ESP32-S3-MINI-1U-N8

ESP32-S3-MINI-1 ESPRESSIF | Alldatasheet

Document overview

• Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
• PDF pages: 52

Technical content

Datasheet sections

• 1 Module Overview
• 1.1 Features
• 1.2 Series Comparison
• 1.3 Applications
• 2 Block Diagram
• 3 Pin Definitions
• 3.1 Pin Layout
• 3.2 Pin Description
• 4 Boot Configurations
• 4.1 Chip Boot Mode Control
• 4.2 VDD_SPI Voltage Control
• 4.3 ROM Messages Printing Control
• 4.4 JTAG Signal Source Control
• 5 Peripherals
• 5.1 Peripheral Overview
• 5.2 Peripheral Description
• 5.2.1 Connectivity Interface
• 5.2.1.1 UART Controller
• 5.2.1.2 I2C Interface
• 5.2.1.3 I2S Interface
• 5.2.1.4 LCD and Camera Controller
• 5.2.1.5 Serial Peripheral Interface (SPI)
• 5.2.1.6 Two-Wire Automotive Interface (TWAI®)
• 5.2.1.8 USB Serial/JTAG Controller
• 5.2.1.9 SD/MMC Host Controller
• 5.2.1.10 LED PWM Controller
• 5.2.1.11 Motor Control PWM (MCPWM)
• 5.2.1.12 Remote Control Peripheral (RMT)
• 5.2.1.13 Pulse Count Controller (PCNT)
• 5.2.2 Analog Signal Processing
• 5.2.2.1 SAR ADC
• 5.2.2.2 Temperature Sensor
• 5.2.2.3 Touch Sensor
• 6 Electrical Characteristics
• 6.1 Absolute Maximum Ratings
• 6.2 Recommended Operating Conditions

Datasheet sections

• 6.4 Current Consumption Characteristics
• 6.4.1 Current Consumption in Active Mode
• 6.4.2 Current Consumption in Other Modes
• 7 RF Characteristics
• 7.1 Wi-Fi Radio
• 7.1.1 Wi-Fi RF Transmitter (TX) Characteristics
• 7.1.2 Wi-Fi RF Receiver (RX) Characteristics
• 7.2 Bluetooth LE Radio
• 7.2.1 Bluetooth LE RF Transmitter (TX) Characteristics
• 7.2.2 Bluetooth LE RF Receiver (RX) Characteristics
• 8 Module Schematics
• 9 Peripheral Schematics
• 10 Physical Dimensions
• 10.1 Module Dimensions
• 10.2 Dimensions of External Antenna Connector
• 11 PCB Layout Recommendations
• 11.1 PCB Land Pattern
• 11.2 Module Placement for PCB Design
• 12 Product Handling
• 12.1 Storage Conditions
• 12.2 Electrostatic Discharge (ESD)
• 12.3 Reflow Profile
• 12.4 Ultrasonic Vibration

Datasheet Version 1.3 Small-sized module supporting 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 Built around ESP32-S3 series of SoCs, Xtensa® dual-core 32-bit LX7 microprocessor Flash up to 8 MB, optional 2 MB PSRAM in chip package

39 GPIOs, rich set of peripherals

On-board PCB antenna or external antenna connector ESP32-S3-MINI-1 ESP32-S3-MINI-1U www.espressif.com

1 Module Overview

Note: Check the link or the QR code to make sure that you use the latest version of this document: https://www.espressif.com/documentation/esp32-s3-mini-1_mini-1u_datasheet_en.pdf

1.1 Features

• ESP32-S3 embedded, Xtensa® dual-core 32-bit LX7 microprocessor (with single precision FPU), up to 240 MHz
• 384 KB ROM
• 512 KB SRAM
• 16 KB SRAM in RTC
• Up to 8 MB Quad SPI flash
• 2 MB PSRAM (ESP32-S3FH4R2 only) Wi-Fi
• 802.11b/g/n
• Bit rate: 802.11n up to 150 Mbps
• A-MPDU and A-MSDU aggregation
• 0.4µs guard interval support
• Center frequency range of operating channel: 2412~ 2484 MHz Bluetooth
• Bluetooth LE: Bluetooth 5, Bluetooth mesh
• Speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps
• Advertising extensions
• Multiple advertisement sets
• Channel selection algorithm #2
• Internal co-existence mechanism between Wi-Fi and Bluetooth to share the same antenna Peripherals
• 39 GPIOs – 4 strapping GPIOs
• SPI, LCD interface, Camera interface, UART, I2C, I2S, remote control, pulse counter, LED PWM, full-speed USB 2.0 OTG, USB Serial/JTAG controller, MCPWM, SDIO host controller, GDMA, TWAI® controller (compatible with ISO 11898-1, i.e. CAN Specification 2.0), ADC, touch sensor, temperature sensor, timers and watchdogs Integrated Components on Module
• 40 MHz crystal oscillator Antenna Options
• ESP32-S3-MINI-1: On-board PCB antenna
• ESP32-S3-MINI-1U: External antenna via a connector Operating Conditions
• Operating voltage/Power supply: 3.0~ 3.6 V
• Operating ambient temperature: –40~ 85 °C Certification
• RF certification: Seecertificates
• Green certification: RoHS/REACH Test
• HTOL/HTSL/uHAST/TCT/ESD Espressif Systems 2 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

1.2 Series Comparison

ESP32-S3-MINI-1 and ESP32-S3-MINI-1U are two powerful, generic Wi-Fi + Bluetooth LE MCU modules that feature a rich set of peripherals, yet an optimized size. They are an ideal choice for a wide variety of application scenarios related to Internet of Things (IoT), such as embedded systems, smart home, wearable electronics, etc. ESP32-S3-MINI-1 comes with a PCB antenna. ESP32-S3-MINI-1U comes with a connector for an external antenna. They feature an up to 8 MB SPI flash and an optional 2 MB SPI Pseudo static RAM (PSRAM). Both ESP32-S3-MINI-1 and ESP32-S3-MINI-1U come in two versions, with the ordering code ending with -N8 and -N4R2 respectively. The two versions only vary in flash and PSRAM size. The series comparison for the two modules is as follows: Table 1: ESP32-S3-MINI-1 and ESP32-S3-MINI-1U Series Comparison Ambient Temp.3 Size4 (°C) (mm) ESP32-S3-MINI-1-N8 8 MB (Quad SPI) - –40 ∼ 85 15.4 × 20.5 × 2.4ESP32-S3-MINI-1-N4R2 4 MB (Quad SPI) 2 MB (Quad SPI) ESP32-S3-MINI-1U-N8 8 MB (Quad SPI) - 15.4 × 15.4 × 2.4ESP32-S3-MINI-1U-N4R2 4 MB (Quad SPI) 2 MB (Quad SPI) 1 The modules use flash and PSRAM integrated in the chip’s package. The integrated flash supports: - More than 100,000 program/erase cycles - More than 20 years data retention time

2 By default, the SPI flash on the module operates at a maximum clock frequency of 80 MHz and does

not support the auto suspend feature. If you have a requirement for a higher flash clock frequency of 120 MHz or if you need the flash auto suspend feature, pleasecontactus.

3 Ambient temperature specifies the recommended temperature range of the environment immediately

outside the Espressif module. 4 For details, refer to Section10.1Module Dimensions. At the core of the modules is an ESP32-S3, an Xtensa® 32-bit LX7 CPU that operates at up to 240 MHz. You can power off the CPU and make use of the low-power co-processor to constantly monitor the peripherals for changes or crossing of thresholds. Note: For more information on ESP32-S3, please refer toESP32-S3 Series Datasheet. For chip revision identification, ESP-IDF release that supports a specific chip revision, and other information on chip revisions, please refer toESP32-S3 Series SoC Errata> SectionChip Revision Identification.

1.3 Applications

• Smart Home
• Industrial Automation
• Health Care
• Consumer Electronics
• Smart Agriculture
• POS Machines Espressif Systems 3 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

• Service Robot
• Audio Devices
• Generic Low-power IoT Sensor Hubs
• Generic Low-power IoT Data Loggers
• Cameras for Video Streaming
• USB Devices
• Speech Recognition
• Image Recognition
• Wi-Fi + Bluetooth Networking Card
• Touch and Proximity Sensing Espressif Systems 4 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

1 ESP32-S3-MINI-1 and ESP32-S3-MINI-1U Series Comparison 3

2 Pin Definitions 11

3 Default Configuration of Strapping Pins 13

4 Description of Timing Parameters for the Strapping Pins 14

5 Chip Boot Mode Control 14

6 VDD_SPI Voltage Control 15

7 JTAG Signal Source Control 16

8 Absolute Maximum Ratings 29

9 Recommended Operating Conditions 29

10 DC Characteristics (3.3 V, 25 °C) 29

11 Current Consumption in Avtice Mode 30

12 Current Consumption in Modem-sleep Mode 31

13 Current Consumption in Low-Power Modes 31

14 Wi-Fi RF Characteristics 33

15 TX Power with Spectral Mask and EVM Meeting 802.11 Standards 33

16 TX EVM Test1 33

17 RX Sensitivity 34

18 Maximum RX Level 35

19 RX Adjacent Channel Rejection 35

20 Bluetooth LE RF Characteristics 35

21 Bluetooth LE - Transmitter Characteristics - 1 Mbps 36

22 Bluetooth LE - Transmitter Characteristics - 2 Mbps 36

23 Bluetooth LE - Transmitter Characteristics - 125 Kbps 36

24 Bluetooth LE - Transmitter Characteristics - 500 Kbps 37

25 Bluetooth LE - Receiver Characteristics - 1 Mbps 37

26 Bluetooth LE - Receiver Characteristics - 2 Mbps 37

27 Bluetooth LE - Receiver Characteristics - 125 Kbps 38

28 Bluetooth LE - Receiver Characteristics - 500 Kbps 38

Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

1 ESP32-S3-MINI-1 Block Diagram 9

2 ESP32-S3-MINI-1U Block Diagram 9

3 Pin Layout (Top View) 10

4 Visualization of Timing Parameters for the Strapping Pins 14

5 ESP32-S3-MINI-1 Schematics 40

6 ESP32-S3-MINI-1U Schematics 41

7 Peripheral Schematics 42

8 ESP32-S3-MINI-1 Physical Dimensions 43

9 ESP32-S3-MINI-1U Physical Dimensions 43

10 Dimensions of External Antenna Connector 44

11 ESP32-S3-MINI-1 Recommended PCB Land Pattern 45

12 ESP32-S3-MINI-1U Recommended PCB Land Pattern 46

13 Reflow Profile 47

Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

2 Block Diagram

(QSPI) ESP32-S3FN8 ESP32-S3FH4R2 RF Matching

40 MHz

PSRAM(opt.) (QSPI) 3V3 EN FLASH (QSPI) ESP32-S2FH4 ESP32-S2FN4R2 PSRAM(opt.) (QSPI) 3V3 EN RF Matching Antenna Figure 1: ESP32-S3-MINI-1 Block Diagram FLASH (QSPI) ESP32-S2FH4 ESP32-S2FN4R2 RF Matching PSRAM(opt.) (QSPI) 3V3 EN FLASH (QSPI) ESP32-S3FN8 ESP32-S3FH4R2 PSRAM(opt.) (QSPI) 3V3 EN RF Matching Antenna Figure 2: ESP32-S3-MINI-1U Block Diagram Espressif Systems 9 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

3 Pin Definitions

3.1 Pin Layout

Thepindiagrambelowshowstheapproximatelocationofpinsonthemodule. Fortheactualdiagramdrawnto scale, please refer to Figure10.1Module Dimensions. Pin 1Pin 2Pin 3Pin 4Pin 5Pin 6Pin 7Pin 8Pin 9Pin 10Pin 11Pin 12Pin 13Pin 14Pin 15 GNDGND3V3IO0IO1IO2IO3IO4IO5IO6IO7IO8IO9IO10IO11Pin 63GNDIO12Pin 16Pin 17Pin 18Pin 19Pin 20Pin 21Pin 22Pin 23Pin 24Pin 25Pin 26Pin 27Pin 28Pin 29Pin 30Pin 64GNDPin 31 IO13IO14IO15IO16IO17IO18IO19IO20IO21IO26IO47IO33IO34IO48Pin 32Pin 33Pin 34Pin 35Pin 36Pin 37Pin 38Pin 39Pin 40Pin 41Pin 42Pin 43Pin 44Pin 45Pin 65GNDPin 62GND Pin 46Pin 47Pin 48Pin 49Pin 50Pin 51Pin 52Pin 53Pin 54Pin 55Pin 56Pin 57Pin 58Pin 59Pin 60Pin 61GNDGNDGNDGNDGNDGNDGNDGNDGNDIO35IO36IO37IO38IO39IO40IO41IO42TXD0RXD0IO45GNDGNDIO46ENGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDKeepout Zone Figure 3: Pin Layout (Top View) Note A: ThepindiagramisapplicabletoESP32-S3-MINI-1andESP32-S3-MINI-1U,butthelatterhasnoantennakeepoutzone. To learn more about the keepout zone for module’s antenna on the base board, please refer to ESP32-S3 Hardware Design Guidelines> SectionPositioning a Module on a Base Board.

3.2 Pin Description

The module has 65 pins. See pin definitions in Table2Pin Definitions. Espressif Systems 10 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

For explanations of pin names and function names, as well as configurations of peripheral pins, please refer to ESP32-S3 Series Datasheet. Table 2: Pin Definitions Name No. Typea Function GND 1, 2, 42, 43, 46-65 P GND 3V3 3 P Power supply IO0 4 I/O/T RTC_GPIO0,GPIO0 IO1 5 I/O/T RTC_GPIO1,GPIO1, TOUCH1, ADC1_CH0 IO2 6 I/O/T RTC_GPIO2,GPIO2, TOUCH2, ADC1_CH1 IO3 7 I/O/T RTC_GPIO3,GPIO3, TOUCH3, ADC1_CH2 IO4 8 I/O/T RTC_GPIO4,GPIO4, TOUCH4, ADC1_CH3 IO5 9 I/O/T RTC_GPIO5,GPIO5, TOUCH5, ADC1_CH4 IO6 10 I/O/T RTC_GPIO6,GPIO6, TOUCH6, ADC1_CH5 IO7 11 I/O/T RTC_GPIO7,GPIO7, TOUCH7, ADC1_CH6 IO8 12 I/O/T RTC_GPIO8,GPIO8, TOUCH8, ADC1_CH7, SUBSPICS1 IO9 13 I/O/T RTC_GPIO9,GPIO9, TOUCH9, ADC1_CH8, FSPIHD, SUBSPIHD IO10 14 I/O/T RTC_GPIO10,GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4, SUBSPICS0 IO11 15 I/O/T RTC_GPIO11,GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5, SUBSPID IO12 16 I/O/T RTC_GPIO12,GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6, SUBSPICLK IO13 17 I/O/T RTC_GPIO13,GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7, SUBSPIQ IO14 18 I/O/T RTC_GPIO14,GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS, SUBSPIWP IO15 19 I/O/T RTC_GPIO15,GPIO15, U0RTS, ADC2_CH4, XTAL_32K_P IO16 20 I/O/T RTC_GPIO16,GPIO16, U0CTS, ADC2_CH5, XTAL_32K_N IO17 21 I/O/T RTC_GPIO17,GPIO17, U1TXD, ADC2_CH6 IO18 22 I/O/T RTC_GPIO18,GPIO18, U1RXD, ADC2_CH7, CLK_OUT3 IO19 23 I/O/T RTC_GPIO19, GPIO19, U1RTS, ADC2_CH8, CLK_OUT2,USB_D- IO20 24 I/O/T RTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1,USB_D+ IO21 25 I/O/T RTC_GPIO21,GPIO21 IO26b 26 I/O/T SPICS1,GPIO26 IO47 27 I/O/T SPICLK_P_DIFF,GPIO47, SUBSPICLK_P_DIFF IO33 28 I/O/T SPIIO4,GPIO33, FSPIHD, SUBSPIHD IO34 29 I/O/T SPIIO5,GPIO34, FSPICS0, SUBSPICS0 IO48 30 I/O/T SPICLK_N_DIFF,GPIO48, SUBSPICLK_N_DIFF IO35 31 I/O/T SPIIO6,GPIO35, FSPID, SUBSPID IO36 32 I/O/T SPIIO7,GPIO36, FSPICLK, SUBSPICLK IO37 33 I/O/T SPIDQS,GPIO37, FSPIQ, SUBSPIQ IO38 34 I/O/T GPIO38, FSPIWP, SUBSPIWP IO39 35 I/O/T MTCK, GPIO39, CLK_OUT3, SUBSPICS1 IO40 36 I/O/T MTDO, GPIO40, CLK_OUT2 IO41 37 I/O/T MTDI, GPIO41, CLK_OUT1 Cont’d on next page Espressif Systems 11 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

Table 2 – cont’d from previous page Name No. Typea Function IO42 38 I/O/T MTMS, GPIO42 TXD0 39 I/O/T U0TXD, GPIO43, CLK_OUT1 RXD0 40 I/O/T U0RXD, GPIO44, CLK_OUT2 IO45 41 I/O/T GPIO45 IO46 44 I/O/T GPIO46 EN 45 I High: on, enables the chip. Low: off, the chip powers off. Note: Do not leave the EN pin floating. a P:powersupply;I:input;O:output;T:highimpedance. Pinfunctionsinboldfontarethedefaultpinfunctions. For pin 28∼ 29, 31∼ 33, the default function is decided by eFuse bit. b For modules with ordering codes ending with -N4R2, IO26 connects to the embedded PSRAM and is not available for other uses. Espressif Systems 12 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

4 Boot Configurations

Note: The content below is excerpted fromESP32-S3 Series Datasheet> SectionBoot Configurations. For the strapping pin mapping between the chip and modules, please refer to Chapter8Module Schematics. The chip allows for configuring the following boot parameters through strapping pins and eFuse bits at power-up or a hardware reset, without microcontroller interaction.

• Chip boot mode – Strapping pin: GPIO0 and GPIO46
• VDD_SPI voltage – Strapping pin: GPIO45 – eFuse parameter: EFUSE_VDD_SPI_FORCE and EFUSE_VDD_SPI_TIEH
• ROM message printing – Strapping pin: GPIO46 – eFuse parameter: EFUSE_UART_PRINT_CONTROL and EFUSE_DIS_USB_SERIAL_JTAG_ROM_PRINT
• JTAG signal source – Strapping pin: GPIO3 – eFuse parameter: EFUSE_DIS_PAD_JTAG, EFUSE_DIS_USB_JTAG, and EFUSE_STRAP_JTAG_SEL The default values of all the above eFuse parameters are 0, which means that they are not burnt. Given that eFuse is one-time programmable, once programmed to 1, it can never be reverted to 0. For how to program eFuse parameters, please refer toESP32-S3 Technical Reference Manual> ChaptereFuse Controller. The default values of the strapping pins, namely the logic levels, are determined by pins’ internal weak pull-up/pull-down resistors at reset if the pins are not connected to any circuit, or connected to an external high-impedance circuit. Table 3: Default Configuration of Strapping Pins Strapping Pin Default Configuration Bit Value GPIO0 Weak pull-up 1 GPIO3 Floating – GPIO45 Weak pull-down 0 GPIO46 Weak pull-down 0 To change the bit values, the strapping pins should be connected to external pull-down/pull-up resistances. If the ESP32-S3 is used as a device by a host MCU, the strapping pin voltage levels can also be controlled by the host MCU. All strapping pins have latches. At system reset, the latches sample the bit values of their respective strapping pins and store them until the chip is powered down or shut down. The states of latches cannot be changed in Espressif Systems 13 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

any other way. It makes the strapping pin values available during the entire chip operation, and the pins are freed up to be used as regular IO pins after reset. The timing of signals connected to the strapping pins should adhere to thesetup timeandhold time specifications in Table4and Figure4. Table 4: Description of Timing Parameters for the Strapping Pins Parameter Description Min (ms) tSU Setup timeisthetimereservedforthepowerrailstostabilizebe- fore the CHIP_PU pin is pulled high to activate the chip. 0 tH Hold timeis the time reserved for the chip to read the strapping pin values after CHIP_PU is already high and before these pins start operating as regular IO pins. Strapping pin VIL_nRST VIH tSU tH CHIP_PU Figure 4: Visualization of Timing Parameters for the Strapping Pins

4.1 Chip Boot Mode Control

GPIO0 and GPIO46 control the boot mode after the reset is released. See Table5Chip Boot Mode Control. Table 5: Chip Boot Mode Control Boot Mode GPIO0 GPIO46 SPI Boot 1 Any value Joint Download Boot2 0 0

1 Bold marks the default value and configura-

tion.

2 JointDownloadBootmodesupportsthefol-

lowing download methods:

• USB Download Boot: – USB-Serial-JTAG Download Boot – USB-OTG Download Boot
• UART Download Boot Espressif Systems 14 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

In SPI Boot mode, the ROM bootloader loads and executes the program from SPI flash to boot the system. In Joint Download Boot mode, users can download binary files into flash using UART0 or USB interface. It is also possible to download binary files into SRAM and execute it from SRAM. In addition to SPI Boot and Joint Download Boot modes, ESP32-S3 also supports SPI Download Boot mode. For details, please seeESP32-S3 Technical Reference Manual> ChapterChip Boot Control.

4.2 VDD_SPI Voltage Control

Depending on the value of EFUSE_VDD_SPI_FORCE, the voltage can be controlled in two ways. Table 6: VDD_SPI Voltage Control VDD_SPI power source2 Voltage EFUSE_VDD_SPI_FORCE GPIO45 EFUSE_VDD_SPI_ TIEH VDD3P3_RTC via RSPI 3.3 V 0 0 IgnoredFlash Voltage Regulator 1.8 V 1 Flash Voltage Regulator 1.8 V 1 Ignored 0 VDD3P3_RTC via RSPI 3.3 V 1 1 Bold marks the default value and configuration. 2 SeeESP32-S3 Series Datasheet> SectionPower Scheme.

4.3 ROM Messages Printing Control

During boot process the messages by the ROM code can be printed to:

• (Default) UART0 and USB Serial/JTAG controller
• USB Serial/JTAG controller
• UART0 TheROMmessagesprintingtoUARTorUSBSerial/JTAGcontrollercanberespectivelydisabledbyconfiguring registers and eFuse. For detailed information, please refer toESP32-S3 Technical Reference Manual> ChapterChip Boot Control.

4.4 JTAG Signal Source Control

ThestrappingpinGPIO3canbeusedtocontrolthesourceofJTAGsignalsduringtheearlybootprocess. This pin does not have any internal pull resistors and the strapping value must be controlled by the external circuit that cannot be in a high impedance state. As Table7shows, GPIO3 is used in combination with EFUSE_DIS_PAD_JTAG, EFUSE_DIS_USB_JTAG, and EFUSE_STRAP_JTAG_SEL. Espressif Systems 15 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

Table 7: JTAG Signal Source Control JTAG Signal Source EFUSE_DIS_PAD_JTAG EFUSE_DIS_USB_JTAG EFUSE_STRAP_JTAG_SEL GPIO3 USB Serial/JTAG Controller 0 0 0 Ignored 0 0 1 1 1 0 Ignored Ignored JTAG pins2 0 0 1 0 0 1 Ignored Ignored JTAG is disabled 1 1 Ignored Ignored 1 Bold marks the default value and configuration. 2 JTAG pins refer to MTDI, MTCK, MTMS, and MTDO. Espressif Systems 16 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

5 Peripherals

5.1 Peripheral Overview

ESP32-S3 integrates a rich set of peripherals including SPI, LCD, Camera interface, UART, I2C, I2S, remote control, pulse counter, LED PWM, USB Serial/JTAG, MCPWM, SD/MMC host controller, TWAI® controller (compatible with ISO 11898-1, i.e., CAN Specification 2.0), ADC, touch sensor, and temperature sensor. It also includes a full-speed USB 2.0 On-The-Go (OTG) interface to enable USB communication. To learn more about on-chip components, please refer toESP32-S3 Series Datasheet> SectionFunctional Description. Note: The content below is sourced fromESP32-S3 Series Datasheet> SectionPeripherals. Some information may not be applicable to ESP32-S3-MINI-1 and ESP32-S3-MINI-1U as not all the IO signals are exposed on the module. To learn more about peripheral signals, please refer toESP32-S3 Technical Reference Manual> SectionPeripheral Signals via GPIO Matrix.

5.2 Peripheral Description

This section describes the chip’s peripheral capabilities, covering connectivity interfaces and on-chip sensors that extend its functionality.

5.2.1 Connectivity Interface

This subsection describes the connectivity interfaces on the chip that enable communication and interaction with external devices and networks.

5.2.1.1 UART Controller

ESP32-S3 has three UART (Universal Asynchronous Receiver Transmitter) controllers, i.e., UART0, UART1, and UART2, which support IrDA and asynchronous communication (RS232 and RS485) at a speed of up to 5 Mbps. Feature List

• Three clock sources that can be divided
• Programmable baud rate
• 1024 x 8-bit RAM shared by TX FIFOs and RX FIFOs of the three UART controllers
• Full-duplex asynchronous communication
• Automatic baud rate detection of input signals
• Data bits ranging from 5 to 8
• Stop bits of 1, 1.5, 2, or 3 bits
• Parity bit Espressif Systems 17 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

• Special character AT_CMD detection
• RS485 protocol
• IrDA protocol
• High-speed data communication using GDMA
• UART as wake-up source
• Software and hardware flow control Pin Assignment
• UART0 – The pins U0TXD and U0RXD that are connected to transmit and receive signals are multiplexed with GPIO43~ GPIO44 via IO MUX, and can also be connected to any GPIO via the GPIO Matrix. – The pins U0RTS and U0CTS that are connected to hardware flow control signals are multiplexed with GPIO15~ GPIO16, RTC_GPIO15~ RTC_GPIO16, XTAL_32K_P and XTAL_32K_N, and SAR ADC2 interface via IO MUX, and can also be connected to any GPIO via the GPIO Matrix. – The pins U0DTR and U0DSR that are connected to hardware flow control signals can be chosen from any GPIO via the GPIO Matrix.
• UART1 – The pins U1TXD and U1RXD that are connected to transmit and receive signals are multiplexed with GPIO17~ GPIO18, RTC_GPIO17~ RTC_GPIO18, and SAR ADC2 interface via IO MUX, and can also be connected to any GPIO via the GPIO Matrix. – The pins U1RTS and U1CTS that are connected to hardware flow control signals are multiplexed with GPIO19~ GPIO20, RTC_GPIO19~ RTC_GPIO20, USB_D- and USB_D+ pins, and SAR ADC2 interface via IO MUX, and can also be connected to any GPIO via the GPIO Matrix. – The pins U1DTR and U1DSR that are connected to hardware flow control signals can be chosen from any GPIO via the GPIO Matrix.
• UART2: The pins used can be chosen from any GPIO via the GPIO Matrix. For more information about the pin assignment, seeESP32-S3 Series Datasheet> SectionIO Pinsand ESP32-S3 Technical Reference Manual> ChapterIO MUX and GPIO Matrix.

5.2.1.2 I2C Interface

ESP32-S3 has two I2C bus interfaces which are used for I2C master mode or slave mode, depending on the user’s configuration. Feature List

• Standard mode (100 kbit/s)
• Fast mode (400 kbit/s)
• Up to 800 kbit/s (constrained by SCL and SDA pull-up strength)
• 7-bit and 10-bit addressing mode Espressif Systems 18 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

• Double addressing mode (slave addressing and slave register addressing) The hardware provides a command abstraction layer to simplify the usage of the I2C peripheral. Pin Assignment For I2C, the pins used can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, seeESP32-S3 Series Datasheet> SectionIO Pinsand ESP32-S3 Technical Reference Manual> ChapterIO MUX and GPIO Matrix.

5.2.1.3 I2S Interface

ESP32-S3 includes two standard I2S interfaces. They can operate in master mode or slave mode, in full-duplex mode or half-duplex communication mode, and can be configured to operate with an 8-bit, 16-bit, 24-bit, or 32-bit resolution as an input or output channel. BCK clock frequency, from 10 kHz up to 40 MHz, is supported. The I2S interface has a dedicated DMA controller. It supports TDM PCM, TDM MSB alignment, TDM LSB alignment, TDM Phillips, and PDM interface. Pin Assignment For I2S, the pins used can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, seeESP32-S3 Series Datasheet> SectionIO Pinsand ESP32-S3 Technical Reference Manual> ChapterIO MUX and GPIO Matrix.

5.2.1.4 LCD and Camera Controller

The LCD and Camera controller of ESP32-S3 consists of a LCD module and a camera module. The LCD module is designed to send parallel video data signals, and its bus supports 8-bit~ 16-bit parallel RGB, I8080, and MOTO6800 interfaces. These interfaces operate at 40 MHz or lower, and support conversion among RGB565, YUV422, YUV420, and YUV411. The camera module is designed to receive parallel video data signals, and its bus supports an 8-bit~ 16-bit DVP image sensor, with clock frequency of up to 40 MHz. The camera interface supports conversion among RGB565, YUV422, YUV420, and YUV411. Pin Assignment For LCD and Camera controller, the pins used can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, seeESP32-S3 Series Datasheet> SectionIO Pinsand ESP32-S3 Technical Reference Manual> ChapterIO MUX and GPIO Matrix.

5.2.1.5 Serial Peripheral Interface (SPI)

ESP32-S3 has the following SPI interfaces:

• SPI0 usedbyESP32-S3’sGDMAcontrollerandcachetoaccessin-packageoroff-packageflash/PSRAM
• SPI1 used by the CPU to access in-package or off-package flash/PSRAM Espressif Systems 19 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

• SPI2 is a general purpose SPI controller with access to a DMA channel allocated by the GDMA controller
• SPI3 is a general purpose SPI controller with access to a DMA channel allocated by the GDMA controller Feature List
• SPI0 and SPI1: – Supports Single SPI, Dual SPI, Quad SPI, Octal SPI, QPI, and OPI modes – 8-line SPI mode supports single data rate (SDR) and double data rate (DDR) – Configurable clock frequency with a maximum of 120 MHz for 8-line SPI SDR/DDR modes – Data transmission is in bytes
• SPI2: – Supports operation as a master or slave – Connects to a DMA channel allocated by the GDMA controller – Supports Single SPI, Dual SPI, Quad SPI, Octal SPI, QPI, and OPI modes – Configurable clock polarity (CPOL) and phase (CPHA) – Configurable clock frequency – Data transmission is in bytes – Configurable read and write data bit order: most-significant bit (MSB) first, or least-significant bit (LSB) first – As a master * Supports 2-line full-duplex communication with clock frequency up to 80 MHz * Full-duplex 8-line SPI mode supports single data rate (SDR) only * Supports 1-, 2-, 4-, 8-line half-duplex communication with clock frequency up to 80 MHz * Half-duplex 8-line SPI mode supports both single data rate (up to 80 MHz) and double data rate (up to 40 MHz) * Provides six SPI_CS pins for connection with six independent SPI slaves * Configurable CS setup time and hold time – As a slave * Supports 2-line full-duplex communication with clock frequency up to 60 MHz * Supports 1-, 2-, 4-line half-duplex communication with clock frequency up to 60 MHz * Full-duplex and half-duplex 8-line SPI mode supports single data rate (SDR) only
• SPI3: – Supports operation as a master or slave – Connects to a DMA channel allocated by the GDMA controller – Supports Single SPI, Dual SPI, Quad SPI, and QPI modes Espressif Systems 20 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

– Configurable clock polarity (CPOL) and phase (CPHA) – Configurable clock frequency – Data transmission is in bytes – Configurable read and write data bit order: most-significant bit (MSB) first, or least-significant bit (LSB) first – As a master * Supports 2-line full-duplex communication with clock frequency up to 80 MHz * Supports 1-, 2-, 4-line half-duplex communication with clock frequency up to 80 MHz * Provides three SPI_CS pins for connection with three independent SPI slaves * Configurable CS setup time and hold time – As a slave * Supports 2-line full-duplex communication with clock frequency up to 60 MHz * Supports 1-, 2-, 4-line half-duplex communication with clock frequency up to 60 MHz Pin Assignment Note: Please refer toESP32-S3 Series Datasheet> SectionIO MUX Function> TableIO MUX Pin Functionsfor the corre- sponding SPI interface details.

• SPI0/1 – Via IO MUX: * Interface4a is multiplexed with GPIO26~ GPIO32 via IO MUX. When used in conjunction with 4b, it can operate as the lower 4 bits data line interface and the CLK, CS0, and CS1 interfaces in 8-line SPI mode. * Interface4b is multiplexed with GPIO33~ GPIO37 and SPI interfaces4e and4f via IO MUX. When used in conjunction with4a, it can operate as the higher 4 bits data line interface and DQS interface in 8-line SPI mode. * Interface4d is multiplexed with GPIO8~ GPIO14, RTC_GPIO8~ RTC_GPIO14, Touch Sensor interface, SAR ADC interface, and SPI interfaces4c and4g via IO MUX. Note that the fast SPI2 interface will not be available. * Interface4e is multiplexed with GPIO33~ GPIO39, JTAG MTCK interface, and SPI interfaces4b and4f via IO MUX. It is an alternative group of signal lines that can be used if SPI0/1 does not use 8-line SPI connection. – Via GPIO Matrix: The pins used can be chosen from any GPIOs via the GPIO Matrix.
• SPI2 – Via IO MUX: * Interface4c is multiplexed with GPIO9~ GPIO14, RTC_GPIO9~ RTC_GPIO14, Touch Sensor interface, SAR ADC interface, and SPI interfaces4d and4g via IO MUX. It is the SPI2 main interface for fast SPI connection. Espressif Systems 21 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

• (not recommended) Interface4f is multiplexed with GPIO33~ GPIO38, SPI interfaces4e and 4b via IO MUX. It is the alternative SPI2 interface if the main SPI2 is not available. Its performance is comparable to SPI2 via GPIO matrix, so use the GPIO matrix instead. * (not recommended) Interface4g is multiplexed with GPIO10~ GPIO14, RTC_GPIO10~ RTC_GPIO14, Touch Sensor interface, SAR ADC interface, and SPI interfaces4c and4d via IO MUX. It is the alternative SPI2 interface signal lines for 8-line SPI connection. – Via GPIO Matrix: The pins used can be chosen from any GPIOs via the GPIO Matrix.
• SPI3: The pins used can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, seeESP32-S3 Series Datasheet> SectionIO Pinsand ESP32-S3 Technical Reference Manual> ChapterIO MUX and GPIO Matrix.

5.2.1.6 Two-Wire Automotive Interface (TWAI®)

The Two-Wire Automotive Interface (TWAI®) is a multi-master, multi-cast communication protocol with error detection and signaling as well as inbuilt message priorities and arbitration. Feature List

• Compatible with ISO 11898-1 protocol (CAN Specification 2.0)
• Standard frame format (11-bit ID) and extended frame format (29-bit ID)
• Bit rates from 1 Kbit/s to 1 Mbit/s
• Multiple modes of operation: – Normal – Listen Only – Self-Test (no acknowledgment required)
• 64-byte receive FIFO
• Acceptance filter (single and dual filter modes)
• Error detection and handling: – Error counters – Configurable error interrupt threshold – Error code capture – Arbitration lost capture Pin Assignment For TWAI, the pins used can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, seeESP32-S3 Series Datasheet> SectionIO Pinsand ESP32-S3 Technical Reference Manual> ChapterIO MUX and GPIO Matrix. Espressif Systems 22 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

5.2.1.7 USB 2.0 OTG Full-Speed Interface ESP32-S3 features a full-speed USB OTG interface along with an integrated transceiver. The USB OTG interface complies with the USB 2.0 specification. General Features

• FS and LS data rates
• HNP and SRP as A-device or B-device
• Dynamic FIFO (DFIFO) sizing
• Multiple modes of memory access – Scatter/Gather DMA mode – Buffer DMA mode – Slave mode
• Can choose integrated transceiver or external transceiver
• Utilizing integrated transceiver with USB Serial/JTAG by time-division multiplexing when only integrated transceiver is used
• Support USB OTG using one of the transceivers while USB Serial/JTAG using the other one when both integrated transceiver or external transceiver are used Device Mode Features
• Endpoint number 0 always present (bi-directional, consisting of EP0 IN and EP0 OUT)
• Six additional endpoints (endpoint numbers 1 to 6), configurable as IN or OUT
• Maximum of five IN endpoints concurrently active at any time (including EP0 IN)
• All OUT endpoints share a single RX FIFO
• Each IN endpoint has a dedicated TX FIFO Host Mode Features
• Eight channels (pipes) – A control pipe consists of two channels (IN and OUT), as IN and OUT transactions must be handled separately. Only Control transfer type is supported. – Each of the other seven channels is dynamically configurable to be IN or OUT, and supports Bulk, Isochronous, and Interrupt transfer types.
• All channels share an RX FIFO, non-periodic TX FIFO, and periodic TX FIFO. The size of each FIFO is configurable. Espressif Systems 23 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

When using the on-chip PHY, the differential signal pins USB_D- and USB_D+ of the USB OTG are multiplexed with GPIO19~ GPIO20, RTC_GPIO19~ RTC_GPIO20, UART1 interface, and SAR ADC2 interface via IO MUX. When using external PHY, the USB OTG pins are multiplexed with GPIO21, RTC_GPIO21, GPIO38~ GPIO42, and SPI interface via IO MUX:

• VP signal connected to MTMS pin
• VM signal connected to MTDI pin
• RCV signal connected to GPIO21
• OEN signal connected to MTDO pin
• VPO signal connected to MTCK pin
• VMO signal connected to GPIO38 For more information about the pin assignment, seeESP32-S3 Series Datasheet> SectionIO Pinsand ESP32-S3 Technical Reference Manual> ChapterIO MUX and GPIO Matrix.

5.2.1.8 USB Serial/JTAG Controller

ESP32-S3 integrates a USB Serial/JTAG controller. Feature List

• USB Full-speed device.
• Can be configured to either use internal USB PHY of ESP32-S3 or external PHY via GPIO matrix.
• Fixed function device, hardwired for CDC-ACM (Communication Device Class - Abstract Control Model) and JTAG adapter functionality.
• Two OUT Endpoints, three IN Endpoints in addition to Control Endpoint 0; Up to 64-byte data payload size.
• Internal PHY, so no or very few external components needed to connect to a host computer.
• CDC-ACM adherent serial port emulation is plug-and-play on most modern OSes.
• JTAG interface allows fast communication with CPU debug core using a compact representation of JTAG instructions.
• CDC-ACM supports host controllable chip reset and entry into download mode. Pin Assignment When using the on-chip PHY, the differential signal pins USB_D- and USB_D+ of the USB Serial/JTAG controller are multiplexed with GPIO19~ GPIO20, RTC_GPIO19~ RTC_GPIO20, UART1 interface, and SAR ADC2 interface via IO MUX. When using external PHY, the USB Serial/JTAG controller pins are multiplexed with GPIO38~ GPIO42 and SPI interface via IO MUX: Espressif Systems 24 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

• VP signal connected to MTMS pin
• VM signal connected to MTDI pin
• OEN signal connected to MTDO pin
• VPO signal connected to MTCK pin
• VMO signal connected to GPIO38 For more information about the pin assignment, seeESP32-S3 Series Datasheet> SectionIO Pinsand ESP32-S3 Technical Reference Manual> ChapterIO MUX and GPIO Matrix.

5.2.1.9 SD/MMC Host Controller

ESP32-S3 has an SD/MMC Host controller. Feature List

• Secure Digital (SD) memory version 3.0 and version 3.01
• Secure Digital I/O (SDIO) version 3.0
• Consumer Electronics Advanced Transport Architecture (CE-ATA) version 1.1
• Multimedia Cards (MMC version 4.41, eMMC version 4.5 and version 4.51)
• Up to 80 MHz clock output
• Three data bus modes: – 1-bit – 4-bit (supports two SD/SDIO/MMC 4.41 cards, and one SD card operating at 1.8 V in 4-bit mode) – 8-bit Pin Assignment For SD/MMC Host, the pins used can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, seeESP32-S3 Series Datasheet> SectionIO Pinsand ESP32-S3 Technical Reference Manual> ChapterIO MUX and GPIO Matrix.

5.2.1.10 LED PWM Controller

The LED PWM controller can generate independent digital waveforms on eight channels. Feature List

• Can generate a digital waveform with configurable periods and duty cycle. The duty cycle resolution can be up to 14 bits within a 1 ms period
• Multiple clock sources, including APB clock and external main crystal clock
• Can operate when the CPU is in Light-sleep mode
• Gradual increase or decrease of duty cycle, useful for the LED RGB color-fading generator Espressif Systems 25 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

For LED PWM, the pins used can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, seeESP32-S3 Series Datasheet> SectionIO Pinsand ESP32-S3 Technical Reference Manual> ChapterIO MUX and GPIO Matrix.

5.2.1.11 Motor Control PWM (MCPWM)

ESP32-S3 integrates two MCPWMs that can be used to drive digital motors and smart light. Each MCPWM peripheral has one clock divider (prescaler), three PWM timers, three PWM operators, and a capture module. PWM timers are used for generating timing references. The PWM operators generate desired waveform based on the timing references. Any PWM operator can be configured to use the timing references of any PWM timers. Different PWM operators can use the same PWM timer’s timing references to produce related PWM signals. PWM operators can also use different PWM timers’ values to produce the PWM signals that work alone. Different PWM timers can also be synchronized together. Pin Assignment For MCPWM, the pins used can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, seeESP32-S3 Series Datasheet> SectionIO Pinsand ESP32-S3 Technical Reference Manual> ChapterIO MUX and GPIO Matrix.

5.2.1.12 Remote Control Peripheral (RMT)

The Remote Control Peripheral (RMT) is designed to send and receive infrared remote control signals. Feature List

• Four TX channels
• Four RX channels
• Support multiple channels (programmable) transmitting data simultaneously
• Eight channels share a 384 x 32-bit RAM
• Support modulation on TX pulses
• Support filtering and demodulation on RX pulses
• Wrap TX mode
• Wrap RX mode
• Continuous TX mode
• DMA access for TX mode on channel 3
• DMA access for RX mode on channel 7 Pin Assignment For RMT, the pins used can be chosen from any GPIOs via the GPIO Matrix. Espressif Systems 26 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

For more information about the pin assignment, seeESP32-S3 Series Datasheet> SectionIO Pinsand ESP32-S3 Technical Reference Manual> ChapterIO MUX and GPIO Matrix.

5.2.1.13 Pulse Count Controller (PCNT)

The pulse count controller (PCNT) captures pulse and counts pulse edges through multiple modes. Feature List

• Four independent pulse counters (units) that count from 1 to 65535
• Each unit consists of two independent channels sharing one pulse counter
• All channels have input pulse signals (e.g. sig_ch0_un) with their corresponding control signals (e.g. ctrl_ch0_un)
• Independently filter glitches of input pulse signals (sig_ch0_un and sig_ch1_un) and control signals (ctrl_ch0_un and ctrl_ch1_un) on each unit
• Each channel has the following parameters: 1. Selection between counting on positive or negative edges of the input pulse signal 2. Configuration to Increment, Decrement, or Disable counter mode for control signal’s high and low states Pin Assignment For pulse count controller, the pins used can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, seeESP32-S3 Series Datasheet> SectionIO Pinsand ESP32-S3 Technical Reference Manual> ChapterIO MUX and GPIO Matrix.

5.2.2 Analog Signal Processing

This subsection describes components on the chip that sense and process real-world data.

5.2.2.1 SAR ADC

ESP32-S3integratestwo12-bitSARADCs andsupportsmeasurementson20channels (analog-enabledpins). For power-saving purpose, the ULP coprocessors in ESP32-S3 can also be used to measure voltage in sleep modes. By using threshold settings or other methods, we can awaken the CPU from sleep modes. Pin Assignment The pins for the SAR ADC are multiplexed with GPIO1~ GPIO20, RTC_GPIO1~ RTC_GPIO20, Touch Sensor interface, SPI interface, UART interface, and USB_D- and USB_D+ pins via IO MUX. For more information about the pin assignment, seeESP32-S3 Series Datasheet> SectionIO Pinsand ESP32-S3 Technical Reference Manual> ChapterIO MUX and GPIO Matrix. Espressif Systems 27 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

5.2.2.2 Temperature Sensor

The temperature sensor generates a voltage that varies with temperature. The voltage is internally converted via an ADC into a digital value. The temperature sensor has a range of –20 °C to 110 °C. It is designed primarily to sense the temperature changes inside the chip. The temperature value depends on factors such as microcontroller clock frequency or I/O load. Generally, the chip’s internal temperature is higher than the ambient temperature.

5.2.2.3 Touch Sensor

ESP32-S3 has 14 capacitive-sensing GPIOs, which detect variations induced by touching or approaching the GPIOs with a finger or other objects. The low-noise nature of the design and the high sensitivity of the circuit allow relatively small pads to be used. Arrays of pads can also be used, so that a larger area or more points can be detected. The touch sensing performance can be further enhanced by the waterproof design and digital filtering feature. Note: ESP32-S3touchsensorhasnotpassedtheConductedSusceptibility(CS)testfornow,andthushaslimitedapplication scenarios. Pin Assignment The pins for touch sensor are multiplexed with GPIO1~ GPIO14, RTC_GPIO1~ RTC_GPIO14, SAR ADC interface, and SPI interface via IO MUX. For more information about the pin assignment, seeESP32-S3 Series Datasheet> SectionIO Pinsand ESP32-S3 Technical Reference Manual> ChapterIO MUX and GPIO Matrix. Espressif Systems 28 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

6 Electrical Characteristics

6.1 Absolute Maximum Ratings

Stresses above those listed in Table8Absolute Maximum Ratingsmay cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Table9Recommended Operating Conditionsis not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Table 8: Absolute Maximum Ratings Symbol Parameter Min Max Unit VDD33 Power supply voltage –0.3 3.6 V TSTORE Storage temperature –40 105 °C

6.2 Recommended Operating Conditions

Table 9: Recommended Operating Conditions Symbol Parameter Min Typ Max Unit VDD33 Power supply voltage 3.0 3.3 3.6 V IV DD Current delivered by external power supply0.5 — — A TA Operating ambient temperature –40 — 85 °C 6.3 DC Characteristics (3.3 V, 25 °C) Table 10: DC Characteristics (3.3 V, 25 °C) Symbol Parameter Min Typ Max Unit CIN Pin capacitance — 2 — pF VIH High-level input voltage 0.75 × VDD1 — VDD1 + 0.3 V VIL Low-level input voltage –0.3 — 0.25 × VDD1 V IIH High-level input current — — 50 nA IIL Low-level input current — — 50 nA VOH 2 High-level output voltage 0.8 × VDD1 — — V VOL2 Low-level output voltage — — 0.1 × VDD1 V IOH High-level source current (VDD1 = 3.3 V, VOH >= 2.64 V, PAD_DRIVER = 3) — 40 — mA IOL Low-level sink current (VDD1 = 3.3 V, VOL =

0.495 V, PAD_DRIVER = 3) — 28 — mA

RPU Internal weak pull-up resistor — 45 — kΩ RPD Internal weak pull-down resistor — 45 — kΩ VIH_nRST Chip reset release voltage (EN voltage is within the specified range) 0.75 × VDD1 — VDD1 + 0.3 V Cont’d on next page Espressif Systems 29 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

Table 10 – cont’d from previous page Symbol Parameter Min Typ Max Unit VIL_nRST Chip reset voltage (EN voltage is within the specified range) –0.3 — 0.25 × VDD1 V 1 VDD is the I/O voltage for pins of a particular power domain. 2 VOH and VOL are measured using high-impedance load.

6.4 Current Consumption Characteristics

6.4.1 Current Consumption in Active Mode

With the use of advanced power-management technologies, the module can switch between different power modes. For details on different power modes, please refer to SectionPower Management Unit inESP32-S3 Series Datasheet. The current consumption measurements are taken with a 3.3 V supply at 25 °C ambient temperature. TX current consumption is rated at a 100% duty cycle. RX current consumption is rated when the peripherals are disabled and the CPU idle. Table 11: Current Consumption in Avtice Mode Work mode Description Peak (mA) Active (RF working) TX 802.11b, 1 Mbps, @20.5 dBm 355 802.11g, 54 Mbps, @18 dBm 297 802.11n, HT20, MCS 7, @17.5 dBm 286 802.11n, HT40, MCS 7, @17 dBm 285 RX 802.11b/g/n, HT20 95 802.11n, HT40 97 Note: The content below is excerpted fromSection Power Consumption in Other ModesinESP32-S3 Series Datasheet.

6.4.2 Current Consumption in Other Modes

Please note that if the chip embedded has in-package PSRAM, the current consumption of the module might be higher compared to the measurements below. Espressif Systems 30 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

Table 12: Current Consumption in Modem-sleep Mode Work mode Frequency (MHz) Description Typ1 (mA) Typ2 (mA) Modem-sleep3 WAITI (Dual core in idle state) 13.2 18.8 Single core running 32-bit data access instructions, the other core in idle state 16.2 21.8 Dual core running 32-bit data access instructions 18.7 24.4 Single core running 128-bit data access instructions, the other core in idle state 19.9 25.4 Dual core running 128-bit data access instructions 23.0 28.8 WAITI 22.0 36.1 Single core running 32-bit data access instructions, the other core in idle state 28.4 42.6 Dual core running 32-bit data access instructions 33.1 47.3 Single core running 128-bit data access instructions, the other core in idle state 35.1 49.6 Dual core running 128-bit data access instructions 41.8 56.3 160 WAITI 27.6 42.3 Single core running 32-bit data access instructions, the other core in idle state 39.9 54.6 Dual core running 32-bit data access instructions 49.6 64.1 Single core running 128-bit data access instructions, the other core in idle state 54.4 69.2 Dual core running 128-bit data access instructions 66.7 81.1 240 WAITI 32.9 47.6 Single core running 32-bit data access instructions, the other core in idle state 51.2 65.9 Dual core running 32-bit data access instructions 66.2 81.3 Single core running 128-bit data access instructions, the other core in idle state 72.4 87.9 Dual core running 128-bit data access instructions 91.7 107.9 1 Current consumption when all peripheral clocks aredisabled. 2 Current consumption when all peripheral clocks areenabled. In practice, the current consumption might be different depending on which peripherals are enabled.

3 In Modem-sleep mode, Wi-Fi is clock gated, and the current consumption might be higher when accessing

flash. For a flash rated at 80 Mbit/s, in SPI 2-line mode the consumption is 10 mA. Table 13: Current Consumption in Low-Power Modes Work mode Description Typ (µA) Light-sleep1 VDD_SPIandWi-Fiarepowereddown,andallGPIOs are high-impedance. 240 Deep-sleep RTC memory and RTC peripherals are powered up. 8 RTC memory is powered up. RTC peripherals are powered down. 7 Espressif Systems 31 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

Power off CHIP_PU is set to low level. The chip is shut down. 1 1 In Light-sleep mode, all related SPI pins are pulled up. For chips embedded withPSRAM,pleaseaddcorrespondingPSRAMconsumptionvalues,e.g.,140 µAfor8MBOctalPSRAM(3.3V),200 µAfor8MBOctalPSRAM(1.8V)and40 µA for 2 MB Quad PSRAM (3.3 V). Espressif Systems 32 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

7 RF Characteristics

This section contains tables with RF characteristics of the Espressif product. The RF data is measured at the antenna port, where RF cable is connected, including the front-end loss. The external antennas used for the tests on the modules with external antenna connectors have an impedance of 50Ω.Devices should operate in the center frequency range allocated by regional regulatory authorities. The target center frequency range and the target transmit power are configurable by software. SeeESPRFTest ToolandTestGuidefor instructions. Unless otherwise stated, the RF tests are conducted with a 3.3 V (±5%) supply at 25 ºC ambient temperature. 7 .1Wi-Fi Radio Table 14: Wi-Fi RF Characteristics Name Description Center frequency range of operating channel2412~ 2484 MHz Wi-Fi wireless standard IEEE 802.11b/g/n 7 .1.1Wi-Fi RF Transmitter (TX) Characteristics Table 15: TX Power with Spectral Mask and EVM Meeting 802.11 Standards Min Typ MaxRate (dBm) (dBm) (dBm) 802.11b, 1 Mbps — 20.5 — 802.11b, 11 Mbps — 20.5 — 802.11g, 6 Mbps — 20.0 — 802.11g, 54 Mbps — 18.0 — 802.11n, HT20, MCS 0 — 19.0 — 802.11n, HT20, MCS 7 — 17.5 — 802.11n, HT40, MCS 0 — 18.5 — 802.11n, HT40, MCS 7 — 17.0 — Table 16: TX EVM Test1 Min Typ LimitRate (dB) (dB) (dB) 802.11b, 1 Mbps, @20.5 dBm — –24.5 –10 802.11b, 11 Mbps, @20.5 dBm — –24.5 –10 802.11g, 6 Mbps, @20 dBm — –23.0 –5 802.11g, 54 Mbps, @18 dBm — –29.5 –25 802.11n, HT20, MCS 0, @19 dBm — –24.0 –5 Cont’d on next page Espressif Systems 33 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

Table 16 – cont’d from previous page Min Typ LimitRate (dB) (dB) (dB) 802.11n, HT20, MCS 7, @17.5 dBm — –30.5 –27 802.11n, HT40, MCS 0, @18.5 dBm — –25.0 –5 802.11n, HT40, MCS 7, @17 dBm — –30.0 –27

1 EVM is measured at the corresponding typical TX power provided

in Table15 TX Power with Spectral Mask and EVM Meeting 802.11 Standards above. 7 .1.2Wi-Fi RF Receiver (RX) Characteristics For RX tests, the PER (packet error rate) limit is 8% for 802.11b, and 10% for 802.11g/n. Table 17: RX Sensitivity Min Typ MaxRate (dBm) (dBm) (dBm) 802.11b, 1 Mbps — –98.2 — 802.11b, 2 Mbps — –95.6 — 802.11b, 11 Mbps — –88.5 — 802.11g, 6 Mbps — –93.0 — 802.11g, 9 Mbps — –92.0 — 802.11g, 12 Mbps — –90.8 — 802.11g, 18 Mbps — –88.5 — 802.11g, 24 Mbps — –85.5 — 802.11g, 36 Mbps — –82.2 — 802.11g, 48 Mbps — –78.0 — 802.11g, 54 Mbps — –76.2 — 802.11n, HT20, MCS 0 — –93.0 — 802.11n, HT20, MCS 1 — –90.6 — 802.11n, HT20, MCS 2 — –88.4 — 802.11n, HT20, MCS 3 — –84.8 — 802.11n, HT20, MCS 4 — –81.6 — 802.11n, HT20, MCS 5 — –77.4 — 802.11n, HT20, MCS 6 — –75.6 — 802.11n, HT20, MCS 7 — –74.2 — 802.11n, HT40, MCS 0 — –90.0 — 802.11n, HT40, MCS 1 — –87.5 — 802.11n, HT40, MCS 2 — –85.0 — 802.11n, HT40, MCS 3 — –82.0 — 802.11n, HT40, MCS 4 — –78.5 — 802.11n, HT40, MCS 5 — –74.4 — 802.11n, HT40, MCS 6 — –72.5 — Cont’d on next page Espressif Systems 34 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

Table 17 – cont’d from previous page Min Typ MaxRate (dBm) (dBm) (dBm) 802.11n, HT40, MCS 7 — –71.2 — Table 18: Maximum RX Level Min Typ MaxRate (dBm) (dBm) (dBm) 802.11b, 1 Mbps — 5 — 802.11b, 11 Mbps — 5 — 802.11g, 6 Mbps — 5 — 802.11g, 54 Mbps — 0 — 802.11n, HT20, MCS 0 — 5 — 802.11n, HT20, MCS 7 — 0 — 802.11n, HT40, MCS 0 — 5 — 802.11n, HT40, MCS 7 — 0 — Table 19: RX Adjacent Channel Rejection Min Typ MaxRate (dB) (dB) (dB) 802.11b, 1 Mbps — 35 — 802.11b, 11 Mbps — 35 — 802.11g, 6 Mbps — 31 — 802.11g, 54 Mbps — 14 — 802.11n, HT20, MCS 0 — 31 — 802.11n, HT20, MCS 7 — 13 — 802.11n, HT40, MCS 0 — 19 — 802.11n, HT40, MCS 7 — 8 — 7 .2 Bluetooth LE Radio Table 20: Bluetooth LE RF Characteristics Name Description Center frequency range of operating channel2402~ 2480 MHz RF transmit power range –24.0~ 20.0 dBm Espressif Systems 35 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

7 .2.1Bluetooth LE RF Transmitter (TX) Characteristics Table 21: Bluetooth LE - Transmitter Characteristics - 1 Mbps Parameter Description Min Typ Max Unit Carrier frequency offset and drift Max|fn|n=0, 1, 2, ..k — 2.50 — kHz Max|f0 − fn| — 2.00 — kHz Modulation characteristics ∆ f1avg — 249.00 — kHz Min∆ f2max (for at least 99.9% of all∆ f2max) — 198.00 — kHz ∆ f2avg/∆ f1avg — 0.86 — — In-band spurious emissions ±2 MHz offset — –37.00 — dBm ±3 MHz offset — –42.00 — dBm >±3 MHz offset — –44.00 — dBm Table 22: Bluetooth LE - Transmitter Characteristics - 2 Mbps Parameter Description Min Typ Max Unit Carrier frequency offset and drift Max|fn|n=0, 1, 2, ..k — 2.50 — kHz Max|f0 − fn| — 2.00 — kHz Modulation characteristics ∆ f1avg — 499.00 — kHz Min∆ f2max (for at least 99.9% of all∆ f2max) — 416.00 — kHz ∆ f2avg/∆ f1avg — 0.89 — — In-band spurious emissions ±4 MHz offset — –42.00 — dBm ±5 MHz offset — –44.00 — dBm >±5 MHz offset — –47.00 — dBm Table 23: Bluetooth LE - Transmitter Characteristics - 125 Kbps Parameter Description Min Typ Max Unit Carrier frequency offset and drift Max|fn|n=0, 1, 2, ..k — 0.80 — kHz Max|f0 − fn| — 1.00 — kHz Modulation characteristics ∆ f1avg — 248.00 — kHz Min∆ f1max (for at least 99.9% of all∆ f1max) — 222.00 — kHz In-band spurious emissions ±2 MHz offset — –37.00 — dBm ±3 MHz offset — –42.00 — dBm >±3 MHz offset — –44.00 — dBm Espressif Systems 36 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

Table 24: Bluetooth LE - Transmitter Characteristics - 500 Kbps Parameter Description Min Typ Max Unit Carrier frequency offset and drift Max|fn|n=0, 1, 2, ..k — 0.80 — kHz Max|f0 − fn| — 1.00 — kHz Modulation characteristics ∆ f2avg — 213.00 — kHz Min∆ f2max (for at least 99.9% of all∆ f2max) — 196.00 — kHz In-band spurious emissions ±2 MHz offset — –37.00 — dBm ±3 MHz offset — –42.00 — dBm >±3 MHz offset — –44.00 — dBm 7 .2.2 Bluetooth LE RF Receiver (RX) Characteristics Table 25: Bluetooth LE - Receiver Characteristics - 1 Mbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –96.5 — dBm Maximumreceivedsignal@30.8%PER — — 8 — dBm Co-channel C/I F = F0 MHz — 8 — dB Adjacent channel selectivity C/I F = F0 + 1 MHz — 4 — dB F = F0 – 1 MHz — 4 — dB F = F0 + 2 MHz — –23 — dB F = F0 – 2 MHz — –23 — dB F = F0 + 3 MHz — –34 — dB F = F0 – 3 MHz — –34 — dB F> F0 + 3 MHz — –36 — dB Image frequency — — –36 — dB Adjacent channel to image frequency F = Fimage + 1 MHz — –39 — dB F = Fimage – 1 MHz — –34 — dB Out-of-band blocking performance

30 MHz~ 2000 MHz — –12 — dBm

2003 MHz~ 2399 MHz — –18 — dBm

2484 MHz~ 2997 MHz — –16 — dBm

3000 MHz~ 12.75 GHz — –10 — dBm Intermodulation — — –29 — dBm Table 26: Bluetooth LE - Receiver Characteristics - 2 Mbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –92 — dBm Maximumreceivedsignal@30.8%PER — — 3 — dBm Cont’d on next page Espressif Systems 37 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

Table 26 – cont’d from previous page Parameter Description Min Typ Max Unit Co-channel C/I F = F0 MHz — 8 — dB Adjacent channel selectivity C/I F = F0 + 2 MHz — 4 — dB F = F0 – 2 MHz — 4 — dB F = F0 + 4 MHz — –27 — dB F = F0 – 4 MHz — –27 — dB F = F0 + 6 MHz — –38 — dB F = F0 – 6 MHz — –38 — dB F> F0 + 6 MHz — –41 — dB Image frequency — — –27 — dB Adjacent channel to image frequency F = Fimage + 2 MHz — –38 — dB F = Fimage – 2 MHz — 4 — dB Out-of-band blocking performance

30 MHz~ 2000 MHz — –15 — dBm

2003 MHz~ 2399 MHz — –21 — dBm

2484 MHz~ 2997 MHz — –21 — dBm

3000 MHz~ 12.75 GHz — –9 — dBm Intermodulation — — –29 — dBm Table 27: Bluetooth LE - Receiver Characteristics - 125 Kbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –103.5 — dBm Maximumreceivedsignal@30.8%PER — — 8 — dBm Co-channel C/I F = F0 MHz — 4 — dB Adjacent channel selectivity C/I F = F0 + 1 MHz — 1 — dB F = F0 – 1 MHz — 2 — dB F = F0 + 2 MHz — –26 — dB F = F0 – 2 MHz — –26 — dB F = F0 + 3 MHz — –36 — dB F = F0 – 3 MHz — –39 — dB F> F0 + 3 MHz — –42 — dB Image frequency — — –42 — dB Adjacent channel to image frequency F = Fimage + 1 MHz — –43 — dB F = Fimage – 1 MHz — –36 — dB Table 28: Bluetooth LE - Receiver Characteristics - 500 Kbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –100 — dBm Maximumreceivedsignal@30.8%PER — — 8 — dBm Co-channel C/I F = F0 MHz — 4 — dB Cont’d on next page Espressif Systems 38 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

Table 28 – cont’d from previous page Parameter Description Min Typ Max Unit Adjacent channel selectivity C/I F = F0 + 1 MHz — 1 — dB F = F0 – 1 MHz — 0 — dB F = F0 + 2 MHz — –24 — dB F = F0 – 2 MHz — –24 — dB F = F0 + 3 MHz — –37 — dB F = F0 – 3 MHz — –39 — dB F> F0 + 3 MHz — –38 — dB Image frequency — — –38 — dB Adjacent channel to image frequency F = Fimage + 1 MHz — –42 — dB F = Fimage – 1 MHz — –37 — dB Espressif Systems 39 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

8 Module Schematics

This is the reference design of the module. D D C C B B A A The values of L3, C5, C11, L2 and C12 vary with the actual PCB board. The values of C1 and C4 vary with the selection of the crystal. The value of R4 varies with the actual PCB board. R4 could be a resistor or inductor, the initial value is suggested to be 24 nH. ESP32-S3-MINI-1(pin-out) NC: No component. 50 ohm Impedance Control GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO26 GPIO39 GPIO40 GPIO41 GPIO42 U0RXD GPIO46 U0TXD GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 GPIO26 GPIO33 GPIO34 GPIO35 GPIO36 GPIO37 GPIO38 GPIO39 GPIO40 GPIO41 GPIO42 U0TXD U0RXD GPIO45 GPIO46 CHIP_PU RF_ANT LNA_IN CHIP_PU GPIO38 GPIO37 GPIO36 GPIO35 GPIO34 GPIO33 GPIO47 GPIO48 GPIO21 GPIO47 GPIO48 GPIO45 VDD33 GND VDD33 GND GND VDD33 GNDGND VDD33 GND GND GND GND GND VDD33 GND GND GND GND GND GND GND GND VDD_SPI VDD33 GND GND GND GND VDD33 Title Size Page Name Rev Date: Sheet o f Confidential and Proprietary<02_ESP32-S3-MINI-1> <ESP32-S3-MINI-1> 2 2Wednesday, November 22, 2023 1.1 Title Size Page Name Rev Date: Sheet o f Confidential and Proprietary<02_ESP32-S3-MINI-1> <ESP32-S3-MINI-1> 2 2Wednesday, November 22, 2023 1.1 Title Size Page Name Rev Date: Sheet o f Confidential and Proprietary<02_ESP32-S3-MINI-1> <ESP32-S3-MINI-1> 2 2Wednesday, November 22, 2023 1.1 0.1uF TBD 1uF TBD ESP32-S3-MINI-1 GND1 3V33 IO04 IO15 IO26 IO37 IO48 IO59 IO610 IO711 IO812 IO913 IO1014 IO1115 GND 42 TXD0 39RXD0 40 IO42 38 IO41 37 IO40 36 IO39 35 IO38 34 IO37 33 IO36 32 IO35 31 IO1317 IO1418 IO1519 IO1620 IO3328 IO3429 GND63 IO1216 IO46 44 IO45 41 IO1721 IO1822 IO1923 IO2024 IO2125 IO2626 IO4727 EPAD 61 GND2 GND62 IO4830 GND 64 GND 65 GND 43 EN 45 GND 46GND 47GND 48GND 49GND 50GND 51GND 52GND 53GND 54GND 55GND 56GND 57GND 58GND 59GND 60 TBD ESD R3 499 0.1uF C14 1uF C13 0.1uF ANT1 PCB_ANT C11 TBD U1 ESP32-S3FN8 VDDA 56 LNA_IN1 VDD3P32 VDD3P33 GPIO05 GPIO16 GPIO27 GPIO38 GPIO49 GPIO510 GPIO611 GPIO712 GPIO1015 GPIO1116 GPIO1217 GPIO1318 GPIO1419 XTAL_32K_P21 VDD3P3_RTC20 XTAL_32K_N22 GPIO1723 GPIO1824 GPIO1925 GPIO2026 VDD_SPI 29 SPIWP 31SPICS0 32 SPIQ 34SPID 35 SPICLK 33 SPICLK_N 36 GND 57 SPICLK_P 37GPIO33 38 GPIO38 43 GPIO46 52XTAL_N 53XTAL_P 54 MTMS 48 MTDO 45 U0TXD 49 VDD3P3_CPU 46 CHIP_PU4 VDDA 55 MTDI 47 GPIO813 GPIO914 GPIO2127 SPICS128 SPIHD 30 GPIO34 39GPIO35 40GPIO36 41 U0RXD 50GPIO45 51 GPIO37 42 MTCK 44 10K(NC) R4 0 10nF C10 0.1uF 40MHz(±10ppm) XIN1 GND2 XOUT 3 GND 4 TBD L1 2.0nH(0.1nH) C12 TBD L2 TBD 10uF C15 0.1uF 1uF Figure 5: ESP32-S3-MINI-1 Schematics Espressif Systems 40 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

The values of C11, L2 and C12 vary with the actual PCB board. The values of C1 and C4 vary with the selection of the crystal. The value of R4 varies with the actual PCB board. R4 could be a resistor or inductor, the initial value is suggested to be 24 nH. ESP32-S3-MINI-1U(pin-out) NC: No component. 50 ohm Impedance Control GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO26 GPIO39 GPIO40 GPIO41 GPIO42 U0RXD GPIO46 U0TXD GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 GPIO26 GPIO33 GPIO34 GPIO35 GPIO36 GPIO37 GPIO38 GPIO39 GPIO40 GPIO41 GPIO42 U0TXD U0RXD GPIO45 GPIO46 CHIP_PU RF_ANT LNA_IN CHIP_PU GPIO38 GPIO37 GPIO36 GPIO35 GPIO34 GPIO33 GPIO47 GPIO48 GPIO21 GPIO47 GPIO48 GPIO45 VDD33 GND VDD33 GND GND VDD33 GNDGND VDD33 GND GND GND GND GND VDD33 GND GND GND GND GND GND GND VDD_SPI VDD33 GND GND GND GND VDD33 Title Size Page Name Rev Date: Sheet o f Confidential and Proprietary<02_ESP32-S3-MINI-1U> <ESP32-S3-MINI-1U> 2 2Wednesday, November 22, 2023 1.1 Title Size Page Name Rev Date: Sheet o f Confidential and Proprietary<02_ESP32-S3-MINI-1U> <ESP32-S3-MINI-1U> 2 2Wednesday, November 22, 2023 1.1 Title Size Page Name Rev Date: Sheet o f Confidential and Proprietary<02_ESP32-S3-MINI-1U> <ESP32-S3-MINI-1U> 2 2Wednesday, November 22, 2023 1.1 0.1uF ESP32-S3-MINI-1U GND1 3V33 IO04 IO15 IO26 IO37 IO48 IO59 IO610 IO711 IO812 IO913 IO1014 IO1115 GND 42 TXD0 39RXD0 40 IO42 38 IO41 37 IO40 36 IO39 35 IO38 34 IO37 33 IO36 32 IO35 31 IO1317 IO1418 IO1519 IO1620 IO3328 IO3429 GND63 IO1216 IO46 44 IO45 41 IO1721 IO1822 IO1923 IO2024 IO2125 IO2626 IO4727 EPAD 61 GND2 GND62 IO4830 GND 64 GND 65 GND 43 EN 45 GND 46GND 47GND 48GND 49GND 50GND 51GND 52GND 53GND 54GND 55GND 56GND 57GND 58GND 59GND 60 TBD 1uF TBD 0.1uF R3 499 C14 1uF U1 ESP32-S3FN8 VDDA 56 LNA_IN1 VDD3P32 VDD3P33 GPIO05 GPIO16 GPIO27 GPIO38 GPIO49 GPIO510 GPIO611 GPIO712 GPIO1015 GPIO1116 GPIO1217 GPIO1318 GPIO1419 XTAL_32K_P21 VDD3P3_RTC20 XTAL_32K_N22 GPIO1723 GPIO1824 GPIO1925 GPIO2026 VDD_SPI 29 SPIWP 31SPICS0 32 SPIQ 34SPID 35 SPICLK 33 SPICLK_N 36 GND 57 SPICLK_P 37GPIO33 38 GPIO38 43 GPIO46 52XTAL_N 53XTAL_P 54 MTMS 48 MTDO 45 U0TXD 49 VDD3P3_CPU 46 CHIP_PU4 VDDA 55 MTDI 47 GPIO813 GPIO914 GPIO2127 SPICS128 SPIHD 30 GPIO34 39GPIO35 40GPIO36 41 U0RXD 50GPIO45 51 GPIO37 42 MTCK 44 C11 TBD C13 0.1uF ESD 10K(NC) R4 0 40MHz(±10ppm) XIN1 GND2 XOUT 3 GND 4 C10 0.1uF 10nF L1 2.0nH(0.1nH) C12 TBD L2 TBD 10uF C15 0.1uF ANT1 CONN 1uF Figure 6: ESP32-S3-MINI-1U Schematics Espressif Systems 41 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

9 Peripheral Schematics

This is the typical application circuit of the module connected with peripheral components (for example, power supply, antenna, reset button, JTAG interface, and UART interface). D D C C B B A A NC: No component. X1: ESR = Max. 70 KΩ EN IO42 IO41 IO37 IO36 IO38 IO40 IO39 RXD0 TXD0 IO35 TMS TDI TDO TCK IO6 IO7 IO9 IO10 IO11 USB_D+ IO3 IO5 IO20 IO19 USB_Du IO46 IO8 IO12 IO13 IO14 IO21 IO48 IO47 IO0 IO1 IO2 IO4 IO26 IO33 IO34 EN IO45 IO17 IO18 IO15 IO16 GND GND GND VDD33 GND GND GND VDD33 GNDGND GND GND GND GND 0.1uF JP4 Boot Option 1 1 2 2 SW1 R2 NC R7 0 R6 0R5 0(NC) C7 12pF(NC) C2 TBD R4 0X1 32.768KHz(NC) 1 2 R3 0(NC) TBD ESP32uS3uMINIu1/ESP32uS3uMINIu1U GND1 3V33 IO04 IO15 IO26 IO37 IO48 IO59 IO610 IO711 IO812 IO913 IO1014 IO1115 GND 42 TXD0 39RXD0 40 IO42 38 IO41 37 IO40 36 IO39 35 IO38 34 IO37 33 IO36 32 IO35 31 IO13 17 IO14 18 IO15 19 IO16 20 IO33 28 IO34 29 GND63 IO12 16 IO46 44 IO45 41 IO17 21 IO18 22 IO19 23 IO20 24 IO21 25 IO26 26 IO47 27 EPAD 61 GND2 GND62 IO48 30 GND 64 GND 65 GND 43 EN 45 GND 46 GND 47 GND 48 GND 49 GND 50 GND 51 GND 52 GND 53 GND 54 GND 55 GND 56 GND 57 GND 58 GND 59 GND 60 R1 TBD JP1 UART 22uF C8 0.1uF JP3 USB OTG JP2 JTAG C4 12pF(NC) TBD Figure 7: Peripheral Schematics

• Soldering the EPAD to the ground of the base board is not a must, however, it can optimize thermal performance. If you choose to solder it, please apply the correct amount of soldering paste. Too much soldering paste may increase the gap between the module and the baseboard. As result, the adhesion between other pins and the baseboard may be poor.
• To ensure that the power supply to the ESP32-S3 chip is stable during power-up, it is advised to add an RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and C = 1µF. However, specific parameters should be adjusted based on the power-up timing of the module and the power-up and reset sequence timing of the chip. For ESP32-S3’s power-up and reset sequence timing diagram, please refer toESP32-S3 Series Datasheet> SectionPower Supply. Espressif Systems 42 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

10 Physical Dimensions

10.1 Module Dimensions

5.05 4.5 0.857.7 Figure 8: ESP32-S3-MINI-1 Physical Dimensions 5.05 4.5 0.857.7 Figure 9: ESP32-S3-MINI-1U Physical Dimensions Note: For information about tape, reel, and product marking, please refer toEspressif Module Packaging Information. Espressif Systems 43 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

10.2 Dimensions of External Antenna Connector

ESP32-S3-MINI-1U uses the third generation external antenna connector as shown in Figure10Dimensions of External Antenna Connector. This connector is compatible with the following connectors:

• W.FL Series connector from Hirose
• MHF III connector from I-PEX
• AMMC connector from Amphenol SECTION: A-ASCALE: 1:1 A1.7 1.7 0.85 2.05±0.101.40 A 0.10 0.57 INSULATION RESISTANCE: 500MOHM Min.DIELECTRIC WITHSTANDING VOLTAGE: 200V AC FOR 1MINUTE; CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER;PERFORMANCE:CONTACT RESISTANCE: 20mOHM Max. HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0;SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; CONTACT GROUND CONTACT 2.00±0.10 Unit: mmTolerance: +/-0.1 mm HOUSINGCONTACT SHELL Figure 10: Dimensions of External Antenna Connector Espressif Systems 44 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

11 PCB Layout Recommendations

11.1 PCB Land Pattern

This section provides the following resources for your reference:

• Figures for recommended PCB land patterns with all the dimensions needed for PCB design. See Figure 11ESP32-S3-MINI-1 Recommended PCB Land Patternand Figure12ESP32-S3-MINI-1U Recommended PCB Land Pattern.
• Source files of recommended PCB land patterns to measure dimensions not covered in Figure11and Figure12. You can view the source files forESP32-S3-MINI-1andESP32-S3-MINI-1UwithAutodesk Viewer.
• 3D models ofESP32-S3-MINI-1andESP32-S3-MINI-1U. Please make sure that you download the 3D model file in .STEP format (beware that some browsers might add .txt). Unit: mmPadVia for thermal padESP32-S3-MINI-1U Land Pattern4.5 Figure 11: ESP32-S3-MINI-1 Recommended PCB Land Pattern Espressif Systems 45 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

Unit: mmPadVia for thermal padESP32-S3-MINI-1U Land Pattern4.5 Figure 12: ESP32-S3-MINI-1U Recommended PCB Land Pattern

11.2 Module Placement for PCB Design

If module-on-board design is adopted, attention should be paid while positioning the module on the base board. The interference of the base board on the module’s antenna performance should be minimized. For details about module placement for PCB design, please refer toESP32-S3 Hardware Design Guidelines> SectionPositioning a Module on a Base Board. Espressif Systems 46 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

12 Product Handling

12.1 Storage Conditions

The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric environment of < 40 °C and 90%RH. The module is rated at the moisture sensitivity level (MSL) of 3. After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and 60%RH. If the above conditions are not met, the module needs to be baked.

12.2 Electrostatic Discharge (ESD)

• Human body model (HBM): ±2000 V
• Charged-device model (CDM): ±500 V

12.3 Reflow Profile

Solder the module in a single reflow. 50 1000 150 200 250 200 100 150 250 Time (s) 217 Preheating 150 – 200 °C 60 – 120 s Ramp-up 25 – 150 °C 60 – 90 s 1 – 3 °C/s Soldering ＞ 217 °C 60 – 90 s Peak temperature: 235 – 250 °C Peak time: 30 – 70 s Soldering time: ＞ 30 s Solder: Sn-Ag-Cu (SAC/three.case/zero.case/five.case) lead-free solder T emperature (°C) 180 230 Cooling ＜ 180 °C –5 ~ –1 °C/s Figure 13: Reflow Profile Espressif Systems 47 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

12.4 Ultrasonic Vibration

Avoid exposing Espressif modules to vibration from ultrasonic equipment, such as ultrasonic welders or ultrasoniccleaners. Thisvibrationmayinduceresonanceinthein-modulecrystalandleadtoitsmalfunctionor even failure. As a consequence,the module may stop working or its performance may deteriorate. Espressif Systems 48 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

Related Documentation and Resources Related Documentation and Resources Related Documentation

• ESP32-S3SeriesDatasheet–Specifications of the ESP32-S3 hardware.
• ESP32-S3TechnicalReferenceManual–DetailedinformationonhowtousetheESP32-S3memoryandperiph- erals.
• ESP32-S3HardwareDesignGuidelines–GuidelinesonhowtointegratetheESP32-S3intoyourhardwareproduct.
• ESP32-S3SeriesSoCErrata–Descriptions of known errors in ESP32-S3 series of SoCs.
• Certificates https://espressif.com/en/support/documents/certificates
• ESP32-S3 Product/Process Change Notifications (PCN) https://espressif.com/en/support/documents/pcns?keys=ESP32-S3
• ESP32-S3 Advisories–Information on security, bugs, compatibility, component reliability. https://espressif.com/en/support/documents/advisories?keys=ESP32-S3
• Documentation Updates and Update Notification Subscription https://espressif.com/en/support/download/documents Developer Zone
• ESP-IDFProgrammingGuideforESP32-S3–ExtensivedocumentationfortheESP-IDFdevelopmentframework.
• ESP-IDF and other development frameworks on GitHub. https://github.com/espressif
• ESP32 BBS Forum–Engineer-to-Engineer(E2E)CommunityforEspressifproductswhereyoucanpostquestions, share knowledge, explore ideas, and help solve problems with fellow engineers. https://esp32.com/
• The ESP Journal–Best Practices, Articles, and Notes from Espressif folks. https://blog.espressif.com/
• See the tabsSDKs and Demos,Apps,Tools,AT Firmware. https://espressif.com/en/support/download/sdks-demos Products
• ESP32-S3 Series SoCs–Browse through all ESP32-S3 SoCs. https://espressif.com/en/products/socs?id=ESP32-S3
• ESP32-S3 Series Modules–Browse through all ESP32-S3-based modules. https://espressif.com/en/products/modules?id=ESP32-S3
• ESP32-S3 Series DevKits–Browse through all ESP32-S3-based devkits. https://espressif.com/en/products/devkits?id=ESP32-S3
• ESP Product Selector–FindanEspressifhardwareproductsuitableforyourneedsbycomparingorapplyingfilters. https://products.espressif.com/#/product-selector?language=en Contact Us
• Seethetabs Sales Questions,Technical Enquiries,Circuit Schematic & PCB Design Review,Get Samples (Online stores),Become Our Supplier,Comments & Suggestions. https://espressif.com/en/contact-us/sales-questions Espressif Systems 49 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

Revision History

Date Version Release notes 2024-11-14 v1.3

• Added flash memory program/erase cycle and data retention details in the table note of Table1ESP32-S3-MINI-1 and ESP32-S3-MINI-1U Series Comparisonandaddedareferencetothechiprevisioninformationinthe following note in Section1.2Series Comparison
• Updated Section1.3Applications
• RestructuredthepreviousSection Strapping PinsasSection 4Boot Con- figurations
• Added Section5.2Peripheral Description
• Divided SectionElectrical Characteristicsinto Section6 Electrical Char- acteristicsand Section7RF Characteristicswith updated formatting and wording
• DividedSection Physical Dimensions and PCB Land PatternintoSection 10Physical Dimensionsand11PCB Layout Recommendationsandadded Section11.2Module Placement for PCB Design
• Added the 3D model link of ESP32-S3-MINI-1U in Section11.1PCB Land Pattern
• Updated Figure13Reflow Profile
• Other minor updates to formatting and wording 2023-11-24 v1.2
• RemovedthetablenoteaboutESP32-S3FH4R2samplestatusfromTable 1ESP32-S3-MINI-1 and ESP32-S3-MINI-1U Series Comparisonandadded the second table note
• Updated Section4.1Chip Boot Mode Control
• Updated the module schematics in Section8Module Schematics
• Updated the physical dimensions figure in Section10.1Module Dimen- sions
• Updated the recommended PCB land pattern figure in Section11.1PCB Land Pattern
• Other minor updates Cont’d on next page Espressif Systems 50 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

Cont’d from previous page Date Version Release notes 2023-03-07 v1.1

• Remove module variants ESP32-S3-MINI-1-H4R2 and ESP32-S3-MINI- 1U-H4R2
• Update the descriptions and Table1 ESP32-S3-MINI-1 and ESP32-S3- MINI-1U Series Comparisonin Section1.2Series Comparison
• Update SectionStrapping Pins
• Update Section6.4 Current Consumption Characteristics
• UpdatetheminimumvalueofRFtransmitpowerinSection 7.2.1Bluetooth LE RF Transmitter (TX) Characteristics
• Update descriptions in Section9Peripheral Schematics
• Add descriptions in Section11.1PCB Land Pattern
• Update Section12.4
• Other minor updates 2022-05-24 v1.0
• Update information about flash and PSRAM on the title page and in Sec- tion1.1
• Add certification and test information
• Addinformationofnewmodulevariantsandtheirambientoperatingtem- perature versions in Table1
• Add the second note in Table2
• Update SectionStrapping Pins
• Add notes in Table13
• Update Bluetooth LE RF data
• Update module schematics in Section8
• Other minor updates 2021-11-16 v0.6 Overall update for chip revision 1 2021-03-30 v0.1 Preliminary release, for chip revision 0 Espressif Systems 51 Submit Documentation Feedback ESP32-S3-MINI-1 & MINI-1U Datasheet v1.3

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