SMP-LGA-6003 IRONWOOD | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 8
Technical content
38.500 28.225 57.500 24.950 28.225 15.000 17.900 2.670 A A double latch lid W/ compression plate IC Removable IC guide B SECTION A-A Recommended torque = 5 in-lbs / 56.5 N-cm DETAIL B SCALE 8 : 1 xGA IC IC guide SMP protective layer SMP SM interposer layer target board SMP-LGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS FEATURES: Wide temperature range (-55C to +155C ) High current capability (up to 4A ) Excellent signal integrity at high frequencies Low and stable contact resistance for reliable production yield Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Double latch snap lid SMP xGA255 21x21mm IC 16x16 array 1.27mm pitch Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. A DATE: 06/10/2015 Material: N/A Finish: N/A Weight: 93.06 SMP-LGA-6003 Drawing SCALE: 1.15:1 SHEET: 1 OF 8 ENG: S. Huang FILE: SMP-LGA-6003 Dwg DRAWN BY: M. Raske
50.900±0.050 63.500±0.050 2.900 4.650 (x4) 0.900 pad (x525) 22.860±0.025 31.750 3.800 25.450 29.00±0.05 25.450 14.500±0.025 49.500±0.050
57.500 Socket base outline
72.500 socket base outline 28.225 socket lid size 38.500 socket lid size Orientation mark Target PCB Recommendations Total Thickness: 5mm Plating: Gold or Solder Finish PCB Pad Height: Same or higher than solder mask Latch Latch socket mounting hole location socket alignment hole location Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Recommended PCB Layout Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. A DATE: 06/10/2015 Material: N/A Finish: N/A Weight: 93.06 SMP-LGA-6003 Drawing SCALE: 2:1 SHEET: 2 OF 8 ENG: S. Huang FILE: SMP-LGA-6003 Dwg DRAWN BY: M. Raske
0.900 29.000±0.050 49.500±0.050 16.495 4.975 14.500 24.750±0.025 6.700 2.900 4.000 3.800 50.900±0.050 25.450 PEM 4.650 4.500 1.500 3.000 PEM M3x0.5 threads Note: PEM is not included. Display only. Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Recommended PCB Layout_pemnut Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. A DATE: 06/10/2015 Material: N/A Finish: N/A Weight: 93.06 SMP-LGA-6003 Drawing SCALE: 2:1 SHEET: 3 OF 8 ENG: S. Huang FILE: SMP-LGA-6003 Dwg DRAWN BY: M. Raske©2015 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com
21.000±0.200 20.200±0.200 17.140±0.000 16.380±0.080 B A A1 A 0.30 T T 0.860±0.100 1.270 1. Black Alumina Package. 2. Plating (Electroless): Ni: 1.27~8.89 Micron. Au on top surface: 1.5 Micron Min. DIM MIN NOM MAX A 2.01 2.23 2.45 A1 1.62 1.80 1.98 A2 0.43 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Compatible CLGA Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. A DATE: 06/10/2015 Material: N/A Finish: N/A Weight: 93.06 SMP-LGA-6003 Drawing SCALE: 3:1 SHEET: 4 OF 8 ENG: S. Huang FILE: SMP-LGA-6003 Dwg DRAWN BY: M. Raske
Attachable compression plate for CLGA package cutout for air flow 12.000 5mm hex key Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: comp screw, comp plt detail Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. A DATE: 06/10/2015 Material: N/A Finish: N/A Weight: 93.06 SMP-LGA-6003 Drawing SCALE: 2:1 SHEET: 5 OF 8 ENG: S. Huang FILE: SMP-LGA-6003 Dwg DRAWN BY: M. Raske©2015 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com
C C D SECTION C-C 0.750 0.600 DETAIL D SCALE 2 : 1 Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: IC guide detail Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. A DATE: 06/10/2015 Material: N/A Finish: N/A Weight: 93.06 SMP-LGA-6003 Drawing SCALE: 1:1 SHEET: 6 OF 8 ENG: S. Huang FILE: SMP-LGA-6003 Dwg DRAWN BY: M. Raske©2015 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com
E F TOP VIEW SMP P layer TOP VIEW SMP SM layer DETAIL E SCALE 1.75 : 1 TOP ISO VIEW SMP P layer SMP SM layer IC guide DETAIL F SCALE 1.75 : 1 BOTTOM ISO VIEW dowel pin SMP P layer SMP SM layer IC guide Note: SMP P layer should place and align onto dowel pin as gold plated wahser on the top Gold plated washer on top only Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: SMP set assembly instruction Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. A DATE: 06/10/2015 Material: N/A Finish: N/A Weight: 93.06 SMP-LGA-6003 Drawing SCALE: 1:2 SHEET: 7 OF 8 ENG: S. Huang FILE: SMP-LGA-6003 Dwg DRAWN BY: M. Raske©2015 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com
ITEM NO. Description Material
1 Dowel Pin, 1/32" x 3/16", SS Chrome Stainless Steel
2 Torsion Spring, 180 0.109" OD, Ccw/Rh Steel Music Wire
3 Hinge Pin and Snap Ring, 2mm
OD, 24mm long, SS Stainless Steel (ferritic)
4 Cap, socket head 2-56 5/16" 18-8
Stainless Steel Stainless Steel (18-8) Zinc-Plated Steel precision compression spring 125"OD 0.25" length 0.016" wire diameter Material <not specified>
6 M2 Dowel Pin 4mm SS Stainless Steel (18-8)
7 Dowel Pin, 1.5mm x 4mm, SS Chrome Stainless Steel
8 Socket Base 23mm, double latch 7075-T6 Aluminum Alloy
9 SMP socket IC Guide 21x21mm
10 Dropping in IC guide insert
1.27mm pitch CLGA255 Kapton Polyimide/Cirlex
11 SMP protective layer xGA255
1.27mm pitch 16x16 array Material <not specified>
12 SMP SM elastomer xGA255
1.27mm pitch 16x16 array SM elastomer
13 PCB for xGA255, 21x21mm
16x16 array .127mm pitch N/A
14 Snap double latch socket lid for
up to 21mm IC 7075-T6 Aluminum Alloy
15 Compression Plate 21mm IC 7075-T6 Aluminum Alloy
16 Compression Screw M18
w/handle 7075-T6 Aluminum Alloy
17 Compression Screw Hex key
block 7075-T6 Aluminum Alloy
18 Clamshell Latch Snap Lid Socket 7075-T6 Alumium Alloy
19 Compression plate for CLGA
package 7075-T6 Aluminum Alloy 20 Cap, socket head, M2x0.4x12mm 18-8 Stainless Steel Stainless Steel (18-8)
21 M2 nylon flat washer Nylon 6/6
22 Screw, M3 x 12mm, Low Head
Cap, SS 18-8 Stainless Steel 23 Screw, #0-80 X .188", Flat, SS Stainless Steel (18-8)
24 Test Chip xGA255, 21x21mm
1.27mm pitch 16x16 array Material <not specified> Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Socket Assem Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. A DATE: 06/10/2015 Material: N/A Finish: N/A Weight: 93.06 SMP-LGA-6003 Drawing SCALE: 1.85:1 SHEET: 8 OF 8 ENG: S. Huang FILE: SMP-LGA-6003 Dwg DRAWN BY: M. Raske©2015 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com