SSG4940NC VBSEMI | Alldatasheet

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Technical content

FEATURES

  • Halogen-free  TrenchFET® Power MOSFET  Optimiz e d for High-Side Synchronous Rectifier Operation  100 % R g Tested  100 % UIS Tested

APPLICATIONS

 Notebook CPU Core - High-Side Switch PRODUCT SUMMARY VDS (V) RDS(on) (Ω) ID (A)a Qg (Typ.) 0.010 at VGS = 10 V 12 5.9 nC0.015 at VGS = 4.5 V 10 Notes: a. Base on TC = 25 °C. b. Surface Mounted on 1" x 1" FR4 board. c. t = 10 s. d. Maximum und er Steady State conditions is 85 °C/W. ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless othe rwise noted Parameter Symbol Limit Unit Drain-Source Voltage VDS 40 VGate-Source Voltage VGS ± 20 Continuous Drain Current (TJ = 150 °C) TC = 25 °C ID A TC = 70 °C 10 TA = 25 °C 10b, c TA = 70 °C 8b, c Pulsed Drain Current IDM 45 Continuous Source-Drain Diode Current TC = 25 °C IS 3.2 TA = 25 °C 1.6b, c Single Pulse Avalanche Current L = 0.1 mH IAS 17 Avalanche Energy EAS 21 mJ Maximum Power Dissipation TC = 25 °C PD 4.1 WTC = 70 °C 2.5 TA = 25 °C 2.1b, c TA = 70 °C 1.2b, c Operating Junction and Storage Temperature Range TJ, Tstg - 55 to 150 °C THERMAL RESISTANCE RATINGS Parameter Symbol Typical Maximum Unit Maximum Junction-to-Ambientb, d t ≤ 10 s RthJA 39 53 °C/WMaximum Junction-to-Foot (Drain) Steady State RthJF 25 29 G1 D1 G2 D2 SO-8 Top View 1 S N-Channel MOSFET N-Channel MOSFET Dual N-Channel 40-V (D-S) MOSFET E-mail：China@VBsemi TEL:86-755-83251052 www.VBsemi.tw SSG4940NC A ll data sheet.com

Notes: a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 b. Guaranteed by design, not subject to production testing. Stresses beyond those listed under “Absol ute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. SPECIFICATIONS TJ = 25 °C, unless otherwise no ted Parameter Symbol T est Conditions Min. Typ. Max. Unit Static Drain-Source Breakdown Voltage VDS VGS = 0 V, ID = 250 µA 40 V VDS Temperature Coefficient ΔVDS/TJ ID = 250 µA 28 mV/°CVGS(th) Temperature Coefficient ΔVGS(th)/TJ - 6 Gate-Source Threshold Voltage VGS(th) VDS = VGS, ID = 250 µA 1.2 2.5 V Gate-Source Leakage IGSS VDS = 0 V, VGS = ± 20 V ± 100 nA Zero Gate Voltage Drain Current IDSS VDS = 40 V, VGS = 0 V 1 µAVDS = 40 V, VGS = 0 V, TJ = 55 °C 10 On-State Drain Currenta ID(on) VDS ≥ 5 V, VGS = 10 V 20 A Drain-Source On-State Resistancea RDS(on) VGS = 10 V, ID = 10 A 0.010 ΩVGS = 4.5 V, ID = 9 A 0.015 Forward Transconductancea gfs VDS = 15 V, ID = 10 A 52 S Dynamicb Input Capacitance Ciss VDS = 15 V, VGS = 0 V, f = 1 MHz 641 pFOutput Capacitance Coss 175 Reverse Transfer Capacitance Crss 73 Total Gate Charge Qg VDS = 15 V, VGS = 10 V, ID = 10 A 15 23 nCVDS = 15 V, VGS = 5 V, ID = 10 A 5.9 10.2 Gate-Source Charge Qgs 2.5 Gate-Drain Charge Qgd 2.3 Gate Resistance Rg f = 1 MHz 0.36 1.8 3.6 Ω Tur n-On Delay Time td(on) VDD = 15 V, RL = 1.4 Ω ID ≅ 9 A, VGEN = 4.5 V, Rg = 1 Ω 16 24 ns Rise Time tr 12 18 Turn-Off Delay Time td(off) 16 24 Fall Time tf 10 20 Tur n-On Del ay Time td(on) VDD = 15 V, RL = 1.4 Ω ID ≅ 9 A, VGEN = 10 V, Rg = 1 Ω 81 6 Rise Time tr 10 20 Turn-Off Delay Time td(off) 16 24 Fall Time tf 81 5 Drain-Source Body Diode Ch aracteristics Continuous Source-Drain Diode Current IS TC = 25 °C 17 A Pulse Diode Forward Currenta ISM 45 Body Diode Voltage VSD IS = 9 A 0.8 1.2 V Body Diode Reverse Recover y Time trr IF = 9 A, dI/dt = 100 A/µs, TJ = 25 °C 15 30 ns Body Diode Reverse Recovery Charge Qrr 61 2 n C Reverse Recover y Fall Time ta 8 ns Reverse Recovery Rise Time tb 7 E-mail：China@VBsemi TEL:86-755-83251052 www.VBsemi.tw SSG4940NC A ll data sheet.com

TYPICAL CHARACTERISTICS 25 °C, unless o therwise noted Output Characteristics On-Resistance vs. Drain Cu rrent and Gate Voltage Gate Charge 02468 10 VGS =1 0t h ru 4 V VGS =3V VDS - Drain-to-Source Voltage (V) - Drain Current (A)I D 0.010 0.015 0.020 0.025 0.030 0 1 02 03 04 05 0 VGS =4 .5 V VGS =1 0V - On-Resistance (Ω)RDS(on) ID - Drain Current (A) 048 12 16 VDS = 34 V ID = 10 A VDS =1 5V - Gate-to-Source Voltage (V) Qg - Total Gate Charge (nC) VGS Transfer Characteristics Capacitan ce On-Resistance vs. Junction Temperature TC = 25 °C TC = 125 °C TC =- 5 5 ° C VGS - Gate-to-Source Voltage (V) - Drain Current (A)I D Crss 200 400 800 1200 0 6 12 18 24 30 Ciss Coss VDS - Drain-to-Source Voltage (V C - Capacitance (pF) 0.6 0.9 1.2 1.5 1.8 - 50 - 25 0 25 50 75 100 125 150 VGS =4 . 5V VGS =1 0 V ID = 10 A TJ -J unction Temperature (°C) (Normalized) - On-ResistanceRDS(on) 0.005 E-mail：China@VBsemi TEL:86-755-83251052 www.VBsemi.tw SSG4940NC A ll data sheet.com

TYPICAL CHARACTERISTICS 25 °C, unless otherwise not ed Source-Drain Diode Forward Voltage T hreshold Voltage 0.01 0.001 0.1 100 TJ = 150 °C TJ = 25 °C VSD -S ource-to-Drain Voltage (V) - Source Current (A)I S 1.0 1.2 1.4 1.6 1.8 2.0 2.2 - 50 - 25 0 25 50 75 100 125 150 ID = 250 µA (V)VGS(th) TJ - Temperature (°C) On-Resistance vs. Gate-to-Source Voltage Single Pu lse Power, Junction-to-Ambient 0.000 0.005 0.010 0.015 0.020 0.025 0.030 0246 8 10 TJ =2 5 ° C TJ = 125 °C - On-Resistance (Ω)RDS(on) VGS - Gate-to-Source Voltage (V) Power (W) Time (s) 1 100 6001010-110-210-3 Safe Operating Area, Junction-to-Amb ient 100 0.1 1 10 100 0.01 0.1 TA =2 5 ° C Single Pulse 100 µA 10 s Limited byR DS(on)* BVDSS Limited 1m s 10 ms 100 ms DC VDS - Drain-to-Source Voltage (V * VGS > minimu m VGS at which RDS(on) is specified - Drain Current (A)ID E-mail：China@VBsemi TEL:86-755-83251052 www.VBsemi.tw SSG4940NC A ll data sheet.com

TYPICAL CHARACTERISTICS 25 °C, unless oth erwise noted * The power dissipation P D is based on T J(max) = 150 °C, using junction-to-case thermal resi stance, and is more u s eful in settling the upper dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package limit. Current Derating* 0 25 50 75 100 125 150 TC - Case Temperature (°C) I D - Drain Current (A) Power Derating, Junction- to-Foot 0 25 50 75 100 125 150 T C - Case Temperature (°C) Power (W) Power Derating, J unction-to-Ambient 0.0 0.5 1.0 1.5 2.0 0 25 50 75 100 125 150 T A -A mbient Temperature (°C) Power (W) E-mail：China@VBsemi TEL:86-755-83251052 www.VBsemi.tw SSG4940NC A ll data sheet.com

TYPICAL CHARACTERISTICS 25 °C, unless other wise noted Normalized Thermal Transient Impedance, Jun ction-to-Ambient 10 -3 10 -2 1 10 60010 -110 -4 100 0.1 0.01 0.2 0.1 0.05 0.02 Single Pulse Duty Cycle = 0.5 Square Wave Pulse Duration (s) Normalized Ef fective T ransient Thermal Impedance 1. Duty Cycle, D = 2. Per Unit Base = R th J A = 70 °C/W 3. T JM - T A = P DM Z th J A (t ) t 1 t 2 t 1 t 2 Notes: 4. Surface Mounted P DM Normalized Thermal Transient Impedance, Junction -to-Foot 10-3 10-2 11 010-110-4 0.1 0.01 0.2 0.1 0.05 0.02 Single Pulse Duty Cycle = 0.5 Square Wave Pulse Duration (s) Normalized Effective Transient Thermal Impedance E-mail：China@VBsemi TEL:86-755-83251052 www.VBsemi.tw SSG4940NC A ll data sheet.com

A 1.35 1.75 0.053 0.069 A1 0.10 0.20 0.004 0.008 B 0.35 0.51 0.014 0.020 C 0.19 0.25 0.0075 0.010 D 4 .80 5.00 0.189 0.196 E 3.80 4.00 0.150 0.157 e 1.27 BSC 0.050 BSC H 5.80 6.20 0.228 0.244 h 0.25 0.50 0.010 0.020 L 0.50 0.93 0.020 0.037 q 0 °8 °0 °8 ° S 0.44 0.64 0.018 0.026 ECN: C-06527-Rev. I, 11-Sep-06 DWG: 5498 431 2 568 7 HE h x 45 C All Leads q 0.101 mm 0.004"LBA 1 A e D 0.25 mm (Gage Plane) SOIC (NARROW): 8-LEAD JEDEC Part N umber: MS-012 S E-mail：China@VBsemi TEL:86-755-83251052 www.VBsemi.tw SSG4940NC A ll data sheet.com

RECOMMENDED MINIMUM PADS FOR SO-8 0.246 (6.248) Recommended Minimum Pads Dimensions in Inches/(mm) 0.172 (4.369) 0.152 (3.861) 0.047 (1.194) 0.028 (0.711) 0.050 (1.270) 0.022 (0.559) E-mail：China@VBsemi TEL:86-755-83251052 www.VBsemi.tw SSG4940NC A ll data sheet.com

All products due to improve reliability, function or design or for other reasons, product specifications and data are subject to change without notice. Taiwan VBsemi Electronics Co., Ltd., branches, agents, employees, and all persons acting on its or their representatives (collectively, the "Taiwan VBsemi"), assumes no responsibility for any errors, inaccuracies or incomplete data contained in the table or any other any disclosure of any information related to the product.(www.VBsemi.tw) Taiwan VBsemi makes no guarantee, representation or warranty on the product for any particular purpose of any goods or continuous production. To the maximum extent permitted by applicable law on Taiwan VBsemi relinquished: (1) any application and all liability arising out of or use of any products; (2) any and all liability, including but not limited to special, consequential damages or incidental ; (3) any and all implied warranties, including a particular purpose, non-infringement and merchantability guarantee. Statement on certain types of applications are based on knowledge of the product is often used in a typical application of the general product VBsemi Taiwan demand that the Taiwan VBsemi of. Statement on whether the product is suitable for a particular application is non-binding. It is the customer's responsibility to verify specific product features in the products described in the specification is appropriate for use in a particular application. Parameter data sheets and technical specifications can be provided may vary depending on the application and performance over time. All operating parameters, including typical parameters must be made by customer's technical experts validated for each customer application. Product specifications do not expand or modify Taiwan VBsemi purchasing terms and conditions, including but not limited to warranty herein. Unless expressly stated in writing, Taiwan VBsemi products are not intended for use in medical, life saving, or life sustaining applications or any other application. Wherein VBsemi product failure could lead to personal injury or death, use or sale of products used in Taiwan VBsemi such applications using client did not express their own risk. Contact your authorized Taiwan VBsemi people who are related to product design applications and other terms and conditions in writing. The information provided in this document and the company's products without a license, express or implied, by estoppel or otherwise, to any intellectual property rights granted to the VBsemi act or document. Product names and trademarks referred to herein are trademarks of their respective representatives will be all. Material Category Policy Taiwan VBsemi Electronics Co., Ltd., hereby certify that all of the products are determined to be RoHS compliant and meets the definition of restrictions under Directive of the European Parliament 2011/65 / EU, 2011 Nian. 6. 8 Ri Yue restrict the use of certain hazardous substances in electrical and electronic equipment (EEE) - modification, unless otherwise specified as inconsistent.(www.VBsemi.tw) Please note that some documents may still refer to Taiwan VBsemi RoHS Directive 2002/95 / EC. We confirm that all products identified as consistent with the Directive 2002/95 / EC European Directive 2011/65 /. Taiwan VBsemi Electronics Co., Ltd. hereby certify that all of its products comply identified as halogen-free halogen-free standards required by the JEDEC JS709A. Please note that some Taiwanese VBsemi documents still refer to the definition of IEC 61249-2-21, and we are sure that all products conform to confirm compliance with IEC 61249-2-21 standard level JS709A. E-mail：China@VBsemi TEL:86-755-83251052 www.VBsemi.tw SSG4940NC A ll data sheet.com