LMK212B7106MG

XCL208 TOREX | Alldatasheet

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400mA Inductor Built-in Step-Down “micro DC/DC” Converters ç ˙GENERAL DESCRIPTION The XCL208/XCL209 series is a synchronous step-down micro DC/DC converter which integrates an inductor and a control IC in one tiny package (2.5mm×2.15mm, h=1.05mm). A stable power supply with an output current of 400mA is configured using only two capacitors connected externally. An internal coil simplifies the circuit and enables minimization of noise and other operational trouble due to the circuit wiring. A wide operating voltage range of 1.8V (2.0V) to 6.0V enables support for applications that require an alkaline battery (2-cell) or AC adapter (5V) power supply. An internally fixed output voltage (0.8V to 4.0V) or an externally set output voltage can be selected. The XCL208/XCL209 series uses synchronous rectification at an operat ing frequency of 3.0MHz. PW M control (XCL208) or automatic PWM/PFM switching control (X CL209) can be selected. The XCL208 series has a fixed frequency, enabling the suppression of output ripple. The XCL209 series achieves high efficiency while holding down output ripple across the full range of loads, from light to heavy, enabling the extension of battery operation time. Soft start and on/off functions with CL discharge are provided, and the IC can be put in the standby state by inputting a Low level signal into the CE pin. ˙APPLICATIONS

• Mobile phones, Smart phones
• Bluetooth Headsets
• Tablet PCs
• PND
• PC peripheral devices
• DSC, Camcorders ■FEATURES Input Voltage : 1.8V ~ 6.0V (Type F) : 2.0V ~ 6.0V (Type A/B) Fixed Output Voltage : 0.8V ~ 4.0V (±2.0%) H i g h E f f i c i e n c y : 9 0 % ( VIN=4.2V, VOUT=3.3V) Output Current : 400mA Oscillation Frequency : 3.0MHz ( ±15%) CE Function : A c t i v e H i g h S o f t - s t a r t C i r c u i t B u i l t - i n CL High Speed Auto Discharge Protection Circuits : Current Limiter Built-in (Constant Current & Latching) Control Methods : PWM (XCL208) PWM/PFM (XCL209) Operating Ambient Temperature : -40 ℃ʙ+85℃ Package : USP-10B03 Environmentally Friendly : EU RoHS Compliant, Pb Free ■TYPICAL APPLICATION CIRCUIT ETR28003-001a ˙çTYPICAL PERFORMANCE CHARACTERISTICS
• Efficiency vs. Output Current XCL208x333DR/XCL209x333D ˑGreenOperation Compatible 100 0.01 0.1 1 10 100 1000 Output Current:IOUT (mA) Efficiency:EFFI(%) V IN= 4.2V VOUT=3.3V XCL209(PWM/PFM) XCL208(PWM) 5.0V XCL208A / XCL208B / XCL209A / XCL209B Type XCL208F / XCL209F Type

˙BLOCK DIAGRAM VIN AVSS VOUT LX CE PVSS VIN AVSS VOU T LX CE PVSS VIN AVSS FB LX CE PVSS 1)XCL208A / XCL209A Type 2) XCL208B / XCL209B Type 3)XCL208F / XCL209F Type NOTE: The XCL208 offers a fixed PWM control, a signal from CE Control Logic to PWM/PFM Selector is fixed to "L" level inside. The XCL 209 control scheme is PWM/PFM automatic switching, a signal from CE Control Logic to PWM/PFM Selector is fixed to "H" level inside. The di odes placed inside are ESD protection diodes and parasitic diodes.

˙PRODUCT CLASSIFICATION XCL208①②③④⑤⑥ Fixed PWM XCL209①②③④⑤⑥ PWM/PFM Auto Switching (*1) When other output voltages (semi-custom) are needed, please contact your local Torex sales office for more information. Output voltage range is 0.8~4.0V. (*2) Halogen free and RoHS compliant. DESIGNATOR ITEM SYMBOL DESCRIPTION A VIN≧2.0V Fixed Output Voltage Standard soft-start , No CL auto discharge B VIN≧2.0V Fixed Output Voltage CL auto discharge, High speed soft-start ① Type F VIN≧1.8V Output Voltage External Setting CL auto discharge, High speed soft-start 10 1.0V 12 1.2V 15 1.5V 18 1.8V 25 2.5V 28 2.8V 2L 2.85V 30 3.0V 33 3.3V ②③ Output Voltage (*1) 08 External Setting 0.8V (XCL208F/XCL209F) ④ Oscillation Frequency 3 3.0MHz ⑤⑥ (*2) Package (Order Unit) DR USP-10B03 (3,000/Reel)

˙PIN CONFIGURATION ˙PIN ASSIGNMENT ç ç ç ç ç ç ■FUNCTION PIN NAME SIGNAL CONDITIONS STATUS L AVSS≦VCE≦0.25V Stand-by CE H 0.65V≦VCE≦6V Active * When the CE pin is left open, the IC may operate unstable. Please do not leave the CE pin open. ˙ABSOLUTE MAXIMUM RATINGS PIN NUMBER USP-10B03 PIN NAME FUNCTIONS

1 PVSS (Power) Ground

2 LX Switching Output

3 NC No Connection

FB Output Voltage Sense Pin (Type F) 4 VOUT Fixed Output Voltage Pin (Type A/B)

5 AVSS (Analog) Ground

6 CE Active High Enable

7 NC No Connection

8 VIN Power Supply Input

9 L1 Inductor Electrodes

10 L2 Inductor Electrodes

Ta=25℃ PARAMETER SYMBOL RATINGS UNITS Input Voltage VIN -0.3ʙ6.5 V Lx Pin Voltage VLx -0.3ʙVIN+0.3ʽ6.5 V Output Voltage VOUT -0.3ʙ6.5 V CE Input Voltage VCE -0.3ʙ6.5 V Lx Pin Current ILX ʶ1500 mA Power Dissipation (*1) Pd 500 mW Operating Ambient Temperature Topr -40ʙ+85 ˆ Storage Temperature Tstg -40ʙ+125 ˆ (BOTTOM VIEW) AVSS VIN CE LX PVSS VOUT NC NC Each voltage rating uses the VSS pin as a reference. (*1) The value is an example data which is taken with the PCB mounted.

■ELECTRICAL CHARACTERISTICS PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNIT CIRCUIT Output Voltage VOUT When connected to external components, VIN=VCE=5.0V, IOUT=30mA <E-1> <E-2> <E-3> V ① Operating Voltage Range VIN 2.0 - 6.0 V ① Maximum Output Current IOUTMAX VIN=VOUT(T)+2.0V, VCE=1.0V, When connected to external components (*8) 400 - - mA ① UVLO Voltage VUVLO VCE =VIN, VOUT =0V, Voltage which Lx pin holding “L” level (*1),(*10) 1.00 1.40 1.78 V ③ Supply Current (XCL208) - 46 65 Supply Current (XCL209) IDD VIN=VCE=5.0V, VOUT=VOUT(T)×1.1 - 21 35 μA ② Stand-by Current ISTB VIN=5.0V, VCE=0V, VOUT=VOUT(T)×1.1 - 0 1 μA ② Oscillation Frequency fOSC When connected to external components, PFM Switching Current (*11) IPFM When connected to external components, VIN=VOUT(T)+2.0V, VCE=VIN , IOUT=1mA <E-4> <E-5> <E-6> mA ⑩ PFM Duty Limit (*11) DTYLIMIT_PFM VCE=VIN=<C-1>, IOUT=1mA - 200 300 % ① Maximum Duty Cycle DMAX VIN=VCE=5.0V, VOUT=VOUT(T)×0.9 100 - - % ③ Minimum Duty Cycle DMIN VIN=VCE=5.0V, VOUT=VOUT(T)×1.1 - - 0 % ③ Efficiency (*2) EFFI When connected to external components, VCE=VIN=VOUT(T)+1.2V, IOUT=100mA - <E-7> - % ① LX SW "H" ON Resistance 1 RLxH1 VIN=VCE=5.0V, VOUT=0V, ILX=100mA (*3) - 0.35 0.55 Ω ④ LX SW "H" ON Resistance 2 RLxH2 VIN=VCE=3.6V, VOUT=0V, ILX=100mA (*3) - 0.42 0.67 Ω ④ LX SW "L" ON Resistance 1 RLxL1 VIN=VCE=5.0V (*4) - 0.45 0.65 Ω - LX SW "L" ON Resistance 2 RLxL2 VIN=VCE=3.6V (*4) - 0.52 0.77 Ω - LX SW "H" Leakage Current (*5) ILeakH VIN=VOUT=5.0V, VCE=0V, VLX=0V - 0.01 1.00 μA ⑤ LX SW "L" Leakage Current (*5) ILeakL VIN=VOUT=5.0V, VCE= 0V, VLX=5.0V - 0.01 1.00 μA ⑤ Current Limit (*9) ILIM VIN=VCE=5.0V, VOUT=VOUT(T)×0.9V (*7) 600 800 1000 mA ⑥ Output Voltage Temperature Characteristics ΔVOUT/ (VOUT･ΔTopr) IOUT=30mA, CE "H" Voltage VCEH VOUT=0V, Applied voltage to VCE, Voltage changes Lx to “L” level (*10) 0.65 - VIN V ③ CE "L" Voltage VCEL VOUT=0V, Applied voltage to VCE, Voltage changes Lx to “L” level (*10) VSS - 0.25 V ③ CE "H" Current ICEH VIN=VCE= 5.0V, VOUT=0V -0.1 - 0.1 μA ⑤ CE "L" Current ICEL VIN=5.0V, VCE=0V, VOUT=0V -0.1 - 0.1 μA ⑤ Soft-start Time tSS When connected to external components, VCE=0V→VIN, IOUT=1mA 0.5 0.90 2.50 ms ① Latch Time tLAT VIN=VCE=5.0V, VOUT=0.8×VOUT(T), Short Lx at 1Ω resistance (*6) 1 - 20 ms ⑦ Short Protection Threshold Voltage VSHORT Sweeping VOUT, VIN=VCE=5.0V, Short Lx at 1Ω resistance, VOUT voltage which Lx becomes “L” level within 1ms Inductance Value L Test Frequency=1MHz - 1.5 - μH - Allowed Inductor Current IDC ΔT=+40℃ - 700 - mA - Ta=25℃1) XCL208Axx3DR/XCL209Axx3DR Test conditions: Unless otherwise stated, VIN=5.0V, VOUT(T)=Nominal Voltage NOTE: (*1) Including hysteresis operating voltage range. (*2) EFFI={ (output voltageʷoutput current) öç(input voltageʷinput current) }ʷ100 (*3) ON resistance (Ω)=(VIN - Lx pin measurement voltage) öç100mA (*4) Design value (*5) When temperature is high, a current of approximately 10ЖA (maximum) may leak. (*6) Time until it short-circuits VOUT with GND via 1Ω of resistor from an operational state and is set to Lx=0V from current limit pulse generating. (*7) When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance. (*8) When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes. If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance. (*9) Current limit denotes the level of detection at peak of coil current. (*10) “H”=VIN~VIN-1.2V, “L”=+0.1V~-0.1V (*11) IPFM and DTYLIMIT_PFM are defined only for the XCL209 series.

˙ELECTRICAL CHARACTERISTICS (Continued) PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNIT CIRCUIT Output Voltage VOUT When connected to external components, VIN=VCE=5.0V, IOUT=30mA <E-1> <E-2> <E-3> V ① Operating Voltage Range VIN 2.0 - 6.0 V ① Maximum Output Current IOUTMAX VIN=VOUT(T)+2.0V, VCE=1.0V, When connected to external components (*8) 400 - - mA ① UVLO Voltage VUVLO VCE=VIN, VOUT=0V, Voltage which Lx pin holding “L” level (*1),(*10) 1.00 1.40 1.78 V ③ Supply Current (XCL208) - 46 65 Supply Current (XCL209) IDD VIN=VCE=5.0V, VOUT=VOUT(T) ×1.1 - 21 35 μA ② Stand-by Current ISTB VIN=5.0V, VCE=0V, VOUT=VOUT(T) ×1.1 - 0 1 μA ② Oscillation Frequency fOSC When connected to external components, PFM Switching Current (*11) IPFM When connected to external components, VIN=VOUT(T)+2.0V, VCE=VIN , IOUT=1mA <E-4> <E-5> <E-6> mA ⑩ PFM Duty Limit (*11) DTYLIMIT_PFM VCE=VIN=<C-1>, IOUT=1mA - 200 300 % ① Maximum Duty Cycle DMAX VIN=VCE=5.0V, VOUT=VOUT(T)×0.9 100 - - % ③ Minimum Duty Cycle DMIN VIN=VCE=5.0V, VOUT=VOUT(T)×1.1 - - 0 % ③ Efficiency (*2) EFFI When connected to external components, VCE=VIN=VOUT(T)+1.2V, IOUT=100mA - <E-7> - % ① LX SW "H" ON Resistance 1 RLxH1 VIN=VCE=5.0V, VOUT=0V, ILX=100mA (*3) - 0.35 0.55 Ω ④ LX SW "H" ON Resistance 2 RLxH2 VIN=VCE=3.6V, VOUT=0V, ILX=100mA (*3) - 0.42 0.67 Ω ④ LX SW "L" ON Resistance 1 RLxL1 VIN=VCE=5.0V (*4) - 0.45 0.65 Ω - LX SW "L" ON Resistance 2 RLxL2 VIN=VCE=3.6V (*4) - 0.52 0.77 Ω - LX SW "H" Leakage Current (*5) ILeakH VIN=VOUT=5.0V, VCE=0V, VLX=0V - 0.01 1.00 μA ⑨ Current Limit (*9) ILIM VIN=VCE=5.0V, VOUT=VOUT(T)×0.9V (*7) 600 800 1000 mA ⑥ Output Voltage Temperature Characteristics ΔVOUT/ (VOUT･ΔTopr) IOUT=30mA, -40℃≦Topr≦85℃, - ±100 - ppm/℃ ① CE "H" Voltage VCEH VOUT=0V, Applied voltage to VCE Voltage changes Lx to “L” level （*10） 0.65 - VIN V ③ CE "L" Voltage VCEL VOUT=0V, Applied voltage to VCE Voltage changes Lx to “L” level （*10） VSS - 0.25 V ③ CE "H" Current ICEH VIN=VCE=5.0V, VOUT=0V -0.1 - 0.1 μA ⑤ CE "L" Current ICEL VIN=5.0V, VCE=0V, VOUT=0V -0.1 - 0.1 μA ⑤ Soft-start Time tSS When connected to external components, VCE=0V→VIN, IOUT=1mA - <E-11> <E-12> ms ① Latch Time tLAT VIN=VCE=5.0V, VOUT=0.8×VOUT(T), Short Lx at 1Ω resistance (*6) 1 - 20 ms ⑦ Short Protection Threshold Voltage VSHORT Sweeping VOUT, VIN=VCE=5.0V, Short Lx at 1Ω resistance, VOUT voltage which Lx becomes “L” level within 1ms CL Discharge RDCHG VIN=5.0V, LX=5.0V, VCE=0V, VOUT=Open 200 300 450 Ω ⑧ Inductance Value L Test Frequency=1MHz - 1.5 - μH - Allowed Inductor Current IDC ΔT=+40℃ - 700 - mA - Ta=25℃2) XCL208Bxx3DR/XCL209Bxx3DR Test conditions: Unless otherwise stated, VIN=5.0V, VOUT (T)=Nominal Voltage NOTE: (*1) Including hysteresis operating voltage range. (*2) EFFI={ ( output voltageʷoutput current ) öç( input voltageʷinput current) }ʷ100 (*3) ON resistance (Ω)= (VIN - Lx pin measurement voltage) öç100mA (*4) Design value (*5) When temperature is high, a current of approximately 10ЖA (maximum) may leak. (*6) Time until it short-circuits VOUT with GND via 1Ω of resistor from an operational state and is set to Lx=0V from current limit pulse generating. (*7) When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance. (*8) When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes. If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance. (*9) Current limit denotes the level of detection at peak of coil current. (*10) “H”=VIN~VIN-1.2V, “L”=+0.1V~-0.1V (*11) IPFM and DTYLIMIT_PFM are defined only for the XCL209 series which have PFM control function. (Not for the XCL 208 series)

˙ELECTRICAL CHARACTERISTICS (Continued) ç PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNIT CIRCUIT FB Voltage VFB VIN=VCE=5.0V, VFB voltage which Decrease VFB from 0.9V, Lx becomes “L” (*10) level 0.784 0.800 0.816 V ③ Operating Voltage Range VIN 1.8 - 6.0 V ① Maximum Output Current IOUTMAX VIN=3.2V, VCE=1.0V, When connected to external components (*8) 400 - - mA ① UVLO Voltage VUVLO VCE=VIN, VFB=0.4V, Voltage which Lx pin holding “L” level (*1), (*10) 1.00 1.40 1.78 V ③ Supply Current (XCL208) - 46 65 Supply Current (XCL209) IDD VIN=VCE= 5.0V, VFB=0.88V - 21 35 μA ② Stand-by Current ISTB VIN=5.0V, VCE=0V, VFB=0.88V - 0 1.0 μA ③ Oscillation Frequency fOSC When connected to external components, PFM Switching Current (*11) IPFM When connected to external components, VIN=3.2V, VCE= VIN, IOUT=1mA <E-4> <E-5> <E-6> mA ⑩ PFM Duty Limit (*11) DTYLIMIT_PFM VIN=VCE=2.2V, IOUT=1mA - 200 300 % ① Maximum Duty Cycle MAXDTY VIN=VCE=5.0V, VFB=0.72V 100 - - % ③ Minimum Duty Cycle MINDTY VIN=VCE=5.0V, VFB=0.88V - - 0 % ③ Efficiency (*2) EFFI When connected to external components, VCE=VIN=2.4V, IOUT=100mA - <E-7> - % ① LX SW "H" ON Resistance 1 RLxH1 VIN=VCE=5.0V, VFB=0.72V, ILX=100mA (*3) - 0.35 0.55 Ω ④ LX SW "H" ON Resistance 2 RLxH2 VIN=VCE=3.6V, VFB=0.72V, ILX=100mA (*3) - 0.42 0.67 Ω ④ LX SW "L" ON Resistance 1 RLxL1 VIN=VCE=5.0V (*4) - 0.45 0.65 Ω - LX SW "L" ON Resistance 2 RLxL2 VIN=VCE=3.6V (*4) - 0.52 0.77 Ω - LX SW "H" Leakage Current (*5) ILeakH VIN=VFB=5.0V, VCE=0V, VLX=0V - 0.01 1.00 μA ⑨ PFM Duty Limit (*9) ILIM VIN=VCE=5.0V, VFB=0.72V (*7) 600 800 1000 mA ⑥ Output Voltage Temperature Characteristics ΔVOUT/ (VOUT･ΔTopr) IOUT=30mA, -40℃≦Topr≦85℃, - ±100 - ppm/℃ ① CE "H" Voltage VCEH VFB=0.72V, Applied voltage to VCE, Voltage changes LX to “L” level (*10) 0.65 - VIN V ③ CE "L" Voltage VCEL VFB=0.72V, Applied voltage to VCE, Voltage changes LX to “L” level (*10) VSS - 0.25 V ③ CE "H" Current ICEH VIN=VCE=5.0V, VFB=0.72V -0.1 - 0.1 μA ⑤ CE "L" Current ICEL VIN=5.0V, VCE=0V, VFB=0.72V -0.1 - 0.1 μA ⑤ Soft-start Time tSS When connected to external components, VCE=0V→VIN, IOUT=1mA - 0.25 0.40 ms ① Latch Time tLAT VIN=VCE=5.0V, VFB=0.64V, Short Lx at 1Ω resistance (*6) 1 - 20 ms ⑦ Short Protection Threshold Voltage VSHORT VIN=VCE=5.0V, VFB voltage which Decrease VFB from 0.9V, Lx becomes “L” (*10) level 0.150 0.200 0.250 V ⑦ CL Discharge RDCHG VIN=5.0V, LX=5.0V, VCE=0V, VFB=Open 200 300 450 Ω ⑧ Inductance Value L Test Frequency=1MHz - 1.5 - μH - Allowed Inductor Current IDC ΔT=40℃ - 700 - mA - ç Ta=25℃3) XCL208F083DR/XCL209F083DR Test conditions: Unless otherwise stated, VIN=5.0V, VOUT(T)=Nominal Voltage, and the order of voltage application is VFB→VIN→VCE NOTE: (*1) Including hysteresis operating voltage range. (*2) EFFI = { ( output voltageʷoutput current ) öç( input voltageʷinput current) }ʷ100 (*3) ON resistance (Ω)= (VIN - Lx pin measurement voltage) öç100mA (*4) Design value (*5) When temperature is high, a current of approximately 10ЖA (maximum) may leak. (*6) Time until it short-circuits VOUT with GND via 1Ω of resistor from an operational state and is set to Lx=0V from current limit pulse generating. (*7) When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance. (*8) When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes. If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance. (*9) Current limit denotes the level of detection at peak of coil current. (*10) “H”=VIN~VIN-1.2V, “L”=+0.1V~-0.1V (*11) IPFM and DTYLIMIT_PFM are defined only for the XCL209 series which have PFM control function.

˙ELECTRICAL CHARACTERISTICS (Continued) VOUT (V) IPFM (mA) EFFI (%) VSHORT (ms) tss (ms) PFM Duty e.g. Circuit (XCL208F/XCL209F Type) VOUT (V) R1 (kΩ) R2 (kΩ) CFB (pF) 0.9 100 820 150 1.2 150 300 100 1.5 130 150 220 1.8 300 240 150 2.5 510 240 100 3.0 330 120 150 3.3 470 150 100 4.0 120 30 470 <XCL208/XCL209 F type output voltage setting> The output voltage can be set by adding external dividing resistor s. The output voltage is determined by R1 and R2 in the equation below. The sum of R1 and R2 is normally kept 1M Ω or less. The output voltage range can be set from 0.9V to 6.0V based on the 0.8V ±2.0% reference voltage source. Note that when the input voltage (V IN) is less than or equal to the set ou tput voltage, an output voltage (VOUT) higher than the input voltage (VIN) cannot be output. V OUT=0.8×(R1+R2)/R2 Adjust the value of the phase compensation speedup capacitor C FB so that fzfb=1/(2× π×CFB×R1) is 10kHz or less. It is optimum to adjust to a value from 1kHz to 20kH based on the components used and the board layout. [Calculation example] When R1=470kΩ, R2=150kΩ, V

˙TEST CIRCUITSç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç

˙OPERATIONAL DESCRIPTION <Reference Voltage Source> The reference voltage source provides the reference voltage to ensure stable output voltage of the DC/DC converter. <Ramp Wave Circuit> The ramp wave circuit determines switching frequency. The fr equency is fixed internally 3.0MHz. Clock pulses generated in this circuit are used to produce ramp waveforms needed for PWM operation, and to synchronize all the internal circuits. <Error Amplifier> The error amplifier is designed to monitor output voltage. The amplifier compares the refe rence voltage with the feedback (Type F: FB pin voltage) divided by the internal split resistors, R1 and R2. When a feed back voltage is lower than the reference voltage, the output vo ltage of the error amplifier is increased. The gai n and frequency characteristic s of the error amplifier output are fixed internally to deliver an optimized signal to the mixer. <Current Limit> The current limiter circuit of the XCL208/XCL209 series monitors the current flowing through the P-ch MOS driver transistor connected to the Lx pin, and features a combination of the current limit mode and the operation suspension mode. ①çWhen the driver current is greater than a current limit level, the current limit function operates to turn off the pulses from the Lx pin at any given timing. ②çWhen the driver transistor is turned off, the limiter circuit is then released from the current limit detection state. ③çAt the next pulse, the driver transistor is turned on. However, the transistor is immediately turned off in the case of an over current state. ᶆ When the over current state is eliminated, the IC resumes its normal operation. The IC waits for the over current state to end by repeating the steps ᶃ through ᶅ. If an over current state continues for a latch time and the above three steps are repeatedly performed, the IC performs the function of latching the OFF state of the driver transistor, and goes into operation suspension state. Once the IC is in suspension state, operations can be resumed by either turning the IC off via the CE pin, or by restoring power to the V IN pin. The suspension state does not mean a complete shutdown, but a state in which pulse output is suspended; therefore, the internal circuitry remains in operation. The current limit of t he XCL208/XCL209 series can be set at 800mA at typical. Depending on the state of the PC Board, latch time may become longer and latch operation may not work. In order to avoid the effect of noise, an input capacitor is placed as close to the IC as possible. The XCL208/XCL209 series consists of a reference voltage source, ramp wave circuit, error amplifier, PWM comparator, phase compensation circuit, output voltage adjustment resistors, P-ch MOSFET driver transistor, N-ch MOSFET switching transistor for the synchronous switch, current limiter circuit, UVLO circuit with control IC, and an inductor. (See the block diagram below.) Using the error amplifier, the voltage of the internal voltage reference source is compared with the feedback voltage from the V OUT pin through split resistors, R1 and R2. Phase compens ation is performed on the resulting error amplifier output, to input a signal to the PWM comparator to determine the turn-on time during PWM operation. The PWM comparator compares, in terms of voltage level, the signal from the error amplifier with the ramp wave from the ramp wave circuit, and delivers the resulting output to the buffer driver circuit to cause the Lx pin to output a switching duty cycle. This process is continuously performed to ensure stable output voltage. The current feedback circuit monitors the P-ch MOS driver transistor current for each switching operation, and modulates the error amplifier output signal to provide multiple feedback signals. This enables a stable feedback loop even w hen a low ESR capacitor such as a ceramic capacitor is used ensuring stable output voltage. Type A Limit＜#ms Limit ＞#ms ILx VOUT Lx VCE VIN Current Limit Level 0mA VSS Restart VIN AVSS VOUT LX CE PVSS

■OPERATIONAL DESCRIPTION(Continued) <Short-Circuit Protection> The short-circuit protection circuit monitors the internal R1 and R2 divider voltage (Type F: FB pin voltage). In case where output is accidentally shorted to the Ground and when the FB point voltage decreases less than half of the reference voltage (Vref) and a current more than the I LIM flows to the driver transistor, the short-ci rcuit protection quickly operates to turn off and to latch the driver transistor. In t he latch state, the operation can be resumed by either turning the IC off and on via the CE pin, or by restoring power supply to the VIN pin. Also, when sharp load transient happens, a voltage drop at the V OUT is propagated through C FB, as a result, short circuit protection may operate in the voltage higher than short-circuit protection voltage. <UVLO Circuit> When the VIN pin voltage becomes 1.4V (TYP.) or lo wer, the P-channel output driver trans istor is forced OFF to prevent false pulse output caused by unstable operation of the internal circuitry. When the V IN pin voltage becomes 1.8V or higher, by releasing the UVLO state then t he soft-start function initiates out put startup operation. The so ft-start function operates eve n when the V IN pin voltage falls momentarily below t he UVLO operating voltage same as re leasing the UVLO function. The UVLO circuit does not cause a complete shutdown of the IC, but causes pulse output to be suspended; therefore, the internal circuitry remains in operation. <PFM Switch Current> In PFM control operation, until coil current reaches to IPFM, the IC keeps the P-ch MOSFET on. In this case, on-time (tON) that the P-ch MOSFET is kept on can be given by the following formula. t ON = LʷIPFM / (VINʵVOUT) ˠIPFM① <PFM Duty Limit> In the PFM control operation, the maximum PFM Duty Limit is set to 200% (TYP.). Therefore, under the condition that the step-down ratio is small, it’s possible for P-ch MOSFET to be turned off even when coil current doesn’t reach to IPFM. ˠIPFM② <CL High Speed Discharge> The XCL208B/XCL209B and the XCL208F/XCL209F can quickly discharge the electric charge at the output capacitor (CL) when a low signal to the CE pin which enables a whole IC circuit put into OFF state, is inputted via the N-ch transistor located between the LX pin and the VSS pin. When the IC is disabled, electric charge left at the output capacitor (CL) is quickly discharged so that it may avoid application malfunction. Discharge time is set by the CL auto-discharge resistance (RDCHG) and the output capacitance (CL). By setting time constant as Н(Н=CL x RDCHG), discharge time of the output voltage is calculated by the following formula. V = VOUT(T) x e –t/Н o r t =τln (VOUT(T) / V) V : Output voltage after discharge V OUT(T) : Output voltage t: Discharge time, Н: CL x RDCHG CL : Output capacitance (CL) RDCHG : CL auto-discharge resistance I PFM① I PFM② 100 0 1 02 03 04 05 06 07 08 09 0 1 0 0 CL=10uF CL=20uF CL=50uF

■OPERATIONAL DESCRIPTION(Continued) (A) SW_CE OPERATIONAL STATES ON Stand-by OFF Active (B) SW_CE OPERATIONAL STATES ON Active OFF Stand-by <CE Pin Function> The operation of the çXCL208/XCL209 series will enter into the stand-by m ode when a low level signal is input to the CE pin. During the stand-by mode, the current consumption of the IC becomes 0ЖA (TYP.), with a state of high impedance at the Lx pin and VOUT pin. The IC starts its operation by inputting a high level sig nal to the CE pin. The input to the CE pin is a CMOS input and the sink current is 0ЖA (TYP.). <Soft-Start>ç Soft-start time is internally set. Soft-start time is defined as the time to reach 90% of the output nominal voltage when the CE pin is turned on. tSS VCEH VOUT 設定電圧の90% 90% of setting voltage IC内部IC内部 SW_CE SW_CE VIN CE VIN CE VDDVDD 使用例A 使用例B(A) (B) < IC inside > < IC inside >

˙NOTE ON USE 1. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be exceeded. 2. The XCL208/XCL209 series is designed for use with ceramic output capacitors. If, however, the po tential difference is too large between the input voltage and the output voltage, a ceramic capacitor may fail to absorb the resulting high switching energy and oscillation could occur on the output. In this case, increase 10 ЖF to the output capacitance for adding insufficient capacitance. Also, if the out put capacitance is too large, the output voltage is slowly rising and the IC may not operate. Adjust the output capacitance so that the output voltage can go up within the soft-start time. 3. Spike noise and ripple voltage arise in a switching regulator as with a DC/DC converter. These are greatly influenced by external component selection, such as the coil inductance, capacitance values, and board layout of external components. Once the design has been completed, verification with actual components should be done. 4. Depending on the input-output voltage differential, or load current, some pulses may be skipped as 1/2, 1/3 and the ripple voltage may increase. 5. When the difference between input and output is large in PWM control, very narrow pulses will be outputted, and there is the possibility that 0% duty cycles may be continued during some cycles. 6. When the difference between input and output is small, and the load current is heavy, very wide pulses will be outputted and there is the possibility that 100% duty cycles may be continued during some cycles. 7. With the IC, the peak current of the coil is controlled by the current limit circuit. Since the peak current of the coil in creases when dropout voltage or load current is high, current limit starts operation, and this can lead to instability. When peak curr ent becomes high, please adjust the coil inductance value and fully check the circuit operation. In addition, please calculate the peak current according to the following formula: Ipk = (V IN - VOUT) x OnDuty / (2 x L x fOSC) + IOUT L: Coil Inductance Value f OSC: Oscillation Frequency 8. When the peak current which exceeds limit current flows within the specified time, the built-in P-ch driver transistor turns off. During the time until it detects limit current and before the built-in transistor can be turned off, the current for limit current flows; therefore, care must be taken when selecting the rating for the external components such as a coil. 9. When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance. 10. Depending on the state of the PC Board, latch time may become longer and latch operation may not work. In order to avoid the effect of noise, the board should be laid out so that input capacitors are placed as close to the IC as possible. 11. Use of the IC at voltages below the minimum operating voltage range may lead to instability. 12. This IC should be used within the stated absolute maximum ratings of external components in order to prevent damage to the device. 13. When the IC is used in high temperature, output voltage may increase up to input voltage level at no load because of the leak current of the driver transistor. 14. The current limit is set to 1000mA (MAX.) at typical. However, the current of 1000mA or more may flow. In case that the current limit functions while the VOUT pin is shorted to the GND pin, when P-ch MOSFET is ON, the potential difference for input voltage will occur at both ends of a coil. For this, the time rate of coil current becomes large. By contrast, when N-ch MOSFET is ON, there is almost no potential difference at both ends of the coil since the VOUT pin is shorted to the GND pin. Conseq uently, the time rate of coil current becomes quite small. According to the repetition of this operation, and the delay time of the circuit, coil current will be converged on a certain current value, exceeding the amount of current, which is supposed to be limited originally. Even in this case, however, after the over current state continues for several ms, the circuit will be latched. A coil should be used within the stated absolute maximum rating in order to prevent damage to the device. ç ①Current flows into P-ch MOSFET to reach the current limit (ILIM). ②The current of ILIM or more flows since the delay time of the circuit occurs during from the detection of the current limit to OFF of P-ch MOSFET. ③Because of no potential difference at both ends of the coil, the time rate of coil current becomes quite small. ④Lx oscillates very narrow pulses by the current limit for several ms. ⑤The circuit is latched, stopping its operation. Delay Limit ʼ#ms ᶄ ᶃ ᶅ ᶆ ᶇ Lx ILIM ILx

■NOTE ON USE (Continued) 15. In order to stabilize VIN voltage level and oscillation frequency, we recommend that a by-pass capacitor (CIN) be connected as close as possible to the VIN & VSS pins. 16. High step-down ratio and very light load may lead an intermittent oscillation when PWM mode. 17. For the XCL209, when PWM/PFM automatic switching goes into continuous mode, the IC may be in unstable operation for the range of MAXDUTY area with small in put/output differential. Once the design has been completed, verification with actual components should be done. 18. Torex places an importance on improving our products and their reliability. We request that users incorporate fail-safe designs and post-aging protection treatment when using Torex products in their systems. 19. Instructions of pattern layouts (1) In order to stabilize VIN voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as possible to the VIN (No.8) and PVSS (No.1) pins. (2) Please mount each external component as close to the IC as possible. (3) Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit impedance. (4) Make sure that the PCB GND traces are as thick as possi ble, as variations in ground potential caused by high ground currents at the time of switching may result in instability of the IC. (5) Internal driver transistors bring on heat because of the output current and ON resistance of the driver transistors. (6) Please connect Lx (No.2) pin and L1 (No.9) pin on the PCB layout. (7) Please connect VOUT (No.4) pin and L2 (No.10) pin on the PCB layout. (Type A/B) <Type A/B (VOUT)> <Type F (FB)> CL VOUTGND CIN VIN GND CE IC XCL208/209 USP-10B03 TOREX LX RFB1 CFB FB CL VOUTGND CIN VIN GND CE IC XCL208/209 USP-10B03 TOREX LX RFB1 CFB FB （TOP VIEW） （BOTTOM VIEW） （PCB mounted TOP VIEW ） （TOP VIEW） （BOTTOM VIEW） （PCB mounted TOP VIEW ） : IC : Ceramic Cap : Chip Resistance

■NOTE ON USE (Continued) 20. Typical application circuit NOTE: The integrated Inductor can be used only for this DC/DC converter.ççPlease do not use this inductor for other reasons. Please use B, X5R, and X7R grades in temperature characteristics for the CIN and CL capacitors. These grade ceramic capacitors minimize capacitance-loss as a function of voltage stress. If necessary, increase capacitance by adding or replacing. Examples of external components PART NUMBER MANUFACTURE RATED VOLTAGE / INDUCTANCE / FEATURES Size (L×W) LMK107BJ475KA TAIYO YUDEN 10V/4.7μF/X5R 1.6mm×0.8mmCIN LMK212B7475KG TAIYO YUDEN 10V/4.7μF/X7R 2.0mm×1.25mm LMK107BBJ106MA TAIYO YUDEN 10V/10μF/X5R 1.6mm×0.8mm CL LMK212B7106MG TAIYO YUDEN 10V/4.7μF/X7R 2.0mm×1.25mm <Typical application circuits Type A/B> < Typical application circuits Type F> Example of external components CIN: 10V/4.7μF（LMK107BJ475KA TAIYO YUDEN ） CL: 10V/10μF（LMK107BBJ106MA TAIYO YUDEN ） Example of external components (VOUT=1.8V) CIN: 10V/4.7μF（LMK107BJ475KA TAIYO YUDEN ） CL: 10V/10μF（LMK107BBJ106MA TAIYO YUDEN ） RFB1: 300kΩ RFB2: 240kΩ CFB: 150pF（C1005CH1H151J TDK）

■TYPICAL PERFORMANCE CHARACTERISTICS ( 1 ) E f f i c i e n c y v s . O u t p u t C u r r e n t ( 2 ) O u t p u t Voltage vs. Output Current 100 0.1 1 10 100 1000 Output Current:I OUT (m A) Efficiency:EFFI(%) (PWM) 2.4V 3.6V VIN= 4.2V XCL209(PWM/PFM) XCL208 çç 1.5 1.6 1.7 1.8 1.9 2.0 2.1 0.1 1 10 100 1000 Output Current:I OUT (m A) Output Voltage:VOUT(V) VIN=4.2V,3.6V,2.4V XCL208/XCL209 (3) Ripple Voltage vs. Output Current (4) Oscillation Frequency vs. Ambient Temperature 100 0.1 1 10 100 1000 Output Current:IOUT (m A) Ripple Voltage:Vr(mV) VIN=2.4 V XCL208 XCL209 VIN=2.4V 3.6V,4.2 3.6V,4.2V çç 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 -50 -25 0 25 50 75 100 Ambient Temperature: Ta (℃) VIN=3.6V Oscillation Frequency : fosc(MHz) (5) Supply Current vs. Ambient Temperature (6) Output Voltage vs. Ambient Temperature -50 -25 0 25 50 75 100 Ambient Temperature: Ta (℃) Supply Current : IDD (μA) VIN=6.0V 4.0V 2.0V 1.5 1.6 1.7 1.8 1.9 2.0 2.1 -50 -25 0 25 50 75 100 Ambient Temperature: Ta (℃) Output Voltage : VOUT (V) VIN=3.6V XCL208B183DR/XCL209B183DR XCL208B183DR/XCL209B183DR XCL208B183DR/XCL209B183DR XCL208B183DR/XCL209B183DR XCL209B183DR XCL208B183DR/XCL209B183DR

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (7) UVLO Voltage vs. Ambient Temperature (8) CE "H" Voltage vs. Ambient Temperature 0.0 0.3 0.6 0.9 1.2 1.5 1.8 -50 -25 0 25 50 75 100 Ambient Temperature: Ta (℃) UVLO Voltage : UVLO (V) CE=VIN 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -50 -25 0 25 50 75 100 Ambient Temperature: Ta (℃) CE "H" Voltage : VCEH (V) VIN=5.0V 3.6V 2.4V (9) CE "L" Voltage vs. Ambient Temperature (10) Soft Start Time vs. Ambient Temperature 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -50 -25 0 25 50 75 100 Ambient Temperature: Ta (℃) CE "L" Voltage : VCEL (V) VIN=5.0V 3.6V 2.4V 0.0 1.0 2.0 3.0 4.0 5.0 -50 -25 0 25 50 75 100 Ambient Temperature: Ta (℃) Soft Start Time : tss (ms) VIN=3.6V (11) "Pch / Nch" Driver on Resistance vs. Input Voltage (12) Rise Wave Form 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0123456 Input Voltage : VIN (V) Pch on Resistance Nch on Resistance Lx SW ON Resistance:RLxH,RLxL ( Ω) çç XCL208B333DR/XCL209B333DR XCL208B183DR/XCL209B183DR XCL208B183DR/XCL209B183DR XCL208B183DR/XCL209B183DR XCL208B183DR/XCL209B183DR XCL208B183DR/XCL209B183DR CE:0.0V˰1.0V VIN = 5.0V IOUT = 1.0mA Time:100μs/div VOUT øĪį ùĪį øĪįāøĝöīİĽçççççùĪįāøĝöīİĽ

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (13) Soft-Start Time vs. Ambient Temperature (14) C L Discharge Resistance vs. Ambient Temperature 100 200 300 400 500 - 5 0 - 2 50 2 55 07 5 1 0 0 Ambient Temperature: Ta (℃) VIN=5.0V IOUT=1.0mA Soft Start Time : tss (μs) 100 200 300 400 500 600 -50 -25 0 25 50 75 100 Ambient Temperature: Ta (℃) CL Discharge Resistance: (Ω) VIN=6.0V 4.0V 2.0V (15) Load Transient Response MODEɿPWM/PFM Automatic Switching Control ççç ç XCL209B183DR IOUT =1mA ˰ 100mA øĪįāø÷÷ĴĈöīİĽçùĪįāü÷ĴĝöīİĽ 1ch VOUT 2ch Time:100μs/div VIN=3.6V,VOUT=1.8V XCL209B183DR IOUT =1mA ˰ 300mA VOUT øĪįāø÷÷ĴĈöīİĽçùĪįāü÷ĴĝöīİĽ Time:100μs/div 1ch 2ch VIN=3.6V,VOUT=1.8V XCL209B183DR IOUT =100mA ˰ 1mA VOUT 1ch:100mA/div 2ch:50mV/div Time:100μs/div 2ch 1ch VIN=3.6V,VOUT=1.8V XCL209B183DR IOUT =300mA ˰ 1mA VOUT 1ch:100mA/div 2ch:50mV/div Time:100μs/div 1ch 2ch VIN=3.6V,VOUT=1.8V XCL208B333DR/XCL209B333DR XCL208B333DR/XCL209B333DR XCL209B183DR XCL209B183DR XCL209B183DR XCL209B183DR

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (15) Load Transient Response (Continued) MODEɿPWM Control ççççç ççççç XCL208B183DR 1ch:100mA/div 2ch:50mV/div Time:100μs/div 2ch 1ch IOUT =1mA ˰ 100mA VIN=3.6V,VOUT=1.8V VOUT XCL208B183DR 1ch:100mA/div 2ch:50mV/div Time:100μs/div 2ch 1ch IOUT =1mA ˰ 300mA VIN=3.6V,VOUT=1.8V VOUT XCL208B183DR Time:100μs/div 1ch:100mA/div 2ch:50mV/div 2ch 1ch IOUT =100mA ˰ 1mA VIN=3.6V,VOUT=1.8V VOUT XCL208B183DR Time:100μs/div 1ch:100mA/div 2ch:50mV/div 2ch 1ch IOUT =300mA ˰ 1mA VIN=3.6V,VOUT=1.8V VOUT XCL208B183DR XCL208B183DR XCL208B183DR XCL208B183DR

■PACKAGING INFORMATION ˔USP-10B03 (unit: mm) 1PIN INDENT 0.3±0.05 (0.65) (0.05) 0.4±0.05 2.5±0.05 (0.6) 87 5 6 4312 (0.5) 0.9±0.05 (0.05) ˔USP-10B03 Reference Pattern Layout (unit: mm) ˔USP-10B03 Reference Metal Mask Design (unit: mm)

■MARKING RULE ① represents products series ② represents integer of output voltage and oscillation frequency ③ represents the decimal part of output voltage Example （Mark ②, ③） ④,⑤ represents production lot number 01ʙ09, 0Aʙ0Z, 11ʙ9Z, A1ʙA9, AAʙAZ, B1ʙZZ in order. (G, I, J, O, Q, W excluded) *No character inversion used. MARK PRODUCT SERIES MARK OUTPUT VOLTAGE(V) OSCILLATION FREQUENCY=3.0MHz 0.x F MARK OUTPUT VOLTAGE (V) OSCILLATION FREQUENCY=3.0MHz 0.x 0 1.x 1 2.x 2 3.x 3 4.x 4 MARK OUTPUT VOLTAGE (V) OSCILLATION FREQUENCY=3.0MHz 0.x A 1.x B 2.x C 3.x D 4.x E OUTPUT VOLTAGE (V) MARK PRODUCT SERIES OUTPUT VOLTAGE (V) MARK PRODUCT SERIES MARK OSCILLATION FREQUENCY ② ③ ② ③ ② ③ 3.0MHz F 8 1 8 D D ⑤ ④ USP-10B03

1. The products and product specifications cont ained herein are subject to change without notice to improve performance characteristic s. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infri ngement of patents, pat ent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not devel oped, designed, or approved for use with such equipment whose failure of malfuncti on can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transpor t; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this dat asheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD.