SBT-BGA-6527

SBT-BGA-6527 IRONWOOD | Alldatasheet

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Technical content

Torque until hard stop is met (floating guide bottoms out) 22.882 7.940 13.354 34.725 32.600 SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS FEATURES: Wide temperature range (-55C to +180C ) High current capability (up to 4A ) Excellent signal integrity at high frequencies Low and stable contact resistance for reliable production yield Highly compliant to accommodate wide co-planarity variations Automated probe manufacturing enables low cost and short lead time ©2015 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: SBT-BGA Socket Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. A DATE: 05/27/2015 Material: N/A Finish: N/A Weight: 51.18 SBT-BGA-6527 Drawing SCALE: 2:1 SHEET: 1 OF 4 ENG: M.A. Fedde FILE: SBT-BGA-6527 Dwg DRAWN BY: M. Raske

11.225* 11.600 1.700±0.100 (x4) 0.850±0.025 (x2) 34.725 Backing Plate outline 29.725 2.540 5.080 0.500 32.600 Socket Base outline 32.225 Socket Base outline *Note: BGA pattern is not symmetrical with respect to the mounting holes. It is shifted by 0.375mm to the right of center. Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Recommended PCB Layout Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. A DATE: 05/27/2015 Material: N/A Finish: N/A Weight: 51.18 SBT-BGA-6527 Drawing SCALE: 3:1 SHEET: 2 OF 4 ENG: M.A. Fedde FILE: SBT-BGA-6527 Dwg DRAWN BY: M. Raske©2015 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com

D E X Y A e b

0.10 S Z

0.25 S Z X S Y S

A DETAIL A SCALE 4 : 1 Z 1. Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. 3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5. Parallelism measurement shall exclude any effect of mark on top surface of package. Ironwood Package Code BGA774B DIM Minimum Maximum A 2.308 2.808 A1 0.36 0.46 b 0.50 D 25.00 BSC E 25.00 BSC e 0.80 BSC ARRAY 30x30 PIN COUNT 744 Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Compatible BGA Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. A DATE: 05/27/2015 Material: N/A Finish: N/A Weight: 51.18 SBT-BGA-6527 Drawing SCALE: 2:1 SHEET: 3 OF 4 ENG: M.A. Fedde FILE: SBT-BGA-6527 Dwg DRAWN BY: M. Raske©2015 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com

34.725 1.700 29.725 Backing and Insulation Plate 7.940 6.350 PIN DETAIL Scale 16:1 ITEM NO. Description Material

1 Socket Base SBT 27x27mm Ni plated

0.375mm shift 7075-T6 Aluminum Alloy

2 Compression Screw, M18 7075-T6 Aluminum Alloy

3 Socket Lid, 32.225 X 32.225 7075-T6 Aluminum Alloy 4 Compression Plate, 26.95 X 26.95 7075-T6 Aluminum Alloy

5 SBT Ni plt backing plt 27mm IC 7075-T6 Aluminum Alloy

6 Test Chip Material <not specified>

7 Insulation Plate 27mm IC FR4

8 #0-80 X .625 LG, SOC HD CAP SCREW, ALLOY STL, BLK OXIDE Alloy Steel

9 Dowel Pin, 1/32" x 3/8", SS Chrome Stainless Steel

10 Floating Guide Spring Alloy Steel (SS)

11 #0-80 Shoulder Screw, 1.59mm thread length Stainless Steel (303) 12 #0-80, 90 deg., head pin guide screw, Peek material 5.5715mm overall Length PEEK unfilled

13 Test PCB Material <not specified>

14 Floating Guide, BGA744, 0.8mm pitch, Size: 32.60mm x 32.225mm Semitron MDS 100 15 SBT Pin, SBT-BGA 0.5mm-0.8mm 16 Middle Guide: BGA744, 0.8mm pitch Size: 34.725mm x 34.725mm Semitron MDS 100 17 Bottom Guide BGA744, 0.8mm pitch Semitron MDS 100 Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Socket Assy, Insulation Plate Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. A DATE: 05/27/2015 Material: N/A Finish: N/A Weight: 51.18 SBT-BGA-6527 Drawing SCALE: 2:1 SHEET: 4 OF 4 ENG: M.A. Fedde FILE: SBT-BGA-6527 Dwg DRAWN BY: M. Raske©2015 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com