MGM13P SILABS | Alldatasheet

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MGM13P Wireless Gecko Module Data Sheet The MGM13P is Silicon Labs’ first PCB module solution for 802.15.4 Mesh and multi- protocol networking that supports Bluetooth 5.0 LE, including long range, high through- put, and regular BLE PHYs. Based on the Silicon Labs EFR32MG13 Mighty Gecko SoC, the MGM13P delivers ro- bust RF performance, low energy consumption, a wide selection of MCU peripherals, regulatory test certificates for various regions and countries, and a simplified develop- ment experience, all in a small form factor. Together with the certified software stacks and powerful tools also offered by Silicon Labs, the MGM13P can minimize the engineer- ing efforts and development costs associated with adding Zigbee, Thread, Bluetooth 5.0 LE, or multi-protocol connectivity to any product, accelerating its time-to-market. The MGM13P is intended for a broad range of applications, including: KEY FEATURES

  • Zigbee, Thread, BLE, or multi-protocol connectivity
  • Antenna or U.FL variants
  • Up to +19 dBm TX power
  • -94.6 dBm BLE RX sensitivity at 1 Mbps
  • -102.1 dBm 802.15.4 RX sensitivity
  • 32-bit ARM® Cortex®-M4 core at 38.4 MHz
  • 512/64 kB of flash/RAM memory
  • Robust security features
  • Wide selection of MCU peripherals
  • Integrated dc-dc converter
  • 25 GPIO pins
  • IoT multi-protocol end-node devices and gateways
  • Connected home
  • Lighting
  • Metering
  • Building automation and security
  • Health and wellness Antenna Timers and Triggers 32-bit bus Peripheral Reflex System Serial Interfaces I/O Ports Analog I/F Lowest power mode with peripheral operational: USART Low Energy UARTTM I2C External Interrupts General Purpose I/O Pin Reset Pin Wakeup ADC VDAC Analog Comparator EM3—StopEM2—Deep SleepEM1—Sleep EM4—Hibernate EM4—ShutoffEM0—Active Energy Management Brown-Out Detector DC-DC Converter Voltage Regulator Voltage Monitor Power-On Reset Other Capacitive Touch Op-Amp IDAC CRYPTO CRC True Random Number Generator SMU Core / Memory ARM CortexTM M4 processor with DSP extensions, FPU and MPU ETM Debug InterfaceRAM Memory LDMA Controller Flash Program Memory Real Time Counter and Calendar Cryotimer Timer/Counter Low Energy Timer Pulse Counter Watchdog Timer Protocol Timer Low Energy Sensor Interface Radio Transceiver DEMOD AGC IFADC CRC BUFC MOD FRC RAC I Q RF Frontend LNA PA Frequency Synthesizer PGA BALUN Chip Antenna or U.FL Connector Matching Crystals

38.4 MHz

32.768 kHz Clock Management L-F RC Oscillator H-F RC Oscillator Auxiliary H-F RC Oscillator Ultra L-F RC Oscillator L-F Crystal Oscillator H-F Crystal Oscillator silabs.com | Building a more connected world. Copyright © 2022 by Silicon Laboratories Rev. 1.4

  1. Feature List
  • Supported Protocols
  • Zigbee
  • Thread
  • Bluetooth 5.0 LE
  • Multi-protocol
  • Wireless System-on-Chip.
  • 2.4 GHz radio
  • TX power up to +19 dBm
  • High Performance 32-bit 38.4 MHz ARM Cortex®-M4 with DSP instruction and floating-point unit for efficient signal processing
  • 512 kB flash program memory
  • 64 kB RAM data memory
  • Embedded Trace Macrocell (ETM) for advanced debugging
  • Integrated dc-dc
  • High Receiver Performance
  • -102.1 dBm sensitivity (1% PER) at 250 kbps DSSS- OQPSK
  • -102.8 dBm sensitivity (0.1% BER) at 125 kbit/s GFSK
  • -98.4 dBm sensitivity (0.1% BER) at 500 kbit/s GFSK
  • -94.6 dBm sensitivity (0.1% BER) at 1 Mbit/s GFSK
  • -91 dBm sensitivity (0.1% BER) at 2 Mbit/s GFSK
  • Low Energy Consumption
  • 11 mA RX current at 250 kbps, DSSS-OQPSK
  • 9.9 mA RX current at 1 Mbps, GFSK
  • 8.5 mA TX current at 0 dBm output power
  • 87 μA/MHz in Active Mode (EM0)
  • 1.4 μA EM2 DeepSleep current (64 kB RAM retention and RTCC running from LFXO)
  • 1.3 μA EM2 DeepSleep current (16 kB RAM retention and RTCC running from LFRCO)
  • Regulatory Certifications
  • FCC
  • CE / UKCA
  • IC / ISEDC
  • MIC / Telec
  • Wide Operating Range
  • 1.8 V to 3.8 V single power supply
  • -40 °C to +85 °C
  • Dimensions
  • Support for Internet Security
  • General Purpose CRC
  • True Random Number Generator (TRNG)
  • 2 × Hardware Cryptographic Acceleration for AES 128/256, SHA-1, SHA-2 (SHA-224 and SHA-256) and ECC
  • Wide Selection of MCU Peripherals
  • 12-bit 1 Msps SAR Analog to Digital Converter (ADC)
  • 2 × Analog Comparator (ACMP)
  • 2 × Digital to Analog Converter (VDAC)
  • 3 × Operational Amplifier (Opamp)
  • Digital to Analog Current Converter (IDAC)
  • Low-Energy Sensor Interface (LESENSE)
  • Multi-channel Capacitive Sense Interface (CSEN)
  • 25 pins connected to analog channels (APORT) shared be- tween analog peripherals
  • 25 General Purpose I/O pins with output state retention and asynchronous interrupts
  • 8 Channel DMA Controller
  • 12 Channel Peripheral Reflex System (PRS)
  • 2 × 16-bit Timer/Counter
  • 3 or 4 Compare/Capture/PWM channels
  • 1 × 32-bit Timer/Counter
  • 3 Compare/Capture/PWM channels
  • 32-bit Real Time Counter and Calendar
  • 16-bit Low Energy Timer for waveform generation
  • 32-bit Ultra Low Energy Timer/Counter for periodic wake-up from any Energy Mode
  • 16-bit Pulse Counter with asynchronous operation
  • 2 × Watchdog Timer
  • 3 × Universal Synchronous/Asynchronous Receiver/Trans- mitter (UART/SPI/SmartCard (ISO 7816)/IrDA/I2S)
  • Low Energy UART (LEUART™)
  • 2 × I2C interface with SMBus support and address recogni- tion in EM3 Stop MGM13P Wireless Gecko Module Data Sheet Feature List silabs.com | Building a more connected world. Rev. 1.4 | 2
  1. Ordering Information Table 2.1. Ordering Information Ordering Code Protocol Stack Max TX Power Antenna Flash (kB) RAM (kB) GPIO Packaging MGM13P12F512GA-V2 Bluetooth LE Zigbee Thread 19 dBm Built-in 512 64 25 Cut Tape MGM13P12F512GA-V2R Bluetooth LE Zigbee Thread 19 dBm Built-in 512 64 25 Reel MGM13P12F512GE-V2 Bluetooth LE Zigbee Thread 19 dBm U.FL 512 64 25 Cut Tape MGM13P12F512GE-V2R Bluetooth LE Zigbee Thread 19 dBm U.FL 512 64 25 Reel MGM13P02F512GA-V2 Bluetooth LE Zigbee Thread 10 dBm Built-in 512 64 25 Cut Tape MGM13P02F512GA-V2R Bluetooth LE Zigbee Thread 10 dBm Built-in 512 64 25 Reel MGM13P02F512GE-V2 Bluetooth LE Zigbee Thread 10 dBm U.FL 512 64 25 Cut Tape MGM13P02F512GE-V2R Bluetooth LE Zigbee Thread 10 dBm U.FL 512 64 25 Reel End-product manufacturers must verify that the module is configured to meet regulatory limits for each region in accordance with the formal certification test reports. Devices are not pre-programmed with a firmware image. MGM13P Wireless Gecko Module Data Sheet

Ordering Information

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  1. System Overview

3.1 Introduction

The MGM13P product family combines an energy-friendly MCU with a highly integrated radio transceiver and a high performance, ultra robust antenna. The devices are well suited for any battery operated application, as well as other system where ultra-small size, reliable high performance RF, low-power consumption and easy application development are key requirements. This section gives a short intro- duction to the full radio and MCU system. A detailed block diagram of the MGM13P module is shown in the figure below. Analog Peripherals Clock Management HFRCO IDAC ARM Cortex-M4 Core

512 KB ISP FlashProgram Memory

64 KB RAM

Floating Point UnitEnergy Management PAVDD / RFVDD / DVDD VBAT bypass VREGVDD / AVDD IOVDD VDAC +- Op-Amp Capacitive Touch LESENSE CRC CRYPTO I2C LEUART USART RTC / RTCC PCNT CRYOTIMER TIMER LETIMER Port F Drivers PFn Port D Drivers PDn Port C Drivers PCn Port B Drivers PBn Port ADrivers PAn Mux & FB DC-DC Converter Debug Signals(shared w/GPIO) Brown Out / Power-On Reset Reset Management UnitSerial Wire and ETM Debug / Programming AUXHFRCO Radio Transciever RF Frontend PA I Q LNA BALUN Frequency Synthesizer DEMOD AGC IFADC CRC BUFC MOD FRC RAC PGA Antenna Chip AntennaorU.FL Connector Matching 1V8 Voltage Regulator Voltage Monitor Internal Crystals

38.4 MHz Crystal

32.768 kHz Crystal Figure 3.1. MGM13P Block Diagram

3.2 Radio

The MGM13P features a highly configurable radio transceiver supporting a wide range of wireless protocols including Zigbee, Thread, and Bluetooth Low Energy. It features a memory buffer and a low-voltage circuit that can withstand extremely high data rates.

3.2.1 Antenna Interface

The MGM13P has two antenna solution variants. One of them is a high-performance integrated chip antenna (MGM13PxxFxxxxA) and the other is a U.FL connector to attach an external antenna to the module (MGM13PxxFxxxxE). MGM13P Wireless Gecko Module Data Sheet System Overview silabs.com | Building a more connected world. Rev. 1.4 | 7

Table 3.1. Antenna Efficiency and Peak Gain Parameter With optimal layout Note Efficiency -1.5 to -3 dB Antenna efficiency, gain and radiation pattern are highly depend- ent on the application PCB layout and mechanical design. Refer to 6. Layout Guidelines for PCB layout and antenna integration guidelines for optimal performance. Peak gain 1 dBi

3.2.2 Packet and State Trace

The MGM13P Frame Controller has a packet and state trace unit that provides valuable information during the development phase. It features:

  • Non-intrusive trace of transmit data, receive data and state information
  • Data observability on a single-pin UART data output, or on a two-pin SPI data output
  • Configurable data output bitrate / baudrate
  • Multiplexed transmitted data, received data and state / meta information in a single serial data stream

3.2.3 Random Number Generator

The Frame Controller (FRC) implements a random number generator that uses entropy gathered from noise in the RF receive chain. The data is suitable for use in cryptographic applications. Output from the random number generator can be used either directly or as a seed or entropy source for software-based random num- ber generator algorithms such as Fortuna. MGM13P Wireless Gecko Module Data Sheet System Overview silabs.com | Building a more connected world. Rev. 1.4 | 8

3.3 Power

The MGM13P has an Energy Management Unit (EMU) and efficient integrated regulators to generate internal supply voltages. Only a single external supply voltage is required, from which all internal voltages are created. An integrated dc-dc buck regulator is utilized to further reduce the current consumption. Figure 3.2 Power Supply Configuration for +10 dBm Devices on page 9 and Figure 3.3 Power Supply Configuration for +19 dBm Devices on page 9 show how the external and internal supplies of the module are connected for different part numbers. DC-DC Analog DVDD PAVDD RFVDD VDD Digital RF PA RF VREGVDD AVDD I/O InterfacesIOVDD Figure 3.2. Power Supply Configuration for +10 dBm Devices DC-DC Analog DVDD PAVDD RFVDD VDD Digital RF PA RF VREGVDD AVDD I/O InterfacesIOVDD Figure 3.3. Power Supply Configuration for +19 dBm Devices

3.3.1 Energy Management Unit (EMU)

The Energy Management Unit manages transitions of energy modes in the device. Each energy mode defines which peripherals and features are available and the amount of current the device consumes. The EMU can also be used to turn off the power to unused RAM blocks, and it contains control registers for the dc-dc regulator and the Voltage Monitor (VMON). The VMON is used to monitor multiple supply voltages. It has multiple channels which can be programmed individually by the user to determine if a sensed supply has fallen below a chosen threshold. MGM13P Wireless Gecko Module Data Sheet System Overview silabs.com | Building a more connected world. Rev. 1.4 | 9

3.3.2 DC-DC Converter

The dc-dc buck converter covers a wide range of load currents and provides up to 90% efficiency in energy modes EM0, EM1, EM2 and EM3. Patented RF noise mitigation allows operation of the dc-dc converter without degrading sensitivity of radio components. Pro- tection features include programmable current limiting, short-circuit protection, and dead-time protection. The dc-dc converter may also enter bypass mode when the input voltage is too low for efficient operation. In bypass mode, the dc-dc input supply is internally connec- ted directly to its output through a low resistance switch. Bypass mode also supports in-rush current limiting to prevent input supply voltage droops due to excessive output current transients.

3.3.3 Power Domains

The MGM13P has two peripheral power domains for operation in EM2 and EM3. If all of the peripherals in a peripheral power domain are configured as unused, the power domain for that group will be powered off in the low-power mode, reducing the overall current consumption of the device. Table 3.2. Peripheral Power Subdomains Peripheral Power Domain 1 Peripheral Power Domain 2 ACMP0 ACMP1 PCNT0 CSEN ADC0 VDAC0 LETIMER0 LEUART0 LESENSE I2C0 APORT I2C1 - IDAC

3.4 General Purpose Input/Output (GPIO)

MGM13P has up to 25 General Purpose Input/Output pins. Each GPIO pin can be individually configured as either an output or input. More advanced configurations including open-drain, open-source, and glitch-filtering can be configured for each individual GPIO pin. The GPIO pins can be overridden by peripheral connections, like SPI communication. Each peripheral connection can be routed to sev- eral GPIO pins on the device. The input value of a GPIO pin can be routed through the Peripheral Reflex System to other peripherals. The GPIO subsystem supports asynchronous external pin interrupts.

3.5 Clocking

3.5.1 Clock Management Unit (CMU)

The Clock Management Unit controls oscillators and clocks in the MGM13P. Individual enabling and disabling of clocks to all peripher- als is performed by the CMU. The CMU also controls enabling and configuration of the oscillators. A high degree of flexibility allows software to optimize energy consumption in any specific application by minimizing power dissipation in unused peripherals and oscilla- tors. MGM13P Wireless Gecko Module Data Sheet System Overview silabs.com | Building a more connected world. Rev. 1.4 | 10

3.5.2 Internal Oscillators and Crystals

The MGM13P fully integrates several oscillator sources and two crystals.

  • The high-frequency crystal oscillator (HFXO) and integrated 38.4 MHz crystal provide a precise timing reference for the MCU and radio.
  • The low-frequency crystal oscillator (LFXO) and integrated 32.768 kHz crystal provide an accurate timing reference for low energy modes and the real-time-clock circuits.
  • An integrated high frequency RC oscillator (HFRCO) is available for the MCU system, when crystal accuracy is not required. The HFRCO employs fast startup at minimal energy consumption combined with a wide frequency range.
  • An integrated auxilliary high frequency RC oscillator (AUXHFRCO) is available for timing the general-purpose ADC and the Serial Wire Viewer port with a wide frequency range.
  • An integrated low frequency 32.768 kHz RC oscillator (LFRCO) for low power operation where high accuracy is not required.
  • An integrated ultra-low frequency 1 kHz RC oscillator (ULFRCO) is available to provide a timing reference at the lowest energy con- sumption in low energy modes.

3.6 Counters/Timers and PWM

3.6.1 Timer/Counter (TIMER)

TIMER peripherals keep track of timing, count events, generate PWM outputs and trigger timed actions in other peripherals through the PRS system. The core of each TIMER is a 16-bit counter with up to 4 compare/capture channels. Each channel is configurable in one of three modes. In capture mode, the counter state is stored in a buffer at a selected input event. In compare mode, the channel output reflects the comparison of the counter to a programmed threshold value. In PWM mode, the TIMER supports generation of pulse-width modulation (PWM) outputs of arbitrary waveforms defined by the sequence of values written to the compare registers, with optional dead-time insertion available in timer unit TIMER_0 only.

3.6.2 Wide Timer/Counter (WTIMER)

WTIMER peripherals function just as TIMER peripherals, but are 32 bits wide. They keep track of timing, count events, generate PWM outputs and trigger timed actions in other peripherals through the PRS system. The core of each WTIMER is a 32-bit counter with up to 4 compare/capture channels. Each channel is configurable in one of three modes. In capture mode, the counter state is stored in a buffer at a selected input event. In compare mode, the channel output reflects the comparison of the counter to a programmed thresh- old value. In PWM mode, the WTIMER supports generation of pulse-width modulation (PWM) outputs of arbitrary waveforms defined by the sequence of values written to the compare registers, with optional dead-time insertion available in timer unit WTIMER_0 only.

3.6.3 Real Time Counter and Calendar (RTCC)

The Real Time Counter and Calendar (RTCC) is a 32-bit counter providing timekeeping in all energy modes. The RTCC includes a Binary Coded Decimal (BCD) calendar mode for easy time and date keeping. The RTCC can be clocked by any of the on-board oscilla- tors with the exception of the AUXHFRCO, and it is capable of providing system wake-up at user defined instances. When receiving frames, the RTCC value can be used for timestamping. The RTCC includes 128 bytes of general purpose data retention, allowing easy and convenient data storage in all energy modes down to EM4H. A secondary RTC is used by the RF protocol stack for event scheduling, leaving the primary RTCC block available exclusively for appli- cation software.

3.6.4 Low Energy Timer (LETIMER)

The unique LETIMER is a 16-bit timer that is available in energy mode EM0 Active, EM1 Sleep, EM2 Deep Sleep, and EM3 Stop. This allows it to be used for timing and output generation when most of the device is powered down, allowing simple tasks to be performed while the power consumption of the system is kept at an absolute minimum. The LETIMER can be used to output a variety of wave- forms with minimal software intervention. The LETIMER is connected to the Real Time Counter and Calendar (RTCC), and can be con- figured to start counting on compare matches from the RTCC.

3.6.5 Ultra Low Power Wake-up Timer (CRYOTIMER)

The CRYOTIMER is a 32-bit counter that is capable of running in all energy modes. It can be clocked by either the 32.768 kHz crystal oscillator (LFXO), the 32.768 kHz RC oscillator (LFRCO), or the 1 kHz RC oscillator (ULFRCO). It can provide periodic Wakeup events and PRS signals which can be used to wake up peripherals from any energy mode. The CRYOTIMER provides a wide range of inter- rupt periods, facilitating flexible ultra-low energy operation. MGM13P Wireless Gecko Module Data Sheet System Overview silabs.com | Building a more connected world. Rev. 1.4 | 11

3.6.6 Pulse Counter (PCNT)

The Pulse Counter (PCNT) peripheral can be used for counting pulses on a single input or to decode quadrature encoded inputs. The clock for PCNT is selectable from either an external source on pin PCTNn_S0IN or from an internal timing reference, selectable from among any of the internal oscillators, except the AUXHFRCO. The peripheral may operate in energy mode EM0 Active, EM1 Sleep, EM2 Deep Sleep, and EM3 Stop.

3.6.7 Watchdog Timer (WDOG)

The watchdog timer can act both as an independent watchdog or as a watchdog synchronous with the CPU clock. It has windowed monitoring capabilities, and can generate a reset or different interrupts depending on the failure mode of the system. The watchdog can also monitor autonomous systems driven by PRS.

3.7 Communications and Other Digital Peripherals

3.7.1 Universal Synchronous/Asynchronous Receiver/Transmitter (USART)

The Universal Synchronous/Asynchronous Receiver/Transmitter is a flexible serial I/O interface. It supports full duplex asynchronous UART communication with hardware flow control as well as RS-485, SPI, MicroWire and 3-wire. It can also interface with devices sup- porting:

  • ISO7816 SmartCards
  • IrDA
  • I2S

3.7.2 Low Energy Universal Asynchronous Receiver/Transmitter (LEUART)

The unique LEUARTTM provides two-way UART communication on a strict power budget. Only a 32.768 kHz clock is needed to allow UART communication up to 9600 baud. The LEUART includes all necessary hardware to make asynchronous serial communication possible with a minimum of software intervention and energy consumption.

3.7.3 Inter-Integrated Circuit Interface (I2C)

The I2C interface enables communication between the MCU and a serial I 2C bus. It is capable of acting as both a master and a slave and supports multi-master buses. Standard-mode, fast-mode and fast-mode plus speeds are supported, allowing transmission rates from 10 kbit/s up to 1 Mbit/s. Slave arbitration and timeouts are also available, allowing implementation of an SMBus-compliant system. The interface provided to software by the I2C peripheral allows precise timing control of the transmission process and highly automated transfers. Automatic recognition of slave addresses is provided in active and low energy modes.

3.7.4 Peripheral Reflex System (PRS)

The Peripheral Reflex System provides a communication network between different peripherals without software involvement. Peripher- als producing Reflex signals are called producers. The PRS routes Reflex signals from producers to consumer peripherals, which in turn perform actions in response. Edge triggers and other functionality such as simple logic operations (AND, OR, NOT) can be applied by the PRS to the signals. The PRS allows peripheral to act autonomously without waking the MCU core, saving power.

3.7.5 Low Energy Sensor Interface (LESENSE)

The Low Energy Sensor Interface LESENSETM is a highly configurable sensor interface with support for up to 16 individually configura- ble sensors. By controlling the analog comparators, ADC, and DAC, LESENSE is capable of supporting a wide range of sensors and measurement schemes, and can for instance measure LC sensors, resistive sensors and capacitive sensors. LESENSE also includes a programmable finite state machine which enables simple processing of measurement results without CPU intervention. LESENSE is available in energy mode EM2, in addition to EM0 and EM1, making it ideal for sensor monitoring in applications with a strict energy budget.

3.8 Security Features

3.8.1 General Purpose Cyclic Redundancy Check (GPCRC)

The GPCRC block implements a Cyclic Redundancy Check (CRC) function. It supports both 32-bit and 16-bit polynomials. The suppor- ted 32-bit polynomial is 0x04C11DB7 (IEEE 802.3), while the 16-bit polynomial can be programmed to any value, depending on the needs of the application. MGM13P Wireless Gecko Module Data Sheet System Overview silabs.com | Building a more connected world. Rev. 1.4 | 12

3.8.2 Crypto Accelerator (CRYPTO)

The Crypto Accelerator is a fast and energy-efficient autonomous hardware encryption and decryption accelerator. EFR32 devices sup- port AES encryption and decryption with 128- or 256-bit keys, ECC over both GF(P) and GF(2 m), SHA-1 and SHA-2 (SHA-224 and SHA-256). Supported block cipher modes of operation for AES include: ECB, CTR, CBC, PCBC, CFB, OFB, GCM, CBC-MAC, GMAC and CCM. Supported ECC NIST recommended curves include P-192, P-224, P-256, K-163, K-233, B-163 and B-233. The CRYPTO1 block is tightly linked to the Radio Buffer Controller (BUFC) enabling fast and efficient autonomous cipher operations on data buffer content. It allows fast processing of GCM (AES), ECC and SHA with little CPU intervention. CRYPTO also provides trigger signals for DMA read and write operations.

3.8.3 True Random Number Generator (TRNG)

The TRNG is a non-deterministic random number generator based on a full hardware solution. The TRNG is validated with NIST800-22 and AIS-31 test suites as well as being suitable for FIPS 140-2 certification (for the purposes of cryptographic key generation).

3.8.4 Security Management Unit (SMU)

The Security Management Unit (SMU) allows software to set up fine-grained security for peripheral access, which is not possible in the Memory Protection Unit (MPU). Peripherals may be secured by hardware on an individual basis, such that only priveleged accesses to the peripheral's register interface will be allowed. When an access fault occurs, the SMU reports the specific peripheral involved and can optionally generate an interrupt.

3.9 Analog

3.9.1 Analog Port (APORT)

The Analog Port (APORT) is an analog interconnect matrix allowing access to many analog peripherals on a flexible selection of pins. Each APORT bus consists of analog switches connected to a common wire. Since many clients can operate differentially, buses are grouped by X/Y pairs.

3.9.2 Analog Comparator (ACMP)

The Analog Comparator is used to compare the voltage of two analog inputs, with a digital output indicating which input voltage is high- er. Inputs are selected from among internal references and external pins. The tradeoff between response time and current consumption is configurable by software. Two 6-bit reference dividers allow for a wide range of internally-programmable reference sources. The ACMP can also be used to monitor the supply voltage. An interrupt can be generated when the supply falls below or rises above the programmable threshold.

3.9.3 Analog to Digital Converter (ADC)

The ADC is a Successive Approximation Register (SAR) architecture, with a resolution of up to 12 bits at up to 1 Msps. The output sample resolution is configurable and additional resolution is possible using integrated hardware for averaging over multiple samples. The ADC includes integrated voltage references and an integrated temperature sensor. Inputs are selectable from a wide range of sources, including pins configurable as either single-ended or differential.

3.9.4 Capacitive Sense (CSEN)

The CSEN peripheral is a dedicated Capacitive Sensing block for implementing touch-sensitive user interface elements such a switches and sliders. The CSEN peripheral uses a charge ramping measurement technique, which provides robust sensing even in adverse conditions including radiated noise and moisture. The peripheral can be configured to take measurements on a single port pin or scan through multiple pins and store results to memory through DMA. Several channels can also be shorted together to measure the combined capacitance or implement wake-on-touch from very low energy modes. Hardware includes a digital accumulator and an aver- aging filter, as well as digital threshold comparators to reduce software overhead. MGM13P Wireless Gecko Module Data Sheet System Overview silabs.com | Building a more connected world. Rev. 1.4 | 13

3.9.5 Digital to Analog Current Converter (IDAC)

The IDAC can source or sink a configurable constant current. This current can be driven on an output pin or routed to the selected ADC input pin for capacitive sensing. The full-scale current is programmable between 0.05 µA and 64 µA with several ranges consisting of various step sizes.

3.9.6 Digital to Analog Converter (VDAC)

The Digital to Analog Converter (VDAC) can convert a digital value to an analog output voltage. The VDAC is a fully differential, 500 ksps, 12-bit converter. The opamps are used in conjunction with the VDAC, to provide output buffering. One opamp is used per single- ended channel, or two opamps are used to provide differential outputs. The VDAC may be used for a number of different applications such as sensor interfaces or sound output. The VDAC can generate high-resolution analog signals while the MCU is operating at low frequencies and with low total power consumption. Using DMA and a timer, the VDAC can be used to generate waveforms without any CPU intervention. The VDAC is available in all energy modes down to and including EM3.

3.9.7 Operational Amplifiers

The opamps are low power amplifiers with a high degree of flexibility targeting a wide variety of standard opamp application areas, and are available down to EM3. With flexible built-in programming for gain and interconnection they can be configured to support multiple common opamp functions. All pins are also available externally for filter configurations. Each opamp has a rail to rail input and a rail to rail output. They can be used in conjunction with the VDAC peripheral or in stand-alone configurations. The opamps save energy, PCB space, and cost as compared with standalone opamps because they are integrated on-chip.

3.10 Reset Management Unit (RMU)

The RMU is responsible for handling reset of the MGM13P. A wide range of reset sources are available, including several power supply monitors, pin reset, software controlled reset, core lockup reset, and watchdog reset.

3.11 Core and Memory

3.11.1 Processor Core

The ARM Cortex-M processor includes a 32-bit RISC processor integrating the following features and tasks in the system:

  • ARM Cortex-M4 RISC processor achieving 1.25 Dhrystone MIPS/MHz
  • Memory Protection Unit (MPU) supporting up to 8 memory segments
  • Up to 512 kB flash program memory
  • Up to 64 kB RAM data memory
  • Configuration and event handling of all peripherals
  • 2-pin Serial-Wire debug interface

3.11.2 Memory System Controller (MSC)

The Memory System Controller (MSC) is the program memory unit of the microcontroller. The flash memory is readable and writable from both the Cortex-M and DMA. The flash memory is divided into two blocks; the main block and the information block. Program code is normally written to the main block, whereas the information block is available for special user data and flash lock bits. There is also a read-only page in the information block containing system and device calibration data. Read and write operations are supported in en- ergy modes EM0 Active and EM1 Sleep.

3.11.3 Linked Direct Memory Access Controller (LDMA)

The Linked Direct Memory Access (LDMA) controller allows the system to perform memory operations independently of software. This reduces both energy consumption and software workload. The LDMA allows operations to be linked together and staged, enabling so- phisticated operations to be implemented. MGM13P Wireless Gecko Module Data Sheet System Overview silabs.com | Building a more connected world. Rev. 1.4 | 14

3.12 Memory Map

The MGM13P memory map is shown in the figures below. RAM and flash sizes are for the largest memory configuration. Figure 3.4. MGM13P Memory Map — Core Peripherals and Code Space MGM13P Wireless Gecko Module Data Sheet System Overview silabs.com | Building a more connected world. Rev. 1.4 | 15

Figure 3.5. MGM13P Memory Map — Peripherals

3.13 Configuration Summary

Many peripherals on the MGM13P are available in multiple instances. However, certain USART, TIMER and WTIMER instances imple- ment only a subset of the full features for that peripheral type. The table below describes the specific features available on these periph- eral instances. All remaining peripherals support full configuration. Table 3.3. Configuration Summary Peripheral Configuration Pin Connections USART0 IrDA SmartCard US0_TX, US0_RX, US0_CLK, US0_CS USART1 IrDA I2S SmartCard US1_TX, US1_RX, US1_CLK, US1_CS USART2 IrDA SmartCard US2_TX, US2_RX, US2_CLK, US2_CS TIMER0 with DTI TIM0_CC[2:0], TIM0_CDTI[2:0] TIMER1 - TIM1_CC[3:0] WTIMER0 with DTI WTIM0_CC[2:0], WTIM0_CDTI[2:0] MGM13P Wireless Gecko Module Data Sheet System Overview silabs.com | Building a more connected world. Rev. 1.4 | 16

  1. Electrical Specifications

4.1 Electrical Characteristics

All electrical parameters in all tables are specified under the following conditions, unless stated otherwise:

  • Typical values are based on TAMB=25 °C and VDD= 3.3 V, by production test and/or technology characterization.
  • Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output pow- er-specific external RF impedance-matching networks for interfacing to a 50 Ω antenna.
  • Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature, unless stated otherwise. The MGM13P module has only one external supply pin (VDD). There are several internal supply rails mentioned in the electrical specifi- cations, whose connections vary based on transmit power configuration. Refer to 3.3 Power for the relationship between the module's external VDD pin and internal voltage supply rails. Refer to Table 4.2 General Operating Conditions on page 19 for more details about operational supply and temperature limits. MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 17

4.1.1 Absolute Maximum Ratings

Stress levels beyond those listed below may cause permanent damage to the device. This is a stress rating only and functional opera- tion of the devices at those or any other conditions beyond those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and reliability data, see the Quality and Reliability Monitor Report at http://www.silabs.com/support/quality/pages/default.aspx. Table 4.1. Absolute Maximum Ratings Parameter Symbol Test Condition Min Typ Max Unit Storage temperature range TSTG -40 — 85 °C Voltage on any supply pin VDDMAX -0.3 — 3.8 V Voltage ramp rate on any supply pin VDDRAMPMAX — — 1 V / µs DC voltage on any GPIO pin VDIGPIN 5V tolerant GPIO pins1 2 3 -0.3 — Min of 5.25 and IOVDD V Standard GPIO pins -0.3 — IOVDD+0.3 V Maximum RF level at input PRFMAX2G4 — — 10 dBm Total current into supply pins IVDDMAX Source — — 200 mA Total current into VSS ground lines IVSSMAX Sink — — 200 mA Current per I/O pin IIOMAX Sink — — 50 mA Source — — 50 mA Current for all I/O pins IIOALLMAX Sink — — 200 mA Source — — 200 mA Junction temperature TJ -40 — 105 °C Note: 1. When a GPIO pin is routed to the analog block through the APORT, the maximum voltage = IOVDD. 2. Valid for IOVDD in valid operating range or when IOVDD is undriven (high-Z). If IOVDD is connected to a low-impedance source below the valid operating range (e.g. IOVDD shorted to VSS), the pin voltage maximum is IOVDD + 0.3 V, to avoid exceeding the maximum IO current specifications. 3. To operate above the IOVDD supply rail, over-voltage tolerance must be enabled according to the GPIO_Px_OVTDIS register. Pins with over-voltage tolerance disabled have the same limits as Standard GPIO. MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 18

4.1.2 Operating Conditions

The following subsections define the recommended operating conditions for the module.

4.1.2.1 General Operating Conditions

Table 4.2. General Operating Conditions Parameter Symbol Test Condition Min Typ Max Unit Operating ambient tempera- ture range TA -G temperature grade -40 25 85 °C VDD operating supply volt- age VVDD DCDC in regulation 2.4 3.3 3.8 V DCDC in bypass, 50mA load 1.8 3.3 3.8 V HFCORECLK frequency fCORE VSCALE2, MODE = WS1 — — 40 MHz VSCALE0, MODE = WS0 — — 20 MHz HFCLK frequency fHFCLK VSCALE2 — — 40 MHz VSCALE0 — — 20 MHz MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 19

4.1.3 DC-DC Converter

Test conditions: V_DCDC_I=3.3 V, V_DCDC_O=1.8 V, I_DCDC_LOAD=50 mA, Heavy Drive configuration, F_DCDC_LN=7 MHz, un- less otherwise indicated. Table 4.3. DC-DC Converter Parameter Symbol Test Condition Min Typ Max Unit Input voltage range VDCDC_I Bypass mode, IDCDC_LOAD = 50 mA 1.8 — VVREGVDD_ MAX V Low noise (LN) mode, 1.8 V out- put, IDCDC_LOAD = 100 mA, or Low power (LP) mode, 1.8 V out- put, IDCDC_LOAD = 10 mA 2.4 — VVREGVDD_ MAX V Output voltage programma- ble range1 VDCDC_O 1.8 — VVREGVDD V Max load current ILOAD_MAX Low noise (LN) mode, Medium or Heavy Drive2 — — 70 mA Low noise (LN) mode, Light Drive2 — — 50 mA Low power (LP) mode, LPCMPBIASEMxx3 = 0 — — 75 µA Low power (LP) mode, LPCMPBIASEMxx3 = 3 — — 10 mA Note: 1. Due to internal dropout, the dc-dc output will never be able to reach its input voltage, VVREGVDD. 2. Drive levels are defined by configuration of the PFETCNT and NFETCNT registers. Light Drive: PFETCNT=NFETCNT=3; Medi- um Drive: PFETCNT=NFETCNT=7; Heavy Drive: PFETCNT=NFETCNT=15. 3. LPCMPBIASEMxx refers to either LPCMPBIASEM234H in the EMU_DCDCMISCCTRL register or LPCMPBIASEM01 in the EMU_DCDCLOEM01CFG register, depending on the energy mode. MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 20

4.1.4 Current Consumption

4.1.4.1 Current Consumption 3.3 V using DC-DC Converter Unless otherwise indicated, typical conditions are: VDD = 3.3 V. T = 25 °C. Minimum and maximum values in this table represent the worst conditions across process variation at T = 25 °C. Table 4.4. Current Consumption 3.3 V using DC-DC Converter Parameter Symbol Test Condition Min Typ Max Unit Current consumption in EM0 mode with all peripherals dis- abled, DCDC in Low Noise DCM mode1 IACTIVE_DCM 38.4 MHz crystal, CPU running while loop from flash2 — 87 — µA/MHz

38 MHz HFRCO, CPU running

— 69 — µA/MHz — 70 — µA/MHz — 82 — µA/MHz

26 MHz HFRCO, CPU running

— 76 — µA/MHz

1 MHz HFRCO, CPU running

— 615 — µA/MHz Current consumption in EM0 mode with all peripherals dis- abled, DCDC in Low Noise CCM mode3 IACTIVE_CCM 38.4 MHz crystal, CPU running while loop from flash2 — 97 — µA/MHz — 80 — µA/MHz — 81 — µA/MHz — 92 — µA/MHz — 94 — µA/MHz — 1145 — µA/MHz Current consumption in EM0 mode with all peripherals dis- abled and voltage scaling enabled, DCDC in Low Noise CCM mode3 IACTIVE_CCM_VS 19 MHz HFRCO, CPU running while loop from flash — 101 — µA/MHz — 1124 — µA/MHz Current consumption in EM1 mode with all peripherals dis- abled, DCDC in Low Noise DCM mode1 IEM1_DCM 38.4 MHz crystal2 — 56 — µA/MHz

38 MHz HFRCO — 39 — µA/MHz

26 MHz HFRCO — 46 — µA/MHz

1 MHz HFRCO — 588 — µA/MHz

Current consumption in EM1 mode with all peripherals dis- abled and voltage scaling enabled, DCDC in Low Noise DCM mode1 IEM1_DCM_VS 19 MHz HFRCO — 50 — µA/MHz

1 MHz HFRCO — 572 — µA/MHz

MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 21

Parameter Symbol Test Condition Min Typ Max Unit Current consumption in EM2 mode, with voltage scaling enabled, DCDC in LP mode4 IEM2_VS Full 64 kB RAM retention and RTCC running from LFXO — 1.4 — µA Full 64 kB RAM retention and RTCC running from LFRCO — 1.5 — µA 1 bank RAM retention and RTCC running from LFRCO5 — 1.3 — µA Current consumption in EM3 mode, with voltage scaling enabled IEM3_VS Full 64 kB RAM retention and CRYOTIMER running from ULFR- CO — 1.14 — µA Current consumption in EM4H mode, with voltage scaling enabled IEM4H_VS 128 byte RAM retention, RTCC running from LFXO — 0.75 — µA 128 byte RAM retention, CRYO- TIMER running from ULFRCO — 0.44 — µA 128 byte RAM retention, no RTCC — 0.42 — µA Current consumption in EM4S mode IEM4S No RAM retention, no RTCC — 0.07 — µA Note: 1. DCDC Low Noise DCM Mode = Light Drive (PFETCNT=NFETCNT=3), F=3.0 MHz (RCOBAND=0), ANASW=DVDD. 2. CMU_HFXOCTRL_LOWPOWER=0. 3. DCDC Low Noise CCM Mode = Light Drive (PFETCNT=NFETCNT=3), F=6.4 MHz (RCOBAND=4), ANASW=DVDD. 4. DCDC Low Power Mode = Medium Drive, LPOSCDIV=1, LPCMPBIASEM234H=0, LPCLIMILIMSEL=1, ANASW=DVDD. 5. CMU_LFRCOCTRL_ENVREF = 1, CMU_LFRCOCTRL_VREFUPDATE = 1 MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 22

4.1.4.2 Current Consumption Using Radio

Unless otherwise indicated, typical conditions are: VDD = 3.3 V. T = 25 °C. DC-DC on. Minimum and maximum values in this table represent the worst conditions across process variation at T = 25 °C. Table 4.5. Current Consumption Using Radio Parameter Symbol Test Condition Min Typ Max Unit Current consumption in re- ceive mode, active packet reception (MCU in EM1 @

38.4 MHz, peripheral clocks

disabled), T ≤ 85 °C IRX_ACTIVE 125 kbit/s, 2GFSK, F = 2.4 GHz, Radio clock prescaled by 4 — 10.5 — mA 500 kbit/s, 2GFSK, F = 2.4 GHz, Radio clock prescaled by 4 — 10.4 — mA 1 Mbit/s, 2GFSK, F = 2.4 GHz, Radio clock prescaled by 4 — 9.9 — mA 2 Mbit/s, 2GFSK, F = 2.4 GHz, Radio clock prescaled by 4 — 10.6 — mA 802.15.4 receiving frame, F = 2.4 GHz, Radio clock prescaled by 3 — 11 — mA Current consumption in re- ceive mode, listening for packet (MCU in EM1 @ 38.4 MHz, peripheral clocks disa- bled), T ≤ 85 °C IRX_LISTEN 125 kbit/s, 2GFSK, F = 2.4 GHz, No radio clock prescaling — 10.5 — mA 500 kbit/s, 2GFSK, F = 2.4 GHz, No radio clock prescaling — 10.5 — mA 1 Mbit/s, 2GFSK, F = 2.4 GHz, No radio clock prescaling — 10.9 — mA 2 Mbit/s, 2GFSK, F = 2.4 GHz, No radio clock prescaling — 11.6 — mA 802.15.4, F = 2.4 GHz, No radio clock prescaling — 11.9 — mA Current consumption in transmit mode (MCU in EM1 @ 38.4 MHz, peripheral clocks disabled), T ≤ 85 °C ITX F = 2.4 GHz, CW, 0 dBm output power, Radio clock prescaled by 3 — 8.5 — mA F = 2.4 GHz, CW, 0 dBm output power, Radio clock prescaled by 1 — 9.6 — mA F = 2.4 GHz, CW, 10 dBm output power — 38.2 — mA F = 2.4 GHz, CW, 19 dBm output power — 131 — mA MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 23

4.1.5 Wake Up Times

Table 4.6. Wake Up Times Parameter Symbol Test Condition Min Typ Max Unit Wake up time from EM1 tEM1_WU — 3 — AHB Clocks Wake up from EM2 tEM2_WU Code execution from flash — 10.9 — µs Code execution from RAM — 3.8 — µs Wake up from EM3 tEM3_WU Code execution from flash — 10.9 — µs Code execution from RAM — 3.8 — µs Wake up from EM4H1 tEM4H_WU Executing from flash — 90 — µs Wake up from EM4S1 tEM4S_WU Executing from flash — 300 — µs Time from release of reset source to first instruction ex- ecution tRESET Soft Pin Reset released — 51 — µs Any other reset released — 358 — µs Power mode scaling time tSCALE VSCALE0 to VSCALE2, HFCLK =

19 MHz2 3

— 31.8 — µs VSCALE2 to VSCALE0, HFCLK =

19 MHz4

— 4.3 — µs Note: 1. Time from wake up request until first instruction is executed. Wakeup results in device reset. 2. Scaling up from VSCALE0 to VSCALE2 requires approximately 30.3 µs + 28 HFCLKs. 3. VSCALE0 to VSCALE2 voltage change transitions occur at a rate of 10 mV/µs for approximately 20 µs. During this transition, peak currents will be dependent on the value of the DECOUPLE output capacitor, from 35 mA (with a 1 µF capacitor) to 70 mA (with a 2.7 µF capacitor). 4. Scaling down from VSCALE2 to VSCALE0 requires approximately 2.8 µs + 29 HFCLKs.

4.1.6 Brown Out Detector (BOD)

Table 4.7. Brown Out Detector (BOD) Parameter Symbol Test Condition Min Typ Max Unit AVDD BOD threshold VAVDDBOD AVDD rising — — 1.8 V AVDD falling (EM0/EM1) 1.62 — — V AVDD falling (EM2/EM3) 1.53 — — V AVDD BOD hysteresis VAVDDBOD_HYST — 20 — mV AVDD BOD response time tAVDDBOD_DELAY Supply drops at 0.1V/µs rate — 2.4 — µs EM4 BOD threshold VEM4DBOD AVDD rising — — 1.7 V AVDD falling 1.45 — — V EM4 BOD hysteresis VEM4BOD_HYST — 25 — mV EM4 BOD response time tEM4BOD_DELAY Supply drops at 0.1V/µs rate — 300 — µs MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 24

4.1.7 Frequency Synthesizer

Table 4.8. Frequency Synthesizer Parameter Symbol Test Condition Min Typ Max Unit RF synthesizer frequency range fRANGE 2400 - 2483.5 MHz 2400 — 2483.5 MHz LO tuning frequency resolu- tion with 38.4 MHz crystal fRES 2400 - 2483.5 MHz — — 73 Hz Frequency deviation resolu- tion with 38.4 MHz crystal dfRES 2400 - 2483.5 MHz — — 73 Hz Maximum frequency devia- tion with 38.4 MHz crystal dfMAX 2400 - 2483.5 MHz — — 1677 kHz MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 25

4.1.8 2.4 GHz RF Transceiver Characteristics 4.1.8.1 RF Transmitter General Characteristics for 2.4 GHz Band quency 2.45 GHz. Conducted measurement from the antenna feedpoint. Table 4.9. RF Transmitter General Characteristics for 2.4 GHz Band Parameter Symbol Test Condition Min Typ Max Unit Maximum TX power1 POUTMAX 19 dBm-rated part numbers. — 19 — dBm 10 dBm-rated part numbers — 10 — dBm Minimum active TX Power POUTMIN CW -27 — dBm Output power step size POUTSTEP -5 dBm< Output power < 0 dBm — 0.5 — dB 0 dBm < output power < POUTMAX — 0.5 — dB Output power variation vs supply at POUTMAX POUTVAR_V 1.8 V < VVDD < 3.3 V, DCDC in bypass, MGM13P12 — 4.74 — dB 2.4 V < VVDD < 3.3 V, MGM13P02 — 0 — dB 2.4 V < VVDD < 3.3 V using DC- DC converter, MGM13P12 — 1.9 — dB Output power variation vs temperature at POUTMAX POUTVAR_T From -40 to +85 °C, MGM13P02 — 2.05 — dB From -40 to +85 °C, MGM13P12 — 1.8 — dB Output power variation vs RF frequency at POUTMAX POUTVAR_F Over RF tuning frequency range — 0.11 — dB RF tuning frequency range FRANGE 2400 — 2483.5 MHz Note: 1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices cov- ered in this datasheet can be found in the Max TX Power column of the Ordering Information Table. 4.1.8.2 RF Receiver General Characteristics for 2.4 GHz Band quency 2.45 GHz. Conducted measurement from the antenna feedpoint. Table 4.10. RF Receiver General Characteristics for 2.4 GHz Band Parameter Symbol Test Condition Min Typ Max Unit RF tuning frequency range FRANGE 2400 — 2483.5 MHz Receive mode maximum spurious emission SPURRX 30 MHz to 1 GHz — -57 — dBm

1 GHz to 12 GHz — -47 — dBm

Max spurious emissions dur- ing active receive mode, per FCC Part 15.109(a) SPURRX_FCC 216 MHz to 960 MHz, Conducted Measurement — -55.2 — dBm Above 960 MHz, Conducted Measurement — -47.2 — dBm MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 26

quency 2.45 GHz. Conducted measurement from the antenna feedpoint. Parameter Symbol Test Condition Min Typ Max Unit Sensitivity, 1% PER SENS Signal is reference signal. Packet length is 20 octets. Using dc-dc converter. — -102.1 — dBm Signal is reference signal. Packet length is 20 octets. Without dc-dc converter. — -102.1 — dBm 4.1.8.4 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 125 kbps Data Rate quency 2.45 GHz. Conducted measurement from the antenna feedpoint. Table 4.12. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 125 kbps Data Rate Parameter Symbol Test Condition Min Typ Max Unit Sensitivity, 0.1% BER SENS Signal is reference signal1. Using dc-dc converter. — -102.8 — dBm With non-ideal signals as speci- fied in RF-PHY.TS.4.2.2, section 4.6.1. — -102.4 — dBm Note: 1. Reference signal is defined 2GFSK at -79 dBm, Modulation index = 0.5, BT = 0.5, Bit rate = 125 kbps, desired data = PRBS9; interferer data = PRBS15; frequency accuracy better than 1 ppm. 4.1.8.5 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 500 kbps Data Rate quency 2.45 GHz. Conducted measurement from the antenna feedpoint. Table 4.13. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 500 kbps Data Rate Parameter Symbol Test Condition Min Typ Max Unit Sensitivity, 0.1% BER SENS Signal is reference signal1. Using dc-dc converter. — -98.4 — dBm With non-ideal signals as speci- fied in RF-PHY.TS.4.2.2, section 4.6.1. — -97.4 — dBm Note: 1. Reference signal is defined 2GFSK at -72 dBm, Modulation index = 0.5, BT = 0.5, Bit rate = 500 kbps, desired data = PRBS9; interferer data = PRBS15; frequency accuracy better than 1 ppm. MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 27

4.1.8.6 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 1 Mbps Data Rate quency 2.45 GHz. Conducted measurement from the antenna feedpoint. Table 4.14. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 1 Mbps Data Rate Parameter Symbol Test Condition Min Typ Max Unit Sensitivity, 0.1% BER SENS Signal is reference signal1. Using dc-dc converter. — -94.6 — dBm With non-ideal signals as speci- fied in RF-PHY.TS.4.2.2, section 4.6.1. — -94.4 — dBm Note: 1. Reference signal is defined 2GFSK at -67 dBm, Modulation index = 0.5, BT = 0.5, Bit rate = 1 Mbps, desired data = PRBS9; interferer data = PRBS15; frequency accuracy better than 1 ppm. 4.1.8.7 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 2 Mbps Data Rate quency 2.45 GHz. Conducted measurement from the antenna feedpoint. Table 4.15. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 2 Mbps Data Rate Parameter Symbol Test Condition Min Typ Max Unit Sensitivity, 0.1% BER SENS Signal is reference signal1. Using dc-dc converter. — -91 — dBm With non-ideal signals as speci- fied in RF-PHY.TS.4.2.2, section 4.6.1. — -91 — dBm Note: 1. Reference signal is defined 2GFSK at -67 dBm, Modulation index = 0.5, BT = 0.5, Bit rate = 2 Mbps, desired data = PRBS9; interferer data = PRBS15; frequency accuracy better than 1 ppm. MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 28

4.1.9 Oscillators

4.1.9.1 Low-Frequency Crystal Oscillator (LFXO)

Table 4.16. Low-Frequency Crystal Oscillator (LFXO) Parameter Symbol Test Condition Min Typ Max Unit Crystal frequency fLFXO — 32.768 — kHz Overall frequency tolerance in all conditions1 FTLFXO -100 — 100 ppm Note: 1. Nominal crystal frequency tolerance of ± 20 ppm.

4.1.9.2 High-Frequency Crystal Oscillator (HFXO)

Table 4.17. High-Frequency Crystal Oscillator (HFXO) Parameter Symbol Test Condition Min Typ Max Unit Crystal frequency fHFXO 38.4 MHz required for radio trans- ciever operation — 38.4 — MHz Frequency tolerance for the crystal FTHFXO -40 — 40 ppm

4.1.9.3 Low-Frequency RC Oscillator (LFRCO)

Table 4.18. Low-Frequency RC Oscillator (LFRCO) Parameter Symbol Test Condition Min Typ Max Unit Oscillation frequency fLFRCO ENVREF1 = 1 31.3 32.768 33.6 kHz ENVREF1 = 0 31.3 32.768 33.4 kHz Startup time tLFRCO — 500 — µs Current consumption 2 ILFRCO ENVREF = 1 in CMU_LFRCOCTRL — 342 — nA ENVREF = 0 in CMU_LFRCOCTRL — 494 — nA Note: 1. In CMU_LFRCOCTRL register. 2. Block is supplied by AVDD if ANASW = 0, or DVDD if ANASW=1 in EMU_PWRCTRL register. MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 29

4.1.9.4 High-Frequency RC Oscillator (HFRCO)

Table 4.19. High-Frequency RC Oscillator (HFRCO) Parameter Symbol Test Condition Min Typ Max Unit Frequency accuracy fHFRCO_ACC At production calibrated frequen- cies, across supply voltage and temperature -2.5 — 2.5 % Start-up time tHFRCO fHFRCO ≥ 19 MHz — 300 — ns 4 < fHFRCO < 19 MHz — 1 — µs fHFRCO ≤ 4 MHz — 2.5 — µs Current consumption on all supplies IHFRCO fHFRCO = 38 MHz — 267 299 µA fHFRCO = 32 MHz — 224 248 µA fHFRCO = 26 MHz — 189 211 µA fHFRCO = 19 MHz — 154 172 µA fHFRCO = 16 MHz — 133 148 µA fHFRCO = 13 MHz — 118 135 µA fHFRCO = 7 MHz — 89 100 µA fHFRCO = 4 MHz — 34 44 µA fHFRCO = 2 MHz — 29 40 µA fHFRCO = 1 MHz — 26 36 µA Coarse trim step size (% of period) SSHFRCO_COARS E — 0.8 — % Fine trim step size (% of pe- riod) SSHFRCO_FINE — 0.1 — % Period jitter PJHFRCO — 0.2 — % RMS Frequency limits fHFRCO_BAND FREQRANGE = 0, FINETUNIN- GEN = 0 3.47 — 6.15 MHz FREQRANGE = 3, FINETUNIN- GEN = 0 6.24 — 11.45 MHz FREQRANGE = 6, FINETUNIN- GEN = 0 11.3 — 19.8 MHz FREQRANGE = 7, FINETUNIN- GEN = 0 13.45 — 22.8 MHz FREQRANGE = 8, FINETUNIN- GEN = 0 16.5 — 29.0 MHz FREQRANGE = 10, FINETUNIN- GEN = 0 23.11 — 40.63 MHz FREQRANGE = 11, FINETUNIN- GEN = 0 27.27 — 48 MHz FREQRANGE = 12, FINETUNIN- GEN = 0 33.33 — 54 MHz MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 30

4.1.9.5 Ultra-low Frequency RC Oscillator (ULFRCO)

Table 4.20. Ultra-low Frequency RC Oscillator (ULFRCO) Parameter Symbol Test Condition Min Typ Max Unit Oscillation frequency fULFRCO 0.95 1 1.07 kHz

4.1.10 Flash Memory Characteristics1

Table 4.21. Flash Memory Characteristics1 Parameter Symbol Test Condition Min Typ Max Unit Flash erase cycles before failure ECFLASH 10000 — — cycles Flash data retention RETFLASH 10 — — years Word (32-bit) programming time tW_PROG Burst write, 128 words, average time per word 20 26.3 30 µs Single word 62 68.9 80 µs Page erase time2 tPERASE 20 29.5 40 ms Mass erase time3 tMERASE 20 30 40 ms Device erase time4 5 tDERASE — 56.2 70 ms Erase current6 IERASE Page Erase — — 2.0 mA Write current6 IWRITE — — 3.5 mA Supply voltage during flash erase and write VFLASH 1.62 — 3.6 V Note: 1. Flash data retention information is published in the Quarterly Quality and Reliability Report. 2. From setting the ERASEPAGE bit in MSC_WRITECMD to 1 until the BUSY bit in MSC_STATUS is cleared to 0. Internal setup and hold times for flash control signals are included. 3. Mass erase is issued by the CPU and erases all flash. 4. Device erase is issued over the AAP interface and erases all flash, SRAM, the Lock Bit (LB) page, and the User data page Lock Word (ULW). 5. From setting the DEVICEERASE bit in AAP_CMD to 1 until the ERASEBUSY bit in AAP_STATUS is cleared to 0. Internal setup and hold times for flash control signals are included. 6. Measured at 25 °C. MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 31

4.1.11 General-Purpose I/O (GPIO)

Table 4.22. General-Purpose I/O (GPIO) Parameter Symbol Test Condition Min Typ Max Unit Input low voltage VIL GPIO pins — — VDD*0.3 V Input high voltage VIH GPIO pins VDD*0.7 — — V Output high voltage relative to IOVDD VOH Sourcing 3 mA, VDD ≥ 3 V, DRIVESTRENGTH1 = WEAK VDD*0.8 — — V Sourcing 1.2 mA, VDD ≥ 1.62 V, DRIVESTRENGTH1 = WEAK VDD*0.6 — — V Sourcing 20 mA, VDD ≥ 3 V, DRIVESTRENGTH1 = STRONG VDD*0.8 — — V Sourcing 8 mA, VDD ≥ 1.62 V, DRIVESTRENGTH1 = STRONG VDD*0.6 — — V Output low voltage relative to IOVDD VOL Sinking 3 mA, IOVDD ≥ 3 V, DRIVESTRENGTH1 = WEAK — — VDD*0.2 V Sinking 1.2 mA, VDD ≥ 1.62 V, DRIVESTRENGTH1 = WEAK — — VDD*0.4 V Sinking 20 mA, VDD ≥ 3 V, DRIVESTRENGTH1 = STRONG — — VDD*0.2 V Sinking 8 mA, VDD ≥ 1.62 V, DRIVESTRENGTH1 = STRONG — — VDD*0.4 V Input leakage current IIOLEAK GPIO ≤ VDD — 0.1 30 nA Input leakage current on 5VTOL pads above VDD I5VTOLLEAK VDD < GPIO ≤ VDD + 2 V — 3.3 15 µA I/O pin pull-up/pull-down re- sistor RPUD 30 40 65 kΩ Pulse width of pulses re- moved by the glitch suppres- sion filter tIOGLITCH 15 25 45 ns Output fall time, From 70% to 30% of VDD tIOOF CL = 50 pF, DRIVESTRENGTH1 = STRONG, SLEWRATE1 = 0x6 — 1.8 — ns CL = 50 pF, DRIVESTRENGTH1 = WEAK, SLEWRATE1 = 0x6 — 4.5 — ns MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 32

Parameter Symbol Test Condition Min Typ Max Unit Output rise time, From 30% to 70% of VDD tIOOR CL = 50 pF, DRIVESTRENGTH1 = STRONG, SLEWRATE = 0x61 — 2.2 — ns CL = 50 pF, DRIVESTRENGTH1 = WEAK, SLEWRATE1 = 0x6 — 7.4 — ns RESETn low time to ensure pin reset TRESET 100 — — ns Note: 1. In GPIO_Pn_CTRL register.

4.1.12 Voltage Monitor (VMON)

Table 4.23. Voltage Monitor (VMON) Parameter Symbol Test Condition Min Typ Max Unit Supply current (including I_SENSE) IVMON In EM0 or EM1, 1 active channel — 6.3 8 µA In EM0 or EM1, All channels ac- tive — 12.5 15 µA In EM2, EM3 or EM4, 1 channel active and above threshold — 62 — nA In EM2, EM3 or EM4, 1 channel active and below threshold — 62 — nA In EM2, EM3 or EM4, All channels active and above threshold — 99 — nA In EM2, EM3 or EM4, All channels active and below threshold — 99 — nA Loading of monitored supply ISENSE In EM0 or EM1 — 2 — µA In EM2, EM3 or EM4 — 2 — nA Threshold range VVMON_RANGE 1.62 — 3.4 V Threshold step size NVMON_STESP Coarse — 200 — mV Fine — 20 — mV Response time tVMON_RES Supply drops at 1V/µs rate — 460 — ns Hysteresis VVMON_HYST — 26 — mV MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 33

4.1.13 Analog to Digital Converter (ADC)

Specified at 1 Msps, ADCCLK = 16 MHz, BIASPROG = 0, GPBIASACC = 0, unless otherwise indicated. Table 4.24. Analog to Digital Converter (ADC) Parameter Symbol Test Condition Min Typ Max Unit Resolution VRESOLUTION 6 — 12 Bits Input voltage range1 VADCIN Single ended — — VFS V Differential -VFS/2 — VFS/2 V Input range of external refer- ence voltage, single ended and differential VADCREFIN_P 1 — VAVDD V Power supply rejection2 PSRRADC At DC — 80 — dB Analog input common mode rejection ratio CMRRADC At DC — 80 — dB Current from all supplies, us- ing internal reference buffer. Continuous operation. WAR- MUPMODE3 = KEEPADC- WARM IADC_CONTINU- OUS_LP

1 Msps / 16 MHz ADCCLK, BIA-

SPROG = 0, GPBIASACC = 1 4 — 270 290 µA 250 ksps / 4 MHz ADCCLK, BIA- SPROG = 6, GPBIASACC = 1 4 — 125 — µA 62.5 ksps / 1 MHz ADCCLK, BIA- SPROG = 15, GPBIASACC = 1 4 — 80 — µA Current from all supplies, us- ing internal reference buffer. Duty-cycled operation. WAR- MUPMODE3 = NORMAL IADC_NORMAL_LP 35 ksps / 16 MHz ADCCLK, BIA- SPROG = 0, GPBIASACC = 1 4 — 45 — µA 5 ksps / 16 MHz ADCCLK BIA- SPROG = 0, GPBIASACC = 1 4 — 8 — µA Current from all supplies, us- ing internal reference buffer. Duty-cycled operation. AWARMUPMODE3 = KEEP- INSTANDBY or KEEPIN- SLOWACC IADC_STAND- BY_LP 125 ksps / 16 MHz ADCCLK, BIA- SPROG = 0, GPBIASACC = 1 4 — 105 — µA 35 ksps / 16 MHz ADCCLK, BIA- SPROG = 0, GPBIASACC = 1 4 — 70 — µA Current from all supplies, us- ing internal reference buffer. Continuous operation. WAR- MUPMODE3 = KEEPADC- WARM IADC_CONTINU- OUS_HP SPROG = 0, GPBIASACC = 0 4 — 325 — µA 250 ksps / 4 MHz ADCCLK, BIA- SPROG = 6, GPBIASACC = 0 4 — 175 — µA 62.5 ksps / 1 MHz ADCCLK, BIA- SPROG = 15, GPBIASACC = 0 4 — 125 — µA Current from all supplies, us- ing internal reference buffer. Duty-cycled operation. WAR- MUPMODE3 = NORMAL IADC_NORMAL_HP 35 ksps / 16 MHz ADCCLK, BIA- SPROG = 0, GPBIASACC = 0 4 — 85 — µA 5 ksps / 16 MHz ADCCLK BIA- SPROG = 0, GPBIASACC = 0 4 — 16 — µA Current from all supplies, us- ing internal reference buffer. Duty-cycled operation. AWARMUPMODE3 = KEEP- INSTANDBY or KEEPIN- SLOWACC IADC_STAND- BY_HP 125 ksps / 16 MHz ADCCLK, BIA- SPROG = 0, GPBIASACC = 0 4 — 160 — µA 35 ksps / 16 MHz ADCCLK, BIA- SPROG = 0, GPBIASACC = 0 4 — 125 — µA Current from HFPERCLK IADC_CLK HFPERCLK = 16 MHz — 140 — µA MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 34

Parameter Symbol Test Condition Min Typ Max Unit ADC clock frequency fADCCLK — — 16 MHz Throughput rate fADCRATE — — 1 Msps Conversion time5 tADCCONV 6 bit — 7 — cycles 8 bit — 9 — cycles 12 bit — 13 — cycles Startup time of reference generator and ADC core tADCSTART WARMUPMODE3 = NORMAL — — 5 µs WARMUPMODE3 = KEEPIN- STANDBY — — 2 µs WARMUPMODE3 = KEEPINSLO- WACC — — 1 µs SNDR at 1Msps and fIN = 10kHz SNDRADC Internal reference6, differential measurement 58 67 — dB External reference7, differential measurement — 68 — dB Spurious-free dynamic range (SFDR) SFDRADC 1 MSamples/s, 10 kHz full-scale sine wave — 75 — dB Differential non-linearity (DNL) DNLADC 12 bit resolution, No missing co- des -1 — 2 LSB Integral non-linearity (INL), End point method INLADC 12 bit resolution -6 — 6 LSB Offset error VADCOFFSETERR -3 0 3 LSB Gain error in ADC VADCGAIN Using internal reference — -0.2 3.5 % Using external reference — -1 — % Temperature sensor slope VTS_SLOPE — -1.84 — mV/°C Note: 1. The absolute voltage allowed at any ADC input is dictated by the power rail supplied to on-chip circuitry, and may be lower than the effective full scale voltage. All ADC inputs are limited to the ADC supply (AVDD or DVDD depending on EMU_PWRCTRL_ANASW). Any ADC input routed through the APORT will further be limited by the IOVDD supply to the pin. 2. PSRR is referenced to AVDD when ANASW=0 and to DVDD when ANASW=1 in EMU_PWRCTRL. 3. In ADCn_CNTL register. 4. In ADCn_BIASPROG register. 5. Derived from ADCCLK. 6. Internal reference option used corresponds to selection 2V5 in the SINGLECTRL_REF or SCANCTRL_REF register field. The differential input range with this configuration is ± 1.25 V. Typical value is characterized using full-scale sine wave input. Minimum value is production-tested using sine wave input at 1.5 dB lower than full scale. 7. External reference is 1.25 V applied externally to ADCnEXTREFP, with the selection CONF in the SINGLECTRL_REF or SCANCTRL_REF register field and VREFP in the SINGLECTRLX_VREFSEL or SCANCTRLX_VREFSEL field. The differential input range with this configuration is ± 1.25 V. MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 35

4.1.14 Analog Comparator (ACMP)

Table 4.25. Analog Comparator (ACMP) Parameter Symbol Test Condition Min Typ Max Unit Input voltage range VACMPIN ACMPVDD = ACMPn_CTRL_PWRSEL 1 — — VACMPVDD V Supply voltage VACMPVDD BIASPROG2 ≤ 0x10 or FULL- BIAS2 = 0 1.8 — VVREGVDD_ MAX V 0x10 < BIASPROG2 ≤ 0x20 and FULLBIAS2 = 1 2.1 — VVREGVDD_ MAX V Active current not including voltage reference3 IACMP BIASPROG2 = 0x10, FULLBIAS2 = 0 — 306 — nA BIASPROG2 = 0x02, FULLBIAS2 = 1 — 6.1 11 µA BIASPROG2 = 0x20, FULLBIAS2 = 1 — 74 92 µA Current consumption of inter- nal voltage reference3 IACMPREF VLP selected as input using 2.5 V Reference / 4 (0.625 V) — 50 — nA VLP selected as input using VDD — 20 — nA VBDIV selected as input using

1.25 V reference / 1

— 4.1 — µA VADIV selected as input using VDD/1 — 2.4 — µA Hysteresis (VCM = 1.25 V, BIASPROG2 = 0x10, FULL- BIAS2 = 1) VACMPHYST HYSTSEL4 = HYST0 -3 0 3 mV HYSTSEL4 = HYST1 5 18 27 mV HYSTSEL4 = HYST2 12 33 50 mV HYSTSEL4 = HYST3 17 46 67 mV HYSTSEL4 = HYST4 23 57 86 mV HYSTSEL4 = HYST5 26 68 104 mV HYSTSEL4 = HYST6 30 79 130 mV HYSTSEL4 = HYST7 34 90 155 mV HYSTSEL4 = HYST8 -3 0 3 mV HYSTSEL4 = HYST9 -27 -18 -5 mV HYSTSEL4 = HYST10 -50 -33 -12 mV HYSTSEL4 = HYST11 -67 -45 -17 mV HYSTSEL4 = HYST12 -86 -57 -23 mV HYSTSEL4 = HYST13 -104 -67 -26 mV HYSTSEL4 = HYST14 -130 -78 -30 mV HYSTSEL4 = HYST15 -155 -88 -34 mV MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 36

Parameter Symbol Test Condition Min Typ Max Unit Comparator delay5 tACMPDELAY BIASPROG2 = 0x10, FULLBIAS2 = 0 — 3.7 10 µs BIASPROG2 = 0x02, FULLBIAS2 = 1 — 360 1000 ns BIASPROG2 = 0x20, FULLBIAS2 = 1 — 35 — ns Offset voltage VACMPOFFSET BIASPROG2 =0x10, FULLBIAS2 = 1 -35 — 35 mV Reference voltage VACMPREF Internal 1.25 V reference 1 1.25 1.47 V Internal 2.5 V reference 1.98 2.5 2.8 V Capacitive sense internal re- sistance RCSRES CSRESSEL6 = 0 — infinite — kΩ CSRESSEL6 = 1 — 15 — kΩ CSRESSEL6 = 2 — 27 — kΩ CSRESSEL6 = 3 — 39 — kΩ CSRESSEL6 = 4 — 51 — kΩ CSRESSEL6 = 5 — 102 — kΩ CSRESSEL6 = 6 — 164 — kΩ CSRESSEL6 = 7 — 239 — kΩ Note: 1. ACMPVDD is a supply chosen by the setting in ACMPn_CTRL_PWRSEL and may be IOVDD, AVDD or DVDD. 2. In ACMPn_CTRL register. 3. The total ACMP current is the sum of the contributions from the ACMP and its internal voltage reference. IACMPTOTAL = IACMP + IACMPREF. 4. In ACMPn_HYSTERESIS registers. 5. ± 100 mV differential drive. 6. In ACMPn_INPUTSEL register. MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 37

4.1.15 Digital to Analog Converter (VDAC)

DRIVESTRENGTH = 2 unless otherwise specified. Primary VDAC output. Table 4.26. Digital to Analog Converter (VDAC) Parameter Symbol Test Condition Min Typ Max Unit Output voltage VDACOUT Single-Ended 0 — VVREF V Differential1 -VVREF — VVREF V Current consumption includ- ing references (2 channels)2 IDAC 500 ksps, 12-bit, DRIVES- TRENGTH = 2, REFSEL = 4 — 396 — µA 44.1 ksps, 12-bit, DRIVES- TRENGTH = 1, REFSEL = 4 — 72 — µA

200 Hz refresh rate, 12-bit Sam-

ple-Off mode in EM2, DRIVES- TRENGTH = 2, REFSEL = 4, SETTLETIME = 0x02, WARMUP- TIME = 0x0A — 1.2 — µA Current from HFPERCLK3 IDAC_CLK — 5.8 — µA/MHz Sample rate SRDAC — — 500 ksps DAC clock frequency fDAC — — 1 MHz Conversion time tDACCONV fDAC = 1MHz 2 — — µs Settling time tDACSETTLE 50% fs step settling to 5 LSB — 2.5 — µs Startup time tDACSTARTUP Enable to 90% fs output, settling to 10 LSB — — 12 µs Output impedance ROUT DRIVESTRENGTH = 2, 0.4 V ≤ VOUT ≤ VOPA - 0.4 V, -8 mA < IOUT < 8 mA, Full supply range — 2 — Ω DRIVESTRENGTH = 0 or 1, 0.4 V ≤ VOUT ≤ VOPA - 0.4 V, -400 µA < IOUT < 400 µA, Full supply range — 2 — Ω DRIVESTRENGTH = 2, 0.1 V ≤ VOUT ≤ VOPA - 0.1 V, -2 mA < IOUT < 2 mA, Full supply range — 2 — Ω DRIVESTRENGTH = 0 or 1, 0.1 V ≤ VOUT ≤ VOPA - 0.1 V, -100 µA < IOUT < 100 µA, Full supply range — 2 — Ω Power supply rejection ratio4 PSRR Vout = 50% fs. DC — 65.5 — dB MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 38

Parameter Symbol Test Condition Min Typ Max Unit Signal to noise and distortion ratio (1 kHz sine wave), Noise band limited to 250 kHz SNDRDAC 500 ksps, single-ended, internal 1.25V reference — 60.4 — dB 500 ksps, single-ended, internal 2.5V reference — 61.6 — dB 500 ksps, single-ended, 3.3V VDD reference — 64.0 — dB 500 ksps, differential, internal 1.25V reference — 63.3 — dB 500 ksps, differential, internal 2.5V reference — 64.4 — dB 500 ksps, differential, 3.3V VDD reference — 65.8 — dB Signal to noise and distortion ratio (1 kHz sine wave), Noise band limited to 22 kHz SNDRDAC_BAND 500 ksps, single-ended, internal 1.25V reference — 65.3 — dB 500 ksps, single-ended, internal 2.5V reference — 66.7 — dB 500 ksps, single-ended, 3.3V VDD reference — 70.0 — dB 500 ksps, differential, internal 1.25V reference — 67.8 — dB 500 ksps, differential, internal 2.5V reference — 69.0 — dB 500 ksps, differential, 3.3V VDD reference — 68.5 — dB Total harmonic distortion THD — 70.2 — dB Differential non-linearity5 DNLDAC -0.99 — 1 LSB Intergral non-linearity INLDAC -4 — 4 LSB Offset error6 VOFFSET T = 25 °C -8 — 8 mV Across operating temperature range -25 — 25 mV Gain error6 VGAIN T = 25 °C, Low-noise internal ref- erence (REFSEL = 1V25LN or 2V5LN) -2.5 — 2.5 % T = 25 °C, Internal reference (RE- FSEL = 1V25 or 2V5) -5 — 5 % T = 25 °C, External reference (REFSEL = VDD or EXT) -1.8 — 1.8 % Across operating temperature range, Low-noise internal refer- ence (REFSEL = 1V25LN or 2V5LN) -3.5 — 3.5 % Across operating temperature range, Internal reference (RE- FSEL = 1V25 or 2V5) -7.5 — 7.5 % Across operating temperature range, External reference (RE- FSEL = VDD or EXT) -2.0 — 2.0 % MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 39

Parameter Symbol Test Condition Min Typ Max Unit External load capactiance, OUTSCALE=0 CLOAD — — 75 pF Note: 1. In differential mode, the output is defined as the difference between two single-ended outputs. Absolute voltage on each output is limited to the single-ended range. 2. Supply current specifications are for VDAC circuitry operating with static output only and do not include current required to drive the load. 3. Current from HFPERCLK is dependent on HFPERCLK frequency. This current contributes to the total supply current used when the clock to the DAC peripheral is enabled in the CMU. 4. PSRR calculated as 20 * log10(ΔVDD / ΔVOUT), VDAC output at 90% of full scale 5. Entire range is monotonic and has no missing codes. 6. Gain is calculated by measuring the slope from 10% to 90% of full scale. Offset is calculated by comparing actual VDAC output at 10% of full scale to ideal VDAC output at 10% of full scale with the measured gain. MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 40

4.1.16 Current Digital to Analog Converter (IDAC)

Table 4.27. Current Digital to Analog Converter (IDAC) Parameter Symbol Test Condition Min Typ Max Unit Number of ranges NIDAC_RANGES — 4 — ranges Output current IIDAC_OUT RANGSEL1 = RANGE0 0.05 — 1.6 µA RANGSEL1 = RANGE1 1.6 — 4.7 µA RANGSEL1 = RANGE2 0.5 — 16 µA RANGSEL1 = RANGE3 2 — 64 µA Linear steps within each range NIDAC_STEPS — 32 — steps Step size SSIDAC RANGSEL1 = RANGE0 — 50 — nA RANGSEL1 = RANGE1 — 100 — nA RANGSEL1 = RANGE2 — 500 — nA RANGSEL1 = RANGE3 — 2 — µA Total accuracy, STEPSEL1 = 0x10 ACCIDAC EM0 or EM1, AVDD=3.3 V, T = 25 -3 — 3 % EM0 or EM1, Across operating temperature range -18 — 22 % EM2 or EM3, Source mode, RANGSEL1 = RANGE0, AVDD=3.3 V, T = 25 °C — -2 — % EM2 or EM3, Source mode, RANGSEL1 = RANGE1, AVDD=3.3 V, T = 25 °C — -1.7 — % EM2 or EM3, Source mode, RANGSEL1 = RANGE2, AVDD=3.3 V, T = 25 °C — -0.8 — % EM2 or EM3, Source mode, RANGSEL1 = RANGE3, AVDD=3.3 V, T = 25 °C — -0.5 — % EM2 or EM3, Sink mode, RANG- SEL1 = RANGE0, AVDD=3.3 V, T = 25 °C — -0.7 — % EM2 or EM3, Sink mode, RANG- SEL1 = RANGE1, AVDD=3.3 V, T = 25 °C — -0.6 — % EM2 or EM3, Sink mode, RANG- SEL1 = RANGE2, AVDD=3.3 V, T = 25 °C — -0.5 — % EM2 or EM3, Sink mode, RANG- SEL1 = RANGE3, AVDD=3.3 V, T = 25 °C — -0.5 — % Start up time tIDAC_SU Output within 1% of steady state value — 5 — µs MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 41

Parameter Symbol Test Condition Min Typ Max Unit Settling time, (output settled within 1% of steady state val- ue), tIDAC_SETTLE Range setting is changed — 5 — µs Step value is changed — 1 — µs Current consumption2 IIDAC EM0 or EM1 Source mode, ex- cluding output current, Across op- erating temperature range — 11 15 µA EM0 or EM1 Sink mode, exclud- ing output current, Across operat- ing temperature range — 13 18 µA EM2 or EM3 Source mode, ex- cluding output current, T = 25 °C — 0.023 — µA EM2 or EM3 Sink mode, exclud- ing output current, T = 25 °C — 0.041 — µA EM2 or EM3 Source mode, ex- cluding output current, T ≥ 85 °C — 11 — µA EM2 or EM3 Sink mode, exclud- ing output current, T ≥ 85 °C — 13 — µA Output voltage compliance in source mode, source current change relative to current sourced at 0 V ICOMP_SRC RANGESEL1=0, output voltage = min(VIOVDD, VAVDD2-100 mV) — 0.11 — % RANGESEL1=1, output voltage = min(VIOVDD, VAVDD2-100 mV) — 0.06 — % RANGESEL1=2, output voltage = min(VIOVDD, VAVDD2-150 mV) — 0.04 — % RANGESEL1=3, output voltage = min(VIOVDD, VAVDD2-250 mV) — 0.03 — % Output voltage compliance in sink mode, sink current change relative to current sunk at IOVDD ICOMP_SINK RANGESEL1=0, output voltage = 100 mV — 0.12 — % RANGESEL1=1, output voltage = 100 mV — 0.05 — % RANGESEL1=2, output voltage = 150 mV — 0.04 — % RANGESEL1=3, output voltage = 250 mV — 0.03 — % Note: 1. In IDAC_CURPROG register. 2. The IDAC is supplied by either AVDD, DVDD, or IOVDD based on the setting of ANASW in the EMU_PWRCTRL register and PWRSEL in the IDAC_CTRL register. Setting PWRSEL to 1 selects IOVDD. With PWRSEL cleared to 0, ANASW selects be- tween AVDD (0) and DVDD (1). MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 42

4.1.17 Capacitive Sense (CSEN)

Table 4.28. Capacitive Sense (CSEN) Parameter Symbol Test Condition Min Typ Max Unit Single conversion time (1x accumulation) tCNV 12-bit SAR Conversions — 20.2 — µs 16-bit SAR Conversions — 26.4 — µs Delta Modulation Conversion (sin- gle comparison) — 1.55 — µs Maximum external capacitive load CEXTMAX IREFPROG=7 (Gain = 1x), includ- ing routing parasitics — 68 — pF IREFPROG=0 (Gain = 10x), in- cluding routing parasitics — 680 — pF Maximum external series im- pedance REXTMAX — 1 — kΩ Supply current, EM2 bonded conversions, WARMUP- MODE=NORMAL, WAR- MUPCNT=0 ICSEN_BOND 12-bit SAR conversions, 20 ms conversion rate, IREFPROG=7 (Gain = 1x), 10 channels bonded (total capacitance of 330 pF)1 — 326 — nA Delta Modulation conversions, 20 ms conversion rate, IRE- FPROG=7 (Gain = 1x), 10 chan- nels bonded (total capacitance of 330 pF)1 — 226 — nA 12-bit SAR conversions, 200 ms conversion rate, IREFPROG=7 (Gain = 1x), 10 channels bonded (total capacitance of 330 pF)1 — 33 — nA Delta Modulation conversions, 200 ms conversion rate, IRE- FPROG=7 (Gain = 1x), 10 chan- nels bonded (total capacitance of 330 pF)1 — 25 — nA Supply current, EM2 scan conversions, WARMUP- MODE=NORMAL, WAR- MUPCNT=0 ICSEN_EM2 12-bit SAR conversions, 20 ms scan rate, IREFPROG=0 (Gain = 10x), 8 samples per scan1 — 690 — nA Delta Modulation conversions, 20 ms scan rate, 8 comparisons per sample (DMCR = 1, DMR = 2), IREFPROG=0 (Gain = 10x), 8 samples per scan1 — 515 — nA 12-bit SAR conversions, 200 ms scan rate, IREFPROG=0 (Gain = 10x), 8 samples per scan1 — 79 — nA Delta Modulation conversions, 200 ms scan rate, 8 comparisons per sample (DMCR = 1, DMR = 2), IREFPROG=0 (Gain = 10x), 8 samples per scan1 — 57 — nA MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 43

Parameter Symbol Test Condition Min Typ Max Unit Supply current, continuous conversions, WARMUP- MODE=KEEPCSENWARM ICSEN_ACTIVE SAR or Delta Modulation conver- sions of 33 pF capacitor, IRE- FPROG=0 (Gain = 10x), always on — 90.5 — µA HFPERCLK supply current ICSEN_HFPERCLK Current contribution from HFPERCLK when clock to CSEN block is enabled. — 2.25 — µA/MHz Note: 1. Current is specified with a total external capacitance of 33 pF per channel. Average current is dependent on how long the periph- eral is actively sampling channels within the scan period, and scales with the number of samples acquired. Supply current for a specific application can be estimated by multiplying the current per sample by the total number of samples per period (total_cur- rent = single_sample_current * (number_of_channels * accumulation)). MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 44

4.1.18 Operational Amplifier (OPAMP)

Unless otherwise indicated, specified conditions are: Non-inverting input configuration, VDD = 3.3 V, DRIVESTRENGTH = 2, MAIN- OUTEN = 1, CLOAD = 75 pF with OUTSCALE = 0, or CLOAD = 37.5 pF with OUTSCALE = 1. Unit gain buffer and 3X-gain connection as specified in table footnotes1 2. Table 4.29. Operational Amplifier (OPAMP) Parameter Symbol Test Condition Min Typ Max Unit Supply voltage (from AVDD) VOPA HCMDIS = 0, Rail-to-rail input range 2 — 3.8 V HCMDIS = 1 1.62 — 3.8 V Input voltage VIN HCMDIS = 0, Rail-to-rail input range VVSS — VOPA V HCMDIS = 1 VVSS — VOPA-1.2 V Input impedance RIN 100 — — MΩ Output voltage VOUT VVSS — VOPA V Load capacitance3 CLOAD OUTSCALE = 0 — — 75 pF OUTSCALE = 1 — — 37.5 pF Output impedance ROUT DRIVESTRENGTH = 2 or 3, 0.4 V ≤ VOUT ≤ VOPA - 0.4 V, -8 mA < IOUT < 8 mA, Buffer connection, Full supply range — 0.25 — Ω DRIVESTRENGTH = 0 or 1, 0.4 V ≤ VOUT ≤ VOPA - 0.4 V, -400 µA < IOUT < 400 µA, Buffer connection, Full supply range — 0.6 — Ω DRIVESTRENGTH = 2 or 3, 0.1 V ≤ VOUT ≤ VOPA - 0.1 V, -2 mA < IOUT < 2 mA, Buffer connection, Full supply range — 0.4 — Ω DRIVESTRENGTH = 0 or 1, 0.1 V ≤ VOUT ≤ VOPA - 0.1 V, -100 µA < IOUT < 100 µA, Buffer connection, Full supply range — 1 — Ω Internal closed-loop gain GCL Buffer connection 0.99 1 1.01 - 3x Gain connection 2.93 2.99 3.05 - 16x Gain connection 15.07 15.7 16.33 - Active current4 IOPA DRIVESTRENGTH = 3, OUT- SCALE = 0 — 580 — µA DRIVESTRENGTH = 2, OUT- SCALE = 0 — 176 — µA DRIVESTRENGTH = 1, OUT- SCALE = 0 — 13 — µA DRIVESTRENGTH = 0, OUT- SCALE = 0 — 4.7 — µA MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 45

Parameter Symbol Test Condition Min Typ Max Unit Open-loop gain GOL DRIVESTRENGTH = 3 — 135 — dB DRIVESTRENGTH = 2 — 137 — dB DRIVESTRENGTH = 1 — 121 — dB DRIVESTRENGTH = 0 — 109 — dB Loop unit-gain frequency5 UGF DRIVESTRENGTH = 3, Buffer connection — 3.38 — MHz DRIVESTRENGTH = 2, Buffer connection — 0.9 — MHz DRIVESTRENGTH = 1, Buffer connection — 132 — kHz DRIVESTRENGTH = 0, Buffer connection — 34 — kHz DRIVESTRENGTH = 3, 3x Gain connection — 2.57 — MHz DRIVESTRENGTH = 2, 3x Gain connection — 0.71 — MHz DRIVESTRENGTH = 1, 3x Gain connection — 113 — kHz DRIVESTRENGTH = 0, 3x Gain connection — 28 — kHz Phase margin PM DRIVESTRENGTH = 3, Buffer connection — 67 — ° DRIVESTRENGTH = 2, Buffer connection — 69 — ° DRIVESTRENGTH = 1, Buffer connection — 63 — ° DRIVESTRENGTH = 0, Buffer connection — 68 — ° Output voltage noise NOUT DRIVESTRENGTH = 3, Buffer connection, 10 Hz - 10 MHz — 146 — µVrms DRIVESTRENGTH = 2, Buffer connection, 10 Hz - 10 MHz — 163 — µVrms DRIVESTRENGTH = 1, Buffer connection, 10 Hz - 1 MHz — 170 — µVrms DRIVESTRENGTH = 0, Buffer connection, 10 Hz - 1 MHz — 176 — µVrms DRIVESTRENGTH = 3, 3x Gain connection, 10 Hz - 10 MHz — 313 — µVrms DRIVESTRENGTH = 2, 3x Gain connection, 10 Hz - 10 MHz — 271 — µVrms DRIVESTRENGTH = 1, 3x Gain connection, 10 Hz - 1 MHz — 247 — µVrms DRIVESTRENGTH = 0, 3x Gain connection, 10 Hz - 1 MHz — 245 — µVrms MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 46

Parameter Symbol Test Condition Min Typ Max Unit Slew rate6 SR DRIVESTRENGTH = 3, INCBW=17 — 4.7 — V/µs DRIVESTRENGTH = 3, INCBW=0 — 1.5 — V/µs DRIVESTRENGTH = 2, INCBW=17 — 1.27 — V/µs DRIVESTRENGTH = 2, INCBW=0 — 0.42 — V/µs DRIVESTRENGTH = 1, INCBW=17 — 0.17 — V/µs DRIVESTRENGTH = 1, INCBW=0 — 0.058 — V/µs DRIVESTRENGTH = 0, INCBW=17 — 0.044 — V/µs DRIVESTRENGTH = 0, INCBW=0 — 0.015 — V/µs Startup time8 TSTART DRIVESTRENGTH = 2 — — 12 µs Input offset voltage VOSI DRIVESTRENGTH = 2 or 3, T = 25 °C -2 — 2 mV DRIVESTRENGTH = 1 or 0, T = 25 °C -2 — 2 mV DRIVESTRENGTH = 2 or 3, across operating temperature range -12 — 12 mV DRIVESTRENGTH = 1 or 0, across operating temperature range -30 — 30 mV DC power supply rejection ratio9 PSRRDC Input referred — 70 — dB DC common-mode rejection ratio9 CMRRDC Input referred — 70 — dB Total harmonic distortion THDOPA DRIVESTRENGTH = 2, 3x Gain connection, 1 kHz, VOUT = 0.1 V to VOPA - 0.1 V — 90 — dB DRIVESTRENGTH = 0, 3x Gain connection, 0.1 kHz, VOUT = 0.1 V to VOPA - 0.1 V — 90 — dB MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 47

Parameter Symbol Test Condition Min Typ Max Unit Note: 1. Specified configuration for Unit gain buffer configuration is: INCBW = 0, HCMDIS = 0, RESINSEL = DISABLE. VINPUT = 0.5 V, VOUTPUT = 0.5 V. 2. Specified configuration for 3X-Gain configuration is: INCBW = 1, HCMDIS = 1, RESINSEL = VSS, VINPUT = 0.5 V, VOUTPUT = 1.5 V. Nominal voltage gain is 3. 3. If the maximum CLOAD is exceeded, an isolation resistor is required for stability. See AN0038 for more information. 4. Current into the load resistor is excluded. When the OPAMP is connected with closed-loop gain > 1, there will be extra current to drive the resistor feedback network. The internal resistor feedback network has total resistance of 143.5 kOhm, which will cause another ~10 µA current when the OPAMP drives 1.5 V between output and ground. 5. In unit gain connection, UGF is the gain-bandwidth product of the OPAMP. In 3x Gain connection, UGF is the gain-bandwidth product of the OPAMP and 1/3 attenuation of the feedback network. 6. Step between 0.2V and VOPA-0.2V, 10%-90% rising/falling range. 7. When INCBW is set to 1 the OPAMP bandwidth is increased. This is allowed only when the non-inverting close-loop gain is ≥ 3, or the OPAMP may not be stable. 8. From enable to output settled. In sample-and-off mode, RC network after OPAMP will contribute extra delay. Settling error < 1mV. 9. When HCMDIS=1 and input common mode transitions the region from VOPA-1.4V to VOPA-1V, input offset will change. PSRR and CMRR specifications do not apply to this transition region.

4.1.19 Pulse Counter (PCNT)

Table 4.30. Pulse Counter (PCNT) Parameter Symbol Test Condition Min Typ Max Unit Input frequency FIN Asynchronous Single and Quad- rature Modes — — 10 MHz Sampled Modes with Debounce filter set to 0. — — 8 kHz

4.1.20 Analog Port (APORT)

Table 4.31. Analog Port (APORT) Parameter Symbol Test Condition Min Typ Max Unit Supply current1 2 IAPORT Operation in EM0/EM1 — 7 — µA Operation in EM2/EM3 — 63 — nA Note: 1. Supply current increase that occurs when an analog peripheral requests access to APORT. This current is not included in repor- ted peripheral currents. Additional peripherals requesting access to APORT do not incur further current. 2. Specified current is for continuous APORT operation. In applications where the APORT is not requested continuously (e.g. peri- odic ACMP requests from LESENSE in EM2), the average current requirements can be estimated by mutiplying the duty cycle of the requests by the specified continuous current number. MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 48

4.1.21 I2C

4.1.21.1 I2C Standard-mode (Sm)1

Table 4.32. I2C Standard-mode (Sm)1 Parameter Symbol Test Condition Min Typ Max Unit SCL clock frequency2 fSCL 0 — 100 kHz SCL clock low time tLOW 4.7 — — µs SCL clock high time tHIGH 4 — — µs SDA set-up time tSU_DAT 250 — — ns SDA hold time3 tHD_DAT 100 — 3450 ns Repeated START condition set-up time tSU_STA 4.7 — — µs (Repeated) START condition hold time tHD_STA 4 — — µs STOP condition set-up time tSU_STO 4 — — µs Bus free time between a STOP and START condition tBUF 4.7 — — µs Note: 1. For CLHR set to 0 in the I2Cn_CTRL register. 2. For the minimum HFPERCLK frequency required in Standard-mode, refer to the I2C chapter in the reference manual. 3. The maximum SDA hold time (tHD_DAT) needs to be met only when the device does not stretch the low time of SCL (tLOW). MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 49

4.1.21.2 I2C Fast-mode (Fm)1

Table 4.33. I2C Fast-mode (Fm)1 Parameter Symbol Test Condition Min Typ Max Unit SCL clock frequency2 fSCL 0 — 400 kHz SCL clock low time tLOW 1.3 — — µs SCL clock high time tHIGH 0.6 — — µs SDA set-up time tSU_DAT 100 — — ns SDA hold time3 tHD_DAT 100 — 900 ns Repeated START condition set-up time tSU_STA 0.6 — — µs (Repeated) START condition hold time tHD_STA 0.6 — — µs STOP condition set-up time tSU_STO 0.6 — — µs Bus free time between a STOP and START condition tBUF 1.3 — — µs Note: 1. For CLHR set to 1 in the I2Cn_CTRL register. 2. For the minimum HFPERCLK frequency required in Fast-mode, refer to the I2C chapter in the reference manual. 3. The maximum SDA hold time (tHD,DAT) needs to be met only when the device does not stretch the low time of SCL (tLOW). MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 50

4.1.21.3 I2C Fast-mode Plus (Fm+)1

Table 4.34. I2C Fast-mode Plus (Fm+)1 Parameter Symbol Test Condition Min Typ Max Unit SCL clock frequency2 fSCL 0 — 1000 kHz SCL clock low time tLOW 0.5 — — µs SCL clock high time tHIGH 0.26 — — µs SDA set-up time tSU_DAT 50 — — ns SDA hold time tHD_DAT 100 — — ns Repeated START condition set-up time tSU_STA 0.26 — — µs (Repeated) START condition hold time tHD_STA 0.26 — — µs STOP condition set-up time tSU_STO 0.26 — — µs Bus free time between a STOP and START condition tBUF 0.5 — — µs Note: 1. For CLHR set to 0 or 1 in the I2Cn_CTRL register. 2. For the minimum HFPERCLK frequency required in Fast-mode Plus, refer to the I2C chapter in the reference manual. MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 51

4.1.22 USART SPI

Table 4.35. SPI Master Timing Parameter Symbol Test Condition Min Typ Max Unit SCLK period 1 2 3 tSCLK 2 * tHFPERCLK — — ns CS to MOSI 1 2 tCS_MO -12.5 — 14 ns SCLK to MOSI 1 2 tSCLK_MO -8.5 — 10.5 ns MISO setup time 1 2 tSU_MI IOVDD = 1.62 V 90 — — ns IOVDD = 3.0 V 42 — — ns MISO hold time 1 2 tH_MI -9 — — ns Note: 1. Applies for both CLKPHA = 0 and CLKPHA = 1 (figure only shows CLKPHA = 0). 2. Measurement done with 8 pF output loading at 10% and 90% of VDD (figure shows 50% of VDD). 3. tHFPERCLK is one period of the selected HFPERCLK. CS SCLK CLKPOL = 0 MOSI MISO tCS_MO tH_MItSU_MI tSCKL_MO tSCLK SCLK CLKPOL = 1 Figure 4.1. SPI Master Timing Diagram MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 52

Table 4.36. SPI Slave Timing Parameter Symbol Test Condition Min Typ Max Unit SCLK period 1 2 3 tSCLK 6 * tHFPERCLK — — ns SCLK high time1 2 3 tSCLK_HI 2.5 * tHFPERCLK — — ns SCLK low time1 2 3 tSCLK_LO 2.5 * tHFPERCLK — — ns CS active to MISO 1 2 tCS_ACT_MI 4 — 70 ns CS disable to MISO 1 2 tCS_DIS_MI 4 — 50 ns MOSI setup time 1 2 tSU_MO 12.5 — — ns MOSI hold time 1 2 3 tH_MO 13 — — ns SCLK to MISO 1 2 3 tSCLK_MI 6 + 1.5 * tHFPERCLK — 45 + 2.5 * tHFPERCLK ns Note: 1. Applies for both CLKPHA = 0 and CLKPHA = 1 (figure only shows CLKPHA = 0). 2. Measurement done with 8 pF output loading at 10% and 90% of VDD (figure shows 50% of VDD). 3. tHFPERCLK is one period of the selected HFPERCLK. CS SCLK CLKPOL = 0 MOSI MISO tCS_ACT_MI tSCLK_HI tSCLK tSU_MO tH_MO tSCLK_MI tCS_DIS_MI tSCLK_LO SCLK CLKPOL = 1 Figure 4.2. SPI Slave Timing Diagram MGM13P Wireless Gecko Module Data Sheet Electrical Specifications silabs.com | Building a more connected world. Rev. 1.4 | 53

  1. Typical Connection Diagrams

5.1 Network Co-Processor (NCP) Application with UART Host

The MGM13P can be controlled over the UART interface as a peripheral to an external host processor. Typical power supply, program- ming/debug, and host interface connections are shown in the figure below. Refer to AN958: Debugging and Programming Interfaces for Custom Designs for more details. Host CPUVDD PTI_FRAME TCK / SWCLK TMS / SWDIO TDO / SWO TDI +3.3 V Wireless Module GND PD13 PD14 PD15 PA0 PA1 PA2 PA3 PA4 PA5 PB11 GND GND RESETn VDD PF7 PF6 PF5 PF4 PF3 PF2 PF1 PF0 GND PB13 PC6 PC7 PC8 PC9 PC10 PC11 RX TX RTS CTS GPIO RESETn VSS +3.3 V RESETn PTI_DATA PTI_FRAME (PB13) +3.3 V TDO / SWO (PF2) TCK / SWCLK (PF0)TMS / SWDIO (PF1) RESETn Mini Simplicity Debug Connector PTI_DATA (PB11) Figure 5.1. Connection Diagram: UART NCP Configuration

5.2 Network Co-Processor (NCP) Application with SPI Host

The MGM13P can be controlled over the SPI interface as a peripheral to an external host processor. Typical power supply, program- ming/debug and host interface connections are shown in the figure below. Refer to AN958: Debugging and Programming Interfaces for Custom Designs for more details. Host CPU VDD PTI_FRAME TCK / SWCLK TMS / SWDIO TDO / SWO TDI +3.3 V Wireless Module GND PD13 PD14 PD15 PA0 PA1 PA2 PA3 PA4 PA5 PB11 GND GND RESETn VDD PF7 PF6 PF5 PF4 PF3 PF2 PF1 PF0 GND PB13 PC6 PC7 PC8 PC9 PC10 PC11 MOSI MISO SCLK nCS GPIO VSS +3.3 V RESETn PTI_DATA PTI_FRAME (PB13) +3.3 V TDO / SWO (PF2) TCK / SWCLK (PF0)TMS / SWDIO (PF1) RESETn Mini Simplicity Debug Connector PTI_DATA (PB11) nWAKE nHOST_INT RESETn Figure 5.2. Connection Diagram: SPI NCP Configuration MGM13P Wireless Gecko Module Data Sheet Typical Connection Diagrams silabs.com | Building a more connected world. Rev. 1.4 | 54

5.3 SoC Application

The MGM13P can be used in a standalone SoC configuration with no external host processor. Typical power supply and programming/ debug connections are shown in the figure below. Refer to AN958: Debugging and Programming Interfaces for Custom Designs for more details. Serial Flash (optional) VDD TCK / SWCLK TMS / SWDIO TDO / SWO TDI +3.3 V Wireless Module GND PD13 PD14 PD15 PA0 PA1 PA2 PA3 PA4 PA5 PB11 GND GND RESETn VDD PF7 PF6 PF5 PF4 PF3 PF2 PF1 PF0 GND PB13 PC6 PC7 PC8 PC9 PC10 PC11 MOSI MISO SCLK nCS VSS +3.3 V RESETn PTI_FRAME (PB13) +3.3 V TDO / SWO (PF2) TCK / SWCLK (PF0)TMS / SWDIO (PF1) RESETn Mini Simplicity Debug Connector PTI_DATA (PB11) PTI_FRAME PTI_DATA Figure 5.3. Connection Diagram: SoC Configuration MGM13P Wireless Gecko Module Data Sheet Typical Connection Diagrams silabs.com | Building a more connected world. Rev. 1.4 | 55

  1. Layout Guidelines For optimal performance of the MGM13P (with integrated antenna), please follow the PCB layout guidelines and ground plane recom- mendations indicated in this section.

6.1 Module Placement and Application PCB Layout Guidelines

  • Place the module at the edge of the PCB, as shown in Figure 6.1 Recommended Application PCB Layout for MGM13P with Integra- ted Antenna on page 56.
  • Do not place any metal (traces, components, battery, etc.) within the clearance area of the antenna.
  • Connect all ground pads directly to a solid ground plane.
  • Place the ground vias as close to the ground pads as possible.
  • Do not place plastic or any other dielectric material in contact with the antenna. Place vias close to each of the module’s GND pads Place vias along all PCB edges Wireless Module (Top View) GND GND GND GND Antenna Clearance No metal in this area Align module edge with PCB edge Figure 6.1. Recommended Application PCB Layout for MGM13P with Integrated Antenna MGM13P Wireless Gecko Module Data Sheet Layout Guidelines silabs.com | Building a more connected world. Rev. 1.4 | 56

Figure 6.2 Non-optimal Module Placements for MGM13P with Integrated Antenna on page 57 shows examples of layouts that will result in severely degraded RF performance. Figure 6.2. Non-optimal Module Placements for MGM13P with Integrated Antenna The amount of ground plane surrounding the sides of the module will also impact the maximum RF range, as shown in Figure 6.3 Impact of GND Plane Size vs. Range for MGM13P on page 57. Figure 6.3. Impact of GND Plane Size vs. Range for MGM13P

6.2 Effect of Plastic and Metal Materials

Do not place plastic or any other dielectric material in close proximity to the antenna. Any metallic objects in close proximity to the antenna will prevent the antenna from radiating freely. The minimum recommended dis- tance of metallic and/or conductive objects is 10 mm in any direction from the antenna except in the directions of the application PCB ground planes.

6.3 Locating the Module Close to Human Body

Placing the module in contact with or very close to the human body will negatively impact antenna efficiency and reduce range. MGM13P Wireless Gecko Module Data Sheet Layout Guidelines silabs.com | Building a more connected world. Rev. 1.4 | 57

Figure 6.6. Typical 2D Radiation Pattern – Top View MGM13P Wireless Gecko Module Data Sheet Layout Guidelines silabs.com | Building a more connected world. Rev. 1.4 | 59

  1. Hardware Design Guidelines The MGM13P is an easy-to-use module with regard to hardware application design. The guidelines in this section should be followed to guarantee optimal performance.

7.1 Power Supply Requirements

Coin cell batteries cannot withstand high peak currents (e.g. higher than 15 mA). If the peak current exceeds 15 mA it is recommended to place a 47 - 100 µF capacitor in parallel with the coin cell battery to improve battery life time. Note that the total current consumption of the application is a combination of the radio, peripherals and MCU current consumption, and all power consumers must be taken into account. MGM13P should be powered by a unipolar supply voltage with nominal value of 3.3 V.

7.2 Reset Functions

The MGM13P can be reset by three different methods: by pulling the RESET line low, by the internal watchdog timer or by software command. The reset state in MGM13P does not provide any power saving functionality and is not recommended as a means to con- serve power. MGM13P has an internal system power-up reset function. The RESET pin includes an on-chip pull-up resistor and can be left unconnected if no external reset switch or source is used.

7.3 Debug and Firmware Updates

Refer to the following application note: AN958: Debugging and Programming Interfaces for Custom Designs.

7.3.1 Programming and Debug Connections

It is recommended to expose the debug pins in your own hardware design for firmware update and debug purposes. The following table lists the required pins for JTAG connection and SWD connections. Certain debug pins have internal pull-down or pull-ups enabled by default, and leaving them enabled may increase current consumption if left connected to supply or ground. If the JTAG pins are enabled, the module must be power cycled to return to a SWD debug config- uration. Table 7.1. Debug Pins Pin Name Pin Number JTAG Signal SWD Signal Comments PF3 24 TDI N/A This pin is disabled after reset. Once enabled the pin has a built-in pull-up. PF2 23 TDO N/A This pin is disabled after reset. PF1 22 TMS SWDIO Pin is enabled after reset and has a built-in pull-up. PF0 21 TCK SWCLK Pin is enabled after reset and has a built-in pull-down.

7.3.2 Packet Trace Interface (PTI)

The MGM13P integrates a true PHY-level packet trace interface (PTI) with the MAC, allowing complete, non-intrusive capture of all packets to and from the EFR32 Wireless STK development tools. The PTI_DATA and PTI_FRAME signals are configurable via soft- ware. Refer to Table 8.3 Alternate Functionality Overview on page 72 for pin availability. MGM13P Wireless Gecko Module Data Sheet Hardware Design Guidelines silabs.com | Building a more connected world. Rev. 1.4 | 60

  1. Pin Definitions

8.1 MGM13P Device Pinout

Figure 8.1. MGM13P Device Pinout The following table provides package pin connections and general descriptions of pin functionality. For detailed information on the sup- ported features for each GPIO pin, see 8.2 GPIO Functionality Table or 8.3 Alternate Functionality Overview. Table 8.1. MGM13P Device Pinout Pin Name Pin(s) Description Pin Name Pin(s) Description GND Ground PD13 2 GPIO PD14 3 GPIO PD15 4 GPIO PA0 5 GPIO PA1 6 GPIO PA2 7 GPIO PA3 8 GPIO MGM13P Wireless Gecko Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.4 | 61

Pin Name Pin(s) Description Pin Name Pin(s) Description PA4 9 GPIO PA5 10 GPIO (5V) PB11 11 GPIO PB13 13 GPIO PC6 14 GPIO (5V) PC7 15 GPIO (5V) PC8 16 GPIO (5V) PC9 17 GPIO (5V) PC10 18 GPIO (5V) PC11 19 GPIO (5V) PF0 21 GPIO (5V) PF1 22 GPIO (5V) PF2 23 GPIO (5V) PF3 24 GPIO (5V) PF4 25 GPIO (5V) PF5 26 GPIO (5V) PF6 27 GPIO (5V) PF7 28 GPIO (5V) VDD 29 Module Power Supply RESETn 30 Reset input, active low. To apply an ex- ternal reset source to this pin, it is re- quired to only drive this pin low during reset, and let the internal pull-up ensure that reset is released. Note: 1. GPIO with 5V tolerance are indicated by (5V). MGM13P Wireless Gecko Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.4 | 62

8.2 GPIO Functionality Table

A wide selection of alternate functionality is available for multiplexing to various pins. The following table shows the name of each GPIO pin, followed by the functionality available on that pin. Refer to 8.3 Alternate Functionality Overview for a list of GPIO locations available for each function. Table 8.2. GPIO Functionality Table GPIO Name Pin Alternate Functionality / Description Analog Timers Communication Radio Other PA0 BUSDY BUSCX ADC0_EXTN TIM0_CC0 #0 TIM0_CC1 #31 TIM0_CC2 #30 TIM0_CDTI0 #29 TIM0_CDTI1 #28 TIM0_CDTI2 #27 TIM1_CC0 #0 TIM1_CC1 #31 TIM1_CC2 #30 TIM1_CC3 #29 WTIM0_CC0 #0 LE- TIM0_OUT0 #0 LE- TIM0_OUT1 #31 PCNT0_S0IN #0 PCNT0_S1IN #31 US0_TX #0 US0_RX #31 US0_CLK #30 US0_CS #29 US0_CTS #28 US0_RTS #27 US1_TX #0 US1_RX #31 US1_CLK #30 US1_CS #29 US1_CTS #28 US1_RTS #27 LEU0_TX #0 LEU0_RX #31 I2C0_SDA #0 I2C0_SCL #31 FRC_DCLK #0 FRC_DOUT #31 FRC_DFRAME #30 MODEM_DCLK #0 MODEM_DIN #31 MODEM_DOUT #30 CMU_CLK1 #0 PRS_CH6 #0 PRS_CH7 #10 PRS_CH8 #9 PRS_CH9 #8 ACMP0_O #0 ACMP1_O #0 LES_CH8 PA1 BUSCY BUSDX ADC0_EXTP VDAC0_EXT TIM0_CC0 #1 TIM0_CC1 #0 TIM0_CC2 #31 TIM0_CDTI0 #30 TIM0_CDTI1 #29 TIM0_CDTI2 #28 TIM1_CC0 #1 TIM1_CC1 #0 TIM1_CC2 #31 TIM1_CC3 #30 WTIM0_CC0 #1 LE- TIM0_OUT0 #1 LE- TIM0_OUT1 #0 PCNT0_S0IN #1 PCNT0_S1IN #0 US0_TX #1 US0_RX #0 US0_CLK #31 US0_CS #30 US0_CTS #29 US0_RTS #28 US1_TX #1 US1_RX #0 US1_CLK #31 US1_CS #30 US1_CTS #29 US1_RTS #28 LEU0_TX #1 LEU0_RX #0 I2C0_SDA #1 I2C0_SCL #0 FRC_DCLK #1 FRC_DOUT #0 FRC_DFRAME #31 MODEM_DCLK #1 MODEM_DIN #0 MODEM_DOUT #31 CMU_CLK0 #0 PRS_CH6 #1 PRS_CH7 #0 PRS_CH8 #10 PRS_CH9 #9 ACMP0_O #1 ACMP1_O #1 LES_CH9 PA2 VDAC0_OUT1ALT / OPA1_OUTALT #1 BUSDY BUSCX OPA0_P TIM0_CC0 #2 TIM0_CC1 #1 TIM0_CC2 #0 TIM0_CDTI0 #31 TIM0_CDTI1 #30 TIM0_CDTI2 #29 TIM1_CC0 #2 TIM1_CC1 #1 TIM1_CC2 #0 TIM1_CC3 #31 WTIM0_CC0 #2 WTIM0_CC1 #0 LE- TIM0_OUT0 #2 LE- TIM0_OUT1 #1 PCNT0_S0IN #2 PCNT0_S1IN #1 US0_TX #2 US0_RX #1 US0_CLK #0 US0_CS #31 US0_CTS #30 US0_RTS #29 US1_TX #2 US1_RX #1 US1_CLK #0 US1_CS #31 US1_CTS #30 US1_RTS #29 LEU0_TX #2 LEU0_RX #1 I2C0_SDA #2 I2C0_SCL #1 FRC_DCLK #2 FRC_DOUT #1 FRC_DFRAME #0 MODEM_DCLK #2 MODEM_DIN #1 MODEM_DOUT #0 PRS_CH6 #2 PRS_CH7 #1 PRS_CH8 #0 PRS_CH9 #10 ACMP0_O #2 ACMP1_O #2 LES_CH10 MGM13P Wireless Gecko Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.4 | 63

GPIO Name Pin Alternate Functionality / Description Analog Timers Communication Radio Other PA3 BUSCY BUSDX VDAC0_OUT0 / OPA0_OUT TIM0_CC0 #3 TIM0_CC1 #2 TIM0_CC2 #1 TIM0_CDTI0 #0 TIM0_CDTI1 #31 TIM0_CDTI2 #30 TIM1_CC0 #3 TIM1_CC1 #2 TIM1_CC2 #1 TIM1_CC3 #0 WTIM0_CC0 #3 WTIM0_CC1 #1 LE- TIM0_OUT0 #3 LE- TIM0_OUT1 #2 PCNT0_S0IN #3 PCNT0_S1IN #2 US0_TX #3 US0_RX #2 US0_CLK #1 US0_CS #0 US0_CTS #31 US0_RTS #30 US1_TX #3 US1_RX #2 US1_CLK #1 US1_CS #0 US1_CTS #31 US1_RTS #30 LEU0_TX #3 LEU0_RX #2 I2C0_SDA #3 I2C0_SCL #2 FRC_DCLK #3 FRC_DOUT #2 FRC_DFRAME #1 MODEM_DCLK #3 MODEM_DIN #2 MODEM_DOUT #1 PRS_CH6 #3 PRS_CH7 #2 PRS_CH8 #1 PRS_CH9 #0 ACMP0_O #3 ACMP1_O #3 LES_CH11 GPIO_EM4WU8 PA4 VDAC0_OUT1ALT / OPA1_OUTALT #2 BUSDY BUSCX OPA0_N TIM0_CC0 #4 TIM0_CC1 #3 TIM0_CC2 #2 TIM0_CDTI0 #1 TIM0_CDTI1 #0 TIM0_CDTI2 #31 TIM1_CC0 #4 TIM1_CC1 #3 TIM1_CC2 #2 TIM1_CC3 #1 WTIM0_CC0 #4 WTIM0_CC1 #2 WTIM0_CC2 #0 LE- TIM0_OUT0 #4 LE- TIM0_OUT1 #3 PCNT0_S0IN #4 PCNT0_S1IN #3 US0_TX #4 US0_RX #3 US0_CLK #2 US0_CS #1 US0_CTS #0 US0_RTS #31 US1_TX #4 US1_RX #3 US1_CLK #2 US1_CS #1 US1_CTS #0 US1_RTS #31 LEU0_TX #4 LEU0_RX #3 I2C0_SDA #4 I2C0_SCL #3 FRC_DCLK #4 FRC_DOUT #3 FRC_DFRAME #2 MODEM_DCLK #4 MODEM_DIN #3 MODEM_DOUT #2 PRS_CH6 #4 PRS_CH7 #3 PRS_CH8 #2 PRS_CH9 #1 ACMP0_O #4 ACMP1_O #4 LES_CH12 PA5 VDAC0_OUT0ALT / OPA0_OUTALT #0 BUSCY BUSDX TIM0_CC0 #5 TIM0_CC1 #4 TIM0_CC2 #3 TIM0_CDTI0 #2 TIM0_CDTI1 #1 TIM0_CDTI2 #0 TIM1_CC0 #5 TIM1_CC1 #4 TIM1_CC2 #3 TIM1_CC3 #2 WTIM0_CC0 #5 WTIM0_CC1 #3 WTIM0_CC2 #1 LE- TIM0_OUT0 #5 LE- TIM0_OUT1 #4 PCNT0_S0IN #5 PCNT0_S1IN #4 US0_TX #5 US0_RX #4 US0_CLK #3 US0_CS #2 US0_CTS #1 US0_RTS #0 US1_TX #5 US1_RX #4 US1_CLK #3 US1_CS #2 US1_CTS #1 US1_RTS #0 US2_TX #0 US2_RX #31 US2_CLK #30 US2_CS #29 US2_CTS #28 US2_RTS #27 LEU0_TX #5 LEU0_RX #4 I2C0_SDA #5 I2C0_SCL #4 FRC_DCLK #5 FRC_DOUT #4 FRC_DFRAME #3 MODEM_DCLK #5 MODEM_DIN #4 MODEM_DOUT #3 CMU_CLKI0 #4 PRS_CH6 #5 PRS_CH7 #4 PRS_CH8 #3 PRS_CH9 #2 ACMP0_O #5 ACMP1_O #5 LES_CH13 ETM_TCLK #1 MGM13P Wireless Gecko Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.4 | 64

GPIO Name Pin Alternate Functionality / Description Analog Timers Communication Radio Other PB11 BUSCY BUSDX OPA2_P TIM0_CC0 #6 TIM0_CC1 #5 TIM0_CC2 #4 TIM0_CDTI0 #3 TIM0_CDTI1 #2 TIM0_CDTI2 #1 TIM1_CC0 #6 TIM1_CC1 #5 TIM1_CC2 #4 TIM1_CC3 #3 WTIM0_CC0 #15 WTIM0_CC1 #13 WTIM0_CC2 #11 WTIM0_CDTI0 #7 WTIM0_CDTI1 #5 WTIM0_CDTI2 #3 LETIM0_OUT0 #6 LETIM0_OUT1 #5 PCNT0_S0IN #6 PCNT0_S1IN #5 US0_TX #6 US0_RX #5 US0_CLK #4 US0_CS #3 US0_CTS #2 US0_RTS #1 US1_TX #6 US1_RX #5 US1_CLK #4 US1_CS #3 US1_CTS #2 US1_RTS #1 LEU0_TX #6 LEU0_RX #5 I2C0_SDA #6 I2C0_SCL #5 FRC_DCLK #6 FRC_DOUT #5 FRC_DFRAME #4 MODEM_DCLK #6 MODEM_DIN #5 MODEM_DOUT #4 PRS_CH6 #6 PRS_CH7 #5 PRS_CH8 #4 PRS_CH9 #3 ACMP0_O #6 ACMP1_O #6 PB13 BUSCY BUSDX OPA2_N TIM0_CC0 #8 TIM0_CC1 #7 TIM0_CC2 #6 TIM0_CDTI0 #5 TIM0_CDTI1 #4 TIM0_CDTI2 #3 TIM1_CC0 #8 TIM1_CC1 #7 TIM1_CC2 #6 TIM1_CC3 #5 WTIM0_CC0 #17 WTIM0_CC1 #15 WTIM0_CC2 #13 WTIM0_CDTI0 #9 WTIM0_CDTI1 #7 WTIM0_CDTI2 #5 LETIM0_OUT0 #8 LETIM0_OUT1 #7 PCNT0_S0IN #8 PCNT0_S1IN #7 US0_TX #8 US0_RX #7 US0_CLK #6 US0_CS #5 US0_CTS #4 US0_RTS #3 US1_TX #8 US1_RX #7 US1_CLK #6 US1_CS #5 US1_CTS #4 US1_RTS #3 LEU0_TX #8 LEU0_RX #7 I2C0_SDA #8 I2C0_SCL #7 FRC_DCLK #8 FRC_DOUT #7 FRC_DFRAME #6 MODEM_DCLK #8 MODEM_DIN #7 MODEM_DOUT #6 CMU_CLKI0 #0 PRS_CH6 #8 PRS_CH7 #7 PRS_CH8 #6 PRS_CH9 #5 ACMP0_O #8 ACMP1_O #8 DBG_SWO #1 GPIO_EM4WU9 PC6 BUSBY BUSAX TIM0_CC0 #11 TIM0_CC1 #10 TIM0_CC2 #9 TIM0_CDTI0 #8 TIM0_CDTI1 #7 TIM0_CDTI2 #6 TIM1_CC0 #11 TIM1_CC1 #10 TIM1_CC2 #9 TIM1_CC3 #8 WTIM0_CC0 #26 WTIM0_CC1 #24 WTIM0_CC2 #22 WTIM0_CDTI0 #18 WTIM0_CDTI1 #16 WTIM0_CDTI2 #14 LETIM0_OUT0 #11 LETIM0_OUT1 #10 PCNT0_S0IN #11 PCNT0_S1IN #10 US0_TX #11 US0_RX #10 US0_CLK #9 US0_CS #8 US0_CTS #7 US0_RTS #6 US1_TX #11 US1_RX #10 US1_CLK #9 US1_CS #8 US1_CTS #7 US1_RTS #6 LEU0_TX #11 LEU0_RX #10 I2C0_SDA #11 I2C0_SCL #10 FRC_DCLK #11 FRC_DOUT #10 FRC_DFRAME #9 MODEM_DCLK #11 MODEM_DIN #10 MODEM_DOUT #9 CMU_CLK0 #2 CMU_CLKI0 #2 PRS_CH0 #8 PRS_CH9 #11 PRS_CH10 #0 PRS_CH11 #5 ACMP0_O #11 ACMP1_O #11 ETM_TCLK #3 MGM13P Wireless Gecko Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.4 | 65

GPIO Name Pin Alternate Functionality / Description Analog Timers Communication Radio Other PC7 BUSAY BUSBX TIM0_CC0 #12 TIM0_CC1 #11 TIM0_CC2 #10 TIM0_CDTI0 #9 TIM0_CDTI1 #8 TIM0_CDTI2 #7 TIM1_CC0 #12 TIM1_CC1 #11 TIM1_CC2 #10 TIM1_CC3 #9 WTIM0_CC0 #27 WTIM0_CC1 #25 WTIM0_CC2 #23 WTIM0_CDTI0 #19 WTIM0_CDTI1 #17 WTIM0_CDTI2 #15 LETIM0_OUT0 #12 LETIM0_OUT1 #11 PCNT0_S0IN #12 PCNT0_S1IN #11 US0_TX #12 US0_RX #11 US0_CLK #10 US0_CS #9 US0_CTS #8 US0_RTS #7 US1_TX #12 US1_RX #11 US1_CLK #10 US1_CS #9 US1_CTS #8 US1_RTS #7 LEU0_TX #12 LEU0_RX #11 I2C0_SDA #12 I2C0_SCL #11 FRC_DCLK #12 FRC_DOUT #11 FRC_DFRAME #10 MODEM_DCLK #12 MODEM_DIN #11 MODEM_DOUT #10 CMU_CLK1 #2 PRS_CH0 #9 PRS_CH9 #12 PRS_CH10 #1 PRS_CH11 #0 ACMP0_O #12 ACMP1_O #12 ETM_TD0 PC8 BUSBY BUSAX TIM0_CC0 #13 TIM0_CC1 #12 TIM0_CC2 #11 TIM0_CDTI0 #10 TIM0_CDTI1 #9 TIM0_CDTI2 #8 TIM1_CC0 #13 TIM1_CC1 #12 TIM1_CC2 #11 TIM1_CC3 #10 WTIM0_CC0 #28 WTIM0_CC1 #26 WTIM0_CC2 #24 WTIM0_CDTI0 #20 WTIM0_CDTI1 #18 WTIM0_CDTI2 #16 LETIM0_OUT0 #13 LETIM0_OUT1 #12 PCNT0_S0IN #13 PCNT0_S1IN #12 US0_TX #13 US0_RX #12 US0_CLK #11 US0_CS #10 US0_CTS #9 US0_RTS #8 US1_TX #13 US1_RX #12 US1_CLK #11 US1_CS #10 US1_CTS #9 US1_RTS #8 LEU0_TX #13 LEU0_RX #12 I2C0_SDA #13 I2C0_SCL #12 FRC_DCLK #13 FRC_DOUT #12 FRC_DFRAME #11 MODEM_DCLK #13 MODEM_DIN #12 MODEM_DOUT #11 PRS_CH0 #10 PRS_CH9 #13 PRS_CH10 #2 PRS_CH11 #1 ACMP0_O #13 ACMP1_O #13 ETM_TD1 PC9 BUSAY BUSBX TIM0_CC0 #14 TIM0_CC1 #13 TIM0_CC2 #12 TIM0_CDTI0 #11 TIM0_CDTI1 #10 TIM0_CDTI2 #9 TIM1_CC0 #14 TIM1_CC1 #13 TIM1_CC2 #12 TIM1_CC3 #11 WTIM0_CC0 #29 WTIM0_CC1 #27 WTIM0_CC2 #25 WTIM0_CDTI0 #21 WTIM0_CDTI1 #19 WTIM0_CDTI2 #17 LETIM0_OUT0 #14 LETIM0_OUT1 #13 PCNT0_S0IN #14 PCNT0_S1IN #13 US0_TX #14 US0_RX #13 US0_CLK #12 US0_CS #11 US0_CTS #10 US0_RTS #9 US1_TX #14 US1_RX #13 US1_CLK #12 US1_CS #11 US1_CTS #10 US1_RTS #9 LEU0_TX #14 LEU0_RX #13 I2C0_SDA #14 I2C0_SCL #13 FRC_DCLK #14 FRC_DOUT #13 FRC_DFRAME #12 MODEM_DCLK #14 MODEM_DIN #13 MODEM_DOUT #12 PRS_CH0 #11 PRS_CH9 #14 PRS_CH10 #3 PRS_CH11 #2 ACMP0_O #14 ACMP1_O #14 ETM_TD2 MGM13P Wireless Gecko Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.4 | 66

GPIO Name Pin Alternate Functionality / Description Analog Timers Communication Radio Other PC10 BUSBY BUSAX TIM0_CC0 #15 TIM0_CC1 #14 TIM0_CC2 #13 TIM0_CDTI0 #12 TIM0_CDTI1 #11 TIM0_CDTI2 #10 TIM1_CC0 #15 TIM1_CC1 #14 TIM1_CC2 #13 TIM1_CC3 #12 WTIM0_CC0 #30 WTIM0_CC1 #28 WTIM0_CC2 #26 WTIM0_CDTI0 #22 WTIM0_CDTI1 #20 WTIM0_CDTI2 #18 LETIM0_OUT0 #15 LETIM0_OUT1 #14 PCNT0_S0IN #15 PCNT0_S1IN #14 US0_TX #15 US0_RX #14 US0_CLK #13 US0_CS #12 US0_CTS #11 US0_RTS #10 US1_TX #15 US1_RX #14 US1_CLK #13 US1_CS #12 US1_CTS #11 US1_RTS #10 LEU0_TX #15 LEU0_RX #14 I2C0_SDA #15 I2C0_SCL #14 I2C1_SDA #19 I2C1_SCL #18 FRC_DCLK #15 FRC_DOUT #14 FRC_DFRAME #13 MODEM_DCLK #15 MODEM_DIN #14 MODEM_DOUT #13 CMU_CLK1 #3 PRS_CH0 #12 PRS_CH9 #15 PRS_CH10 #4 PRS_CH11 #3 ACMP0_O #15 ACMP1_O #15 ETM_TD3 GPIO_EM4WU12 PC11 BUSAY BUSBX TIM0_CC0 #16 TIM0_CC1 #15 TIM0_CC2 #14 TIM0_CDTI0 #13 TIM0_CDTI1 #12 TIM0_CDTI2 #11 TIM1_CC0 #16 TIM1_CC1 #15 TIM1_CC2 #14 TIM1_CC3 #13 WTIM0_CC0 #31 WTIM0_CC1 #29 WTIM0_CC2 #27 WTIM0_CDTI0 #23 WTIM0_CDTI1 #21 WTIM0_CDTI2 #19 LETIM0_OUT0 #16 LETIM0_OUT1 #15 PCNT0_S0IN #16 PCNT0_S1IN #15 US0_TX #16 US0_RX #15 US0_CLK #14 US0_CS #13 US0_CTS #12 US0_RTS #11 US1_TX #16 US1_RX #15 US1_CLK #14 US1_CS #13 US1_CTS #12 US1_RTS #11 LEU0_TX #16 LEU0_RX #15 I2C0_SDA #16 I2C0_SCL #15 I2C1_SDA #20 I2C1_SCL #19 FRC_DCLK #16 FRC_DOUT #15 FRC_DFRAME #14 MODEM_DCLK #16 MODEM_DIN #15 MODEM_DOUT #14 CMU_CLK0 #3 PRS_CH0 #13 PRS_CH9 #16 PRS_CH10 #5 PRS_CH11 #4 ACMP0_O #16 ACMP1_O #16 DBG_SWO #3 PD13 VDAC0_OUT0ALT / OPA0_OUTALT #1 BUSCY BUSDX OPA1_P TIM0_CC0 #21 TIM0_CC1 #20 TIM0_CC2 #19 TIM0_CDTI0 #18 TIM0_CDTI1 #17 TIM0_CDTI2 #16 TIM1_CC0 #21 TIM1_CC1 #20 TIM1_CC2 #19 TIM1_CC3 #18 WTIM0_CDTI0 #29 WTIM0_CDTI1 #27 WTIM0_CDTI2 #25 LETIM0_OUT0 #21 LETIM0_OUT1 #20 PCNT0_S0IN #21 PCNT0_S1IN #20 US0_TX #21 US0_RX #20 US0_CLK #19 US0_CS #18 US0_CTS #17 US0_RTS #16 US1_TX #21 US1_RX #20 US1_CLK #19 US1_CS #18 US1_CTS #17 US1_RTS #16 LEU0_TX #21 LEU0_RX #20 I2C0_SDA #21 I2C0_SCL #20 FRC_DCLK #21 FRC_DOUT #20 FRC_DFRAME #19 MODEM_DCLK #21 MODEM_DIN #20 MODEM_DOUT #19 PRS_CH3 #12 PRS_CH4 #4 PRS_CH5 #3 PRS_CH6 #15 ACMP0_O #21 ACMP1_O #21 LES_CH5 MGM13P Wireless Gecko Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.4 | 67

GPIO Name Pin Alternate Functionality / Description Analog Timers Communication Radio Other PD14 BUSDY BUSCX VDAC0_OUT1 / OPA1_OUT TIM0_CC0 #22 TIM0_CC1 #21 TIM0_CC2 #20 TIM0_CDTI0 #19 TIM0_CDTI1 #18 TIM0_CDTI2 #17 TIM1_CC0 #22 TIM1_CC1 #21 TIM1_CC2 #20 TIM1_CC3 #19 WTIM0_CDTI0 #30 WTIM0_CDTI1 #28 WTIM0_CDTI2 #26 LETIM0_OUT0 #22 LETIM0_OUT1 #21 PCNT0_S0IN #22 PCNT0_S1IN #21 US0_TX #22 US0_RX #21 US0_CLK #20 US0_CS #19 US0_CTS #18 US0_RTS #17 US1_TX #22 US1_RX #21 US1_CLK #20 US1_CS #19 US1_CTS #18 US1_RTS #17 LEU0_TX #22 LEU0_RX #21 I2C0_SDA #22 I2C0_SCL #21 FRC_DCLK #22 FRC_DOUT #21 FRC_DFRAME #20 MODEM_DCLK #22 MODEM_DIN #21 MODEM_DOUT #20 CMU_CLK0 #5 PRS_CH3 #13 PRS_CH4 #5 PRS_CH5 #4 PRS_CH6 #16 ACMP0_O #22 ACMP1_O #22 LES_CH6 GPIO_EM4WU4 PD15 VDAC0_OUT0ALT / OPA0_OUTALT #2 BUSCY BUSDX OPA1_N TIM0_CC0 #23 TIM0_CC1 #22 TIM0_CC2 #21 TIM0_CDTI0 #20 TIM0_CDTI1 #19 TIM0_CDTI2 #18 TIM1_CC0 #23 TIM1_CC1 #22 TIM1_CC2 #21 TIM1_CC3 #20 WTIM0_CDTI0 #31 WTIM0_CDTI1 #29 WTIM0_CDTI2 #27 LETIM0_OUT0 #23 LETIM0_OUT1 #22 PCNT0_S0IN #23 PCNT0_S1IN #22 US0_TX #23 US0_RX #22 US0_CLK #21 US0_CS #20 US0_CTS #19 US0_RTS #18 US1_TX #23 US1_RX #22 US1_CLK #21 US1_CS #20 US1_CTS #19 US1_RTS #18 LEU0_TX #23 LEU0_RX #22 I2C0_SDA #23 I2C0_SCL #22 FRC_DCLK #23 FRC_DOUT #22 FRC_DFRAME #21 MODEM_DCLK #23 MODEM_DIN #22 MODEM_DOUT #21 CMU_CLK1 #5 PRS_CH3 #14 PRS_CH4 #6 PRS_CH5 #5 PRS_CH6 #17 ACMP0_O #23 ACMP1_O #23 LES_CH7 DBG_SWO #2 PF0 BUSBY BUSAX TIM0_CC0 #24 TIM0_CC1 #23 TIM0_CC2 #22 TIM0_CDTI0 #21 TIM0_CDTI1 #20 TIM0_CDTI2 #19 TIM1_CC0 #24 TIM1_CC1 #23 TIM1_CC2 #22 TIM1_CC3 #21 WTIM0_CDTI1 #30 WTIM0_CDTI2 #28 LETIM0_OUT0 #24 LETIM0_OUT1 #23 PCNT0_S0IN #24 PCNT0_S1IN #23 US0_TX #24 US0_RX #23 US0_CLK #22 US0_CS #21 US0_CTS #20 US0_RTS #19 US1_TX #24 US1_RX #23 US1_CLK #22 US1_CS #21 US1_CTS #20 US1_RTS #19 US2_TX #14 US2_RX #13 US2_CLK #12 US2_CS #11 US2_CTS #10 US2_RTS #9 LEU0_TX #24 LEU0_RX #23 I2C0_SDA #24 I2C0_SCL #23 FRC_DCLK #24 FRC_DOUT #23 FRC_DFRAME #22 MODEM_DCLK #24 MODEM_DIN #23 MODEM_DOUT #22 PRS_CH0 #0 PRS_CH1 #7 PRS_CH2 #6 PRS_CH3 #5 ACMP0_O #24 ACMP1_O #24 DBG_SWCLKTCK MGM13P Wireless Gecko Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.4 | 68

GPIO Name Pin Alternate Functionality / Description Analog Timers Communication Radio Other PF1 BUSAY BUSBX TIM0_CC0 #25 TIM0_CC1 #24 TIM0_CC2 #23 TIM0_CDTI0 #22 TIM0_CDTI1 #21 TIM0_CDTI2 #20 TIM1_CC0 #25 TIM1_CC1 #24 TIM1_CC2 #23 TIM1_CC3 #22 WTIM0_CDTI1 #31 WTIM0_CDTI2 #29 LETIM0_OUT0 #25 LETIM0_OUT1 #24 PCNT0_S0IN #25 PCNT0_S1IN #24 US0_TX #25 US0_RX #24 US0_CLK #23 US0_CS #22 US0_CTS #21 US0_RTS #20 US1_TX #25 US1_RX #24 US1_CLK #23 US1_CS #22 US1_CTS #21 US1_RTS #20 US2_TX #15 US2_RX #14 US2_CLK #13 US2_CS #12 US2_CTS #11 US2_RTS #10 LEU0_TX #25 LEU0_RX #24 I2C0_SDA #25 I2C0_SCL #24 FRC_DCLK #25 FRC_DOUT #24 FRC_DFRAME #23 MODEM_DCLK #25 MODEM_DIN #24 MODEM_DOUT #23 PRS_CH0 #1 PRS_CH1 #0 PRS_CH2 #7 PRS_CH3 #6 ACMP0_O #25 ACMP1_O #25 DBG_SWDIOTMS PF2 BUSBY BUSAX TIM0_CC0 #26 TIM0_CC1 #25 TIM0_CC2 #24 TIM0_CDTI0 #23 TIM0_CDTI1 #22 TIM0_CDTI2 #21 TIM1_CC0 #26 TIM1_CC1 #25 TIM1_CC2 #24 TIM1_CC3 #23 WTIM0_CDTI2 #30 LETIM0_OUT0 #26 LETIM0_OUT1 #25 PCNT0_S0IN #26 PCNT0_S1IN #25 US0_TX #26 US0_RX #25 US0_CLK #24 US0_CS #23 US0_CTS #22 US0_RTS #21 US1_TX #26 US1_RX #25 US1_CLK #24 US1_CS #23 US1_CTS #22 US1_RTS #21 LEU0_TX #26 LEU0_RX #25 I2C0_SDA #26 I2C0_SCL #25 FRC_DCLK #26 FRC_DOUT #25 FRC_DFRAME #24 MODEM_DCLK #26 MODEM_DIN #25 MODEM_DOUT #24 CMU_CLK0 #6 PRS_CH0 #2 PRS_CH1 #1 PRS_CH2 #0 PRS_CH3 #7 ACMP0_O #26 ACMP1_O #26 DBG_TDO DBG_SWO #0 GPIO_EM4WU0 PF3 BUSAY BUSBX TIM0_CC0 #27 TIM0_CC1 #26 TIM0_CC2 #25 TIM0_CDTI0 #24 TIM0_CDTI1 #23 TIM0_CDTI2 #22 TIM1_CC0 #27 TIM1_CC1 #26 TIM1_CC2 #25 TIM1_CC3 #24 WTIM0_CDTI2 #31 LETIM0_OUT0 #27 LETIM0_OUT1 #26 PCNT0_S0IN #27 PCNT0_S1IN #26 US0_TX #27 US0_RX #26 US0_CLK #25 US0_CS #24 US0_CTS #23 US0_RTS #22 US1_TX #27 US1_RX #26 US1_CLK #25 US1_CS #24 US1_CTS #23 US1_RTS #22 US2_TX #16 US2_RX #15 US2_CLK #14 US2_CS #13 US2_CTS #12 US2_RTS #11 LEU0_TX #27 LEU0_RX #26 I2C0_SDA #27 I2C0_SCL #26 FRC_DCLK #27 FRC_DOUT #26 FRC_DFRAME #25 MODEM_DCLK #27 MODEM_DIN #26 MODEM_DOUT #25 CMU_CLK1 #6 PRS_CH0 #3 PRS_CH1 #2 PRS_CH2 #1 PRS_CH3 #0 ACMP0_O #27 ACMP1_O #27 DBG_TDI MGM13P Wireless Gecko Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.4 | 69

GPIO Name Pin Alternate Functionality / Description Analog Timers Communication Radio Other PF4 BUSBY BUSAX TIM0_CC0 #28 TIM0_CC1 #27 TIM0_CC2 #26 TIM0_CDTI0 #25 TIM0_CDTI1 #24 TIM0_CDTI2 #23 TIM1_CC0 #28 TIM1_CC1 #27 TIM1_CC2 #26 TIM1_CC3 #25 LE- TIM0_OUT0 #28 LE- TIM0_OUT1 #27 PCNT0_S0IN #28 PCNT0_S1IN #27 US0_TX #28 US0_RX #27 US0_CLK #26 US0_CS #25 US0_CTS #24 US0_RTS #23 US1_TX #28 US1_RX #27 US1_CLK #26 US1_CS #25 US1_CTS #24 US1_RTS #23 US2_TX #17 US2_RX #16 US2_CLK #15 US2_CS #14 US2_CTS #13 US2_RTS #12 LEU0_TX #28 LEU0_RX #27 I2C0_SDA #28 I2C0_SCL #27 FRC_DCLK #28 FRC_DOUT #27 FRC_DFRAME #26 MODEM_DCLK #28 MODEM_DIN #27 MODEM_DOUT #26 PRS_CH0 #4 PRS_CH1 #3 PRS_CH2 #2 PRS_CH3 #1 ACMP0_O #28 ACMP1_O #28 PF5 BUSAY BUSBX TIM0_CC0 #29 TIM0_CC1 #28 TIM0_CC2 #27 TIM0_CDTI0 #26 TIM0_CDTI1 #25 TIM0_CDTI2 #24 TIM1_CC0 #29 TIM1_CC1 #28 TIM1_CC2 #27 TIM1_CC3 #26 LE- TIM0_OUT0 #29 LE- TIM0_OUT1 #28 PCNT0_S0IN #29 PCNT0_S1IN #28 US0_TX #29 US0_RX #28 US0_CLK #27 US0_CS #26 US0_CTS #25 US0_RTS #24 US1_TX #29 US1_RX #28 US1_CLK #27 US1_CS #26 US1_CTS #25 US1_RTS #24 US2_TX #18 US2_RX #17 US2_CLK #16 US2_CS #15 US2_CTS #14 US2_RTS #13 LEU0_TX #29 LEU0_RX #28 I2C0_SDA #29 I2C0_SCL #28 FRC_DCLK #29 FRC_DOUT #28 FRC_DFRAME #27 MODEM_DCLK #29 MODEM_DIN #28 MODEM_DOUT #27 PRS_CH0 #5 PRS_CH1 #4 PRS_CH2 #3 PRS_CH3 #2 ACMP0_O #29 ACMP1_O #29 MGM13P Wireless Gecko Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.4 | 70

GPIO Name Pin Alternate Functionality / Description Analog Timers Communication Radio Other PF6 BUSBY BUSAX TIM0_CC0 #30 TIM0_CC1 #29 TIM0_CC2 #28 TIM0_CDTI0 #27 TIM0_CDTI1 #26 TIM0_CDTI2 #25 TIM1_CC0 #30 TIM1_CC1 #29 TIM1_CC2 #28 TIM1_CC3 #27 LE- TIM0_OUT0 #30 LE- TIM0_OUT1 #29 PCNT0_S0IN #30 PCNT0_S1IN #29 US0_TX #30 US0_RX #29 US0_CLK #28 US0_CS #27 US0_CTS #26 US0_RTS #25 US1_TX #30 US1_RX #29 US1_CLK #28 US1_CS #27 US1_CTS #26 US1_RTS #25 US2_TX #19 US2_RX #18 US2_CLK #17 US2_CS #16 US2_CTS #15 US2_RTS #14 LEU0_TX #30 LEU0_RX #29 I2C0_SDA #30 I2C0_SCL #29 FRC_DCLK #30 FRC_DOUT #29 FRC_DFRAME #28 MODEM_DCLK #30 MODEM_DIN #29 MODEM_DOUT #28 CMU_CLK1 #7 PRS_CH0 #6 PRS_CH1 #5 PRS_CH2 #4 PRS_CH3 #3 ACMP0_O #30 ACMP1_O #30 PF7 BUSAY BUSBX TIM0_CC0 #31 TIM0_CC1 #30 TIM0_CC2 #29 TIM0_CDTI0 #28 TIM0_CDTI1 #27 TIM0_CDTI2 #26 TIM1_CC0 #31 TIM1_CC1 #30 TIM1_CC2 #29 TIM1_CC3 #28 LE- TIM0_OUT0 #31 LE- TIM0_OUT1 #30 PCNT0_S0IN #31 PCNT0_S1IN #30 US0_TX #31 US0_RX #30 US0_CLK #29 US0_CS #28 US0_CTS #27 US0_RTS #26 US1_TX #31 US1_RX #30 US1_CLK #29 US1_CS #28 US1_CTS #27 US1_RTS #26 US2_TX #20 US2_RX #19 US2_CLK #18 US2_CS #17 US2_CTS #16 US2_RTS #15 LEU0_TX #31 LEU0_RX #30 I2C0_SDA #31 I2C0_SCL #30 FRC_DCLK #31 FRC_DOUT #30 FRC_DFRAME #29 MODEM_DCLK #31 MODEM_DIN #30 MODEM_DOUT #29 CMU_CLKI0 #1 CMU_CLK0 #7 PRS_CH0 #7 PRS_CH1 #6 PRS_CH2 #5 PRS_CH3 #4 ACMP0_O #31 ACMP1_O #31 GPIO_EM4WU1 MGM13P Wireless Gecko Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.4 | 71

8.3 Alternate Functionality Overview

A wide selection of alternate functionality is available for multiplexing to various pins. The following table shows the name of the alter- nate functionality in the first column, followed by columns showing the possible LOCATION bitfield settings and the associated GPIO pin. Refer to 8.2 GPIO Functionality Table for a list of functions available on each GPIO pin. Note: Some functionality, such as analog interfaces, do not have alternate settings or a LOCATION bitfield. In these cases, the pinout is shown in the column corresponding to LOCATION 0. Table 8.3. Alternate Functionality Overview Alternate LOCATION Functionality 0 - 3 4 - 7 8 - 11 12 - 15 16 - 19 20 - 23 24 - 27 28 - 31 Description ACMP0_O 0: PA0 1: PA1 2: PA2 3: PA3 4: PA4 5: PA5 6: PB11 8: PB13 11: PC6 12: PC7 13: PC8 14: PC9 15: PC10 16: PC11 21: PD13 22: PD14 23: PD15 24: PF0 25: PF1 26: PF2 27: PF3 28: PF4 29: PF5 30: PF6 31: PF7 Analog comparator ACMP0, digital out- put. ACMP1_O 0: PA0 1: PA1 2: PA2 3: PA3 4: PA4 5: PA5 6: PB11 8: PB13 11: PC6 12: PC7 13: PC8 14: PC9 15: PC10 16: PC11 21: PD13 22: PD14 23: PD15 24: PF0 25: PF1 26: PF2 27: PF3 28: PF4 29: PF5 30: PF6 31: PF7 Analog comparator ACMP1, digital out- put. ADC0_EXTN 0: PA0 Analog to digital converter ADC0 ex- ternal reference in- put negative pin. ADC0_EXTP 0: PA1 Analog to digital converter ADC0 ex- ternal reference in- put positive pin. CMU_CLK0 0: PA1 2: PC6 3: PC11 5: PD14 6: PF2 7: PF7 Clock Management Unit, clock output number 0. CMU_CLK1 0: PA0 2: PC7 3: PC10 5: PD15 6: PF3 7: PF6 Clock Management Unit, clock output number 1. CMU_CLKI0 0: PB13 1: PF7 2: PC6 4: PA5 Clock Management Unit, clock input number 0. DBG_SWCLKTCK 0: PF0 Debug-interface Serial Wire clock input and JTAG Test Clock. Note that this func- tion is enabled to the pin out of reset, and has a built-in pull down. MGM13P Wireless Gecko Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.4 | 72

Functionality 0 - 3 4 - 7 8 - 11 12 - 15 16 - 19 20 - 23 24 - 27 28 - 31 Description DBG_SWDIOTMS 0: PF1 Debug-interface Serial Wire data in- put / output and JTAG Test Mode Select. Note that this func- tion is enabled to the pin out of reset, and has a built-in pull up. DBG_SWO 0: PF2 1: PB13 2: PD15 3: PC11 Debug-interface Serial Wire viewer Output. Note that this func- tion is not enabled after reset, and must be enabled by software to be used. DBG_TDI 0: PF3 Debug-interface JTAG Test Data In. Note that this func- tion becomes avail- able after the first valid JTAG com- mand is received, and has a built-in pull up when JTAG is active. DBG_TDO 0: PF2 Debug-interface JTAG Test Data Out. Note that this func- tion becomes avail- able after the first valid JTAG com- mand is received. ETM_TCLK 1: PA5 3: PC6 Embedded Trace Module ETM clock . ETM_TD0 3: PC7 Embedded Trace Module ETM data ETM_TD1 3: PC8 Embedded Trace Module ETM data ETM_TD2 3: PC9 Embedded Trace Module ETM data ETM_TD3 3: PC10 Embedded Trace Module ETM data MGM13P Wireless Gecko Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.4 | 73

Functionality 0 - 3 4 - 7 8 - 11 12 - 15 16 - 19 20 - 23 24 - 27 28 - 31 Description FRC_DCLK 0: PA0 1: PA1 2: PA2 3: PA3 4: PA4 5: PA5 6: PB11 8: PB13 11: PC6 12: PC7 13: PC8 14: PC9 15: PC10 16: PC11 21: PD13 22: PD14 23: PD15 24: PF0 25: PF1 26: PF2 27: PF3 28: PF4 29: PF5 30: PF6 31: PF7 Frame Controller, Data Sniffer Clock. FRC_DFRAME 0: PA2 1: PA3 2: PA4 3: PA5 4: PB11 6: PB13 9: PC6 10: PC7 11: PC8 12: PC9 13: PC10 14: PC11 19: PD13 20: PD14 21: PD15 22: PF0 23: PF1 24: PF2 25: PF3 26: PF4 27: PF5 28: PF6 29: PF7 30: PA0 31: PA1 Frame Controller, Data Sniffer Frame active FRC_DOUT 0: PA1 1: PA2 2: PA3 3: PA4 4: PA5 5: PB11 7: PB13 10: PC6 11: PC7 12: PC8 13: PC9 14: PC10 15: PC11 20: PD13 21: PD14 22: PD15 23: PF0 24: PF1 25: PF2 26: PF3 27: PF4 28: PF5 29: PF6 30: PF7 31: PA0 Frame Controller, Data Sniffer Out- put. GPIO_EM4WU0 0: PF2 Pin can be used to wake the system up from EM4 GPIO_EM4WU1 0: PF7 Pin can be used to wake the system up from EM4 GPIO_EM4WU4 0: PD14 Pin can be used to wake the system up from EM4 GPIO_EM4WU8 0: PA3 Pin can be used to wake the system up from EM4 GPIO_EM4WU9 0: PB13 Pin can be used to wake the system up from EM4 GPIO_EM4WU12 0: PC10 Pin can be used to wake the system up from EM4 I2C0_SCL 0: PA1 1: PA2 2: PA3 3: PA4 4: PA5 5: PB11 7: PB13 10: PC6 11: PC7 12: PC8 13: PC9 14: PC10 15: PC11 20: PD13 21: PD14 22: PD15 23: PF0 24: PF1 25: PF2 26: PF3 27: PF4 28: PF5 29: PF6 30: PF7 31: PA0 I2C0 Serial Clock Line input / output. I2C0_SDA 0: PA0 1: PA1 2: PA2 3: PA3 4: PA4 5: PA5 6: PB11 8: PB13 11: PC6 12: PC7 13: PC8 14: PC9 15: PC10 16: PC11 21: PD13 22: PD14 23: PD15 24: PF0 25: PF1 26: PF2 27: PF3 28: PF4 29: PF5 30: PF6 31: PF7 I2C0 Serial Data in- put / output. I2C1_SCL 18: PC10 19: PC11 I2C1 Serial Clock Line input / output. MGM13P Wireless Gecko Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.4 | 74

Functionality 0 - 3 4 - 7 8 - 11 12 - 15 16 - 19 20 - 23 24 - 27 28 - 31 Description I2C1_SDA 19: PC10 20: PC11 I2C1 Serial Data in- put / output. LES_CH5 0: PD13 LESENSE channel LES_CH6 0: PD14 LESENSE channel LES_CH7 0: PD15 LESENSE channel LES_CH8 0: PA0 LESENSE channel LES_CH9 0: PA1 LESENSE channel LES_CH10 0: PA2 LESENSE channel 10. LES_CH11 0: PA3 LESENSE channel 11. LES_CH12 0: PA4 LESENSE channel 12. LES_CH13 0: PA5 LESENSE channel 13. LETIM0_OUT0 0: PA0 1: PA1 2: PA2 3: PA3 4: PA4 5: PA5 6: PB11 8: PB13 11: PC6 12: PC7 13: PC8 14: PC9 15: PC10 16: PC11 21: PD13 22: PD14 23: PD15 24: PF0 25: PF1 26: PF2 27: PF3 28: PF4 29: PF5 30: PF6 31: PF7 Low Energy Timer LETIM0, output channel 0. LETIM0_OUT1 0: PA1 1: PA2 2: PA3 3: PA4 4: PA5 5: PB11 7: PB13 10: PC6 11: PC7 12: PC8 13: PC9 14: PC10 15: PC11 20: PD13 21: PD14 22: PD15 23: PF0 24: PF1 25: PF2 26: PF3 27: PF4 28: PF5 29: PF6 30: PF7 31: PA0 Low Energy Timer LETIM0, output channel 1. LEU0_RX 0: PA1 1: PA2 2: PA3 3: PA4 4: PA5 5: PB11 7: PB13 10: PC6 11: PC7 12: PC8 13: PC9 14: PC10 15: PC11 20: PD13 21: PD14 22: PD15 23: PF0 24: PF1 25: PF2 26: PF3 27: PF4 28: PF5 29: PF6 30: PF7 31: PA0 LEUART0 Receive input. LEU0_TX 0: PA0 1: PA1 2: PA2 3: PA3 4: PA4 5: PA5 6: PB11 8: PB13 11: PC6 12: PC7 13: PC8 14: PC9 15: PC10 16: PC11 21: PD13 22: PD14 23: PD15 24: PF0 25: PF1 26: PF2 27: PF3 28: PF4 29: PF5 30: PF6 31: PF7 LEUART0 Transmit output. Also used as receive input in half duplex commu- nication. MODEM_DCLK 0: PA0 1: PA1 2: PA2 3: PA3 4: PA4 5: PA5 6: PB11 8: PB13 11: PC6 12: PC7 13: PC8 14: PC9 15: PC10 16: PC11 21: PD13 22: PD14 23: PD15 24: PF0 25: PF1 26: PF2 27: PF3 28: PF4 29: PF5 30: PF6 31: PF7 MODEM data clock out. MGM13P Wireless Gecko Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.4 | 75

Functionality 0 - 3 4 - 7 8 - 11 12 - 15 16 - 19 20 - 23 24 - 27 28 - 31 Description MODEM_DIN 0: PA1 1: PA2 2: PA3 3: PA4 4: PA5 5: PB11 7: PB13 10: PC6 11: PC7 12: PC8 13: PC9 14: PC10 15: PC11 20: PD13 21: PD14 22: PD15 23: PF0 24: PF1 25: PF2 26: PF3 27: PF4 28: PF5 29: PF6 30: PF7 31: PA0 MODEM data in. MODEM_DOUT 0: PA2 1: PA3 2: PA4 3: PA5 4: PB11 6: PB13 9: PC6 10: PC7 11: PC8 12: PC9 13: PC10 14: PC11 19: PD13 20: PD14 21: PD15 22: PF0 23: PF1 24: PF2 25: PF3 26: PF4 27: PF5 28: PF6 29: PF7 30: PA0 31: PA1 MODEM data out. OPA0_N 0: PA4 Operational Amplifi- er 0 external nega- tive input. OPA0_P 0: PA2 Operational Amplifi- er 0 external posi- tive input. OPA1_N 0: PD15 Operational Amplifi- er 1 external nega- tive input. OPA1_P 0: PD13 Operational Amplifi- er 1 external posi- tive input. OPA2_N 0: PB13 Operational Amplifi- er 2 external nega- tive input. OPA2_P 0: PB11 Operational Amplifi- er 2 external posi- tive input. PCNT0_S0IN 0: PA0 1: PA1 2: PA2 3: PA3 4: PA4 5: PA5 6: PB11 8: PB13 11: PC6 12: PC7 13: PC8 14: PC9 15: PC10 16: PC11 21: PD13 22: PD14 23: PD15 24: PF0 25: PF1 26: PF2 27: PF3 28: PF4 29: PF5 30: PF6 31: PF7 Pulse Counter PCNT0 input num- ber 0. PCNT0_S1IN 0: PA1 1: PA2 2: PA3 3: PA4 4: PA5 5: PB11 7: PB13 10: PC6 11: PC7 12: PC8 13: PC9 14: PC10 15: PC11 20: PD13 21: PD14 22: PD15 23: PF0 24: PF1 25: PF2 26: PF3 27: PF4 28: PF5 29: PF6 30: PF7 31: PA0 Pulse Counter PCNT0 input num- ber 1. PRS_CH0 0: PF0 1: PF1 2: PF2 3: PF3 4: PF4 5: PF5 6: PF6 7: PF7 8: PC6 9: PC7 10: PC8 11: PC9 12: PC10 13: PC11 Peripheral Reflex System PRS, chan- nel 0. MGM13P Wireless Gecko Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.4 | 76

Functionality 0 - 3 4 - 7 8 - 11 12 - 15 16 - 19 20 - 23 24 - 27 28 - 31 Description PRS_CH1 0: PF1 1: PF2 2: PF3 3: PF4 4: PF5 5: PF6 6: PF7 7: PF0 Peripheral Reflex System PRS, chan- nel 1. PRS_CH2 0: PF2 1: PF3 2: PF4 3: PF5 4: PF6 5: PF7 6: PF0 7: PF1 Peripheral Reflex System PRS, chan- nel 2. PRS_CH3 0: PF3 1: PF4 2: PF5 3: PF6 4: PF7 5: PF0 6: PF1 7: PF2 12: PD13 13: PD14 14: PD15 Peripheral Reflex System PRS, chan- nel 3. PRS_CH4 4: PD13 5: PD14 6: PD15 Peripheral Reflex System PRS, chan- nel 4. PRS_CH5 3: PD13 4: PD14 5: PD15 Peripheral Reflex System PRS, chan- nel 5. PRS_CH6 0: PA0 1: PA1 2: PA2 3: PA3 4: PA4 5: PA5 6: PB11 8: PB13 15: PD13 16: PD14 17: PD15 Peripheral Reflex System PRS, chan- nel 6. PRS_CH7 0: PA1 1: PA2 2: PA3 3: PA4 4: PA5 5: PB11 7: PB13 10: PA0 Peripheral Reflex System PRS, chan- nel 7. PRS_CH8 0: PA2 1: PA3 2: PA4 3: PA5 4: PB11 6: PB13 9: PA0 10: PA1 Peripheral Reflex System PRS, chan- nel 8. PRS_CH9 0: PA3 1: PA4 2: PA5 3: PB11 5: PB13 8: PA0 9: PA1 10: PA2 11: PC6 12: PC7 13: PC8 14: PC9 15: PC10 16: PC11 Peripheral Reflex System PRS, chan- nel 9. MGM13P Wireless Gecko Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.4 | 77

Functionality 0 - 3 4 - 7 8 - 11 12 - 15 16 - 19 20 - 23 24 - 27 28 - 31 Description PRS_CH10 0: PC6 1: PC7 2: PC8 3: PC9 4: PC10 5: PC11 Peripheral Reflex System PRS, chan- nel 10. PRS_CH11 0: PC7 1: PC8 2: PC9 3: PC10 4: PC11 5: PC6 Peripheral Reflex System PRS, chan- nel 11. TIM0_CC0 0: PA0 1: PA1 2: PA2 3: PA3 4: PA4 5: PA5 6: PB11 8: PB13 11: PC6 12: PC7 13: PC8 14: PC9 15: PC10 16: PC11 21: PD13 22: PD14 23: PD15 24: PF0 25: PF1 26: PF2 27: PF3 28: PF4 29: PF5 30: PF6 31: PF7 Timer 0 Capture Compare input / output channel 0. TIM0_CC1 0: PA1 1: PA2 2: PA3 3: PA4 4: PA5 5: PB11 7: PB13 10: PC6 11: PC7 12: PC8 13: PC9 14: PC10 15: PC11 20: PD13 21: PD14 22: PD15 23: PF0 24: PF1 25: PF2 26: PF3 27: PF4 28: PF5 29: PF6 30: PF7 31: PA0 Timer 0 Capture Compare input / output channel 1. TIM0_CC2 0: PA2 1: PA3 2: PA4 3: PA5 4: PB11 6: PB13 9: PC6 10: PC7 11: PC8 12: PC9 13: PC10 14: PC11 19: PD13 20: PD14 21: PD15 22: PF0 23: PF1 24: PF2 25: PF3 26: PF4 27: PF5 28: PF6 29: PF7 30: PA0 31: PA1 Timer 0 Capture Compare input / output channel 2. TIM0_CDTI0 0: PA3 1: PA4 2: PA5 3: PB11 5: PB13 8: PC6 9: PC7 10: PC8 11: PC9 12: PC10 13: PC11 18: PD13 19: PD14 20: PD15 21: PF0 22: PF1 23: PF2 24: PF3 25: PF4 26: PF5 27: PF6 28: PF7 29: PA0 30: PA1 31: PA2 Timer 0 Compli- mentary Dead Time Insertion channel 0. TIM0_CDTI1 0: PA4 1: PA5 2: PB11 4: PB13 7: PC6 8: PC7 9: PC8 10: PC9 11: PC10 12: PC11 17: PD13 18: PD14 19: PD15 20: PF0 21: PF1 22: PF2 23: PF3 24: PF4 25: PF5 26: PF6 27: PF7 28: PA0 29: PA1 30: PA2 31: PA3 Timer 0 Compli- mentary Dead Time Insertion channel 1. TIM0_CDTI2 0: PA5 1: PB11 3: PB13 6: PC6 7: PC7 8: PC8 9: PC9 10: PC10 11: PC11 16: PD13 17: PD14 18: PD15 19: PF0 20: PF1 21: PF2 22: PF3 23: PF4 24: PF5 25: PF6 26: PF7 27: PA0 28: PA1 29: PA2 30: PA3 31: PA4 Timer 0 Compli- mentary Dead Time Insertion channel 2. TIM1_CC0 0: PA0 1: PA1 2: PA2 3: PA3 4: PA4 5: PA5 6: PB11 8: PB13 11: PC6 12: PC7 13: PC8 14: PC9 15: PC10 16: PC11 21: PD13 22: PD14 23: PD15 24: PF0 25: PF1 26: PF2 27: PF3 28: PF4 29: PF5 30: PF6 31: PF7 Timer 1 Capture Compare input / output channel 0. MGM13P Wireless Gecko Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.4 | 78

Functionality 0 - 3 4 - 7 8 - 11 12 - 15 16 - 19 20 - 23 24 - 27 28 - 31 Description TIM1_CC1 0: PA1 1: PA2 2: PA3 3: PA4 4: PA5 5: PB11 7: PB13 10: PC6 11: PC7 12: PC8 13: PC9 14: PC10 15: PC11 20: PD13 21: PD14 22: PD15 23: PF0 24: PF1 25: PF2 26: PF3 27: PF4 28: PF5 29: PF6 30: PF7 31: PA0 Timer 1 Capture Compare input / output channel 1. TIM1_CC2 0: PA2 1: PA3 2: PA4 3: PA5 4: PB11 6: PB13 9: PC6 10: PC7 11: PC8 12: PC9 13: PC10 14: PC11 19: PD13 20: PD14 21: PD15 22: PF0 23: PF1 24: PF2 25: PF3 26: PF4 27: PF5 28: PF6 29: PF7 30: PA0 31: PA1 Timer 1 Capture Compare input / output channel 2. TIM1_CC3 0: PA3 1: PA4 2: PA5 3: PB11 5: PB13 8: PC6 9: PC7 10: PC8 11: PC9 12: PC10 13: PC11 18: PD13 19: PD14 20: PD15 21: PF0 22: PF1 23: PF2 24: PF3 25: PF4 26: PF5 27: PF6 28: PF7 29: PA0 30: PA1 31: PA2 Timer 1 Capture Compare input / output channel 3. US0_CLK 0: PA2 1: PA3 2: PA4 3: PA5 4: PB11 6: PB13 9: PC6 10: PC7 11: PC8 12: PC9 13: PC10 14: PC11 19: PD13 20: PD14 21: PD15 22: PF0 23: PF1 24: PF2 25: PF3 26: PF4 27: PF5 28: PF6 29: PF7 30: PA0 31: PA1 USART0 clock in- put / output. US0_CS 0: PA3 1: PA4 2: PA5 3: PB11 5: PB13 8: PC6 9: PC7 10: PC8 11: PC9 12: PC10 13: PC11 18: PD13 19: PD14 20: PD15 21: PF0 22: PF1 23: PF2 24: PF3 25: PF4 26: PF5 27: PF6 28: PF7 29: PA0 30: PA1 31: PA2 USART0 chip se- lect input / output. US0_CTS 0: PA4 1: PA5 2: PB11 4: PB13 7: PC6 8: PC7 9: PC8 10: PC9 11: PC10 12: PC11 17: PD13 18: PD14 19: PD15 20: PF0 21: PF1 22: PF2 23: PF3 24: PF4 25: PF5 26: PF6 27: PF7 28: PA0 29: PA1 30: PA2 31: PA3 USART0 Clear To Send hardware flow control input. US0_RTS 0: PA5 1: PB11 3: PB13 6: PC6 7: PC7 8: PC8 9: PC9 10: PC10 11: PC11 16: PD13 17: PD14 18: PD15 19: PF0 20: PF1 21: PF2 22: PF3 23: PF4 24: PF5 25: PF6 26: PF7 27: PA0 28: PA1 29: PA2 30: PA3 31: PA4 USART0 Request To Send hardware flow control output. US0_RX 0: PA1 1: PA2 2: PA3 3: PA4 4: PA5 5: PB11 7: PB13 10: PC6 11: PC7 12: PC8 13: PC9 14: PC10 15: PC11 20: PD13 21: PD14 22: PD15 23: PF0 24: PF1 25: PF2 26: PF3 27: PF4 28: PF5 29: PF6 30: PF7 31: PA0 USART0 Asynchro- nous Receive. USART0 Synchro- nous mode Master Input / Slave Out- put (MISO). MGM13P Wireless Gecko Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.4 | 79

Functionality 0 - 3 4 - 7 8 - 11 12 - 15 16 - 19 20 - 23 24 - 27 28 - 31 Description US0_TX 0: PA0 1: PA1 2: PA2 3: PA3 4: PA4 5: PA5 6: PB11 8: PB13 11: PC6 12: PC7 13: PC8 14: PC9 15: PC10 16: PC11 21: PD13 22: PD14 23: PD15 24: PF0 25: PF1 26: PF2 27: PF3 28: PF4 29: PF5 30: PF6 31: PF7 USART0 Asynchro- nous Transmit. Al- so used as receive input in half duplex communication. USART0 Synchro- nous mode Master Output / Slave In- put (MOSI). US1_CLK 0: PA2 1: PA3 2: PA4 3: PA5 4: PB11 6: PB13 9: PC6 10: PC7 11: PC8 12: PC9 13: PC10 14: PC11 19: PD13 20: PD14 21: PD15 22: PF0 23: PF1 24: PF2 25: PF3 26: PF4 27: PF5 28: PF6 29: PF7 30: PA0 31: PA1 USART1 clock in- put / output. US1_CS 0: PA3 1: PA4 2: PA5 3: PB11 5: PB13 8: PC6 9: PC7 10: PC8 11: PC9 12: PC10 13: PC11 18: PD13 19: PD14 20: PD15 21: PF0 22: PF1 23: PF2 24: PF3 25: PF4 26: PF5 27: PF6 28: PF7 29: PA0 30: PA1 31: PA2 USART1 chip se- lect input / output. US1_CTS 0: PA4 1: PA5 2: PB11 4: PB13 7: PC6 8: PC7 9: PC8 10: PC9 11: PC10 12: PC11 17: PD13 18: PD14 19: PD15 20: PF0 21: PF1 22: PF2 23: PF3 24: PF4 25: PF5 26: PF6 27: PF7 28: PA0 29: PA1 30: PA2 31: PA3 USART1 Clear To Send hardware flow control input. US1_RTS 0: PA5 1: PB11 3: PB13 6: PC6 7: PC7 8: PC8 9: PC9 10: PC10 11: PC11 16: PD13 17: PD14 18: PD15 19: PF0 20: PF1 21: PF2 22: PF3 23: PF4 24: PF5 25: PF6 26: PF7 27: PA0 28: PA1 29: PA2 30: PA3 31: PA4 USART1 Request To Send hardware flow control output. US1_RX 0: PA1 1: PA2 2: PA3 3: PA4 4: PA5 5: PB11 7: PB13 10: PC6 11: PC7 12: PC8 13: PC9 14: PC10 15: PC11 20: PD13 21: PD14 22: PD15 23: PF0 24: PF1 25: PF2 26: PF3 27: PF4 28: PF5 29: PF6 30: PF7 31: PA0 USART1 Asynchro- nous Receive. USART1 Synchro- nous mode Master Input / Slave Out- put (MISO). US1_TX 0: PA0 1: PA1 2: PA2 3: PA3 4: PA4 5: PA5 6: PB11 8: PB13 11: PC6 12: PC7 13: PC8 14: PC9 15: PC10 16: PC11 21: PD13 22: PD14 23: PD15 24: PF0 25: PF1 26: PF2 27: PF3 28: PF4 29: PF5 30: PF6 31: PF7 USART1 Asynchro- nous Transmit. Al- so used as receive input in half duplex communication. USART1 Synchro- nous mode Master Output / Slave In- put (MOSI). MGM13P Wireless Gecko Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.4 | 80

Functionality 0 - 3 4 - 7 8 - 11 12 - 15 16 - 19 20 - 23 24 - 27 28 - 31 Description US2_CLK 12: PF0 13: PF1 14: PF3 15: PF4 16: PF5 17: PF6 18: PF7 30: PA5 USART2 clock in- put / output. US2_CS 11: PF0 12: PF1 13: PF3 14: PF4 15: PF5 16: PF6 17: PF7 29: PA5 USART2 chip se- lect input / output. US2_CTS 10: PF0 11: PF1 12: PF3 13: PF4 14: PF5 15: PF6 16: PF7 28: PA5 USART2 Clear To Send hardware flow control input. US2_RTS 9: PF0 10: PF1 11: PF3 12: PF4 13: PF5 14: PF6 15: PF7 27: PA5 USART2 Request To Send hardware flow control output. US2_RX 13: PF0 14: PF1 15: PF3 16: PF4 17: PF5 18: PF6 19: PF7 31: PA5 USART2 Asynchro- nous Receive. USART2 Synchro- nous mode Master Input / Slave Out- put (MISO). US2_TX 0: PA5 14: PF0 15: PF1 16: PF3 17: PF4 18: PF5 19: PF6 20: PF7 USART2 Asynchro- nous Transmit. Al- so used as receive input in half duplex communication. USART2 Synchro- nous mode Master Output / Slave In- put (MOSI). VDAC0_EXT 0: PA1 Digital to analog converter VDAC0 external reference input pin. VDAC0_OUT0 / OPA0_OUT 0: PA3 Digital to Analog Converter DAC0 output channel number 0. VDAC0_OUT0AL T / OPA0_OUT- ALT 0: PA5 1: PD13 2: PD15 Digital to Analog Converter DAC0 al- ternative output for channel 0. MGM13P Wireless Gecko Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.4 | 81

Functionality 0 - 3 4 - 7 8 - 11 12 - 15 16 - 19 20 - 23 24 - 27 28 - 31 Description VDAC0_OUT1 / OPA1_OUT 0: PD14 Digital to Analog Converter DAC0 output channel number 1. VDAC0_OUT1AL T / OPA1_OUT- ALT 1: PA2 2: PA4 Digital to Analog Converter DAC0 al- ternative output for channel 1. WTIM0_CC0 0: PA0 1: PA1 2: PA2 3: PA3 4: PA4 5: PA5 15: PB11 17: PB13 26: PC6 27: PC7 28: PC8 29: PC9 30: PC10 31: PC11 Wide timer 0 Cap- ture Compare in- put / output channel WTIM0_CC1 0: PA2 1: PA3 2: PA4 3: PA5 13: PB11 15: PB13 24: PC6 25: PC7 26: PC8 27: PC9 28: PC10 29: PC11 Wide timer 0 Cap- ture Compare in- put / output channel WTIM0_CC2 0: PA4 1: PA5 11: PB11 13: PB13 22: PC6 23: PC7 24: PC8 25: PC9 26: PC10 27: PC11 Wide timer 0 Cap- ture Compare in- put / output channel WTIM0_CDTI0 7: PB11 9: PB13 18: PC6 19: PC7 20: PC8 21: PC9 22: PC10 23: PC11 29: PD13 30: PD14 31: PD15 Wide timer 0 Com- plimentary Dead Time Insertion channel 0. WTIM0_CDTI1 5: PB11 7: PB13 16: PC6 17: PC7 18: PC8 19: PC9 20: PC10 21: PC11 27: PD13 28: PD14 29: PD15 30: PF0 31: PF1 Wide timer 0 Com- plimentary Dead Time Insertion channel 1. WTIM0_CDTI2 3: PB11 5: PB13 14: PC6 15: PC7 16: PC8 17: PC9 18: PC10 19: PC11 25: PD13 26: PD14 27: PD15 28: PF0 29: PF1 30: PF2 31: PF3 Wide timer 0 Com- plimentary Dead Time Insertion channel 2. MGM13P Wireless Gecko Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.4 | 82

8.4 Analog Port (APORT) Client Maps

The Analog Port (APORT) is an infrastructure used to connect chip pins with on-chip analog clients such as analog comparators, ADCs, DACs, etc. The APORT consists of a set of shared buses, switches, and control logic needed to configurably implement the signal rout- ing. Figure 8.2 APORT Connection Diagram on page 83 shows the APORT routing for this device family (note that available features may vary by part number). A complete description of APORT functionality can be found in the Reference Manual. PF0 PF1 PF2 PF3 PF4 PF5 PF6 PF7 PC6 PC7 PC8 PC9 PC10 PC11 PD9 PD10 PD14 PD13 PD12 PD11 PD15 PA0 PA4 PA3 PA2 PA1 PA5 PB14 PB13 PB12 PB11 PB15 AXAY BXBY CXCYDXDY IDAC0 1X POS NEG ACMP0 1Y2Y3Y4Y POS NEG ACMP1 ADC0 EXTPEXTN POS NEG OPA0 1X2X3X4X 1Y2Y3Y4Y 1XOPA0_P OPA0_N OUT0OUT0ALTOUT1OUT2OUT3OUT4 OUT POS NEG OPA1 OUT 1X2X3X4X 1Y2Y3Y4Y 1XOPA1_P OPA1_N OUT1OUT1ALTOUT1 OUT2OUT3OUT4 ADC_EXTP ADC_EXTN OUT0OUT1 OPA0_N OPA0_P OPA1_N OPA1_P VDAC0_OUT0ALTOUT0ALT VDAC0_OUT0ALTOUT0ALT VDAC0_OUT0ALTOUT0ALT VDAC0_OUT1ALTOUT1ALT VDAC0_OUT1ALTOUT1ALT VDAC0_OUT0ALTOUT1ALT n X, n Y APORTn X, APORTn Y AX, BY, …BUSAX, BUSBY, ... POS NEG OPA2 1X2X3X4X 1Y2Y3Y4Y 1XOPA2_P OPA2_N OUT2OUT2ALTOUT1OUT2OUT3OUT4 OUT CEXT 1X1Y3X3YCSEN CEXT_SENSE 2X2Y 4X4Y OUT2 OPA2_P OPA2_N 1X2X3X4X 2X3X4X 1Y2Y3Y4Y NEXT1NEXT0 NEXT1NEXT0 NEXT1NEXT0 NEXT1NEXT0 POS NEG 1X2X3X4X 1Y2Y3Y4Y NEXT0 NEXT1 NEXT2 NEXT2 NEXT0 NEXT1 Figure 8.2. APORT Connection Diagram Client maps for each analog circuit using the APORT are shown in the following tables. The maps are organized by bus, and show the peripheral's port connection, the shared bus, and the connection from specific bus channel numbers to GPIO pins. MGM13P Wireless Gecko Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.4 | 83

In general, enumerations for the pin selection field in an analog peripheral's register can be determined by finding the desired pin con- nection in the table and then combining the value in the Port column (APORT__), and the channel identifier (CH__). For example, if pin PF7 is available on port APORT2X as CH23, the register field enumeration to connect to PF7 would be APORT2XCH23. The shared bus used by this connection is indicated in the Bus column. Table 8.4. ACMP0 Bus and Pin Mapping Port Bus CH31 CH30 CH29 CH28 CH27 CH26 CH25 CH24 CH23 CH22 CH21 CH20 CH19 CH18 CH17 CH16 CH15 CH14 CH13 CH12 CH11 CH10 CH9 CH8 CH7 CH6 CH5 CH4 CH3 CH2 CH1 CH0 APORT1X BUSAX PF6 PF4 PF2 PF0 PC10 PC8 PC6 APORT1Y BUSAY PF7 PF5 PF3 PF1 PC11 PC9 PC7 APORT2X BUSBX PF7 PF5 PF3 PF1 PC11 PC9 PC7 APORT2Y BUSBY PF6 PF4 PF2 PF0 PC10 PC8 PC6 APORT3X BUSCX PA4 PA2 PA0 PD14 APORT3Y BUSCY PB13 PB11 PA5 PA3 PA1 PD15 PD13 APORT4X BUSDX PB13 PB11 PA5 PA3 PA1 PD15 PD13 APORT4Y BUSDY PA4 PA2 PA0 PD14 MGM13P Wireless Gecko Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.4 | 84

Table 8.5. ACMP1 Bus and Pin Mapping Port Bus CH31 CH30 CH29 CH28 CH27 CH26 CH25 CH24 CH23 CH22 CH21 CH20 CH19 CH18 CH17 CH16 CH15 CH14 CH13 CH12 CH11 CH10 CH9 CH8 CH7 CH6 CH5 CH4 CH3 CH2 CH1 CH0 APORT1X BUSAX PF6 PF4 PF2 PF0 PC10 PC8 PC6 APORT1Y BUSAY PF7 PF5 PF3 PF1 PC11 PC9 PC7 APORT2X BUSBX PF7 PF5 PF3 PF1 PC11 PC9 PC7 APORT2Y BUSBY PF6 PF4 PF2 PF0 PC10 PC8 PC6 APORT3X BUSCX PA4 PA2 PA0 PD14 APORT3Y BUSCY PB13 PB11 PA5 PA3 PA1 PD15 PD13 APORT4X BUSDX PB13 PB11 PA5 PA3 PA1 PD15 PD13 APORT4Y BUSDY PA4 PA2 PA0 PD14 MGM13P Wireless Gecko Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.4 | 85

Table 8.6. ADC0 Bus and Pin Mapping Port Bus CH31 CH30 CH29 CH28 CH27 CH26 CH25 CH24 CH23 CH22 CH21 CH20 CH19 CH18 CH17 CH16 CH15 CH14 CH13 CH12 CH11 CH10 CH9 CH8 CH7 CH6 CH5 CH4 CH3 CH2 CH1 CH0 APORT1X BUSAX PF6 PF4 PF2 PF0 PC10 PC8 PC6 APORT1Y BUSAY PF7 PF5 PF3 PF1 PC11 PC9 PC7 APORT2X BUSBX PF7 PF5 PF3 PF1 PC11 PC9 PC7 APORT2Y BUSBY PF6 PF4 PF2 PF0 PC10 PC8 PC6 APORT3X BUSCX PA4 PA2 PA0 PD14 APORT3Y BUSCY PB13 PB11 PA5 PA3 PA1 PD15 PD13 APORT4X BUSDX PB13 PB11 PA5 PA3 PA1 PD15 PD13 APORT4Y BUSDY PA4 PA2 PA0 PD14 MGM13P Wireless Gecko Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.4 | 86

Table 8.7. CSEN Bus and Pin Mapping Port Bus CH31 CH30 CH29 CH28 CH27 CH26 CH25 CH24 CH23 CH22 CH21 CH20 CH19 CH18 CH17 CH16 CH15 CH14 CH13 CH12 CH11 CH10 CH9 CH8 CH7 CH6 CH5 CH4 CH3 CH2 CH1 CH0 CEXT APORT1X BUSAX PF6 PF4 PF2 PF0 PC10 PC8 PC6 APORT1Y BUSAY PF7 PF5 PF3 PF1 PC11 PC9 PC7 APORT3X BUSCX PA4 PA2 PA0 PD14 APORT3Y BUSCY PB13 PB11 PA5 PA3 PA1 PD15 PD13 CEXT_SENSE APORT2X BUSBX PF7 PF5 PF3 PF1 PC11 PC9 PC7 APORT2Y BUSBY PF6 PF4 PF2 PF0 PC10 PC8 PC6 APORT4X BUSDX PB13 PB11 PA5 PA3 PA1 PD15 PD13 APORT4Y BUSDY PA4 PA2 PA0 PD14 Table 8.8. IDAC0 Bus and Pin Mapping Port Bus CH31 CH30 CH29 CH28 CH27 CH26 CH25 CH24 CH23 CH22 CH21 CH20 CH19 CH18 CH17 CH16 CH15 CH14 CH13 CH12 CH11 CH10 CH9 CH8 CH7 CH6 CH5 CH4 CH3 CH2 CH1 CH0 APORT1X BUSCX PA4 PA2 PA0 PD14 APORT1Y BUSCY PB13 PB11 PA5 PA3 PA1 PD15 PD13 MGM13P Wireless Gecko Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.4 | 87

Table 8.9. VDAC0 / OPA Bus and Pin Mapping Port Bus CH31 CH30 CH29 CH28 CH27 CH26 CH25 CH24 CH23 CH22 CH21 CH20 CH19 CH18 CH17 CH16 CH15 CH14 CH13 CH12 CH11 CH10 CH9 CH8 CH7 CH6 CH5 CH4 CH3 CH2 CH1 CH0 OPA0_N APORT1Y BUSAY PF7 PF5 PF3 PF1 PC11 PC9 PC7 APORT2Y BUSBY PF6 PF4 PF2 PF0 PC10 PC8 PC6 APORT3Y BUSCY PB13 PB11 PA5 PA3 PA1 PD15 PD13 APORT4Y BUSDY PA4 PA2 PA0 PD14 OPA0_P APORT1X BUSAX PF6 PF4 PF2 PF0 PC10 PC8 PC6 APORT2X BUSBX PF7 PF5 PF3 PF1 PC11 PC9 PC7 APORT3X BUSCX PA4 PA2 PA0 PD14 APORT4X BUSDX PB13 PB11 PA5 PA3 PA1 PD15 PD13 MGM13P Wireless Gecko Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.4 | 88

OPA1_N APORT1Y BUSAY PF7 PF5 PF3 PF1 PC11 PC9 PC7 APORT2Y BUSBY PF6 PF4 PF2 PF0 PC10 PC8 PC6 APORT3Y BUSCY PB13 PB11 PA5 PA3 PA1 PD15 PD13 APORT4Y BUSDY PA4 PA2 PA0 PD14 OPA1_P APORT1X BUSAX PF6 PF4 PF2 PF0 PC10 PC8 PC6 APORT2X BUSBX PF7 PF5 PF3 PF1 PC11 PC9 PC7 APORT3X BUSCX PA4 PA2 PA0 PD14 APORT4X BUSDX PB13 PB11 PA5 PA3 PA1 PD15 PD13 OPA2_N APORT1Y BUSAY PF7 PF5 PF3 PF1 PC11 PC9 PC7 APORT2Y BUSBY PF6 PF4 PF2 PF0 PC10 PC8 PC6 APORT3Y BUSCY PB13 PB11 PA5 PA3 PA1 PD15 PD13 APORT4Y BUSDY PA4 PA2 PA0 PD14 MGM13P Wireless Gecko Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.4 | 89

OPA2_OUT APORT1Y BUSAY PF7 PF5 PF3 PF1 PC11 PC9 PC7 APORT2Y BUSBY PF6 PF4 PF2 PF0 PC10 PC8 PC6 APORT3Y BUSCY PB13 PB11 PA5 PA3 PA1 PD15 PD13 APORT4Y BUSDY PA4 PA2 PA0 PD14 OPA2_P APORT1X BUSAX PF6 PF4 PF2 PF0 PC10 PC8 PC6 APORT2X BUSBX PF7 PF5 PF3 PF1 PC11 PC9 PC7 APORT3X BUSCX PA4 PA2 PA0 PD14 APORT4X BUSDX PB13 PB11 PA5 PA3 PA1 PD15 PD13 VDAC0_OUT0 / OPA0_OUT APORT1Y BUSAY PF7 PF5 PF3 PF1 PC11 PC9 PC7 APORT2Y BUSBY PF6 PF4 PF2 PF0 PC10 PC8 PC6 APORT3Y BUSCY PB13 PB11 PA5 PA3 PA1 PD15 PD13 APORT4Y BUSDY PA4 PA2 PA0 PD14 MGM13P Wireless Gecko Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.4 | 90

VDAC0_OUT1 / OPA1_OUT APORT1Y BUSAY PF7 PF5 PF3 PF1 PC11 PC9 PC7 APORT2Y BUSBY PF6 PF4 PF2 PF0 PC10 PC8 PC6 APORT3Y BUSCY PB13 PB11 PA5 PA3 PA1 PD15 PD13 APORT4Y BUSDY PA4 PA2 PA0 PD14 MGM13P Wireless Gecko Module Data Sheet Pin Definitions silabs.com | Building a more connected world. Rev. 1.4 | 91

  1. Package Specifications

9.1 Package Outline

Figure 9.1. MGM13P with Antenna - Top and Side View Figure 9.2. MGM13P with U.FL - Top and Side View MGM13P Wireless Gecko Module Data Sheet Package Specifications silabs.com | Building a more connected world. Rev. 1.4 | 92

Figure 9.3. MGM13P Bottom View MGM13P Wireless Gecko Module Data Sheet Package Specifications silabs.com | Building a more connected world. Rev. 1.4 | 93

9.2 Recommended PCB Land Pattern

The figure below shows the recommended land pattern. The antenna clearance section is not required for MGM13P module versions with a U.FL connector. Figure 9.4. MGM13P Recommended PCB Land Pattern MGM13P Wireless Gecko Module Data Sheet Package Specifications silabs.com | Building a more connected world. Rev. 1.4 | 94

9.3 Package Marking

The figure below shows the module markings printed on the RF-shield. Figure 9.5. MGM13P Package Marking Note: Module memory size in the Ordering Code (F512) is encoded as "H" in the package top mark. Mark Description The package marking consists of:

  • MGM13Pxxxxxxx - Part number designation.
  • Model: MGM13Pxxxx – Model number designation.
  • QR Code: YYWWMMABCDE
  • YY - Last two digits of the assembly year.
  • WW - Two-digit workweek when the device was assembled.
  • MMABCDE - Silicon Labs unit code.
  • YYWWTTTTTT
  • YY – Last two digits of the assembly year.
  • WW – Two-digit workweek when the device was assembled.
  • TTTTTT – Manufacturing trace code. The first letter is the device revision.
  • Certification marks such as the CE logo, FCC and IC IDs, etc. will be engraved on the grayed out area, according to regulatory body requirements. MGM13P Wireless Gecko Module Data Sheet Package Specifications silabs.com | Building a more connected world. Rev. 1.4 | 95
  1. Soldering Recommendations The MGM13P is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the ther- mal mass of the entire populated PCB, heat transfer efficiency of the oven, and particular type of solder paste used.
  • Refer to technical documentations of particular solder paste for profile configurations.
  • Avoid using more than two reflow cycles.
  • A no-clean, type-3 solder paste is recommended.
  • A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
  • Recommended stencil thickness is 0.100mm (4 mils).
  • Refer to the recommended PCB land pattern for an example stencil aperture size.
  • For further recommendation, please refer to the JEDEC/IPC J-STD-020, IPC-SM-782 and IPC 7351 guidelines.
  • Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use different parameters and fine tune their SMT process as required for their application and tooling. MGM13P Wireless Gecko Module Data Sheet Soldering Recommendations silabs.com | Building a more connected world. Rev. 1.4 | 96
  1. Certifications

11.1 Qualified Antenna Types

The MGM13P variants supporting an external antenna have been designed to operate with a standard 2.14 dBi dipole antenna. Any antenna of a different type or with a gain higher than 2.14 dBi is strictly prohibited for use with this device. Using an antenna of a differ- ent type or gain more than 2.14 dBi will require additional testing for FCC, CE and IC. The required antenna impedance is 50 Ω. Table 11.1. Qualified Antennas for MGM13P Antenna Type Maximum Gain Dipole 2.14 dBi

11.2 Bluetooth

The MGM13P is pre-qualified as a Low Energy RF-PHY tested component, having Declaration ID of D037287 and QDID of 101562. For the qualification of an end product embedding the MGM13P, the above should be combined with the most up to date Wireless Gecko Link Layer and Host components.

11.3 CE and UKCA - EU and UK

The MGM13P02 module is in conformity with the essential requirements and other relevant requirements of the Radio Equipment Di- rective (RED) (2014/53/EU) and of the UK's Radio Equipment Regulations (RER) (S.I. 2017/1206). Please note that every application using the MGM13P02 will need to perform the radio EMC tests on the end product, according to EN 301 489-17. It is ultimately the responsibility of the manufacturer to ensure the compliance of the end-product. The specific product assembly may have an impact to RF radiated characteristics, and manufacturers should carefully consider RF radiated testing with the end-product assembly. The modules are entitled to carry the CE and UKCA Marks, and a formal Declaration of Conformity (DoC) is available at the product web page which is reachable starting from https://www.silabs.com/. With regards to the Bluetooth Low Energy protocol, the MGM13P12 module is in conformity with the essential requirements and other relevant requirements of the Radio Equipment Directive (RED) and of the UK's Radio Equipment Regulations (RER) at up to 10 dBm RF transmit power when not using Adaptive Frequency Hopping (AFH). With early module firmware versions that do not support AFH and that do not have built-in functionality to limit the max RF transmit power to 10 dBm automatically, it is responsibility of the end- product's manufacturer to limit output power accordingly. With newer firmware versions supporting AFH, the end-product’s manufactur- er has the option to enable AFH and transmit at full output power while the module remains compliant or, alternatively, to disable AFH in which case the max RF transmit power will be automatically limited to 10 dBm, making the module compliant in all cases. Please refer to the firmware change log to verify which version introduced AFH. MGM13P Wireless Gecko Module Data Sheet Certifications silabs.com | Building a more connected world. Rev. 1.4 | 97

11.4 FCC

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: 1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesirable operation. Any changes or modifications not expressly approved by Silicon Labs could void the user’s authority to operate the equipment. FCC RF Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specif- ic operating instructions for satisfying RF exposure compliance. This transmitter meets both portable and mobile limits as demonstrated in the RF Exposure Analysis. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. OEM Responsibilities to comply with FCC Regulations: OEM integrator is responsible for testing their end-product for any additional compliance requirements required with this module instal- led (for example, digital device emissions, PC peripheral requirements, etc.).

  • With MGM13P12 the antenna(s) must be installed such that a minimum separation distance of 50.5 mm is maintained between the radiator (antenna) and all persons at all times.
  • With MGM13P02 the antenna(s) must be installed such that a minimum separation distance of 7.7 mm is maintained between the radiator (antenna) and all persons at all times.
  • The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter except in accord- ance with FCC multi-transmitter product procedures. Important Note: In the event that the above conditions cannot be met (for certain configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM inte- grator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling The variants of MGM13P Modules are labeled with their own FCC ID. If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following: "Contains Transmitter Module FCC ID: QOQMGM13P" Or "Contains FCC ID: QOQMGM13P" The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. MGM13P Wireless Gecko Module Data Sheet Certifications silabs.com | Building a more connected world. Rev. 1.4 | 98

11.5 ISED Canada

This radio transmitter (IC: 5123A-MGM13P) has been approved by Industry Canada to operate with the antenna types listed above, with the maximum permissible gain indicared. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. This device complies with Industry Canada’s license-exempt RSS standards. Operation is subject to the following two conditions: 1. This device may not cause interference; and 2. This device must accept any interference, including interference that may cause undesired operation of the device RF Exposure Statement Exception from routine SAR evaluation limits are given in RSS-102 Issue 5. The models MGM13P12A and MGM13P12E meet the given requirements when the minimum separation distance to human body is 35 mm. The models MGM13P02A and MGM13P02E meet the given requirements when the minimum separation distance to human body is 20 mm. RF exposure or SAR evaluation is not required when the separation distance is same or more than stated above. If the separation dis- tance is less than stated above the OEM integrator is responsible for evaluating the SAR. OEM Responsibilities to comply with IC Regulations The MGM13P modules have been certified for integration into products only by OEM integrators under the following conditions:

  • The antenna(s) must be installed such that a minimum separation distance as stated above is maintained between the radiator (an- tenna) and all persons at all times.
  • The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter. As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still respon- sible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). IMPORTANT NOTE In the event that these conditions cannot be met (for certain configurations or co-location with another transmitter), then the ISEDC authorization is no longer considered valid and the IC ID cannot be used on the final product. In these circumstances, the OEM integra- tor will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate ISEDC authorization. End Product Labeling The MGM13P module is labeled with its own IC ID. If the IC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following: “Contains Transmitter Module IC: 5123A-MGM13P ” or “Contains IC: 5123A-MGM13P” The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. MGM13P Wireless Gecko Module Data Sheet Certifications silabs.com | Building a more connected world. Rev. 1.4 | 99

ISEDC (Français) Industrie Canada a approuvé l’utilisation de cet émetteur radio (IC: 5123A-MGM13P) en conjonction avec des antennes de type dipo- laire à 2.14dBi ou des antennes embarquées, intégrée au produit. L’utilisation de tout autre type d’antenne avec ce composant est pro- scrite. Ce composant est conforme aux normes RSS, exonérées de licence d'Industrie Canada. Son mode de fonctionnement est soumis aux deux conditions suivantes: 1. Ce composant ne doit pas générer d’interférences. 2. Ce composant doit pouvoir est soumis à tout type de perturbation y compris celle pouvant nuire à son bon fonctionnement. Déclaration d'exposition RF L'exception tirée des limites courantes d'évaluation SAR est donnée dans le document RSS-102 Issue 5. Les modules MGM13P12A and MGM13P12E répondent aux exigences requises lorsque la distance minimale de séparation avec le corps humain est de 35 mm. Les modules MGM13P02A and MGM13P02E répondent aux exigences requises lorsque la distance minimale de séparation avec le corps humain est de 20 mm. La déclaration d’exposition RF ou l'évaluation SAR n'est pas nécessaire lorsque la distance de séparation est identique ou supérieure à celle indiquée ci-dessus. Si la distance de séparation est inférieure à celle mentionnées plus haut, il incombe à l'intégrateur OEM de procédé à une évaluation SAR. Responsabilités des OEM pour une mise en conformité avec le Règlement du Circuit Intégré Le module MGM13P a été approuvé pour l'intégration dans des produits finaux exclusivement réalisés par des OEM sous les condi- tions suivantes:

  • L'antenne (s) doit être installée de sorte qu'une distance de séparation minimale indiquée ci-dessus soit maintenue entre le radiateur (antenne) et toutes les personnes avoisinante, ce à tout moment.
  • Le module émetteur ne doit pas être localisé ou fonctionner avec une autre antenne ou un autre transmetteur que celle indiquée plus haut. Tant que les deux conditions ci-dessus sont respectées, il n’est pas nécessaire de tester ce transmetteur de façon plus poussée. Ce- pendant, il incombe à l’intégrateur OEM de s’assurer de la bonne conformité du produit fini avec les autres normes auxquelles il pour- rait être soumis de fait de l’utilisation de ce module (par exemple, les émissions des périphériques numériques, les exigences de pé- riphériques PC, etc.). REMARQUE IMPORTANTE ans le cas où ces conditions ne peuvent être satisfaites (pour certaines configurations ou co-implantation avec un autre émetteur), l'au- torisation ISEDC n'est plus considérée comme valide et le numéro d’identification ID IC ne peut pas être apposé sur le produit final. Dans ces circonstances, l'intégrateur OEM sera responsable de la réévaluation du produit final (y compris le transmetteur) et de l'ob- tention d'une autorisation ISEDC distincte. Étiquetage des produits finis Les modules MGM13P sont étiquetés avec leur propre ID IC. Si l'ID IC n'est pas visible lorsque le module est intégré au sein d'un autre produit, cet autre produit dans lequel le module est installé devra porter une étiquette faisant apparaitre les référence du module inté- gré. Dans un tel cas, sur le produit final doit se trouver une étiquette aisément lisible sur laquelle figurent les informations suivantes: “Contient le module transmetteur: 5123A-MGM13P ” or “Contient le circuit: 5123A-MGM13P” L'intégrateur OEM doit être conscient qu’il ne doit pas fournir, dans le manuel d’utilisation, d'informations relatives à la façon d'installer ou de d’enlever ce module RF ainsi que sur la procédure à suivre pour modifier les paramètres liés à la radio. MGM13P Wireless Gecko Module Data Sheet Certifications silabs.com | Building a more connected world. Rev. 1.4 | 100

11.6 Japan

The MGM13P02A and MGM13P02E are certified in Japan with certification number 209-J00283. Since September 1, 2014 it is allowed (and highly recommended) that a manufacturer who integrates a radio module in their host equipment can place the certification mark and certification number (the same marking/number as depicted on the label of the radio module) on the outside of the host equipment. The certification mark and certification number must be placed close to the text in the Japanese language which is provided below. This change in the Radio Law has been made in order to enable users of the combination of host and radio module to verify if they are actually using a radio device which is approved for use in Japan. Certification Text to be Placed on the Outside Surface of the Host Equipment: Translation of the text: “This equipment contains specified radio equipment that has been certified to the Technical Regulation Conformity Certification under the Radio Law.” The "Giteki" marking shown in the figures below must be affixed to an easily noticeable section of the specified radio equipment. Note that additional information may be required if the device is also subject to a telecom approval. Figure 11.1. GITEKI Mark and ID Figure 11.2. GITEKI Mark

11.7 KC South Korea

The MGM13P02A and MGM13P02E have an RF certification for import and use in South-Korea. Certification number: R-C-BGT-MGM13P02 The RF-certified module is meant to be integrated into an end-product, which is then exempted from doing the RF emission testing, as long as the recommended design guidance is followed, and the approved antennas are used. EMC testing and any other relevant test applicable to the end-product, plus appropriate labelling of the end-product, might still be re- quired for the full regulatory compliance. MGM13P Wireless Gecko Module Data Sheet Certifications silabs.com | Building a more connected world. Rev. 1.4 | 101

  1. Revision History Revision 1.4 November, 2022
  • Updated certifications to reflect UK specifics: 1. Feature List and 11.3 CE and UKCA - EU and UK
  • Updated 9.3 Package Marking Revision 1.3 June, 2022
  • Added timing specifications for RESETn low time in Table 4.22 General-Purpose I/O (GPIO) on page 32.
  • Removed BIASPROG = 1, FULLBIAS = 0 specifications from Table 4.25 Analog Comparator (ACMP) on page 36.
  • Clarified the dimensions in Figure 9.4 MGM13P Recommended PCB Land Pattern on page 94.
  • Removed all references to RFSENSE.
  • Removed all references to BOOT_TX and BOOT_RX. Revision 1.2 April, 2020
  • In the front page block diagram, updated the lowest energy mode for LETIMER.
  • Removed Wake On Radio references wherever applicable since this feature is not supported by the software.
  • Removed multiprotocol from protocol stack Table 2.1 Ordering Information on page 3.
  • Updated 3.2 Radio overview.
  • Updated 3.6.4 Low Energy Timer (LETIMER) lowest energy mode.
  • Updated DCDC Low Power Mode configuration note in Table 4.4 Current Consumption 3.3 V using DC-DC Converter on page 21.
  • Updated wording in Table 4.23 Voltage Monitor (VMON) on page 33.
  • Updated VDAC test conditions for EM2 current consumption Table 4.26 Digital to Analog Converter (VDAC) on page 38.
  • Updated register name IREFPROG for CSEN test conditions Table 4.28 Capacitive Sense (CSEN) on page 43.
  • Updated PTI description 7.3.2 Packet Trace Interface (PTI).
  • Updated package drawing and specifications in 9.1 Package Outline.
  • Updated dimensions 9.2 Recommended PCB Land Pattern.
  • Updated 9.3 Package Marking images and description.
  • Additional text regarding 10. Soldering Recommendations.
  • Updated text in 11.3 CE and UKCA - EU and UK.
  • Added 11.7 KC South Korea.
  • Minor wording change regarding peripheral modules. Revision 1.1 September 2018
  • Added 19 dBm part numbers (MGM13P12) and associated specifications and details. Revision 1.01 August 2018
  • Added Electrical Specifications Tables for VDAC, CSEN, OPAMP, PCNT and APORT.
  • Table 8.2 GPIO Functionality Table on page 63: Sorted by GPIO name.
  • Removed unbonded I/O from APORT mapping tables.
  • Removed tape and reel specifications section. MGM13P Wireless Gecko Module Data Sheet

Revision History

silabs.com | Building a more connected world. Rev. 1.4 | 102

Revision 1.0 February 2018

  • Added V2 part numbers to Table 2.1 Ordering Information on page 3.
  • Updated with latest characterization data and test limits.
  • Added certification details. Revision 0.1 September 15, 2017
  • Initial Release. MGM13P Wireless Gecko Module Data Sheet

silabs.com | Building a more connected world. Rev. 1.4 | 103

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