SMP-QFN-8002 IRONWOOD | Alldatasheet

Document overview

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Technical content

Features

  • Directly mounts to target PCB (needs tooling holes) with hardware
  • Minimum real estate required
  • Compression plate distributes forces evenly
  • Easily removable swivel socket lid SM-LAYER Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: SMP-QFN32 5x5mm 0.5mm pitch Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. A DATE: 11/04/2015 Material: N/A Finish: N/A Weight: 5.74 SMP-QFN-8002 Drawing SCALE: 4:1 SHEET: 1 OF 5 ENG: S. Huang FILE: SMP-QFN-8002 Dwg DRAWN BY: M. Raske

14.725±0.125 Backing plate outline 12.225±0.125 Socket base outline 1.71±0.10 (x4) Non-plated mounting hole 3.00 (x5) 0.25 9.725±0.05 (x4) 4.8625 4.8625 0.85±0.05 (x2) Non-plated alignment hole 2.00 3.00 3.3625* 2.8625* 2.5275 B A1 marking on socket base CL pads Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder Finish PCB Pad Height: Same or higher than solder mask *NOTE: PAD LAYOUT OFFSET WITH RESPECT TO CENTERLINE OF MOUNTING HOLES. PADS PATTERN IS SHIFTED 0.25MM TO THE RIGHT. CL mounting hole CL mounting hole Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Hole and pad positions ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Recommended PCB Layout Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. A DATE: 11/04/2015 Material: N/A Finish: N/A Weight: 5.74 SMP-QFN-8002 Drawing SCALE: 7:1 SHEET: 2 OF 5 ENG: S. Huang FILE: SMP-QFN-8002 Dwg DRAWN BY: M. Raske

E D PIN 1

0.15 C2X

A B A 0.10 C 0.08 C C SEATING PLANE L W 3.50±0.10 e Dimensions are in millimeters. Interpret dimensions and tolerances per ASME Y14.5M-1994.1. Parallelism measurement shall exclude any effect of mark on top surface of package.2. Ironwood Package Code: QFN32A DIM MIN MAX A 0.80 1 D 5.0 BSC E 5.0 BSC D1 3.5 BSC E1 3.5 BSC e 0.5BSC W 0.20 0.30 L 0.35 0.45 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Compatible Device Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. A DATE: 11/04/2015 Material: N/A Finish: N/A Weight: 5.74 SMP-QFN-8002 Drawing SCALE: 10:1 SHEET: 3 OF 5 ENG: S. Huang FILE: SMP-QFN-8002 Dwg DRAWN BY: M. Raske

C 0.65 0.65 DETAIL C SCALE 8 : 1 DETAIL D SCALE 20 : 1 DETAIL E SCALE 20 : 1 CL PADS SMP protective layer SMP SM layer Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: layout detail Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. A DATE: 11/04/2015 Material: N/A Finish: N/A Weight: 5.74 SMP-QFN-8002 Drawing SCALE: 7:1 SHEET: 4 OF 5 ENG: S. Huang FILE: SMP-QFN-8002 Dwg DRAWN BY: M. Raske©2015 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com

14.73 9.73 3.00 (x5) BACKING PLATE DETAIL 6.35 3.50 ITEM NO. Description Material

1 Compression Screw Steel

2 Shoulder Screw Steel

3 Mounting Screw Steel

4 Alignment Pin Steel

5 Socket Base 7mm 7075-T6 (SN)

6 Socket Lid 7mm 7075-T6 Aluminum

7 Compression Plate 7mm

IC, 1.5mm thick 7075-T6 (SN)

8 Test Chip FR4 High temp

9 IC guide 5X5mm Torlon 4203

10 SMP protective layer for

5x5mm 0.5mm QFN32 SMP

11 SM Interposer 5X5mm SM elastomer

12 Test PCB FR4 High temp

13 Backing Plate, 5 post 7mm 7075-T6 Aluminum

Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Socket, Backing Plate Detail Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. A DATE: 11/04/2015 Material: N/A Finish: N/A Weight: 5.74 SMP-QFN-8002 Drawing SCALE: 7:2 SHEET: 5 OF 5 ENG: S. Huang FILE: SMP-QFN-8002 Dwg DRAWN BY: M. Raske