SBT-BGA-6019 IRONWOOD | Alldatasheet
Document overview
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Technical content
Features
Directly mounts to target PCB (needs tooling holes) with hardware. Top View: (fan removed) Side View (Section AA) Easily removable swivel socket lid 45.00mm 45.00mm A A Fan is not shown Status: Released Drawing: E Smolentseva Scale: - Rev: A Date: 09/08/2012 Modified:File: SBT-BGA-6019 Dwg.mcd SBT-BGA-6019 Drawing PAGE 1 of 4 © 2010 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Customer's Target PCB Customer's BGA IC Socket Lid/ Heat sink: Ni plated Aluminum. Socket base screw: Socket head cap, alloy steel with black oxide finish, 0-80 fine thread , 15.875mm long. Socket base: Ni plated Aluminum. Thickness = 5mm. Insulation Plate: FR4, Thickness = 1.59mm. Compression screw: Socket head cap, alloy steel with black oxide finish, 0-80 fine thread , 7.94mm long. Backing Plate: Ni plated Aluminum. Thickness = 4mm. IC Frame: Ultem Pin Guide: Ceramic Filled Peek SBT pin: Stamped contact BeCu, Au plated Spring: SS, Au plated Gap Pad Fan: 40x40x10mm Recommended torque is 1 in lb per screw Remove fan prior to Applying torque to Heat sink / compression plate
Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. R ecom m ended PC B Layout Top View Target PC B R ecom m endations Total thickness: 3.175mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask NOTE: Steel backing plate may be required based on end user's application PAGE 2 of 4 Status: Released Drawing: E Smolentseva Scale: - Rev: A Date: 09/08/2012 Modified:File: SBT-BGA-6019 Dwg.mcd SBT-BGA-6019 Drawing © 2010 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Backing Plate Size Non plated mounting hole Non plated alignment hole Orientation Mark 1.250mm ±0.125mm (x4) 1.250mm ±0.125mm (x4) 34.325mm ±0.125mm (x4) 5.08mm 31.825mm(x4) Ø 0.850mm ±0.125mm (x2) 2.7875mm* Socket size 2.54mm 2.4125mm 36.825mm (x4) 2.50mm (x4) 2.50mm (x4) *N ote: B G A pattern is not sym m etrical w ith respect to the m ounting holes. It is offset 0.375m m to the right of the tooling holes. 1.000mm typ. Ø 0.51mm (x762) pad 27.000mm Ø 1.700mm ±0.125mm (x4)
Status: Released Drawing: E Smolentseva Scale: - Rev: A Date: 09/08/2012 Modified:File: SBT-BGA-6019 Dwg.mcd SBT-BGA-6019 Drawing © 2010 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com D E Y X Ø0.25 Ø0.10 Z X Y TOP VIEW SIDE VIEW 0.20 BOTTOM VIEW e DETAIL DIM MIN MAX A 1.69 A1 0.40 b 0.7 D E e
29.0 BSC
1.00 BSC
Dimensions are in millimeters. Interpret dimensions and tolerances per ASME Y14.5M-1994. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. Parallelism measurement shall exclude any effect of mark on top surface of package. Array 28 x 28 Ø b 0.5 C om patible BG A Spec 1.41 0.6 A2 0.36 0.42 12.09 11.88 A Ironwood Package Code: BGA762A DETAIL 0.20ZZ 0.25 Z
Status: Released Drawing: E Smolentseva Scale: - Rev: A Date: 09/08/2012 Modified:File: SBT-BGA-6019 Dwg.mcd SBT-BGA-6019 Drawing © 2010 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com 36.83mm 36.83mm 20.06mm 10.00mm 31.83mm 1.59mm 1.27mm