S8823A

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POWERED BY ULTRA-LOW POWER AND ULTRA-LOW VOLTAGE OPERATION BOOST CHARGE PUMPwww.sii-ic.com © SII Semiconductor Corporation, 2017 Rev.1.0_01 The S-8823A Series is a boost charge pump which enables operati on with ultra-low power and ultra-low voltage. An original circuit system and SOI technology allow this product to boost the industry's lowest level *1 0.35 V ultra-low input voltage as a boost charge pump, and achieve operation with an extremely weak power of 26 μW. This makes the S-8823A Series most suitable for use in applications where low-voltage energy harvesti ng devices such as 1-cell to 2-cell solar cells and biofuels, etc. are boosted. The boosted electric power is stored in an external capacitor, and the discharge operation is st arted to intermittently drive LED or other minute loads of several mW if the capacitor reaches the discharge start voltage (VCPOUT1). It also includes boost flying capacitors, which allows for forma tion of a circuit by adding a minimum of just one external capacitor, thus realizing miniaturization of devices. *1. Based on available information as of October 2016  Features

• Ultra-low power and ultra-low voltage operation: Input power at startup (PIN(START-UP)) = 26 μW typ. (VCPOUT1(S) = 1.8 V, VIN = 0.35 V) (Ta = +25°C)
• Minimum operation input voltage: 0.35 V (VCPOUT1(S) = 1.8 V) (Ta = +25°C) 0.39 V (VCPOUT1(S) = 1.8 V to 2.4 V) (Ta = −40°C to +85°C)
• Current consumption during operation: 74 μA typ. (VIN = 0.35 V)
• Discharge start voltage: VCPOUT1(S) = 1.8 V to 2.4 V (Selectable in 0.2 V step)
• Power-off voltage: VCPOUT1 + 0.1 V (Fixed internally)
• External component: External capacitor (CCPOUT) × 1 unit*1
• Operation temperature range: Ta = −40°C to +85°C
• Lead-free (Sn 100%), halogen-free *1. Adjust the output capacitance based on the load. The capacit ance should be fully confirmed using an actually mounted model since it affects the startup time. Refer to " Characteristics (Typical Data)" for details.  Applications  Packages
• Biofuel, fuel cell, thermoel ectric generator, solar cell and other energy harvesting
• Boosting from low-voltage power supply
• Intermittently power supplying to intermittent operation system
• Intermittently minute load driving
• SOT-23-5 (2.8 mm × 2.9 mm × t1.3 mm max.)
• SNT-8A (2.46 mm × 1.97 mm × t0.5 mm max.)  Typical Application Circuit  Basic Operation Waveform VIN = 0.37 V S-8823A Series CPOUT VSS VIN OUT VM LED CCPOUT VIN [V]0.5 VOUT [V] VCPOUT [V] t (2 s / div.) VOUT VIN VCPOUT

ENERGY HARVESTING POWERED BY ULTRA-LOW POWER AND ULTRA-LOW VOLTAGE OPERATION BOOST CHARGE PUMP S-8823A Series Rev.1.0_01  Product Name Structure Users can select the discharge start voltage and the package type for the S-8823A Series. Refer to " 1. Product name " regarding the contents of product name, " 2. Packages " regarding the package drawings and "3. Product name list " regarding the product name. 1. Product name S-8823A xx - xxxx U Package abbreviation and IC packing specifications*1 M5T1: SOT-23-5, Tape I8T1: SNT-8A, Tape Discharge start voltage 18: 1.8 V 20: 2.0 V 22: 2.2 V 24: 2.4 V Environmental code U: Lead-free (Sn 100%), halogen-free *1. Refer to the tape drawing. 2. Packages Table 1 Package Drawing Codes Package Name Dimension Tape Reel Land SOT-23-5 MP005-A-P-SD MP 005-A-C-SD MP005-A-R-SD − SNT-8A PH008-A-P-SD PH008-A-C-SD PH008-A-R-SD PH008-A-L-SD 3. Product name list Table 2 Set Discharge Start Voltage (VCPOUT1(S)) Set Power-off Voltage (VOFF(S)) SOT-23-5 SNT-8A 1.8 V 1.9 V S-8823A18-M5T1U S-8823A18-I8T1U 2.0 V 2.1 V S-8823A20-M5T1U S-8823A20-I8T1U 2.2 V 2.3 V S-8823A22-M5T1U S-8823A22-I8T1U 2.4 V 2.5 V S-8823A24-M5T1U S-8823A24-I8T1U Remark Please contact our sales office for products with set discharge start voltage other than the above.

ENERGY HARVESTING POWERED BY ULTRA-LOW POWER AND ULTRA-LOW VOLTAGE OPERATION BOOST CHARGE PUMP Rev.1.0_01 S-8823A Series  Pin Configurations 1. SOT-23-5 13 2 4 5 Top view Figure 1 Table 3 Pin No. Symbol Description

1 OUT Output pin

2 VSS GND pin

Power-on / power-off setting pin "L": Power-on (Normal operation) "H": Power-off (Standby)

4 VIN Power supply input pin

5 CPOUT External capacitor connection pin

1. SNT-8A Top view Figure 2 Table 4 Pin No. Symbol Description

1 NC*1 No connection

2 VIN Power supply input pin

Power-on / power-off setting pin "L": Power-on (Normal operation) "H": Power-off (Standby)

4 NC*1 No connection

5 OUT Output pin

6 VSS GND pin

7 CPOUT External capacitor connection pin

8 NC*1 No connection

*1. The NC pin is electrically open. The NC pin can be connected to the VIN pin or the VSS pin.

ENERGY HARVESTING POWERED BY ULTRA-LOW POWER AND ULTRA-LOW VOLTAGE OPERATION BOOST CHARGE PUMP S-8823A Series Rev.1.0_01  Absolute Maximum Ratings Table 5 (Ta = +25°C unless otherwise specified) Item Symbol Absolute Maximum Rating Unit VIN pin voltage VIN V SS − 0.3 to VSS + 3.3 V CPOUT pin voltage VCPOUT V SS − 0.3 to VSS + 3.3 V OUT pin voltage VOUT V SS − 0.3 to VSS + 3.3 V VM pin voltage VVM V SS − 0.3 to VSS + 3.3 V Operation ambient temperature Topr −40 to +85 °C Storage temperature Tstg −40 to +125 °C Caution The absolute maximum ratings are rated values exceeding which the product could suffer physical damage. These values must therefore not be exceeded under any conditions.  Thermal Resistance Value Table 6 Item Symbol Condition Min. Typ. Max. Unit Junction-to-ambient thermal resistance*1 θJA SOT-23-5 Board A − 192 − ° C/W Board B − 160 − ° C/W Board C −− − ° C/W Board D −− − ° C/W Board E −− − ° C/W SNT-8A Board A − 211 − ° C/W Board B − 173 − ° C/W Board C − − − ° C/W Board D − − − ° C/W Board E − − − ° C/W *1. Test environment: compliance with JEDEC STANDARD JESD51-2A Remark Refer to " Power Dissipation" and "Test Board" for details.

ENERGY HARVESTING POWERED BY ULTRA-LOW POWER AND ULTRA-LOW VOLTAGE OPERATION BOOST CHARGE PUMP Rev.1.0_01 S-8823A Series  Electrical Characteristics Table 7 (Ta = +25°C unless otherwise specified) Item Symbol Condition Min. Typ. Max. Unit Discharge start voltage*1 VCPOUT1 V IN = 0.35 V VCPOUT1(S) − 0.1 VCPOUT1(S) VCPOUT1(S) + 0.1 V Discharge start voltage temperature coefficient CPOUT1 CPOUT1 V Ta V

• Δ Δ Ta = −40°C to +85°C − ±150 − ppm/ °C Discharge stop voltage*2 VCPOUT2 VCPOUT1(S) = 1.8 V VCPOUT1 − 0.60 − VCPOUT1 − 0.33 V VCPOUT1(S) = 2.0 V VCPOUT1 − 0.67 − VCPOUT1 − 0.33 V VCPOUT1(S) = 2.2 V VCPOUT1 − 0.74 − VCPOUT1 − 0.33 V VCPOUT1(S) = 2.4 V VCPOUT1 − 0.80 − VCPOUT1 − 0.33 V Operation input voltage range 1*3 VIN1 VCPOUT1(S) = 1.8 V 0.35 − 3.0 V VCPOUT1(S) = 2.0 V 0.36 − 3.0 V VCPOUT1(S) = 2.2 V, 2.4 V 0.37 − 3.0 V Operation input voltage range 2 *3 VIN2 VCPOUT1(S) = 1.8 V, 2.0 V, Ta = −30°C to +60°C 0.37 − 3.0 V VCPOUT1(S) = 1.8 V to 2.4 V, Ta = −40°C to +85°C 0.39 − 3.0 V Discharge start delay time *4 tOUT VCPOUT1(S) = 1.8 V, VIN = 0.35 V, CCPOUT = 10 μF − 4.6 − s VCPOUT1(S) = 2.4 V, VIN = 0.37 V, CCPOUT = 10 μF − 5.8 − s Discharge control switch resistance RM1 V CPOUT = 1.8 V to 2.4 V, IOUT = 3 mA − 30 100 Ω Input power at start-up P IN(START-UP) V IN = 0.35 V, VCPOUT = 0 V − 26 − μW Current consumption during operation I SS VIN = 0.35 V, VCPOUT = 0 V − 0.074 0.35 mA VIN = 0.6 V, VCPOUT = 0 V − 0.38 1.1 mA VIN = 1.0 V, VCPOUT = 0 V − 1.1 2.3 mA Current consumption during power-off I SSS VIN = 0.35 V, VCPOUT = 0 V, VVM = 3.0 V − 0.1 0.6 μA VIN = 1.0 V, VCPOUT = 0 V, VVM = 3.0 V − 0.1 0.7 μA VIN = 2.0 V, VCPOUT = 0 V, VVM = 3.0 V − 0.1 0.8 μA Power-off voltage*5 VOFF V IN = 0.35 V, VCPOUT = 0 V VOFF(S) − 0.1 VOFF(S) VOFF(S) + 0.1 V Power-off voltage temperature coefficient OFF OFF V Ta V
• Δ Δ Ta = −40°C to +85°C − ±150 − ppm/ °C Discharge control switch leakage current*6 ILEAK V IN = VCPOUT = 0 V, VOUT = VVM = 3.0 V − − 0.1 μA VM pin input current I VM V VM = 3.0 V − 0.7 1.8 μA *1. V CPOUT1: Actual discharge start voltage VCPOUT1(S): Set discharge start voltage *2. Voltage at which discharge to the OUT pin stops *3. Input voltage required to start discharge to the OUT pin from the external capacitor *4. Delay time from when power is input to the VIN pin until the electric charge of the external capacitor is discharged to the OUT pin *5. V OFF: Actual power-off voltage (VM pin voltage value at which power-off actually occurs) V OFF(S): Set power-off voltage (Set VM pin voltage at which power-off occurs) V OFF(S) is automatically set to VCPOUT1(S) + 0.1 V. *6. Current that flows into the IC from the OUT pin due to the off-leak current of the discharge control switch Caution Set the discharge start voltage based on thoro ugh evaluation including the temperature characteristics under the actual usage conditions.

ENERGY HARVESTING POWERED BY ULTRA-LOW POWER AND ULTRA-LOW VOLTAGE OPERATION BOOST CHARGE PUMP Rev.1.0_01 S-8823A Series 2. Power-on / power-off setting pin (VM pin) When the power-off voltage (V OFF) or higher is applied to the VM pin voltage (V VM), the power-off status is entered. When this happens, the internal oscillation circuit stops its operation, so that the charge pump circuit operation stops, and greatly reduces the current consumption. Figure 4 shows the configuration of the VM pin. VREF VM pin Table 8 VM Pin Internal Circuit V VM < VOFF Operate V VM ≥ VOFF Stop Figure 4 VM Pin Configuration Set VVM during power-off as follows. 3.0 V ≥ VVM ≥ VIN + 1.0 V

3.0 V ≥ VVM ≥ VOUT

VM < VIN + 1.0 V occurs, the current consumption during power-off increases. When VVM < VOUT occurs, the discharge control switch leak current increases. Caution 1. When not using the VM pin in actual use, be sure to connect it to the VSS pin. If the VM pin is left open, it may cause malfunctions. 2. Note that the operation to recharge the external capacitor (C CPOUT) does not restart when CPOUT pin voltage (VCPOUT) exceeds the discharge stop voltage (V CPOUT2) even if the power-off status is released. This operation restarts if V CPOUT decreases to VCPOUT2 or lower by discharge of CCPOUT. 3. Do not connect a high resistance to the VM pin. Note that the VM pin input current (I VM) max. may not flow if a high resistance is connected.

ENERGY HARVESTING POWERED BY ULTRA-LOW POWER AND ULTRA-LOW VOLTAGE OPERATION BOOST CHARGE PUMP Rev.1.0_01 S-8823A Series  Selection of External Capacitor (CCPOUT) The S-8823A Series boosts the low input voltage and stores it in an external capacitor (C CPOUT), and intermittently drives minute load connected to the OUT pin by using the stored power (Refer to Figure 7). Moreover, the S-8823A Series can also intermittently s upply power to a capacitor with a large capacitance via a Schottky-barrier diode (SBD) connected to the OUT pin (Refer to Figure 10). In this case, set the capacitance of C CPOUT smaller when setting the ripple voltage of the VVOUT lower. Select the discharge start voltage (VCPOUT1) and the capacitance of CCPOUT according to the load connected. Caution 1. The S-8823A Series can supply more energy to the OUT pin as the discharge start voltage (V CPOUT1) is higher and the capacitance of the external capacitor (CCPOUT) is larger. However, note that the time from when the power is input until the the discharge operation starts becomes longer in this case. 2. Note that if the discharge start voltage (V CPOUT1) > 2.0 V, the minimum operation input voltage (V IN min.) (the minimum input voltage value required for power to be output from the OUT pin of the S-8823A Series) rises from 0.37 V to 0.39 V (Refer to Table 9). 3. When the capacitance of the external capacitor (C CPOUT) is lower, the discharge operation may start if the ripple voltage of the CPOUT pin reaches the discharge start voltage (V CPOUT1). The influence of the ripple voltage can be reduced by setting CCPOUT larger in this case. 4. Do not connect a load other than a capacitance to the CPOUT pin. Note that the discharge operation may not be performed if a resistance, etc. is connected. Table 9 Discharge Start Voltage (VCPOUT1) Operation Input Voltage (V IN) Operation Temperature Range 1.8 V, 2.0 V 0.37 V min. Ta = −30°C to +60°C 1.8 V to 2.4 V 0.39 V min. Ta = −40°C to +85°C Caution The above connection diagram and constant will not guarantee successful operation. Perform thorough evaluation using the actual application to set the constant.

ENERGY HARVESTING POWERED BY ULTRA-LOW POWER AND ULTRA-LOW VOLTAGE OPERATION BOOST CHARGE PUMP S-8823A Series Rev.1.0_01  Precautions

• If the consumption current during power-off (I SSS) needs to be kept at 0.1 μA or lower, set the VM pin voltage (V VM) so that conditions (1) and (2) below are satisfied. (1) VVM ≥ Power-off voltage (VOFF) (2) Operation input voltage (VIN) + 1.0 V ≤ VVM ≤ 3.0 V
• When selecting products, fully check them using an actually mounted model. Refer to "  Selection of External Capacitor (CCPOUT)" for details.
• The discharge start delay time (t OUT) will be longer according to conditions (1), (2), and (3) below. Also note it will be further longer when these conditions are combined. (1) The operation input voltage (VIN) is low. (2) The discharge start voltage (VCPOUT1) is high. (3) The capacitance of external capacitor (CCPOUT) is large.
• When stopping the discharge to the OUT pin and recharging the external capacitor (C CPOUT), CCPOUT needs to be discharged until CPOUT pin voltage (V CPOUT) decreases to the discharge stop voltage (V CPOUT2) or lower. In this case, set the condition as follows: Condition: OUT pin voltage (VOUT) < VCPOUT2
• When not using the VM pin in actual use, be sure to connect it to the VSS pin. If the VM pin is left open, it may cause malfunctions.
• Note that the operation to recharge the external capacitor (C CPOUT) does not restart when CPOUT pin voltage (VCPOUT) exceeds the discharge stop voltage (V CPOUT2) even if the power-off status is released. This operation restarts if VCPOUT decreases to VCPOUT2 or lower by discharge of CCPOUT.
• Do not connect a high resistance to the VM pin. Note that the VM pin input current (I VM) max. may not flow if a high resistance is connected.
• The S-8823A Series can supply more energy to the OUT pin as the discharge start voltage (V CPOUT1) is higher and the capacitance of the external capacitor (CCPOUT) is larger. However, note that the time from when the power is input until the discharge operation starts becomes longer in this case.
• Note that if the discharge start voltage (V CPOUT1) > 2.0 V, the minimum operation input voltage (V IN min.) (the minimum input voltage value required for power to be output from the OUT pin of the S-8823A Series) rises from 0.37 V to 0.39 V (Refer to Table 9).
• When the capacitance of the external capacitor (C CPOUT) is lower, the discharge operation may start if the ripple voltage of the CPOUT pin reaches the discharge start voltage (V CPOUT1). The influence of the ripple voltage can be reduced by setting CCPOUT larger in this case.
• Do not connect a load other than a capacitance to the CPOUT pin. Note that the discharge operation may not be performed if a resistance, etc. is connected.
• When the operation input voltage (V IN) is higher or the OUT pin current is extremely low, the CPOUT pin voltage (VCPOUT) equal to or more than the discharge start voltage (VCPOUT1) may be output.
• When designing for mass production using the applicati on circuit described herein, the product deviation and temperature characteristics should be taken into consideration. SII Semiconductor Corporation shall not bear any responsibility for the products on the circuits described herein.
• Do not apply an electrostatic discharge to this IC that exceeds the performance ratings of the built-in electrostatic protection circuit.
• SII Semiconductor Corporation claims no responsibility for any disputes arising out of or in connection with any infringement by products including this IC of patents owned by a third party.

ENERGY HARVESTING POWERED BY ULTRA-LOW POWER AND ULTRA-LOW VOLTAGE OPERATION BOOST CHARGE PUMP Rev.1.0_01 S-8823A Series  Characteristics (Typical Data) 1. Example of major voltage characteristics (Ta = +25°C) 1. 1 Discharge start voltage (V CPOUT1), discharge stop voltage (VCPOUT2) vs. Input voltage (VIN) VCPOUT1(S) = 1.8 V VCPOUT1(S) = 2.4 V 2.2 VCPOUT1, VCPOUT2 [V] 3.0 VIN [V] 2.0 1.8 1.6 1.4 1.2 1.0 0.8 VCPOUT2 VCPOUT1 2.8 VCPOUT1, VCPOUT2 [V] 3.0 VIN [V] 2.6 2.4 2.2 2.0 1.8 1.6 1.4 VCPOUT2 VCPOUT1 1. 2 Discharge start delay time (t OUT) vs. Input voltage (VIN) VIN ≤ 0.7 V, CCPOUT = 10 μF V IN ≥ 0.7 V, CCPOUT = 10 μF tOUT [s] 0.7 VIN [V] 0.60.50.40.3 VCPOUT1(S) = 2.4 V VCPOUT1(S) = 1.8 V 0.8 tOUT [s] 3.0 VIN [V] 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 VCPOUT1(S) = 2.4 V VCPOUT1(S) = 1.8 V 1. 3 Discharge start delay time (t OUT) vs. Capacitance of external capacitor (CCPOUT) VIN = 1.0 V 100 0.1 tOUT [s] 100 CCPOUT [F] 0.01 1 10 VCPOUT1(S) = 2.4 V, VIN = 0.37 V VCPOUT1(S) = 1.8 V, VIN = 0.35 V VCPOUT1(S) = 1.8 V, VIN = 0.60 V VCPOUT1(S) = 2.4 V, VIN = 0.60 V tOUT [s] 100 CCPOUT [F] 0.01 0.1 VCPOUT1(S) = 2.4 V VCPOUT1(S) = 1.8 V VIN = 2.0 V VIN = 3.0 V tOUT [s] 100 CCPOUT [F] 0.01 0.1 VCPOUT1(S) = 2.4 V VCPOUT1(S) = 1.8 V tOUT [s] 100 CCPOUT [F] 0.01 0.1 VCPOUT1(S) = 2.4 V VCPOUT1(S) = 1.8 V

ENERGY HARVESTING POWERED BY ULTRA-LOW POWER AND ULTRA-LOW VOLTAGE OPERATION BOOST CHARGE PUMP S-8823A Series Rev.1.0_01 1. 4 Current consumption during operation (I SS) 1. 5 Current consumption during operation (I SS) vs. Input voltage (V IN) vs. CPOUT pin voltage (V CPOUT) VCPOUT = 0 V VCPOUT < VCPOUT2 1.8 ISS [mA] 3.0 VIN [V] 0.0 1.5 1.2 0.9 0.6 0.3 VCPOUT1(S) = 2.4 V VCPOUT1(S) = 1.8 V 120 ISS [A] 2.5 VCPOUT [V] 0.0 100 2.0 1.5 1.0 0.5 VCPOUT1(S) = 2.4 V, VIN = 0.37 V VCPOUT1(S) = 1.8 V, VIN = 0.35 V 1. 6 Current consumption during power-off (I SSS) 1. 7 Power-off voltage (V OFF) vs. Input voltage (VIN) vs. Input voltage (VIN) VVM = 3.0 V ISSS [nA] 2.0 VIN [V] 0.0 1.51.00.5 VCPOUT1(S) = 2.4 V VCPOUT1(S) = 1.8 V 2.8 VOFF [V] 3.0 VIN [V] 1.4 2.6 2.4 2.2 2.0 1.8 1.6 VOFF(S) = 2.5 V VOFF(S) = 1.9 V 1. 8 VM pin input current (I VM) vs. VM pin voltage (VVM) 1.2 IVM [μA] 3.0 VVM [V] 0.0 1.0 0.8 0.6 0.4 0.2 VOFF(S) = 2.5 V VOFF(S) = 1.9 V

ENERGY HARVESTING POWERED BY ULTRA-LOW POWER AND ULTRA-LOW VOLTAGE OPERATION BOOST CHARGE PUMP Rev.1.0_01 S-8823A Series 2. Example of major temperature characteristics (Ta = −40°C to +85°C) 2. 1 Discharge start voltage (V CPOUT1), discharge stop voltage (VCPOUT2) vs. Temperature (Ta) VCPOUT1(S) = 1.8 V VCPOUT1(S) = 2.4 V −40 8575 50 25 0−25 Ta [C] 2.2 VCPOUT1, VCPOUT2 [V] 2.0 1.8 1.6 1.4 1.2 1.0 0.8 VCPOUT2 VCPOUT1 −40 8575 50 25 0−25 Ta [C] 2.8 VCPOUT1, VCPOUT2 [V] 2.6 2.4 2.2 2.0 1.8 1.6 1.4 VCPOUT2 VCPOUT1 2. 2 Discharge start delay time (t OUT) vs. Temperature (Ta) CCPOUT = 10 μF C CPOUT = 10 μF 40 85 75 50 25 025 Ta [C] tOUT [s] VCPOUT1(S) = 2.4 V, VIN = 0.39 V VCPOUT1(S) = 1.8 V, VIN = 0.37 V 40 85 75 50 25 025 Ta [C] tOUT [s] 1.2 0.0 1.0 0.8 0.6 0.4 0.2 VCPOUT1(S) = 2.4 V, VIN = 0.6 V VCPOUT1(S) = 1.8 V, VIN = 0.6 V VCPOUT1(S) = 1.8 V, VIN = 1.0 V VCPOUT1(S) = 2.4 V, VIN = 1.0 V VIN = 2.0 V, CCPOUT = 10 μF V IN = 3.0 V, CCPOUT = 10 μF 40 85 75 50 25 025 Ta [C] tOUT [s] 0.5 0.4 0.3 0.2 0.1 0.0 VCPOUT1(S) = 2.4 V VCPOUT1(S) = 1.8 V 40 85 75 50 25 025 Ta [C] tOUT [s] 0.5 0.4 0.3 0.2 0.1 0.0 VCPOUT1(S) = 2.4 V VCPOUT1(S) = 1.8 V 2. 3 Current consumption during operation (I SS) vs. Temperature (Ta) VCPOUT = 0 V VCPOUT = 0 V 40 85 75 50 25 025 Ta [C] ISS [mA] 0.25 0.20 0.15 0.10 0.05 0.00 VCPOUT1(S) = 2.4 V, VIN = 0.39 V VCPOUT1(S) = 1.8 V, VIN = 0.37 V −40 8575 50 25 0−25 Ta [C] ISS [mA] 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 VCPOUT1(S) = 2.4 V, VIN = 0.6 V VCPOUT1(S) = 1.8 V, VIN = 0.6 V VCPOUT1(S) = 1.8 V, VIN = 1.0 V VCPOUT1(S) = 2.4 V, VIN = 1.0 V

ENERGY HARVESTING POWERED BY ULTRA-LOW POWER AND ULTRA-LOW VOLTAGE OPERATION BOOST CHARGE PUMP S-8823A Series Rev.1.0_01 2. 4 Current consumption during power-off (I SSS) 2. 5 Power-off voltage (V OFF) vs. Temperature (Ta) vs. Temperature (Ta) VVM = 3.0 V 40 85 75 50 25 025 Ta [C] ISSS [nA] VIN = 2.0 VVIN = 1.0 VVIN = 0.35 V −40 8575 50 25 0−25 Ta [C] VOFF [V] 2.8 1.6 2.6 2.4 2.2 2.0 1.8 VOFF(S) = 2.5 V VOFF(S) = 1.9 V 2. 6 Discharge control switch resistance (R M1) 2. 7 Discharge control switch leakage current (ILEAK) vs. Temperature (Ta) vs. Temperature (Ta) V VM = VCPOUT = 3.0 V, VIN = VOUT = 0 V −40 8575 50 25 0−25 Ta [C] RM1 [Ω] VCPOUT1(S) = 1.8 V VCPOUT1(S) = 2.4 V −40 8575 50 25 0−25 Ta [C] ILEAK [nA] VCPOUT1(S) = 1.8 V VCPOUT1(S) = 2.4 V 2. 8 VM pin input current (I VM) vs. Temperature (Ta) VVM = 3.0 V −40 8575 50 25 0−25 Ta [C] IVM [A] 1.2 0.0 1.0 0.8 0.6 0.4 0.2 VOFF(S) = 2.5 V VOFF(S) = 1.9 V

ENERGY HARVESTING POWERED BY ULTRA-LOW POWER AND ULTRA-LOW VOLTAGE OPERATION BOOST CHARGE PUMP Rev.1.0_01 S-8823A Series  Marking Specifications 1. SOT-23-5 123 Top view (1) (2) (3) (4) (1) to (3): Product code (Refer to Product name vs. Product code) (4): Lot number Product Name vs. Product Code Product Name Product Code (1) (2) (3) S-8823A18-M5T1U Q Y U S-8823A20-M5T1U Q Y V S-8823A22-M5T1U Q Y W S-8823A24-M5T1U Q Y X 2. SNT-8A Top view 14 3 2 85 6 7 (1) (2) (3) (4) (5) (6) (7) (8) (9) (10) (11) (1): Blank (2) to (4): Product code (Refer to Product name vs. Product code) (5), (6): Blank (7) to (11): Lot number Product Name vs. Product Code Product Name Product Code (2) (3) (4) S-8823A18-I8T1U Q Y U S-8823A20-I8T1U Q Y V S-8823A22-I8T1U Q Y W S-8823A24-I8T1U Q Y X

ENERGY HARVESTING POWERED BY ULTRA-LOW POWER AND ULTRA-LOW VOLTAGE OPERATION BOOST CHARGE PUMP S-8823A Series Rev.1.0_01  Power Dissipation 0 25 50 75 100 125 150 1750.0 0.2 0.4 0.6 0.8 1.0 Ambient temperature (Ta) [C] Power dissipation (PD) [W] Tj = 125C max. SOT-23-5 B A 0 25 50 75 100 125 150 1750.0 0.2 0.4 0.6 0.8 1.0 Ambient temperature (Ta) [C] Power dissipation (PD) [W] Tj = 125C max. SNT-8A B A Board Power Dissipation (PD) Board Power Dissipation (PD) A 0.52 W A 0.47 W B 0.63 W B 0.58 W C − C − D − D − E − E −

(1) (2) Board A Item Specification Size [mm] 114.3 x 76.2 x t1.6 Material FR-4 Number of copper foil layer 2 Copper foil layer [mm] Land pattern and wiring for testing: t0.070 74.2 x 74.2 x t0.070 74.2 x 74.2 x t0.070 Thermal via - Board B Item Specification Size [mm] 114.3 x 76.2 x t1.6 Thermal via - Material FR-4 Number of copper foil layer 4 Copper foil layer [mm] Land pattern and wiring for testing: t0.070 74.2 x 74.2 x t0.035 74.2 x 74.2 x t0.035 IC Mount Area SOT-23-3/5/6 Test Board No. SOT23x-A-Board-SD-1.0 SII Semiconductor Corporation

(1) (2) Thermal via - Material FR-4 Number of copper foil layer 4 Copper foil layer [mm] Land pattern and wiring for testing: t0.070 74.2 x 74.2 x t0.035 74.2 x 74.2 x t0.035 74.2 x 74.2 x t0.070 Thermal via - Board B Item Specification Size [mm] 114.3 x 76.2 x t1.6 Number of copper foil layer 2 Copper foil layer [mm] Land pattern and wiring for testing: t0.070 74.2 x 74.2 x t0.070 Board A Item Specification Size [mm] 114.3 x 76.2 x t1.6 Material FR-4 IC Mount Area SNT-8A Test Board No. SNT8A-A-Board-SD-1.0 SII Semiconductor Corporation

/X4E/X6F/X2E /X54/X49/X54/X4C/X45 /X55/X4E/X49/X54 /X53/X49/X49/X20/X53/X65/X6D/X69/X63/X6F/X6E/X64/X75/X63/X74/X6F/X72/X20/X43/X6F/X72/X70/X6F/X72/X61/X74/X69/X6F/X6E /X41/X4E/X47/X4C/X45 /X32/X2E/X39/XB1/X30/X2E/X32 /X31/X2E/X39/XB1/X30/X2E/X32 /X30/X2E/X39/X35/XB1/X30/X2E/X31 /X30/X2E/X34/XB1/X30/X2E/X31 /X30/X2E/X31/X36 /X20/X2B/X30/X2E/X31 /X20/X2D/X30/X2E/X30/X36/X31/X32/X33 /X34/X35 /X4E/X6F/X2E/X20/X4D/X50/X30/X30/X35/X2D/X41/X2D/X50/X2D/X53/X44/X2D/X31/X2E/X33 /X4D/X50/X30/X30/X35/X2D/X41/X2D/X50/X2D/X53/X44/X2D/X31/X2E/X33 /X53/X4F/X54/X32/X33/X35/X2D/X41/X2D/X50/X4B/X47/X20/X44/X69/X6D/X65/X6E/X73/X69/X6F/X6E/X73 /X6D/X6D

/X4E/X6F/X2E /X54/X49/X54/X4C/X45 /X55/X4E/X49/X54 /X53/X49/X49/X20/X53/X65/X6D/X69/X63/X6F/X6E/X64/X75/X63/X74/X6F/X72/X20/X43/X6F/X72/X70/X6F/X72/X61/X74/X69/X6F/X6E /X41/X4E/X47/X4C/X45 /XF8/X31/X2E/X35 /X2B/X30/X2E/X31 /X2D/X30 /X32/X2E/X30/XB1/X30/X2E/X30/X35 /XF8/X31/X2E/X30 /X2B/X30/X2E/X32 /X2D/X30 /X34/X2E/X30/XB1/X30/X2E/X31 /X31/X2E/X34/XB1/X30/X2E/X32 /X30/X2E/X32/X35/XB1/X30/X2E/X31 /X33/X2E/X32/XB1/X30/X2E/X32 /X31/X32/X33 /X34/X35 /X4E/X6F/X2E/X20/X4D/X50/X30/X30/X35/X2D/X41/X2D/X43/X2D/X53/X44/X2D/X32/X2E/X31 /X4D/X50/X30/X30/X35/X2D/X41/X2D/X43/X2D/X53/X44/X2D/X32/X2E/X31 /X53/X4F/X54/X32/X33/X35/X2D/X41/X2D/X43/X61/X72/X72/X69/X65/X72/X20/X54/X61/X70/X65 /X46/X65/X65/X64/X20/X64/X69/X72/X65/X63/X74/X69/X6F/X6E /X34/X2E/X30/XB1/X30/X2E/X31/X28/X31/X30/X20/X70/X69/X74/X63/X68/X65/X73/X3A/X34/X30/X2E/X30/XB1/X30/X2E/X32/X29 /X6D/X6D

/X4E/X6F/X2E /X54/X49/X54/X4C/X45 /X55/X4E/X49/X54 /X53/X49/X49/X20/X53/X65/X6D/X69/X63/X6F/X6E/X64/X75/X63/X74/X6F/X72/X20/X43/X6F/X72/X70/X6F/X72/X61/X74/X69/X6F/X6E /X41/X4E/X47/X4C/X45 /X31/X32/X2E/X35/X6D/X61/X78/X2E /X39/X2E/X30/XB1/X30/X2E/X33 /XF8/X31/X33/XB1/X30/X2E/X32 /X28/X36/X30/XB0/X29 /X28/X36/X30/XB0/X29 /X51/X54/X59/X2E/X33/X2C/X30/X30/X30 /X4E/X6F/X2E/X20/X4D/X50/X30/X30/X35/X2D/X41/X2D/X52/X2D/X53/X44/X2D/X31/X2E/X31 /X4D/X50/X30/X30/X35/X2D/X41/X2D/X52/X2D/X53/X44/X2D/X31/X2E/X31 /X53/X4F/X54/X32/X33/X35/X2D/X41/X2D/X52/X65/X65/X6C /X45/X6E/X6C/X61/X72/X67/X65/X64/X20/X64/X72/X61/X77/X69/X6E/X67/X20/X69/X6E/X20/X74/X68/X65/X20/X63/X65/X6E/X74/X72/X61/X6C/X20/X70/X61/X72/X74 /X6D/X6D

/X53/X49/X49/X20/X53/X65/X6D/X69/X63/X6F/X6E/X64/X75/X63/X74/X6F/X72/X20/X43/X6F/X72/X70/X6F/X72/X61/X74/X69/X6F/X6E /X4E/X6F/X2E /X54/X49/X54/X4C/X45 /X55/X4E/X49/X54 /X41/X4E/X47/X4C/X45 /X31/X2E/X39/X37/XB1/X30/X2E/X30/X33 /X30/X2E/X32/XB1/X30/X2E/X30/X35 /X30/X2E/X34/X38/XB1/X30/X2E/X30/X32 /X30/X2E/X30/X38 /X6D/X6D /X53/X4E/X54/X2D/X38/X41/X2D/X41/X2D/X50/X4B/X47/X20/X44/X69/X6D/X65/X6E/X73/X69/X6F/X6E/X73 /X50/X48/X30/X30/X38/X2D/X41/X2D/X50/X2D/X53/X44/X2D/X32/X2E/X31 /X4E/X6F/X2E/X20/X50/X48/X30/X30/X38/X2D/X41/X2D/X50/X2D/X53/X44/X2D/X32/X2E/X31 /X30/X2E/X35 /X2B/X30/X2E/X30/X35 /X2D/X30/X2E/X30/X32/X31 /X32/X33/X34 /X35/X36/X37/X38

/X53/X49/X49/X20/X53/X65/X6D/X69/X63/X6F/X6E/X64/X75/X63/X74/X6F/X72/X20/X43/X6F/X72/X70/X6F/X72/X61/X74/X69/X6F/X6E /X4E/X6F/X2E /X54/X49/X54/X4C/X45 /X55/X4E/X49/X54 /X41/X4E/X47/X4C/X45 /X6D/X6D /X50/X48/X30/X30/X38/X2D/X41/X2D/X43/X2D/X53/X44/X2D/X31/X2E/X30 /X53/X4E/X54/X2D/X38/X41/X2D/X41/X2D/X43/X61/X72/X72/X69/X65/X72/X20/X54/X61/X70/X65 /X4E/X6F/X2E/X20/X50/X48/X30/X30/X38/X2D/X41/X2D/X43/X2D/X53/X44/X2D/X31/X2E/X30 /X46/X65/X65/X64/X20/X64/X69/X72/X65/X63/X74/X69/X6F/X6E /X34/X2E/X30/XB1/X30/X2E/X31/X32/X2E/X30/XB1/X30/X2E/X30/X35 /X34/X2E/X30/XB1/X30/X2E/X31 /XF8/X31/X2E/X35/X2B/X30/X2E/X31 /X20/X2D/X30 /XF8/X30/X2E/X35/XB1/X30/X2E/X31 /X32/X2E/X32/X35/XB1/X30/X2E/X30/X35 /X30/X2E/X36/X35/XB1/X30/X2E/X30/X35 /X30/X2E/X32/X35/XB1/X30/X2E/X30/X35 /X32/X31/X33/X34 /X37/X38/X36/X35 /X35/XB0

/X53/X49/X49/X20/X53/X65/X6D/X69/X63/X6F/X6E/X64/X75/X63/X74/X6F/X72/X20/X43/X6F/X72/X70/X6F/X72/X61/X74/X69/X6F/X6E /X4E/X6F/X2E /X54/X49/X54/X4C/X45 /X55/X4E/X49/X54 /X41/X4E/X47/X4C/X45 /X31/X32/X2E/X35/X6D/X61/X78/X2E /X39/X2E/X30/XB1/X30/X2E/X33 /XF8/X31/X33/XB1/X30/X2E/X32 /X28/X36/X30/XB0/X29 /X28/X36/X30/XB0/X29 /X45/X6E/X6C/X61/X72/X67/X65/X64/X20/X64/X72/X61/X77/X69/X6E/X67/X20/X69/X6E/X20/X74/X68/X65/X20/X63/X65/X6E/X74/X72/X61/X6C/X20/X70/X61/X72/X74 /X51/X54/X59/X2E /X50/X48/X30/X30/X38/X2D/X41/X2D/X52/X2D/X53/X44/X2D/X31/X2E/X30 /X6D/X6D /X53/X4E/X54/X2D/X38/X41/X2D/X41/X2D/X52/X65/X65/X6C /X4E/X6F/X2E/X20/X50/X48/X30/X30/X38/X2D/X41/X2D/X52/X2D/X53/X44/X2D/X31/X2E/X30 /X35/X2C/X30/X30/X30

/X53/X49/X49/X20/X53/X65/X6D/X69/X63/X6F/X6E/X64/X75/X63/X74/X6F/X72/X20/X43/X6F/X72/X70/X6F/X72/X61/X74/X69/X6F/X6E /X4E/X6F/X2E /X54/X49/X54/X4C/X45 /X55/X4E/X49/X54 /X41/X4E/X47/X4C/X45 /X6D/X6D /X53/X4E/X54/X2D/X38/X41/X2D/X41 /X20/X20/X20/X20/X20/X20/X2D/X4C/X61/X6E/X64/X20/X52/X65/X63/X6F/X6D/X6D/X65/X6E/X64/X61/X74/X69/X6F/X6E /X50/X48/X30/X30/X38/X2D/X41/X2D/X4C/X2D/X53/X44/X2D/X34/X2E/X31 /X30/X2E/X33/X30/X2E/X32 /X30/X2E/X35/X32 /X32/X2E/X30/X31 /X30/X2E/X35/X32 /X4E/X6F/X2E/X20/X50/X48/X30/X30/X38/X2D/X41/X2D/X4C/X2D/X53/X44/X2D/X34/X2E/X31 /X43/X61/X75/X74/X69/X6F/X6E /X31/X2E/X20/X44/X6F/X20/X6E/X6F/X74/X20/X64/X6F/X20/X73/X69/X6C/X6B/X73/X63/X72/X65/X65/X6E/X20/X70/X72/X69/X6E/X74/X69/X6E/X67/X20/X61/X6E/X64/X20/X73/X6F/X6C/X64/X65/X72/X20/X70/X72/X69/X6E/X74/X69/X6E/X67/X20/X75/X6E/X64/X65/X72/X20/X74/X68/X65/X20/X6D/X6F/X6C/X64/X20/X72/X65/X73/X69/X6E/X20/X6F/X66/X20/X74/X68/X65/X20/X70/X61/X63/X6B/X61/X67/X65/X2E /X32/X2E/X20/X54/X68/X65/X20/X74/X68/X69/X63/X6B/X6E/X65/X73/X73/X20/X6F/X66/X20/X74/X68/X65/X20/X73/X6F/X6C/X64/X65/X72/X20/X72/X65/X73/X69/X73/X74/X20/X6F/X6E/X20/X74/X68/X65/X20/X77/X69/X72/X65/X20/X70/X61/X74/X74/X65/X72/X6E/X20/X75/X6E/X64/X65/X72/X20/X74/X68/X65/X20/X70/X61/X63/X6B/X61/X67/X65/X20/X73/X68/X6F/X75/X6C/X64/X20/X62/X65/X20/X30/X2E/X30/X33/X20/X6D/X6D /X20/X6F/X72/X20/X6C/X65/X73/X73/X20/X66/X72/X6F/X6D/X20/X74/X68/X65/X20/X6C/X61/X6E/X64/X20/X70/X61/X74/X74/X65/X72/X6E/X20/X73/X75/X72/X66/X61/X63/X65/X2E /X33/X2E/X20/X4D/X61/X74/X63/X68/X20/X74/X68/X65/X20/X6D/X61/X73/X6B/X20/X61/X70/X65/X72/X74/X75/X72/X65/X20/X73/X69/X7A/X65/X20/X61/X6E/X64/X20/X61/X70/X65/X72/X74/X75/X72/X65/X20/X70/X6F/X73/X69/X74/X69/X6F/X6E/X20/X77/X69/X74/X68/X20/X74/X68/X65/X20/X6C/X61/X6E/X64/X20/X70/X61/X74/X74/X65/X72/X6E/X2E /X34/X2E/X20/X52/X65/X66/X65/X72/X20/X74/X6F/X20/X22/X53/X4E/X54/X20/X50/X61/X63/X6B/X61/X67/X65/X20/X55/X73/X65/X72/X27/X73/X20/X47/X75/X69/X64/X65/X22/X20/X66/X6F/X72/X20/X64/X65/X74/X61/X69/X6C/X73/X2E /X31/X2E/X20 /X28/X30/X2E/X32/X35/X20/X6D/X6D/X20/X6D/X69/X6E/X2E/X20/X2F/X20/X30/X2E/X33/X30/X20/X6D/X6D/X20/X74/X79/X70/X2E/X29 /X32/X2E/X20 /X20/X28/X31/X2E/X39/X36/X20/X6D/X6D/X20/X7E/X20/X32/X2E/X30/X36/X20/X6D/X6D/X29 /X31/X2E /X32/X2E /X30/X2E/X30/X33/X20/X6D/X6D /X33/X2E /X34/X2E /X53/X4E/X54 /X31/X2E/X20/X50/X61/X79/X20/X61/X74/X74/X65/X6E/X74/X69/X6F/X6E/X20/X74/X6F/X20/X74/X68/X65/X20/X6C/X61/X6E/X64/X20/X70/X61/X74/X74/X65/X72/X6E/X20/X77/X69/X64/X74/X68/X20/X28/X30/X2E/X32/X35/X20/X6D/X6D/X20/X6D/X69/X6E/X2E/X20/X2F/X20/X30/X2E/X33/X30/X20/X6D/X6D/X20/X74/X79/X70/X2E/X29/X2E /X32/X2E/X20/X44/X6F/X20/X6E/X6F/X74/X20/X77/X69/X64/X65/X6E/X20/X74/X68/X65/X20/X6C/X61/X6E/X64/X20/X70/X61/X74/X74/X65/X72/X6E/X20/X74/X6F/X20/X74/X68/X65/X20/X63/X65/X6E/X74/X65/X72/X20/X6F/X66/X20/X74/X68/X65/X20/X70/X61/X63/X6B/X61/X67/X65/X20/X28/X31/X2E/X39/X36/X20/X6D/X6D/X20/X74/X6F/X20/X32/X2E/X30/X36/X6D/X6D/X29/X2E /X31 /X32 /X31/X2E /X32/X2E/X20 /X28/X31/X2E/X39/X36/X20/X6D/X6D/X20/X7E/X20/X32/X2E/X30/X36/X20/X6D/X6D/X29 /X28/X30/X2E/X32/X35/X20/X6D/X6D/X20/X6D/X69/X6E/X2E/X20/X2F/X20/X30/X2E/X33/X30/X20/X6D/X6D/X20/X74/X79/X70/X2E/X29

Disclaimers (Handling Precautions) 1. All the information described herei n (product data, specifications, figur es, tables, programs, algorithms and application circuit examples, etc.) is cu rrent as of publishing dat e of this document and is subject to change without notice. 2. The circuit examples and the usages described herein are for reference only, and do not guarantee the success of any specific mass-production design. SII Semiconductor Corporation is not responsible for damages caused by the reasons other than the products or infringement of third-party intellectual property rights and any other rights due to the use of the information described herein. 3. SII Semiconductor Corporation is not responsible for da mages caused by the incorrect information described herein. 4. Take care to use the products described herein within their specified ranges. Pay special attention to the absolute maximum ratings, operation voltage range and electrical characteristics, etc. SII Semiconductor Corporation is not re sponsible for damages caused by failu res and/or accidents, etc. that occur due to the use of products outside their specified ranges. 5. When using the products described herei n, confirm their applicatio ns, and the laws and regulat ions of the region or country where they are used and verify suitability, safety and other factors for the intended use. 6. When exporting the products described herein, comply with the Foreign Exchange and Foreign Trade Act and all other export-related laws, and follow the required procedures. 7. The products described herein must not be used or prov ided (exported) for the purposes of the development of weapons of mass destruction or militar y use. SII Semiconductor Corporation is not responsible for any provision (export) to those whose purpose is to develop, manufactur e, use or store nuclear, biol ogical or chemical weapons, missiles, or other military use. 8. The products described herein are not designed to be used as part of any device or equipment that may affect the human body, human life, or assets (such as medical equi pment, disaster prevention sy stems, security systems, combustion control systems, infrastructure control systems, vehicle equipment, traffic systems, in-vehicle equipment, aviation equipment, aerospace equipment, and nuclear-related equipment), excluding when specified for in-vehicle use or other uses. Do not use those products without the prior written permission of SII Semiconductor Corporation. Especially, the products described her ein cannot be used for life support dev ices, devices implanted in the human body and devices that directly affect human life, etc. Prior consultation with our sales office is required when considering the above uses. SII Semiconductor Corporation is not responsible for damages caused by unauthorized or unspecified use of our products. 9. Semiconductor products may fail or malfunction with some probability. The user of these products s hould therefore take responsibility to gi ve thorough consideration to safety design including redundancy, fire spread prevention measures, and malfunction prevention to prevent accidents causing injury or death, fires and social damage, etc. that may ensue from the products' failure or malfunction. The entire system must be sufficiently evaluated and applied on customer's own responsibility. 10. The products described herein are not designed to be radi ation-proof. The necessary radiation measures should be taken in the product design by the customer depending on the intended use. 11. The products described herein do not affect human health under normal use. However, they contain chemical substances and heavy metals and should therefore not be put in the mouth. The fracture surfaces of wafers and chips may be sharp. Take care when handling these with the bare hands to prevent injuries, etc. 12. When disposing of the products described herein, comply with the laws and ordinances of the country or region where they are used. 13. The information described herein contains copyright info rmation and know-how of SII Semiconductor Corporation. The information described herein does not convey any lic ense under any intellectual property rights or any other rights belonging to SII Semiconductor Corporation or a third party. Reproduction or copying of the information described herein for the purpose of disclosing it to a thir d-party without the express permission of SII Semiconductor Corporation is strictly prohibited. 14. For more details on the information de scribed herein, contact our sales office. 1.0-2016.01 www.sii-ic.com