ETRX3585HR-LRS

Silicon Laboratories

ETRX3585-LRS ZIGBEE® MODULES

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Telegesis™ TG-PM-0520-ETRX3585-LRS r3 ETRX3585-LRS and ETRX3585HR-LRS Product Manual Telegesis™ is a trademark of Silicon Laboratories Inc. ©20 22 Sil icon Labs ETRX3585-LRS Product Manual ETRX3585 -LRS ZIGBEE ® MODULE S PRODUCT MANUAL

ETRX3585-LRS and ETRX3585HR-LRS ©2022 Silicon Labs - 4 - ETRX3585-LRS Product Manual The Telegesis ETRX3585 -LRS and ETRX3585HR -LRS modules are low power 2.4GHz ZigBee modules with an added frontend module (SiGe SE2432L) containing both PA and LNA for highest possible link budget. Based on th e latest Ember EM3585 family of single chip ZigBee solutions the new long- range modules are footprint compatible with the entire Telegesis ETRX3 family , thus representing a drop-in replacement for all applications where a high link budget is required. For custom application development the ETRX3585 series integrates with ease into Ember’s InSight development environment. Image not shown actual size; enlarged to show detail. Module Features

Small form factor, SMT module 25mm x 19mm
Same footprint and pin-out as ETRX357-LRS
Side Castellations for easy soldering and inspection
Two antenna options: Integrated chip antenna or U.FL coaxial connector
Based on 32-bit ARM® Cortex-M3
Industry standard JTAG Programming and real time network level debugging via the Ember Debug Port
Up to 512kB of flash and 64kbytes of RAM
Lowest Deep Sleep Current of sub 1µA wi th retained RAM and GPIO and multiple sleep modes
Ultra Wide supply voltage range (2.1 to 3.6V)
Optional 32.768kHz watch crystal can be added externally
Can act as an End Device, Router or Coordinator
22 general-purpose I/O lines including analogue inputs
Firmware upgrades via serial port or over the air (password protected)
Hardware supported encryption (AES-128)
CE and FCC and IC compliance, IC and FCC modular approval
Operating temperature range: -40 °C to +85°C
Standard version without LNA and PA avail able in the same form factor Radio Features
Based on the Silicon Labs EM3585 family of single chip ZigBee® SoCs
2.4GHz ISM Band
250kbit/s over the air data rate – NB: actual usable data throughput with ZigBee is about 20kbps
15 channels (IEEE802.15.4 Channel 11 to 25)
SiGe SE2432L integrated PA and LNA
+20dBm output power (adjustable down to -41dBm)
High sensitivity of -106dBm typ. @ 1% packet error rate
RX Current: 33mA, TX C urrent: approx 140mA at 20dBm Suggested Applications
ZigBee Smart Energy applications
Wireless Alarms and Security
Home/Building Automation
Wireless Sensor Networks
M2M Industrial Controls
Lighting and ventilation control
Remote monitoring
Environmental monitoring and control Development Kit
Enhancement kit available to upgrade existing Telegesis and Ember development kits to be used with the new ETRX3585 family
Custom software development available upon request.

ETRX3585-LRS and ETRX3585HR-LRS ©20 22 Silicon Labs - 5 - ETRX3585-LRS Product Manual

1 Introduction

This document describes the Telegesis ETRX3585-LR S and ETRX3585HR-LR S ZigBee long range modules which have been designed to be easily integrated into another device and to provide a fast, simple and low-cost wireless mesh networking interface. The Telegesis ETRX3 series modules are based on the Silicon Labs ZigBee compliant platform consisting of the single chip family of EM3585 SoCs com bined with the ZigBee PRO compliant EmberZNet meshing stack. The ETRX3585-LRS and ETRX3585HR-LRS modules represent an ideal platform for custom firmware development in conjunction with the Silicon Labs ZigBee development kits. No RF experience or expertise is required to add this powerful wireless networking capability to your products. The ETRX35 85-LRS and ETRX3585HR-LR S offer fast integration opportunities and the shortest possible time to market for your product.

1.1 Hardware Description

The main building b locks of the ETRX3585-LR S and ETRX3585HR- LRS are the single chip EM3585 SoC from Silicon Labs , a SiGe SE2432L frontend module combining a Power Amplifier with a Low Noise Amplifier, a 24MHz reference crystal and RF front-end circuitry optimized for best RF performance. The modules are available with on-board antenna or alternatively a U.FL connector for attaching external antennae. Modules with the U.FL connector are identified by the “HR” suffix. The integrated antenna is an Antenova Rufa, and details of the radiation pattern and further data are available from the Antenova website [5]. Module Chip Flash RAM Antenna USB ETRX3585-LRS EM3585 512kB 32kB Chip No ETRX3585HR-LRS EM3585 512kB 32kB External No Table 1: Memories The LNA and RF power amplifier of the LRS devices improve the output power by 12dB and the sensitivity by 5dB which will increase the range by approximately 700% relative to the standard devices (where local regulations permit the use of the maximum output power). The ETRX3585-LRS and ETRX3585HR-LRS are used for ZigBee (www.zigbee.org) applications. In case it is desired to develop custom firmware, the Silicon Labs toolchain, consisting of Ember Desktop together with a comprehensive integrated development environment (IDE), is required.

2 Product Approvals

2.1 FCC Approvals

approval as detailed in the FCC public notice DA00.1407.transmitter. for OEM products to alert users on FCC RF exposure compliance.

1 BT-Stubby

2 BT-Stubby

4 Rufa (on

Table 2. Approved Antennae for the end product depending upon local territorial regulations. users from replacing them with non-approved ones.

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2.1.1 FCC Labelling Requirements

When integrating the ETRX3585-LRS or ETRX35 85HR-LRS families into a product it must be ensured that the FCC labelling requirements are met. This includes a clearly visible label on the outside of the finished product specifying the Telegesis FCC identifier ( FCC ID: S4GEM358L) as well as the notice above. This exterior label can use wording such as “Contains Transmitter Module FCC ID: S4GEM358L” or “Contains FCC ID: S4GEM358L” although any similar wording that expresses the same meaning may be used.

2.2 IC (Industry Canada) Approvals

The Telegesis ETRX3585-LRS family with integrated Antenna as well as the ETRX3585HR-LRS family have been approved by Industry Canada to operate with the antenna types listed in Table 2 with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. IC-ID: 8735A-EM358L

This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication.
To comply with Industry Canada RF radiation exposure limits for general population, the antenna(s) used for this transmitter must be installed such that a minimum separation distance of 20cm is maintained between the radiator (antenna) and all persons at all times
This device has been designed to operate with the antennas listed in Table 2, and having a maximum gain of 2.1 dBi. Antennas not included in this list or having a gain greater than 2.1 dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms. French Statements
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

ETRX3585-LRS and ETRX3585HR-LRS ©20 22 Silicon Labs - 8 - ETRX3585-LRS Product Manual OEM Responsibilities The ETRX3585-LRS and ETRX3585-LRS families of module have been certified for integration into products only by OEM integrators under the following conditions: 1. The antenna(s) must be installed such that a minimum separation distance of 0.75cm is maintained between the radiator (antenna) and all persons at all times. 2. The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter. As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-pro duct for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). IMPORTANT NOTE: In the event that these conditions cannot be met (for certain configurations or co-location with another transmitter), then Industry Canada certification is no longer considered valid and the IC Certification Number cannot be used on the final pr oduct. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Industry Canada authorization.

2.2.1 IC Labelling Requirements

The ETRX3585-LRS and ETRX3585 HR-LRS fam ily modules are labelled with its own IC Certification Number. If the IC Certification Number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labelled in a visible area with the following: “Contains Transmitter Module IC: 8735A-EM358L” or “Contains IC: 8735A-EM358L” The OEM of the ETRX3585-LRS and ETRX35 85HR-LRS f amily modules must only use the approved antenna(s) listed above, which have been certified with this module. The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user’s manual of the end product.

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2.3 CE (EU) and UKCA (UK) Compliance

The ETRX35 85-LRS and ETRX3585HR-LRS modules conf orm with the essential requirements and other relevant requirements of the EU’s Radio Equipment Directive (RED) (2014/53/EU) and the UK's Radio Equipment Regulations (RER) (S.I. 2017/1206) . Compliance i s demonstrated by verification against the applicable standards, including the following:

Radio: EN 300 328 v2.2.2
EMC: EN 301 489-1 v2.1.1, EN 301 489-17 v3.1.1
Safety: EN62368-1:2020+A11:2020 All tests have been conducted with the antennae listed in Table 2. When a module is incorporated into an OEM product, the OEM product manufacturer must ens ure compliance of the final product to the European harmoni zed EMC and low voltage/safety standards. Additionally, the specific product assembl y may have an impact on the RF radiated characteristics, and manufacturers should also carefully consider RF radiated testing of their end- products to confirm the compliance. The final product should not deviate from the max power ratings, antenna specific ations, and installation requirements as specified in this us er manual ; otherwise, compliance re-testing against all the applicable standards becomes necessary, and a Notified Body evaluation strongly recommended. The modules are entitled to carry the CE and UKCA compliance marks, and the formal Declarations of Conformity (DoC) are available at the product web page, which is reachable starting from www.silabs.com. OEM product manufacturers must also consider applying the compliance marks to a visible location on their products. Customers assume full responsibility for learning and meeting the required guidelines for each country in their distribution market. 2.4 IEEE 802.15.4 IEEE 802.15.4 is a standard for low data rate, wi reless networks (raw bit-rate within a radio packet of 25 0kbps @2.4GHz) which focuses on low cost, low duty cycle, long primary battery life applications as well as mains-powered applications. It is the basis for the open ZigBee Protocol.

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2.5 The ZigBee Protocol

The ZigBee Protocol is a set of standards for wireless connectivity for use between any devices over short to medium distances. The specification was originally ratified in December 2004, paving the way for companies to start making low-power networks a reality. ZigBee uses an IEEE 802.15.4 radio specification running on the 2.4GHz band, plus three additional layers for networking, security and applications. What makes the specification unique is its use of a mesh network architecture which, in bucket chain style, passes data from one node to the next until it lands at its destination. The network is self -healing and adapts its routing as link quality changes or nodes move. Furthermore, nodes can be defined as End Devices which do not act as routers but can therefore be put into a low-power sleep state. The enhanced version of the ZigBee standard (or ZigBee 20 06) was released in December 2006, adding new features and improvements to the only global wireless communication standard enabling the developm ent of easily deployable low -cost, low-power, monitoring and control products for homes, commercial buildings and industrial plant monitoring. In 2007 the ZigBee Alliance introduced the PRO feature-set which offers advantages over earlier feature-sets , including

Truly self-healing mesh networking
Messages can now travel up to 30 hops
Source-Routing for improved point to multipoint message transmission
Improved security including Trust-Centre link keys
New message types and options

3 Module Pinout

Figure 1. ETRX3 series Module Pinout (top view)

1 GND GND GND

3 PC6 I/O 13 OSC32B, nTX_ACTIVE

4 PC7 I/O 14 OSC32A, OSC32_EXT

5 PA7 {4} I/O 18 TIM1C4

6 PB3 {2} I/O CTS 19 SC1nCTS, SC1SCLK, TIM2C3

8 PB4 {2} I/O RTS 20 TIM2C4, SC1nRTS, SC1nSSEL

9 PA0 I/O 21 TIM2C1, SC2MOSI

10 PA1 I/O 22 TIM2C3, SC2SDA, SC2MISO

11 PA2 I/O 24 TIM2C4, SC2SCL, SC2SCLK

12 PA3 I/O 25 SC2nSSEL, TIM2C2

13 GND GND GND

14 PA4 I/O 26 ADC4, PTI_EN, TRACEDATA2

15 PA5 {3} I/O 27 ADC5, PTI_DATA, nBOOTMODE, TRACEDATA3

16 PA6 {4} I/O 29 TIM1C3

17 PB1 TXD 30 SC1MISO, SC1MOSI, SC1SDA, SC1TXD,

18 PB2 RXD 31 SC1MISO, SC1MOSI, SC1SCL, SC1RXD,

19 GND GND GND

20 GND GND GND

21 JTCK JTCK 32 SWCLK

22 PC2 I/O 33 JTDO, SWO,TRACEDATA0

23 PC3 I/O 34 JTDI,TRACECLK

24 PC4 I/O 35 JTMS, SWDIO

25 N/C{1} N/C 36 PB0 of the EM3585 is used to control the FEM

26 PC1 I/O ADC3 38 ADC3, TRACEDATA3

27 PC0 {4} I/O 40 JRST, IRQD, TRACEDATA1

28 PB7 {4} I/O ADC2 41 ADC2, IRQC, TIM1C2

29 PB6 {4} I/O ADC1 42 ADC1, IRQB, TIM1C1

30 PB5 I/O ADC0 43 ADC0, TIM2CLK, TIM1MSK

31 GND GND GND

32 Vcc Vcc Vcc

33 GND GND GND

Table 3. Pin Information {2} The serial UART connections TXD, RX D, CTS and RTS are PB1, PB2, PB3 and PB4 respectively . The device sends its data on TXD and receives on RXD. is low. This signal has a 30kΩ Pull-Up. Pad2, but it is configured as TX_ACTIVE signal and cannot be used as a general purpose GPIO. See also the table “Module pads and functions” in the ETRX357 Development Kit Product Manual. Refer to the Silicon Labs EM358x manual for details of the alternate functions and pin names.

4 Hardware Description

Figure 2. Hardware Diagram the strict timing requirements imposed by the ZigBee and IEEE802.15.4 standards. connected externally to pads 3 and 4 in case more accurate timing is required.

4.1 Hardware Interface

used as general purpose I/Os or assigned to a peripheral function like ADC is set by the firmware. When developing custom firmware please refer to the EM3585 datasheet [2].

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5 Firmware Description

By default, the m odules will be pre-loaded with a standalone bootloader which supports over -the- air bootloading as well as serial bootloading of new firmware. To enter the standalone bootloader using a hardware trigger pull PA5 to ground and power -cycle or reset the module. To avoid entering the standalone bootloader unintentionally make sure not to pull this pin down during boot-up unless the resistance to ground is >10k Ω. (A pull -up is not required). Each module comes with a unique 64-bit 802.15.4 identifier which is stored in non-volatile memory. A router is typically a mains -powered device whilst a sleepy end device (SED) can be battery powered. The module is also able to act as a coordinator and Trust Centre through external host control.

5.1 Token Settings

settings shown in the table below. Table 4. Manufacturing tokens

5.2 Custom Firmware

order to develop custom firmware, the Silicon Labs Ember toolchain is required.

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6 Absolute Maximum Ratings

No. Item Symbol Absolute Maximum Ratings Unit 1 Supply voltage VCC -0.3 to +3.6 Vdc 2 Voltage on any Pad Vin -0.3 to VCC +0.3 Vdc Voltage on any Pad pin (PA4, PA5, PB5, PB6, PB7, PC1), when used as an input to the general purpose ADC with the low voltage range selected Vin -0.3 to +2.0 Vdc

4 Module storage temperature range Tstg -40 to +105 °C

5 Reel storage temperature range Tstrgreel 0 to 75 °C

6 Operating temperature range Top -40 to +85 °C

7 Input RF level Pmax +6 dBm

8 Reflow temperature TDeath Please refer to chapter 12 °C

Table 5: Absolute Maximum Ratings The absolute maximum ratings given above should under no circumstances be violated. Exceeding one or more of the limiting values may cause permanent damage to the device. Caution! ESD sensitive device. Precautions should be used when handling the device in order to prevent permanent damage.

6.1 Environmental Characteristics

No. Item Symbol Absolute Maximum Ratings Unit ESD on any pad according to Human Body Model (HBM) circuit

description

VTHHBM ±2 kV ESD on non-RF pads according to Charged Device Model (CDM) circuit VTHCDM ±400 V

3 ESD on RF terminal (HBM) VTHCDM 1000 V

4 Moisture Sensitivity Level MSL MSL3, per J-STD-033

Table 6: Absolute Maximum Ratings

6.2 Recommended Operating Conditions

No. Item Condition / Remark Symbol Value Unit Min Typ Max 1 Supply voltage VCC 2.1 3.0 3.6 Vdc

2 RF Input Frequency fC 2405 2480 MHz

3 RF Input Power pIN 0 dBm

4 Operating temperature

range Top -40 +85 °C Table 7. Recommended Operating Conditions

ETRX3585-LRS and ETRX3585HR-LRS ©20 22 Silicon Labs - 17 - ETRX3585-LRS Product Manual VCC = 3.0V, TAMB = 25°C, NORMAL MODE (non-Boost) unless otherwise stated No. Item Condition / Remark Symbol Value Unit Min Typ Max 1 Module supply voltage VCC 2.1 3.6 Vdc Deep Sleep Current Quiescent current, internal RC oscillator disabled, 4kB RAM retained ISLEEP 1.0 µA Quiescent current, internal RC oscillator enabled 4kB RAM retained ISLEEP 1.25 µA Quiescent current, including 32.768kHz oscillator 4kB RAM retained ISLEEP 1.6 µA Quiescent current including internal RC oscillator and 32.768kHz oscillator 4kB RAM retained ISLEEP 1.9 µA Additional current per 4kB block of RAM retained IRAMSLEEP 0,067 µA Reset Current

7 Quiescent current

nReset asserted IRESET 2 3 mA Processor and Peripheral Currents

8 ARM® CortexTM M3,

25°C, 12MHz Core clock IMCU 7.5 mA

9 ARM® CortexTM M3,

25°C, 24MHz Core clock IMCU 8.5 mA ARM® CortexTM M3, RAM and flash memory sleep current 25°C, 12MHz Core clock IMCU 4.0 mA ARM® CortexTM M3, RAM and flash memory sleep current 25°C, 6MHz Core clock IMCU 2.5 mA

12 Serial controller current

controller at max. clock rate ISC 0.2 mA

13 General purpose timer

Per timer at max. clock rate ITIM 0.25 mA

14 General purpose ADC

Max. Sample rate, DMA IADC 1.1 mA

15 USB Active Current IUSB 1 mA

16 USB Suspend Mode

Current IUSBSUSP 2.5 mA RX Current

17 LNA,Radio receiver MAC

ARM® CortexTM M3 sleeping. IRX 26.5 mA

18 Receive current

Total, 12MHz clock speed IRX 30 mA

19 Receive current

Total, 24MHz clock speed IRX 31.5 mA

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20 Transmit current

21 Transmit Current

Sleep Modes & Peripheral Current

22 MCU, RAM and flash,

FEM, radio off 12MHz clock speed IMCU 7 mA

23 MCU, RAM and flash,

FEM, radio off 24MHz clock speed IMCU 8 mA 24 Serial Controller Max data rate ISC 0.2 mA 25 Timer Max clock rate ITMR 0.25 mA 26 ADC Max sample rate IADC 1.1 mA Table 8: DC Electrical Characteristics

8 Digital I/O Specifications

The digital I/Os of the ETRX3585-LRS module have the ratings shown below.

1 Low Schmitt switching

2 High Schmitt switching

5 Input Pull-up resistor

6 Input Pull-down resistor

7 Output voltage for logic 0

8 Output voltage for logic 1

9 Output Source Current Standard current

10 Output Sink current Standard current

11 Output Source Current High current pad (1) IOHH 8 mA

12 Output Sink current High current pad (1) IOLH 8 mA

13 Total output current IOH + IOL 40 mA

Table 9. Digital I/O Specifications

6 Input Pull-up resistor

Table 10. nReset Pin Specifications

9 A/D Converter Characteristics

1 A/D resolution Up to 14 bits

3 A/D sample time for 14-bit conversion 682µs

Table 11. A/D Converter Characteristics

1 Frequency range 2400 2500 MHz

2 Sensitivity for 1% Packet Error Rate (PER) -107 -106 -100 dBm

4 Saturation (maximum input level for correct operation) -3 2 dBm

5 High-Side Adjacent Channel Rejection

6 Low-Side Adjacent Channel Rejection

9 Channel Rejection for all other channels

11 Co-channel rejection

12 Relative frequency error

13 Relative timing error

14 Linear RSSI range 35 dB

16 Output power at lowest power setting -40 dBm

18 Carrier frequency error -40 {1} 40 {1} ppm

Table 12. AC Electrical Characteristics {1} Applies across the full ranges of rated temperature and supply voltage.

22 Frequency range 2400 2500 MHz

24 Lock time from off state, with correct VCO DAC settings 100 µs

25 Relock time, channel change or Rx/Tx turnaround 100 µs

26 Phase noise at 100kHz offset -71dBc/Hz

27 Phase noise at 1MHz offset -91dBc/Hz

28 Phase noise at 4MHz offset -103dBc/Hz

29 Phase noise at 10MHz offset -111dBc/Hz

Table 13. Synthesiser Characteristics Table 14. Power On Reset Specifications

33 Reset Pulse width to guarantee a reset 26 µs

34 Reset Pulse width guaranteed not to cause reset 0 1 µs

Table 15. nReset Specifications

10.1 TX Power Characteristics

EM3585-LRS power setting in NORMAL MODE at 3.6V and room temperature. Figure 3. Output Power vs. Power Setting Figure 4. Module Current vs. Power Setting

10.2 Power Settings for Regulatory Compliance

Because of the high gain of the frontend module output power of up to 22dBm can be achieved When the antenna gain is included the output power of the EM3585 transceivers needs to be reduced for regulatory compliance. The following tables list the maximum permitted power setting for the antenna types listed in Table 2. Note that this is the power out of the EM3585 chip, and the power delivered to the antenna will be higher by the gain of the RF power amplifier. VCC = 3.3V, TAMB = 25°C, NORMAL MODE) Antenna Channels 11-24 Channel 25 Channel 26 1/2 Wave -17 -17 -17 1/4 Wave -17 -17 -17 On Board -17 -17 -17 Table 16: Maximum Power Settings for European Compliance Finally, Table 17 the maximum Power settings for FCC and IC compliance. Antenna Channels 11-24 Channel 25 Channel 26 1/2 Wave -8 -12 -43 1/4 Wave -8 -8 -26 On Board -7 -7 -26 Table 17: Maximum Power Settings for FCC, IC Compliance

10.3 Temperature Behaviour

degrees Celsius the absolute maximum rating is 85 degrees Celsius. Figure 5. Sensitivity vs. Temperature Figure 6. TX Power vs. Temperature

11 Physical Dimensions

Figure 7. ETRX3 Physical Dimensions Table 18. ETRX3 Physical Dimensions antenna used and also the housing of the finished product.

12 Recommended Reflow Profile

Figure 8. Recommended Reflow Profile Use of “No-Clean” solder paste is recommended to avoid the requirement for a cleaning process. module on the bottom / underside of your PCB and re-flow).

13 Product Label Drawing

Figure 9. Product Label according to regulatory body requirements. Table 19. ETRX3585-LRS Label Details

14 Recommended Footprint

underside of the ETRX3 series module. plane to minimize inductivity in the ground path. Figure 10. Recommended Footprint The land pattern dimensions above serve as a guideline. thickness of 120μm to 150μm. show examples of how to align the module on its host PCB.

copper plane directly under the ETRX3 series module. Figure 11. Typical pad dimensions

14.1 Recommended Placement

Figure 12. Typical Placement Figure 13. How to not place the Module

Figure 14. Adding a no copper / no component area

14.2 Example carrier board

used during testing by Telegesis. Figure 15. Reference Board board and to respect the recommended keep-out areas as described in section 11. suffice, but a degradation in radio performance could be the result.

15 Reliability Tests

The following measurements will be conducted after the module has been exposed to standard room temperature and humidity for 1 hour. No Item Limit Condition

1 Vibration test Electrical parameter should be

Freq.:40Hz, Amplitude:1.5mm 20min. / cycle,1hrs. each of X and Y axis

2 Shock test the same as the above Dropped onto hard wood from height of

3 Heat cycle test the same as the above -40°C for 30min. and +85°C for 30min.; each temperature 300 cycles 5 Low temp. test the same as the above -40°C, 300h 6 High temp. test the same as the above +85°C, 300h Table 20: Reliability Tests

16.1 Safety Precautions

These specifications are intended to preserve the quality assurance of products as individual components. Before use, check and evaluate their operation when mounted on your products. Abide by these specifications when using the products. These products may short -circuit. If electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a short circuit occurs, then provide the following failsafe functions as a minimum: (1) Ensure the safety of the whole s ystem by installing a protection circuit an d a protection device. (2) Ensure the safety of the whole system by installing a redundant circuit or another system to prevent a single fault causing an unsafe status.

16.2 Design Engineering Notes

(1) Heat is the major caus e of shortening the life of these products. Avoid assembly and use of the target equipment in conditions where the product’s temperature may exceed the maximum allowable. (2) Failure to do so may result in degrading of the product’s functions and damage to the product. (3) If pulses or other transient loads (a large load applied in a short time) are applied to the products, before use, check and evaluate their operation when assembled onto your products. (4) These products are not intended for other uses, other than under the special conditions shown below. B efore using these products under such special conditions, check their performance and reliability under the said special conditions carefully, to determine whether or not they can be used in such a manner.

ETRX3585-LRS and ETRX3585HR-LRS ©20 22 Silicon Labs - 34 - ETRX3585-LRS Product Manual (5) In liqui d, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid may splash. (6) In direct sunlight, outdoors, or in a dusty environment (7) In an environment where condensation occurs. (8) In an environment with a high concentration of harmful gas (e.g. salty air, HCl, Cl2, SO2, H2S, NH3, and NOx) (9) If an abnormal voltage is applied due to a problem occurring in other components or circuits, replace these products with new products because they may not be able to provide normal performance even i f their electronic characteristics and appe arances appear satisfactory. (10) Mechanical stress during assembly of the board and operation has to be avoided. (11) Pressing on parts of the metal cover or fastening objects to the metal cover is not permitted.

16.3 Storage Conditions

(1) The module must not be stressed mechanically during storage. (2) Do not store these products in the following conditions or the performance characteristics of the product, such as RF performance, may well be adversely affected: (3) Storage in salty air o r in an environment with a high concentrati on of corrosive gas, such as Cl2, H2S, NH3, SO2, or NOX (4) Storage (before assembly of the end product) of the modules for more than one year after the date of delivery at your company even if all the above condition s (1) to (3) have been met, should be avoided.

17 Packaging

17.1 Embossed Tape

(1) Dimension of the tape (2) Cover tape peel force Force direction Speed = 300mm/min. Cover tape peel force θ= 10deg (3) Empty pockets NB: Empty pockets in the component packed area will be less than two per reel and those empty pockets will not be consecutive.

17.2 Component Orientation

Top cover tape will not obstruct the carrier tape holes and will not extend beyond the edges of the carrier tape (top view) Component Orientation Part No. Direction

17.3 Reel Dimensions

(4) Quantity per reel: 600 pieces (5) Marking: Part No. / Quantity / Lot No. and manufac turer part# with bar -code will be on the reel

17.4 Packaging

(6) Each reel will be packed in a hermetically-sealed bag (7) Marking: Reel / Antistatic Packaging / Reel Box and outer Box will carry the following label Imprint Description MFG P/N: 99X902DL Internal use Lot: 00 Internal use P/N:ETRX3587-LRS Telegesis Module Order Code. Quantity:600 Quantity of modules inside the reel/carton Reel No: 000001 Six digit unique Reel number counting up from 000001 Date:120824 Date Code in the format YYMMDD, e.g. 120824 P/C: ETRX3587-LRS- R308 Module product code with reference to firmware/module type selected during ATE. If needed multiline. 2D-Barcode Information in the 32x32 Datamatrix 2D-Barcode are and identifier “!REEL” [5 characters], the reel number [6 characters], the Module Order code [max 18 characters ], the quantity [max 4 characters] , the date code in the format Year-Month-Day [6 characters] and the product code [max 40 characters] , all separated by a semicolon.

ETRX3585-LRS and ETRX3585HR-LRS ©20 22 Silicon Labs - 38 - ETRX3585-LRS Product Manual Ordering/Product Code1, 2 Description ETRX3585-LRS Power amplified Telegesis Wireless Mesh Networking Module with Silicon Labs ZigBee Technology:

Based on Silicon Labs EM3585 SoC
Integrated 2.4GHz Antenna ETRX3585HR-LRS3 Power amplified Telegesis Wireless Mesh Network ing Module with Silicon Labs ZigBee Technology:
Based on Silicon Labs EM3585 SoC
U.FL coaxial Antenna Connector ETRX357DVK3 Telegesis Development Kit with:
3 x ETRX3DVK Development Boards
3 x USB cables
2 x ETRX357 on carrier boards
2 x ETRX357HR on carrier boards
2 x ETRX357-LRS on carrier boards
2 x ETRX357HR-LRS on carrier boards
1 x ETRX3USB USB stick
2 x ½-wave antennae
2 x ¼-wave antennae ETRX3587 Expansion Pack3
2 x ETRX3587 on carrier boards
2 x ETRX3587HR on carrier boards
2 x ETRX3587-LRS on carrier boards
2 x ETRX3587HR-LRS on carrier boards Notes: 1. Customers’ PO’s must state the Ordering/Product Code. 2. There is no “blank” version of the ETRX3585 modules available. 3. This part is End of Life (EOL) and is no longer available.

19 RoHS Declaration

Declaration of environmental compatibility for supplied products: Hereby we declare based on the declaration of our suppliers that this product does not contain any of the substances which are banned by Directive 2011/ 65/EU (RoHS2) or if they do, contain a maximum concentration of 0,1% by weight in homogeneous materials for:

Lead and lead compounds
Mercury and mercury compounds
Chromium (VI)
PBB (polybrominated biphenyl) category
PBDE (polybrominated biphenyl ether) category And a maximum concentration of 0.01% by weight in homogeneous materials for:
Cadmium and cadmium compounds

20 Data Sheet Status

Silicon Labs reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Please consult the most recently issued data sheet before initiating or completing a design.

21 Related Documents

[1] IEEE Standard 802.15.4 –2003 Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR- WPANs) [2] Datasheet EM35x, Ember. (www.silabs.com) [3] Datasheet U.FL-Series 2004.2 Hirose Ultra Small Surface Mount Coaxial Connectors - Low Profile 1.9mm or 2.4mm Mated Height [4] The ZigBee specification (www.zigbee.org) [5] Specification for Antenova Rufa Antenna (www.antenova.com) [6] Embedded Antenna design Ltd. (EAD Ltd.) (www.ead-ltd.com)

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Austin, TX 78701 USA www.silabs.com Disclaimer Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software imple - menters using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and “Typical” parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the performance of the product. Silicon Labs shall have no liability for the consequences of use of the infor - mation supplied in this document. This document does not imply or expressly grant any license to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA premarket approval is required or Life Support Systems without the specific written consent of Silicon Labs. A “Life Support System” is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Silicon Labs disclaims all express and implied warranties and shall not be responsible or liable for any injuries or damages related to use of a Silicon Labs product in such unauthorized applications. Note: This content may contain offensive terminology that is now obsolete. Silicon Labs is replacing these terms with inclusive language wherever possible. For more information, visit www.silabs.com/about-us/inclusive-lexicon-project Trademark Information Silicon Laboratories Inc. ®, Silicon Laboratories ®, Silicon Labs ®, SiLabs ® and the Silicon Labs logo ®, Bluegiga ®, Bluegiga Logo ®, EFM®, EFM32®, EFR, Ember®, Energy Micro, Energy Micro logo and combinations thereof, “the world’s most energy friendly microcontrollers”, Redpine Signals ®, WiSeConnect , n-Link, ThreadArch ®, EZLink®, EZRadio®, EZRadioPRO ®, Gecko®, Gecko OS, Gecko OS Studio, Precision32 ®, Simplicity Studio ®, Telegesis, the Telegesis Logo ®, USBXpress ® , Zentri, the Zentri logo and Zentri DMS, Z-Wave ®, and others are trademarks or registered trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. Wi-Fi is a registered trademark of the Wi-Fi Alliance. All other products or brand names mentioned herein are trademarks of their respective holders.

Product Information

ETRX3585HR-LRS specifications and overview.

Summary

ETRX3585-LRS ZIGBEE® MODULES

Description

ETRX3585-LRS ZIGBEE® MODULES

Source title ETRX3585HR-LRS Datasheet(PDF) - Silicon Laboratories

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