ESP32-S2-MINI-2 ESPRESSIF | Alldatasheet
Document overview
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- PDF pages: 34
Technical content
Datasheet sections
- 1 Module Overview
- 1.1 Features
- 1.2 Description
- 1.3 Applications
- 2 Block Diagram
- 3 Pin Definitions
- 3.1 Pin Layout
- 3.2 Pin Description
- 3.3 Strapping Pins
- 3.4 Strapping Pins
- 3.4.1 Chip Boot Mode Control
- 3.4.2 VDD_SPI Voltage Control
- 3.4.3 ROM Messages Printing Control
- 4 Electrical Characteristics
- 4.1 Absolute Maximum Ratings
- 4.2 Recommended Operating Conditions
- 4.4 Current Consumption Characteristics
- 4.4.1 Current Consumption in Active Mode
- 4.4.2 Current Consumption in Other Modes
- 4.5 Wi-Fi Radio
- 4.5.1 Wi-Fi RF Standards
- 4.5.2 Wi-Fi RF Transmitter (TX) Specifications
- 4.5.3 Wi-Fi RF Receiver (RX) Specifications
- 5 Module Schematics
- 6 Peripheral Schematics
- 7 Physical Dimensions and PCB Land Pattern
- 8 Product Handling
- 8.1 Storage Conditions
- 8.2 Electrostatic Discharge (ESD)
- 8.3 Soldering Profile
- 8.3.1 Reflow Profile
- 8.4 Ultrasonic Vibration
Datasheet sections
Datasheet Version 1.1 2.4 GHz Wi-Fi (802.11 b/g/n) module Built around ESP32-S2 series of SoC (chip revision v1.0), Xtensa® single-core 32-bit LX7 micro- processor
4 MB flash and optional 2 MB PSRAM in chip package
37 GPIOs, rich set of peripherals
On-board PCB antenna or external antenna connector ESP32-S2-MINI-2 ESP32-S2-MINI-2U www.espressif.com
1 Module Overview
Note: Check the link or the QR code to make sure that you use the latest version of this document: https://www.espressif.com/documentation/esp32-s2-mini-2_esp32-s2-mini-2u_datasheet_en. pdf
1.1 Features
- ESP32-S2FH4 or ESP32-S2FN4R2 embedded, Xtensa® single-core 32-bit LX7 microprocessor, up to 240 MHz
- 128 KB ROM
- 320 KB SRAM
- 16 KB SRAM in RTC
- 4 MB flash
- 2 MB PSRAM (ESP32-S2FN4R2 only) Wi-Fi
- 802.11 b/g/n
- Bit rate: 802.11n up to 150 Mbps
- A-MPDU and A-MSDU aggregation
- 0.4 µs guard interval support
- Center frequency range of operating channel: 2412 ~ 2484 MHz Peripherals
- GPIO, SPI, LCD, UART , I2C, I2S, Camera interface, IR, pulse counter, LED PWM, TWAI® (compatible with ISO 11898-1, i.e. CAN Specification 2.0), full-speed USB OTG, ADC, DAC, touch sensor, temperature sensor, general-purpose timers, watchdog timers Note: * Please refer toESP32-S2 Series Datasheetfor detailed information about the module peripher- als. Integrated Components on Module
- 40 MHz crystal oscillator Antenna Options
- On-board PCB antenna (ESP32-S2-MINI-2)
- External antenna via a connector (ESP32-S2-MINI-2U) Operating Conditions
- Operating voltage/Power supply: 3.0~ 3.6 V
- Operating ambient temperature: – 85 °C version: –40~ 85 °C – 105 °C version: –40~ 105 °C (ESP32-S2-MINI-2-H4) and ESP32-S2-MINI-2U-H4 only) Certification
- Green certification: RoHS/REACH
- RF certification: Seecertificates Test
- HTOL/HTSL/uHAST/TCT/ESD/Latch-up Espressif Systems 2 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.1
1.2 Description
ESP32-S2-MINI-2 and ESP32-S2-MINI-2U are two powerful, generic Wi-Fi MCU modules that have a rich set of peripherals. They are an ideal choice for a wide variety of application scenarios related to Internet of Things (IoT), such as wearable electronics and smart home. ESP32-S2-MINI-2 comes with a PCB antenna (ANT). ESP32-S2-MINI-2U comes with an external antenna connector (CONN). A wide selection of module variants are available for customers as shown in T able1 and T able2. Table 1: ESP32-S2-MINI-2 (ANT) Series Comparison1 Ambient Temp.2 Size3 Ordering Code Flash PSRAM (°C) (mm) ESP32-S2-MINI-2-N4
4 MB (Quad SPI)4
— –40 ∼ 85 ESP32-S2-MINI-2-N4R2 2 MB (Quad SPI)5 –40 ∼ 85 1 This table shares the same notes presented in T able2 below. Table 2: ESP32-S2-MINI-2U (CONN) Series Comparison Ambient Temp.2 Size3 Ordering Code Flash PSRAM (°C) (mm) ESP32-S2-MINI-2U-N4 — –40 ∼ 85 15.4 × 15.4 × 2.4ESP32-S2-MINI-2U-H4 — –40 ∼ 105 ESP32-S2-MINI-2U-N4R2 2 MB (Quad SPI)5 –40 ∼ 85
2 Ambient temperature specifies the recommended temperature range of the environment immediately out-
side the Espressif module. 3 For details, refer to Section7 .1Physical Dimensions. 4 The flash is integrated in the chip’s package. 5 The PSRAM is integrated in the chip’s package. In this datasheet unless otherwise stated, ESP32-S2-MINI-2 refers to all variants of ESP32-S2-MINI-2, whereas ESP32-S2-MINI-2U refers to all variants of ESP32-S2-MINI-2U. At the core of the modules is ESP32-S2 series. ESP32-S2 series of chips has an Xtensa® 32-bit LX7 CPU that operates at up to 240 MHz. It has a low-power co-processor that can be used instead of the CPU to save power while performing tasks that do not require much computing power, such as monitoring of peripherals. ESP32-S2 series integrates a rich set of peripherals, ranging from SPI, I2S, UART , I2C, LED PWM, TWAI®, LCD, Camera interface, ADC, DAC, touch sensor, temperature sensor, 43 GPIOs, full-speed USB On-The-Go (OTG) interface to enable USB communication, etc. For more information on ESP32-S2 series of SoCs, please refer toESP32-S2 Series Datasheetand ESP32-S2 Series SoC Errata. Information about ESP-IDF release that supports a specific chip revision is provided inESP Product Selector. Espressif Systems 3 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.1
1.3 Applications
- Generic Low-power IoT Sensor Hub
- Generic Low-power IoT Data Loggers
- Cameras for Video Streaming
- Over-the-top (OTT) Devices
- USB Devices
- Speech Recognition
- Image Recognition
- Mesh Network
- Home Automation
- Smart Home Control Panel
- Smart Building
- Industrial Automation
- Smart Agriculture
- Audio Applications
- Health Care Applications
- Wi-Fi-enabled Toys
- Wearable Electronics
- Retail & Catering Applications
- Smart POS Machines Espressif Systems 4 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.1
1 ESP32-S2-MINI-2 (ANT) Series Comparison 1 3
2 ESP32-S2-MINI-2U (CONN) Series Comparison 3
3 Pin Definitions 11
4 Default Configuration of Strapping Pins 13
5 Description of Timing Parameters for the Strapping Pins 14
6 Chip Boot Mode Control 14
7 VDD_SPI Voltage Control 15
8 ROM Messages Printing Control 15
9 Absolute Maximum Ratings 16
10 Recommended Operating Conditions 16
11 DC Characteristics (3.3 V, 25 °C) 16
12 RF Current Consumption in Active Mode 17
13 Current Consumption in Modem-sleep Mode 17
14 Current Consumption in Low-Power Modes 18
15 Wi-Fi RF Standards 18
16 TX Power with Spectral Mask and EVM Meeting 802.11 Standards 19
17 TX EVM Test 19
18 RX Sensitivity 19
19 Maximum RX Level 20
20 RX Adjacent Channel Rejection 21
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1 ESP32-S2-MINI-2 Block Diagram 9
2 ESP32-S2-MINI-2U Block Diagram 9
3 ESP32-S2-MINI-2 Pin Layout (Top View) 10
4 Visualization of Timing Parameters for the Strapping Pins 14
5 ESP32-S2-MINI-2 Schematics 22
6 ESP32-S2-MINI-2U Schematics 23
7 Peripheral Schematics 24
8 ESP32-S2-MINI-2 Physical Dimensions 25
9 ESP32-S2-MINI-2U Physical Dimensions 26
10 ESP32-S2-MINI-2 Recommended PCB Land Pattern 27
11 ESP32-S2-MINI-2U Recommended PCB Land Pattern 28
12 Dimensions of External Antenna Connector 29
13 Reflow Profile 30
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2 Block Diagram
FLASH(QSPI)ESP32-S2FH4ESP32-S2FN4R2RF Matching40 MHzCrystalESP32-S2-MINI-2GPIOsAntennaPSRAM(opt.)(QSPI)3V3EN FLASH(QSPI)ESP32-S2FH4ESP32-S2FN4R240 MHzCrystalESP32-S2-MINI-2UGPIOsPSRAM(opt.)(QSPI)3V3ENRF MatchingAntenna Figure 1: ESP32-S2-MINI-2 Block Diagram FLASH(QSPI)ESP32-S2FH4ESP32-S2FN4R2RF Matching40 MHzCrystalESP32-S2-MINI-2GPIOsAntennaPSRAM(opt.)(QSPI)3V3EN FLASH(QSPI)ESP32-S2FH4ESP32-S2FN4R240 MHzCrystalESP32-S2-MINI-2UGPIOsPSRAM(opt.)(QSPI)3V3ENRF MatchingAntenna Figure 2: ESP32-S2-MINI-2U Block Diagram Espressif Systems 9 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.1
3 Pin Definitions
3.1 Pin Layout
The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to scale, please refer to Figure7 .1Physical Dimensions. The pin layout is applicable for ESP32-S2-MINI-2 and ESP32-S2-MINI-2U, but the latter has no keepout zone. Pin 1Pin 2Pin 3Pin 4Pin 5Pin 6Pin 7Pin 8Pin 9Pin 10Pin 11Pin 12Pin 13Pin 14Pin 15 GNDGND3V3IO0IO1IO2IO3IO4IO5IO6IO7IO8IO9IO10IO11Pin 63GNDIO12Pin 16Pin 17Pin 18Pin 19Pin 20Pin 21Pin 22Pin 23Pin 24Pin 25Pin 26Pin 27Pin 28Pin 29Pin 30Pin 64GNDPin 31 IO13IO14IO15IO16IO17IO18IO19IO20IO21IO26NCIO33IO34GNDPin 32Pin 33Pin 34Pin 35Pin 36Pin 37Pin 38Pin 39Pin 40Pin 41Pin 42Pin 43Pin 44Pin 45Pin 65GNDPin 62GND Pin 46Pin 47Pin 48Pin 49Pin 50Pin 51Pin 52Pin 53Pin 54Pin 55Pin 56Pin 57Pin 58Pin 59Pin 60Pin 61GNDGNDGNDGNDGNDGNDGNDGNDGNDIO35IO36IO37IO38IO39IO40IO41IO42TXD0RXD0IO45GNDGNDIO46ENGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDKeepout Zone Figure 3: ESP32-S2-MINI-2 Pin Layout (Top View)
3.2 Pin Description
The module has 65 pins. See pin definitions in T able3 Pin Definitions. For peripheral pin configurations, please refer toESP32-S2 Series Datasheet> SectionPeripheral Pin Configurations. Espressif Systems 10 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.1
Table 3: Pin Definitions Name No. Type1 Function GND 1, 2, 30, 42, 43, 46-65 P Ground 3V3 3 P Power supply IO0 4 I/O/T RTC_GPIO0, GPIO0 IO1 5 I/O/T RTC_GPIO1, GPIO1, TOUCH1, ADC1_CH0 IO2 6 I/O/T RTC_GPIO2, GPIO2, TOUCH2, ADC1_CH1 IO3 7 I/O/T RTC_GPIO3, GPIO3, TOUCH3, ADC1_CH2 IO4 8 I/O/T RTC_GPIO4, GPIO4, TOUCH4, ADC1_CH3 IO5 9 I/O/T RTC_GPIO5, GPIO5, TOUCH5, ADC1_CH4 IO6 10 I/O/T RTC_GPIO6, GPIO6, TOUCH6, ADC1_CH5 IO7 11 I/O/T RTC_GPIO7 , GPIO7 , TOUCH7 , ADC1_CH6 IO8 12 I/O/T RTC_GPIO8, GPIO8, TOUCH8, ADC1_CH7 IO9 13 I/O/T RTC_GPIO9, GPIO9, TOUCH9, ADC1_CH8, FSPIHD IO10 14 I/O/T RTC_GPIO10, GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4 IO11 15 I/O/T RTC_GPIO11, GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5 IO12 16 I/O/T RTC_GPIO12, GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6 IO13 17 I/O/T RTC_GPIO13, GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7 IO14 18 I/O/T RTC_GPIO14, GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS IO15 19 I/O/T RTC_GPIO15, GPIO15, U0RTS, ADC2_CH4, XTAL_32K_P IO16 20 I/O/T RTC_GPIO16, GPIO16, U0CTS, ADC2_CH5, XTAL_32K_N IO17 21 I/O/T RTC_GPIO17 , GPIO17 , U1TXD, ADC2_CH6, DAC_1 IO18 22 I/O/T RTC_GPIO18, GPIO18, U1RXD, ADC2_CH7 , DAC_2, CLK_OUT3 IO19 23 I/O/T RTC_GPIO19, GPIO19, U1RTS, ADC2_CH8, CLK_OUT2, USB_D- IO20 24 I/O/T RTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1, USB_D+ IO21 25 I/O/T RTC_GPIO21, GPIO21 IO26 2 26 I/O/T SPICS1, GPIO26 NC 27 — NC IO33 28 I/O/T SPIIO4, GPIO33, FSPIHD IO34 29 I/O/T SPIIO5, GPIO34, FSPICS0 IO35 31 I/O/T SPIIO6, GPIO35, FSPID IO36 32 I/O/T SPIIO7 , GPIO36, FSPICLK IO37 33 I/O/T SPIDQS, GPIO37 , FSPIQ IO38 34 I/O/T GPIO38, FSPIWP IO39 35 I/O/T MTCK, GPIO39, CLK_OUT3 IO40 36 I/O/T MTDO, GPIO40, CLK_OUT2 IO41 37 I/O/T MTDI, GPIO41, CLK_OUT1 IO42 38 I/O/T MTMS, GPIO42 TXD0 39 I/O/T U0TXD, GPIO43, CLK_OUT1 RXD0 40 I/O/T U0RXD, GPIO44, CLK_OUT2 IO45 41 I/O/T GPIO45 Cont’d on next page Espressif Systems 11 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.1
Table 3 – cont’d from previous page Name No. Type1 Function IO46 44 I GPIO46 EN 45 I High: on, enables the chip. Low: off, the chip powers off. Note: Do not leave the EN pin floating. 1 P: power supply; I: input; O: output; T: high impedance.
2 IO26 is used by the embedded PSRAM on the ESP32-S2-MINI-2-N4R2 and ESP32-S2-MINI-2U-N4R2
modules, and cannot be used for other purposes. Espressif Systems 12 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.1
3.3 Strapping Pins
Note: The content below is excerpted from SectionStrapping Pinsin ESP32-S2 Series Datasheet. For the strapping pin mapping between the chip and modules, please refer to Chapter5 Module Schematics.
3.4 Strapping Pins
Note: The content below is excerpted fromESP32-S2 Series Datasheet> SectionStrapping Pins. For the strapping pin mapping between the chip and modules, please refer to Chapter5 Module Schematics. At each startup or reset, a chip requires some initial configuration parameters, such as in which boot mode to load the chip, voltage of flash memory, etc. These parameters are passed over via the strapping pins. After reset, the strapping pins operate as regular IO pins. The parameters controlled by the given strapping pins at chip reset are as follows:
- Chip boot mode– GPIO0 and GPIO46
- VDD_SPI voltage– GPIO45
- ROM messages printing– GPIO46 GPIO0, GPIO45, and GPIO46 are connected to the chip’s internal weak pull-up/pull-down resistors at chip reset. These resistors determine the default bit values of the strapping pins. Also, these resistors determine the bit values if the strapping pins are connected to an external high-impedance circuit. Table 4: Default Configuration of Strapping Pins Strapping Pin Default Configuration Bit Value GPIO0 Pull-up 1 GPIO45 Pull-down 0 GPIO46 Pull-down 0 To change the bit values, the strapping pins should be connected to external pull-down/pull-up resistances. If the ESP32-S2 is used as a device by a host MCU, the strapping pin voltage levels can also be controlled by the host MCU. All strapping pins have latches. At system reset, the latches sample the bit values of their respective strapping pins and store them until the chip is powered down or shut down. The states of latches cannot be changed in any other way. It makes the strapping pin values available during the entire chip operation, and the pins are freed up to be used as regular IO pins after reset. Regarding the timing requirements for the strapping pins, there are such parameters assetup timeand hold time. For more information, see T able5 and Figure4. Espressif Systems 13 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.1
Table 5: Description of Timing Parameters for the Strapping Pins Parameter Description Min (ms) tSU Setup timeis the time reserved for the power rails to stabilize be- fore the CHIP_PU pin is pulled high to activate the chip. 0 tH Hold timeis the time reserved for the chip to read the strapping pin values after CHIP_PU is already high and before these pins start operating as regular IO pins. Strapping pin VIL_nRST VIH tSU tH CHIP_PU Figure 4: Visualization of Timing Parameters for the Strapping Pins
3.4.1 Chip Boot Mode Control
GPIO0 and GPIO46 control the boot mode after the reset is released. See T able6 Chip Boot Mode Control. Table 6: Chip Boot Mode Control Boot Mode GPIO0 GPIO46 Default configuration 1 (Pull-up) 0 (Pull-down) SPI Boot(default) 1 Any value Download Boot 0 0 Invalid combination1 0 1
1 This combination triggers unexpected behavior
and should be avoided.
3.4.2 VDD_SPI Voltage Control
Depending on the value of EFUSE_VDD_SPI_FORCE, the voltage can be controlled in two ways. Espressif Systems 14 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.1
Table 7: VDD_SPI Voltage Control EFUSE_VDD_SPI_FORCE GPIO45 eFuse 1 Voltage VDD_SPI power source2 0 0 Ignored 3.3 V VDD3P3_RTC_IO via RSPI 1 1.8 V Flash Voltage Regulator 1 Ignored 0 1.8 V Flash Voltage Regulator 1 3.3 V VDD3P3_RTC_IO via RSPI 1 eFuse: EFUSE_VDD_SPI_ TIEH
2 See ESP32-S2 Series Datasheet> SectionPower Scheme
3.4.3 ROM Messages Printing Control
During boot process the messages by the ROM code can be printed to:
- (Default) U0TXD pin. For this, EFUSE_UART _PRINT _CONTROL should be 0.
- DAC_1 pin. For this, EFUSE_UART _PRINT _CONTROL should be 1. EFUSE_UART _PRINT _CONTROL and GPIO46 control ROM messages printing as shown in T able8 ROM Messages Printing Control. Table 8: ROM Messages Printing Control eFuse1 GPIO46 ROM Messages Printing
0 Ignored Always enabled
1 Disabled
1 Enabled
3 Ignored Always disabled
1 eFuse: EFUSE_UART _PRINT _CONTROL Espressif Systems 15 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.1
4 Electrical Characteristics
4.1 Absolute Maximum Ratings
Stresses above those listed in T able9 Absolute Maximum Ratingsmay cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under T able10 Recommended Operating Conditionsis not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Table 9: Absolute Maximum Ratings Symbol Parameter Min Max Unit VDD33 Power supply voltage –0.3 3.6 V TSTORE Storage temperature –40 105 °C
4.2 Recommended Operating Conditions
Table 10: Recommended Operating Conditions Symbol Parameter Min Typ Max Unit VDD33 Power supply voltage 3.0 3.3 3.6 V IV DD Current delivered by external power supply 0.5 — — A TA Operating ambient temperature 85 °C version –40 — 85 °C105 °C version 105 4.3 DC Characteristics (3.3 V, 25 °C) Table 11: DC Characteristics (3.3 V, 25 °C) Symbol Parameter Min Typ Max Unit CIN Pin capacitance — 2 — pF VIH High-level input voltage 0.75 × VDD1 — VDD1 + 0.3 V VIL Low-level input voltage –0.3 — 0.25 × VDD1 V IIH High-level input current — — 50 nA IIL Low-level input current — — 50 nA VOH2 High-level output voltage 0.8 × VDD1 — — V VOL2 Low-level output voltage — — 0.1 × VDD1 V IOH High-level source current (VDD1 = 3.3 V, VOH >= 2.64 V, PAD_DRIVER = 3) — 40 — mA IOL Low-level sink current (VDD1 = 3.3 V, VOL =
0.495 V, PAD_DRIVER = 3) — 28 — mA
RPU Pull-up resistor — 45 — kΩ RPD Pull-down resistor — 45 — kΩ VIH_nRST Chip reset release voltage 0.75 × VDD1 — VDD1 + 0.3 V VIL_nRST Chip reset voltage –0.3 — 0.25 × VDD1 V Espressif Systems 16 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.1
1 VDD is the I/O voltage for pins of a particular power domain. 2 VOH and VOL are measured using high-impedance load.
4.4 Current Consumption Characteristics
Owing to the use of advanced power-management technologies, the module can switch between different power modes. For details on different power modes, please refer to SectionRTC and Low-Power Management in ESP32-S2 Series Datasheet.
4.4.1 Current Consumption in Active Mode
Table 12: RF Current Consumption in Active Mode Work mode Description Peak (mA) Active (RF working) TX 802.11b, 20 MHz, 1 Mbps, @19 dBm 302 802.11g, 20 MHz, 54 Mbps, @17 .5 dBm 264 802.11n, 20 MHz, MCS7 , @16.5 dBm 257 802.11n, 40 MHz, MCS7 , @16.5 dBm 267 RX 802.11b/g/n, 20 MHz 77 802.11n, 40 MHz 81 1 The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient temperature at the RF port. All transmitters’ measurements are based on 100% duty cycle.
2 The current consumption figures in RX mode are for cases where the peripherals are dis-
abled and the CPU idle. Note: The content below is excerpted fromSection Power Consumption in Other Modesin ESP32-S2 Series Datasheet.
4.4.2 Current Consumption in Other Modes
The measurements below are applicable to ESP32-S2, ESP32-S2FH2, and ESP32-S2FH4. Since ESP32-S2FN4R2 and ESP32-S2R2 come with in-package PSRAM, their current consumption might be higher. Table 13: Current Consumption in Modem-sleep Mode Typ Mode CPU Frequency (MHz) Description All Peripherals Clocks Disabled (mA) All Peripherals Clocks Enabled (mA)1 Modem-sleep2,3 240 CPU is idle 20.0 28.0 CPU is running 23.0 32.0 160 CPU is idle 14.0 21.0 Cont’d on next page Espressif Systems 17 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.1
Table 13 – cont’d from previous page Typ Mode CPU Frequency (MHz) Description All Peripherals Clocks Disabled (mA) All Peripherals Clocks Enabled (mA)1 CPU is running 16.0 24.0 80 CPU is idle 10.5 18.4 CPU is running 12.0 20.0 1 In practice, the current consumption might be different depending on which peripherals are enabled. 2 In Modem-sleep mode, Wi-Fi is clock gated. 3 In Modem-sleep mode, the consumption might be higher when accessing flash. For a flash rated at 80 Mbit/s, in SPI 2-line mode the consumption is 10 mA. Table 14: Current Consumption in Low-Power Modes Work mode Description Typ (µA) Light-sleep1 VDD_SPI and Wi-Fi are powered down, and all GPIOs are high-impedance750 Deep-sleep The ULP co-processor is powered on2 ULP-FSM 170 ULP-RISC-V 190 ULP sensor-monitored pattern3 22 RTC timer + RTC memory 25 RTC timer only 20 Power off CHIP_PU is set to low level, the chip is powered off 1
1 In Light-sleep mode, with all related SPI pins pulled up, the current consumption of the embedded
PSRAM is 140µA. Chip variants with in-package PSRAM include ESP32-S2FN4R2 and ESP32-S2R2.
2 During Deep-sleep, when the ULP co-processor is powered on, peripherals such as GPIO and I2C
are able to operate.
3 The “ULP sensor-monitored pattern” refers to the mode where the ULP coprocessor or the sensor
works periodically. When touch sensors work with a duty cycle of 1%, the typical current consump- tion is 22µA.
4.5 Wi-Fi Radio
4.5.1 Wi-Fi RF Standards
Table 15: Wi-Fi RF Standards Name Description Center frequency range of operating channel1 2412 ~ 2484 MHz Wi-Fi wireless standard IEEE 802.11b/g/n Data rate 20 MHz 802.11b: 1, 2, 5.5 and 11 Mbps 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps 802.11n: MCS0-7 , 72.2 Mbps (Max) 40 MHz 802.11n: MCS0-7 , 150 Mbps (Max) Antenna type PCB antenna, external antenna connector Espressif Systems 18 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.1
1 Device should operate in the center frequency range allocated by regional regulatory authorities. T arget center frequency range is configurable by software. 2 For the modules that use external antenna connectors, the output impedance is 50Ω. For other modules without external antenna connectors, the output impedance is irrelevant.
4.5.2 Wi-Fi RF Transmitter (TX) Specifications
T arget TX power is configurable based on device or certification requirements. The default characteristics are provided in T able16. Table 16: TX Power with Spectral Mask and EVM Meeting 802.11 Standards Min Typ MaxRate (dBm) (dBm) (dBm) 802.11b, 1 Mbps — 19.0 — 802.11b, 11 Mbps — 19.0 — 802.11g, 6 Mbps — 17 .5 — 802.11g, 54 Mbps — 17 .5 — 802.11n, HT20, MCS0 — 17 .5 — 802.11n, HT20, MCS7 — 16.5 — 802.11n, HT40, MCS0 — 17 .5 — 802.11n, HT40, MCS7 — 16.5 — Table 17: TX EVM Test Min Typ SL1 Rate (dB) (dB) (dB) 802.11b, 1 Mbps, @19 dBm — –25.0 –10 802.11b, 11 Mbps, @19 dBm — –25.0 –10 802.11g, 6 Mbps, @17 .5 dBm — –25.0 –5 802.11g, 54 Mbps, @17 .5 dBm — –28.5 –25 802.11n, HT20, MCS0, @17 .5 dBm — –27 .0 –5 802.11n, HT20, MCS7 , @16.5 dBm — –30.0 –27 802.11n, HT40, MCS0, @17 .5 dBm — –27 .0 –5 802.11n, HT40, MCS7 , @16.5 dBm — –30.0 –27 1 SL stands for standard limit value.
4.5.3 Wi-Fi RF Receiver (RX) Specifications
Table 18: RX Sensitivity Min Typ MaxRate (dBm) (dBm) (dBm) 802.11b, 1 Mbps — –96.5 — Cont’d on next page Espressif Systems 19 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.1
Table 18 – cont’d from previous page Min Typ MaxRate (dBm) (dBm) (dBm) 802.11b, 2 Mbps — –94.0 — 802.11b, 11 Mbps — –88.0 — 802.11g, 6 Mbps — –92.0 — 802.11g, 9 Mbps — –90.5 — 802.11g, 12 Mbps — –89.0 — 802.11g, 18 Mbps — –87 .0 — 802.11g, 24 Mbps — –84.0 — 802.11g, 36 Mbps — –80.0 — 802.11g, 48 Mbps — –76.0 — 802.11g, 54 Mbps — –74.5 — 802.11n, HT20, MCS0 — –91.5 — 802.11n, HT20, MCS1 — –88.5 — 802.11n, HT20, MCS2 — –86.0 — 802.11n, HT20, MCS3 — –83.0 — 802.11n, HT20, MCS4 — –79.0 — 802.11n, HT20, MCS5 — –75.0 — 802.11n, HT20, MCS6 — –73.5 — 802.11n, HT20, MCS7 — –72.0 — 802.11n, HT40, MCS0 — –89.0 — 802.11n, HT40, MCS1 — –86.0 — 802.11n, HT40, MCS2 — –83.5 — 802.11n, HT40, MCS3 — –79.5 — 802.11n, HT40, MCS4 — –76.0 — 802.11n, HT40, MCS5 — –72.0 — 802.11n, HT40, MCS6 — –70.5 — 802.11n, HT40, MCS7 — –69.5 — Table 19: Maximum RX Level Min Typ MaxRate (dBm) (dBm) (dBm) 802.11b, 1 Mbps — 5 — 802.11b, 11 Mbps — 5 — 802.11g, 6 Mbps — 5 — 802.11g, 54 Mbps — 5 — 802.11n, HT20, MCS0 — 5 — 802.11n, HT20, MCS7 — 5 — 802.11n, HT40, MCS0 — 5 — 802.11n, HT40, MCS7 — 5 — Espressif Systems 20 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.1
Table 20: RX Adjacent Channel Rejection Min Typ MaxRate (dB) (dB) (dB) 802.11b, 1 Mbps — 35 — 802.11b, 11 Mbps — 35 — 802.11g, 6 Mbps — 31 — 802.11g, 54 Mbps — 14 — 802.11n, HT20, MCS0 — 31 — 802.11n, HT20, MCS7 — 13 — 802.11n, HT40, MCS0 — 19 — 802.11n, HT40, MCS7 — 8 — Espressif Systems 21 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.1
5 Module Schematics
This is the reference design of the module. D D C C B B A A The values of C1 and C4 vary with the selection of the crystal. The value of R4 varies with the actual PCB board. ESP32-S2FN4R2 ESP32-S2FH4 The values of C11, L2 and C12 vary with the actual PCB board. ESP32-S2-MINI-2(pin-out) GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 GPIO33 GPIO34 GPIO35 GPIO36 GPIO37 GPIO38 GPIO26 RF_ANT GPIO39 GPIO40 GPIO41 GPIO42 U0RXD GPIO45 GPIO46 CHIP_PU U0TXD GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 GPIO26 GPIO33 GPIO34 GPIO35 GPIO36 GPIO37 GPIO38 GPIO39 GPIO40 GPIO41 GPIO42 U0TXD U0RXD GPIO45 GPIO46 CHIP_PU LNA_IN VDD33 GND VDD33 GND GND GND GNDGND GND GND VDD33 VDD33 GND GNDGND VDD33 GND GND VDD33 GND VDD33 GND GND GND GND GND GND GND VDD_SPI GND GND VDD33 Title Size Page Name Rev Date: Sheet o f Proprietary <02_ESP32-S2-MINI-2> V1.0 <ESP32-S2-MINI-2> 2 2Friday, February 25, 2022 Title Size Page Name Rev Date: Sheet o f Proprietary <02_ESP32-S2-MINI-2> V1.0 <ESP32-S2-MINI-2> 2 2Friday, February 25, 2022 Title Size Page Name Rev Date: Sheet o f Proprietary <02_ESP32-S2-MINI-2> V1.0 <ESP32-S2-MINI-2> 2 2Friday, February 25, 2022 ESP32-S2-MINI-2 GND1 3V33 IO04 IO15 IO26 IO37 IO48 IO59 IO610 IO711 IO812 IO913 IO1014 IO1115 GND 42 TXD0 39RXD0 40 IO42 38 IO41 37 IO40 36 IO39 35 IO38 34 IO37 33 IO36 32 IO35 31 IO13 17 IO14 18 IO15 19 IO16 20 IO33 28 IO34 29 GND63 IO12 16 IO46 44 IO45 41 IO17 21 IO18 22 IO19 23 IO20 24 IO21 25 IO26 26 NC 27 EPAD 61 GND2 GND62 GND 30 GND 64 GND 65 GND 43 EN 45 GND 46 GND 47 GND 48 GND 49 GND 50 GND 51 GND 52 GND 53 GND 54 GND 55 GND 56 GND 57 GND 58 GND 59 GND 60 TBD R3 499 C14 1uF C13 0.1uF VDDA1 LNA_IN2 VDD3P33 VDD3P34 GPIO05 GPIO16 GPIO27 GPIO38 GPIO49 GPIO510 GPIO611 GPIO712 GPIO10 15 GPIO11 16 GPIO12 17 GPIO13 18 GPIO14 19 XTAL_32K_P 21 VDD3P3_RTC 20 XTAL_32K_N 22 DAC_1 23 DAC_2 24 GPIO19 25 GPIO20 26 VDD_SPI 30 SPICS1 29 SPIWP 32SPICS0 33 SPIQ 35SPID 36 SPICLK 34 GPIO33 37 GND 57 GPIO34 38GPIO35 39 MTCK 43 GPIO46 55 VDDA 51 XTAL_N 52 XTAL_P 53 MTMS 47 MTDO 44 U0TXD 48 VDD3P3_CPU 45 CHIP_PU 56 VDDA 54 MTDI 46 GPIO813 GPIO914 VDD3P3_RTC_IO 27 GPIO21 28 SPIHD 31 GPIO36 40GPIO37 41GPIO38 42 U0RXD 49 GPIO45 50 C9 100pF 1uF L1 2.0nH 10uF 100pF 40MHz(±10ppm) XIN 1 GND 2XOUT 3 GND 4 C10 0.1uF C12 TBD ESD 1uF L2 TBD ANT1 PCB_ANT TBD C11 TBD C16 0.1uF C15 0.1uF R4 0 0.1uF 0.1uF Figure 5: ESP32-S2-MINI-2 Schematics Espressif Systems 22 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.1
The values of C11, L2 and C12 vary with the actual PCB board. The values of C1 and C4 vary with the selection of the crystal. The value of R4 varies with the actual PCB board. ESP32-S2FN4R2 ESP32-S2FH4 ESP32-S2-MINI-2U(pin-out) GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 GPIO33 GPIO34 GPIO35 GPIO36 GPIO37 GPIO38 GPIO26 RF_ANT GPIO39 GPIO40 GPIO41 GPIO42 U0RXD GPIO45 GPIO46 CHIP_PU U0TXD GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 GPIO26 GPIO33 GPIO34 GPIO35 GPIO36 GPIO37 GPIO38 GPIO39 GPIO40 GPIO41 GPIO42 U0TXD U0RXD GPIO45 GPIO46 CHIP_PU LNA_IN GND VDD33 GND GND GND GNDGND GND GND VDD33 VDD33 GND GNDGND VDD33 GND VDD33 GND VDD33GND GND GND GND GND GNDGND VDD_SPI GND GND GND VDD33 VDD33 Title Size Page Name Rev Date: Sheet o f Confidential and Proprietary <02_ESP32-S2-MINI-1U> <ESP32-S2-MINI-1U> 2 2Monday, July 18, 2022 1.1 Title Size Page Name Rev Date: Sheet o f Confidential and Proprietary <02_ESP32-S2-MINI-1U> <ESP32-S2-MINI-1U> 2 2Monday, July 18, 2022 1.1 Title Size Page Name Rev Date: Sheet o f Confidential and Proprietary <02_ESP32-S2-MINI-1U> <ESP32-S2-MINI-1U> 2 2Monday, July 18, 2022 1.1 ESP32-S2-MINI-2U GND1 3V33 IO04 IO15 IO26 IO37 IO48 IO59 IO610 IO711 IO812 IO913 IO1014 IO1115 GND 42 TXD0 39RXD0 40 IO42 38 IO41 37 IO40 36 IO39 35 IO38 34 IO37 33 IO36 32 IO35 31 IO13 17 IO14 18 IO15 19 IO16 20 IO33 28 IO34 29 GND63 IO12 16 IO46 44 IO45 41 IO17 21 IO18 22 IO19 23 IO20 24 IO21 25 IO26 26 NC 27 EPAD 61 GND2 GND62 GND 30 GND 64 GND 65 GND 43 EN 45 GND 46 GND 47 GND 48 GND 49 GND 50 GND 51 GND 52 GND 53 GND 54 GND 55 GND 56 GND 57 GND 58 GND 59 GND 60 TBD R3 499 C14 1uF VDDA1 LNA_IN2 VDD3P33 VDD3P34 GPIO05 GPIO16 GPIO27 GPIO38 GPIO49 GPIO510 GPIO611 GPIO712 GPIO10 15 GPIO11 16 GPIO12 17 GPIO13 18 GPIO14 19 XTAL_32K_P 21 VDD3P3_RTC 20 XTAL_32K_N 22 DAC_1 23 DAC_2 24 GPIO19 25 GPIO20 26 VDD_SPI 30 SPICS1 29 SPIWP 32SPICS0 33 SPIQ 35SPID 36 SPICLK 34 GPIO33 37 GND 57 GPIO34 38GPIO35 39 MTCK 43 GPIO46 55 VDDA 51 XTAL_N 52 XTAL_P 53 MTMS 47 MTDO 44 U0TXD 48 VDD3P3_CPU 45 CHIP_PU 56 VDDA 54 MTDI 46 GPIO813 GPIO914 VDD3P3_RTC_IO 27 GPIO21 28 SPIHD 31 GPIO36 40GPIO37 41GPIO38 42 U0RXD 49 GPIO45 50 C13 0.1uF 0.1uF 10uF L1 2.0nH 100pF C10 0.1uF 40MHz(±10ppm) XIN 1 GND 2XOUT 3 GND 4 ESD C12 TBD L2 TBD 1uF ANT1 CONN TBD C11 TBD C16 0.1uF C15 0.1uF R4 0 1uF 0.1uF 0.1uF Figure 6: ESP32-S2-MINI-2U Schematics Espressif Systems 23 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.1
6 Peripheral Schematics
This is the typical application circuit of the module connected with peripheral components (for example, power supply, antenna, reset button, JTAG interface, and UART interface). D D C C B B A A NC: No component. X1: ESR = Max. 70 KΩ EN IO4 IO5 IO6 IO7 IO14 IO8 IO13 IO12 IO17 EN IO46 IO45 TXD0 RXD0 TDI TDO TCK IO42 TMS IO39 IO41 IO40 IO38 IO37 IO36 IO35 IO15 IO16 IO18 IO9 IO10 IO11 IO3 IO2 IO1 IO0 IO34 IO33 IO26 IO21 IO19 IO20 USB_DW USB_D+ GND VDD33 GND GND GND GND GND VDD33 GND GND GNDGND GND GND TBD R6 0 SW1 R1 TBD JP4 Boot Option 1 1 2 2 R7 0 32.768kHz(NC) 1 2 JP3 USB OTG 11 22 R2 NC JP1 UART R4 0 0.1uF R3 0(NC) JP2 JTAG C7 12pF(NC) ESP32WS2WMINIW2/ESP32WS2WMINIW2U GND1 3V33 IO04 IO15 IO26 IO37 IO48 IO59 IO610 IO711 IO812 IO913 IO1014 IO1115 GND 42 TXD0 39RXD0 40 IO42 38 IO41 37 IO40 36 IO39 35 IO38 34 IO37 33 IO36 32 IO35 31 IO13 17 IO14 18 IO15 19 IO16 20 IO33 28 IO34 29 GND63 IO12 16 IO46 44 IO45 41 IO17 21 IO18 22 IO19 23 IO20 24 IO21 25 IO26 26 NC 27 EPAD 61 GND2 GND62 GND 30 GND 64 GND 65 GND 43 EN 45 GND 46 GND 47 GND 48 GND 49 GND 50 GND 51 GND 52 GND 53 GND 54 GND 55 GND 56 GND 57 GND 58 GND 59 GND 60 C4 12pF(NC) R5 0(NC) C8 0.1uF TBD 22uF C2 TBD Figure 7: Peripheral Schematics
- Soldering the EPAD to the ground of the base board is not a must, however, it can optimize thermal performance. If you choose to solder it, please apply the correct amount of soldering paste. Too much soldering paste may increase the gap between the module and the baseboard. As a result, the adhesion between other pins and the baseboard may be poor.
- To ensure that the power supply to the ESP32-S2 chip is stable during power-up, it is advised to add an RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and C = 1µF. However, specific parameters should be adjusted based on the power-up timing of the module and the power-up and reset sequence timing of the chip. For ESP32-S2’s power-up and reset sequence timing diagram, please refer toESP32-S2 Series Datasheet> SectionPower Scheme. Espressif Systems 24 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.1
7 Physical Dimensions and PCB Land Pattern
7 .1Physical Dimensions 4.5 5.05 Figure 8: ESP32-S2-MINI-2 Physical Dimensions Espressif Systems 25 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.1
4.5 Figure 9: ESP32-S2-MINI-2U Physical Dimensions Note: For information about tape, reel, and product marking, please refer toEspressif Module Packaging Information. Espressif Systems 26 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.1
7 .2 Recommended PCB Land Pattern This section provides the following resources for your reference:
- Figures for recommended PCB land patterns with all the dimensions needed for PCB design. See Figure
10 ESP32-S2-MINI-2 Recommended PCB Land Patternand Figure11 ESP32-S2-MINI-2U Recommended
PCB Land Pattern.
- Source files of recommended PCB land patterns to measure dimensions not covered in Figure10. You can view the source files forESP32-S2-MINI-2 and ESP32-S2-MINI-2U with Autodesk Viewer. Figure 10: ESP32-S2-MINI-2 Recommended PCB Land Pattern Espressif Systems 27 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.1
Figure 11: ESP32-S2-MINI-2U Recommended PCB Land Pattern Espressif Systems 28 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.1
7 .3 Dimensions of External Antenna Connector ESP32-S2-MINI-2U uses the third generation external antenna connector as shown in Figure12 Dimensions of External Antenna Connector. This connector is compatible with the following connectors:
- W.FL Series connector from Hirose
- MHF III connector from I-PEX
- AMMC connector from Amphenol SECTION: A-ASCALE: 1:1 A1.7 1.7 0.85 2.05±0.101.40 A 0.10 0.57 INSULATION RESISTANCE: 500MOHM Min.DIELECTRIC WITHSTANDING VOLTAGE: 200V AC FOR 1MINUTE; CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER;PERFORMANCE:CONTACT RESISTANCE: 20mOHM Max. HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0;SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; CONTACT GROUND CONTACT 2.00±0.10 Unit: mmTolerance: +/-0.1 mm HOUSINGCONTACT SHELL Figure 12: Dimensions of External Antenna Connector Espressif Systems 29 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.1
8 Product Handling
8.1 Storage Conditions
The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric environment of < 40 °C and 90%RH. The module is rated at the moisture sensitivity level (MSL) of 3. After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and 60%RH. If the above conditions are not met, the module needs to be baked.
8.2 Electrostatic Discharge (ESD)
- Human body model (HBM): ±2000 V
- Charged-device model (CDM): ±500 V
8.3 Soldering Profile
8.3.1 Reflow Profile
Solder the module in a single reflow. 50 150 1 ~ 3 ℃/s 200 250 200 –1 ~ –5 ℃/s Cooling zone 100 217 100 250 Reflow zone !217 ℃ 60 ~ 90 s Temperature (℃) Preheating zone 150 ~ 200 ℃ 60 ~ 120 s Ramp-up zone Peak Temp. 235 ~ 250 ℃ Soldering time > 30 s Time (sec.) Ramp-up zone — Temp. : 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s Reflow zone — Temp.: >217 ℃ 7LPH 60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy Figure 13: Reflow Profile Espressif Systems 30 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.1
8.4 Ultrasonic Vibration
Avoid exposing Espressif modules to vibration from ultrasonic equipment, such as ultrasonic welders or ultrasonic cleaners. This vibration may induce resonance in the in-module crystal and lead to its malfunction or even failure. As a consequence,the module may stop working or its performance may deteriorate. Espressif Systems 31 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.1
Related Documentation and Resources Related Documentation and Resources Related Documentation
- ESP32-S2 Series Datasheet – Specifications of the ESP32-S2 hardware.
- ESP32-S2 TechnicalReferenceManual – Detailed information on how to use the ESP32-S2 memory and periph- erals.
- ESP32-S2 HardwareDesign Guidelines – Guidelines on how to integrate the ESP32-S2 into your hardware product.
- ESP32-S2 Series SoC Errata – Descriptions of known errors in ESP32-S2 series of SoCs.
- Certificates https:/ /espressif.com/en/support/documents/certificates
- ESP32-S2 Product/Process Change Notifications (PCN) https:/ /espressif.com/en/support/documents/pcns?keys=ESP32-S2
- ESP32-S2 Advisories– Information on security, bugs, compatibility, component reliability. https:/ /espressif.com/en/support/documents/advisories?keys=ESP32-S2
- Documentation Updates and Update Notification Subscription https:/ /espressif.com/en/support/download/documents Developer Zone
- ESP-IDF Programming Guide for ESP32-S2 – Extensive documentation for the ESP-IDF development framework.
- ESP-IDF and other development frameworks on GitHub. https:/ /github.com/espressif
- ESP32 BBS Forum– Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions, share knowledge, explore ideas, and help solve problems with fellow engineers. https:/ /esp32.com/
- The ESP Journal– Best Practices, Articles, and Notes from Espressif folks. https:/ /blog.espressif.com/
- See the tabsSDKs and Demos, Apps, Tools, AT Firmware. https:/ /espressif.com/en/support/download/sdks-demos Products
- ESP32-S2 Series SoCs– Browse through all ESP32-S2 SoCs. https:/ /espressif.com/en/products/socs?id=ESP32-S2
- ESP32-S2 Series Modules– Browse through all ESP32-S2-based modules. https:/ /espressif.com/en/products/modules?id=ESP32-S2
- ESP32-S2 Series DevKits– Browse through all ESP32-S2-based devkits. https:/ /espressif.com/en/products/devkits?id=ESP32-S2
- ESP Product Selector– Find an Espressif hardware product suitable for your needs by comparing or applying filters. https:/ /products.espressif.com/#/product-selector?language=en Contact Us
- See the tabsSales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples (Online stores),Become Our Supplier, Comments & Suggestions. https:/ /espressif.com/en/contact-us/sales-questions Espressif Systems 32 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.1
Revision History
Date Version Release notes 2024-09-05 v1.6 • Updated the module images on the cover page 2024-05-10 v1.0 • Added information about certification and test in Section1.1Features 2024-04-16 v0.6
- Updated EPAD descriptions in Section6 Peripheral Schematics
- Added descriptions in Section7 .2Recommended PCB Land Pattern
- Other formatting updates 2022-09-19 v0.5 Preliminary release Espressif Systems 33 Submit Documentation Feedback ESP32-S2-MINI-2 & MINI-2U Datasheet v1.1
Disclaimer and Copyright Notice Information in this document, including URL references, is subject to change without notice. ALL THIRD PARTY’S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES TO ITS AUTHENTICITY AND ACCURACY . NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY , NON-INFRINGEMENT , FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a registered trademark of Bluetooth SIG. All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners, and are hereby acknowledged. Copyright © 2024 Espressif Systems (Shanghai) Co., Ltd. All rights reserved. www.espressif.com