MPX5010 SYC | Alldatasheet

Document overview

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Technical content

Features

  • 5.0% Maximum Error over 0  to 85C
  • Ideally Suited for Microprocessor or Microcontroller-Based Systems
  • Durable Epoxy Unibody and Thermoplastic (PPS) Surface Mount Package
  • Temperature Compensated over -40  to +125C
  • Patented Silicon Shear Stress Strain Gauge
  • Available in Differential and Gauge Configurations
  • Available in Surface Mount (SMT) or Through-hole (DIP) Configurations

ORDERING INFORMATION

Device Name Case No. # of Ports Pressure Type Device MarkingNone Single Dual Gauge Differential Absolute Unibody Package (MPX5010 Series) MPX5010DP 867C • • MPX5010DP MPX5010GP 867B • • MPX5010GP MPX5010GS 867E • • MPX5010D MPX5010GSX 867F • • MPX5010D Small Outline Package (MPXV5010 Series) MPXV5010DP 1351 • • MPXV5010DP MPXV5010G6U 482 • • MPXV5010G MPXV5010GC6T1 482A • • MPXV5010G MPXV5010GC6U 482A • • MPXV5010G MPXV5010GC7U 482C • • MPXV5010G MPXV5010GP 1369 • • MPXV5010GP Small Outline Package (Media Resistant Gel) (MPVZ5010 Series) MPVZ5010G6U 482 • • MPVZ5010G MPVZ5010G7U 482B • • MPVZ5010G MPVZ5010GW6U 1735 • • MZ5010GW MPVZ5010GW7U 1560 • • MZ5010GW MPX5010 Series 0 to 10 kPa (0 to 1.45 psi) (0 to 1019.78 mm H2O) 0.2 to 4.7 V Output MPXV5010 MPVZ5010 Application Examples

  • Hospital Beds
  • H V A C
  • Respiratory Systems
  • Process Control
  • Washing Machine Water Level Measurement (Reference AN1950)
  • Ideally Suited for Microprocessor or Microcontroller-Based Systems
  • Appliance Liquid Level and Pressure Measurement MPX5010 SENSOR DE PRESION 10KPA www.sycelectronica.com.ar

2 Freescale Semiconductor, Inc. MPXV5010GC6U/C6T1 CASE 482A-01 MPXV5010GC7U CASE 482C-03 MPXV5010DP CASE 1351-01 MPXV5010GP CASE 1369-01 MPX5010GSX CASE 867F-03 MPX5010GP CASE 867B-04 MPX5010DP CASE 867C-05 MPX5010GS CASE 867E-03 UNIBODY PACKAGES SMALL OUTLINE PACKAGES THROUGH-HOLE SMALL OUTLINE PACKAGES SURFACE MOUNT MPXV5010G6U, MPVZ5010G6U CASE 482-01 J MPVZ5010G7U CASE 482B-03 MPVZ5010GW6U CASE 1735-01 MPVZ5010GW7U CASE 1560-02 www.sycelectronica.com.ar

Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in

  1. Device is ratiometric within this specified excitation range.
  2. Offset (V off) is defined as the output voltage at the minimum rated pressure.
  3. Full Scale Output (V FSO) is defined as the output voltage at the maximum or full rated pressure.
  4. Full Scale Span (V FSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
  5. Accuracy (error budget) c onsists of the following:

Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. from the minimum or maximum operating temperature points, with zero differential pressure applied. maximum rated pressure, at 25°C. TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.

  1. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a

specified step change in pressure.

  1. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
  2. Offset Stability is the product's output deviation when subjected to 1000 hours of Pu lsed Pressure, Temperature Cycling with Bias Test.

6 Freescale Semiconductor, Inc. Pressure Nominal Transfer Value: Vout = VS x (0.09 x P + 0.04) ± (Pressure Error x Temp. Factor x 0.09 x VS) VS = 5.0 V  0.25 Vdc Transfer Function Temp Multiplier –40 3 0 to 85 1 +125 3 Temperature in C 4.0 3.0 2.0 0.0 1.0 –40 –20 0 20 40 60 140 120 10080 Temperature Error Factor NOTE: The Temperature Multiplier is a linear response from 0 to –40C and from 85 to 125C. Temperature Error Band Pressure Error (Max) Pressure Error Band 0 to 10 (kPa) ±0.5 (kPa) Pressure (kPa) 0.5 0.4 0.2 –0.3 –0.4 –0.5 0 123456 7 890 0.3 0.1 –0.2 –0.1 Pressure Error (kPa) www.sycelectronica.com.ar

shorting between solder pads. Figure 5. SOP Footprint (Case 482)

0.060 TYP 8X

0.100 TYP 8X

8 Freescale Semiconductor, Inc. Pressure PACKAGE DIMENSIONS CASE 482-01 ISSUE O SMALL OUTLINE PACKAGE CASE 482A-0 ISSUE A SMALL OUTLINE PACKAGE S D 8 PL G SBM0.25 (0.010) A ST -A- -B- N C M J K PIN 1 IDENTIFIER H SEATING PLANE -T- DIM MIN MAX MIN MAX MILLIMETERSINCHES A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 5.380.2300.212 5.84 D 0.960.0420.038 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0˚ 7˚ 0˚ 7˚ N 0.405 0.415 10.29 10.54 S 0.709 0.725 18.01 18.41 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT . DIM MIN MAX MIN MAX MILLIMETERSINCHES A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 12.700.5200.500 13.21 D 0.960.0420.038 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0 7 0 7 N 0.444 0.448 11.28 11.38 S 0.709 0.725 18.01 18.41 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. S D G 8 PL SBM0.25 (0.010) A ST –A– –B– C M J K PIN 1 IDENTIFIER H SEATING PLANE –T– N V W V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17 www.sycelectronica.com.ar

Freescale Semiconductor, Inc. 9 Pressure PACKAGE DIMENSIONS CASE 482B-03 ISSUE B SMALL OUTLINE PACKAGE CASE 482C-03 ISSUE B SMALL OUTLINE PACKAGE MILLIMETERSINCHES 0.100 BSC 2.54 BSC DIM A B C D G J K M N S MIN 0.415 0.415 0.210 0.026 0.009 0.100 0.405 0.540 MAX 0.425 0.425 0.220 0.034 0.011 0.120 15˚ 0.415 0.560 MIN 10.54 10.54 5.33 0.66 0.23 2.54 10.29 13.72 MAX 10.79 10.79 5.59 0.864 0.28 3.05 15˚ 10.54 14.22 PIN 1 IDENTIFIER K SEATING PLANE-T- DETAIL X S G -A- -B- C M J N D 8 PL SBM0.25 (0.010) A ST DETAIL X NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006). ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. DIM MIN MAX MIN MAX MILLIMETERSINCHES A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 12.700.5200.500 13.21 D 0.660.0340.026 0.864 G 0.100 BSC 2.54 BSC J 0.009 0.011 0.23 0.28 K 0.100 0.120 2.54 3.05 M 0 15 0 15 N 0.444 0.448 11.28 11.38 S 0.540 0.560 13.72 14.22 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. PIN 1 K SEATING PLANE–T– S G –A– –B– C N V W M J V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17 IDENTIFIER D 8 PL SBM0.25 (0.010) A ST DETAIL X DETAIL X www.sycelectronica.com.ar

10 Freescale Semiconductor, Inc. Pressure PACKAGE DIMENSIONS CASE 867F-03 ISSUE D UNIBODY PACKAGE C E V J PORT #1 POSITIVE PRESSURE (P1) -T- -P- MQM0.25 (0.010) T D 6 PL F G K PIN 1 U A B R S N -Q- SPM0.13 (0.005) Q ST 65 4321 STYLE 1: PIN 1. VOUT 2. GROUND 3. VCC 4. V1 5. V2 6. V EX MILLIMETERSINCHES 0.100 BSC 2.54 BSC DIM A B C D E F G J K N P Q R S U V MIN 1.080 0.740 0.630 0.027 0.160 0.048 0.014 0.070 0.150 0.150 0.440 0.695 0.840 0.182 0.220 MAX 1.120 0.760 0.650 0.033 0.180 0.064 0.016 0.080 0.160 0.160 0.460 0.725 0.860 0.194 0.240 MIN 27.43 18.80 16.00 0.68 4.06 1.22 0.36 1.78 3.81 3.81 11.18 17.65 21.34 4.62 5.59 MAX 28.45 19.30 16.51 0.84 4.57 1.63 0.41 2.03 4.06 4.06 11.68 18.42 21.84 4.93 6.10 NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. www.sycelectronica.com.ar

Freescale Semiconductor, Inc. 11 Pressure PACKAGE DIMENSIONS CASE 867B-04 ISSUE G UNIBODY PACKAGE PAGE 1 OF 2 www.sycelectronica.com.ar

12 Freescale Semiconductor, Inc. Pressure PACKAGE DIMENSIONS CASE 867B-04 ISSUE G UNIBODY PACKAGE PAGE 2 OF 2 www.sycelectronica.com.ar

Freescale Semiconductor, Inc. 13 Pressure PACKAGE DIMENSIONS CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE PAGE 1 OF 2 www.sycelectronica.com.ar

14 Freescale Semiconductor, Inc. Pressure PACKAGE DIMENSIONS CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE PAGE 2 OF 2 www.sycelectronica.com.ar

Freescale Semiconductor, Inc. 15 Pressure PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE PAGE 1 OF 2 www.sycelectronica.com.ar

16 Freescale Semiconductor, Inc. Pressure PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE PAGE 2 OF 2

Freescale Semiconductor, Inc. 17 Pressure PACKAGE DIMENSIONS 1560-03 ISSUE C SMALL OUTLINE PACKAGE PAGE 1 OF 3 www.sycelectronica.com.ar

18 Freescale Semiconductor, Inc. Pressure PACKAGE DIMENSIONS CASE 1560-03 ISSUE D SMALL OUTLINE PACKAGE PAGE 2 OF 3 www.sycelectronica.com.ar

Freescale Semiconductor, Inc. 19 Pressure PACKAGE DIMENSIONS CASE 1560-03 ISSUE D SMALL OUTLINE PACKAGE PAGE 3 OF 3 www.sycelectronica.com.ar

20 Freescale Semiconductor, Inc. Pressure PACKAGE DIMENSIONS CASE 1735-02 ISSUE B SMALL OUTLINE PACKAGE PAGE 1 OF 3

Freescale Semiconductor, Inc. 21 Pressure PACKAGE DIMENSIONS CASE 1735-02 ISSUE B SMALL OUTLINE PACKAGE PAGE 2 OF 3

22 Freescale Semiconductor, Inc. Pressure PACKAGE DIMENSIONS CASE 1735-02 ISSUE B SMALL OUTLINE PACKAGE PAGE 3 OF 3 www.sycelectronica.com.ar

Table 3. Revision History

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