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◎ SEMIHOW REV.A0,December 2014 HRLD55N03K_HRLU55N03K BVDSS = 30 V RDS(on) typ = 4.2mΩ ID = 100 A

FEATURES

30V N-Channel Trench MOSFET 1.Gate 2. Drain 3. Source December 2014 D-PAK I-PAK HRLD55N03K HRLU55N03K  Originative New Design  Superior Avalanche Rugged Technology  Excellent Switching Characteristics  Unrivalled Gate Charge : 50nC (Typ.)  Extended Safe Operating Area  Lower RDS(ON) : 4.2 mΩ (Typ.) @VGS=10V  Lower RDS(ON) : 7.5 mΩ (Typ.) @VGS=4.5V  100% Avalanche Tested Absolute Maximum Ratings TC=25℃ unless otherwise specified Symbol Parameter Value Units VDSS Drain-Source Voltage 30 V ID Drain Current – Continuous (TC = 25℃) 100 * A Drain Current – Continuous (TC = 100℃) 70 * A IDM Drain Current – Pulsed (Note 1) 310 * A VGS Gate-Source Voltage ±20 V EAS Single Pulsed Avalanche Energy (Note 2) 300 mJ EAR Repetitive Avalanche Energy (Note 1) 7.5 mJ PD Power Dissipation (TA = 25℃)* 3 W Power Dissipation (TC = 25℃) - Derate above 25℃ 75 W

0.5 W/℃

TJ, TSTG Operating and Storage Temperature Range -55 to +175 ℃ TL Maximum lead temperature for soldering purposes, 1/8” from case for 5 seconds 300 ℃ Thermal Resistance Characteristics Symbol Parameter Typ. Max. Units RθJC Junction-to-Case -- 2.0 ℃/W RθJA Junction-to-Ambient* -- 50 RθJA Junction-to-Ambient -- 110 * When mounted on the minimum pad size recommended (PCB Mount) * Drain current limited by maximum junction temperature

◎ SEMIHOW REV.A0,December 2014 HRLD55N03K_HRLU55N03K Electrical Characteristics TJ=25 °C unless otherwise specified Symbol Parameter Test Conditions Min Typ Max Units IS Continuous Source-Drain Diode Forward Current -- -- 100 A ISM Pulsed Source-Drain Diode Forward Current -- -- 310 VSD Source-Drain Diode Forward Voltage IS = 20 A, VGS = 0 V -- -- 1.3 V trr Reverse Recovery Time IS = 20 A, VGS = 0 V diF/dt = 55 A/μs -- 20 -- ㎱ Qrr Reverse Recovery Charge -- 10 -- nC On Characteristics BVDSS Drain-Source Breakdown Voltage VGS = 0 V, ID = 250 ㎂ 30 -- -- V IDSS Zero Gate Voltage Drain Current VDS = 24 V, VGS = 0 V -- -- 1 ㎂ IGSS Gate-Body Leakage Current VGS = ±20 V, VDS = 0 V -- -- ±100 ㎁ Off Characteristics Ciss Input Capacitance VDS = 25 V, VGS = 0 V, f = 1.0 MHz -- 1950 -- ㎊ Coss Output Capacitance -- 250 -- ㎊ Crss Reverse Transfer Capacitance -- 190 -- ㎊ Rg Gate Resistance VGS = 0 V, VDS = 0 V, f = 1MHz -- 1 -- Ω Dynamic Characteristics td(on) Turn-On Time VDS = 15 V, ID = 20 A, RG = 6 Ω -- 15 -- ㎱ tr Turn-On Rise Time -- 20 -- ㎱ td(off) Turn-Off Delay Time -- 65 -- ㎱ tf Turn-Off Fall Time -- 70 -- ㎱ Qg Total Gate Charge VDS = 24 V, ID = 20 A, VGS = 10 V -- 50 -- nC Qgs Gate-Source Charge -- 8 -- nC Qgd Gate-Drain Charge -- 8 -- nC Switching Characteristics Source-Drain Diode Maximum Ratings and Characteristics VGS Gate Threshold Voltage VDS = VGS, ID = 250 ㎂ 1.0 -- 2.4 V RDS(ON) Static Drain-Source On-Resistance VGS = 10 V, ID = 20 A -- 4.2 5.5 mΩ VGS = 4.5 V, ID = 20 A -- 7.5 9 mΩ gFS Forward Transconductance VDS = 15, ID = 20 A -- 60 -- S Notes : 1. Repetitive Rating : Pulse width limited by maximum junction temperature 2. L=1mH, IAS=10A, VDD=25V, RG=25Ω, Starting TJ =25°C

◎ SEMIHOW REV.A0,December 2014 HRLD55N03K_HRLU55N03K Fig 12. Gate Charge Test Circuit & Waveform Fig 13. Resistive Switching Test Circuit & Waveforms Fig 14. Unclamped Inductive Switching Test Circuit & Waveforms EAS = LL IAS 2 ---- 2 BVDSS -- VDD BVDSS Vin VDS 10% 90% td(on) tr t on t off td(off) tf Charge VGS 10V Qg Qgs Qgd VDD VDS BVDSS t p VDD IAS VDS (t) ID (t) Time VDD ( 0.5 rated VDS ) 10V VDS RL DUT RG 3mA VGS DUT VDS 300nF 50KΩ 200nF 12V Same Type as DUT 10V DUT RG L I D

◎ SEMIHOW REV.A0,December 2014 HRLD55N03K_HRLU55N03K Fig 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms DUT VDS Driver RG Same Type as DUT VGS • dv/dt controlled by RG

  • IS controlled by pulse period VDD L I S 10V VGS ( Driver ) I S ( DUT ) VDS ( DUT ) VDD Body Diode Forward Voltage Drop Vf IFM , Body Diode Forward Current Body Diode Reverse Current IRM Body Diode Recovery dv/dt di/dt D = Gate Pulse Width

◎ SEMIHOW REV.A0,December 2014 HRLD55N03K_HRLU55N03K Package Dimension TO-252 (Ass’y GZSM)

◎ SEMIHOW REV.A0,December 2014 HRLD55N03K_HRLU55N03K Package Dimension TO-251 (Ass’y GZSM)

◎ SEMIHOW REV.A0,December 2014 HRLD55N03K_HRLU55N03K Package Dimension TO-251 (Ass’y CLD)