MGM240PA22VNA3R

Silicon Laboratories

MGM240P Multi-Protocol Wireless Module Rev. 1.0

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PDF pages: 63

Technical content

MGM240P Multi-Protocol Wireless Module Data Sheet The MGM240P is a secure, high-performance wireless module optimized for the needs of battery and line-powered IoT devices for 2.4 GHz mesh networks. Based on the Series 2 EFR32MG24 SoC, it enables 802.15.4 (Zigbee®, OpenThread®) and Bluetooth® Low Energy connectivity, delivering exceptional RF performance and en- ergy efficiency, Matter ready Smart Home Connectivity, industry-leading Secure Vault® technology, and future-proofing capabilities. The MGM240P is a complete solution offered with robust and fully-upgradeable software stacks, global regulatory certifications, advanced development and debugging tools, and documentation that simplifies and minimizes the development cycle of your end-product, helping to accelerate its time-to-market. The MGM240P is targeted for a broad range of applications, including:

Smart Home Devices
Lighting
Gateways and Digital Assistants
Building Automation and Security KEY FEATURES
Multi-protocol connectivity (802.15.4 and Bluetooth Low Energy 5.3) Built-in antenna or RF pin
+10 or +20 dBm TX output power
-106.0 dBm 802.15.4 RX sensitivity
-98.5 dBm BLE 1M RX sensitivity
32-bit ARM® Cortex®-M33 core at 39 MHz
1536/256 kB of Flash/RAM memory
Vault High or Vault Mid security
Rich set of analog and digital peripherals
26 GPIO pins
-40 °C to 105 °C
12.9 mm x 15.0 mm Power ManagementClock Management Timers and Triggers 32-bit Bus Peripheral Reflex System Serial Interfaces I/O Ports Analog I/F Lowest power mode with peripheral operational: USART EUSART External Interrupts General Purpose I/O Pin Reset Pin Wakeup ADC EM4—Shutoff Voltage Regulator Power-On Reset SecurityCore / Memory ARM CortexTM M33 processor with DSP extensions, FPU and TrustZone ETM Debug Interface RAM Memory LDMA Controller Flash Program Memory System Real Time Counter Timer/Counter Low Energy Timer Watchdog Timer Protocol Timer EM3—StopEM2—Deep SleepEM1—SleepEM0—Active Fast Startup RC Oscillator Back-Up Real Time Counter I2C EUSART VDAC Radio Subsystem Frequency Synthesizer ARM CortexTM M0+ Radio Controller CRC BUFC RAM FRC DEMOD AGC IFADC MOD Temperature Sensor ACMP Keypad Scanner Antenna Antenna or RF Pin Matching RX/TX Front-End with Integrated PA DC-DC Converter SupplyCrystal

39 MHz

Oscillator Brown-Out Detector Decoupling DC-DC LC Crypto Acceleration TRNG Secure Debug Authentication Secure EngineHF Crystal Oscillator HF RC Oscillator DPA Countermeasures Pulse Counter silabs.com | Building a more connected world. Copyright © 2022 by Silicon Laboratories Rev. 1.0

Features

Supported Protocols 802.15.4
Zigbee
OpenThread
Bluetooth Low Energy (BLE) 5.3
Bluetooth Mesh
Matter-ready Smart Home Connectivity
Multiprotocol
Wireless System-on-Chip
2.4 GHz radio
TX power up to +20 dBm
32-bit ARM Cortex®-M33 with DSP instruction and floating- point unit for efficient signal processing
1536 kB flash program memory
256 kB RAM data memory
Embedded Trace Macrocell (ETM) for advanced debugging
Receiver Sensitivity
-106.0 dBm (1% PER) @ 250 kbps O-QPSK DSSS
-106.5 dBm (0.1% BER) @ 125 kbps GFSK
-102.2 dBm (0.1% BER) @ 500 kbps GFSK
-98.5 dBm (0.1% BER) @ 1 Mbps GFSK
-95.7 dBm (0.1% BER) @ 2 Mbps GFSK
Current Consumption
5.2 mA RX current @ 250 kbps O-QPSK DSSS
4.5 mA RX current @ 1 Mbps GFSK
4.8 mA TX current @ 0 dBm (MGM240Px22)
18.8 mA TX current @ 10 dBm (MGM240Px22)
158 mA TX current @ 20 dBm (MGM240Px32)
33.4 µA/MHz in Active Mode (EM0) @ 39.0 MHz
1.3 μA EM2 DeepSleep current (16 kB RAM retention and RTC running from LFRCO)
Regulatory Certifications
CE (EU)
UKCA (UK)
FCC (USA)
ISED (Canada)
MIC (Japan)
KC (South Korea)
Operating Range 1.8 V to 3.8 V single power supply
Dimensions
12.9 mm x 15.0 mm
Security
Secure Boot with Root of Trust and Secure Loader (RTSL)
Hardware Cryptographic Acceleration with DPA counter- measures for AES128/256, SHA-1, SHA-2 (up to 256-bit), ECC (up to 256-bit), ECDSA, and ECDH
True Random Number Generator (TRNG) compliant with NIST SP800-90 and AIS-31
ARM® TrustZone®
Secure Debug Interface lock/unlock
Secure Key Management with PUF
Anti-Tamper
Secure Attestation
MCU Peripherals
Analog to Digital Converter (ADC)
12-bit @ 1 Msps
16-bit @ 76.9 ksps
2 × Analog Comparator (ACMP)
2 × Digital to Analog Converter (VDAC)
Up to 26 General Purpose I/O pins with output state reten- tion and asynchronous interrupts
8 Channel DMA Controller
16 Channel Peripheral Reflex System (PRS)
3 × 16-bit Timer/Counter with 3 Compare/Capture/PWM channels
2 × 32-bit Timer/Counter with 3 Compare/Capture/PWM channels
2 x 32-bit Real Time Counter (SYSRTC/BURTC)
24-bit Low Energy Timer for waveform generation (LETIM- ER)
16-bit Pulse Counter with asynchronous operation (PCNT)
2 × Watchdog Timer (WDOG)
1 × Universal Synchronous/Asynchronous Receiver/Trans- mitter (USART), supporting UART/SPI/SmartCard (ISO 7816)/IrDA/I2S
2 × Enhanced Universal Synchronous/Asynchronous Re- ceiver/Transmitter (EUSART) supporting UART/SPI/DALI/ IrDA
2 × I2C interface with SMBus support
Low-Frequency RC Oscillator with precision mode to re- place 32 kHz sleep crystal (LFRCO)
Keypad scanner supporting up to 6x8 matrix (KEYSCAN)
Die temperature sensor with +/- 1.5 °C accuracy after sin- gle-point calibration Note: Sensitivity values above are for +10 dBm parts (MGM240x22). MGM240P Multi-Protocol Wireless Module Data Sheet

Features

silabs.com | Building a more connected world. Rev. 1.0 | 2

Ordering Information Table 2.1. Ordering Information Ordering Code Protocol Stack Max TX Power Security Antenna Flash (kB) RAM (kB) GPIO Temp Range Carrier MGM240PA22VNA3

Zigbee Open Thread
Bluetooth Low Energy 5.3
Bluetooth Mesh +10 dBm Vault Mid Built-in 1536 256 26 -40 to 105 °C Cut Tape MGM240PA22VNA3R
Zigbee Open Thread
Bluetooth Low Energy 5.3
Bluetooth Mesh +10 dBm Vault Mid Built-in 1536 256 26 -40 to 105 °C Reel MGM240PB22VNA3
Zigbee Open Thread
Bluetooth Low Energy 5.3
Bluetooth Mesh +10 dBm Vault High Built-in 1536 256 26 -40 to 105 °C Cut Tape MGM240PB22VNA3R
Zigbee Open Thread
Bluetooth Low Energy 5.3
Bluetooth Mesh +10 dBm Vault High Built-in 1536 256 26 -40 to 105 °C Reel MGM240PA32VNA3
Zigbee Open Thread
Bluetooth Low Energy 5.3
Bluetooth Mesh +20 dBm Vault Mid Built-in 1536 256 26 -40 to 105 °C Cut Tape MGM240PA32VNA3R
Zigbee Open Thread
Bluetooth Low Energy 5.3
Bluetooth Mesh +20 dBm Vault Mid Built-in 1536 256 26 -40 to 105 °C Reel MGM240PA32VNN3
Zigbee Open Thread
Bluetooth Low Energy 5.3
Bluetooth Mesh +20 dBm Vault Mid RF Pin 1536 256 26 -40 to 105 °C Cut Tape MGM240PA32VNN3R
Zigbee Open Thread
Bluetooth Low Energy 5.3
Bluetooth Mesh +20 dBm Vault Mid RF Pin 1536 256 26 -40 to 105 °C Reel MGM240P Multi-Protocol Wireless Module Data Sheet

Ordering Information

silabs.com | Building a more connected world. Rev. 1.0 | 3

Ordering Code Protocol Stack Max TX Power Security Antenna Flash (kB) RAM (kB) GPIO Temp Range Carrier MGM240PB32VNA3

Zigbee Open Thread
Bluetooth Low Energy 5.3
Bluetooth Mesh +20 dBm Vault High Built-in 1536 256 26 -40 to 105 °C Cut Tape MGM240PB32VNA3R
Zigbee Open Thread
Bluetooth Low Energy 5.3
Bluetooth Mesh +20 dBm Vault High Built-in 1536 256 26 -40 to 105 °C Reel MGM240PB32VNN3
Zigbee Open Thread
Bluetooth Low Energy 5.3
Bluetooth Mesh +20 dBm Vault High RF Pin 1536 256 26 -40 to 105 °C Cut Tape MGM240PB32VNN3R
Zigbee Open Thread
Bluetooth Low Energy 5.3
Bluetooth Mesh +20 dBm Vault High RF Pin 1536 256 26 -40 to 105 °C Reel Note: MGM240P modules operate in the 2.4 GHz ISM frequency band. 2. The maximum RF TX power allowed by different regional regulatory authorities may differ from the maximum output power a mod- ule can produce. End-product manufacturers must then verify that the module is configured to meet the regulatory limits for each region in accordance with the local rules and the formal certification test reports. 3. Throughout this document, the modules may be referred to by their product family/marketing name (e.g. MGM240P), by their mod- el names (MGM240P32A, MGM240P22A or MGM240P32N) or by their full ordering codes as seen in the table above. 4. Radio boards xGM240-RB4316A (+10 dBm) and xGM240-RB4317A (+20 dBm) are available for MGM240P evaluation and devel- opment. 5. Devices are pre-programmed with UART XMODEM bootloader version 2.00.00, which uses the pin configuration found in Section 5. Reference Diagrams. MGM240P Multi-Protocol Wireless Module Data Sheet

silabs.com | Building a more connected world. Rev. 1.0 | 4

4.10 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate .. 21 4.11 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate .. 23 4.12 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate .. 25 silabs.com | Building a more connected world. Rev. 1.0 | 5

7.4 silabs.com | Building a more connected world. Rev. 1.0 | 6

System Overview

3.1 Block Diagram

module is a highly-integrated, high-performance system with all the hardware components needed to enable 2.4 GHz wireless connectivity and support robust networking capabilities via multiple wireless protocols. Built around the EFR32MG24 Wireless SoC, the MGM240P includes a built-in antenna, an RF matching network (optimized for transmit power efficiency), supply decoupling and filtering components, an LC tank for DC-DC conversion, a 39 MHz reference crystal, and an RF shield. Also, it supports the use of an external 32 kHz crystal as a low frequency reference signal via GPIO pins for use cases demanding maximum energy efficiency. For designs where an external antenna solution may be beneficial, a module variant with a 50 Ω-matched RF pin instead of the built-in antenna is available (for 20 dBm TX power only). Because the RF matching network is optimized for transmit power efficiency, modules rated for +20 dBm will show non-optimal current consumption and performance when operated at a lower output power (e.g. +10 or 0 dBm). Figure 3.1. MGM240P Block Diagram - Built-in Antenna Variant Figure 3.2. MGM240P Block Diagram - RF pin Variant MGM240P Multi-Protocol Wireless Module Data Sheet System Overview silabs.com | Building a more connected world. Rev. 1.0 | 7

A simplified internal schematic for the MGM240P module is shown in Figure 3.3 MGM240P Module Schematic on page 8. 4.7µF 2.2µF 4.7µF DVDD RFVDD PAVDD VREGIN DECOUPLE VDD 2G4RF1 Matching Network EFR32xG24 HFXTAL_I HFXTAL_O PA0x (x:0-8) PB0x (x:0-4) PC0x (x:0-7) PD0x (x:0-3) PA0x PB0x PC0x PD0x IOVDD VREGSW 2.2µH RESET AVDD RESET 0.1µF RFOUT Figure 3.3. MGM240P Module Schematic

3.2 EFR32MG24 SoC

SoC features a 32-bit ARM Cortex M33 core, a 2.4 GHz high-performance radio, 1536 kB of Flash memory, 256 kB of RAM, a dedicated core for security, a rich set of MCU peripherals, and various clock management and serial interfacing options. See the EFR32xG24 Reference Manual and EFR32MG24 Data Sheet for details.

3.3 Antenna

MGM240P modules come with two antenna solution variants: A built-in antenna or a 50 Ω-matched RF pin to support an external an- tenna. Typical performance characteristics for the built-in antenna are detailed in the table below. See 4.18 Antenna Radiation and Effi- ciency and 11.1 Qualified Antennas for other relevant details. Table 3.1. Antenna Efficiency and Peak Gain Parameter With optimal layout Note Efficiency -1 dB Antenna efficiency, gain and radiation pattern are highly depend- ent on the application PCB layout and mechanical design. Refer to 7. Design Guidelines for recommendations to achieve optimal antenna performance. Peak gain 1.82 dBi

3.4 Power Supply

requires a single nominal supply level (VDD) to operate and supports an operating range of 1.8 to 3.8 V. The nominal level needed for +10 dBm devices (Model: MGM240P22A) is 3.0 V whereas +20 dBm devices (Model: MGM240P32A, MGM240P32N) require 3.3 V in order to achieve higher TX output power. All necessary decoupling, filtering and DC-DC-related components are inclu- ded in the module. Note: The power amplifier for +10 dBm modules is supplied through an internal LDO, and thus is independent of the VDD supply. Re- spectively, the power amplifier for +20 dBm modules is supplied through the VDD pin with a target level of 3.3 V. MGM240P Multi-Protocol Wireless Module Data Sheet System Overview silabs.com | Building a more connected world. Rev. 1.0 | 8

3.5 General Purpose Input/Output (GPIO)

has up to 26 General Purpose Input/Output pins. Each GPIO pin can be individually configured as either an output or input. More advanced configurations including open-drain, open-source, and glitch-filtering can be configured for each individual GPIO pin. The GPIO pins can be overridden by peripheral connections, like SPI communication. Each peripheral connection can be routed to several GPIO pins on the device. The input value of a GPIO pin can be routed through the Peripheral Reflex System to other peripher- als. The GPIO subsystem supports asynchronous external pin interrupts. All of the pins on ports A and port B are EM2 capable. These pins may be used by Low-Energy peripherals in EM2/3 and may also be used as EM2/3 pin wake-ups. Pins on ports C and D are latched/retained in their current state when entering EM2 until EM2 exit upon which internal peripherals could once again drive those pads. A few GPIOs also have EM4 wake functionality. These pins are listed in the Table 6.2 GPIO Alternate Functions Table on page 38.

3.6 Security

MGM240P modules support one of two levels in the Security Portfolio offered by Silicon Labs: Secure Vault Mid or Secure Vault High. Secure Vault is a collection of technologies that deliver state-of-the-art security and upgradability features to protect and future-proof IoT devices against costly threats, attacks, and tampering. A dedicated security CPU enables the Secure Vault functions and isolates cryptographic functions and data from the Cortex-M33 core. MGM240P B part numbers support Secure Vault High and MGM240P A part numbers support Secure Vault Mid. Table 3.2. Secure Vault Features Feature Secure Vault Mid Secure Vault High True Random Number Generator (TRNG) Yes Yes Secure Boot with Root of Trust and Secure Loader (RTSL) Yes Yes Secure Debug with Lock/Unlock Yes Yes DPA Countermeasures Yes Yes Anti-Tamper Yes Secure Attestation Yes Secure Key Management Yes Symmetric Encryption • AES 128 / 192 / 256 bit ECB, CTR, CBC, CFB, CCM, GCM, CBC-MAC, and GMAC

AES 128 / 192 / 256 bit ECB, CTR, CBC, CFB, CCM, GCM, CBC-MAC, and GMAC
ChaCha20 Public Key Encryption - ECDSA / ECDH / EdDSA
p192 and p256 • p192, p256, p384 and p521 Curve25519 (ECDH)
Ed25519 (EdDSA) Key Derivation • ECJ-PAKE p192 and p256 • ECJ-PAKE p192, p256, p384, and p521 PBKDF2
HKDF Hashes • SHA-1 SHA-2/256
SHA-1 SHA-2 256, 384, and 512
Poly1305 MGM240P Multi-Protocol Wireless Module Data Sheet System Overview silabs.com | Building a more connected world. Rev. 1.0 | 9

3.6.1 Secure Boot with Root of Trust and Secure Loader (RTSL)

The Secure Boot with RTSL authenticates a chain of trusted firmware that begins from an immutable memory (ROM). It prevents malware injection, prevents rollback, ensures that only authentic firmware is executed, and protects Over The Air updates. For more information about this feature, see AN1218: Series 2 Secure Boot with RTSL.

3.6.2 Cryptographic Accelerator

Cryptographic Accelerator is an autonomous hardware accelerator with Differential Power Analysis (DPA) countermeasures to pro- tect keys. It supports AES encryption and decryption with 128/192/256-bit keys, ChaCha20 encryption, and Elliptic Curve Cryptography (ECC) to support public key operations, and hashes. Supported block cipher modes of operation for AES include:

ECB (Electronic Code Book)
CTR (Counter Mode)
CBC (Cipher Block Chaining)
CFB (Cipher Feedback)
GCM (Galois Counter Mode)
CCM (Counter with CBC-MAC)
CBC-MAC (Cipher Block Chaining Message Authentication Code)
GMAC (Galois Message Authentication Code) The Cryptographic Accelerator accelerates Elliptical Curve Cryptography and supports the NIST (National Institute of Standards and Technology) recommended curves including P-192, P-256, P-384, and P-521 for ECDH (Elliptic Curve Diffie-Hellman) key derivation, and ECDSA (Elliptic Curve Digital Signature Algorithm) sign and verify operations. Also supported is the non-NIST Curve25519 for ECDH and Ed25519 for EdDSA (Edwards-curve Digital Signature Algorithm) sign and verify operations. Secure Vault also supports ECJ-PAKE (Elliptic Curve variant of Password Authenticated Key Exchange by Juggling) and PBKDF2 (Password-Based Key Derivation Function 2). Supported hashes include SHA-1, SHA-2/256/384/512 and Poly1305. This implementation provides a fast and energy efficient solution to state of the art cryptographic needs.

3.6.3 True Random Number Generator

The True Random Number Generator module is a non-deterministic random number generator that harvests entropy from a thermal energy source. It includes start-up health tests for the entropy source as required by NIST SP800-90B and AIS-31 as well as online health tests required for NIST SP800-90C. The TRNG is suitable for periodically generating entropy to seed an approved pseudo random number generator.

3.6.4 Secure Debug with Lock/Unlock

For obvious security reasons, it is critical for a product to have its debug interface locked before being released in the field. In addition, Secure Vault High also provides a secure debug unlock function that allows authenticated access based on public key cryp- tography. This functionality is particularly useful for supporting failure analysis while maintaining confidentiality of IP and sensitive end- user data. For more information about this feature, see AN1190: Series 2 Secure Debug.

3.6.5 DPA Countermeasures

The AES and ECC accelerators have Differential Power Analysis (DPA) countermeasures support. This makes it very expensive from a time and effort standpoint to use DPA to recover secret keys. MGM240P Multi-Protocol Wireless Module Data Sheet System Overview silabs.com | Building a more connected world. Rev. 1.0 | 10

3.6.6 Secure Key Management with PUF

material in Secure Vault High products is protected by "key wrapping" with a standardized symmetric encryption mechanism. This method has the advantage of protecting a virtually unlimited number of keys, limited only by the storage that is accessible by the Cortex-M33, which includes off-chip storage as well. The symmetric key used for this wrapping and unwrapping must be highly secure because it can expose all other key materials in the system. The Secure Vault Key Management system uses a Physically Unclonable Function (PUF) to generate a persistent device-unique seed key on power up to dynamically generate this critical wrapping/unwrapping key which is only visible to the AES encryption engine and is not retained when the device loses power.

3.6.7 Anti-Tamper

Secure Vault High devices provide internal tamper protection which monitors parameters such as voltage, temperature, and electro- magnetic pulses as well as detecting tamper of the security sub-system itself. Additionally, 8 external configurable tamper pins support external tamper sources, such as enclosure tamper switches. For each tamper event, the user is able to select the severity of the tamper response ranging from an interrupt, to a reset, to destroying the PUF reconstruction data which will make all protected key materials un-recoverable and effectively render the device inoperable. The tamper system also has an internal resettable event counter with programmable trigger threshold and refresh periods to mitigate false positive tamper events. For more information about this feature, see AN1247: Anti-Tamper Protection Configuration and Use.

3.6.8 Secure Attestation

Secure Vault High products support Secure Attestation, which begins with a secure identity that is created during the Silicon Labs man- ufacturing process. During device production, each device generates its own public/private keypair and securely stores the wrapped private key into immutable OTP memory and this key never leaves the device. The corresponding public key is extracted from the de- vice and inserted into a binary DER-encoded X.509 device certificate, which is signed into a Silicon Labs CA chain and then program- med back into the chip into an immutable OTP memory. The secure identity can be used to authenticate the chip at any time in the life of the product. The production certification chain can be requested remotely from the product. This certification chain can be used to verify that the device was authentically produced by Silicon Labs. The device unique public key is also bound to the device certificate in the certification chain. A challenge can be sent to the chip at any point in time to be signed by the device private key. The public key in the device certificate can then be used to verify the chal- lenge response, proving that the device has access to the securely-stored private key, which prevents counterfeit products or imperso- nation attacks. For more information about this feature, see AN1268: Authenticating Silicon Labs Devices Using Device Certificates. MGM240P Multi-Protocol Wireless Module Data Sheet System Overview silabs.com | Building a more connected world. Rev. 1.0 | 11

Electrical Specifications All electrical parameters in all tables are specified under the following conditions, unless stated otherwise: Typical values are based on TA=25 °C and VDD supply at 3.0 V, by production test and/or technology characterization.

Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output pow- er-specific external RF impedance-matching networks for interfacing to a 50 Ω antenna.
Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature, unless stated otherwise.

4.1 Absolute Maximum Ratings

Table 4.1. Absolute Maximum Ratings Parameter Symbol Test Condition Min Typ Max Unit Storage temperature range T STG -40 — +105 °C Voltage on any supply pin V DDMAX -0.3 — 3.8 V Voltage ramp rate on any supply pin VDDRAMPMAX — — 1.0 V / µs DC voltage on any GPIO pin V DIGPIN -0.3 — V VDD + 0.3 V DC voltage on RESETn pin1 VRESETn -0.3 — 3.8 V Absolute voltage on RFOUT pin VMAX2G4 -0.3 — V VDD + 0.3 V Total current into VDD pin I VDDMAX Source — — 200 mA Total current into GND pin I VSSMAX Sink — — 200 mA Current per I/O pin IIOMAX Sink — — 50 mA Source — — 50 mA Current for all I/O pins I IOALLMAX Sink — — 200 mA Source — — 200 mA Note: The RESETn pin has a pull-up device to the internal DVDD supply. For minimum leakage, RESETn should not exceed the volt- age at DVDD, which is generated by the DC-DC converter. DVDD is equal to 1.8 V when DC-DC is active and bypassed to VDD when DC-DC is inactive. MGM240P Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 12

4.2 General Operating Conditions

Table 4.2. General Operating Conditions Parameter Symbol Test Condition Min Typ Max Unit Operating ambient tempera- ture range TA -40 — +105 °C VDD operating supply volt- age VVDD 10 dBm Module, DC-DC in regula- tion 2.2 3.0 3.8 V 20 dBm Module, DC-DC in regula- tion 2.2 3.3 3.8 V 10 dBm Module, DC-DC in by- pass 1.8 3.0 3.8 V 20 dBm Module, DC-DC in by- pass 1.8 3.3 3.8 V HCLK and SYSCLK frequen- cy fHCLK VSCALE2, MODE = WS1 — — 78 MHz VSCALE2, MODE = WS0 — — 40 MHz EM01 Group A clock fre- quency fEM01GRPACLK VSCALE2 — — 78 MHz VSCALE1 — — 40 MHz EM01 Group C clock fre- quency fEM01GRPCCLK VSCALE2 — — 78 MHz VSCALE1 — — 40 MHz Radio HCLK frequency f RHCLK VSCALE2 or VSCALE1 — 39.0 — MHz MGM240P Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 13

4.3 MCU current consumption at 3.0 V Unless otherwise indicated, typical conditions are: VDD = 3.0 V, DC-DC in regulation. Voltage scaling level = VSCALE1. T A = 25 °C. Minimum and maximum values in this table represent the worst conditions across process variation at TA = 25 °C. Table 4.3. MCU current consumption at 3.0 V Parameter Symbol Test Condition Min Typ Max Unit Current consumption in EM0 mode with all peripherals dis- abled IACTIVE 78 MHz HFRCO w/ DPLL refer- enced to 39 MHz crystal, CPU running Prime from flash, VSCALE2 — 33.3 — µA/MHz

78 MHz HFRCO w/ DPLL refer-

enced to 39 MHz crystal, CPU running while loop from flash, VSCALE2 — 32.8 — µA/MHz enced to 39 MHz crystal, CPU running CoreMark loop from flash, VSCALE2 — 49.1 — µA/MHz

39 MHz crystal, CPU running

— 33.9 — µA/MHz — 33.4 — µA/MHz — 49.4 — µA/MHz

38 MHz HFRCO, CPU running

— 28.1 — µA/MHz Current consumption in EM1 mode with all peripherals dis- abled IEM1 78 MHz HFRCO w/ DPLL refer- enced to 39 MHz crystal, VSCALE2 — 22.6 — µA/MHz 39 MHz crystal — 24.4 — µA/MHz 38 MHz HFRCO — 19.0 — µA/MHz Current consumption in EM2 mode, VSCALE0 IEM2_VS 256 kB RAM and full Radio RAM retention, RTC running from LFXO1 — 2.9 — µA 256 kB RAM and full Radio RAM retention, RTC running from LFRCO1 — 2.9 — µA 16 kB RAM and full Radio RAM retention, RTC running from LFXO1 — 1.3 — µA 16 kB RAM and full Radio RAM retention, RTC running from LFRCO1 — 1.3 — µA 16 kB RAM and full Radio RAM retention, RTC running from LFRCO in precision mode1 — 1.9 — µA MGM240P Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 14

Parameter Symbol Test Condition Min Typ Max Unit Current consumption in EM3 mode, VSCALE0 IEM3_VS 256 kB RAM and full Radio RAM retention, RTC running from ULFRCO1 — 2.7 — µA 16 kB RAM and full Radio RAM retention, RTC running from ULFRCO1 — 1.1 — µA Current consumption in EM4 mode IEM4 No BURTC, no LF oscillator — 0.27 — µA BURTC with LFXO — 0.64 — µA Current consumption during reset IRST Hard pin reset held — 467 — µA Note: CPU cache retained, EM0/1 peripheral states retained 4.4 Radio Current Consumption with 3.0 V Supply RF current consumption measured with MCU in EM1 and all MCU peripherals disabled. Unless otherwise indicated, typical conditions are: VDD = 3.0 V, DC-DC in regulation. TA = 25 °C. Table 4.4. Radio Current Consumption with 3.0 V Supply Parameter Symbol Test Condition Min Typ Max Unit Current consumption in re- ceive mode, active packet reception, VSCALE1, EM1P IRX_ACTIVE 125 kbit/s, 2GFSK, f = 2.4 GHz — 4.8 — mA 500 kbit/s, 2GFSK, f = 2.4 GHz — 4.9 — mA 1 Mbit/s, 2GFSK, f = 2.4 GHz — 4.5 — mA 2 Mbit/s, 2GFSK, f = 2.4 GHz — 5.2 — mA 802.15.4, f = 2.4 GHz — 5.3 — mA Current consumption in re- ceive mode, listening for packet, VSCALE1, EM1P IRX_LISTEN 125 kbit/s, 2GFSK, f = 2.4 GHz — 4.8 — mA 500 kbit/s, 2GFSK, f = 2.4 GHz — 4.8 — mA 1 Mbit/s, 2GFSK, f = 2.4 GHz — 4.5 — mA 2 Mbit/s, 2GFSK, f = 2.4 GHz — 5.2 — mA 802.15.4, f = 2.4 GHz — 5.2 — mA Current consumption in transmit mode ITX f = 2.4 GHz, CW, 20 dBm output power, VDD = 3.3 V — 158 — mA f = 2.4 GHz, CW, 10 dBm output power — 18.8 — mA f = 2.4 GHz, CW, 0 dBm output power — 4.8 — mA MGM240P Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 15

4.5 RF Transmitter General Characteristics for the 2.4 GHz Band Table 4.5. RF Transmitter General Characteristics for the 2.4 GHz Band Parameter Symbol Test Condition Min Typ Max Unit RF tuning frequency range F RANGE 2402 — 2480 MHz Maximum TX power1 POUTMAX 20 dBm, VDD = 3.3 V2 — 19.9 — dBm 10 dBm — 10 — dBm 0 dBm — -0.3 — dBm Minimum active TX power POUT MIN 20 dBm, VDD = 3.3 V — -33.7 — dBm 10 dBm — -30 — dBm 0 dBm — -24 — dBm Output power step size POUT STEP 0 dBm 0.1 0.7 9.9 dB 10 dBm, -5 dBm < Output power < 0 dBm 0.6 1.1 1.8 dB 10 dBm, 0 dBm < Output power < 10 dBm 0.1 0.3 0.8 dB 20 dBm, VDD = 3.3 V, Output power < 0 dBm 0.9 3.6 14.4 dB 20 dBm, 0 dBm < Output power < 20 dBm 0.1 0.2 1.3 dB Output power variation vs supply voltage variation, fre- quency = 2450 MHz POUTVAR_V 20 dBm output power with VDD voltage swept from 1.8 V to 3.8 V — 5.4 — dB 10 dBm output power with VDD voltage swept from 1.8 V to 3.8 V — 0.05 — dB 0 dBm output power with VDD voltage swept from 1.8 V to 3.8 V — 0.01 — dB Output power variation vs temperature, Frequency =

2450 MHz

POUTVAR_T 20 dBm, VDD = 3.3 V, (-40 to +105 °C) — 0.2 — dB Output power variation over the RF tuning frequency range POUTVAR_F 20 dBm, VDD = 3.3 V — 0.2 — dB 10 dBm — 0.2 — dB 0 dBm — 0.2 — dB Note: Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices cov- ered in this data sheet can be found in the TX Power column of the Ordering Information Table. 2. The maximum output power for Bluetooth Low Energy is limited to 19.6 dBm for compliance with the Bluetooth Core Specifica- tion. MGM240P Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 16

4.6 RF Transmitter Characteristics for 802.15.4 DSSS-OQPSK in the 2.4 GHz Band Parameter Symbol Test Condition Min Typ Max Unit Error vector magnitude per 802.15.4-2011 EVM 20 dBm, VDD = 3.3 V, Average across frequency, signal is DSSS- OQPSK reference packet — 3.1 — % rms 10 dBm, Average across frequen- cy, signal is DSSS-OQPSK refer- ence packet — 2.9 — % rms 0 dBm, Average across frequen- cy, signal is DSSS-OQPSK refer- ence packet — 3.0 — % rms 4.7 RF Receiver General Characteristics for the 2.4 GHz Band Table 4.7. RF Receiver General Characteristics for the 2.4 GHz Band Parameter Symbol Test Condition Min Typ Max Unit RF tuning frequency range F RANGE 2402 — 2480 MHz MGM240P Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 17

4.8 Receiver Characteristics for 802.15.4 DSSS-OQPSK in the 2.4 GHz Band Parameter Symbol Test Condition Min Typ Max Unit Max usable receiver input level, 1% PER SAT Signal is reference signal1, packet length is 20 octets — 10 — dBm Sensitivity, 1% PER SENS 10 dBm Module, Signal is refer- ence signal. Packet length is 20 octets — -106 — dBm 20 dBm Module, Signal is refer- ence signal. Packet length is 20 octets — -105.2 — dBm Co-channel interferer rejec- tion, 1% PER CCR Desired signal 3 dB above sensi- tivity limit — -0.7 — dB Adjacent channel rejection, Interferer is reference signal, 1% PER, desired is refer- ence signal at 3 dB above reference sensitivity level2 ACRREF1 Interferer is reference signal at +1 channel spacing — 36.8 — dB Interferer is reference signal at -1 channel spacing — 37.5 — dB Alternate channel rejection, interferer is reference signal, 1% PER, desired is refer- ence signal at 3 dB above reference sensitivity level2 ACRREF2 Interferer is reference signal at +2 channel spacing — 48.9 — dB Interferer is reference signal at -2 channel spacing — 49.4 — dB Image rejection, 1% PER, desired is reference signal at 3 dB above reference sensi- tivity level2 IR Interferer is CW in image band3 — 53.5 — dB Blocking rejection of all other channels, 1% PER, desired is reference signal at 3 dB above reference sensitivity level2, interferer is reference signal BLOCK Interferer frequency < desired fre- quency -3 channel spacing — 55.3 — dB Interferer frequency > desired fre- quency +3 channel spacing — 55.1 — dB RSSI resolution RSSIRES -100 dBm to +5 dBm — 0.25 — dB RSSI accuracy in the linear region as defined by 802.15.4-2003 RSSILIN — +/-6 — dB Note: Reference signal is defined as O-QPSK DSSS per 802.15.4, Frequency range = 2400-2483.5 MHz, Symbol rate = 62.5 ksym- bols/s. 2. Reference sensitivity level is -85 dBm. 3. Due to low-IF frequency, there is some overlap of adjacent channel and image channel bands. Adjacent channel CW blocker tests place the Interferer center frequency at the Desired frequency ± 5 MHz on the channel raster, whereas the image rejection test places the CW interferer near the image frequency of the Desired signal carrier, regardless of the channel raster. MGM240P Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 18

4.9 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate Table 4.9. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate Parameter Symbol Test Condition Min Typ Max Unit Max usable receiver input level SAT Signal is reference signal1 — 10 — dBm Sensitivity SENS 10 dBm Module, Signal is refer- ence signal, 37 byte payload1 — -98.5 — dBm 10 dBm Module, Signal is refer- ence signal, 255 byte payload1 — -96.9 — dBm 10 dBm Module, With non-ideal signals2 1 — -96.5 — dBm 20 dBm Module, Signal is refer- ence signal, 37 byte payload1 — -97.6 — dBm 20 dBm Module, Signal is refer- ence signal, 255 byte payload1 — -96 — dBm 20 dBm Module, With non-ideal signals2 1 — -95.6 — dBm Signal to co-channel interfer- er C/ICC (see notes)1 3 — 8.7 — dB N ± 1 Adjacent channel se- lectivity C/I1 Interferer is reference signal at +1 MHz offset1 4 3 5 — -5.4 — dB Interferer is reference signal at -1 MHz offset1 4 3 5 — -5.3 — dB N ± 2 Alternate channel se- lectivity C/I2 Interferer is reference signal at +2 MHz offset1 4 3 5 — -40.9 — dB Interferer is reference signal at -2 MHz offset1 4 3 5 — -39.7 — dB N ± 3 Alternate channel se- lectivity C/I3 Interferer is reference signal at +3 MHz offset1 4 3 5 — -45.5 — dB Interferer is reference signal at -3 MHz offset1 4 3 5 — -45.7 — dB Selectivity to image frequen- cy C/IIM Interferer is reference signal at im- age frequency with 1 MHz preci- sion1 5 — -23.3 — dB Selectivity to image frequen- cy ± 1 MHz C/IIM_1 Interferer is reference signal at im- age frequency +1 MHz with 1 MHz precision1 5 — -40.9 — dB Interferer is reference signal at im- age frequency -1 MHz with 1 MHz precision1 5 — -5.4 — dB Intermodulation performance IM n = 3 (see note6) — -17.3 — dBm MGM240P Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 19

Parameter Symbol Test Condition Min Typ Max Unit Note: 0.017% Bit Error Rate. 3. Desired signal -67 dBm. 4. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz. 5. With allowed exceptions. 6. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4 MGM240P Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 20

4.10 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate Table 4.10. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate Parameter Symbol Test Condition Min Typ Max Unit Max usable receiver input level SAT Signal is reference signal1 — 10 — dBm Sensitivity SENS 10 dBm Module, Signal is refer- ence signal, 37 byte payload1 — -95.7 — dBm 10 dBm Module, Signal is refer- ence signal, 255 byte payload1 — -94.2 — dBm 10 dBm Module, With non-ideal signals2 1 — -93.9 — dBm 20 dBm Module, Signal is refer- ence signal, 37 byte payload1 — -94.8 — dBm 20 dBm Module, Signal is refer- ence signal, 255 byte payload1 — -93.3 — dBm 20 dBm Module, With non-ideal signals2 1 — -93.1 — dBm Signal to co-channel interfer- er C/ICC (see notes)1 3 — 8.6 — dB N ± 1 Adjacent channel se- lectivity C/I1 Interferer is reference signal at +2 MHz offset1 4 3 5 — -5.3 — dB Interferer is reference signal at -2 MHz offset1 4 3 5 — -5.8 — dB N ± 2 Alternate channel se- lectivity C/I2 Interferer is reference signal at +4 MHz offset1 4 3 5 — -42.2 — dB Interferer is reference signal at -4 MHz offset1 4 3 5 — -44.2 — dB N ± 3 Alternate channel se- lectivity C/I3 Interferer is reference signal at +6 MHz offset1 4 3 5 — -48.1 — dB Interferer is reference signal at -6 MHz offset1 4 3 5 — -50.2 — dB Selectivity to image frequen- cy C/IIM Interferer is reference signal at im- age frequency with 1 MHz preci- sion1 5 — -22.8 — dB Selectivity to image frequen- cy ± 2 MHz C/IIM_1 Interferer is reference signal at im- age frequency +2 MHz with 1 MHz precision1 5 — -42.2 — dB Interferer is reference signal at im- age frequency -2 MHz with 1 MHz precision1 5 — -5.3 — dB Intermodulation performance IM n = 3 (see note6) — -18.3 — dBm MGM240P Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 21

Parameter Symbol Test Condition Min Typ Max Unit Note: 0.017% Bit Error Rate. 3. Desired signal -64 dBm. 4. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz. 5. With allowed exceptions. 6. As specified in Bluetooth Core specification version 5.1, Vol 6, Part A, Section 4.4 MGM240P Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 22

4.11 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate Table 4.11. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate Parameter Symbol Test Condition Min Typ Max Unit Max usable receiver input level SAT Signal is reference signal1 — 10 — dBm Sensitivity SENS 10 dBm Module, Signal is refer- ence signal, 37 byte payload1 — -102.2 — dBm 10 dBm Module, Signal is refer- ence signal, 255 byte payload1 — -101 — dBm 10 dBm Module, With non-ideal signals2 1 — -100 — dBm 20 dBm Module, Signal is refer- ence signal, 37 byte payload1 — -101.4 — dBm 20 dBm Module, Signal is refer- ence signal, 255 byte payload1 — -100 — dBm 20 dBm Module, With non-ideal signals2 1 — -99 — dBm Signal to co-channel interfer- er C/ICC (see notes)1 3 — 2.7 — dB N ± 1 Adjacent channel se- lectivity C/I1 Interferer is reference signal at +1 MHz offset1 4 3 5 — -7.1 — dB Interferer is reference signal at -1 MHz offset1 4 3 5 — -7.4 — dB N ± 2 Alternate channel se- lectivity C/I2 Interferer is reference signal at +2 MHz offset1 4 3 5 — -46.8 — dB Interferer is reference signal at -2 MHz offset1 4 3 5 — -49.7 — dB N ± 3 Alternate channel se- lectivity C/I3 Interferer is reference signal at +3 MHz offset1 4 3 5 — -49.4 — dB Interferer is reference signal at -3 MHz offset1 4 3 5 — -54.5 — dB Selectivity to image frequen- cy C/IIM Interferer is reference signal at im- age frequency with 1 MHz preci- sion1 5 — -49 — dB Selectivity to image frequen- cy ± 1 MHz C/IIM_1 Interferer is reference signal at im- age frequency +1 MHz with 1 MHz precision1 5 — -49.4 — dB Interferer is reference signal at im- age frequency -1 MHz with 1 MHz precision1 5 — -46.8 — dB MGM240P Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 23

Parameter Symbol Test Condition Min Typ Max Unit Note: 0.017% Bit Error Rate. 3. Desired signal -72 dBm. 4. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz. 5. With allowed exceptions. MGM240P Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 24

4.12 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate Table 4.12. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate Parameter Symbol Test Condition Min Typ Max Unit Max usable receiver input level SAT Signal is reference signal1 — 10 — dBm Sensitivity SENS 10 dBm Module, Signal is refer- ence signal, 37 byte payload1 — -106.5 — dBm 10 dBm Module, Signal is refer- ence signal, 255 byte payload1 — -106.1 — dBm 10 dBm Module, With non-ideal signals2 1 — -105.7 — dBm 20 dBm Module, Signal is refer- ence signal, 37 byte payload1 — -105.6 — dBm 20 dBm Module, Signal is refer- ence signal, 255 byte payload1 — -105.3 — dBm 20 dBm Module, With non-ideal signals2 1 — -104.8 — dBm Signal to co-channel interfer- er C/ICC (see notes)1 3 — 0.9 — dB N ± 1 Adjacent channel se- lectivity C/I1 Interferer is reference signal at +1 MHz offset1 4 3 5 — -12.4 — dB Interferer is reference signal at -1 MHz offset1 4 3 5 — -12.8 — dB N ± 2 Alternate channel se- lectivity C/I2 Interferer is reference signal at +2 MHz offset1 4 3 5 — -52.6 — dB Interferer is reference signal at -2 MHz offset1 4 3 5 — -55.5 — dB N ± 3 Alternate channel se- lectivity C/I3 Interferer is reference signal at +3 MHz offset1 4 3 5 — -53.8 — dB Interferer is reference signal at -3 MHz offset1 4 3 5 — -60 — dB Selectivity to image frequen- cy C/IIM Interferer is reference signal at im- age frequency with 1 MHz preci- sion1 5 — -53 — dB Selectivity to image frequen- cy ± 1 MHz C/IIM_1 Interferer is reference signal at im- age frequency +1 MHz with 1 MHz precision1 5 — -53.8 — dB Interferer is reference signal at im- age frequency -1 MHz with 1 MHz precision1 5 — -52.6 — dB MGM240P Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 25

Parameter Symbol Test Condition Min Typ Max Unit Note: 0.017% Bit Error Rate. 3. Desired signal -79 dBm. 4. Desired frequency 2402 MHz ≤ Fc ≤ 2480 MHz. 5. With allowed exceptions.

4.13 High-Frequency Crystal

Table 4.13. High-Frequency Crystal Parameter Symbol Test Condition Min Typ Max Unit Crystal frequency fHFXTAL — 39 — MHz Initial calibrated accuracy ACC HFXTAL -10 +/-5 10 ppm Temperature drift DRIFTHFXTAL Across specified temperature range -20 — 20 ppm MGM240P Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 26

4.14 Low Frequency Crystal Oscillator

Table 4.14. Low Frequency Crystal Oscillator Parameter Symbol Test Condition Min Typ Max Unit Crystal Frequency FLFXO — 32.768 — kHz Supported Crystal equivalent series resistance (ESR) ESRLFXO GAIN = 0 — — 80 kΩ GAIN = 1 to 3 — — 100 kΩ Supported range of crystal load capacitance 1 CL_LFXO GAIN = 0 4 — 6 pF GAIN = 1 6 — 10 pF GAIN = 2 (see note2) 10 — 12.5 pF GAIN = 3 (see note2) 12.5 — 18 pF Current consumption I CL12p5 ESR = 70 kΩ, CL = 12.5 pF, GAIN3 = 2, AGC4 = 1 — 294 — nA Startup Time TSTARTUP ESR = 70 kΩ, CL = 7 pF, GAIN3 = 1, AGC4 = 1 — 52 — ms On-chip tuning cap step size SS LFXO — 0.26 — pF On-chip tuning capacitor val- ue at minimum setting5 CLFXO_MIN CAPTUNE = 0 — 5.2 — pF On-chip tuning capacitor val- ue at maximum setting5 CLFXO_MAX CAPTUNE = 0x4F — 26.2 — pF Note: Total load capacitance seen by the crystal 2. Crystals with a load capacitance of greater than 12 pF require external load capacitors. 3. In LFXO_CAL Register 4. In LFXO_CFG Register 5. The effective load capacitance seen by the crystal will be CLFXO/2. This is because each XTAL pin has a tuning cap and the two caps will be seen in series by the crystal MGM240P Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 27

4.15 Precision Low Frequency RC Oscillator (LFRCO)

Table 4.15. Precision Low Frequency RC Oscillator (LFRCO) Parameter Symbol Test Condition Min Typ Max Unit Nominal oscillation frequen- cy FLFRCO — 32.768 — kHz Frequency accuracy F LFRCO_ACC Normal mode -3 — 3 % Precision mode1, across operat- ing temperature range2 -500 — 500 ppm Startup time tSTARTUP Normal mode — 204 — µs Precision mode1 — 11.7 — ms Current consumption I LFRCO Normal mode — 189.9 — nA Precision mode1, T = stable at 25 °C 3 — 649.8 — nA Note: The LFRCO operates in high-precision mode when CFG_HIGHPRECEN is set to 1. High-precision mode is not available in EM4. 2. Includes ± 40 ppm frequency tolerance of the HFXO crystal. 3. Includes periodic re-calibration against HFXO crystal oscillator. MGM240P Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 28

4.16 GPIO Pins

Table 4.16. GPIO Pins Parameter Symbol Test Condition Min Typ Max Unit Leakage current ILEAK_IO MODEx = DISABLED, VDD = 3.0 V — 2.5 — nA Input low voltage1 VIL Any GPIO pin — — 0.3*VDD V RESETn — — 0.3 * DVDD V Input high voltage1 VIH Any GPIO pin 0.7*VDD — — V RESETn 0.7 * DVDD — — V Hysteresis of input voltage V HYS Any GPIO pin 0.05*VDD — — V RESETn 0.05 * DVDD — — V Output high voltage V OH Sourcing 20 mA, VDD = 3.0 V 0.8 * VDD — — V Output low voltage VOL Sinking 20 mA, VDD = 3.0 V — — 0.2 * VDD V GPIO rise time TGPIO_RISE VDD = 3.0 V, Cload = 50pF, SLEWRATE = 4, 10% to 90% — 8.4 — ns GPIO fall time TGPIO_FALL VDD = 3.0 V, Cload = 50pF, SLEWRATE = 4, 90% to 10% — 7.1 — ns Pull up/down resistance2 RPULL Any GPIO pin. Pull-up to VDD: MODEn = DISABLE DOUT=1. Pull-down to GND: MODEn = WIREDORPULLDOWN DOUT = 35 44 55 kΩ RESETn pin. Pull-up to DVDD 35 44 55 kΩ Maximum filtered glitch width T GF MODE = INPUT, DOUT = 1 — 27 — ns RESETn low time to ensure pin reset TRESET 100 — — ns Note: GPIO input thresholds are proportional to the VDD pin. RESETn input thresholds are proportional to the internal DVDD supply, which is generated by the DC-DC converter. DVDD is equal to 1.8 V when DC-DC is active and bypassed to VDD when DC-DC is inactive. 2. GPIO pull-ups connect to VDD supply, pull-downs connect to GND. RESETn pull-up connects to internal DVDD supply, which is generated by the DC-DC converter. DVDD is equal to 1.8 V when DC-DC is active and bypassed to VDD when DC-DC is inac- tive. MGM240P Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 29

4.17 Microcontroller Peripherals

The MCU peripherals set available in MGM240P modules includes:

ADC: 12-bit at 1 Msps, 16-bit at 76.9 ksps
16-bit and 32-bit Timers/Counters
24-bit Low Energy Timer for waveform generation
32-bit Real Time Counter
USART (UART/SPI/SmartCards/IrDA/I2S)
EUSART (UART/IrDA)
I2C peripheral interfaces
12 Channel Peripheral Reflex System For details on their electrical performance, consult the relevant portions of Section 4 in the SoC datasheet. To learn which GPIO ports provide access to every peripheral, consult 6.3 Analog Peripheral Connectivity and 6.4 Digital Peripheral Connectivity. MGM240P Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 30

4.18 Antenna Radiation and Efficiency

radiation patterns for the built-in antenna under optimal operating conditions are plotted in the figures that follow. Antenna gain and radiation patterns have a strong dependence on the size and shape of the application PCB the module is mounted on, as well as on the proximity of any mechanical design to the antenna. Z X Z Y X Figure 4.1. Typical 2D Antenna Radiation Patterns - Phi 0o (Side View) Gain (dBi) Z Y Z Y X Figure 4.2. Typical 2D Antenna Radiation Patterns - Phi 90o (Top View) Gain (dBi) MGM240P Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 31

Figure 4.5. Efficiency of the Built-in Antenna as Function of the Carrier Board Width(mm) MGM240P Multi-Protocol Wireless Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.0 | 33

Reference Diagrams

5.1 Network Co-Processor (NCP) Application with UART Host

can be controlled over the UART interface as a peripheral to an external host processor. Typical power supply, pro- gramming/debug interface, and host interface connections are shown in the figure below. For more details, see AN958: Debugging and Programming Interfaces for Custom Designs. Figure 5.1. UART NCP Configuration MGM240P Multi-Protocol Wireless Module Data Sheet Reference Diagrams silabs.com | Building a more connected world. Rev. 1.0 | 34

5.2 SoC Application

MGM240P can be used in a stand-alone SoC configuration without an external host processor. Typical power supply and program- ming/debug interface connections are shown in the figure below. For more details, see AN958: Debugging and Programming Interfaces for Custom Designs. Figure 5.2. Stand-Alone SoC Configuration Figure 5.3. Stand-Alone SoC Configuration with External Antenna MGM240P Multi-Protocol Wireless Module Data Sheet Reference Diagrams silabs.com | Building a more connected world. Rev. 1.0 | 35

Pin Definitions

6.1 Module Pinout

Figure 6.1. MGM240P Module Pinout The next table shows the MGM240P pinout and general descriptions for each pin. Refer to 6.2 Alternate Pin Functions, 6.3 Analog Peripheral Connectivity, and 6.4 Digital Peripheral Connectivity for details on functions and peripherals supported by each GPIO pin. Table 6.1. MGM240P Module Pin Definitions Pin Name No. Description Pin Name No. Description GND 1 Ground PB04 2 GPIO PB03 3 GPIO PB02 4 GPIO PB01 5 GPIO PB00 6 GPIO PA00 7 GPIO PA01 8 GPIO PA02 9 GPIO PA03 10 GPIO PA04 11 GPIO PA05 12 GPIO PA06 13 GPIO GND 14 Ground VDD 15 Power supply PA07 16 GPIO PA08 17 GPIO PD03 18 GPIO PD02 19 GPIO PD01 20 GPIO PD00 21 GPIO PC00 22 GPIO GND 23 Ground PC01 24 GPIO PC02 25 GPIO PC03 26 GPIO PC04 27 GPIO PC05 28 GPIO PC06 29 GPIO PC07 30 GPIO MGM240P Multi-Protocol Wireless Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.0 | 36

Pin Name No. Description Pin Name No. Description RESETn 31 Reset Pin. The RESETn pin is pulled up to an internal DVDD supply. An external pull-up is not recommended. To apply an external reset source to this pin, it is required to only drive this pin low during reset, and let the internal pull-up ensure that reset is released. The RESETn pin can be left unconnected if no external reset switch or source is used. GND 32 Ground RFOUT 33 RF input/output GND 34 Ground GND 35 Ground GND 36 Ground MGM240P Multi-Protocol Wireless Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.0 | 37

6.2 Alternate Pin Functions

GPIOs support alternate functions like debugging, wake-up from EM4, external low frequency crystal access, etc.. The following table shows which module pins have alternate capabilities and the functions they support. Refer to the SoC's reference manual for more details. Table 6.2. GPIO Alternate Functions Table GPIO Alternate Functions PA00 IADC0.VREFP PA01 GPIO.SWCLK PA02 GPIO.SWDIO PA03 GPIO.SWV GPIO.TDO GPIO.TRACEDATA0 PA04 GPIO.TDI GPIO.TRACECLK PA05 GPIO.TRACEDATA1 GPIO.EM4WU0 PA06 GPIO.TRACEDATA2 PA07 GPIO.TRACEDATA3 PB00 VDAC0.VDAC_CH0_MAIN_OU TPUT PB01 GPIO.EM4WU3 VDAC0.VDAC_CH1_MAIN_OU TPUT PB02 VDAC1.VDAC_CH0_MAIN_OU TPUT PB03 GPIO.EM4WU4 VDAC1.VDAC_CH1_MAIN_OU TPUT PC00 GPIO.EM4WU6 PC01 GPIO.EFP_TX_SDA PC02 GPIO.EFP_TX_SCL PC05 GPIO.EFP_INT GPIO.EM4WU7 PC07 GPIO.EM4WU8 GPIO.THMSW_EN GPIO.THMSW_HALFSWITCH PD00 LFXO.LFXTAL_O PD01 LFXO.LFXTAL_I LFXO.LF_EXTCLK PD02 GPIO.EM4WU9 MGM240P Multi-Protocol Wireless Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.0 | 38

6.3 Analog Peripheral Connectivity

analog resources are routable and can be connected to numerous GPIO's. The table below indicates which peripherals are avali- able on each GPIO port. When a differential connection is being used positive inputs are restricted to the EVEN pins and negative in- puts are restricted to the ODD pins. When a single ended connection is being used positive input is avaliable on all pins. See the SoC's Reference Manual for more details on the ABUS and analog peripherals. Table 6.3. ABUS Routing Table Peripheral Signal PA PB PC PD EVEN ODD EVEN ODD EVEN ODD EVEN ODD ACMP0 ANA_NEG Yes Yes Yes Yes Yes Yes Yes Yes ANA_POS Yes Yes Yes Yes Yes Yes Yes Yes ACMP1 ANA_NEG Yes Yes Yes Yes Yes Yes Yes Yes ANA_POS Yes Yes Yes Yes Yes Yes Yes Yes IADC0 ANA_NEG Yes Yes Yes Yes Yes Yes Yes Yes ANA_POS Yes Yes Yes Yes Yes Yes Yes Yes VDAC0 VDAC_CH0_ABUS_OUT- PUT Yes Yes Yes Yes Yes Yes Yes Yes VDAC_CH1_ABUS_OUT Yes Yes Yes Yes Yes Yes Yes Yes VDAC1 VDAC_CH0_ABUS_OUT- PUT Yes Yes Yes Yes Yes Yes Yes Yes VDAC_CH1_ABUS_OUT Yes Yes Yes Yes Yes Yes Yes Yes MGM240P Multi-Protocol Wireless Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.0 | 39

6.4 Digital Peripheral Connectivity

digital resources are routable and can be connected to numerous GPIO's. The table below indicates which peripherals are avalia- ble on each GPIO port. Table 6.4. DBUS Routing Table Peripheral.Resource PORT PA PB PC PD ACMP0.DIGOUT Available Available Available Available ACMP1.DIGOUT Available Available Available Available CMU.CLKIN0 Available Available CMU.CLKOUT0 Available Available CMU.CLKOUT1 Available Available CMU.CLKOUT2 Available Available EUSART0.CS Available Available EUSART0.CTS Available Available EUSART0.RTS Available Available EUSART0.RX Available Available EUSART0.SCLK Available Available EUSART0.TX Available Available EUSART1.CS Available Available Available Available EUSART1.CTS Available Available Available Available EUSART1.RTS Available Available Available Available EUSART1.RX Available Available Available Available EUSART1.SCLK Available Available Available Available EUSART1.TX Available Available Available Available FRC.DCLK Available Available FRC.DFRAME Available Available FRC.DOUT Available Available HFXO0.BUFOUT_REQ_IN_ASYNC Available Available I2C0.SCL Available Available Available Available I2C0.SDA Available Available Available Available I2C1.SCL Available Available I2C1.SDA Available Available KEYSCAN.COL_OUT_0 Available Available Available Available KEYSCAN.COL_OUT_1 Available Available Available Available KEYSCAN.COL_OUT_2 Available Available Available Available KEYSCAN.COL_OUT_3 Available Available Available Available KEYSCAN.COL_OUT_4 Available Available Available Available MGM240P Multi-Protocol Wireless Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.0 | 40

Peripheral.Resource PORT PA PB PC PD KEYSCAN.COL_OUT_5 Available Available Available Available KEYSCAN.COL_OUT_6 Available Available Available Available KEYSCAN.COL_OUT_7 Available Available Available Available KEYSCAN.ROW_SENSE_0 Available Available KEYSCAN.ROW_SENSE_1 Available Available KEYSCAN.ROW_SENSE_2 Available Available KEYSCAN.ROW_SENSE_3 Available Available KEYSCAN.ROW_SENSE_4 Available Available KEYSCAN.ROW_SENSE_5 Available Available LETIMER0.OUT0 Available Available LETIMER0.OUT1 Available Available MODEM.ANT0 Available Available Available Available MODEM.ANT1 Available Available Available Available MODEM.ANT_ROLL_OVER Available Available MODEM.ANT_RR0 Available Available MODEM.ANT_RR1 Available Available MODEM.ANT_RR2 Available Available MODEM.ANT_RR3 Available Available MODEM.ANT_RR4 Available Available MODEM.ANT_RR5 Available Available MODEM.ANT_SW_EN Available Available MODEM.ANT_SW_US Available Available MODEM.ANT_TRIG Available Available MODEM.ANT_TRIG_STOP Available Available MODEM.DCLK Available Available MODEM.DIN Available Available MODEM.DOUT Available Available PCNT0.S0IN Available Available PCNT0.S1IN Available Available PRS.ASYNCH0 Available Available PRS.ASYNCH1 Available Available PRS.ASYNCH2 Available Available PRS.ASYNCH3 Available Available PRS.ASYNCH4 Available Available PRS.ASYNCH5 Available Available PRS.ASYNCH6 Available Available MGM240P Multi-Protocol Wireless Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.0 | 41

Peripheral.Resource PORT PA PB PC PD PRS.ASYNCH7 Available Available PRS.ASYNCH8 Available Available PRS.ASYNCH9 Available Available PRS.ASYNCH10 Available Available PRS.ASYNCH11 Available Available PRS.ASYNCH12 Available Available PRS.ASYNCH13 Available Available PRS.ASYNCH14 Available Available PRS.ASYNCH15 Available Available PRS.SYNCH0 Available Available Available Available PRS.SYNCH1 Available Available Available Available PRS.SYNCH2 Available Available Available Available PRS.SYNCH3 Available Available Available Available RAC.LNAEN Available Available Available Available RAC.PAEN Available Available Available Available TIMER0.CC0 Available Available Available Available TIMER0.CC1 Available Available Available Available TIMER0.CC2 Available Available Available Available TIMER0.CDTI0 Available Available Available Available TIMER0.CDTI1 Available Available Available Available TIMER0.CDTI2 Available Available Available Available TIMER1.CC0 Available Available Available Available TIMER1.CC1 Available Available Available Available TIMER1.CC2 Available Available Available Available TIMER1.CDTI0 Available Available Available Available TIMER1.CDTI1 Available Available Available Available TIMER1.CDTI2 Available Available Available Available TIMER2.CC0 Available Available TIMER2.CC1 Available Available TIMER2.CC2 Available Available TIMER2.CDTI0 Available Available TIMER2.CDTI1 Available Available TIMER2.CDTI2 Available Available TIMER3.CC0 Available Available TIMER3.CC1 Available Available TIMER3.CC2 Available Available MGM240P Multi-Protocol Wireless Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.0 | 42

Peripheral.Resource PORT PA PB PC PD TIMER3.CDTI0 Available Available TIMER3.CDTI1 Available Available TIMER3.CDTI2 Available Available TIMER4.CC0 Available Available TIMER4.CC1 Available Available TIMER4.CC2 Available Available TIMER4.CDTI0 Available Available TIMER4.CDTI1 Available Available TIMER4.CDTI2 Available Available USART0.CLK Available Available Available Available USART0.CS Available Available Available Available USART0.CTS Available Available Available Available USART0.RTS Available Available Available Available USART0.RX Available Available Available Available USART0.TX Available Available Available Available MGM240P Multi-Protocol Wireless Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.0 | 43

Design Guidelines

7.1 Layout and Placement

For optimal performance of the MGM240P,

Place the module aligned to the edge of the application PCB, as illustrated in the figures below.
Optional on the module with the RF pin.
Leave the antenna clearance area void of any traces, components, or copper on all layers of the application PCB if you are going to use the built-in antenna.
Antenna clearance area is not necessary if you are using an external antenna attached to the RF pin.
RFOUT can be left floating if not used.
Antennas external to the module, either connectorized off-the-shelf antennas or PCB trace antennas, must be well-matched to 50 Ω.
For external antenna use cases, use a 50 Ω grounded coplanar transmission line to trace the signal from the RF pin to an exter- nal RF connector if applicable (see Figure 7.2 Recommended Layout for MGM240P Using External Antenna on page 45).
A general rule is to use 50 Ω transmission lines where the length of the RF trace is longer than λ/16 at the fundamental frequen- cy, which for 2.4 GHz is approximately 3.5 mm.
A U.FL connector can be used in the host PCB for the connection to an external antenna. The use of a U.FL connector is also recommended for conductive tests. The integrator must use a unique connector, such as a “reverse polarity SMA” or “reverse thread SMA”, if detachable antenna is offered with the host chassis. This is especially required for the FCC and ISED approvals to remain valid, and any other kind of direct connector to the antenna might require a permissive change.
A trace length of 1.84 mm was used in the certifications host board to connect the module RF pin to the U.FL connector.
For reference, Figure 7.4 RF Trace Design Example on page 46 shows a set of parameters for a 50 Ω trace. Trace impedance should always be matched to the particular stack-up used on the host board.
Connect all ground pads directly to a solid ground plane.
Place the ground vias as close to the ground pads as possible.
Avoid plastic or any other dielectric material in contact with the antenna. Place vias close to each of the module’s GND pads Place vias along all PCB edges Wireless Module (Top View) GND GND GND GND GND Antenna Clearance No metal in this area Align module edge with PCB edge GND GND Figure 7.1. Recommended Layout for MGM240P Using Built-in Antenna MGM240P Multi-Protocol Wireless Module Data Sheet Design Guidelines silabs.com | Building a more connected world. Rev. 1.0 | 44

module’s GND pads Place vias along all PCB edges Wireless Module (Top View) GND GND GND GND RFOUT GND GND GND Align module edge with PCB edge (OPTIONAL) U.FL connector for external antenna

50 Ohm

Figure 7.2. Recommended Layout for MGM240P Using External Antenna The figure below illustrates layout scenarios that will lead to severely degraded RF performance for the module. Copper Clearance Area X GND plane width Figure 7.3. Non-Optimal Layout Examples The width of the GND plane to the sides the module will impact the efficiency of the built-in antenna. To achieve optimal performance, a GND plane width of 55 - 60 mm is recommended. Narrower ground planes can be used but will result in compromised RF performance. See 4.18 Antenna Radiation and Efficiency for reference. MGM240P Multi-Protocol Wireless Module Data Sheet Design Guidelines silabs.com | Building a more connected world. Rev. 1.0 | 45

Figure 7.4. RF Trace Design Example

7.2 Proximity to Other Materials

placing plastic or any other dielectric material in close proximity to the antenna. Conformal coating and other thin dielectric layers are acceptable directly on top of the antenna region, but this will also negatively impact antenna efficiency and reduce range. Any metallic objects in close proximity to the antenna will prevent the antenna from radiating freely. The minimum recommended dis- tance of metallic and/or conductive objects is 10 mm in any direction from the antenna except in the directions of the application PCB ground planes.

7.3 Proximity to Human Body

Placing the module in contact with or very close to the human body will negatively impact antenna efficiency and reduce range.

7.4 Reset

The MGM240P can be reset by pulling the RESET line low, by the internal watchdog timer, or by software command. The reset state does not provide power saving functionality and it is not recommended as a means to conserve power.

7.5 Debug

See AN958: Debugging and Programming Interfaces for Custom Designs. The MGM240P supports hardware debugging via 4-pin JTAG or 2-pin serial-wire debug (SWD) interfaces. It is recommended to ex- pose the debug pins in your own hardware design for firmware update and debug purposes. The table below lists the required pins for JTAG and SWD debug interfacing, which are also presented in Section 6.2 Alternate Pin Functions. If JTAG interfacing is enabled, the module must be power cycled to return to a SWD debug configuration if necessary. Table 7.1. Debug Pins Pin Name JTAG Signal SWD Signal Comments PA04 TDI N/A This pin is disabled after reset. Once enabled the pin has a built-in pull-up. PA03 TDO N/A This pin is disabled after reset. PA02 TMS SWDIO Pin is enabled after reset and has a built-in pull-up. PA01 TCK SWCLK Pin is enabled after reset and has a built-in pull-down. MGM240P Multi-Protocol Wireless Module Data Sheet Design Guidelines silabs.com | Building a more connected world. Rev. 1.0 | 46

7.6 Packet Trace Interface (PTI)

integrates a true PHY-level packet trace interface (PTI) peripheral that can capture packets non-intrusively to monitor and log device and network traffic without burdening processing resources in the module's SoC. The PTI generates two output signals that can serve as a powerful debugging tool, especially in conjunction with other hardware and software development tools available from Silicon Labs. The PTI_DATA and PTI_FRAME signals can be accessed through any GPIO on ports C and D (see FRC.DOUT and FRC.DFRAME peripheral resources in 6. Pin Definitions. MGM240P Multi-Protocol Wireless Module Data Sheet Design Guidelines silabs.com | Building a more connected world. Rev. 1.0 | 47

Package Specifications

8.1 Package Outline

Figure 8.1. Top and Side Views Figure 8.2. Bottom View MGM240P Multi-Protocol Wireless Module Data Sheet Package Specifications silabs.com | Building a more connected world. Rev. 1.0 | 48

8.2 PCB Land Pattern

Figure 8.3. Recommended Land Pattern for Modules with a Built-in Antenna For modules with an RF pin, the antenna keep out zone seen in the land pattern above should be omitted. MGM240P Multi-Protocol Wireless Module Data Sheet Package Specifications silabs.com | Building a more connected world. Rev. 1.0 | 49

8.3 Package Marking

The figure below shows the module markings engraved on the RF shield. Figure 8.4. MGM240P Top Marking Mark Description The package marking consists of: MGM240Pxxxxxxx - Part number designation

Model: MGM240Pxxx - Model number designation
QR Code: YYWWMMABCDE
YY – Last two digits of the assembly year
WW – Two-digit workweek when the device was assembled
MMABCDE – Silicon Labs unit code
YYWWTTTTTT
YY – Last two digits of the assembly year
WW – Two-digit workweek when the device was assembled
TTTTTT – Manufacturing trace code. The first letter is the device revision
Certification-related information (such as the CE Mark, FCC and IC IDs, etc.) is being engraved on the grayed out area, or printed on the back side of the module (silkscreen), according to regulatory body requirements. MGM240P Multi-Protocol Wireless Module Data Sheet Package Specifications silabs.com | Building a more connected world. Rev. 1.0 | 50

Soldering Recommendations It is recommended that final PCB assembly of the MGM240P follows the industry standard as identified by the Institute for Printed Cir- cuits (IPC). This product is assembled in compliance with the J-STD-001 requirements and the guidelines of IPC-AJ-820. Surface mounting of this product by the end user is recommended to follow IPC-A-610 to meet or exceed class 2 requirements. CLASS 1 General Electronic Products Includes products suitable for applications where the major requirement is function of the completed assembly. CLASS 2 Dedicated Service Electronic Products Includes products where continued performance and extended life is required, and for which uninterrupted service is desired but not critical. Typically the end-use environment would not cause failures. CLASS 3 High Performance/Harsh Environment Electronic Products Includes products where continued high performance or performance-on-demand is critical, equipment downtime cannot be tolerated, end-use environment may be uncommonly harsh, and the equipment must function when required, such as life support or other critical systems. Note: General SMT application notes are provided in the AN1223 document. MGM240P Multi-Protocol Wireless Module Data Sheet Soldering Recommendations silabs.com | Building a more connected world. Rev. 1.0 | 51

Certifications This section details the certification status of the module with regards to regional regulatory radio approvals. Where applicable, the sta- tus with the qualifications against the specifications of the supported industrial wireless standards is given too. The address of the module manufacturer (technology owner) and certification applicant is: SILICON LABS / SILICON LABORATORIES FINLAND OY Alberga Business Park, Bertel Jungin aukio 3,

02600 Espoo, Finland

The MGM240P modules have brand name of "Silicon Labs". "Silicon Labs" is a trademark globally owned by the Silicon Laboratories Inc. corporation, and all branches and subsidiaries, including the above applicant, holds the right to use it.

11.1 Qualified Antennas

The MGM240P modules have been tested and certified both with the built-in integral antenna and with a reference external antenna attached to the module's RF pin denoted as RFOUT. The antenna impedance is 50 Ω. Performance characteristics for the built-in antenna are presented in 3.3 Antenna and 4.18 Antenna Radiation and Efficiency . The de- tails of the qualified external antenna are summarized in the table below. Table 11.1. Qualified External Antennas for MGM240P Antenna Type Maximum Gain Impedance Connectorized Coaxial Dipole 2.8 dBi 50 Ω Any external antenna of the same general type and of equal or less directional gain compared to the one listed in the above table, and having similar in-band and out-of-band characteristics, can be used in the regulatory areas that have modular radio approvals, such as USA and Canada, as long as spot-check testing of the host is performed to verify that no performance changes compromising compli- ance have been introduced. In the particular FCC case, in order to comply with e-CFR Title 47, Part 15, Subpart C, Section 15.203, the module integrator using an external antenna must ensure it has a unique connector or it is nondetachable. In countries applying the ETSI standards, where manufacturers issue a self-Declaration of Conformity before placing products in the market, like in the EU countries, the radiated emissions are always tested with the end-product and the antenna type is not critical, but antennas with higher gain may violate some of the regulatory limits. When using instead an external antenna of a different type (such as a chip antenna, a PCB trace antenna, or a patch) or having non- similar in-band and out-of-band characteristics, but still with a gain less than or equal to the maximum gain listed in the table above, in principle it can be added to an existing modular grant/certificate by mean of a permissive change (for example with FCC and ISED), or by the administrative registration of such additional antenna (for example with MIC and KC). In many of these cases, some radiated emission testing is demanded, but no modular or end-product re-certification is required. On the other hand, all products with external antennas having more gain than the maximum gain listed in the table above are very likely to require a full new end-product certification. Since the exact permissive change or registration or re-certification procedure is chosen on a case-by-case basis, please consult your certification house and/or a certification body for understanding the correct approach based on your unique design. You might also want or need to get in touch with Silicon Labs for any authorization letter that your certifi- cation body might ask for. MGM240P Multi-Protocol Wireless Module Data Sheet Certifications silabs.com | Building a more connected world. Rev. 1.0 | 53

11.2 CE and UKCA - EU and UK

MGM240P modules have been tested against the relevant harmonized/designated standards and are in conformity with the essen- tial requirements and other relevant requirements of the EU's Radio Equipment Directive (RED) (2014/53/EU) and of the UK's Radio Equipment Regulations (RER) (S.I. 2017/1206). Please notice that every end-product integrating a MGM240P module will need to perform the radio EMC tests on the whole assembly, according to the ETSI 301 489-x relevant standards. Furthermore, it is ultimately the responsibility of the manufacturers to ensure the compliance of their end-products as a whole. The spe- cific product assembly is likely to have an impact to RF radiated characteristics, when compared to the bare module. Hence, manufac- turers should carefully consider RF radiated testing with the final product assembly, especially taking into account the gain of the external antenna if any, and the possible deviations in the PSD, EIRP and spurious emissions measurements, as defined in the ETSI EN 300 328 standard. The modules are entitled to carry the CE and UKCA Marks, and a formal Declaration of Conformity (DoC) is available at the product web page which is reachable starting from https://www.silabs.com/.

11.3 FCC - USA

This device complies with FCC's e-CFR Title 47, Part 15, Subpart C, Section 15.247 (and related relevant parts of the ANSI C63.10 standard) when operating with the built-in integral antenna or with an external antenna type as discussed in chapter 11.1. Operation is subject to the following two conditions: 1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesirable operation. Any changes or modifications not expressly approved by Silicon Labs could void the user’s authority to operate the equipment. FCC RF Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specif- ic operating instructions for satisfying RF exposure compliance. This transmitter meets the Mobile requirements at a distance of 20 cm and above from the human body, in accordance to the limit(s) exposed in the RF Exposure Analysis. This transmitter also meets the Portable requirements at distances equal or above 10 mm for the 31.6 mm and 33.9 mm in the case of Bluetooth Low Energy. These distances are reported for convenience also in Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption on page 61. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. MGM240P Multi-Protocol Wireless Module Data Sheet Certifications silabs.com | Building a more connected world. Rev. 1.0 | 54

OEM Responsibilities to comply with FCC Regulations This module has been tested for compliance to FCC Part 15. OEM integrators are responsible for testing their end-product for any additional compliance requirements needed with this module in- stalled (for example, digital device emissions, PC peripheral requirements, etc.). Additionally, investigative measurements and spot-checking are strongly recommended to verify that the full system compliance is maintained when the module is integrated, even with a module having a full modular approval, in accordance with the "Host Product Testing Guidance" in FCC's KDB 996369 D04 Module Integration Guide V01.

General Considerations This transmitter module is tested as a subsystem and its certification does not cover the FCC Part 15 Subpart B (unintentional radia- tor) rule requirement, which is typically applicable to the final host. The final host will still need to be assessed for compliance to this portion of the rule requirements, if applicable.
Manual Information to the End User The OEM integrator has to be aware not to provide information to the end-user regarding how to install or remove this RF module, or how to change RF related parameters, in the user’s manual of the final product which integrates this module. The end user manual shall include all required regulatory information/warnings as shown in this manual.
Host Manufacturer Responsibilities Host manufacturers are ultimately responsible for the full compliance of their host system. The final product is supposed to be as- sessed against all the essential requirements of the FCC rules, such as FCC Part 15 Subpart B, before it can be placed on the US market. This includes re-assuring the compliance of the radio transmitter with the RF and EMF essential requirements of the FCC rules. The modular radio transmitter must not be incorporated into any other radio-equipped device or system without retesting for compliance as multi-radio and combined equipment. Except for minor cosmetic changes, most changes to an FCC certified equipment require testing to determine whether the change is a Class I or Class II permissive change. For more details about using the Single Modular Transmitter, refer to the following FCC documents:
KDB 996369 D01 Transmitter Module Equipment Authorization Guide
KDB 996369 D02 Frequently Asked Questions and Answers about Modules
KDB 178919 D01 Permissive Change Policy
KDB 178919 D02 Permissive Change Frequently-Asked Questions Separation
To meet the SAR exemption for portable conditions, the minimum separation distance indicated in Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption on page 61 must be maintained between the human body and the radiator (antenna) at all times. In particular, in the use case of 802.15.4 the minimum distance must be 10 mm for the MGM240P22A, 31.6 mm for the MGM240P32A and 34.5 mm for the MGM240P32N, whereas in the use case of Bluetooth Low Energy the minimum distances must be 9.9 mm, 31.6 mm and 33.9 mm respectively.
This transmitter module is tested in a standalone RF Exposure condition, and in case of any co-located radio transmitter being al- lowed to transmit simultaneously, or in case of portable use at closer distances from the human body than those allowing the excep- tions rules to be applied, a separate additional SAR evaluation, or a reduction in the max output power or in the duty-cycle, might be required for the host, ultimately leading to a Class II Permissive Change, or more rarely to a new grant.
Important Note: In the event that the conditions for the exemption cannot be met, the final product will likely have to undergo addi- tional testing to evaluate the RF Exposure, or go through some re-configuration of the max output power and/or duty-cycle in order for the FCC authorization to remain valid, and a permissive change will have to be applied. The SAR evaluation (and/or reconfigura- tion) is in the responsibility of the end-product’s manufacturer, as well as the permissive change that can be carried out with the help of the customer's own Telecommunication Certification Body, following a Change in ID authorization by the module's original grant holder. MGM240P Multi-Protocol Wireless Module Data Sheet Certifications silabs.com | Building a more connected world. Rev. 1.0 | 55

modules are labeled with their own FCC ID. In all those cases when the FCC ID is not visible after the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the en- closed module. In that case, the final product must be labeled in a visible area with the following: "Contains Transmitter Module FCC ID: QOQ-GM240P" or "Contains FCC ID: QOQ-GM240P" Final note: As long as all the conditions in this and all the above chapters are met, further RF testing of the transmitter will not be strictly required. However, still consider the good practice and the FCC strong recommendation to ensure the compliance of the host by spot-checking. Nevertheless, the OEM integrator is still responsible for testing their end-product for any additional compliance require- ments which might be mandatory with this module installed. Class B Device Notice This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna
Increase the separation between the equipment and receiver
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected
Consult the dealer or an experienced radio/TV technician for help MGM240P Multi-Protocol Wireless Module Data Sheet Certifications silabs.com | Building a more connected world. Rev. 1.0 | 56

11.4 ISED - Canada

radio transmitter (IC: 5123A-GM240P) has been approved by Innovation, Science and Economic Development Canada (ISED Canada, formerly Industry Canada ) to operate with the built-in integral antenna and with the antenna type(s) listed in Section 11.1 Qualified Antennas, with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain listed, are strictly prohibited for use with this device. This radio-equipped device complies with ISED's license-exempt RSS standards. Operation is subject to the following two conditions: 1. This device may not cause interference; and 2. This device must accept any interference, including interference that may cause undesired operation of the device RF Exposure Statement Exception from routine SAR evaluation limits are given in RSS-102 Issue 5. The module meets the requirements for Mobile use cases when the minimum separation distance from the human body is 20 cm or greater, in accordance to the limit(s) exposed in the RF Exposure Analysis. For Portable use cases, RF exposure or SAR evaluation is not required when the separation distances from the human body are equal or above 15.2 mm for the MGM240P22A, 37 mm for the MGM240P32A and 41 mm for the MGM240P32N in the case of 802.15.4, and respectively 15 mm, 39.3 mm and 40 mm in the case of Bluetooth Low Energy. If the separation distance from the human body is less than the values stated above, which are also reported in Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption on page 61 for convenience, then the OEM integrator is responsible for evaluat- ing the SAR with the end-product, or for the re-configuration of the radio module in the host in terms of lowering the max RF TX power and/or the duty-cycle. A permissive change would be required too, under the responsibility of the host manufacturer, following a Multiple Listing authorization by the original module's certificate holder. OEM Responsibilities to comply with IC Regulations The MGM240P modules have been certified for integration into products only by OEM integrators under the following conditions:

The antenna must be installed such that a minimum separation distance as stated above is maintained between the radiator (anten- na) and all persons at all times.
The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter. Important Note: In the event that the above conditions cannot be met, the final product will have to undergo additional testing to evalu- ate the RF Exposure, or go through some re-configuration of the max output power and/or duty-cycle in order for the ISED authorization to remain valid; a permissive change will have to be applied too . The RF Exposure evaluation (SAR, or possibly a re-configuration) is in the responsibility of the end-product's manufacturer, as well as the permissive change that can be carried out with the help of the cus- tomer's own Telecommunication Certification Body, following a Multiple Listing authorization by the module's original grant holder. End Product Labeling The MGM240P modules are labeled with their own IC ID. In all those cases when the IC ID is not visible after a module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the en- closed module. In that case, the final product must be labeled in a visible area with the following: “Contains Transmitter Module IC: 5123A-GM240P ” or “Contains IC: 5123A-GM240P” The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end-product. As long as all the conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still respon- sible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). CAN ICES-003 (B) This Class B digital apparatus complies with Canadian ICES-003. MGM240P Multi-Protocol Wireless Module Data Sheet Certifications silabs.com | Building a more connected world. Rev. 1.0 | 57

ISED (Français) Le présent émetteur radio (IC: 5123A-GM240P) a été approuvé par Innovation, Sciences et Développement Économique Canada (IS- ED Canada, anciennement Industrie Canada) pour fonctionner avec l'antenne intégrée et le ou les types d'antenne énumérés à la section 11.1 Qualified Antennas , avec le gain maximal admissible indiqué. Les types d'antenne non inclus dans cette liste, ayant un gainsupérieur au gain maximal indiqué, sont strictement interdits d'utilisation avec cet appareil. . L’émetteur/récepteur exempt de licence contenu dans le présent appareil est conforme aux CNR d’Innovation, Sciences et Développe- ment économique Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions sui- vantes: 1. L’appareil ne doit pas produire de brouillage; 2. L’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptibled’en compromettre le fonctionne- ment. Déclaration d'exposition RF L'exception tirée des limites courantes d'évaluation SAR est donnée dans le document RSS-102 Issue 5. Le module répond aux exigences pour les cas d'utilisation Mobile lorsque la distance minimale de séparation du corps humain est de 20 cm ou plus, conformément à la (aux) limite(s) exposée(s) dans l'analyse de l'exposition RF. Pour les cas d'utilisation Portables, l'exposition aux fréquences radio ou l'évaluation du SAR n'est pas nécessaire lorsque les distances de séparation du corps humain sont égales ou supérieures à 15.2 mm pour le MGM240P22A, 37 mm pour le MGM240P32A et à 41 mm pour le MGM240P32N dans le cas de 802.15.4, et respectivement à 15 mm, 39.3 mm et à 40 mm dans le cas de Bluetooth Low Energy. Si la distance de séparation du corps humain est inférieure aux valeurs indiquées ci-dessus, également indiquées dans le tableau 11.2 pour des raisons de commodité, l'intégrateur OEM est responsable de l'évaluation du SAR avec le produit final, ou de la reconfiguration du module radio dans l'hôte en termes de réduction de la puissance RF TX maximale et/ou du rapport cyclique. Une modification per- missive serait également nécessaire, sous la responsabilité du fabricant de l'hôte, suite à une autorisation de cotation multiple par le titulaire du certificat du module d'origine. Responsabilités du fabricant de se conformer à la réglementation IC Le module a été certifié pour l'intégration dans les produits uniquement par les intégrateurs OEM dans les conditions suivantes:

L'antenne doit être installée de manière à maintenir une distance de séparation minimale, comme indiqué ci-dessus, entre le radia- teur (antenne) et toutes les personnes.
Le module émetteur ne doit pas être localisé ou fonctionner conjointement avec une autre antenne ou un autre émetteur. Remarque Importante: au cas où ces conditions ne pourraient pas être remplies, le produit final devra être soumis à des tests supplé- mentaires pour évaluer l'exposition RF, ou passer par une reconfiguration de la puissance de sortie maximale et/ou du rapport cyclique, afin que l'autorisation ISED reste valable; une modification permissive devra également être appliqué. L'évaluation de l'exposition aux radiofréquences (SAR, ou éventuellement une reconfiguration) est sous la responsabilité du fabricant du produit final, ainsi que le changement permissif qui peut être effectué avec l'aide de l'organisme de certification des télécommunications du client, après autori- sation de cotation multiple par le titulaire de la certification du module. Étiquetage des produits finis Les modules MGM240P est étiqueté avec son propre ID de certification.Si l'ID de certification n'est pas visible lorsque le module est installé dans un autre appareil, l'extérieur de l'appareil dans lequel le module est installé doit également afficher une étiquette faisant référence au module inclus. Dans ce cas, le produit final doit être étiqueté dans une zone visible avec les éléments suivants: “Contient le module transmetteur IC: 5123A-GM240P ” ou “Contient IC: 5123A-GM240P” L’intégrateur OEM doit être conscient de ne pas fournir à l’utilisateur final d’informations sur la procédure d’installation ou de retrait de ce module RF ni sur la modification des paramètres liés à la RF dans le manuel d’utilisation du produit final. Tant que toutes les conditions ci-dessus sont remplies, aucun test supplémentaire de l'émetteur ne sera nécessaire. Toutefois, l’inté- grateur OEM reste responsable de l’essai de son produit final pour déterminer les exigences de conformité supplémentaires requises avec ce module installé (par exemple, émissions d’appareils numériques, exigences relatives aux périphériques PC, etc.) CAN ICES-003 (B) Cet appareil numérique de classe B est conforme à la norme canadienne ICES-003. MGM240P Multi-Protocol Wireless Module Data Sheet Certifications silabs.com | Building a more connected world. Rev. 1.0 | 58

11.5 MIC - Japan

The MGM240P modules are certified in Japan with following certification numbers: Low-power (10dBm) parts with model name MGM240P22A: 020-220127

High-power (20dBm) parts with model names MGM240P32A and MGM240P32N: 020-220128 It is the end-product manufacturer's responsibility to ensure that a module is configured to meet the compliance limits, as documented in the formal certification test report(s) being available at www.silabs.com. Refer to the API reference manual(s) to learn for example how to configure (limit) the maximum RF TX power for the normal operations, and refer as well to the power setting tables in the test report(s) in order to realize the maximum output power allowed for the regulatory compliance in Japan. Manufacturers integrating a radio module into their host equipment are supposed to make the certification mark and the certification number visible on the outside of the host equipment. This combination of mark and number, and their relative placement, is depicted in Figure 11.1, and depending on the overall size it might also appear among the top shield markings of the radio module. The certification mark and certification number must be placed close to the text in the Japanese language which is provided below. This requirement in the Radio Law has been made in order to enable users of the combination of host and radio module to verify if they are actually using a radio device which is approved for use in Japan. Certification Text to be Placed on the Outside Surface of the Host Equipment: Translation of the text: “This equipment contains specified radio equipment that has been certified to the Technical Regulation Conformity Certification under the Radio Law.” The "Giteki" Mark shown in the following figures must be affixed to an easily noticeable section of the specified radio-enabled host equipment. Note that such section may be required to contain additional information if the end-device embedding the module is also subject to a Telecom approval. The manufacturer of the final product is also responsible to provide a Japanese language version of the User Manual and/or Installation Instructions as a companion document coming with the final product when placed on the market in Japan. Such a document will have to mention the integrated radio component and the related certification information. Figure 11.1. GITEKI Mark and ID MGM240P Multi-Protocol Wireless Module Data Sheet Certifications silabs.com | Building a more connected world. Rev. 1.0 | 59

Figure 11.2. Detail of GITEKI Mark

11.6 KC - South Korea

The low-power variant of the MGM240P modules has a RF registration for import and use in South Korea. Registration number is R-R-BGT-GM240P. These modules are meant to be integrated into end-products, which then become exempted from doing the RF emission testing, as long as the recommended design guidance is followed, and as long as, where applicable, the approved external antennas are used and any additional transmit power backoff is implemented in accordance to the measurements and configurations seen in the formal test report(s). EMC testing and any other relevant test applicable to the end-product as a whole, plus appropriate labeling of the end-product, might still be required for the full regulatory compliance in the country. MGM240P Multi-Protocol Wireless Module Data Sheet Certifications silabs.com | Building a more connected world. Rev. 1.0 | 60

11.7 Human Body Proximity

using the MGM240P modules in an application where the radio is located close to the human body, the human RF Exposure must be taken into account. FCC, ISED, and CE all have different standards and rules for evaluating the RF Exposure. In particular, each regulator has different requirements when it comes to the exemption from having to perform RF Exposure and SAR (Specific Ab- sorption Rate) measurements, and the minimum separation distances between the module's antenna and the human body varies ac- cordingly. The properties of the MGM240P modules allow for the minimum separation distances detailed below in Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption on page 61 for the SAR evaluation exemption in portable use cases (less than 20 cm from human body). The module is approved for the Mobile use case (more than 20 cm) without any need for RF Exposure evalu- ation. Table 11.2. Minimum Separation Distances for SAR Evaluation Exemption Certification MGM240P22A MGM240P32A MGM240P32N mm Bluetooth: 33.9 mm, 802.15.4: 34.5 mm CE The RF exposure should always be evaluated with the end-product when transmitting with power levels higher than 20 mW (13 dBm). The exemption distances above, calculated for reference in the full output power use case, are based on the rules in force at the time of writing this datasheet. Even though changing rarely, always ensure to apply the rules in force at the time of placing a product in the market. In the cases of FCC and ISED, it is allowed to use the module at its max RF TX power in end-products where the typical separation distance from the human body is smaller than mentioned above, but it requires evaluating the RF Exposure in the final assembly and applying for a Class 2 Permissive Change to the FCC and ISED approvals of the module. In order to proceed with the permissive change, module manufacturer should be asked for an authorization to proceed first with a Change in ID and/or Multiple Listing, so that the new portable condition will be added to the new parallel grant owned by the end-product manufacturer. For CE, RF Exposure must be evaluated using the end-product in all cases when transmitting at more than the power level indicated in the table. Note: Placing the module in touch or very close to the human body will have a negative impact on the efficiency of the antenna thus a reduced range is to be expected.

11.8 Bluetooth Qualification

The MGM240P modules are launched with a pre-qualified Bluetooth Low Energy RF-PHY Tested Component based on Core Specifica- tion 5.3 having Declaration ID of D059594 and QDID of 184327. The RF-PHY Tested Component should be imported and combined together with the latest Wireless Gecko Link Layer and Host pre- qualified Components by Silicon Labs, when in the process of qualifying an end-product which embeds the MGM240P via the SIG's Launch Studio. Please find out more in chapter 2.2 of the quick start guides QSG139 and GSG169. Notice that the validity set by the SIG for Tested Components is currently of 3 years: during the product lifetime, Silicon Labs will re- assess or re-qualify the RF-PHY Component as it expires, whenever applicable. In case of a re-qualification, a Tested Component will come with a new DID and a new QDID, and the latter will be then referred to in new end-product listings. Newer DIDs and QDIDs can be discovered by using the search engine in the SIG's Launch Studio, or by asking Silicon Labs via the technical support platform. MGM240P Multi-Protocol Wireless Module Data Sheet Certifications silabs.com | Building a more connected world. Rev. 1.0 | 61

Revision History Revision 1.0 August 2022 Full production Revision 0.5 May 2022

Initial release Revision 0.1 September, 2021
Initial Draft MGM240P Multi-Protocol Wireless Module Data Sheet

Revision History

silabs.com | Building a more connected world. Rev. 1.0 | 62

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MGM240PA22VNA3R specifications and overview.

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MGM240P Multi-Protocol Wireless Module Rev. 1.0

Description

MGM240P Multi-Protocol Wireless Module Rev. 1.0

Source title MGM240PA22VNA3R Datasheet(PDF) - Silicon Laboratories

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