MP02TT200

MP02TT200 DYNEX | Alldatasheet

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Technical content

www.dynexsemi.com

FEATURES

I Electrically Isolated Package I Pressure Contact Construction I International Standard Footprint I Alumina (Non Toxic) Isolation Medium I Integral Water Cooled Heatsink

APPLICATIONS

I Controlled Rectifier Bridges I Heater Control I AC Phase Control VOLTAGE RATINGS

ORDERING INFORMATION

Order As: MP02TT200-XX-W12 1/4 - 18 NPT connection MP02TT200-XX-W13 1/4 BSP connection XX shown in the part number about represents VDRM /100 selection required, e.g. MP02TT200-14-W12 Note: When ordering, please use the whole part number. Auxiliary gate and cathode leads can be ordered separately. KEY PARAMETERS VDRM 1600V IT(AV) 200A ITSM(per arm) 6800A IT(RMS) 318A Visol 3000V MP02TT200 Dual Thyristor Water Cooled Module Preliminary Information DS5434-1.1 April 2001 Fig. 1 Circuit diagram Fig. 2 Electrical connections - (not to scale) Outline type code: MP02 W12/W13 (See package details for further information) 1600 1500 1400 1300 1200 MP02TT200-16 MP02TT200-15 MP02TT200-14 MP02TT200-13 MP02TT200-12 Conditions T vj = 0˚ to 125˚C, IDRM = IRRM = 30mA VDSM = VRSM = VDRM = VRRM + 100V respectively Lower voltage grades available Type Number Repetitive Peak Voltages VDRM VRRM V G 1 K1 K2 G 2 1 23 K1 G1 K2 G2 1 23

www.dynexsemi.com Test Conditions Half wave resistive load, T water (in) = 25˚C

4.5 Ltr/min T water (in) = 40˚C

Twater (in) = 50˚C Twater (in) = 25˚C @ 4.5 Ltr/min Twater (in) = 40˚C @ 4.5 Ltr/min 10ms half sine, Tj = 125˚C VR = 0 10ms half sine, Tj = 125˚C VR = 50% VDRM Commoned terminals to base plate. AC RMS, 1 min, 50Hz Symbol IT(AV) IT(RMS ITSM I2t ITSM I2t Visol Units A A A A A kA A kA A2s V Max. 230 200 180 360 318 6.8 0.231 x 10 5.5 0.15 x 106 3000 Test Conditions dc, 4.5 Ltr/min Half wave, 4.5 Ltr/min 3 Phase, 4.5 Ltr/min Reverse (blocking) Mounting - M6 Electrical connections - M6 Parameter Thermal resistance - junction to water (per thyristor) Virtual junction temperature Storage temperature range Screw torque Weight (nominal) THERMAL AND MECHANICAL RATINGS ABSOLUTE MAXIMUM RATINGS - PER ARM Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability. Parameter Mean on-state current RMS value Surge (non-repetitive) on-current I2t for fusing Surge (non-repetitive) on-current I 2t for fusing Isolation voltage Symbol R th(j-w) Tvj Tstg Units ˚C/kW ˚C/kW ˚C/kW Nm (lb.ins) Nm (lb.ins) g Max. 0.3 0.32 0.33 125 125 5 (44) 1200 Min. –40 5 (44)

www.dynexsemi.com Units mA V/µs A/µs V m Ω Test Conditions At VRRM /VDRM , Tj = 125˚C To 67% VDRM , Tj = 125˚C From 67% VDRM to 200A, gate source 10V, 5Ω tr = 0.5µs, Tj = 125˚C At Tvj = 125˚C At Tvj = 125˚C Parameter Peak reverse and off-state current Linear rate of rise of off-state voltage Rate of rise of on-state current Threshold voltage On-state slope resistance DYNAMIC CHARACTERISTICS Symbol IRRM /IDRM dV/dt dI/dt VT(TO) rT Max. 1000 500 0.98 0.75 Min. Parameter Gate trigger voltage Gate trigger current Gate non-trigger voltage Peak forward gate voltage Peak forward gate voltage Peak reverse gate voltage Peak forward gate current Peak gate power Mean gate power Test Conditions V DRM = 5V, Tcase = 25oC VDRM = 5V, Tcase = 25oC At VDRM Tcase = 125oC Anode positive with respect to cathode Anode negative with respect to cathode Anode positive with respect to cathode See table fig. 5 Symbol VGT IGT VGD VFGM VFGN VRGM IFGM PGM PG(AV) GATE TRIGGER CHARACTERISTICS AND RATINGS Max. 150 0.25 0.25 100 Units V mA V V V V A W W Note 1: The data given in this datasheet with regard to forward voltage drop is for calculation of the power dissipation in the semiconductor elements only. Forward voltage drops measured at the power terminals of the module will be in excess of these figures due to the impedance of the busbar from the terminal to the semiconductor.

www.dynexsemi.com Fig. 3 Maximum (limit) on-state characteristics 1 10 1 2 3 4 5 50 Duration 100 140 Peak half sine wave on-state current - (kA) ms cycles at 50Hz I2t value - A2s x 103 180 I2t 10 20 30 Fig. 6 Transient thermal impedance - dc Fig. 4 Surge (non-repetitive) on-state current vs time (with 50% VRSM at Tcase = 125˚C) Fig. 5 Gate characteristics 0.5 1.0 2.0 Instantaneous on-state voltage, VT - (V) 500 1000 1500 2000Instantaneous on-state current, IT - (A) Measured under pulse conditions Tj = 125˚C 1.5 2.5 100 1.0 Gate trigger current, IGT - (A) Gate trigger voltage, VGT - (V) Tj = 125˚C Tj = 25˚C Tj = -40˚C Upper limit 99% Lower li mit 1% VFGM VGD IFGM 10W 50W 75W100W Pulse Width µs 100 500 1ms 10ms 100 100 100 100 100 100 100 100 100 100 400 100 100 100 Pulse Frequency Hz Table gives pulse power PGM in watts 1010.1 1000 1000.010.001 Time - (s) 1.0 0.1 0.01 0.001 Thermal resistance (junction to water). Rth(j-w) - (ßC/W)

www.dynexsemi.com Fig. 7 On-state power loss per arm vs on-state current at specified conduction angles, sine wave 50/60Hz Fig. 8 On-state power loss per arm vs on-state current at specified conduction angles, square wave 50/60Hz Fig. 9 Maximum permissible water inlet temperature vs on- state current at specified conduction angles, sine wave 50/60Hz Fig. 10 Maximum permissible water inlet temperature vs on- state current at specified conduction angles, square wave 50/60Hz 0 100 200 300 400 Mean on-state current, IT(AV) - (A) 200 400 500 700On-state power loss per device - (W) 100 300

600 Conduction Angle 30˚ 60˚

90˚ 180˚120˚ 0 100 200 300 400 Mean on-state current, IT(AV) - (A) 200 400 500On-state power loss per device - (W) 100 300 600 Conduction Angle 30˚ 60˚ 90˚ 180˚120˚ 0 50 100 150 200 250 200 Mean on-state current, IT(AV) - (A) 60Max. permissible water inlet temperature - (˚C @ 4.5 l/min) 100 60˚ 90˚ 180˚ 120˚Conduction Angle 30˚ 0 50 100 150 200 250 200 Mean on-state current, IT(AV) - (A) Max. permissible water inlet temperature - (˚C @ 4.5 l/min) 100 60˚ 90˚ 180˚ 120˚Conduction Angle 30˚

www.dynexsemi.com Fig. 11 50/60Hz single phase bridge DC output current vs power loss and maximum permissible water inlet temperature for specified values of heatsink thermal resistance Fig. 12 Fig. 11 50/60Hz Three phase bridge DC output current vs power loss and maximum permissible water inlet temperature for specified values of heatsink thermal resistance 02 04 0 6 08 0 1 0 0 0 5 0 0 Max. water inlet temperature - (˚C) DC output current - (A) 400 800 Total power loss - (W) 200 600 300 700 100 500 1000 900 1200 1100 1400 1300 100 200 300 400 Resistive load Inductive load 0 20 40 60 80 100 0 500 Max. water inlet temperature - (˚C) DC output current - (A) 400 800 1200Total power loss - (W) 200 600 1000 1400 1800 1600 2000 100 200 300 400 Resistive load or Inductive load

www.dynexsemi.com PACKAGE DETAILS For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE. Recommended fixings for mounting: M6 socket head cap screws. Auxiliary gate and cathode leads can be ordered separately. Nominal weight: 1200g Module outline type code: MP02-W12 23 24 12.8 Ø 6.5 K1 G1 2.8 X 0.8 21.6 1 23 10.5 50.8

2 Off water connectors

1/4 - 18 NTP (W12) Water-way plug 23.8 9.5 2 Off Holes M3 x 0.5 10 deep

www.dynexsemi.com PACKAGE DETAILS For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE. Recommended fixings for mounting: M6 socket head cap screws. Auxiliary gate and cathode leads can be ordered separately. Nominal weight: 1200g Module outline type code: MP02-W13 23 24 12.8 fl6.5 K1 G1 2.8 X 0.8 21.6 1 23 10.5 50.8 1/4 BSP (W13) Water-way plug 23.8 9.5 2 Off Holes M3 x 0.5 10 deep

www.dynexsemi.com POWER ASSEMBLY CAPABILITY The Power Assembly group provides support for those customers requiring more than the basic semiconductor switch. Using CAD design tools the group has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current capability of Dynex semiconductors. An extensive range of air and liquid cooled assemblies is available covering the range of circuit designs in general use today. HEATSINKS The Power Assembly group has a proprietary range of extruded aluminium heatsinks. These were designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer service office. CUSTOMER SERVICE CENTRES Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444 UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. © Dynex Semiconductor 2001 Publication No. DS5434-1 Issue No. 1.1 April 2001 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC.

99 Bank Street, Suite 410,

Ottawa, Ontario, Canada, K1P 6B9 Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:- Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification.