74LS373-4 SYC | Alldatasheet

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CONNECTION DIAGRAM DIP (TOP VIEW) Data Inputs Latch Enable (Active HIGH) Input Clock (Active HIGH Going Edge) Input Output Enable (Active LOW) Input Outputs D 0 – D7 LE CP OE O0 – O7 0.5 U.L. 0.5 U.L. 0.5 U.L. 0.5 U.L. 65 U.L. 0.25 U.L. 0.25 U.L. 0.25 U.L. 0.25 U.L. 15 U.L. NOTES: a) 1 TTL Unit Load (U.L.) = 40 /C0109A HIGH/1.6 mA LOW. HIGH LOW (Note a)LOADING PIN NAMES NOTE: The Flatpak version has the same pinouts (Connection Diagram) as the Dual In-Line Package. SN74LS373 SN74LS374 18 17 16 15 14 13 1234 56 7 20 19 VCC OE O7 D7 D6 O6 D5O5 D4 O0 D0 D1 O1 O2 D2 D3 91 0 O3 GND O4 LE 18 17 16 15 14 13 1234 56 7 20 19 VCC OE O7 D7 D6 O6 D5O5 D4 O0 D0 D1 O1 O2 D2 D3 91 0 O3 GND 12 11 O4 CP TRUTH TABLE LS373 D n LE OE O n H H L H L H L L X L L Q 0 X X H Z* LS374 D n LE OE O n H L H L L L X X H Z* H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance * Note: Contents of flip-flops unaffected by the state of the Output Enable input (OE www.sycelectronica.com.ar

D D G Q CP QQ CP OE OE LE LATCH ENABLE O0 O1 O2 O3 O4 O5 O6 O7 73 84 5 9 12 16 VCC = PIN 20 GND = PIN 10 = PIN NUMBERSD G Q D G Q D G Q D G Q D G Q D G Q D G Q 17 18 O0 O1 O2 O3 O4 O5 O6 O7 26 5 9 12 1615 19 1473 84 13 D1 D2 D3 D4 D5 D6 D7 17 18 DCP QQ DCP QQ DCP QQ DCP QQ DCP QQ DCP QQ DCP QQ DC CHARACTERISTICS OVER OPERATING TEMPERATURE RANGE (unless otherwise specified) Limits Symbol Parameter Min Typ Max Unit Test Conditions VIH Input HIGH Voltage 2.0 V Guaranteed Input HIGH Voltage for All Inputs VIL Input LOW Voltage 0.8 V Guaranteed Input LOW Voltage for All Inputs VIK Input Clamp Diode Voltage –0.65 –1.5 V VCC = MIN, IIN = –18 mA VOH Output HIGH Voltage 2.4 3.1 V VCC = MIN, IOH = MAX, VIN = VIH or VIL per Truth Table VO Output LOW Voltage 0.25 0.4 V IOL = 12 mA VCC = VCC MIN, VIN =V ILor VIHVOL O utput LOW Voltage 0.35 0.5 V IOL = 24 mA VIN = VIL or VIH per Truth Table IOZH Output Off Current HIGH 20 µA VCC = MAX, VOUT = 2.7 V IOZL Output Off Current LOW –20 µA VCC = MAX, VOUT = 0.4 V I Input HIGH Current 20 µA VCC = MAX, VIN = 2.7 V IIH Input HIGH C urrent 0.1 mA VCC = MAX, VIN = 7.0 V IIL Input LOW Current –0.4 mA VCC = MAX, VIN = 0.4 V IOS Short Circuit Current (Note 1)–30 –130 mA VCC = MAX ICC Power Supply Current 40 mA VCC = MAX Note 1: Not more than one output should be shorted at a time, nor for more than 1 second. www.sycelectronica.com.ar

CASE 738–03 ISSUE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. M L J 20 PL MBM0.25 (0.010) T DIM MIN MAX MIN MAX MILLIMETERSINCHES A 25.66 27.171.010 1.070 B 6.10 6.600.240 0.260 C 3.81 4.570.150 0.180 D 0.39 0.550.015 0.022 G 2.54 BSC0.100 BSC J 0.21 0.380.008 0.015 K 2.80 3.550.110 0.140 L 7.62 BSC0.300 BSC M 0 15 0 15 N 0.51 1.010.020 0.040 /C0095/C0095/C0095/C0095 E 1.27 1.770.050 0.070 –A– SEATING PLANE K N FG D 20 PL –T– MAM0.25 (0.010) T E B C F 1.27 BSC0.050 BSC D SUFFIX PLASTIC SOIC PACKAGE CASE 751D–05 ISSUE F B20X H10X C L 18X A1 A SEATING PLANE /C0113 h X 45/C0095 E D M0.25 MB M0.25 SA SBT e T B A DIM MIN MAX MILLIMETERS A 2.35 2.65 A1 0.10 0.25 B 0.35 0.49 C 0.23 0.32 D 12.65 12.95 E 7.40 7.60 e 1.27 BSC H 10.05 10.55 h 0.25 0.75 L 0.50 0.90 /C0113 0 7 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION./C0095/C0095 www.sycelectronica.com.ar