F106R6A030SB VINCOTECH | Alldatasheet

Document overview

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Technical content

  • Inverter, blocking diodes
  • Very compact housing, easy to route
  • IGBT3 technology
  • Power Regeneration
  • 10-F106R6A030SB-M434E08
  • 10-F106R6A030SB01-M434E18 Tj=25°C, unless otherwise specified Parameter Symbol Value Unit Repetitive peak reverse voltage VRRM 1600 V Maximum Junction Temperature Tjmax 150 °C Inverter Transistor tSC Tj≤150°C 6 μs VCC VGE=15V 360 V Th=80°C 55 ±20 50Th=80°C Th=80°C 95 700 W A V °C175 VCE IC VGE ICpulse Tjmax A 600 A V Tj=Tjmax Tj=Tjmax VCE ≤ 600V, Tj ≤ Top max tp limited by Tjmax Th=80°C Turn off safe operating area Collector-emitter break down voltage DC collector current Power dissipation per IGBT Maximum Junction Temperature Short circuit ratings Repetitive peak collector current Tj=Tjmax tp=10ms Tj=Tjmax Ptot A Features flow1 housing Target Applications Schematic DC forward current Surge forward current Tj=25°C 2450 Types I2t-value Maximum Ratings IFAV A2s IFSM Condition Blocking Diode A WPower dissipation per Diode I2t Ptot Gate-emitter peak voltage copyright by Vincotech 1 Revision: 3

Tj=25°C, unless otherwise specified Parameter Symbol Value Unit Maximum Ratings Condition Inverter Diode Thermal Properties Insulation Properties Vis t=2s DC voltage 4000 V min 12.7 mm min 12.7 mm CTI >200 Th=80°C Th=80°C 600 Tjmax IFRM Ptot V Repetitive peak forward current Power dissipation per Diode Maximum Junction Temperature Peak Repetitive Reverse Voltage W 175 °C Tj=Tjmax A IF VRRM Tj=25°C A Tj=Tjmax tp limited by Tjmax DC forward current Storage temperature Tstg -40…+125 °C -40…+(Tjmax - 25) Comparative tracking index Insulation voltage Creepage distance TopOperation temperature under switching condition Clearance copyright by Vincotech 2 Revision: 3

VGE [V] or VGS [V] Vr [V] or VCE [V] or VDS [V] IC [A] or IF [A] or ID [A] Tj Min Typ Max Tj=25°C 1.11 1.7 Tj=125°C 1.04 Tj=25°C 0.91 Tj=125°C 0.78 Tj=25°C 4 Tj=125°C 5 Tj=25°C 0.05 Tj=125°C 1.1 Thermal resistance chip to heatsink per chip RthJH 0.74 Thermal resistance chip to heatsink per chip RthJC 0.49 Tj=25°C 5 5.8 6.5 Tj=150°C Tj=25°C 1.1 1.61 2.1 Tj=150°C 1.77 Tj=25°C 0.2 Tj=150°C Tj=25°C 350 Tj=150°C Tj=25°C Tj=150°C 94 Tj=25°C Tj=150°C 18 Tj=25°C Tj=150°C 160 Tj=25°C Tj=150°C 87 Tj=25°C Tj=150°C 0.63 Tj=25°C Tj=150°C 0.80 Thermal resistance chip to heatsink per chip RthJH 1.72 Thermal resistance chip to case per chip RthJC 1.14 Tj=25°C 1.25 1.75 2.15 Tj=150°C 1.7 Tj=25°C Tj=150°C 34.29 Tj=25°C Tj=150°C 183.2 Tj=25°C Tj=150°C 2.16 di(rec)max Tj=25°C /dt Tj=150°C tbd. Tj=25°C Tj=150°C 0.45 Thermal resistance chip to heatsink per chip RthJH 2.07 T hermal resistance chip to case per chip RthJC 1.24 Thermal grease thickness≤50um λ = 1 W/mK none Tj=25°C 167 1630 V ±15 tr td(off) VCE=VGE Thermal grease thickness≤50um λ = 1 W/mK QGate Erec Coss Crss Qrr trr IGES tf Eon Eoff td(on) IRRM VF VGE(th) VCE(sat) ICES Rgint Input capacitance Output capacitance Turn-off energy loss per pulse Integrated Gate resistor Inverter Transistor Gate emitter threshold voltage ValueConditions Characteristic Values Forward voltage Threshold voltage (for power loss calc. only) Slope resistance (for power loss calc. only) V F Vto rt Blocking Diode K/W V V mΩ mAReverse current Ir μC mWs A/μs K/W f=1MHz Rgon=8 Ω Rgoff=8 Ω ±15 30 ±15 Turn-on energy loss per pulse Reverse recovered charge Inverter Diode Peak reverse recovery current Reverse transfer capacitance Diode forward voltage Gate charge Cies Reverse recovery time Reverse recovered energy Peak rate of fall of recovery current Collector-emitter cut-off current incl. Diode Fall time Turn-off delay time Turn-on delay time Rise time Gate-emitter leakage current Collector-emitter saturation voltage 600 0.00043 300 300 1600 Thermal grease thickness≤50um λ = 1 W/mK Rgon=8 Ω V ns A nC nA K/W V 108 mWs ns pF mA Ω Tj=25°C copyright by Vincotech 3 Revision: 3

VGE [V] or VGS [V] Vr [V] or VCE [V] or VDS [V] IC [A] or IF [A] or ID [A] Tj Min Typ Max ValueConditions Characteristic Values g Nm Weight G tbd. 44 . 2 N m Terminal connection torque M 6.7 7 7.4 Mounting torque M 3.8 5n H Chip module lead resistance, terminals -chip Rcc'1+EE' tbd. mΩ Module stray inductance LsCE Thermal resistance, case to heatsink RthCH tbd. K/W Module Properties BTj=25°CVincotech NTC Reference B-value Tol. ±3% 3950 K B(25/100) Tj=25°C 3996 K Tj=25°CB-value B(25/50) Tol. ±3% Ω22000 5-5 200 mW/K Power dissipation P mW Rated resistance R Power dissipation constant Deviation of R100 ΔR/R R100=1996 Ω Thermistor Tj=25°C Tc=100°C Tc=100°C Tj=25°C copyright by Vincotech 4 Revision: 3

Version Ordering Code in DataMatrix as in packaging barcode as 12mm housing 10-F106R6A030SB-M434E08 M434-E08 M434-E08 12mm housing, without thermistor 10-F106R6A030SB01-M434E18 M434-E18 M434-E18 Outline Pinout Ordering Code & Marking Ordering Code and Marking - Outline - Pinout copyright by Vincotech 5 Revision: 3

PRODUCT STATUS DEFINITIONS Formative or In Design First Production Full Production DISCLAIMER LIFE SUPPORT POLICY As used herein: The information given in this datasheet describes the type of component and does not represent assured characteristics. For tested values please contact Vincotech.Vincotech reserves the right to make changes without further notice to any products herein to improve reliability, function or design. Vincotech does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. Vincotech products are not authorised for use as critical components in life support devices or systems without the express written approval of Vincotech. 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in labelling can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Target Product StatusDatasheet Status Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. The data contained is exclusively intended for technically trained staff. Preliminary This datasheet contains preliminary data, and supplementary data may be published at a later date. Vincotech reserves the right to make changes at any time without notice in order to improve design. The data contained is exclusively intended for technically trained staff. Final This datasheet contains final specifications. Vincotech reserves the right to make changes at any time without notice in order to improve design. The data contained is exclusively intended for technically trained staff. copyright by Vincotech 6 Revision: 3