F206R6A050SB VINCOTECH | Alldatasheet

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Technical content

  • Inverter, blocking diodes
  • Built-in thermistor
  • IGBT3 technology for low saturation losses
  • Power Regeneration
  • 30-F206R6A050SB-M442E
  • 30-F206R6A050SB01-M442E10 Tj=25°C, unless otherwise specified Parameter Symbol Value Unit Repetitive peak reverse voltage VRRM 1600 V Th=80°C 160 Tc=80°C 160 Th=80°C 135 Tc=80°C 206 Maximum Junction Temperature Tjmax 150 °C Inverter Transistor Th=80°C 60 Tc=80°C 75 Th=80°C 116 Tc=80°C 176 tSC Tj≤150°C 6 μs VCC VGE=15V 360 V W A V °C175Tjmax VCE IC VGE ICpulse Tj=Tjmax Tj=Tjmax VCE ≤ 600V, Tj ≤ Top max A 150 600 A V tp limited by Tjmax Collector-emitter break down voltage DC collector current Repetitive peak collector current Power dissipation per IGBT Maximum Junction Temperature Short circuit ratings Turn off safe operating area Types 1400 Tj=Tjmax tp=10ms Tj=Tjmax Ptot DC forward current Surge forward current Tj=25°C 9800 Features flow2 housing Target Applications Schematic I2t-value Maximum Ratings IFAV A2s IFSM Condition Blocking Diode A A WPower dissipation per Diode I ±20 150 Ptot Gate-emitter peak voltage copyright by Vincotech 1 Revision: 3

Tj=25°C, unless otherwise specified Parameter Symbol Value Unit Maximum Ratings Condition Inverter Diode Th=80°C 35 Tc=80°C 40 Th=80°C 60 Tc=80°C 91 Thermal Properties Insulation Properties Vis t=2s DC voltage 4000 V min 12.7 mm min 12.7 mm CTI >200 600 Tjmax IFRM Tj=Tjmax Ptot Maximum Junction Temperature Peak Repetitive Reverse Voltage Repetitive peak forward current Power dissipation per Diode W 175 °C IF VRRM Tj=25°C A V A60 Tj=Tjmax tp limited by Tjmax DC forward current Storage temperature Tstg -40…+125 °C -40…+(Tjmax - 25) Comparative tracking index Insulation voltage Creepage distance TopOperation temperature under switching condition Clearance copyright by Vincotech 2 Revision: 3

VGE [V] or VGS [V] Vr [V] or VCE [V] or VDS [V] IC [A] or IF [A] or ID [A] Tj Min Typ Max Tj=25°C 1.11 1.7 Tj=125°C 1.04 Tj=25°C 0.91 Tj=125°C 0.78 Tj=25°C 2 Tj=125°C 2.5 Tj=25°C 0.1 Tj=125°C 2.2 Thermal resistance chip to heatsink per chip RthJH 0.52 Thermal resistance chip to heatsink per chip RthJC 0.34 Tj=25°C 5 5.8 6.5 Tj=150°C Tj=25°C 1.5 2.1 Tj=150°C 1.7 Tj=25°C 0.35 Tj=150°C Tj=25°C 700 Tj=150°C Tj=25°C tbd. Tj=150°C tbd. Tj=25°C tbd. Tj=150°C tbd. Tj=25°C tbd. Tj=150°C tbd. Tj=25°C tbd. Tj=150°C tbd. Tj=25°C tbd. Tj=150°C tbd. Tj=25°C tbd. Tj=150°C tbd. Thermal resistance chip to heatsink per chip RthJH 0.8 Thermal resistance chip to case per chip RthJC 0.53 Tj=25°C 1.62 2.1 Tj=150°C 1.58 Tj=25°C tbd. Tj=150°C tbd. Tj=25°C tbd. Tj=150°C tbd. Tj=25°C tbd. Tj=150°C tbd. di(rec)max Tj=25°C tbd. /dt Tj=150°C tbd. Tj=25°C tbd. Tj=150°C tbd. Thermal resistance chip to heatsink per chip RthJH 1.59 T hermal resistance chip to case per chip RthJC 1.05 Thermal grease thickness≤50um λ = 1 W/mK none Tj=25°C 310 3140 V ±15 tr td(off) VCE=VGE Thermal grease thickness≤50um λ = 1 W/mK QGate Erec Coss Crss Qrr trr IGES tf Eon Eoff td(on) IRRM VF VGE(th) VCE(sat) ICES Rgint Input capacitance Output capacitance Turn-off energy loss per pulse Integrated Gate resistor Inverter Transistor Gate emitter threshold voltage ValueConditions Characteristic Values Forward voltage Threshold voltage (for power loss calc. only) Slope resistance (for power loss calc. only) V F Vto rt Blocking Diode 100 100 100 K/W V V mΩ mAReverse current Ir μC mWs A/μs K/W f=1MHz Rgon=8 Ω Rgoff=8 Ω ±15 ±15 Turn-on energy loss per pulse Reverse recovered charge Inverter Diode Peak reverse recovery current Reverse transfer capacitance Diode forward voltage Gate charge Cies Reverse recovery time Reverse recovered energy Peak rate of fall of recovery current Collector-emitter cut-off current incl. Diode Fall time Turn-off delay time Turn-on delay time Rise time Gate-emitter leakage current Collector-emitter saturation voltage 600 480 0.0008 300 300 1600 Thermal grease thickness≤50um λ = 1 W/mK Rgon=8 Ω V ns A nC nA K/W V 200 mWs ns pF mA Ω Tj=25°C copyright by Vincotech 3 Revision: 3

VGE [V] or VGS [V] Vr [V] or VCE [V] or VDS [V] IC [A] or IF [A] or ID [A] Tj Min Typ Max ValueConditions Characteristic Values g Nm Weight G tbd. 44 . 2 N m Terminal connection torque M 6.7 7 7.4 Mounting torque M 3.8 5n H Chip module lead resistance, terminals -chip Rcc'1+EE' tbd. mΩ Module stray inductance LsCE Thermal resistance, case to heatsink RthCH tbd. K/W Module Properties BTj=25°CVincotech NTC Reference B-value Tol. ±3% 3950 K B(25/100) Tj=25°C 3996 K Tj=25°CB-value B(25/50) Tol. ±3% Ω22000 5-5 200 mW/K Power dissipation P mW Rated resistance R Power dissipation constant Deviation of R100 ΔR/R R100=1486 Ω Thermistor Tj=25°C Tc=100°C Tc=100°C Tj=25°C copyright by Vincotech 4 Revision: 3

Version Ordering Code in DataMatrix as in packaging barcode as 17mm housing 30-F206R6A050SB-M442E M442-E M442-E 17mm housing, without thermistor 30-F206R6A050SB01-M442E10 M442-E10 M442-E10 Outline Pinout Ordering Code & Marking Ordering Code and Marking - Outline - Pinout copyright by Vincotech 5 Revision: 3

PRODUCT STATUS DEFINITIONS Formative or In Design First Production Full Production DISCLAIMER LIFE SUPPORT POLICY As used herein: The information given in this datasheet describes the type of component and does not represent assured characteristics. For tested values please contact Vincotech.Vincotech reserves the right to make changes without further notice to any products herein to improve reliability, function or design. Vincotech does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. Vincotech products are not authorised for use as critical components in life support devices or systems without the express written approval of Vincotech. 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in labelling can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Target Product StatusDatasheet Status Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. The data contained is exclusively intended for technically trained staff. Preliminary This datasheet contains preliminary data, and supplementary data may be published at a later date. Vincotech reserves the right to make changes at any time without notice in order to improve design. The data contained is exclusively intended for technically trained staff. Final This datasheet contains final specifications. Vincotech reserves the right to make changes at any time without notice in order to improve design. The data contained is exclusively intended for technically trained staff. copyright by Vincotech 6 Revision: 3