SBT-BGA-8004

SBT-BGA-8004 IRONWOOD | Alldatasheet

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Technical content

14.0 4.500 2.000 D Recommended Torque 1 in lbs 13.625 0.41 Compression DETAIL D SCALE 16 : 1 SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS FEATURES: Wide temperature range (-55C to +180C ) High current capability (up to 2.9A ) Excellent signal integrity at high frequencies Low and stable contact resistance for reliable production yield Highly compliant to accommodate wide co-planarity variations Automated probe manufacturing enables low cost and short lead time. Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: SBT-BGA Socket, 7x7mm, 0.4mm pitch, 16x16 array Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. C DATE: 02/25/13 Material: N/A Finish: N/A Weight: 8.54 SBT-BGA-8004 Drawing SCALE: 3:1 SHEET: 1 OF 5 ENG: V. Panavala FILE: SBT-BGA-8004 Dwg DRAWN BY: M. Raske

1.25 (x4) 1.25 (x4) 1.61±0.05 (x4) 0.850±0.025 (x2) 3.8225 1.2825 16.725 BACKING PLATE 0.300 3.000±0.025 2.750±0.025 0.400 6.000 (x4) 16.4897 Socket Base 15.475 Socket Base A1 Corner

0.025 A B

A B *Note: BGA pattern is not symmetrical with respect to the mounting holes Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: same or higher than solder mask Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Recommended PCB Layout Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. C DATE: 02/25/13 Material: N/A Finish: N/A Weight: 8.54 SBT-BGA-8004 Drawing SCALE: 7:1 SHEET: 2 OF 5 ENG: V. Panavala FILE: SBT-BGA-8004 Dwg DRAWN BY: M. Raske

e b 6.000 6.000

0.15 X Y

0.05 A D E Y Z Ironwood Package Code: BGA 256B 1. Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. 3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5. Parallelism measurement shall exclude any effect of mark on top surface of package. DIM Minimum Maximum A 2.5 A1 0.15 0.25 b 0.30 D 7.00 BSC E 7.00 BSC e 0.40 BSC ARRAY 16 x 16 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Compatible BGA Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. C DATE: 02/25/13 Material: N/A Finish: N/A Weight: 8.54 SBT-BGA-8004 Drawing SCALE: 8:1 SHEET: 3 OF 5 ENG: V. Panavala FILE: SBT-BGA-8004 Dwg DRAWN BY: M. Raske

12.725 (x4) 16.725 4.000 2.000 Backing plate detail 4.5 2.0 1.9 2.7 ITEM NO. DESCRIPTION Material

1 Compression Plate 7075-T6 Aluminum Alloy

2 Test Chip Material <not specified>

3 Test PCB 7x7, 0.4mm pitch, 16x16 array Material <not specified> 4 IC guide 7mm IC With posts 0.4mm pitch Semitron MDS 100

5 Dowel pin, 1/32" X 1/4", SS Stainless Steel (18-8)

6 Stamped Pin, 0.4mm SBT-BGA N/A 7 Bottom Guide,16x16 arr, 0.4mm pitch BGA256 Semitron MDS 100 8 Middle Guide 16x16, 0.4mm pitch BGA256 Semitron MDS 100 9 Floating guide 7mm IC 0.4mm Semitron MDS 100 10 #0-80 Shoulder Screw, 1.59mm thread length Stainless Steel (303)

11 Floating Guide Spring Alloy Steel (SS)

12 Socket Lid 7075-T6 Aluminum Alloy

13 Socket Base SBT BGA 10x10 7075-T6 Alumium Alloy

14 Compression Screw M6x1 Stainless Steel (18-8)

15 X Shaped Backing Plate 10x10mm IC 7075-T6 Aluminum Alloy

16 #0-80 x 0.5, SH Cap Screw Alloy Steel 17 #0-80, 90 deg., head pin guide screw, Peek material PEEK unfilled Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Socket Assy, Insulation Plate Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. C DATE: 02/25/13 Material: N/A Finish: N/A Weight: 8.54 SBT-BGA-8004 Drawing SCALE: 3:1 SHEET: 4 OF 5 ENG: V. Panavala FILE: SBT-BGA-8004 Dwg DRAWN BY: M. Raske

Rev Date Initials Description A 02/25/13 MR Original B 02/06/15 DH Updated layout page C 3/25/16 MR Replaced plastic screws with peek screws Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Revisions Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. C DATE: 02/25/13 Material: Finish: Weight: SBT-BGA-8004 Drawing SCALE: 3:1 SHEET: 5 OF 5 ENG: V. Panavala FILE: SBT-BGA-8004 Dwg DRAWN BY: M. Raske©2015 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com