LSS-BGA217C-05 IRONWOOD | Alldatasheet
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Technical content
3.1750 0.6793 2FRONT VIEW 19.7250 4.8225 2.2825 14.7250±0.0500 0.850±0.025 (x2) 4X 1.7000 THRU ALL 3.1750 1.5240 10.4000 0.6500 2.1625 2.4125 0.3175 pad (x217) TOP VIEW ISO TOP VIEW ISO BOTTOM VIEW PROPRIETARY AND CONFIDENTIAL - THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF IRONWOOD ELECTRONICS, INC. ANY REPRODUCTION IN PART OR AS A WHOLE WITHOUT THE WRITTEN PERMISSION OF IRONWOOD ELECTRONICS, INC. IS PROHIBITED. ITEM NO. Description Material 1 Substrate for BGA217 0.65mm pitch giga snap LSS-05 type land socket High Temp FR4 2 0.5mm pitch terminal pin for LS-05 Brass 360 Full Hard Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0254mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: LSS-05 BGA217 0.65mm pitch 17x17 array compatible with C15039 Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. A DATE: 05/03/2016 Material: N/A Finish: N/A Weight: 1.28 LSS-BGA217C-05 Drawing SCALE: 3:1 SHEET: 1 OF 1 ENG: E. Smolentseva FILE: LSS-BGA217C-05 Dwg DRAWN BY: M. Raske©2015 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com