MGM240SA22VNA2

MGM240S SILABS | Alldatasheet

Document overview

• Manufacturer or author: Silicon Labs
• PDF pages: 64

Technical content

MGM240S Multi-Protocol Wireless Module Data Sheet The MGM240S is a secure, high-performance wireless module optimized for the needs of battery and line-powered IoT devices for 2.4 GHz mesh networks. Based on the Series 2 EFR32MG24 SoC, it enables 802.15.4 (Zigbee®, OpenThread®) and Bluetooth® Low Energy connectivity, delivering exceptional RF performance and en- ergy efficiency, Matter ready Smart Home Connectivity, industry-leading Secure Vault® technology, and future-proofing capabilities. The MGM240S is a complete System in Package solution offered with robust and fully- upgradeable software stacks, global regulatory certifications, advanced development and debugging tools, and documentation that simplifies and minimizes the development cycle of your end-product, helping to accelerate its time-to-market. The MGM240S is targeted for a broad range of applications, including:

• Smart Home Devices
• Lighting
• Gateways and Digital Assistants
• Building Automation and Security KEY FEATURES
• Multi-protocol connectivity (802.15.4 and Bluetooth Low Energy 5.3) Built-in antenna or RF pin
• Up to 10 dBm TX output power
• -104.5 dBm 802.15.4 RX sensitivity
• -97 dBm BLE 1M RX sensitivity
• 32-bit ARM® Cortex®-M33 core running up to 78 MHz
• 1536/256 kB of Flash/RAM memory
• Vault High or Vault Mid security
• Matrix Vector Processor1
• Rich set of analog and digital peripherals
• 32 GPIO pins
• -40 °C to 105 °C
• 7mm x 7mm x 1.18mm Power ManagementClock Management Timers and Triggers 32-bit Bus Peripheral Reflex System Serial Interfaces I/O Ports Analog I/F Lowest power mode with peripheral operational: USART EUSART External Interrupts General Purpose I/O Pin Reset Pin Wakeup ADC EM4—Shutoff Voltage Regulator Power-On Reset SecurityCore / Memory ARM CortexTM M33 processor with DSP extensions, FPU and TrustZone ETM Debug Interface RAM Memory LDMA Controller Flash Program Memory System Real Time Counter Timer/Counter Low Energy Timer Watchdog Timer Protocol Timer EM3—StopEM2—Deep SleepEM1—SleepEM0—Active Fast Startup RC Oscillator Back-Up Real Time Counter I2C EUSART VDAC Radio Subsystem Frequency Synthesizer ARM CortexTM M0+ Radio Controller CRC BUFC RAM FRC DEMOD AGC IFADC MOD Temperature Sensor ACMP Keypad Scanner Antenna Antenna or RF Pin Matching RX/TX Front-End with Integrated PA DC-DC Converter SupplyCrystal

39 MHz

Oscillator Brown-Out Detector Decoupling DC-DC LC Crypto Acceleration TRNG Secure Debug Authentication Secure EngineHF Crystal Oscillator HF RC Oscillator DPA Countermeasures Pulse Counter 1. Available on dedicated OPNs see: Ordering information silabs.com | Building a more connected world. Copyright © 2022 by Silicon Laboratories Rev. 1.0

1. Features

• Supported Protocols 802.15.4
• Zigbee
• Open Thread
• Bluetooth 5.3
• Bluetooth Mesh
• Matter-ready Smart Home Connectivity
• Multi-protocol
• Wireless System-on-Chip
• 2.4 GHz radio
• TX power up to +10 dBm
• 32-bit ARM Cortex®-M33 with DSP instruction and floating- point unit for efficient signal processing
• 1536 kB flash program memory
• 256 kB RAM data memory
• Embedded Trace Macrocell (ETM) for advanced debugging
• Receiver Sensitivity
• -104.5 dBm (1% BER) at 250 kbps O-QPSK DSSS
• -105.1 dBm (0.1% BER) at 125 kbps GFSK
• -100.7 dBm (0.1% BER) at 500 kbps GFSK
• -97.0 dBm (0.1% BER) at 1 Mbps GFSK
• -94.3 dBm (0.1% BER) at 2 Mbps GFSK
• Current Consumption
• 5.9 mA RX current at 250 kbps O-QPSK DSSS
• 5.1 mA RX current at 1 Mbps GFSK
• 4.6 mA TX current at 0 dBm
• 23.4 mA TX current at 10 dBm
• 33.4 µA/MHz in Active Mode (EM0) at 39.0 MHz
• 1.3 μA EM2 DeepSleep current (16 kB RAM retention and RTC running from LFRCO)
• Regulatory Certifications
• CE (EU)
• UKCA (UK)
• FCC (USA)
• ISED (Canada)
• MIC (Japan)
• KC (South Korea)
• Operating Range 1.8 to 3.8 V
• -40 to +105°C
• Dimensions
• 7 mm x 7 mm x 1.18 mm
• Security
• Secure Boot with Root of Trust and Secure Loader (RTSL)
• Hardware Cryptographic Acceleration with DPA counter- measures for AES128/256, SHA-1, SHA-2 (up to 256-bit), ECC (up to 256-bit), ECDSA, and ECDH
• True Random Number Generator (TRNG) compliant with NIST SP800-90 and AIS-31
• ARM® TrustZone®
• Secure Debug Interface lock/unlock
• Secure Key Management with PUF
• Anti-Tamper
• Secure Attestation
• MCU Peripherals
• Analog to Digital Converter (ADC)
• 12-bit @ 1 Msps
• 16-bit @ 76.9 ksps
• 2 × Analog Comparator (ACMP)
• 2 × Digital to Analog Converter (VDAC)
• Up to 32 General Purpose I/O pins with output state reten- tion and asynchronous interrupts
• 8 Channel DMA Controller
• 16 Channel Peripheral Reflex System (PRS)
• 3 × 16-bit Timer/Counter with 3 Compare/Capture/PWM channels
• 2 × 32-bit Timer/Counter with 3 Compare/Capture/PWM channels
• 2 x 32-bit Real Time Counter (SYSRTC/BURTC)
• 24-bit Low Energy Timer for waveform generation (LETIM- ER)
• 16-bit Pulse Counter with asynchronous operation (PCNT)
• 2 × Watchdog Timer (WDOG)
• 1 × Universal Synchronous/Asynchronous Receiver/Trans- mitter (USART), supporting UART/SPI/SmartCard (ISO 7816)/IrDA/I2S
• 2 × Enhanced Universal Synchronous/Asynchronous Re- ceiver/Transmitter (EUSART) supporting UART/SPI/DALI/ IrDA
• 2 × I2C interface with SMBus support
• Low-Frequency RC Oscillator with precision mode to re- place 32 kHz sleep crystal (LFRCO)
• Keypad scanner supporting up to 6x8 matrix (KEYSCAN)
• Die temperature sensor with +/- 1.5 °C accuracy after sin- gle-point calibration MGM240S Multi-Protocol Wireless Module Data Sheet

Features

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1. With Secure Element (SE) firmware v2.1.7 or newer MGM240S Multi-Protocol Wireless Module Data Sheet

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1. Ordering Information Table 2.1. MGM240S Ordering Part Numbers Ordering Code Protocol Stack TX Power Freq Band Antenna Secure Vault Flash/ RAM(kB) Matrix Vector Processor GPIO Temp Range Packag- ing MGM240SA22VNA2 802.15.4 Bluetooth 5.3 10 dBm 2.4 GHz Built in or RF PIN MID 1536/256 No 32 -40 to 105 C Tray MGM240SA22VNA2R 802.15.4 Bluetooth 5.3 10 dBm 2.4 GHz Built in or RF PIN MID 1536/256 No 32 -40 to 105 C Reel MGM240SD22VNA2 802.15.4 Bluetooth 5.3 10 dBm 2.4 GHz Built in or RF PIN HIGH 1536/256 Yes 32 -40 to 105 C Tray MGM240SD22VNA2R 802.15.4 Bluetooth 5.3 10 dBm 2.4 GHz Built in or RF PIN HIGH 1536/256 Yes 32 -40 to 105 C Reel Note: MGM240S modules operate over the 2.4 GHz ISM band (802.15.4 range: 2405 - 2480 Mhz, BLE range: 2402 - 2480 MHz). 2. The maximum RF TX output power allowed by different regional regulatory authorities may differ from the maximum output power a module can produce. End-product manufacturers must then verify that the module is configured to meet the regulatory limits for each region in accordance with the local rules and the formal certification test reports. 3. MGM240S modules are pre-programmed with UART XMODEM bootloader. 4. Throughout this document, the modules may be referred to by their product family/marketing name (e.g. MGM240S), by their mod- el name (MGM240S22A), or by their full ordering codes as seen in the table above. 5. Radio board xGM240-RB4318A (+10 dBm) is available for MGM240S evaluation and development. 6. Devices are pre-programmed for xGM240-RB4318A (+10dBm), which uses the pin configuration in Section 5. Reference Dia- grams. MGM240S Multi-Protocol Wireless Module Data Sheet

Ordering Information

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4.10 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate .. 20 4.11 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate .. 21 4.12 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate .. 22 silabs.com | Building a more connected world. Rev. 1.0 | 5

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1. System Overview

3.1 Block Diagram

MGM240S module is a highly-integrated, high-performance system in package with all the hardware components needed to enable 2.4 GHz wireless connectivity and support robust networking capabilities via multiple wireless protocols. Built around the EFR32MG24 Wireless SoC, the MGM240S includes a built-in antenna, an RF matching network (optimized for transmit power efficiency), supply decoupling and filtering components, an LC tank for DC-DC conversion, a 39 MHz reference crystal, and an RF shield. Also, it supports the use of an external 32 kHz crystal as a low frequency reference signal via GPIO pins for use cases demanding maximum energy efficiency. For designs where an external antenna solution may be beneficial, a module variant with a 50 Ω-matched RF pin instead of the built-in antenna is available. Figure 3.1. MGM240S Block Diagram - Integral Antenna Figure 3.2. MGM240S Block Diagram - External Antenna MGM240S Multi-Protocol Wireless Module Data Sheet System Overview silabs.com | Building a more connected world. Rev. 1.0 | 7

A simplified internal schematic for the MGM240S module is shown in Figure 3.3 MGM240S Module Schematic on page 8. Figure 3.3. MGM240S Module Schematic

3.2 EFR32MG24 SoC

SoC features a 32-bit ARM Cortex M33 core, a 2.4 GHz high-performance radio, 1536 kB of Flash memory, 256 kB of RAM, a dedicated core for security, a rich set of MCU peripherals, and various clock management and serial interfacing options. See the EFR32xG24 Reference Manual for details.

3.3 Antenna

MGM240S modules come with two antenna solution variants: a built-in integral ground loop type antenna realized by a PCB trace de- sign, or a 50Ω-matched RF pin to support an external antenna. Typical performance characteristics for the built-in antenna are detailed in the table below. See Section 4.18 Typical Performance Curves and Section 11.1 Qualified Antennas for other relevant details. Table 3.1. MGM240S antenna specification Parameter Symbol Test Condition Min Typ Max Unit Antenna frequency range F RANGE 2400 — 2483.5 MHz Antenna Gain GMAX Maximum relative to isotropic — — 1.48 dBi Antenna Efficiency Efficiency -2.5 — -1.36 dB Reference impedance Z — 50 — Ω Dielectric Constant Host Board DICONST — 4.3 — Trace Thickness TTHICKNESS — 47 — um VSWR VSWR Maximum — — 2:1 Antenna efficiency, gain and radiation pattern are dependent on the application PCB layout and mechanical design. Antenna specifica- tion is based on the assumption that the host board design guidelines in Section 7. Design Guidelines are followed.

3.4 Power Supply

MGM240S requires a primary supply (VDD) and IO supply (VDDIO) voltage to operate. All necessary decoupling, filtering and DC- DC-related components are included in the module. MGM240S Multi-Protocol Wireless Module Data Sheet System Overview silabs.com | Building a more connected world. Rev. 1.0 | 8

3.5 General Purpose Input/Output (GPIO)

has up to 32 General Purpose Input/Output pins. Each GPIO pin can be individually configured as either an output or input. More advanced configurations including open-drain, open-source, and glitch-filtering can be configured for each individual GPIO pin. The GPIO pins can be overridden by peripheral connections, like SPI communication. Each peripheral connection can be routed to several GPIO pins on the device. The input value of a GPIO pin can be routed through the Peripheral Reflex System to other peripher- als. The GPIO subsystem supports asynchronous external pin interrupts. All of the pins on ports A and port B are EM2 capable. These pins may be used by Low-Energy peripherals in EM2/3 and may also be used as EM2/3 pin wake-ups. Pins on ports C and D are latched/retained in their current state when entering EM2 until EM2 exit upon which internal peripherals could once again drive those pads. A few GPIOs also have EM4 wake functionality. These pins are listed in the Table 6.2 GPIO Alternate Functions Table on page 34

3.6 Security

MGM240S modules support one of two levels in the Security Portfolio offered by Silicon Labs: Secure Vault Mid or Secure Vault High. Secure Vault is a collection of technologies that deliver state-of-the-art security and upgradability features to protect and future-proof IoT devices against costly threats, attacks, and tampering. A dedicated security CPU enables the Secure Vault functions and isolates cryptographic functions and data from the Cortex-M33 core. MGM240S A part numbers support Secure Mid Vault and MGM240S D part numbers support Secure Vault High. Table 3.2. Secure Vault Features Feature Secure Vault Mid Secure Vault High True Random Number Generator (TRNG) Yes Yes Secure Boot with Root of Trust and Secure Loader (RTSL) Yes Yes Secure Debug with Lock/Unlock Yes Yes DPA Countermeasures Yes Yes Anti-Tamper Yes Secure Attestation Yes Secure Key Management Yes Symmetric Encryption • AES 128 / 192 / 256 bit ECB, CTR, CBC, CFB, CCM, GCM, CBC-MAC, and GMAC

• AES 128 / 192 / 256 bit ECB, CTR, CBC, CFB, CCM, GCM, CBC-MAC, and GMAC
• ChaCha20 Public Key Encryption - ECDSA / ECDH / EdDSA
• p192 and p256 • p192, p256, p384 and p521 Curve25519 (ECDH)
• Ed25519 (EdDSA) Key Derivation • ECJ-PAKE p192 and p256 • ECJ-PAKE p192, p256, p384, and p521 PBKDF2
• HKDF Hashes • SHA-1 SHA-2/256
• SHA-1 SHA-2 256, 384, and 512
• Poly1305 MGM240S Multi-Protocol Wireless Module Data Sheet System Overview silabs.com | Building a more connected world. Rev. 1.0 | 9

3.6.1 Secure Boot with Root of Trust and Secure Loader (RTSL)

The Secure Boot with RTSL authenticates a chain of trusted firmware that begins from an immutable memory (ROM). It prevents malware injection, prevents rollback, ensures that only authentic firmware is executed, and protects Over The Air updates. For more information about this feature, see AN1218: Series 2 Secure Boot with RTSL.

3.6.2 Cryptographic Accelerator

Cryptographic Accelerator is an autonomous hardware accelerator with Differential Power Analysis (DPA) countermeasures to pro- tect keys. It supports AES encryption and decryption with 128/192/256-bit keys, ChaCha20 encryption, and Elliptic Curve Cryptography (ECC) to support public key operations, and hashes. Supported block cipher modes of operation for AES include:

• ECB (Electronic Code Book)
• CTR (Counter Mode)
• CBC (Cipher Block Chaining)
• CFB (Cipher Feedback)
• GCM (Galois Counter Mode)
• CCM (Counter with CBC-MAC)
• CBC-MAC (Cipher Block Chaining Message Authentication Code)
• GMAC (Galois Message Authentication Code) The Cryptographic Accelerator accelerates Elliptical Curve Cryptography and supports the NIST (National Institute of Standards and Technology) recommended curves including P-192, P-256, P-384, and P-521 for ECDH (Elliptic Curve Diffie-Hellman) key derivation, and ECDSA (Elliptic Curve Digital Signature Algorithm) sign and verify operations. Also supported is the non-NIST Curve25519 for ECDH and Ed25519 for EdDSA (Edwards-curve Digital Signature Algorithm) sign and verify operations. Secure Vault also supports ECJ-PAKE (Elliptic Curve variant of Password Authenticated Key Exchange by Juggling) and PBKDF2 (Password-Based Key Derivation Function 2). Supported hashes include SHA-1, SHA-2/256/384/512 and Poly1305. This implementation provides a fast and energy efficient solution to state of the art cryptographic needs.

3.6.3 True Random Number Generator

The True Random Number Generator module is a non-deterministic random number generator that harvests entropy from a thermal energy source. It includes start-up health tests for the entropy source as required by NIST SP800-90B and AIS-31 as well as online health tests required for NIST SP800-90C. The TRNG is suitable for periodically generating entropy to seed an approved pseudo random number generator.

3.6.4 Secure Debug with Lock/Unlock

For obvious security reasons, it is critical for a product to have its debug interface locked before being released in the field. In addition, Secure Vault High also provides a secure debug unlock function that allows authenticated access based on public key cryp- tography. This functionality is particularly useful for supporting failure analysis while maintaining confidentiality of IP and sensitive end- user data. For more information about this feature, see AN1190: Series 2 Secure Debug.

3.6.5 DPA Countermeasures

The AES and ECC accelerators have Differential Power Analysis (DPA) countermeasures support. This makes it very expensive from a time and effort standpoint to use DPA to recover secret keys. MGM240S Multi-Protocol Wireless Module Data Sheet System Overview silabs.com | Building a more connected world. Rev. 1.0 | 10

3.6.6 Secure Key Management with PUF

material in Secure Vault High products is protected by "key wrapping" with a standardized symmetric encryption mechanism. This method has the advantage of protecting a virtually unlimited number of keys, limited only by the storage that is accessible by the Cortex-M33, which includes off-chip storage as well. The symmetric key used for this wrapping and unwrapping must be highly secure because it can expose all other key materials in the system. The Secure Vault Key Management system uses a Physically Unclonable Function (PUF) to generate a persistent device-unique seed key on power up to dynamically generate this critical wrapping/unwrapping key which is only visible to the AES encryption engine and is not retained when the device loses power.

3.6.7 Anti-Tamper

Secure Vault High devices provide internal tamper protection which monitors parameters such as voltage, temperature, and electro- magnetic pulses as well as detecting tamper of the security sub-system itself. Additionally, 8 external configurable tamper pins support external tamper sources, such as enclosure tamper switches. For each tamper event, the user is able to select the severity of the tamper response ranging from an interrupt, to a reset, to destroying the PUF reconstruction data which will make all protected key materials un-recoverable and effectively render the device inoperable. The tamper system also has an internal resettable event counter with programmable trigger threshold and refresh periods to mitigate false positive tamper events. For more information about this feature, see AN1247: Anti-Tamper Protection Configuration and Use.

3.6.8 Secure Attestation

Secure Vault High products support Secure Attestation, which begins with a secure identity that is created during the Silicon Labs man- ufacturing process. During device production, each device generates its own public/private keypair and securely stores the wrapped private key into immutable OTP memory and this key never leaves the device. The corresponding public key is extracted from the de- vice and inserted into a binary DER-encoded X.509 device certificate, which is signed into a Silicon Labs CA chain and then program- med back into the chip into an immutable OTP memory. The secure identity can be used to authenticate the chip at any time in the life of the product. The production certification chain can be requested remotely from the product. This certification chain can be used to verify that the device was authentically produced by Silicon Labs. The device unique public key is also bound to the device certificate in the certification chain. A challenge can be sent to the chip at any point in time to be signed by the device private key. The public key in the device certificate can then be used to verify the chal- lenge response, proving that the device has access to the securely-stored private key, which prevents counterfeit products or imperso- nation attacks. For more information about this feature, see AN1268: Authenticating Silicon Labs Devices Using Device Certificates. MGM240S Multi-Protocol Wireless Module Data Sheet System Overview silabs.com | Building a more connected world. Rev. 1.0 | 11

1. Electrical Specifications All electrical parameters in all tables are specified under the following conditions, unless stated otherwise: Typical values are based on TA=25 °C and VDD = VDDIO = 3.0 V, by production test and/or technology characterization.

• Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output pow- er-specific external RF impedance-matching networks for interfacing to a 50 Ω antenna.
• Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature, unless stated otherwise.

4.1 Absolute Maximum Ratings

Table 4.1. Absolute Maximum Ratings Parameter Symbol Test Condition Min Typ Max Unit Storage temperature range T STG -40 — +105 °C Voltage on any supply pin V DDMAX -0.3 — 3.8 V Voltage ramp rate on any supply pin VDDRAMPMAX — — 1.0 V / µs DC voltage on any GPIO pin V DIGPIN -0.3 — V VDDIO + 0.3 V DC voltage on RESETn pin1 VRESETn -0.3 — 3.8 V Absolute voltage on RFOUT pin VMAX2G4 -0.3 — V VDD + 0.3 V Total current into VDD pin I VDDMAX Source — — 200 mA Total current into GND pin I VSSMAX Sink — — 200 mA Current per I/O pin IIOMAX Sink — — 50 mA Source — — 50 mA Current for all I/O pins I IOALLMAX Sink — — 200 mA Source — — 200 mA Note: The RESETn pin has a pull-up device to the internal DVDD supply. For minimum leakage, RESETn should not exceed the volt- age at DVDD, which is generated by the DC-DC converter. DVDD is equal to 1.8 V when DC-DC is active and bypassed to VDD when DC-DC is inactive. MGM240S Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 12

4.2 General Operating Conditions

Table 4.2. General Operating Conditions Parameter Symbol Test Condition Min Typ Max Unit Operating ambient tempera- ture range TA -40 — +105 °C VDD operating supply volt- age VVDD DC-DC in regulation 2.2 3.0 3.8 V DC-DC in bypass 1.8 3.0 3.8 V VDDIO operating supply volt- age VVDDIO AVDDBODEN=0, IOVDDxBO- DEN=01 1.71 3.0 3.8 V HCLK and SYSCLK frequen- cy fHCLK VSCALE2, MODE = WS1 — — 78 MHz VSCALE2, MODE = WS0 — — 40 MHz VSCALE1, MODE = WS0 — — 40 MHz EM01 Group A clock fre- quency fEM01GRPACLK VSCALE2 — — 78 MHz VSCALE1 — — 40 MHz EM01 Group C clock fre- quency fEM01GRPCCLK VSCALE2 — — 78 MHz VSCALE1 — — 40 MHz Radio HCLK frequency f RHCLK VSCALE2 or VSCALE1 — 39.0 — MHz Note: The AVDD and IOVDD BOD enable bits are in the EMU_BOD3SENSE register. These BODs are disabled on reset. MGM240S Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 13

4.3 MCU current consumption at 3.0 V Unless otherwise indicated, typical conditions are: VDD = VDDIO = 3.0 V, DC-DC in regulation. Voltage scaling level = VSCALE1. T A = 25 °C. Minimum and maximum values in this table represent the worst conditions across process variation at TA = 25 °C. Table 4.3. MCU current consumption at 3.0 V Parameter Symbol Test Condition Min Typ Max Unit Current consumption in EM0 mode with all peripherals dis- abled IACTIVE 78 MHz HFRCO w/ DPLL refer- enced to 39 MHz crystal, CPU running Prime from flash, VSCALE2 — 33.3 — µA/MHz

78 MHz HFRCO w/ DPLL refer-

enced to 39 MHz crystal, CPU running while loop from flash, VSCALE2 — 32.8 — µA/MHz enced to 39 MHz crystal, CPU running CoreMark loop from flash, VSCALE2 — 49.1 — µA/MHz

39 MHz crystal, CPU running

— 33.9 — µA/MHz — 33.4 — µA/MHz — 49.4 — µA/MHz

38 MHz HFRCO, CPU running

— 28.1 — µA/MHz Current consumption in EM1 mode with all peripherals dis- abled IEM1 78 MHz HFRCO w/ DPLL refer- enced to 39 MHz crystal, VSCALE2 — 22.6 — µA/MHz 39 MHz crystal — 24.4 — µA/MHz 38 MHz HFRCO — 19.0 — µA/MHz Current consumption in EM2 mode, VSCALE0 IEM2_VS 256 kB RAM and full Radio RAM retention, RTC running from LFXO1 — 3.1 — µA 256 kB RAM and full Radio RAM retention, RTC running from LFRCO1 — 3.1 — µA 16 kB RAM and full Radio RAM retention, RTC running from LFXO1 — 1.3 — µA 16 kB RAM and full Radio RAM retention, RTC running from LFRCO1 — 1.3 — µA 16 kB RAM and full Radio RAM retention, RTC running from LFRCO in precision mode1 — 1.9 — µA MGM240S Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 14

Parameter Symbol Test Condition Min Typ Max Unit Current consumption in EM3 mode, VSCALE0 IEM3_VS 256 kB RAM and full Radio RAM retention, RTC running from ULFRCO1 — 2.9 — µA 16 kB RAM and full Radio RAM retention, RTC running from ULFRCO1 — 1.1 — µA Current consumption in EM4 mode IEM4 No BURTC, no LF oscillator — 0.31 — µA BURTC with LFXO — 0.64 — µA Current consumption during reset IRST Hard pin reset held — 467 — µA Note: CPU cache retained, EM0/1 peripheral states retained 4.4 Radio Current Consumption with 3.0 V Supply RF current consumption measured with MCU in EM1 and all MCU peripherals disabled. Unless otherwise indicated, typical conditions are: VDD = VDDIO = 3.0 V, DC-DC in regulation. TA = 25 °C. Table 4.4. Radio Current Consumption with 3.0 V Supply Parameter Symbol Test Condition Min Typ Max Unit Current consumption in re- ceive mode, active packet reception, VSCALE1, EM1P IRX_ACTIVE 125 kbit/s, 2GFSK, f = 2.4 GHz — 5.4 — mA 500 kbit/s, 2GFSK, f = 2.4 GHz — 5.5 — mA 1 Mbit/s, 2GFSK, f = 2.4 GHz — 5.1 — mA 2 Mbit/s, 2GFSK, f = 2.4 GHz — 5.8 — mA 802.15.4, f = 2.4 GHz — 5.9 — mA Current consumption in re- ceive mode, listening for packet, VSCALE1, EM1P IRX_LISTEN 125 kbit/s, 2GFSK, f = 2.4 GHz — 5.4 — mA 500 kbit/s, 2GFSK, f = 2.4 GHz — 5.4 — mA 1 Mbit/s, 2GFSK, f = 2.4 GHz — 5.0 — mA 2 Mbit/s, 2GFSK, f = 2.4 GHz — 5.8 — mA 802.15.4, f = 2.4 GHz — 5.8 — mA Current consumption in transmit mode ITX f = 2.4 GHz, CW, 10 dBm output power — 23.4 — mA f = 2.4 GHz, CW, 0 dBm output power — 4.6 — mA MGM240S Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 15

4.5 RF Transmitter General Characteristics for the 2.4 GHz Band Unless otherwise indicated, typical conditions are: VDD = VDDIO = 3.0 V, DC-DC in regulation. RF center frequency 2.45 GHz. T A = 25 °C. Table 4.5. RF Transmitter General Characteristics for the 2.4 GHz Band Parameter Symbol Test Condition Min Typ Max Unit RF tuning frequency range F RANGE 2402 — 2480 MHz Maximum TX power POUT MAX 10 dBm — 10.0 — dBm 0 dBm — -1.4 — dBm Minimum active TX power POUT MIN 10 dBm — -29.1 — dBm 0 dBm — -24.9 — dBm Output power step size POUT STEP 0 dBm 0.1 0.6 10 dB 10 dBm, -5 dBm < Output power < 0 dBm 0.2 0.7 1.7 dB 10 dBm, 0 dBm < Output power < 10 dBm 0.04 0.2 0.8 dB Output power variation vs supply voltage variation, fre- quency = 2450 MHz POUTVAR_V 10 dBm output power with VDD voltage swept from 1.8 V to 3.8 V — 0.02 — dB 0 dBm output power with VDD voltage swept from 1.8 V to 3.8 V — 0.06 — dB Output power variation vs temperature, Frequency =

2450 MHz

POUTVAR_T 10 dBm, (-40 to +105 °C) — 1.0 — dB Output power variation over the RF tuning frequency range POUTVAR_F 10 dBm — 0.6 — dB 0 dBm — 0.07 — dB 4.6 RF Transmitter Characteristics for 802.15.4 DSSS-OQPSK in the 2.4 GHz Band Unless otherwise indicated, typical conditions are: VDD = VDDIO = 3.0 V, DC-DC in regulation. RF center frequency 2.45 GHz. T A = 25 °C. Parameter Symbol Test Condition Min Typ Max Unit Error vector magnitude per 802.15.4-2011 EVM 10 dBm, Average across frequen- cy, signal is DSSS-OQPSK refer- ence packet — 2.9 — % rms 0 dBm, Average across frequen- cy, signal is DSSS-OQPSK refer- ence packet — 3.0 — % rms MGM240S Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 16

4.7 RF Receiver General Characteristics for the 2.4 GHz Band Unless otherwise indicated, typical conditions are: VDD = VDDIO = 3.0 V, DC-DC in regulation. RF center frequency 2.45 GHz. T A = 25 °C. Table 4.7. RF Receiver General Characteristics for the 2.4 GHz Band Parameter Symbol Test Condition Min Typ Max Unit RF tuning frequency range F RANGE 2402 — 2480 MHz MGM240S Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 17

4.8 RF Receiver Characteristics for 802.15.4 DSSS-OQPSK in the 2.4 GHz Band Unless otherwise indicated, typical conditions are: VDD = VDDIO = 3.0 V, DC-DC in regulation. RF center frequency 2.45 GHz. T A = 25 °C. Parameter Symbol Test Condition Min Typ Max Unit Max usable receiver input level, 1% PER SAT Signal is reference signal1, packet length is 20 octets — 10 — dBm Sensitivity, 1% PER SENS Signal is reference signal. Packet length is 20 octets — -104.5 — dBm Co-channel interferer rejec- tion, 1% PER CCR Desired signal 3 dB above sensi- tivity limit — -0.7 — dB Adjacent channel rejection, Interferer is reference signal, 1% PER, desired is refer- ence signal at 3 dB above reference sensitivity level2 ACRREF1 Interferer is reference signal at +1 channel spacing — 36.8 — dB Interferer is reference signal at -1 channel spacing — 37.5 — dB Alternate channel rejection, interferer is reference signal, 1% PER, desired is refer- ence signal at 3 dB above reference sensitivity level2 ACRREF2 Interferer is reference signal at +2 channel spacing — 48.9 — dB Interferer is reference signal at -2 channel spacing — 49.4 — dB Image rejection, 1% PER, desired is reference signal at 3 dB above reference sensi- tivity level2 IR Interferer is CW in image band3 — 53.5 — dB Blocking rejection of all other channels, 1% PER, desired is reference signal at 3 dB above reference sensitivity level2, interferer is reference signal BLOCK Interferer frequency < desired fre- quency -3 channel spacing — 55.3 — dB Interferer frequency > desired fre- quency +3 channel spacing — 55.1 — dB RSSI resolution RSSIRES -100 dBm to +5 dBm — 0.25 — dB RSSI accuracy in the linear region as defined by 802.15.4-2003 RSSILIN — +/-6 — dB Note: Reference signal is defined as O-QPSK DSSS per 802.15.4, Frequency range = 2400-2483.5 MHz, Symbol rate = 62.5 ksym- bols/s. 2. Reference sensitivity level is -85 dBm. 3. Due to low-IF frequency, there is some overlap of adjacent channel and image channel bands. Adjacent channel CW blocker tests place the Interferer center frequency at the Desired frequency ± 5 MHz on the channel raster, whereas the image rejection test places the CW interferer near the image frequency of the Desired signal carrier, regardless of the channel raster. MGM240S Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 18

4.9 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate Unless otherwise indicated, typical conditions are: VDD = VDDIO = 3.0 V, DC-DC in regulation. RF center frequency 2.45 GHz. T A = 25 °C. Table 4.9. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate Parameter Symbol Test Condition Min Typ Max Unit Rx Max Strong Signal Input Level for 0.1% BER RXSAT Signal is reference signal1 — 10 — dBm Sensitivity SENS Signal is reference signal, 37 byte payload1 — -97 — dBm Signal is reference signal, 255 byte payload1 — -95.4 — dBm With non-ideal signals2 1 — -95.0 — dBm Signal to co-channel interfer- er C/ICC (see notes)1 3 — 8.7 — dB N ± 1 Adjacent channel se- lectivity C/I1 Interferer is reference signal at +1 MHz offset1 4 3 5 — -5.4 — dB Interferer is reference signal at -1 MHz offset1 4 3 5 — -5.3 — dB N ± 2 Alternate channel se- lectivity C/I2 Interferer is reference signal at +2 MHz offset1 4 3 5 — -40.9 — dB Interferer is reference signal at -2 MHz offset1 4 3 5 — -39.7 — dB N ± 3 Alternate channel se- lectivity C/I3 Interferer is reference signal at +3 MHz offset1 4 3 5 — -45.5 — dB Interferer is reference signal at -3 MHz offset1 4 3 5 — -45.7 — dB Selectivity to image frequen- cy C/IIM Interferer is reference signal at im- age frequency with 1 MHz preci- sion1 5 — -23.3 — dB Selectivity to image frequen- cy ± 1 MHz C/IIM_1 Interferer is reference signal at im- age frequency +1 MHz with 1 MHz precision1 5 — -40.9 — dB Interferer is reference signal at im- age frequency -1 MHz with 1 MHz precision1 5 — -5.4 — dB Intermodulation performance IM n = 3 (see note6) — -17.3 — dBm Note: 0.017% Bit Error Rate. 3. Desired signal -67 dBm. 4. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz. 5. With allowed exceptions. 6. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4 MGM240S Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 19

4.10 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate Unless otherwise indicated, typical conditions are: VDD = VDDIO = 3.0 V, DC-DC in regulation. RF center frequency 2.45 GHz. T A = 25 °C. Table 4.10. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate Parameter Symbol Test Condition Min Typ Max Unit Rx Max Strong Signal Input Level for 0.1% BER RXSAT Signal is reference signal1 — 10 — dBm Sensitivity SENS Signal is reference signal, 37 byte payload1 — -94.3 — dBm Signal is reference signal, 255 byte payload1 — -92.7 — dBm With non-ideal signals2 1 — -92.5 — dBm Signal to co-channel interfer- er C/ICC (see notes)1 3 — 8.6 — dB N ± 1 Adjacent channel se- lectivity C/I1 Interferer is reference signal at +2 MHz offset1 4 3 5 — -5.3 — dB Interferer is reference signal at -2 MHz offset1 4 3 5 — -5.8 — dB N ± 2 Alternate channel se- lectivity C/I2 Interferer is reference signal at +4 MHz offset1 4 3 5 — -42.2 — dB Interferer is reference signal at -4 MHz offset1 4 3 5 — -44.2 — dB N ± 3 Alternate channel se- lectivity C/I3 Interferer is reference signal at +6 MHz offset1 4 3 5 — -48.1 — dB Interferer is reference signal at -6 MHz offset1 4 3 5 — -50.2 — dB Selectivity to image frequen- cy C/IIM Interferer is reference signal at im- age frequency with 1 MHz preci- sion1 5 — -22.8 — dB Selectivity to image frequen- cy ± 2 MHz C/IIM_1 Interferer is reference signal at im- age frequency +2 MHz with 1 MHz precision1 5 — -42.2 — dB Interferer is reference signal at im- age frequency -2 MHz with 1 MHz precision1 5 — -5.3 — dB Intermodulation performance IM n = 3 (see note6) — -18.3 — dBm Note: 0.017% Bit Error Rate. 3. Desired signal -64 dBm. 4. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz. 5. With allowed exceptions. 6. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4 MGM240S Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 20

4.11 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate Unless otherwise indicated, typical conditions are: VDD = VDDIO = 3.0 V, DC-DC in regulation. RF center frequency 2.45 GHz. T A = 25 °C. Table 4.11. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate Parameter Symbol Test Condition Min Typ Max Unit Rx Max Strong Signal Input Level for 0.1% BER RXSAT Signal is reference signal1 — 10 — dBm Sensitivity SENS Signal is reference signal, 37 byte payload1 — -100.7 — dBm Signal is reference signal, 255 byte payload1 — -99.4 — dBm With non-ideal signals2 1 — -98.4 — dBm Signal to co-channel interfer- er C/ICC (see notes)1 3 — 2.7 — dB N ± 1 Adjacent channel se- lectivity C/I1 Interferer is reference signal at +1 MHz offset1 4 3 5 — -7.1 — dB Interferer is reference signal at -1 MHz offset1 4 3 5 — -7.4 — dB N ± 2 Alternate channel se- lectivity C/I2 Interferer is reference signal at +2 MHz offset1 4 3 5 — -46.8 — dB Interferer is reference signal at -2 MHz offset1 4 3 5 — -49.7 — dB N ± 3 Alternate channel se- lectivity C/I3 Interferer is reference signal at +3 MHz offset1 4 3 5 — -49.4 — dB Interferer is reference signal at -3 MHz offset1 4 3 5 — -54.5 — dB Selectivity to image frequen- cy C/IIM Interferer is reference signal at im- age frequency with 1 MHz preci- sion1 5 — -49 — dB Selectivity to image frequen- cy ± 1 MHz C/IIM_1 Interferer is reference signal at im- age frequency +1 MHz with 1 MHz precision1 5 — -49.4 — dB Interferer is reference signal at im- age frequency -1 MHz with 1 MHz precision1 5 — -46.8 — dB Note: 0.017% Bit Error Rate. 3. Desired signal -72 dBm. 4. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz. 5. With allowed exceptions. MGM240S Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 21

4.12 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate Unless otherwise indicated, typical conditions are: VDD = VDDIO = 3.0 V, DC-DC in regulation. RF center frequency 2.45 GHz. T A = 25 °C. Table 4.12. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate Parameter Symbol Test Condition Min Typ Max Unit Rx Max Strong Signal Input Level for 0.1% BER RXSAT Signal is reference signal1 — 10 — dBm Sensitivity SENS Signal is reference signal, 37 byte payload1 — -105.1 — dBm Signal is reference signal, 255 byte payload1 — -104.7 — dBm With non-ideal signals2 1 — -104.3 — dBm Signal to co-channel interfer- er C/ICC (see notes)1 3 — 0.9 — dB N ± 1 Adjacent channel se- lectivity C/I1 Interferer is reference signal at +1 MHz offset1 4 3 5 — -12.4 — dB Interferer is reference signal at -1 MHz offset1 4 3 5 — -12.8 — dB N ± 2 Alternate channel se- lectivity C/I2 Interferer is reference signal at +2 MHz offset1 4 3 5 — -52.6 — dB Interferer is reference signal at -2 MHz offset1 4 3 5 — -55.5 — dB N ± 3 Alternate channel se- lectivity C/I3 Interferer is reference signal at +3 MHz offset1 4 3 5 — -53.8 — dB Interferer is reference signal at -3 MHz offset1 4 3 5 — -60 — dB Selectivity to image frequen- cy C/IIM Interferer is reference signal at im- age frequency with 1 MHz preci- sion1 5 — -53 — dB Selectivity to image frequen- cy ± 1 MHz C/IIM_1 Interferer is reference signal at im- age frequency +1 MHz with 1 MHz precision1 5 — -53.8 — dB Interferer is reference signal at im- age frequency -1 MHz with 1 MHz precision1 5 — -52.6 — dB Note: 0.017% Bit Error Rate. 3. Desired signal -79 dBm. 4. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz. 5. With allowed exceptions. MGM240S Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 22

4.13 High-Frequency Crystal

Table 4.13. High-Frequency Crystal Parameter Symbol Test Condition Min Typ Max Unit Crystal frequency fHFXTAL — 39 — MHz Initial calibrated accuracy ACC HFXTAL -5 — +5 ppm Temperature drift DRIFTHFXTAL Across specified temperature range -30 — 30 ppm

4.14 Low Frequency Crystal Oscillator

Table 4.14. Low Frequency Crystal Oscillator Parameter Symbol Test Condition Min Typ Max Unit Crystal Frequency FLFXO — 32.768 — kHz Supported Crystal equivalent series resistance (ESR) ESRLFXO GAIN = 0 — — 80 kΩ GAIN = 1 to 3 — — 100 kΩ Supported range of crystal load capacitance 1 CL_LFXO GAIN = 0 4 — 6 pF GAIN = 1 6 — 10 pF GAIN = 2 (see note2) 10 — 12.5 pF GAIN = 3 (see note2) 12.5 — 18 pF Current consumption I CL12p5 ESR = 70 kΩ, CL = 12.5 pF, GAIN3 = 2, AGC4 = 1 — 294 — nA Startup Time TSTARTUP ESR = 70 kΩ, CL = 7 pF, GAIN3 = 1, AGC4 = 1 — 52 — ms On-chip tuning cap step size SS LFXO — 0.26 — pF On-chip tuning capacitor val- ue at minimum setting5 CLFXO_MIN CAPTUNE = 0 — 5.2 — pF On-chip tuning capacitor val- ue at maximum setting5 CLFXO_MAX CAPTUNE = 0x4F — 26.2 — pF Note: Total load capacitance seen by the crystal 2. Crystals with a load capacitance of greater than 12 pF require external load capacitors. 3. In LFXO_CAL Register 4. In LFXO_CFG Register 5. The effective load capacitance seen by the crystal will be CLFXO/2. This is because each XTAL pin has a tuning cap and the two caps will be seen in series by the crystal MGM240S Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 23

4.15 Precision Low Frequency RC Oscillator (LFRCO)

Table 4.15. Precision Low Frequency RC Oscillator (LFRCO) Parameter Symbol Test Condition Min Typ Max Unit Nominal oscillation frequen- cy FLFRCO — 32.768 — kHz Frequency accuracy F LFRCO_ACC Normal mode -3 — 3 % Precision mode1, across operat- ing temperature range2 -500 — 500 ppm Startup time tSTARTUP Normal mode — 204 — µs Precision mode1 — 11.7 — ms Current consumption I LFRCO Normal mode — 189.9 — nA Precision mode1, T = stable at 25 °C 3 — 649.8 — nA Note: The LFRCO operates in high-precision mode when CFG_HIGHPRECEN is set to 1. High-precision mode is not available in EM4. 2. Includes ± 40 ppm frequency tolerance of the HFXO crystal. 3. Includes periodic re-calibration against HFXO crystal oscillator. MGM240S Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 24

4.16 GPIO Pins

Table 4.16. GPIO Pins Parameter Symbol Test Condition Min Typ Max Unit Leakage current ILEAK_IO MODEx = DISABLED, VDD = VDDIO = 3.0 V — 2.5 — nA Input low voltage1 VIL Any GPIO pin — — 0.3 * VDDIO V RESETn — — 0.3 * DVDD V Input high voltage1 VIH Any GPIO pin 0.7 * VDDIO — — V RESETn 0.7 * DVDD — — V Hysteresis of input voltage V HYS Any GPIO pin 0.05 * VDDIO — — V RESETn 0.05 * DVDD — — V Output high voltage V OH Sourcing 20 mA, VDDIO = 3.0 V 0.8 * VDDIO — — V Output low voltage VOL Sinking 20 mA, VDDIO = 3.0 V — — 0.2 * VDDIO V GPIO rise time TGPIO_RISE VDDIO = 3.0 V, Cload = 50pF, SLEWRATE = 4, 10% to 90% — 8.4 — ns GPIO fall time TGPIO_FALL VDDIO = 3.0 V, Cload = 50pF, SLEWRATE = 4, 90% to 10% — 7.1 — ns Pull up/down resistance2 RPULL Any GPIO pin. Pull-up to VDDIO: MODEn = DISABLE DOUT=1. Pull-down to GND: MODEn = WIREDORPULLDOWN DOUT = 35 44 55 kΩ RESETn pin. Pull-up to DVDD 35 44 55 kΩ Maximum filtered glitch width T GF MODE = INPUT, DOUT = 1 — 27 — ns Note: GPIO input thresholds are proportional to the VDDIO pin. RESETn input thresholds are proportional to the internal DVDD supply, which is generated by the DC-DC converter. DVDD is equal to 1.8 V when DC-DC is active and bypassed to VDD when DC-DC is inactive. 2. GPIO pull-ups connect to VDDIO supply, pull-downs connect to GND. RESETn pull-up connects to internal DVDD supply, which is generated by the DC-DC converter. DVDD is equal to 1.8 V when DC-DC is active and bypassed to VDD when DC-DC is inac- tive. MGM240S Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 25

4.17 Microcontroller Peripherals

The set of peripherals available in MGM240S modules includes:

• 12-bit 1 Msps ADC
• Analog Comparators
• 16-bit and 32-bit Timers/Counters
• 24-bit Low Energy Timer for waveform generation
• 32-bit Real Time Counter
• USART (UART/SPI/SmartCards/IrDA/I2S)
• I2C peripheral interfaces
• 12 Channel Peripheral Reflex System Details on their electrical performance can be found in the relevant portions of Section 4 of the EFR32MG24 SoC data sheet. To learn which GPIO ports provide access to every peripheral, consult the 6.4 Digital Peripheral Connectivity and 6.3 Analog Peripheral Connectivity tables. MGM240S Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 26

4.18 Typical Performance Curves

radiation patterns for the built-in antenna under optimal operating conditions are plotted in the figures that follow. Antenna gain and radiation patterns have a strong dependence on the size and shape of the application PCB the module is mounted on, as well as on the proximity of any mechanical design to the antenna. Figure 4.1. Typical 2D Antenna Radiation Patterns - Phi 0o (Side View) Gain (dBi) MGM240S Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 27

Figure 4.4. 3D Radiation Pattern at 2440MHz MGM240S Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 29

1. Reference Diagrams

5.1 Network Co-Processor (NCP) Application with UART Host

MGM240S can be controlled via the UART interface as a peripheral to an external host processor. Typical power supply, program- ming/debug interface, and host interface connections are shown in the figure below. For more details, see AN958: Debugging and Pro- gramming Interfaces for Custom Designs. Figure 5.1. UART NCP Configuration MGM240S Multi-Protocol Wireless Module Data Sheet Reference Diagrams silabs.com | Building a more connected world. Rev. 1.0 | 30

5.2 SoC Application

MGM240S can be used in a stand-alone SoC configuration without an external host processor. Typical power supply and program- ming/debug interface connections are shown in the figure below. For more details, see AN958: Debugging and Programming Interfaces for Custom Designs. Figure 5.2. Stand-Alone SoC Configuration MGM240S Multi-Protocol Wireless Module Data Sheet Reference Diagrams silabs.com | Building a more connected world. Rev. 1.0 | 31

1. Pin Definitions

6.1 Module Pinout

Figure 6.1. MGM240S Module Pinout (Top view) The next table shows the MGM240S pinout and general descriptions for each pin. Refer to 6.2 Alternate Pin Functions, 6.3 Analog Peripheral Connectivity, and 6.4 Digital Peripheral Connectivity for details on functions and peripherals supported by each GPIO pin. Table 6.1. MGM240S Module Pin Definitions Pin Name No. Description Pin Name No. Description DNC 1 Do not connect GND 52 GROUND ANT OUT 2 Integral Ant Out GND 51 GROUND DNC 3 Do not connect GND 50 GROUND DNC 4 Do not connect GND 49 GROUND ANT IN 5 Integral Ant In GND 48 GROUND 2G4IO 6 RF IN/OUT RESETn1 47 RESET GND 7 GROUND PC09 46 GPIO PB05 8 GPIO PC08 45 GPIO PB04 9 GPIO PC07 44 GPIO PB03 10 GPIO PC06 43 GPIO PB02 11 GPIO PC05 42 GPIO GND 12 GROUND PC04 41 GPIO PB01 13 GPIO PC03 40 GPIO PB00 14 GPIO PC02 39 GPIO PA00 15 GPIO PC01 38 GPIO PA01 16 GPIO PC00 37 GPIO PA02 17 GPIO PD00 36 GPIO MGM240S Multi-Protocol Wireless Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.0 | 32

Pin Name No. Description Pin Name No. Description PA03 18 GPIO PD01 35 GPIO PA04 19 GPIO PD02 34 GPIO PA05 20 GPIO PD03 33 GPIO PA06 21 GPIO PD04 32 GPIO PA07 22 GPIO PD05 31 GPIO PA08 23 GPIO VDDIO 30 IO power supply PA09 24 GPIO GND 29 GROUND GND 25 GROUND VDD 28 Power supply VDCDC 26 Test pin (internal test usage) DECOUPLE 27 Test pin (internal test usage) Note: The RESETn pin is pulled up to an internal DVDD supply. An external pull-up is not recommended. To apply an external reset source to this pin, it is, required to only drive this pin low during, reset, and let the internal pull-up ensure that reset is released. The RESETn pin can be left unconnected if no external reset switch or source is used. MGM240S Multi-Protocol Wireless Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.0 | 33

6.2 Alternate Pin Functions

GPIOs support alternate functions like debugging, wake-up from EM4, external low frequency crystal access, etc. The following table shows both which module pins have alternate capabilities and the functions they support. Refer to the SoCs reference manual for more details. Table 6.2. GPIO Alternate Functions Table GPIO Alternate Functions PA00 IADC0.VREFP PA01 GPIO.SWCLK PA02 GPIO.SWDIO PA03 GPIO.SWV GPIO.TDO GPIO.TRACEDATA0 PA04 GPIO.TDI GPIO.TRACECLK PA05 GPIO.TRACEDATA1 GPIO.EM4WU0 PA06 GPIO.TRACEDATA2 PA07 GPIO.TRACEDATA3 PB00 VDAC0.VDAC_CH0_MAIN_OU TPUT PB01 GPIO.EM4WU3 VDAC0.VDAC_CH1_MAIN_OU TPUT PB02 VDAC1.VDAC_CH0_MAIN_OU TPUT PB03 GPIO.EM4WU4 VDAC1.VDAC_CH1_MAIN_OU TPUT PC00 GPIO.EM4WU6 PC01 GPIO.EFP_TX_SDA PC02 GPIO.EFP_TX_SCL PC05 GPIO.EFP_INT GPIO.EM4WU7 PC07 GPIO.EM4WU8 GPIO.THMSW_EN GPIO.THMSW_HALFSWITCH PD00 LFXO.LFXTAL_O PD01 LFXO.LFXTAL_I LFXO.LF_EXTCLK PD02 GPIO.EM4WU9 MGM240S Multi-Protocol Wireless Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.0 | 34

6.3 Analog Peripheral Connectivity

analog resources are routable and can be connected to numerous GPIO's. The table below indicates which peripherals are avail- able on each GPIO port. When a differential connection is being used positive inputs are restricted to the EVEN pins and negative in- puts are restricted to the ODD pins. When a single ended connection is being used positive input is available on all pins. See the SoC's Reference Manual for more details on the ABUS and analog peripherals. Table 6.3. ABUS Routing Table Peripheral Signal PA PB PC PD EVEN ODD EVEN ODD EVEN ODD EVEN ODD ACMP0 ANA_NEG Yes Yes Yes Yes Yes Yes Yes Yes ANA_POS Yes Yes Yes Yes Yes Yes Yes Yes ACMP1 ANA_NEG Yes Yes Yes Yes Yes Yes Yes Yes ANA_POS Yes Yes Yes Yes Yes Yes Yes Yes IADC0 ANA_NEG Yes Yes Yes Yes Yes Yes Yes Yes ANA_POS Yes Yes Yes Yes Yes Yes Yes Yes VDAC0 VDAC_CH0_ABUS_OUT- PUT Yes Yes Yes Yes Yes Yes Yes Yes VDAC_CH1_ABUS_OUT Yes Yes Yes Yes Yes Yes Yes Yes VDAC1 VDAC_CH0_ABUS_OUT- PUT Yes Yes Yes Yes Yes Yes Yes Yes VDAC_CH1_ABUS_OUT Yes Yes Yes Yes Yes Yes Yes Yes MGM240S Multi-Protocol Wireless Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.0 | 35

6.4 Digital Peripheral Connectivity

digital resources are routable and can be connected to numerous GPIOs. The table below indicates which peripherals are avalia- ble on each GPIO port. Table 6.4. DBUS Routing Table Peripheral.Resource PORT PA PB PC PD ACMP0.DIGOUT Available Available Available Available ACMP1.DIGOUT Available Available Available Available CMU.CLKIN0 Available Available CMU.CLKOUT0 Available Available CMU.CLKOUT1 Available Available CMU.CLKOUT2 Available Available EUSART0.CS Available Available EUSART0.CTS Available Available EUSART0.RTS Available Available EUSART0.RX Available Available EUSART0.SCLK Available Available EUSART0.TX Available Available EUSART1.CS Available Available Available Available EUSART1.CTS Available Available Available Available EUSART1.RTS Available Available Available Available EUSART1.RX Available Available Available Available EUSART1.SCLK Available Available Available Available EUSART1.TX Available Available Available Available FRC.DCLK Available Available FRC.DFRAME Available Available FRC.DOUT Available Available HFXO0.BUFOUT_REQ_IN_ASYNC Available Available I2C0.SCL Available Available Available Available I2C0.SDA Available Available Available Available I2C1.SCL Available Available I2C1.SDA Available Available KEYSCAN.COL_OUT_0 Available Available Available Available KEYSCAN.COL_OUT_1 Available Available Available Available KEYSCAN.COL_OUT_2 Available Available Available Available KEYSCAN.COL_OUT_3 Available Available Available Available KEYSCAN.COL_OUT_4 Available Available Available Available MGM240S Multi-Protocol Wireless Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.0 | 36

Peripheral.Resource PORT PA PB PC PD KEYSCAN.COL_OUT_5 Available Available Available Available KEYSCAN.COL_OUT_6 Available Available Available Available KEYSCAN.COL_OUT_7 Available Available Available Available KEYSCAN.ROW_SENSE_0 Available Available KEYSCAN.ROW_SENSE_1 Available Available KEYSCAN.ROW_SENSE_2 Available Available KEYSCAN.ROW_SENSE_3 Available Available KEYSCAN.ROW_SENSE_4 Available Available KEYSCAN.ROW_SENSE_5 Available Available LETIMER0.OUT0 Available Available LETIMER0.OUT1 Available Available MODEM.ANT0 Available Available Available Available MODEM.ANT1 Available Available Available Available MODEM.ANT_ROLL_OVER Available Available MODEM.ANT_RR0 Available Available MODEM.ANT_RR1 Available Available MODEM.ANT_RR2 Available Available MODEM.ANT_RR3 Available Available MODEM.ANT_RR4 Available Available MODEM.ANT_RR5 Available Available MODEM.ANT_SW_EN Available Available MODEM.ANT_SW_US Available Available MODEM.ANT_TRIG Available Available MODEM.ANT_TRIG_STOP Available Available MODEM.DCLK Available Available MODEM.DIN Available Available MODEM.DOUT Available Available PCNT0.S0IN Available Available PCNT0.S1IN Available Available PRS.ASYNCH0 Available Available PRS.ASYNCH1 Available Available PRS.ASYNCH2 Available Available PRS.ASYNCH3 Available Available PRS.ASYNCH4 Available Available PRS.ASYNCH5 Available Available PRS.ASYNCH6 Available Available MGM240S Multi-Protocol Wireless Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.0 | 37

Peripheral.Resource PORT PA PB PC PD PRS.ASYNCH7 Available Available PRS.ASYNCH8 Available Available PRS.ASYNCH9 Available Available PRS.ASYNCH10 Available Available PRS.ASYNCH11 Available Available PRS.ASYNCH12 Available Available PRS.ASYNCH13 Available Available PRS.ASYNCH14 Available Available PRS.ASYNCH15 Available Available PRS.SYNCH0 Available Available Available Available PRS.SYNCH1 Available Available Available Available PRS.SYNCH2 Available Available Available Available PRS.SYNCH3 Available Available Available Available RAC.LNAEN Available Available Available Available RAC.PAEN Available Available Available Available TIMER0.CC0 Available Available Available Available TIMER0.CC1 Available Available Available Available TIMER0.CC2 Available Available Available Available TIMER0.CDTI0 Available Available Available Available TIMER0.CDTI1 Available Available Available Available TIMER0.CDTI2 Available Available Available Available TIMER1.CC0 Available Available Available Available TIMER1.CC1 Available Available Available Available TIMER1.CC2 Available Available Available Available TIMER1.CDTI0 Available Available Available Available TIMER1.CDTI1 Available Available Available Available TIMER1.CDTI2 Available Available Available Available TIMER2.CC0 Available Available TIMER2.CC1 Available Available TIMER2.CC2 Available Available TIMER2.CDTI0 Available Available TIMER2.CDTI1 Available Available TIMER2.CDTI2 Available Available TIMER3.CC0 Available Available TIMER3.CC1 Available Available TIMER3.CC2 Available Available MGM240S Multi-Protocol Wireless Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.0 | 38

Peripheral.Resource PORT PA PB PC PD TIMER3.CDTI0 Available Available TIMER3.CDTI1 Available Available TIMER3.CDTI2 Available Available TIMER4.CC0 Available Available TIMER4.CC1 Available Available TIMER4.CC2 Available Available TIMER4.CDTI0 Available Available TIMER4.CDTI1 Available Available TIMER4.CDTI2 Available Available USART0.CLK Available Available Available Available USART0.CS Available Available Available Available USART0.CTS Available Available Available Available USART0.RTS Available Available Available Available USART0.RX Available Available Available Available USART0.TX Available Available Available Available MGM240S Multi-Protocol Wireless Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.0 | 39

1. Design Guidelines

7.1 Layout and Placement

For optimal performance of the MGM240S the following guidelines are recommended:

• Place the module 1.50 mm from the edge of the copper “keep-in” area at the middle of the long edge of the application PCB, as illustrated in Figure 7.1 on page 40.
• Copy the exact design from Figure 7.2 on page 41 with the values for coordinates A to L given in Table 7.1 Antenna Polygon Coordinates, Referenced to Center of MGM240S on page 41.
• Make a cutout in all lower layers aligned with the right edge and the bottom edge of the integral loop antenna as indicated by the red box in Figure 7.3 Antenna Clearance in Inner and Bottom Layers on page 42.
• Connect all ground pads directly to a solid ground plane in the top layer.
• Connect 2G4IO to ANT_IN through a 0-ohm resistor.
• The 0-ohm gives the ability to test conducted and to evaluate the antenna impedance in the design.
• Place ground vias as close to the ground pads of the MGM240S as possible.
• Place ground vias along the antenna loop right and bottom side.
• Place ground vias along the edges of the application board.
• Do not place plastic or any other dielectric material in contact with the antenna.
• A minimum clearance of 0.5 mm is advised.
• Solder mask, conformal coating and other thin dielectric layers are acceptable directly on top of the antenna region.
• Proper module placement and electrical connection should be ensured by measuring radiated output power from antenna.
• Impedance of the antenna can be verified by measuring S11 at ANT_IN pin that is corresponding antenna specification.
• With an external antenna, use a 50Ω trace to connect RF signal to the antenna, as it is illustrated in Figure 7.4 Recommended Lay- out for MGM240S (External Antenna) on page 42 Figure 7.1. Recommended Layout for MGM240S (Integral Antenna) MGM240S Multi-Protocol Wireless Module Data Sheet Design Guidelines silabs.com | Building a more connected world. Rev. 1.0 | 40

Figure 7.2. TOP Layer Antenna Layout With Coordinates Table 7.1. Antenna Polygon Coordinates, Referenced to Center of MGM240S Point Coordinate A (2.10, 3.30) B (2.40, 3.30 C (2.40, 4.20) D (2.10, 5.00) E (7.35, 5.00) F (7.35, 4.20) G (7.35, -0.03) H (6.59, -0.30) I (3.39, 2.90) J (3.05, 2.90) K (2.27, 2.13) L (-0.08, 2.13) M (-0.08, 5.00) Tolerance for the coordinates is +/- 0.05 mm. MGM240S Multi-Protocol Wireless Module Data Sheet Design Guidelines silabs.com | Building a more connected world. Rev. 1.0 | 41

7.2 Best Design Practices

design of a good RF system relies on thoughtful placement and routing of the RF signals. The following guidelines are recommen- ded:

• Place the MGM240S and antenna close to the center of the longest edge of the application board.
• Do not place any circuitry between the board edge and the antenna.
• Make sure to tie all GND planes in the application board together with as many vias as can be fitted.
• Generally ground planes are recommended in all areas of the application board except in the antenna keep-out area shown in Fig- ure 7.3 Antenna Clearance in Inner and Bottom Layers on page 42.
• Open-ended stubs of copper in the outer layer ground planes must be removed if they are more than 5 mm long to avoid radiation of spurious emissions.
• The width of the GND plane to the sides of the MGM240S will impact the efficiency of the on-board integral loop antenna.
• To achieve optimal performance, a GND plane width of 55 mm is recommended as seen on Figure 7.5 Illustration of Recommended Board Width on page 43.
• See 4.16.1 Antenna Typical Characteristics for reference. Figure 7.6 Non-Recommended Layout Examples on page 44 illustrates layout scenarios that will lead to severely degraded RF performance for the application board. Figure 7.5. Illustration of Recommended Board Width MGM240S Multi-Protocol Wireless Module Data Sheet Design Guidelines silabs.com | Building a more connected world. Rev. 1.0 | 43

Figure 7.6. Non-Recommended Layout Examples MGM240S Multi-Protocol Wireless Module Data Sheet Design Guidelines silabs.com | Building a more connected world. Rev. 1.0 | 44

7.3 Radio Performance vs. Carrier Board Size As with most applications, the carrier board size is determined by the overall form factor or size of the additional circuitry. The recom- mended carrier board width of 55 mm is thus not always possible in the end-application. If another form factor is required, the antenna performance of the integrated antenna will likely be compromised, but it may still be sufficiently good for providing the required link qual- ity and range of the end-application. As can be seen in Figure 7.7 on page 45, the best performance is achieved for a carrier board size of 55 mm x 30, with relatively constant performance for larger boards and rapidly declining performance for smaller boards. WARNING: Any antenna tuning, and/or change of the loop dimensions, is likely to invalidate a modular certification, unless it is done to compensate for the degradation caused by a host board deviating in size from the manufacturer's best-case reference. Separate guid- ance might be provided by the manufacturer to address this particular kind of degradation, in which case a Permissive Change to the modular approval might not even become necessary: however, since this is evaluated on a case-by-case basis, please consult your certification house on the best approach. Figure 7.7. Efficiency of the Integrated Antenna as Function of the Carrier Board Size for MGM240S

7.4 Impact of Human Body and Other Materials in Close Proximity

Placing the module in contact with or very close to the human body will negatively impact antenna efficiency and reduce range. Avoid placing plastic or any other dielectric material in close proximity to the antenna. Conformal coating and other thin dielectric layers are acceptable directly on top of the antenna region, but this will also negatively impact antenna efficiency and reduce range. Any metallic objects in close proximity to the antenna will prevent the antenna from radiating freely. The minimum recommended dis- tance of metallic and/or conductive objects is 10 mm in any direction from the antenna except in the directions of the application PCB ground planes.

7.5 Reset

The MGM240S can be reset by pulling the RESET line low, by the internal watchdog timer, or by software command. The reset state does not provide power saving functionality and it is not recommended as a means to conserve power.

7.6 Debug

See AN958: Debugging and Programming Interfaces for Custom Designs. MGM240S Multi-Protocol Wireless Module Data Sheet Design Guidelines silabs.com | Building a more connected world. Rev. 1.0 | 45

The MGM240S supports hardware debugging via 4-pin JTAG or 2-pin serial-wire debug (SWD) interfaces. It is recommended to ex- pose the debug pins in your own hardware design for firmware update and debug purposes. The table below lists the required pins for JTAG and SWD debug interfacing, which are also presented in Section 6.2 Alternate Pin Functions. If JTAG interfacing is enabled, the module must be power cycled to return to a SWD debug configuration if necessary. Table 7.2. Debug Pins Pin Name JTAG Signal SWD Signal Comments PA04 TDI N/A This pin is disabled after reset. Once enabled the pin has a built-in pull-up. PA03 TDO N/A This pin is disabled after reset. PA02 TMS SWDIO Pin is enabled after reset and has a built-in pull-up. PA01 TCK SWCLK Pin is enabled after reset and has a built-in pull-down.

7.7 Packet Trace Interface (PTI)

integrates a true PHY-level packet trace interface (PTI) peripheral that can capture packets non-intrusively to monitor and log device and network traffic without burdening processing resources in the module's SoC. The PTI generates two output signals that can serve as a powerful debugging tool, especially in conjunction with other hardware and software development tools available from Silicon Labs. The PTI_DATA and PTI_FRAME signals can be accessed through any GPIO on ports C and D (see FRC.DOUT and FRC.DFRAME peripheral resources in Section 6. Pin Definitions. MGM240S Multi-Protocol Wireless Module Data Sheet Design Guidelines silabs.com | Building a more connected world. Rev. 1.0 | 46

1. Package Specifications

8.1 Package Outline

Figure 8.1. Top and Side Views Figure 8.2. Bottom View MGM240S Multi-Protocol Wireless Module Data Sheet Package Specifications silabs.com | Building a more connected world. Rev. 1.0 | 47

Figure 8.3. Bottom View about Package Corner Table 8.1. QFN40 Package Dimensions Dimension Min Typ Max A 1.080 1.180 1.280 A1 0.140 0.180 0.220 A2 0.950 1.000 1.050 b 0.200 0.250 0.300 D 7.000 BSC D1 5.5000 BSC e 0.500 BSC E 7.000 BSC E1 5.500 BSC L 0.300 0.350 0.400 L1 0.125 0.175 0.225 L2 0.575 0.625 0.675 L3 0.450 0.500 0.550 eD1 0.450 BSC eD2 0.900 BSC eE1 0.450 BSC eE2 0.900 BSC aaa 0.100 bbb 0.100 ccc 0.100 ddd 0.100 eee 0.100 1. All dimensions shown are in millimeters (mm) unless otherwise noted. The dimensions in parenthesis are reference. 3. Hatching lines indicate package shielding area MGM240S Multi-Protocol Wireless Module Data Sheet Package Specifications silabs.com | Building a more connected world. Rev. 1.0 | 48

1. Unless otherwise specified, Decimal tolerances are: X.X = +/- 0.1

• X.XX = +/- 0.05
• X.XXX = +/- 0.03 5. Unless otherwise specified, Angular tolerances are:
• +/- 0.1 (in Deg) MGM240S Multi-Protocol Wireless Module Data Sheet Package Specifications silabs.com | Building a more connected world. Rev. 1.0 | 49

8.2 PCB Land Pattern

Figure 8.4. Recommended Land Pattern for Modules with a Built-in Antenna Table 8.2. PCB Land Pattern Dimensions Dimension Typ C1 6.43 C2 6.43 W 0.35 L 0.35 e 0.5 L1 0.50 X1 0.45 Y1 0.45 S1 6.08 S2 6.08 e1 0.90 MGM240S Multi-Protocol Wireless Module Data Sheet Package Specifications silabs.com | Building a more connected world. Rev. 1.0 | 50

Note: All dimensions shown are in millimeters (mm) unless otherwise noted. 2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification. 3. This Land Pattern Design is based on IPC-SM-782 guidelines. 4. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a Fabri- cation Allowance of 0.05mm. 5. All pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60um mini- mum, all the way around the pad. 6. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 7. The stencil thickness should be 0.125mm (5 mils). 8. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads. 9. A No-Clean, Type-3 solder paste is recommended. 10. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 11. Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use different parameters and fine tune their SMT process as required for their application and tooling. MGM240S Multi-Protocol Wireless Module Data Sheet Package Specifications silabs.com | Building a more connected world. Rev. 1.0 | 51

8.3 Package Marking

Figure 8.5. MGM240S Top Marking Table 8.3. Top Marking Definition OPN Line 1 Marking Line 2 Marking Line 3 Marking Line 4 Marking MGM240SA22VNA2 MGM240S22A SA22VNA2 See note 1 See note 2 MGM240SA22VNA2R MGM240S22A SA22VNA2 See note 1 See note 2 MGM240SD22VNA2 MGM240S22A SD22VNA2 See note 1 See note 2 MGM240SD22VNA2R MGM240S22A SD22VNA2 See note 1 See note 2 Note: YY = Year. WW = Work Week, TTTTTTT = Trace Code 2. Country of Origin ISO Code Abbreviation to be marked as specified in mark instructions of PO. MGM240S Multi-Protocol Wireless Module Data Sheet Package Specifications silabs.com | Building a more connected world. Rev. 1.0 | 52

1. Soldering Recommendations It is recommended that final PCB assembly of the MGM240S follows the industry standard as identified by the Institute for Printed Cir- cuits (IPC). This product is assembled in compliance with the J-STD-001 requirements and the guidelines of IPC-AJ-820. Surface mounting of this product by the end user is recommended to follow IPC-A-610 to meet or exceed class 2 requirements. CLASS 1 General Electronic Products Includes products suitable for applications where the major requirement is function of the completed assembly. CLASS 2 Dedicated Service Electronic Products Includes products where continued performance and extended life is required, and for which uninterrupted service is desired but not critical. Typically the end-use environment would not cause failures. CLASS 3 High Performance/Harsh Environment Electronic Products Includes products where continued high performance or performance-on-demand is critical, equipment downtime cannot be tolerated, end-use environment may be uncommonly harsh, and the equipment must function when required, such as life support or other critical systems. MGM240S Multi-Protocol Wireless Module Data Sheet Soldering Recommendations silabs.com | Building a more connected world. Rev. 1.0 | 53

1. Certifications This section details the regulatory certification status of the module in various regions. The address for the module manufacturer and certification applicant is: SILICON LABORATORIES FINLAND OY Alberga Business Park, Bertel Jungin aukio 3,

02600 Espoo, Finland

11.1 Qualified Antennas

modules have been tested and certified both with the built-in integral antenna and with a reference external antenna attached to the module's RF pin denoted as RFOUT. The antenna impedance is 50 Ω. Performance characteristics for the built-in antenna are presented in 3.3 Antenna and 4.18 Typical Performance Curves. The details of the qualified external antenna are summarized in the table below. Table 11.1. Qualified External Antennas for MGM240S Antenna Type Maximum Gain Impedance Connectorized Coaxial Dipole 2.8 dBi 50 Ω Any external antenna of the same general type and of equal or less directional gain compared to the one listed in the above table, and having similar in-band and out-of-band characteristics, can be used in the regulatory areas that have modular radio approvals, such as USA and Canada, as long as spot-check testing of the host is performed to verify that no performance changes compromising compli- ance have been introduced. In the particular FCC case, in order to comply with e-CFR Title 47, Part 15, Subpart C, Section 15.203, the module integrator using an external antenna must ensure it has a unique connector or it is nondetachable. In countries applying the ETSI standards, where manufacturers issue a self-Declaration of Conformity before placing products in the market, like in the EU countries, the radiated emissions are always tested with the end-product and the antenna type is not critical, but antennas with higher gain may violate some of the regulatory limits. When using instead an external antenna of a different type (such as a chip antenna, a PCB trace antenna, or a patch) or having non- similar in-band and out-of-band characteristics, but still with a gain less than or equal to the maximum gain listed in the table above, in principle it can be added to an existing modular grant/certificate by mean of a permissive change (for example with FCC and ISED), or by the administrative registration of such additional antenna (for example with MIC and KC). In many of these cases, some radiated emission testing is demanded, but no modular or end-product re-certification is required. On the other hand, all products with external antennas having more gain than the maximum gain listed in the table above are very likely to require a full new end-product certification. Since the exact permissive change or registration or re-certification procedure is chosen on a case-by-case basis, please consult your certification house and/or a certification body for understanding the correct approach based on your unique design. You might also want or need to get in touch with Silicon Labs for any authorization letter that your certifi- cation body might ask for.

11.2 CE and UKCA - EU and UK

The MGM240S modules have been tested against the relevant harmonized/designated standards and are in conformity with the essen- tial requirements and other relevant requirements of the EU's Radio Equipment Directive (RED) (2014/53/EU) and of the UK's Radio Equipment Regulations (RER) (S.I. 2017/1206). Please notice that every end-product integrating a MGM240S module will need to perform the radio EMC tests on the whole assembly, according to the ETSI 301 489-x relevant standards. Furthermore, it is ultimately the responsibility of the manufacturers to ensure the compliance of their end-products as a whole. The spe- cific product assembly is likely to have an impact to RF radiated characteristics, when compared to the bare module. Hence, manufac- turers should carefully consider RF radiated testing with the final product assembly, especially taking into account the gain of the exter- nal antenna if any, and the possible deviations in the PSD, EIRP and spurious emissions measurements, as defined in the ETSI EN 300 328 standard. The modules are entitled to carry the CE and UKCA Marks, and a formal Declaration of Conformity (DoC) is available at the product web page which is reachable starting from https://www.silabs.com/. MGM240S Multi-Protocol Wireless Module Data Sheet Certifications silabs.com | Building a more connected world. Rev. 1.0 | 55

11.3 FCC - USA

device complies with FCC's e-CFR Title 47, Part 15, Subpart C, Section 15.247 (and related relevant parts of the ANSI C63.10 standard) when operating with the built-in integral antenna or with an external antenna type as discussed in Section 11.1 Qualified An- tennas. Operation is subject to the following two conditions: 1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesirable operation. Any changes or modifications not expressly approved by Silicon Labs could void the user’s authority to operate the equipment. FCC RF Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specif- ic operating instructions for satisfying RF exposure compliance. This transmitter meets the Mobile requirements at a distance of 20 cm and above from the human body, in accordance to the limit(s) exposed in the RF Exposure Analysis. This transmitter also meets the Portable requirements at distances equal or above those repor- ted in Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption on page 62. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. OEM Responsibilities to comply with FCC Regulations This module has been tested for compliance to FCC Part 15. OEM integrators are responsible for testing their end-product for any additional compliance requirements needed with this module in- stalled (for example, digital device emissions, PC peripheral requirements, etc.). Additionally, investigative measurements and spot-checking are strongly recommended to verify that the full system compliance is maintained when the module is integrated, even with a module having a full modular approval, in accordance with the "Host Product Testing Guidance" in FCC's KDB 996369 D04 Module Integration Guide V01.

• General Considerations This transmitter module is tested as a subsystem and its certification does not cover the FCC Part 15 Subpart B (unintentional radia- tor) rule requirement, which is typically applicable to the final host. The final host will still need to be assessed for compliance to this portion of the rule requirements, if applicable.
• Manual Information to the End User The OEM integrator has to be aware not to provide information to the end-user regarding how to install or remove this RF module, or how to change RF related parameters, in the user’s manual of the final product which integrates this module. The end user manual shall include all required regulatory information/warnings as shown in this manual.
• Host Manufacturer Responsibilities Host manufacturers are ultimately responsible for the full compliance of their host system. The final product is supposed to be as- sessed against all the essential requirements of the FCC rules, such as FCC Part 15 Subpart B, before it can be placed on the US market. This includes re-assuring the compliance of the radio transmitter with the RF and EMF essential requirements of the FCC rules. The modular radio transmitter must not be incorporated into any other radio-equipped device or system without retesting for compliance as multi-radio and combined equipment. Except for minor (cosmetic) modifications, most changes to an FCC certified equipment require preliminary testing to determine whether any of such changes is leading to a Class I or Class II Permissive Change. For more details about using the Single Modular Transmitter, refer to the following FCC documents:
• KDB 996369 D01 Transmitter Module Equipment Authorization Guide
• KDB 996369 D02 Frequently Asked Questions and Answers about Modules
• KDB 178919 D01 Permissive Change Policy
• KDB 178919 D02 Permissive Change Frequently-Asked Questions MGM240S Multi-Protocol Wireless Module Data Sheet Certifications silabs.com | Building a more connected world. Rev. 1.0 | 56

• To meet the SAR exemption for portable conditions, the minimum separation distance indicated in Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption on page 62 must be maintained between the human body and the radiator (antenna) at all times.
• This transmitter module is tested in a standalone RF Exposure condition, and in case of any co-located radio transmitter being al- lowed to transmit simultaneously, or in case of portable use at closer distances from the human body than those allowing the excep- tions rules to be applied, a separate additional SAR evaluation, or a reduction in the max output power or in the duty-cycle, might be required for the host, ultimately leading to a Class II Permissive Change, or more rarely to a new grant.
• Important Note: In the event that the conditions for the exemption cannot be met, the final product will likely have to undergo addi- tional testing to evaluate the RF Exposure, or go through some re-configuration of the max output power and/or duty-cycle in order for the FCC authorization to remain valid, and a permissive change will have to be applied. The SAR evaluation (and/or re-configura- tion) is under the responsibility of the end-product’s manufacturer, as well as the permissive change that can be carried out with the help of the customer's own Telecommunication Certification Body, following a Change in ID authorization by the module's original grant holder. End Product Labeling MGM240S modules are not labeled with their own FCC ID due their very small size. Instead, the anti-static bags containing the mod- ules' reels or trays come with a special label displaying the FCC ID. In all those cases when the module's FCC ID is not visible after the module is installed inside another device, then the outside of the device into which the module is installed must also have a label with a reference to the enclosed module. In that case, the final product must be labeled in a visible area with the following: "Contains Transmitter Module FCC ID: QOQ-GM240S" or "Contains FCC ID: QOQ-GM240S" Final note: As long as all the conditions in this and all the above chapters are met, further RF testing of the transmitter will not be strictly required. However, still consider the good practice and the FCC strong recommendation to ensure the compliance of the host by spot-checking. Nevertheless, the OEM integrator is still responsible for testing their end-product for any additional compliance require- ments which might be mandatory with this module installed. Class B Device Notice This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna
• Increase the separation between the equipment and receiver
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected
• Consult the dealer or an experienced radio/TV technician for help MGM240S Multi-Protocol Wireless Module Data Sheet Certifications silabs.com | Building a more connected world. Rev. 1.0 | 57

11.4 ISED - Canada

radio transmitter (IC: 5123A-GM240S) has been approved by Innovation, Science and Economic Development Canada (ISED Canada, formerly Industry Canada ) to operate with the built-in integral antenna and with the antenna type(s) listed in Section 11.1 Qualified Antennas, with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain listed, are strictly prohibited for use with this device. This radio-equipped device complies with ISED's license-exempt RSS standards. Operation is subject to the following two conditions: 1. This device may not cause interference; and 2. This device must accept any interference, including interference that may cause undesired operation of the device RF Exposure Statement Exception from routine SAR evaluation limits are given in RSS-102 Issue 5. The module meets the requirements for Mobile use cases when the minimum separation distance from the human body is 20 cm or greater, in accordance to the limit(s) exposed in the RF Exposure Analysis. For Portable use cases, RF exposure or SAR evaluation is not required when the separation distances from the human body are equal or above those reported in Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption on page 62. If the separation distance from the human body is less than the values stated in Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption on page 62 , then the OEM integrator is responsible for evaluating the SAR with the end-product, or for the re- configuration of the radio module in the host in terms of lowering the max RF TX power and/or the duty-cycle. A permissive change would be required too, under the responsibility of the host manufacturer, following a Multiple Listing authorization by the original mod- ule's certificate holder. OEM Responsibilities to comply with IC Regulations The MGM240S modules have been certified for integration into products only by OEM integrators under the following conditions:

• The antenna must be installed so as to maintain the intended minimum separation distance between the radiator (antenna) and all persons at all times. Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption on page 62 indicates the distances in accordance to the use cases.
• The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter. Important Note: In the event that the above conditions cannot be met, the final product will have to undergo additional testing to evalu- ate the RF Exposure, or go through some re-configuration of the max output power and/or duty-cycle in order for the ISED authorization to remain valid. A permissive change will have to be applied too . The RF Exposure evaluation (SAR, or possibly a re-configuration) is under the responsibility of the end-product's manufacturer, as well as the permissive change that can be carried out with the help of the customer's own Telecommunication Certification Body, following a Multiple Listing authorization by the module's original grant holder. End Product Labeling The MGM240S modules are not labeled with their own IC ID due their very small size. Instead, the anti-static bags containing the mod- ules' reels or trays come with a special label displaying the IC ID. In all those cases when the module's IC ID is not visible after the module is installed inside another device, then the outside of the device into which the module is installed must also have a label with a reference to the enclosed module. In that case, the final product must be labeled in a visible area with the following: “Contains Transmitter Module IC: 5123A-GM240S ” or “Contains IC: 5123A-GM240S” The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end-product. As long as all the conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still respon- sible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). CAN ICES-003 (B) This Class B digital apparatus complies with Canadian ICES-003. MGM240S Multi-Protocol Wireless Module Data Sheet Certifications silabs.com | Building a more connected world. Rev. 1.0 | 58

ISED (Français) Le présent émetteur radio (IC: 5123A-GM240S) a été approuvé par Innovation, Sciences et Développement Économique Canada (IS- ED Canada, anciennement Industrie Canada) pour fonctionner avec l'antenne intégrée et le ou les types d'antenne énumérés à la sec- tion 11.1 Qualified Antennas, avec le gain maximal admissible indiqué. Les types d'antenne non inclus dans cette liste, ayant un gain- supérieur au gain maximal indiqué, sont strictement interdits d'utilisation avec cet appareil. . L’émetteur/récepteur exempt de licence contenu dans le présent appareil est conforme aux CNR d’Innovation, Sciences et Développe- ment économique Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions sui- vantes: 1. L’appareil ne doit pas produire de brouillage; 2. L’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptibled’en compromettre le fonctionne- ment. Déclaration d'exposition RF L'exception tirée des limites courantes d'évaluation SAR est donnée dans le document RSS-102 Issue 5. Le module répond aux exigences pour les cas d'utilisation Mobile lorsque la distance minimale de séparation du corps humain est de 20 cm ou plus, conformément à la (aux) limite(s) exposée(s) dans l'analyse de l'exposition RF. Pour les cas d'utilisation Portables, l'évaluation de l'Exposition RF ou l'évaluation SAR n'est pas requise lorsque les distances de sépa- ration du corps humain sont égales ou supérieures à celles indiquées dans le tableau 11.2 à la page 57. Si la distance de séparation du corps humain est inférieure aux valeurs indiquées dans le tableau 11.2 à la page 57, l'intégrateur OEM est responsable de l'évaluation du SAR avec le produit final, ou de la reconfiguration du module radio dans l'hôte en termes de réduc- tion de la puissance RF TX maximale et/ou du rapport cyclique. Une modification permissive serait également nécessaire, sous la re- sponsabilité du fabricant de l'hôte, suite à une autorisation de cotation multiple par le titulaire du certificat du module d'origine. Responsabilités du fabricant de se conformer à la réglementation IC Le module a été certifié pour l'intégration dans les produits uniquement par les intégrateurs OEM dans les conditions suivantes:

• L'antenne doit être installée de manière à maintenir une distance de séparation minimale entre le radiateur (antenne) et toutes les personnes à tout moment. Le tableau 11.2 à la page 57 indique les distances en fonction des cas d'utilisation.
• Le module émetteur ne doit pas être localisé ou fonctionner conjointement avec une autre antenne ou un autre émetteur. Remarque Importante: au cas où ces conditions ne pourraient pas être remplies, le produit final devra être soumis à des tests supplé- mentaires pour évaluer l'exposition RF, ou passer par une reconfiguration de la puissance de sortie maximale et/ou du rapport cyclique, afin que l'autorisation ISED reste valable; une modification permissive devra également être appliqué. L'évaluation de l'exposition aux radiofréquences (SAR, ou éventuellement une reconfiguration) est sous la responsabilité du fabricant du produit final, ainsi que le changement permissif qui peut être effectué avec l'aide de l'organisme de certification des télécommunications du client, après autori- sation de cotation multiple par le titulaire de la certification du module. Étiquetage des produits finis Les modules MGM240S ne sont pas étiquetés avec leur propre IC ID en raison de leur taille. Au lieu de cela, l'étiquette d'emballage contient l'ID IC. Dans tous ces cas, si l'ID IC n'est pas visible après l'installation du module à l'intérieur d'un autre appareil, alors l'extér- ieur de l'appareil dans lequel le module est installé doit également afficher une étiquette faisant référence au module inclus. Dans ce cas, le produit final doit être étiqueté dans une zone visible avec les éléments suivants: “Contient le module transmetteur IC: 5123A-GM240S ” ou “Contient IC: 5123A-GM240S” L’intégrateur OEM doit être conscient de ne pas fournir à l’utilisateur final d’informations sur la procédure d’installation ou de retrait de ce module RF ni sur la modification des paramètres liés à la RF dans le manuel d’utilisation du produit final. Tant que toutes les conditions ci-dessus sont remplies, aucun test supplémentaire de l'émetteur ne sera nécessaire. Toutefois, l’inté- grateur OEM reste responsable de l’essai de son produit final pour déterminer les exigences de conformité supplémentaires requises avec ce module installé (par exemple, émissions d’appareils numériques, exigences relatives aux périphériques PC, etc.) CAN ICES-003 (B) Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003. MGM240S Multi-Protocol Wireless Module Data Sheet Certifications silabs.com | Building a more connected world. Rev. 1.0 | 59

11.5 MIC - Japan

The MGM240S modules are certified in Japan with following certification numbers: 020-220205 It is the end-product manufacturer's responsibility to ensure that a module is configured to meet the compliance limits, as documented in the formal certification test report(s) being available at www.silabs.com. Refer to the API reference manual(s) to learn for example how to configure (limit) the maximum RF TX power for the normal operations, and refer as well to the power setting tables in the test report(s) in order to realize the maximum output power allowed for the regulatory compliance in Japan. Manufacturers integrating a radio module into their host equipment are supposed to make the certification mark and the certification number visible on the outside of the host equipment. This combination of mark and number, and their relative placement, is depicted in Figure 11.1, and depending on the overall size it might also appear among the top shield markings of the radio module. The certification mark and certification number must be placed close to the text in the Japanese language which is provided below. This requirement in the Radio Law has been made in order to enable users of the combination of host and radio module to verify if they are actually using a radio device which is approved for use in Japan. Certification Text to be Placed on the Outside Surface of the Host Equipment: Translation of the text: “This equipment contains specified radio equipment that has been certified to the Technical Regulation Conformity Certification under the Radio Law.” The "Giteki" Mark shown in the following figures must be affixed to an easily noticeable section of the specified radio-enabled host equipment. Note that such section may be required to contain additional information if the end-device embedding the module is also subject to a Telecom approval. The manufacturer of the final product is also responsible to provide a Japanese language version of the User Manual and/or Installation Instructions as a companion document coming with the final product when placed on the market in Japan. Such a document will have to mention the integrated radio component and the related certification information. Figure 11.1. GITEKI Mark and ID MGM240S Multi-Protocol Wireless Module Data Sheet Certifications silabs.com | Building a more connected world. Rev. 1.0 | 60

Figure 11.2. Detail of GITEKI Mark

11.6 KC - South Korea

The MGM240S modules have a RF registration for import and use in South Korea. Registration number is R-R-BGT-GM240S. These modules are meant to be integrated into end-products, which then become exempted from doing the RF emission testing, as long as the recommended design guidance is followed, and as long as, where applicable, the approved external antennas are used and any additional transmit power backoff is implemented in accordance to the measurements and configurations seen in the formal test report(s). EMC testing and any other relevant test applicable to the end-product as a whole, plus appropriate labeling of the end-product, might still be required for the full regulatory compliance in the country. MGM240S Multi-Protocol Wireless Module Data Sheet Certifications silabs.com | Building a more connected world. Rev. 1.0 | 61

11.7 RF Exposure and Proximity to Human Body

using the MGM240S modules in an application where the radio-equipped end-product is located close to the human body, the human RF Exposure must be taken into account. FCC, ISED, and CE all have different standards and rules for evaluating the RF Expo- sure. In particular, each regulator has different requirements when it comes to the exemption from having to perform RF Exposure and SAR (Specific Absorption Rate) measurements, and the minimum separation distances between the module's antenna and the human body varies accordingly. The properties of the MGM240S modules allow for the minimum separation distances detailed in Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption on page 62 for the SAR evaluation exemption in portable use cases (less than 20 cm from human body). The module is approved for the Mobile use case (more than 20 cm) without any need for RF Exposure evaluation. Table 11.2. Minimum Separation Distances for SAR Evaluation Exemption Certification MGM240S22A, 802.15.4 MGM240S22A, Bluetooth FCC Integral Antenna: 11 mm External Reference Dipole Antenna: 12 mm Integral Antenna: 11 mm External Reference Dipole Antenna: 12 mm ISED Integral Antenna: 16 mm External Reference Dipole Antenna: 18 mm Integral Antenna: 16 mm External Reference Dipole Antenna: 18 mm CE The RF exposure should always be evaluated with the end-product when transmitting with power levels higher than 20 mW (13 dBm). The exemption distances above, calculated for reference in the full output power use case, are based on the rules in force at the time of writing this datasheet. Even though changing rarely, always ensure to apply the rules in force at the time of placing a product in the market. In the cases of FCC and ISED, it is allowed to use the module at its max RF TX power in end-products where the typical separation distance from the human body is smaller than mentioned above, but it requires evaluating the RF Exposure in the final assembly and applying for a Class 2 Permissive Change to the FCC and ISED approvals of the module. In order to proceed with the permissive change, module manufacturer should be asked for an authorization to proceed first with a Change in ID and/or Multiple Listing, so that the new portable condition will be added to the new parallel grant owned by the end-product manufacturer. For CE, RF Exposure must be evaluated using the end-product in all cases when transmitting at more than the power level indicated in the table. Note: Placing the module in touch or very close to the human body will have a negative impact on the efficiency of the antenna thus a reduced range is to be expected.

11.8 Bluetooth Qualification

The MGM240S modules are launched with a pre-qualified Bluetooth Low Energy RF-PHY Tested Component based on Core Specifica- tion 5.3 having Declaration ID of D059594 and QDID of 184327. The RF-PHY Tested Component should be imported and combined together with the latest Wireless Gecko Link Layer and Host pre- qualified Components by Silicon Labs, when in the process of qualifying an end-product which embeds the MGM240S via the SIG's Launch Studio. Please find out more in chapter 2.2 of the quick start guides QSG139 and GSG169. Notice that the validity set by the SIG for Tested Components is currently of 3 years: during the product lifetime, Silicon Labs will re- assess or re-qualify the RF-PHY Component as it expires, whenever applicable. In case of a re-qualification, a Tested Component will come with a new DID and a new QDID, and the latter will be then referred to in new end-product listings. Newer DIDs and QDIDs can be discovered by using the search engine in the SIG's Launch Studio, or by asking Silicon Labs via the technical support platform. MGM240S Multi-Protocol Wireless Module Data Sheet Certifications silabs.com | Building a more connected world. Rev. 1.0 | 62

1. Revision History Revision 1.0 December, 2022 Updated front page block diagram

• Updated top marking Revision 0.5 September, 2022
• Initial Draft MGM240S Multi-Protocol Wireless Module Data Sheet

Revision History

silabs.com | Building a more connected world. Rev. 1.0 | 63

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