SBT-BGA-6000 IRONWOOD | Alldatasheet

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Technical content

Features

Wide temperature range (-55C to +180C)• High current capability (up to 8A)• Excellent signal integrity at high frequencies• Low and stable contact resistance for reliable production yield• Highly compliant to accommodate wide co-planarity variations• Automated probe manufacturing enables low cost and short lead • time SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS ©2015 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: SBT-BGA1156 Socket, 35x35, 1.00mm, 34 x 34 Array Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. F DATE: 4/26/2010 Material: Material <not specified> Finish: Weight: 80.82 SBT-BGA-6000 Drawing SCALE: 2:1 SHEET: 1 OF 4 ENG: V. Panavala FILE: SBT-BGA-6000 DRAWN BY: V. Panavala

41.925 BACKING PLATE 40.2250 SOCKET BASE 33.00 18.8625±0.0500 (8) * 2.7375±0.0250 2.3625±0.0250 2.5400±0.0250

0.8500 THRU

NON-PLATED HOLE (2) 1.00 Typ. 1.6100±0.0500 THRU NON-PLATED HOLE (8) 5.080±0.025 0.5100 (x1156 PAD) 40.60 42.30 41.925 Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask *Note: BGA pattern is not symmetrical with respect to the mounting holes. Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Recommended PCB Layout Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. F DATE: 4/26/2010 Material: Material <not specified> Finish: Weight: 80.82 SBT-BGA-6000 Drawing SCALE: 3:1 SHEET: 2 OF 4 ENG: V. Panavala FILE: SBT-BGA-6000 DRAWN BY: V. Panavala©2015 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com

D E e b SEE NOTE #3 0.20

0.25 C A B

0.10 B A 0.91 min. 13.97 A 2.54 A DETAIL A SCALE 6 : 1 0.20 C C Dimensions are in millimeters.1. Interpret dimensions and tolerances per ASME Y14.5M-1994.2. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane C.3. Datum C (seating plane) is defined by the spherical crowns of the solder balls.4. Parallelism measurement shall exclude any effect of mark on top surface of package.5. Ironwood Package Code: BGA1156A DIM Minimum Maximum A 4.7 A1 0.4 0.6 b 0.7 D 35.0 BSC E 35.0 BSC e 1.00 BSC ARRAY SIZE 34 X 34 PIN COUNT 1156 Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Compatible BGA Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. F DATE: 4/26/2010 Material: Material <not specified> Finish: Weight: 80.82 SBT-BGA-6000 Drawing SCALE: 2:1 SHEET: 3 OF 4 ENG: V. Panavala FILE: SBT-BGA-6000 DRAWN BY: V. Panavala©2015 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com

1.70 42.725 18.8625 24.06 10.00 1.27 1.5875 INSULATION PLATE DETAIL SBT PIN 10:1 scale ITEM NO. Description Material

1 SBT socket base, Ni Plated, 35x35mm,

0.375 shift 7075-T6, Plate (SS) 2 #0-80, 90 deg., head pin guide screw, Peek material 5.5715mm overall Length PEEK unfilled

3 Pogo Pin, 1mm Pitch SBT BGA pin

4 Socket Lid 35mm GHz swivel 7075-T6 Aluminum Alloy

5 CBT/SBT Ni plt Backing Plate 35x35mm

IC 7075-T6, Plate (SS)

6 Insulation Plate 35x35mm IC FR4 Standard

7 Compression plate 35mm with cutout 7075-T6 Aluminum Alloy

8 Floating Guide Spring Alloy Steel (SS)

9 #0-80 X .75 LG, SOC HD CAP SCREW, 18-8 SS Stainless Steel (18-8)

10 SBT Ni plt Compression Plate,

35x35mm IC 7075-T6 Aluminum Alloy

11 Floating Guide 35mm SBT-BGA1156 PEEK Ceramic filled

12 Bottom Guide SBT-BGA1156 PEEK Ceramic filled

13 Middle Guide SBT-BGA1156 PEEK Ceramic filled

14 Test PCB 34x34 array 1mm pitch High Temp FR4

15 Test Chip 35mm 34x34 array High Temp FR4

16 Compression Screw, M30 7075-T6 Aluminum Alloy

17 #0-80 Shoulder Screw, 2.29mm thread length Stainless Steel (303) Rev Date Initials Description A 04/26/10 VP Original B 5/19/10 VP Changed socket base screw and added compression plate M1065 C 6/28/10 MR Replaced anodized components with nickel plated components D 10/18/11 VP Update layout page E 3/16/15 SF Added recommended torque in page 1 F 2/2/16 MR Replace flat head screws Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Assembly, Insulation Plate Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. F DATE: 4/26/2010 Material: Material <not specified> Finish: Weight: 80.82 SBT-BGA-6000 Drawing SCALE: 3:2 SHEET: 4 OF 4 ENG: V. Panavala FILE: SBT-BGA-6000 DRAWN BY: V. Panavala©2015 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com