MA5114

MA5114 DYNEX | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 12

Technical content

Symbol Parameter Conditions FT Basic Functionality V DD = 4.5V - 5.5V, FREQ = 1MHz VIL = VSS , VIH = VDD , VOL ≤ 1.5V, VOH ≥ 1.5V TEMP = -55°C to +125°C, GPS PATTERN SET GROUP A SUBGROUPS 7, 8A, 8B Figure 9: Functionality Subgroup Definition

1 Static characteristics specified in Tables 4 and 5 at +25°C

2 Static characteristics specified in Tables 4 and 5 at +125°C

3 Static characteristics specified in Tables 4 and 5 at -55°C

7 Functional characteristics specified in Table 9 at +25°C

8A Functional characteristics specified in Table 9 at +125°C 8B Functional characteristics specified in Table 9 at -55°C

9 Switching characteristics specified in Tables 6 and 7 at +25°C

10 Switching characteristics specified in Tables 6 and 7 at +125°C

11 Switching characteristics specified in Tables 6 and 7 at -55°C

Figure 10: Definition of Subgroups

Figure 12: Write Cycle ADDRESS TAVAVW TAVWH TAVWL TWLWH (2) TWHAV (3) TELWL (7) (4) TWLQZ WE TAXQX TWLQH DATA OUT (5) (6) HIGH IMPEDANCE DATA VALIDDATA IN TDVWH TWHDX TELWH CS 1. WE must be high during all address transitions. 2. A write occurs during the overlap (TWLWH ) of a low CS and a low WE. 3. TWHAV is measured from either CS or WE going high, whichever is the earlier, to the end of the write cycle. 4. If the CS low transition occurs simultaneously with, or after, the WE low transition, the output remains in the high impedance state. 5. DATA OUT is in the active state, so DATA IN must not be in opposing state. 6. DATA OUT is the write data of the current cycle, if selected. 7. DATA OUT is the read data of the next address, if selected. 8. T ELWL must be met to prevent memory corruption.

OUTLINES AND PIN ASSIGNMENTS Figure 13: 18-Lead Ceramic DIL (Solder Seal) - Package Style C Ref Millimetres Inches A1 0.38 - 1.53 0.015 - 0.060 b 0.35 - 0.59 0.014 - 0.023 c 0.20 - 0.36 0.008 - 0.014 H 4.44 - 5.38 0.175 - 0.212 XG406 D W A e b Z H A 1 15° M E C Seating Plane 1810

18 Vdd

Figure 14: 24-Lead Ceramic Flatpack (Solder Seal) - Package Style F M b e D L A c Pin 1 Z M E Ref Millimetres Inches b 0.38 - 0.48 0.015 - 0.019 c 0.08 - 0.152 0.003 - 0.006 D 14.99 - 15.50 0.590 - 0.610 L 6.73 - 7.75 0.265 - 0.305 M 9.96 - 10.36 0.392 - 0.408 Z 0.13 - 1.14 0.005 - 0.045 XG544 1N C 2A 6 3A 5 4A 4 5A 3 6N C 7A 0 8A 1 9A 2 10 NC CS

12 Vss

Figure 15: 24-Pad Leadless Chip Carrier - Package Style L Bottom View Pad 1 Radius r 3 corners E e b1 D A Bottom View N C CS Vss WE N C N C Vdd 987654 NC 161718192021 NC NC Ref Millimetres Inches D 8.76 - 9.14 0.345 - 0.360 E 8.76 - 9.14 0.345 - 0.360 XG470

Function F C L Via Static 1 Static 2 Dynamic Radiation A6 2 1 2 R 0V 5V F6 5V A5 3 2 3 R 0V 5V F5 5V A4 4 3 4 R 0V 5V F4 5V A3 5 4 5 R 0V 5V F3 5V A0 7 5 7 R 0V 5V F0 5V A1 8 6 8 R 0V 5V F1 5V A2 9 7 9 R 0V 5V F2 5V NCS 11 8 11 R 0V 5V 0V 5V VSS 12 9 12 Direct 0V 0V 0V 0V NWE 13 10 13 R 0V 5V 5V 5V D4 15 11 15 R 0V 5V LOAD 5V D3 16 12 16 R 0V 5V LOAD 5V D2 17 13 17 R 0V 5V LOAD 5V D1 18 14 18 R 0V 5V LOAD 5V A9 21 15 21 R 0V 5V F9 5V A8 22 16 22 R 0V 5V F8 5V A7 23 17 23 R 0V 5V F7 5V VDD 24 18 24 Direct 5V 5V 5V 5V 1. F0=150KHz, F1=F0/2, F2=F0/4, F3=F0/8 etc. 2. Burnin R=1k 3. Radiation R=10k Figure 16: Burnin and Radiation Configuration

ORDERING INFORMATION

For details of reliability, QA/QC, test and assembly options, see ‘Manufacturing Capability and Quality Assurance Standards’ Section 9. Unique Circuit Designator S L C R Radiation Hard Processing 30 kRads (Si) Guaranteed 50 kRads (Si) Guaranteed 100 kRads (Si) Guaranteed Radiation Tolerance C F L Ceramic DIL (Solder Seal) Flatpack (Solder Seal) Leadless Chip Carrier Package Type QA/QCI Process (See Section 9 Part 4) Test Process (See Section 9 Part 3) Assembly Process (See Section 9 Part 2) L C D E B S Rel 0 Rel 1 Rel 2 Rel 3/4/5/STACK Class B Class S Reliability Level MAx5114xxxxx CUSTOMER SERVICE CENTRES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444 UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 Germany Tel: 07351 827723 Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. © Dynex Semiconductor 2000 Publication No. DS3581-5 Issue No. 5.0 January 2000 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. Unit 7 - 58 Antares Drive, Nepean, Ontario, Canada K2E 7W6. Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:- Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification.