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www.sii-ic.com STEP-DOWN, BUILT-IN FET, SYNCHRONOUS RECTIFICATION, PWM CONTROL SWITCHING REGULATORS © SII Semiconductor Corporation, 2007-2015 Rev.5.0_01 The S-8550 Series is a CMOS synchronous rectification step-down switching re gulator which mainly consists of a reference voltage circuit, an oscillator, an error amplifier, a phase compensation circuit, a PWM controller, an under voltage lockout circuit (UVLO), a current limit circuit, and a powe r MOS FET. The oscillation frequency is high at 1.2 MHz, so a high efficiency, large output current, step-down switching regulator can be achieved by using small external parts. The built-in synchronous rectification circuit makes achieving hi gh efficiency easier compared with conventional step-down switching regulators. A ceramic capacitor can be used as an output capacitor. High-density mounting is supported by adopting packages small SOT-23-5 and super-small and thin SNT-8A. Features
- Oscillation frequency: 1.2 MHz
- Input voltage range: 2.0 V to 5.5 V
- Output voltage range: Arbitrarily settable by external output voltage setting resistor
- Output current: 600 mA
- Reference voltage: 0.6 V ±2.0%
- Efficiency: 92%
- Soft-start function: 1 ms typ.
- Shutdown function: Shutdown current consumption : 1.0 μA max.
- Built-in current limit circuit
- Pch power MOS FET on-resistance: 0.4 Ω typ.
- Nch power MOS FET on-resistance: 0.3 Ω typ.
- Constant continuous mode operation (no light load mode)
- Lead-free, Sn 100%, halogen-free *1 *1. Refer to “ Product Name Structure ” for details. Applications
- Mobile devices, such as mobile phones, Bluetooth devices , wireless devices, digital audio players, digital still cameras, portable DVD players, and portable CD players Packages
- SOT-23-5
- S N T - 8 A
STEP-DOWN, BUILT-IN FET, SYNCHRONOUS RECTIFICATION, PWM CONTROL SWITCHING REGULATORS Rev.5.0_01 S-8550 Series Product Name Structure 1. Product name 1. 1 SOT-23-5 S-8550 A A - M 5 T 1 x Package name abbreviation and packing specification*1 M5T1: SOT-23-5, tape Oscillation frequency A: 1.2 MHz Environmental code U: Lead-free (Sn 100%), halogen-free G: Lead-free (for details, please contact our sales office) *1. Refer to the tape drawing. 1. 2 SNT-8A S-8550 A A - I 8 T 1 U Package name abbreviation and packing specification*1 I8T1: SNT-8A, ta pe Oscillation frequency A: 1.2 MHz Environmental code U: Lead-free (Sn 100%), halogen-free *1. Refer to the tape drawing. 2. Packages Package Name Drawing Code Package Tape Reel Land SOT-23-5 MP005-A-P-SD MP005-A-C-SD MP005-A-R-SD − SNT-8A PH008-A-P-SD PH008-A-C- SD PH008-A-R-SD PH008-A-L-SD
STEP-DOWN, BUILT-IN FET, SYNCHRONOUS RECTIFICATION, PWM CONTROL SWITCHING REGULATORS S-8550 Series Rev.5.0_01 Pin Configurations 1. SOT-23-5 Table 1 13 2 Top view Figure 3 Pin No. Symbol Description
1 VIN IC power supply pin
2 VSS GND pin
“H” : Power on (normal operation) “L” : Power off (standby)
4 FB Output voltage feedback pin
5 CONT External inductor connection pin
- SNT-8A Table 2 Top view Figure 4 Pin No. Symbol Description
1 FB Output voltage feedback pin
2 NC*1 No connection
3 VSS*2 Small signal GND Pin
“H”：Power on (normal operation) “L”：Power off (standby)
5 VIN IC power supply pin
6 PVSS*2 Power GND pin
7 NC*1 No connection
8 CONT External inductor connection pin
*1. The NC pin is electrically open. The NC pin can be connected to VIN, VSS or PVSS. *2. Connect VSS and PVSS to GND.
STEP-DOWN, BUILT-IN FET, SYNCHRONOUS RECTIFICATION, PWM CONTROL SWITCHING REGULATORS Rev.5.0_01 S-8550 Series Absolute Maximum Ratings Table 3 Absolute Maximum Ratings (Unless otherwise specified: Ta = 25°C, VSS = 0 V) Item Symbol Abso lute Maximum Rating Unit VIN pin voltage V IN V SS − 0.3 to VSS + 6.0 V FB pin voltage V FB V SS − 0.3 to VIN + 0.3 V CONT pin voltage V CONT V SS − 0.3 to VIN + 0.3 V ON/OFF pin voltage V ON/OFF V SS − 0.3 to VIN + 0.3 V CONT pin current I CONT 1300 mA Power dissipation SOT-23-5 PD 600*1 mW SNT-8A 450*1 mW Operating temperature T opr −40 to +85 °C Storage temperature T stg −40 to +125 °C *1. When mounted on printed circuit board [Mounted board] (1) Board size: 114.3 mm × 76.2 mm × t1.6 mm (2) Board name: JEDEC STANDARD51-7 Caution 1. The absolute maximum ratings are rated values exceeding which the product could suffer physical damage. These values must therefore not be exceeded under any conditions. 2. Since this IC has a built-in power MOS FET, make sure that dissipation of the power MOS FET does not exceed the allowable power dissipation of the package. (Refer to Figure 5.) Generally, dissipation of a switching regulator can be calculated by the following equation. Dissipation = (100 (%) − efficiency (%)) / efficiency (%) × output voltage × load current The greater part of dissipation depends on the built-in power MOS FET, however, dissipation of the inductor is also included. In addition, since power dissipation of th e package also changes a ccording to a mounting board or a mounting state, fully check them using an actually mounted mode. 400 Power dissipation (P D) [mW] Ambient temperature (Ta) [°C] 200 500 300 100 600 700 50 100 150 SNT-8A SOT-23-5 Figure 5 Power Dissipation of Package (Mounted on Board)
STEP-DOWN, BUILT-IN FET, SYNCHRONOUS RECTIFICATION, PWM CONTROL SWITCHING REGULATORS S-8550 Series Rev.5.0_01 Electrical Characteristics Table 4 Electrical Characteristics (Unless otherwise specified: V IN = 3.6 V, VOUT = 1.8 V (the conditions in Table 5), Ta = +25°C) Item Symbol Condition Min. Typ. Max. Unit Test Circuit Operating input voltage V IN − 2.0 − 5.5 V 2 Output voltage range *1 VOUT V IN = VOUT(S) + 0.4 V to 5.5 V 1.1 − 4.0 V 2 FB voltage temperature coefficient ΔVFB ΔTa Ta = −40°C to +85°C − ±100 − ppm/ °C 2 FB pin input current I FB V IN = 2.0 V to 5.5 V, FB pin −0.1 − +0.1 μA 1 Current consumption during shutdown ISSS VIN = 2.0 V to 5.5 V, VON/OFF = 0 V − − 1.0 μA 1 Current consumption 1 I SS1 fosc = 1.2 MHz, no external parts, VFB = VFB(S) × 1.1 V − 200 400 μA 1 Power MOS FET on-resistance RPFET I CONT = 100 mA − 0.4 0.6 Ω 1 RNFET I CONT = −100 mA − 0.3 0.5 Power MOS FET leakage current ILSW VIN = 2.0 V to 5.5 V, VON/OFF = 0 V, VCONT = 0 or 3.6 V − ±0.01 ±0.5 μA 1 Limit current I LIM − 800 1000 1200 mA 1 Oscillation frequency f osc − 1.02 1.2 1.38 MHz 2 Soft-start time t SS Time required to reach 90% of VOUT(S) 0.7 1.0 1.3 ms 2 High level input voltage V SH V IN = 2.0 V to 5.5 V, ON/OFF pin 0.9 − − V 2 Low level input voltage V SL V IN = 2.0 V to 5.5 V, ON/OFF pin − − 0.3 V 2 High level input current I SH V IN = 2.0 V to 5.5 V, ON/OFF pin −0.1 − 0.1 μA 1 Low level input current I SL V IN = 2.0 V to 5.5 V, ON/OFF pin −0.1 − 0.1 μA 1 UVLO detection voltage VUVLO − 1.4 1.6 1.78 V 2 *1. V OUT(S) is the output voltage set value, and V OUT is the typ. value of t he actual output voltage. V OUT(S) can be set depending on the ratio between the V FB value and output voltage set resistors (R FB1, RFB2). For details, refer to “ External Parts Selection ”. External Parts When Measuri ng Electrical Characteristics Table 5 External Parts Element Name Symbol Constant Manufacturer Part Number Inductor L 3.3 μH Taiyo Yuden Co., Ltd. NR4018T3R3M Input capacitor C IN 4.7 μF TDK Corporation C3216X7R1E475K Output capacitor C OUT 10 μF TDK Corporation C3216X7R1C106K Output voltage set resistor 1 R FB1 36 k Ω Rohm Co., Ltd. MCR03 Series 3602 Output voltage set resistor 2 R FB2 18 k Ω Rohm Co., Ltd. MCR03 Series 1802 Phase compensation capacitor C FB 68 pF Murata Manufacturing Co., Ltd. GRM1882C1H680J
STEP-DOWN, BUILT-IN FET, SYNCHRONOUS RECTIFICATION, PWM CONTROL SWITCHING REGULATORS S-8550 Series Rev.5.0_01 Operation 1. Synchronous rectification PWM c ontrol step-down switching regulator 1. 1 Synchronous rectification The synchronous rectification method lo wers voltage drop to greatly reduce power dissipation since an Nch power MOS FET, having resistance much lower th an conventional switching regulators, is used. In conventional switching regulators, current flows in the diode connected between the GND and CONT pins when the Pch power MOS FET is off. The forward drop voltage (V f) of such diodes is large, between 0.3 V to 0.7 V, so the power dissipation used to be very la rge. Synchronous rectification ultra-low resistance Nch transistors repeat on and off, in sync hronization with the operat ion of the Pch driver, in the reverse cycle of the Pch driver. Moreover, the built-in P and N through prevention circuit helps much reduction of power consumption during operation. 1. 2 PWM control The S-8550 Series is a switching regulator using a pulse width modulation method (PWM) and features low current consumption. In conventional PFM control switching regulators, pulses are skipped when the output load current is low, causing a fluctuation in the ripple fr equency of the output voltage, resu lting in an increase in the ripple voltage. In the S-8550 Series, the switching frequency does not change, although the pulse width changes from 0% to 100% corresponding to each load current. The ripple voltage generated from switching can thus be removed easily using a filter because the switching frequency is constant. 2. Soft-start function The soft-start circuit built in the S-8550 Series controls the rush current and the overshoot of the output voltage when powering on, the ON/OFF pin is switched from the “L” level to the “H” level, or the UVLO operation is released. A reference voltage adjustment meth od is adopted as the soft-start method. 3. Shutdown pin This pin stops or starts step-up operations. Switching the shutdown pin to the “L” level stops operation of all the internal circuits and reduces the current consumption significantly. DO NOT use the shutdown pin in a floating st ate because it is not pulled up or pulled down internally. DO NOT apply voltage of be tween 0.3 V and 0.9 V to the shutdown pin because applying such a voltage increases the current consumption. If the shutdown pin is not used, connect it to the VIN pin. Table 6 Shutdown Pin CR Oscillation Circuit Output Voltage “H” Operates Set value “L” Stops Hi-Z VIN ON/OFF VSS Figure 8
STEP-DOWN, BUILT-IN FET, SYNCHRONOUS RECTIFICATION, PWM CONTROL SWITCHING REGULATORS Rev.5.0_01 S-8550 Series 4. Current limit circuit A current limit circuit is built in the S-8550 Series. The current limit circuit monitors the current that flow s in the Pch power MOS FET and limits current in order to prevent thermal destructi on of the IC due to an overload or ma gnetic saturation of the inductor. When a current exceeding the current limit detection value flows in the Pc h power MOS FET, the current limit circuit operates and turns off the Pch power MOS FET si nce the current limit detecti on until one clock of the oscillator ends. The Pch power MOS FET is turned on in the next clock and the current limit circuit resumes current detection operation. If the value of the current that flows in the Pch power MOS FET remains the current limit detection value or more, the current limit circuit functions agai n and the same operation is repeated. Once the value of the current that flows in the Pch power MOS FET is lo wered up to the specified value, the normal operation status restores. A slight overshoot is generated in the output voltage when the current limit is released. The current limit detection value is fixed to 1 A (typ.) in the IC. If the time taken for the current limit to be detected is shorter than the time required for the current li mit circuit in the IC to detect, the current value that is actually limited increases. Generally, the voltage di fference between the VIN and VOUT pins is large, the current limit detection status is reached faster and the current value increases. 5. 100% duty cycle The S-8550 Series operates up to the maximum duty cycle at 100%. Even when the input voltage is lowered up to the output voltage value set using the external outp ut voltage setting resistor, the Pch power MOS FET is kept on and current can be supplied to the load. The output voltage at this time is the input voltage from which the voltage drop due to the direct re sistance of the inductor and the on-r esistance of the Pch power MOS FET are subtracted. 6. UVLO function The S-8550 Series includes a UVLO (under-voltage lockout) circuit to prevent the IC from malfunctioning due to a transient status when power is applied or a momentary drop of the supply voltage. When UVLO is in the detection state, the Pch and Nch power MOS FETs stop sw itching operation, and the CONT pin become Hi-Z. Once the S-8550 Series is in the UV LO detection status, the soft-start f unction is reset, but the soft-start operates by the releasing operation of UVLO after that. Note that the other internal circuits operate normally and that the status is different from the power-off status. The hysteresis width is set for the UVLO circuit to prev ent a malfunction due to a nois e that is generated in the input voltage. A voltage about 150 mV (typ.) higher th an the UVLO detection volta ge is the release voltage.
STEP-DOWN, BUILT-IN FET, SYNCHRONOUS RECTIFICATION, PWM CONTROL SWITCHING REGULATORS S-8550 Series Rev.5.0_01 External Parts Selection 1. Inductor The inductance (L value) has a strong infl uence on the maximum output current (I OUT) and efficiency (η). The peak current (I PK) increases by decreasing L and the stability of the circuit improves and I OUT increases. If L is decreased further, the current drive capability of the external transisto r is insufficient and I OUT decreases. If the L value is increased, the loss due to I PK of the power MOS FET decreases and the efficiency becomes maximum at a certain L value. Further increasing L de creases the efficiency due to the increased loss of the DC resistance of the inductor. The recommended L value for the S-8550 Series is 3.3 μH. When selecting an inductor, note the allo wable current of the inductor. If a current exceeding this allowable current flows through the inductor, magnetic saturation occurs, substantially lowering the efficiency. Therefore, select an inductor so that I PK does not exceed the allowable current. I PK is expressed by the following equations in the discontinuous mode and continuous mode. 2 × fOSC × L × VIN IPK = IOUT + VOUT × (VIN − VOUT) fOSC = Oscillation frequency Table 7 Typical Inductors Manufacturer Part Number L Value DC Resistance Rated Current Dimensions (L × W × H) [mm] Taiyo Yuden Co., Ltd. Sumida Corporation TDK Corporation FDK Corporation
STEP-DOWN, BUILT-IN FET, SYNCHRONOUS RECTIFICATION, PWM CONTROL SWITCHING REGULATORS Rev.5.0_01 S-8550 Series 2. Capacitors (C IN, COUT) A ceramic capacitor can be used for the input (C IN) and output (C OUT) sides. C IN lowers the power supply impedance and averages the input current to improve efficiency. Select C IN according to the impedance of the power supply to be used. The recommended capacitance is 4.7 μF for the S-8550 Series when a general lithium ion rechargeable battery is used. Select as C OUT a capacitor with large capacitance and sma ll ESR for smoothing the ripple voltage. The optimum capacitor selection depends on the L value, capa citance value, wiring, and application (output load). Select COUT after sufficient evaluation under actual use conditions. 3. Output voltage setting resistors (R FB1, RFB2), capacitor for phase compensation (C FB) With the S-8550 Series, V OUT can be set to any value by external divider resistors. Connect the divider resistors across the VOUT and VSS pins. Because V FB = 0.6 V typ., VOUT can be calculated by this equation. VOUT = (RFB1 + RFB2) RFB2 × 0.6 Connect divider resistors R FB1 and RFB2 as close to the IC to minimize effect s from of noise. If noise does have an effect, adjust the values of R FB1 and RFB2 so that RFB1 + RFB2 < 100 kΩ. CFB connected in parallel with R FB1 is a capacitor for phase compensation. By setting the zero point (the phase feedback) by adding capacitor C FB to output voltage setting resistor R FB1 in parallel, the feedback loop gains the phase margin. As a re sult, the stability can be obtained. In principle, to use the portion how much the phase has feed back by the zero point effectively, define C FB referring to the following equation. CFB ≅ 1 2 × π × RFB1 × 70 kHz This equation is the reference. The followings are explanation regarding the proper setting. To use the portion how much the phase has feed back by the zero point effectively, set R FB1 and CFB so that the zero point goes into the higher frequency than the pole frequency of L and C OUT. The following equations are the pole frequency of L and C OUT and the zero point frequency by C FB and RFB1. fpole ≅ 1 2 × π × L × COUT fzero ≅ 1 2 × π × RFB1 × CFB The transient response can be improved by setting the zero point frequency in the range of lower frequency. However, since the gain becomes higher in the range of high frequency, the total phase of feedback loop delays 180° or more by setting the zero point frequency in the sign ificantly lower range. As a result, the gain cannot be 0 dB or lower in the frequency rang e thus the operation might be unstable. Determine the proper value after the sufficient evaluation under the actual condition. The typical constants by our evaluation are in Table 8. Table 8 Constant for External Parts V OUT(s) [V] R FB1 [kΩ] R FB2 [kΩ] C FB [pF] L [μH]*1 C OUT [μF]*1 1.1 36 43 56 3.3 10 1.8 36 18 68 3.3 10 3.3 36 8 120 3.3 10 4.0 51 9 100 3.3 10 *1. The recommended parts in Table 5
STEP-DOWN, BUILT-IN FET, SYNCHRONOUS RECTIFICATION, PWM CONTROL SWITCHING REGULATORS Rev.5.0_01 S-8550 Series Precaution
- Mount external capacitors, diodes, and in ductors as close as possible to the IC, and make a one-point grounding.
- Characteristics ripple voltage and spike noise occur in IC containing switching regulators. Moreover rush current flows at the time of a power supply injection. Because these largely depend on the inductor, the capacitor and impedance of power supply used, fully che ck them using an actually mounted model.
- The 1.0 μF capacitance connected between the VIN and VSS pins is a bypass capacitor. It stabilizes the power supply in the IC when application is used with a heav y load, and thus effectively works for stable switching regulator operation. Allocate the bypass capacitor as cl ose to the IC as possible, prioritized over other parts.
- Although the IC contains a static elec tricity protection circuit, static electric ity or voltage that exceeds the limit of the protection circuit should not be applied.
- The power dissipation of the IC greatly varies depending on the size and material of the board to be connected. Perform sufficient evaluation using an actual application before designing.
- SII Semiconductor Corporation assumes no responsibility for the way in which this IC is used on products created using this IC or for the specificat ions of that product, nor does SII Semiconductor Corporation assume any responsibility for any infringement of patents or copyrights by products that include this IC either in Japan or in other countries.
STEP-DOWN, BUILT-IN FET, SYNCHRONOUS RECTIFICATION, PWM CONTROL SWITCHING REGULATORS S-8550 Series Rev.5.0_01 Characteristics (Typical Data) 1. Example of Major Power Supply Dependence Characteristics (Ta = +25°C) 1. 1 Current consumption 1 (I SS1) vs. Input voltage (V IN) 1. 2 Current consumption during shutdown (I SSS) vs. Input voltage (V IN) 2.0 4.0 5.0 5.5 ISS1 [μA] 500 400 300 200 100 VIN [V] ISSS [μA] 1.0 0.8 0.6 0.4 0.2 VIN [V] 2.5 3.0 3.5 4.5 1. 3 Oscillation frequency (f osc) vs. Input voltage (V IN) 1. 4 Soft-start time (t SS) vs. Input voltage (V IN) 2.0 4.0 5.0 5.5 fOSC [MHz] 1.38 1.30 1.18 1.10 1.02 VIN [V] 2.5 3.0 3.5 4.5 1.06 1.14 1.22 1.26 1.34 2.0 4.0 5.0 5.5 tSS [ms] 1.3 1.1 1.0 0.9 0.7 VIN [V] 2.5 3.0 3.5 4.5 0.8 1.2 1. 5 Power MOS FET on-resistance (R FET) vs. Input voltage (V IN) 1. 6 Power MOS FET leakage current (I LSW) vs. Input voltage (V IN) 2.0 4.0 5.0 5.5 RFET [] 0.8 0.6 0.5 0.4 0.2 VIN [V] 2.5 3.0 3.5 4.5 0.3 0.7 Nch Pch 2.0 4.0 5.0 5.5 ILSW [μA] 0.5 0.1 −0.1 −0.5 VIN [V] 2.5 3.0 3.5 4.5 −0.4 0.4 Nch Pch0.2 0.3 −0.2 −0.3 1. 7 ON/OFF pin input voltage“H” (V SH) vs. Input voltage (V IN) 1. 8 ON/OFF pin input voltage“L” (V SL) vs. Input voltage (V IN) 2.0 4.0 5.0 5.5 VSH [V] 0.9 0.6 0.3 VIN [V] 2.5 3.0 3.5 4.5 0.7 0.8 0.5 0.4 2.0 4.0 5.0 5.5 VSL [V] 0.9 0.6 0.3 VIN [V] 2.5 3.0 3.5 4.5 0.7 0.8 0.5 0.4
STEP-DOWN, BUILT-IN FET, SYNCHRONOUS RECTIFICATION, PWM CONTROL SWITCHING REGULATORS Rev.5.0_01 S-8550 Series 1. 9 FB voltage (V FB) vs. Input voltage (V IN) 2.0 4.0 5.0 5.5 VFB [mV] 612 600 588 VIN [V] 2.5 3.0 3.5 4.5 604 608 596 592 2. Example of Major Temperature Characteristics (Ta = −40 to +85°C) 2. 1 Current consumption 1 (I SS1) vs. Temperature (Ta) 2. 2 Current consumption during shutdown (I SSS) vs. Temperature (Ta) −40 75 85 ISS1 [μA] 500 −25 0 25 50 300 400 200 100 Ta [C] VIN = 5.5 V VIN = 3.6 V VIN = 2.0 V −40 75 85 ISSS [μA] 1.0 −25 0 25 50 0.6 0.8 0.4 0.2 Ta [C] VIN = 5.5 V VIN = 3.6 V VIN = 2.0 V 2. 3 Oscillation frequency (f osc) vs. Temperature (Ta) 2. 4 Soft-start time (t SS) vs. Temperature (Ta) −40 75 85 fOSC [MHz] 1.32 1.08 −25 0 25 50 1.28 1.20 1.16 Ta [C] VIN = 5.5 V VIN = 3.6 V VIN = 2.0 V 1.12 1.24 −40 75 85 tSS [ms] 1.3 0.7 −25 0 25 50 1.1 1.0 0.9 Ta [C] VIN = 5.5 V VIN = 3.6 V VIN = 2.0 V0.8 1.2 2. 5 Power MOS FET on-resistance (R FET) vs. Temperature (Ta) 2. 6 Power MOS FET leakage current (I LSW) vs. Temperature (Ta) −40 75 85 RFET [] 0.8 0.2 −25 0 25 50 Ta [C] VIN = 5.5 V VIN = 3.6 V VIN = 2.0 V VIN = 5.5 V VIN = 3.6 V VIN = 2.0 V Pch Nch 0.6 0.5 0.4 0.3 0.7 −40 75 85 ILSW [μA] 0.5 −0.5 −25 0 25 50 Ta [C] VIN = 5.5 V VIN = 5.5 V Pch Nch 0.1 −0.1 −0.4 0.4 0.2 0.3 −0.2 −0.3
STEP-DOWN, BUILT-IN FET, SYNCHRONOUS RECTIFICATION, PWM CONTROL SWITCHING REGULATORS S-8550 Series Rev.5.0_01 2. 7 ON/OFF pin input voltage“H” (V SH) vs. Temperature (Ta) 2. 8 ON/OFF pin input voltage“L” (V SL) vs. Temperature (Ta) −40 75 85 VSH [V] 0.9 0.3 −25 0 25 50 Ta [C] 0.6 0.7 0.8 0.5 0.4 VIN = 3.6 V VIN = 5.5 V VIN = 2.0 V −40 75 85 VSL [V] 0.9 0.3 −25 0 25 50 Ta [C] 0.6 0.7 0.8 0.5 0.4 VIN = 5.5 V VIN = 3.6 V VIN = 2.0 V 2. 9 UVLO detection voltage (V UVLO) vs. Temperature (Ta) 2. 10 FB voltage (V FB) vs. Temperature (Ta) −40 75 85 VUVLO [V] 1.80 1.40 −25 0 25 50 Ta [C] 1.60 1.70 1.75 1.55 1.45 1.50 1.65 −40 75 85 VFB [mV] 612 588 −25 0 25 50 Ta [C] 600 604 608 596 592 VIN = 5.5 V VIN = 3.6 V VIN = 2.0 V 3. Examples of Transient Response Characteristics (Unless otherwise specified, the used parts are ones shown in External Parts When Measuring Electrical Characteristics .) 3. 1 Powering ON (V OUT = 1.8 V, VIN = 0 V → 3.6 V, Ta = +25°C) (1) I OUT = 1 mA (2) I OUT = 600 mA −0.2 0.6 1.0 1.6 VIN, VOUT [V] t [ms] IL [A] 0.6 0.2 0.4 −0.2 0 0.2 0.4 0.8 VOUT VIN IL VIN, VOUT [V] t [ms] IL [A] 1.5 0.5 1.0 −0.5 0 0.2 0.4 0.8 1.2 1.4 VOUT VIN IL 3. 2 Shutdown pin response (V OUT = 1.8 V, VIN = 3.6 V, VON/OFF = 0 V → 3.6 V, Ta = +25°C) (1) I OUT = 1 mA (2) I OUT = 600 mA −0.2 0.6 1.0 1.6 VON/OFF, VOUT [V] t [ms] IL [A] 0.6 0.2 0.4 −0.2 0 0.2 0.4 0.8 1.2 1.4 VOUT VON/OFF IL −0.2 0.6 1.0 1.6 VON/OFF, VOUT [V] t [ms] IL [A] 1.5 0.5 1.0 −0.5 0 0.2 0.4 0.8 1.2 1.4 VOUT VON/OFF IL
STEP-DOWN, BUILT-IN FET, SYNCHRONOUS RECTIFICATION, PWM CONTROL SWITCHING REGULATORS Rev.5.0_01 S-8550 Series 3. 3 Power supply fluctuations (V OUT = 1.8 V, Ta = +25°C) −0.1 0.3 0.5 0.7 VOUT [V]2.2 2.0 1.8 1.6 1.4 t [ms] VIN [V] 3.5 2.5 1.5 0.5 4.5 0 0.1 0.2 0.4 0.6 VOUT VIN −0.1 0.3 0.5 0.7 VOUT [V]2.2 2.0 1.8 1.6 1.4 t [ms] VIN [V] 3.5 2.5 1.5 0.5 4.5 0 0.1 0.2 0.4 0.6 VOUT VIN 3. 4 Load fluctuations (V OUT = 1.8 V, VIN = 3.6 V, Ta = +25°C) (1) I OUT = 0.1 mA → 100 mA → 0.1 mA (2) I OUT = 0.1 mA → 300 mA → 0.1 mA −0.1 0.3 0.5 0.7 VOUT [V]1.90 1.85 1.80 1.75 1.70 t [ms] IOUT [mA] 200 100 −100 400 0 0.1 0.2 0.4 0.6 VOUT IOUT 300 −0.1 0.3 0.5 0.7 VOUT [V]1.90 1.85 1.80 1.75 1.70 t [ms] IOUT [mA] 200 100 −100 400 0 0.1 0.2 0.4 0.6 300 VOUT IOUT
STEP-DOWN, BUILT-IN FET, SYNCHRONOUS RECTIFICATION, PWM CONTROL SWITCHING REGULATORS S-8550 Series Rev.5.0_01 Reference Data 1. Reference data for external parts Table 9 Properties of External Parts Element Name Product Name Manufacture Characteristics Inductor NR4018T3R3M Taiyo Yuden Co., Ltd 3.3 μH, DCRMAX = 0.07 Ω, IMAX = 1.23 A Input capacitor C3216X7R1E475K TDK Corporation 4.7 μF Output capacitor C3216X7R1C106K TDK Corporation 10 μF Caution The values of the external parts are based on the materials provided by each manufacturer. However, consider the characteristics of the original materials when using the above products. 2. Output current (I OUT) vs. Efficiency ( η) Characteristics and Output current (I OUT) vs. Output voltage (V OUT) Characteristics 2. 1 V OUT = 1.1 V (RFB1 = 36 kΩ, RFB2 = 43 kΩ) (1) Output current (IOUT) vs. Efficiency (η) (2) Output current (I OUT) vs. Output voltage (V OUT) 0 1000 η [%] 100 1 10 100 IOUT [mA] 90 VIN = 2.0 V VIN = 3.6 V VIN = 5.5 V 0 1000 VOUT [V] 1.3 0.9 1 10 100 IOUT [mA] 1.1 1.2 1.0 VIN = 5.5 V VIN = 3.6 V VIN = 2.0 V 2. 2 V OUT = 1.8 V (RFB1 = 36 kΩ, RFB2 = 18 kΩ) (1) Output current (IOUT) vs. Efficiency (η) (2) Output current (I OUT) vs. Output voltage (V OUT) 0 1000 η [%] 100 1 10 100 IOUT [mA] 90 VIN = 2.2 V VIN = 3.6 V VIN = 5.5 V 0 1000 VOUT [V] 2.0 1.6 1 10 100 IOUT [mA] 1.8 1.9 1.7 VIN = 5.5 V VIN = 3.6 V VIN = 2.0 V
STEP-DOWN, BUILT-IN FET, SYNCHRONOUS RECTIFICATION, PWM CONTROL SWITCHING REGULATORS Rev.5.0_01 S-8550 Series 2. 3 V OUT = 3.3 V (RFB1 = 36 kΩ, RFB2 = 8 kΩ) (1) Output current (IOUT) vs. Efficiency (η) (2) Output current (I OUT) vs. Output voltage (V OUT) 0 1000 η [%] 100 1 10 100 IOUT [mA] 90 VIN = 3.7 V VIN = 5.5 V 0 1000 VOUT [V] 3.5 3.1 1 10 100 IOUT [mA] 3.3 3.4 3.2 VIN = 5.5 V VIN = 3.7 V 2. 4 V OUT = 4.0 V (RFB1 = 51 kΩ, RFB2 = 9 kΩ) (1) Output current (IOUT) vs. Efficiency (η) (2) Output current (I OUT) vs. Output voltage (V OUT) 0 1000 η [%] 100 1 10 100 IOUT [mA] 90 VIN = 4.4 V VIN = 5.5 V 0 1000 VOUT [V] 4.2 3.8 1 10 100 IOUT [mA] 4.0 4.1 3.9 VIN = 5.5 V VIN = 4.4 V 3. Output current (I OUT) vs. Ripple voltage (Vr) Characteristics 3. 1 V OUT = 1.1 V (RFB1 = 36 kΩ, RFB2 = 43 kΩ) (1) V IN = 3.6 V (2) V IN = 5.5 V 0 1000 Vr [mV] 1 10 100 IOUT [mA] 0 1000 Vr [mV] 1 10 100 IOUT [mA]
STEP-DOWN, BUILT-IN FET, SYNCHRONOUS RECTIFICATION, PWM CONTROL SWITCHING REGULATORS S-8550 Series Rev.5.0_01 3. 2 V OUT = 1.8 V (RFB1 = 36 kΩ, RFB2 = 18 kΩ) (1) V IN = 3.6 V (2) V IN = 5.5 V 0 1000 Vr [mV] 1 10 100 IOUT [mA] 0 1000 Vr [mV] 1 10 100 IOUT [mA] 3. 3 V OUT = 3.3 V (RFB1 = 36 kΩ, RFB2 = 8 kΩ) (1) V IN = 3.6 V (2) V IN = 5.5 V 0 1000 Vr [mV] 1 10 100 IOUT [mA] 0 1000 Vr [mV] 1 10 100 IOUT [mA] 3. 4 V OUT = 4.0 V (RFB1 = 51 kΩ, RFB2 = 9 kΩ) (1) V IN = 5.5 V 0 1000 Vr [mV] 1 10 100 IOUT [mA]
STEP-DOWN, BUILT-IN FET, SYNCHRONOUS RECTIFICATION, PWM CONTROL SWITCHING REGULATORS Rev.5.0_01 S-8550 Series Marking Specifications 1. SOT-23-5 123 Top view (1) (2) (3) (4) (1) to (3): Product code (Refer to Product name vs. Product code .) (4): Lot number Product name vs. Product code Product Name Product Code (1) (2) (3) S-8550AA-M5T1x R 5 A Remark 1. x: G or U 2. Please select products of environmental code = U for Sn 100%, halogen-free products. 2. SNT-8A Top view 14 32 85 67 (1) (2) (3) (4) (5) (6) (7) (8) (9) (10) (11) (1): Blank (2) to (4): Product code (Refer to Product name vs. Product code ) (5), (6): Blank (7) to (11): Lot number Product name vs. Product code Product name Product code (2) (3) (4) S-8550AA-I8T1U R 5 A
/X4E/X6F/X2E /X54/X49/X54/X4C/X45 /X53/X43/X41/X4C/X45 /X55/X4E/X49/X54 /X53/X49/X49/X20/X53/X65/X6D/X69/X63/X6F/X6E/X64/X75/X63/X74/X6F/X72/X20/X43/X6F/X72/X70/X6F/X72/X61/X74/X69/X6F/X6E /X32/X2E/X39/XB1/X30/X2E/X32 /X31/X2E/X39/XB1/X30/X2E/X32 /X30/X2E/X39/X35/XB1/X30/X2E/X31 /X30/X2E/X34/XB1/X30/X2E/X31 /X30/X2E/X31/X36/X20/X2B/X30/X2E/X31 /X20/X2D/X30/X2E/X30/X36/X31/X32/X33 /X34/X35 /X4E/X6F/X2E/X20/X4D/X50/X30/X30/X35/X2D/X41/X2D/X50/X2D/X53/X44/X2D/X31/X2E/X32 /X4D/X50/X30/X30/X35/X2D/X41/X2D/X50/X2D/X53/X44/X2D/X31/X2E/X32 /X53/X4F/X54/X32/X33/X35/X2D/X41/X2D/X50/X4B/X47/X20/X44/X69/X6D/X65/X6E/X73/X69/X6F/X6E/X73 /X6D/X6D
/X4E/X6F/X2E /X54/X49/X54/X4C/X45 /X53/X43/X41/X4C/X45 /X55/X4E/X49/X54 /X53/X49/X49/X20/X53/X65/X6D/X69/X63/X6F/X6E/X64/X75/X63/X74/X6F/X72/X20/X43/X6F/X72/X70/X6F/X72/X61/X74/X69/X6F/X6E /XF8/X31/X2E/X35 /X2B/X30/X2E/X31 /X2D/X30 /X32/X2E/X30/XB1/X30/X2E/X30/X35 /XF8/X31/X2E/X30 /X2B/X30/X2E/X32 /X2D/X30 /X34/X2E/X30/XB1/X30/X2E/X31 /X31/X2E/X34/XB1/X30/X2E/X32 /X30/X2E/X32/X35/XB1/X30/X2E/X31 /X33/X2E/X32/XB1/X30/X2E/X32 /X31/X32/X33 /X34/X35 /X4E/X6F/X2E/X20/X4D/X50/X30/X30/X35/X2D/X41/X2D/X43/X2D/X53/X44/X2D/X32/X2E/X31 /X4D/X50/X30/X30/X35/X2D/X41/X2D/X43/X2D/X53/X44/X2D/X32/X2E/X31 /X53/X4F/X54/X32/X33/X35/X2D/X41/X2D/X43/X61/X72/X72/X69/X65/X72/X20/X54/X61/X70/X65 /X46/X65/X65/X64/X20/X64/X69/X72/X65/X63/X74/X69/X6F/X6E /X34/X2E/X30/XB1/X30/X2E/X31/X28/X31/X30/X20/X70/X69/X74/X63/X68/X65/X73/X3A/X34/X30/X2E/X30/XB1/X30/X2E/X32/X29 /X6D/X6D
/X4E/X6F/X2E /X54/X49/X54/X4C/X45 /X53/X43/X41/X4C/X45 /X55/X4E/X49/X54 /X53/X49/X49/X20/X53/X65/X6D/X69/X63/X6F/X6E/X64/X75/X63/X74/X6F/X72/X20/X43/X6F/X72/X70/X6F/X72/X61/X74/X69/X6F/X6E /X31/X32/X2E/X35/X6D/X61/X78/X2E /X39/X2E/X30/XB1/X30/X2E/X33 /XF8/X31/X33/XB1/X30/X2E/X32 /X28/X36/X30/XB0/X29 /X28/X36/X30/XB0/X29 /X51/X54/X59/X2E /X33/X2C/X30/X30/X30 /X4E/X6F/X2E/X20/X4D/X50/X30/X30/X35/X2D/X41/X2D/X52/X2D/X53/X44/X2D/X31/X2E/X31 /X4D/X50/X30/X30/X35/X2D/X41/X2D/X52/X2D/X53/X44/X2D/X31/X2E/X31 /X53/X4F/X54/X32/X33/X35/X2D/X41/X2D/X52/X65/X65/X6C /X45/X6E/X6C/X61/X72/X67/X65/X64/X20/X64/X72/X61/X77/X69/X6E/X67/X20/X69/X6E/X20/X74/X68/X65/X20/X63/X65/X6E/X74/X72/X61/X6C/X20/X70/X61/X72/X74 /X6D/X6D
/X53/X49/X49/X20/X53/X65/X6D/X69/X63/X6F/X6E/X64/X75/X63/X74/X6F/X72/X20/X43/X6F/X72/X70/X6F/X72/X61/X74/X69/X6F/X6E /X4E/X6F/X2E /X54/X49/X54/X4C/X45 /X53/X43/X41/X4C/X45 /X55/X4E/X49/X54 /X31/X2E/X39/X37/XB1/X30/X2E/X30/X33 /X30/X2E/X32/XB1/X30/X2E/X30/X35 /X30/X2E/X34/X38/XB1/X30/X2E/X30/X32 /X30/X2E/X30/X38 /X6D/X6D /X53/X4E/X54/X2D/X38/X41/X2D/X41/X2D/X50/X4B/X47/X20/X44/X69/X6D/X65/X6E/X73/X69/X6F/X6E/X73 /X50/X48/X30/X30/X38/X2D/X41/X2D/X50/X2D/X53/X44/X2D/X32/X2E/X30 /X4E/X6F/X2E/X20/X50/X48/X30/X30/X38/X2D/X41/X2D/X50/X2D/X53/X44/X2D/X32/X2E/X30 /X30/X2E/X35 /X2B/X30/X2E/X30/X35 /X2D/X30/X2E/X30/X32/X31 /X32/X33 /X34 /X35/X36/X37/X38
/X53/X49/X49/X20/X53/X65/X6D/X69/X63/X6F/X6E/X64/X75/X63/X74/X6F/X72/X20/X43/X6F/X72/X70/X6F/X72/X61/X74/X69/X6F/X6E /X4E/X6F/X2E /X54/X49/X54/X4C/X45 /X53/X43/X41/X4C/X45 /X55/X4E/X49/X54/X6D/X6D /X50/X48/X30/X30/X38/X2D/X41/X2D/X43/X2D/X53/X44/X2D/X31/X2E/X30 /X53/X4E/X54/X2D/X38/X41/X2D/X41/X2D/X43/X61/X72/X72/X69/X65/X72/X20/X54/X61/X70/X65 /X4E/X6F/X2E/X20/X50/X48/X30/X30/X38/X2D/X41/X2D/X43/X2D/X53/X44/X2D/X31/X2E/X30 /X46/X65/X65/X64/X20/X64/X69/X72/X65/X63/X74/X69/X6F/X6E /X34/X2E/X30/XB1/X30/X2E/X31/X32/X2E/X30/XB1/X30/X2E/X30/X35 /X34/X2E/X30/XB1/X30/X2E/X31 /XF8/X31/X2E/X35/X2B/X30/X2E/X31 /X20/X2D/X30 /XF8/X30/X2E/X35/XB1/X30/X2E/X31 /X32/X2E/X32/X35/XB1/X30/X2E/X30/X35 /X30/X2E/X36/X35/XB1/X30/X2E/X30/X35 /X30/X2E/X32/X35/XB1/X30/X2E/X30/X35 /X32/X31/X33/X34 /X37/X38/X36/X35 /X35/XB0
/X53/X49/X49/X20/X53/X65/X6D/X69/X63/X6F/X6E/X64/X75/X63/X74/X6F/X72/X20/X43/X6F/X72/X70/X6F/X72/X61/X74/X69/X6F/X6E /X4E/X6F/X2E /X54/X49/X54/X4C/X45 /X53/X43/X41/X4C/X45 /X55/X4E/X49/X54 /X31/X32/X2E/X35/X6D/X61/X78/X2E /X39/X2E/X30/XB1/X30/X2E/X33 /XF8/X31/X33/XB1/X30/X2E/X32 /X28/X36/X30/XB0/X29 /X28/X36/X30/XB0/X29 /X45/X6E/X6C/X61/X72/X67/X65/X64/X20/X64/X72/X61/X77/X69/X6E/X67/X20/X69/X6E/X20/X74/X68/X65/X20/X63/X65/X6E/X74/X72/X61/X6C/X20/X70/X61/X72/X74 /X51/X54/X59/X2E /X50/X48/X30/X30/X38/X2D/X41/X2D/X52/X2D/X53/X44/X2D/X31/X2E/X30 /X6D/X6D /X53/X4E/X54/X2D/X38/X41/X2D/X41/X2D/X52/X65/X65/X6C /X4E/X6F/X2E/X20/X50/X48/X30/X30/X38/X2D/X41/X2D/X52/X2D/X53/X44/X2D/X31/X2E/X30 /X35/X2C/X30/X30/X30
/X53/X49/X49/X20/X53/X65/X6D/X69/X63/X6F/X6E/X64/X75/X63/X74/X6F/X72/X20/X43/X6F/X72/X70/X6F/X72/X61/X74/X69/X6F/X6E /X4E/X6F/X2E /X54/X49/X54/X4C/X45 /X53/X43/X41/X4C/X45 /X55/X4E/X49/X54/X6D/X6D /X53/X4E/X54/X2D/X38/X41/X2D/X41 /X20/X20/X20/X20/X20/X20/X2D/X4C/X61/X6E/X64/X20/X52/X65/X63/X6F/X6D/X6D/X65/X6E/X64/X61/X74/X69/X6F/X6E /X50/X48/X30/X30/X38/X2D/X41/X2D/X4C/X2D/X53/X44/X2D/X34/X2E/X31 /X30/X2E/X33/X30/X2E/X32 /X30/X2E/X35/X32 /X32/X2E/X30/X31 /X30/X2E/X35/X32 /X4E/X6F/X2E/X20/X50/X48/X30/X30/X38/X2D/X41/X2D/X4C/X2D/X53/X44/X2D/X34/X2E/X31 /X43/X61/X75/X74/X69/X6F/X6E /X31/X2E/X20/X44/X6F/X20/X6E/X6F/X74/X20/X64/X6F/X20/X73/X69/X6C/X6B/X73/X63/X72/X65/X65/X6E/X20/X70/X72/X69/X6E/X74/X69/X6E/X67/X20/X61/X6E/X64/X20/X73/X6F/X6C/X64/X65/X72/X20/X70/X72/X69/X6E/X74/X69/X6E/X67/X20/X75/X6E/X64/X65/X72/X20/X74/X68/X65/X20/X6D/X6F/X6C/X64/X20/X72/X65/X73/X69/X6E/X20/X6F/X66/X20/X74/X68/X65/X20/X70/X61/X63/X6B/X61/X67/X65/X2E /X32/X2E/X20/X54/X68/X65/X20/X74/X68/X69/X63/X6B/X6E/X65/X73/X73/X20/X6F/X66/X20/X74/X68/X65/X20/X73/X6F/X6C/X64/X65/X72/X20/X72/X65/X73/X69/X73/X74/X20/X6F/X6E/X20/X74/X68/X65/X20/X77/X69/X72/X65/X20/X70/X61/X74/X74/X65/X72/X6E/X20/X75/X6E/X64/X65/X72/X20/X74/X68/X65/X20/X70/X61/X63/X6B/X61/X67/X65/X20/X73/X68/X6F/X75/X6C/X64/X20/X62/X65/X20/X30/X2E/X30/X33/X20/X6D/X6D /X20/X6F/X72/X20/X6C/X65/X73/X73/X20/X66/X72/X6F/X6D/X20/X74/X68/X65/X20/X6C/X61/X6E/X64/X20/X70/X61/X74/X74/X65/X72/X6E/X20/X73/X75/X72/X66/X61/X63/X65/X2E /X33/X2E/X20/X4D/X61/X74/X63/X68/X20/X74/X68/X65/X20/X6D/X61/X73/X6B/X20/X61/X70/X65/X72/X74/X75/X72/X65/X20/X73/X69/X7A/X65/X20/X61/X6E/X64/X20/X61/X70/X65/X72/X74/X75/X72/X65/X20/X70/X6F/X73/X69/X74/X69/X6F/X6E/X20/X77/X69/X74/X68/X20/X74/X68/X65/X20/X6C/X61/X6E/X64/X20/X70/X61/X74/X74/X65/X72/X6E/X2E /X34/X2E/X20/X52/X65/X66/X65/X72/X20/X74/X6F/X20/X22/X53/X4E/X54/X20/X50/X61/X63/X6B/X61/X67/X65/X20/X55/X73/X65/X72/X27/X73/X20/X47/X75/X69/X64/X65/X22/X20/X66/X6F/X72/X20/X64/X65/X74/X61/X69/X6C/X73/X2E /X31/X2E/X20 /X28/X30/X2E/X32/X35/X20/X6D/X6D/X20/X6D/X69/X6E/X2E/X20/X2F/X20/X30/X2E/X33/X30/X20/X6D/X6D/X20/X74/X79/X70/X2E/X29 /X32/X2E/X20 /X20/X28/X31/X2E/X39/X36/X20/X6D/X6D/X20/X7E/X20/X32/X2E/X30/X36/X20/X6D/X6D/X29 /X31/X2E /X32/X2E /X30/X2E/X30/X33/X20/X6D/X6D /X33/X2E /X34/X2E /X53/X4E/X54 /X31/X2E/X20/X50/X61/X79/X20/X61/X74/X74/X65/X6E/X74/X69/X6F/X6E/X20/X74/X6F/X20/X74/X68/X65/X20/X6C/X61/X6E/X64/X20/X70/X61/X74/X74/X65/X72/X6E/X20/X77/X69/X64/X74/X68/X20/X28/X30/X2E/X32/X35/X20/X6D/X6D/X20/X6D/X69/X6E/X2E/X20/X2F/X20/X30/X2E/X33/X30/X20/X6D/X6D/X20/X74/X79/X70/X2E/X29/X2E /X32/X2E/X20/X44/X6F/X20/X6E/X6F/X74/X20/X77/X69/X64/X65/X6E/X20/X74/X68/X65/X20/X6C/X61/X6E/X64/X20/X70/X61/X74/X74/X65/X72/X6E/X20/X74/X6F/X20/X74/X68/X65/X20/X63/X65/X6E/X74/X65/X72/X20/X6F/X66/X20/X74/X68/X65/X20/X70/X61/X63/X6B/X61/X67/X65/X20/X28/X31/X2E/X39/X36/X20/X6D/X6D/X20/X74/X6F/X20/X32/X2E/X30/X36/X6D/X6D/X29/X2E /X31 /X32 /X31/X2E /X32/X2E/X20 /X28/X31/X2E/X39/X36/X20/X6D/X6D/X20/X7E/X20/X32/X2E/X30/X36/X20/X6D/X6D/X29 /X28/X30/X2E/X32/X35/X20/X6D/X6D/X20/X6D/X69/X6E/X2E/X20/X2F/X20/X30/X2E/X33/X30/X20/X6D/X6D/X20/X74/X79/X70/X2E/X29
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