ESP32-C3-MINI-1U-H4

ESP32-C3-MINI-1 ESPRESSIF | Alldatasheet

Document overview

• Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
• PDF pages: 42

Technical content

Datasheet sections

• 1 Module Overview
• 1.1 Features
• 1.2 Series Comparison
• 1.3 Applications
• 2 Block Diagram
• 3 Pin Definitions
• 3.1 Pin Layout
• 3.2 Pin Description
• 4 Boot Configurations
• 4.1 Chip Boot Mode Control
• 4.2 ROM Messages Printing Control
• 5 Peripherals
• 5.1 Peripheral Overview
• 5.2 Peripheral Description
• 5.2.1 Connectivity Interface
• 5.2.1.1 UART Controller
• 5.2.1.2 SPI Controller
• 5.2.1.3 I2C Controller
• 5.2.1.4 I2S Controller
• 5.2.1.5 USB Serial/JTAG Controller
• 5.2.1.6 Two-wire Automotive Interface
• 5.2.1.7 LED PWM Controller
• 5.2.1.8 Remote Control Peripheral
• 5.2.2 Analog Signal Processing
• 5.2.2.1 SAR ADC
• 5.2.2.2 Temperature Sensor
• 6 Electrical Characteristics
• 6.1 Absolute Maximum Ratings
• 6.2 Recommended Operating Conditions
• 6.4 Current Consumption Characteristics
• 6.4.1 Current Consumption in Active Mode
• 6.4.2 Current Consumption in Other Modes
• 7 RF Characteristics

Datasheet sections

• 8 Module Schematics
• 9 Peripheral Schematics
• 10 Physical Dimensions
• 10.1 Module Dimensions
• 10.2 Dimensions of External Antenna Connector
• 11 PCB Layout Recommendations
• 11.1 PCB Land Pattern
• 11.2 Module Placement for PCB Design
• 12 Product Handling
• 12.1 Storage Conditions
• 12.2 Electrostatic Discharge (ESD)
• 12.3 Reflow Profile
• 12.4 Ultrasonic Vibration

Datasheet Version 2.0 Small-sized 2.4 GHz Wi-Fi (802.11b/g/n) and Bluetooth® 5 module Built around ESP32-C3 series of SoCs, RISC-V single-core microprocessor

4 MB flash in chip package

15 GPIOs

On-board PCB antenna or external antenna connector ESP32-C3-MINI-1 ESP32-C3-MINI-1U www.espressif.com

1 Module Overview

Note: Check the link or the QR code to make sure that you use the latest version of this document: https://www.espressif.com/documentation/esp32-c3-mini-1_datasheet_en.pdf

1.1 Features

• ESP32-C3FH4 embedded, 32-bit RISC-V single-core processor, up to 160 MHz
• 384 KB ROM
• 400 KB SRAM (16 KB for cache)
• 8 KB SRAM in RTC
• 4 MB flash in chip package Wi-Fi
• IEEE 802.11 b/g/n-compliant
• Center frequency range of operating channel: 2412 ~ 2484 MHz
• Supports 20 MHz, 40 MHz bandwidth in 2.4 GHz band
• 1T1R mode with data rate up to 150 Mbps
• Wi-Fi Multimedia (WMM)
• TX/RX A-MPDU, TX/RX A-MSDU
• Immediate Block ACK
• Fragmentation and defragmentation
• Transmit opportunity (TXOP)
• Automatic Beacon monitoring (hardware TSF)
• 4 × virtual Wi-Fi interfaces
• Simultaneous support for Infrastructure BSS in Station mode, SoftAP mode, Station + SoftAP mode, and promiscuous mode Note that when the chip scans in Station mode, the SoftAP channel will change along with the Station channel
• 802.11mc FTM Bluetooth®
• Bluetooth LE: Bluetooth 5, Bluetooth mesh
• Speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps
• Advertising extensions
• Multiple advertisement sets
• Channel selection algorithm #2
• Internal co-existence mechanism between Wi-Fi and Bluetooth to share the same antenna Peripherals
• Up to 15 GPIOs – 3 strapping GPIOs
• SPI, UART , I2C, I2S, remote control peripheral, LED PWM controller, general DMA controller, TWAI® controller (compatible with ISO 11898-1, i.e. CAN Specification 2.0), USB Serial/JTAG controller, temperature sensor, SAR ADC, general-purpose timers, watchdog timers Note: * Please refer toESP32-C3 Series Datasheetfor detailed information about the module peripher- als. Integrated Components on Module
• 40 MHz crystal oscillator Antenna Options
• ESP32-C3-MINI-1: On-board PCB antenna Espressif Systems 2 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

• ESP32-C3-MINI-1U: External antenna via a connector Operating Conditions
• Operating voltage/Power supply: 3.0~ 3.6 V
• Operating ambient temperature: – 85 °C version module: –40 ~ 85 °C – 105 °C version module: –40 ~ 105 °C Certification
• RF certification: Seecertificates
• Green certification: RoHS/REACH Test
• HTOL/HTSL/uHAST/TCT/ESD/Latch-up

1.2 Series Comparison

ESP32-C3-MINI-1 and ESP32-C3-MINI-1U are two general-purpose Wi-Fi and Bluetooth LE modules. The rich set of peripherals and a small size make the two modules an ideal choice for smart homes, industrial automation, health care, consumer electronics, etc. ESP32-C3-MINI-1 comes with a PCB antenna. ESP32-C3-MINI-1U comes with an external antenna connector. A wide selection of module variants are available as shown in T able1 and 2. The series comparison for the two modules is as follows: Table 1: ESP32-C3-MINI-1 (ANT) Series Comparison1 Ambient Temp.2 Embedded Size3 Ordering Code5 Flash4 (°C) Chip Revision6 (mm) ESP32-C3-MINI-1-N4X (Recommended)

4 MB (Quad SPI)

–40 ∼ 85 v1.1 13.2 × 16.6 × 2.4ESP32-C3-MINI-1-H4X (Recommended) –40 ∼ 105 v1.1 ESP32-C3-MINI-1-N4 (NRND) –40 ∼ 85 v0.4 ESP32-C3-MINI-1-H4 (NRND) –40 ∼ 105 v0.4 ESP32-C3-MINI-1-H4-AZ (NRND) –40 ∼ 105 v0.4 1 This table shares the same notes presented in T able2 below. Espressif Systems 3 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

Table 2: ESP32-C3-MINI-1U (CONN) Series Comparison Ambient Temp.2 Embedded Size3 Ordering Code5 Flash4, 7 (°C) Chip Revision6 (mm) ESP32-C3-MINI-1U-N4X (Recommended) –40 ∼ 85 v1.1 13.2 × 12.5 × 2.4ESP32-C3-MINI-1U-H4X (Recommended) –40 ∼ 105 v1.1 ESP32-C3-MINI-1U-N4 (NRND) –40 ∼ 85 v0.4 ESP32-C3-MINI-1U-H4 (NRND) –40 ∼ 105 v0.4 2 Ambient temperature specifies the recommended temperature range of the environment immediately outside the Espressif module. 3 For details, refer to Section10.1Module Dimensions. 4 The flash is integrated in the chip’s package. The flash supports: - More than 100,000 program/erase cycles - More than 20 years data retention time 5 All modules can be pre-programmed withAWS IoT ExpressLinkfirmware. Modules with such firmware have suffix ”-A” in their ordering codes, e.g. ESP32-C3-MINI-1-N4-A. Since AWS IoT ExpressLink firmware enables flash encryption and secure boot, joint download boot mode will be disabled, and it will no longer be possible to program firmware through the UART or USB port into the modules. 6 All chip revisions have the same SRAM size, but chip revision v1.1 has around 10 KB more available space for users than chip revision v0.4. Chip revision v1.1 depends on specific ESP-IDF versions, as detailed inCompatibility Advisory for ESP32-C3 Chip Revision v1.1. For how to identify chip revisions, please refer toESP32-C3 Series SoC Errata. 7 By default, the SPI flash on the module operates at a maximum clock frequency of 80 MHz and does not support the auto suspend feature. If you have a requirement for a higher flash clock frequency of 120 MHz or if you need the flash auto suspend feature, pleasecontact us. Both ESP32-C3-MINI-1 and ESP32-C3-MINI-1U has two operating ambient temperature options: –40∼ 85 °C variants and –40∼ 105 °C variants, all embedded with the ESP32-C3FH4 chip. ESP32-C3-MINI-1 has one more variant: ESP32-C3-MINI-1-H4-AZ embedded with the ESP32-C3FH4AZ chip. For this chip, SPI0/SPI1 pins for flash connection are not bonded. For more information about the differences between chips embedded, please refer to SectionChip Series Comparisonin ESP32-C3 Series Datasheet.

1.3 Applications

• Smart Home
• Industrial Automation
• Health Care
• Consumer Electronics
• Smart Agriculture
• POS Machines
• Service Robot
• Audio Devices
• Generic Low-power IoT Sensor Hubs
• Generic Low-power IoT Data Loggers Espressif Systems 4 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

1 ESP32-C3-MINI-1 (ANT) Series Comparison 1 3

2 ESP32-C3-MINI-1U (CONN) Series Comparison 4

3 Pin Definitions 11

4 Default Configuration of Strapping Pins 12

5 Description of Timing Parameters for the Strapping Pins 13

6 Chip Boot Mode Control 13

7 UART0 ROM Message Printing Control 14

8 USB Serial/JTAG ROM Message Printing Control 14

9 Absolute Maximum Ratings 20

10 Recommended Operating Conditions 20

11 DC Characteristics (3.3 V, 25 °C) 20 12 Current Consumption for Wi-Fi (2.4 GHz) in Active Mode 21

13 Current Consumption for Bluetooth LE in Active Mode 21

14 Current Consumption in Modem-sleep Mode 22

15 Current Consumption in Low-Power Modes 22

16 Wi-Fi RF Characteristics 23

17 TX Power with Spectral Mask and EVM Meeting 802.11 Standards 23

18 TX EVM Test1 23

19 RX Sensitivity 24

20 Maximum RX Level 25

21 RX Adjacent Channel Rejection 25

22 Bluetooth LE RF Characteristics 25

23 Bluetooth LE - Transmitter Characteristics - 1 Mbps 26

24 Bluetooth LE - Transmitter Characteristics - 2 Mbps 26

25 Bluetooth LE - Transmitter Characteristics - 125 Kbps 26

26 Bluetooth LE - Transmitter Characteristics - 500 Kbps 27

27 Bluetooth LE - Receiver Characteristics - 1 Mbps 27

28 Bluetooth LE - Receiver Characteristics - 2 Mbps 28

29 Bluetooth LE - Receiver Characteristics - 125 Kbps 28

30 Bluetooth LE - Receiver Characteristics - 500 Kbps 28

Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

1 ESP32-C3-MINI-1 Block Diagram 9

2 ESP32-C3-MINI-1U Block Diagram 9

3 Pin Layout (Top View) 10

4 Visualization of Timing Parameters for the Strapping Pins 13

5 ESP32-C3-MINI-1 Schematics 30

6 ESP32-C3-MINI-1U Schematics 31

7 Peripheral Schematics 32

8 ESP32-C3-MINI-1 Physical Dimensions 33

9 ESP32-C3-MINI-1U Physical Dimensions 33

10 Dimensions of External Antenna Connector 34

11 ESP32-C3-MINI-1 Recommended PCB Land Pattern 35

12 ESP32-C3-MINI-1U Recommended PCB Land Pattern 36

13 Reflow Profile 37

Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

2 Block Diagram

SPI FlashRF Matching40 MHzCrystal3V3ESP32-C3-MINI-1ENGPIOsAntennaESP32-C3FH4SPI Flash40 MHzCrystal3V3ESP32-C3-MINI-1UENGPIOsESP32-C3FH4RF MatchingAntenna Figure 1: ESP32-C3-MINI-1 Block Diagram SPI FlashRF Matching40 MHzCrystal3V3ESP32-C3-MINI-1ENGPIOsAntennaESP32-C3FH4SPI Flash40 MHzCrystal3V3ESP32-C3-MINI-1UENGPIOsESP32-C3FH4RF MatchingAntenna Figure 2: ESP32-C3-MINI-1U Block Diagram Espressif Systems 9 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

3 Pin Definitions

3.1 Pin Layout

The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to scale, please refer to Figure10.1Module Dimensions. Pin 49GNDGNDGNDGNDGNDGNDGNDGNDGNDPin 1Pin 2Pin 3Pin 4Pin 6Pin 5Pin 7Pin 8Pin 9Pin 10Pin 11 Pin 53GND Pin 52GNDPin 12Pin 13Pin 14Pin 15Pin 16Pin 17Pin 18Pin 19Pin 20Pin 21Pin 22Pin 23Pin 24Pin 25Pin 51GNDPin 26Pin 27Pin 28Pin 29Pin 30Pin 31Pin 32Pin 33Pin 34Pin 35Pin 50GNDPin 36Pin 37Pin 38Pin 39Pin 40Pin 41Pin 42Pin 43Pin 44Pin 45Pin 46Pin 47Pin 48GNDGND3V3NCIO2IO3NCENNCNCGNDIO0IO1GNDNCIO10NCIO4IO5IO6IO7IO8IO9NCNCIO18IO19NCNCRXD0TXD0NCNCNCNCGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDKeepout Zone A Figure 3: Pin Layout (Top View) Note A: The zone marked with dotted lines is the antenna keepout zone. The pin diagram is applicable to ESP32-C3-MINI-1 and ESP32-C3-MINI-1U, but the latter has no antenna keepout zone. To learn more about the keepout zone for module’s antenna on the base board, please refer to ESP32-C3 Hardware Design Guidelines> SectionPositioning a Module on a Base Board.

3.2 Pin Description

The module has 53 pins. See pin definitions in T able3 Pin Definitions. For peripheral pin configurations, please refer to Section5.2 Peripheral Description. Espressif Systems 10 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

Table 3: Pin Definitions Name No. Type1 Function GND 1, 2, 11, 14, 36-53 P Ground 3V3 3 P Power supply NC 4, 7 , 9, 10, 15, 17 , 24, 25, 28, 29, 32-35 — NC IO2 5 I/O/T GPIO2, ADC1_CH2, FSPIQ IO3 6 I/O/T GPIO3, ADC1_CH3 EN 8 I High: on, enables the chip. Low: off, the chip powers off. Note: Do not leave the EN pin floating. IO0 12 I/O/T GPIO0, ADC1_CH0, XTAL_32K_P IO1 13 I/O/T GPIO1, ADC1_CH1, XTAL_32K_N IO10 16 I/O/T GPIO10, FSPICS0 IO4 18 I/O/T GPIO4, ADC1_CH4, FSPIHD, MTMS IO5 19 I/O/T GPIO5, ADC2_CH0, FSPIWP, MTDI IO6 20 I/O/T GPIO6, FSPICLK, MTCK IO7 21 I/O/T GPIO7 , FSPID, MTDO IO8 22 I/O/T GPIO8 IO9 23 I/O/T GPIO9 IO18 26 I/O/T GPIO18, USB_D- IO19 27 I/O/T GPIO19, USB_D+ RXD0 30 I/O/T GPIO20, U0RXD TXD0 31 I/O/T GPIO21, U0TXD 1 P: power supply; I: input; O: output; T: high impedance. Espressif Systems 11 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

4 Boot Configurations

Note: The content below is excerpted fromESP32-C3 Series Datasheet> SectionBoot Configurations. For the strapping pin mapping between the chip and modules, please refer to Chapter8 Module Schematics. The chip allows for configuring the following boot parameters through strapping pins and eFuse bits at power-up or a hardware reset, without microcontroller interaction.

• Chip boot mode – Strapping pins: GPIO2, GPIO8, and GPIO9
• ROM message printing – Strapping pin: GPIO8 – eFuse parameters: EFUSE_UART _PRINT _CONTROL and EFUSE_USB_PRINT _CHANNEL The default values of all the above eFuse bits are 0, which means that they are not burnt. Given that eFuse is one-time programmable, once an eFuse bit is programmed to 1, it can never be reverted to 0. For how to program eFuse bits, please refer toESP32-C3 Technical Reference Manual> ChaptereFuse Controller. The default values of the strapping pins, namely the logic levels, are determined by pins’ internal weak pull-up/pull-down resistors at reset if the pins are not connected to any circuit, or connected to an external high-impedance circuit. Table 4: Default Configuration of Strapping Pins Strapping Pin Default Configuration Bit Value GPIO2 Floating – GPIO8 Floating – GPIO9 Weak pull-up 1 To change the bit values, the strapping pins should be connected to external pull-down/pull-up resistances. If the ESP32-C3 is used as a device by a host MCU, the strapping pin voltage levels can also be controlled by the host MCU. All strapping pins have latches. At system reset, the latches sample the bit values of their respective strapping pins and store them until the chip is powered down or shut down. The states of latches cannot be changed in any other way. It makes the strapping pin values available during the entire chip operation, and the pins are freed up to be used as regular IO pins after reset. The timing of signals connected to the strapping pins should adhere to thesetup timeand hold time specifications in T able5 and Figure4. Espressif Systems 12 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

Table 5: Description of Timing Parameters for the Strapping Pins Parameter Description Min (ms) tSU Setup timeis the time reserved for the power rails to stabilize be- fore the CHIP_EN pin is pulled high to activate the chip. 0 tH Hold timeis the time reserved for the chip to read the strapping pin values after CHIP_EN is already high and before these pins start operating as regular IO pins. Strapping pin VIL_nRST VIH tSU tH CHIP_EN Figure 4: Visualization of Timing Parameters for the Strapping Pins

4.1 Chip Boot Mode Control

GPIO2, GPIO8, and GPIO9 control the boot mode after the reset is released. See T able6 Chip Boot Mode Control. Table 6: Chip Boot Mode Control Boot Mode GPIO2 2 GPIO8 GPIO9 SPI Boot 1 Any value 1 Joint Download Boot3 1 1 0 1 Bold marks the default value and configuration.

2 GPIO2 actually does not determine SPI Boot and Joint

Download Boot mode, but it is recommended to pull this pin up due to glitches.

3 Joint Download Boot mode supports the following

download methods:

• USB-Serial-JTAG Download Boot
• UART Download Boot In SPI Boot mode, the ROM bootloader loads and executes the program from SPI flash to boot the system. Espressif Systems 13 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

In Joint Download Boot mode, users can download binary files into flash using UART0 or USB interface. It is also possible to download binary files into SRAM and execute it from SRAM. In addition to SPI Boot and Joint Download Boot modes, ESP32-C3 also supports SPI Download Boot mode. For details, please seeESP32-C3 Technical Reference Manual> ChapterChip Boot Control.

4.2 ROM Messages Printing Control

During the boot process, the messages by the ROM code can be printed to:

• (Default) UART0 and USB Serial/JTAG controller
• UART0
• USB Serial/JTAG controller EFUSE_UART _PRINT _CONTROL and GPIO8 control ROM messages printing toUART0 as shown in T able7 UART0 ROM Message Printing Control. Table 7: UART0 ROM Message Printing Control UART0 ROM Code PrintingEFUSE_UART _PRINT _CONTROLGPIO8 Enabled

0 Ignored

3 Ignored

1 Bold marks the default value and configuration. EFUSE_USB_PRINT _CHANNEL controls the printing toUSB Serial/JTAG controlleras shown in T able8 USB Serial/JTAG ROM Message Printing Control. Table 8: USB Serial/JTAG ROM Message Printing Control USB Serial/JTAG ROM Code Printing EFUSE_DIS_USB_SERIAL_JTAG2 EFUSE_USB_PRINT _CHANNEL Enabled 0 0 Disabled 0 1

1 Ignored

1 Bold marks the default value and configuration. 2 EFUSE_DIS_USB_SERIAL_JTAG controls whether to disable USB Serial/JTAG. Espressif Systems 14 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

5 Peripherals

5.1 Peripheral Overview

ESP32-C3FH4 integrates a rich set of peripherals including SPI, UART , I2C, I2S, remote control peripheral, LED PWM controller, TWAI® controller, USB Serial/JTAG controller, temperature sensor, SAR ADC To learn more about on-chip components, please refer toESP32-C3 Series Datasheet> SectionFunctional Description. Note: The content below is sourced fromESP32-C3 Series Datasheet> SectionPeripherals. Some information may not be applicable to ESP32-C3-MINI-1 and ESP32-C3-MINI-1U as not all the IO signals are exposed on the module. To learn more about peripheral signals, please refer toESP32-C3 Technical Reference Manual> SectionPeripheral Signal List.

5.2 Peripheral Description

This section describes the chip’s peripheral capabilities, covering connectivity interfaces and on-chip sensors that extend its functionality.

5.2.1 Connectivity Interface

This subsection describes the connectivity interfaces on the chip that enable communication and interaction with external devices and networks.

5.2.1.1 UART Controller

ESP32-C3 has two UART interfaces, i.e. UART0 and UART1, which support IrDA and asynchronous communication (RS232 and RS485) at a speed of up to 5 Mbps. The UART controller provides hardware flow control (CTS and RTS signals) and software flow control (XON and XOFF). Both UART interfaces connect to GDMA via UHCI0, and can be accessed by the GDMA controller or directly by the CPU. Pin Assignment The pins connected to transmit and receive signals (U0TXD and U0RXD) forUART0 are multiplexed with GPIO21 ~ GPIO20 via IO MUX. Other signals can be routed to any GPIOs via the GPIO matrix. For more information about the pin assignment, seeESP32-C3 Series Datasheet> SectionIO Pinsand ESP32-C3 Technical Reference Manual> ChapterIO MUX and GPIO Matrix.

5.2.1.2 SPI Controller

ESP32-C3 has the following SPI interfaces:

• SPI0 used by ESP32-C3’s GDMA controller and cache to access in-package or off-package flash
• SPI1 used by the CPU to access in-package or off-package flash
• SPI2 is a general purpose SPI controller with access to a DMA channel allocated by the GDMA controller Espressif Systems 15 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

• Supports Single SPI, Dual SPI, and Quad SPI, QPI modes
• Configurable clock frequency with a maximum of 120 MHz in Single Transfer Rate (STR) mode
• Data transmission is in bytes Features of SPI2
• Supports operation as a master or slave
• Connects to a DMA channel allocated by the GDMA controller
• Supports Single SPI, Dual SPI, and Quad SPI, QPI
• Configurable clock polarity (CPOL) and phase (CPHA)
• Configurable clock frequency
• Data transmission is in bytes
• Configurable read and write data bit order: most-significant bit (MSB) first, or least-significant bit (LSB) first
• As a master – Supports 2-line full-duplex communication with clock frequency up to 80 MHz – Supports 1-, 2-, 4-line half-duplex communication with clock frequency up to 80 MHz – Provides six SPI_CS pins for connection with six independent SPI slaves – Configurable CS setup time and hold time
• As a slave – Supports 2-line full-duplex communication with clock frequency up to 60 MHz – Supports 1-, 2-, 4-line half-duplex communication with clock frequency up to 60 MHz Pin Assignment For SPI0/1, the pins are multiplexed with GPIO12 ~ GPIO17 via the IO MUX. For SPI2, the pins are multiplexed with GPIO2, GPIO4 ~ GPIO7 , GPIO10, and JTAG interface via the IO MUX. For more information about the pin assignment, seeESP32-C3 Series Datasheet> SectionIO Pinsand ESP32-C3 Technical Reference Manual> ChapterIO MUX and GPIO Matrix.

5.2.1.3 I2C Controller

ESP32-C3 has an I2C bus interface which is used for I2C master mode or slave mode, depending on your configuration. The I2C interface supports:

• standard mode (100 Kbit/s)
• fast mode (400 Kbit/s) Espressif Systems 16 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

• up to 800 Kbit/s (constrained by SCL and SDA pull-up strength)
• 7-bit and 10-bit addressing mode
• double addressing mode
• 7-bit broadcast address Pin Assignment The pins for I2C can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, seeESP32-C3 Series Datasheet> SectionIO Pinsand ESP32-C3 Technical Reference Manual> ChapterIO MUX and GPIO Matrix.

5.2.1.4 I2S Controller

ESP32-C3 includes a standard I2S interface. This interface can operate as a master or a slave in full-duplex mode or half-duplex mode, and can be configured for 8-bit, 16-bit, 24-bit, or 32-bit serial communication. BCK clock frequency, from 10 kHz up to 40 MHz, is supported. The I2S interface connects to the GDMA controller. The interface supports TDM PCM, TDM MSB alignment, TDM standard, and PDM standard. Pin Assignment The pins for the I2S Controller can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, seeESP32-C3 Series Datasheet> SectionIO Pinsand ESP32-C3 Technical Reference Manual> ChapterIO MUX and GPIO Matrix.

5.2.1.5 USB Serial/JTAG Controller

ESP32-C3 integrates a USB Serial/JTAG controller. This controller has the following features:

• CDC-ACM virtual serial port and JTAG adapter functionality
• USB 2.0 full speed compliant, capable of up to 12 Mbit/s transfer speed (Note that this controller does not support the faster 480 Mbit/s high-speed transfer mode)
• programming in-package/off-package flash
• CPU debugging with compact JTAG instructions
• a full-speed USB PHY integrated in the chip Pin Assignment The pins for the USB Serial/JTAG Controller are multiplexed with GPIO18 ~ GPIO19. For more information about the pin assignment, seeESP32-C3 Series Datasheet> SectionIO Pinsand ESP32-C3 Technical Reference Manual> ChapterIO MUX and GPIO Matrix. Espressif Systems 17 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

5.2.1.6 Two-wire Automotive Interface

ESP32-C3 has a TWAI® controller with the following features:

• compatible with ISO 11898-1 protocol (CAN Specification 2.0)
• standard frame format (11-bit ID) and extended frame format (29-bit ID)
• bit rates from 1 Kbit/s to 1 Mbit/s
• multiple modes of operation: Normal, Listen Only, and Self-Test (no acknowledgment required)
• 64-byte receive FIFO
• acceptance filter (single and dual filter modes)
• error detection and handling: error counters, configurable error interrupt threshold, error code capture, arbitration lost capture Pin Assignment The pins for the Two-wire Automotive Interface can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, seeESP32-C3 Series Datasheet> SectionIO Pinsand ESP32-C3 Technical Reference Manual> ChapterIO MUX and GPIO Matrix.

5.2.1.7 LED PWM Controller

The LED PWM controller can generate independent digital waveform on six channels. The LED PWM controller:

• Can generate digital waveform with configurable periods and duty cycle. The resolution of duty cycle can be up to 14 bits.
• Has multiple clock sources, including APB clock and external main crystal clock.
• Can operate when the CPU is in Light-sleep mode.
• Supports gradual increase or decrease of duty cycle, which is useful for the LED RGB color-gradient generator. Pin Assignment The pins for the LED PWM Controller can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, seeESP32-C3 Series Datasheet> SectionIO Pinsand ESP32-C3 Technical Reference Manual> ChapterIO MUX and GPIO Matrix.

5.2.1.8 Remote Control Peripheral

The Remote Control Peripheral (RMT) supports two channels of infrared remote transmission and two channels of infrared remote reception. By controlling pulse waveform through software, it supports various infrared and other single wire protocols. All four channels share a 192 × 32-bit memory block to store transmit or receive waveform. Espressif Systems 18 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

The pins for the Remote Control Peripheral can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, seeESP32-C3 Series Datasheet> SectionIO Pinsand ESP32-C3 Technical Reference Manual> ChapterIO MUX and GPIO Matrix.

5.2.2 Analog Signal Processing

This subsection describes components on the chip that sense and process real-world data.

5.2.2.1 SAR ADC

ESP32-C3 integrates two 12-bit SAR ADCs.

• ADC1 supports measurements on 5 channels, and is factory-calibrated.
• ADC2 supports measurements on 1 channel, and is not factory-calibrated. Note: ADC2 of some chip revisions is not operable. For details, please refer toESP32-C3 Series SoC Errata. Pin Assignment The pins for the SAR ADC are multiplexed with GPIO0 ~ GPIO5, JTAG interface, SPI2 interface, and pins for external crystal or oscillator. For more information about the pin assignment, seeESP32-C3 Series Datasheet> SectionIO Pinsand ESP32-C3 Technical Reference Manual> ChapterIO MUX and GPIO Matrix.

5.2.2.2 Temperature Sensor

The temperature sensor generates a voltage that varies with temperature. The voltage is internally converted via an ADC into a digital value. The temperature sensor has a range of –40 °C to 125 °C. It is designed primarily to sense the temperature changes inside the chip. The temperature value depends on factors like microcontroller clock frequency or I/O load. Generally, the chip’s internal temperature is higher than the operating ambient temperature. Espressif Systems 19 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

6 Electrical Characteristics

6.1 Absolute Maximum Ratings

Stresses above those listed in T able9 Absolute Maximum Ratingsmay cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under T able10 Recommended Operating Conditionsis not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Table 9: Absolute Maximum Ratings Symbol Parameter Min Max Unit VDD33 Power supply voltage –0.3 3.6 V TSTORE Storage temperature –40 105 °C

6.2 Recommended Operating Conditions

Table 10: Recommended Operating Conditions Symbol Parameter Min Typ Max Unit VDD33 Power supply voltage 3.0 3.3 3.6 V IV DD Current delivered by external power supply 0.5 — — A TA Operating ambient temperature 85 °C version –40 — 85 °C105 °C version 105 6.3 DC Characteristics (3.3 V, 25 °C) Table 11: DC Characteristics (3.3 V, 25 °C) Symbol Parameter Min Typ Max Unit CIN Pin capacitance — 2 — pF VIH High-level input voltage 0.75 × VDD1 — VDD1 + 0.3 V VIL Low-level input voltage –0.3 — 0.25 × VDD1 V IIH High-level input current — — 50 nA IIL Low-level input current — — 50 nA VOH 2 High-level output voltage 0.8 × VDD1 — — V VOL2 Low-level output voltage — — 0.1 × VDD1 V IOH High-level source current (VDD1 = 3.3 V, VOH >= 2.64 V, PAD_DRIVER = 3) — 40 — mA IOL Low-level sink current (VDD1 = 3.3 V, VOL =

0.495 V, PAD_DRIVER = 3) — 28 — mA

RPU Pull-up resistor — 45 — kΩ RPD Pull-down resistor — 45 — kΩ VIH_nRST Chip reset release voltage 0.75 × VDD1 — VDD1 + 0.3 V VIL_nRST Chip reset voltage –0.3 — 0.25 × VDD1 V Espressif Systems 20 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

1 VDD is the I/O voltage for pins of a particular power domain. 2 VOH and VOL are measured using high-impedance load.

6.4 Current Consumption Characteristics

6.4.1 Current Consumption in Active Mode

The current consumption measurements are taken with a 3.3 V supply at 25 °C ambient temperature. TX current consumption is rated at a 100% duty cycle. RX current consumption is rated when the peripherals are disabled and the CPU idle. Table 12: Current Consumption for Wi-Fi (2.4 GHz) in Active Mode Work mode Description Peak (mA) Active (RF working) TX 802.11b, 1 Mbps, @20.5 dBm 350 802.11g, 54 Mbps, @18 dBm 295 802.11n, HT20, MCS7 , @17 .5 dBm 290 802.11n, HT40, MCS7 , @17 dBm 290 RX 802.11b/g/n, HT20 82 802.11n, HT40 84 Table 13: Current Consumption for Bluetooth LE in Active Mode Work Mode RF Condition Description Peak (mA) Active (RF working) TX Bluetooth LE @ 20.0 dBm 340 Bluetooth LE @ 9.0 dBm 190 Bluetooth LE @ 0 dBm 170 Bluetooth LE @ –15.0 dBm 100 RX Bluetooth LE 86 Espressif Systems 21 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

Note: The content below is excerpted fromSection Power Consumption in Other Modesin ESP32-C3 Series Datasheet.

6.4.2 Current Consumption in Other Modes

Table 14: Current Consumption in Modem-sleep Mode Typ Mode CPU Frequency (MHz) Description All Peripherals Clocks Disabled (mA) All Peripherals Clocks Enabled (mA)1 Modem-sleep2,3

160 CPU is idle 16 21

80 CPU is idle 13 18

1 In practice, the current consumption might be different depending on which peripherals are enabled. 2 In Modem-sleep mode, Wi-Fi is clock gated. 3 In Modem-sleep mode, the consumption might be higher when accessing flash. For a flash rated at 80 Mbit/s, in SPI 2-line mode the consumption is 10 mA. Table 15: Current Consumption in Low-Power Modes Mode Description Typ (µA) Light-sleep VDD_SPI and Wi-Fi are powered down, and all GPIOs are high-impedance130 Deep-sleep RTC timer + RTC memory 5 Power off CHIP_EN is set to low level, the chip is powered off 1 Espressif Systems 22 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

7 RF Characteristics

This section contains tables with RF characteristics of the Espressif product. The RF data is measured at the antenna port, where RF cable is connected, including the front-end loss. The external antennas used for the tests on the modules with external antenna connectors have an impedance of 50 Ω. Devices should operate in the center frequency range allocated by regional regulatory authorities. The target center frequency range and the target transmit power are configurable by software. SeeESP RF TestTooland TestGuide for instructions. Unless otherwise stated, the RF tests are conducted with a 3.3 V (±5%) supply at 25 ºC ambient temperature. 7 .1Wi-Fi Radio Table 16: Wi-Fi RF Characteristics Name Description Center frequency range of operating channel2412 ~ 2484 MHz Wi-Fi wireless standard IEEE 802.11b/g/n 7 .1.1Wi-Fi RF Transmitter (TX) Characteristics Table 17: TX Power with Spectral Mask and EVM Meeting 802.11 Standards Min Typ MaxRate (dBm) (dBm) (dBm) 802.11b, 1 Mbps — 20.5 — 802.11b, 11 Mbps — 20.5 — 802.11g, 6 Mbps — 20.0 — 802.11g, 54 Mbps — 18.0 — 802.11n, HT20, MCS0 — 19.0 — 802.11n, HT20, MCS7 — 17 .5 — 802.11n, HT40, MCS0 — 18.5 — 802.11n, HT40, MCS7 — 17 .0 — Table 18: TX EVM Test1 Min Typ LimitRate (dB) (dB) (dB) 802.11b, 1 Mbps, @20.5 dBm — –24.5 –10 802.11b, 11 Mbps, @20.5 dBm — –25.0 –10 802.11g, 6 Mbps, @20 dBm — –23.0 –5 802.11g, 54 Mbps, @18 dBm — –28.0 –25 Cont’d on next page Espressif Systems 23 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

Table 18 – cont’d from previous page Min Typ LimitRate (dB) (dB) (dB) 802.11n, HT20, MCS0, @19 dBm — –23.5 –5 802.11n, HT20, MCS7 , @17 .5 dBm — –30.5 –27 802.11n, HT40, MCS0, @18.5 dBm — –26.5 –5 802.11n, HT40, MCS7 , @17 dBm — –30.5 –27

1 EVM is measured at the corresponding typical TX power provided

in T able17 TX Power with Spectral Mask and EVM Meeting 802.11 Standards above. 7 .1.2Wi-Fi RF Receiver (RX) Characteristics For RX tests, the PER (packet error rate) limit is 8% for 802.11b, and 10% for 802.11g/n. Table 19: RX Sensitivity Min Typ MaxRate (dBm) (dBm) (dBm) 802.11b, 1 Mbps — –98.0 — 802.11b, 2 Mbps — –96.0 — 802.11b, 11 Mbps — –88.6 — 802.11g, 6 Mbps — –92.8 — 802.11g, 9 Mbps — –91.8 — 802.11g, 12 Mbps — –90.8 — 802.11g, 18 Mbps — –88.4 — 802.11g, 24 Mbps — –85.4 — 802.11g, 36 Mbps — –82.0 — 802.11g, 48 Mbps — –77 .8 — 802.11g, 54 Mbps — –76.2 — 802.11n, HT20, MCS0 — –92.6 — 802.11n, HT20, MCS1 — –90.6 — 802.11n, HT20, MCS2 — –88.0 — 802.11n, HT20, MCS3 — –84.8 — 802.11n, HT20, MCS4 — –81.6 — 802.11n, HT20, MCS5 — –77 .4 — 802.11n, HT20, MCS6 — –75.6 — 802.11n, HT20, MCS7 — –74.4 — 802.11n, HT40, MCS0 — –90.0 — 802.11n, HT40, MCS1 — –87 .6 — 802.11n, HT40, MCS2 — –84.8 — 802.11n, HT40, MCS3 — –81.8 — 802.11n, HT40, MCS4 — –78.4 — 802.11n, HT40, MCS5 — –74.2 — Cont’d on next page Espressif Systems 24 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

Table 19 – cont’d from previous page Min Typ MaxRate (dBm) (dBm) (dBm) 802.11n, HT40, MCS6 — –72.6 — 802.11n, HT40, MCS7 — –71.2 — Table 20: Maximum RX Level Min Typ MaxRate (dBm) (dBm) (dBm) 802.11b, 1 Mbps — 5 — 802.11b, 11 Mbps — 5 — 802.11g, 6 Mbps — 5 — 802.11g, 54 Mbps — 0 — 802.11n, HT20, MCS0 — 5 — 802.11n, HT20, MCS7 — 0 — 802.11n, HT40, MCS0 — 5 — 802.11n, HT40, MCS7 — 0 — Table 21: RX Adjacent Channel Rejection Min Typ MaxRate (dB) (dB) (dB) 802.11b, 1 Mbps — 35 — 802.11b, 11 Mbps — 35 — 802.11g, 6 Mbps — 31 — 802.11g, 54 Mbps — 14 — 802.11n, HT20, MCS0 — 31 — 802.11n, HT20, MCS7 — 13 — 802.11n, HT40, MCS0 — 19 — 802.11n, HT40, MCS7 — 8 — 7 .2 Bluetooth 5 (LE) Radio 7 .2.1Bluetooth LE RF Transmitter (TX) Characteristics Table 22: Bluetooth LE RF Characteristics Name Description Center frequency range of operating channel2402 ~ 2480 MHz RF transmit power range –24.0 ~ 20.0 dBm Espressif Systems 25 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

Table 23: Bluetooth LE - Transmitter Characteristics - 1 Mbps Parameter Description Min Typ Max Unit In-band emissions F = F0 ± 2 MHz — –37 .62 — dBm F = F0 ± 3 MHz — –41.95 — dBm F = F0 ± > 3 MHz — –44.48 — dBm Modulation characteristics ∆ f1avg — 245.00 — kHz ∆ f2max — 208.00 — kHz ∆ f2avg/∆ f1avg — 0.93 — — Carrier frequency offset — — –9.00 — kHz Carrier frequency drift Table 24: Bluetooth LE - Transmitter Characteristics - 2 Mbps Parameter Description Min Typ Max Unit In-band emissions F = F0 ± 4 MHz — –43.55 — dBm F = F0 ± 5 MHz — –45.26 — dBm F = F0 ± > 5 MHz — –47 .00 — dBm Modulation characteristics ∆ f1avg — 497 .00 — kHz ∆ f2max — 398.00 — kHz ∆ f2avg/∆ f1avg — 0.95 — — Carrier frequency offset — — –9.00 — kHz Carrier frequency drift Table 25: Bluetooth LE - Transmitter Characteristics - 125 Kbps Parameter Description Min Typ Max Unit In-band emissions F = F0 ± 2 MHz — –37 .90 — dBm F = F0 ± 3 MHz — –41.00 — dBm F = F0 ± > 3 MHz — –42.50 — dBm Modulation characteristics ∆ f1avg — 252.00 — kHz ∆ f1max — 200.00 — kHz Carrier frequency offset — — –13.70 — kHz Carrier frequency drift Espressif Systems 26 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

Table 26: Bluetooth LE - Transmitter Characteristics - 500 Kbps Parameter Description Min Typ Max Unit In-band emissions F = F0 ± 2 MHz — –37 .90 — dBm F = F0 ± 3 MHz — –41.30 — dBm F = F0 ± > 3 MHz — –42.80 — dBm Modulation characteristics ∆ f2avg — 220.00 — kHz ∆ f2max — 205.00 — kHz Carrier frequency offset — — –11.90 — kHz Carrier frequency drift 7 .2.2 Bluetooth LE RF Receiver (RX) Characteristics Table 27: Bluetooth LE - Receiver Characteristics - 1 Mbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –96 — dBm Maximum received signal @30.8% PER— — 10 — dBm Co-channel C/I — — 8 — dB Adjacent channel selectivity C/I F = F0 + 1 MHz — –4 — dB F = F0 – 1 MHz — –3 — dB F = F0 + 2 MHz — –32 — dB F = F0 – 2 MHz — –36 — dB F ≥ F0 + 3 MHz(1) — — — dB F ≤ F0 – 3 MHz — –39 — dB Image frequency — — –29 — dB Adjacent channel to image frequency F = Fimage + 1 MHz — –38 — dB F = Fimage – 1 MHz — –34 — dB Out-of-band blocking performance

30 MHz~ 2000 MHz — –9 — dBm

2003 MHz~ 2399 MHz — –18 — dBm

2484 MHz~ 2997 MHz — –16 — dBm

3000 MHz~ 12.75 GHz — –6 — dBm Intermodulation — — –44 — dBm 1 Refer to the value of Adjacent channel to image frequency when F = Fimage – 1 MHz. Espressif Systems 27 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

Table 28: Bluetooth LE - Receiver Characteristics - 2 Mbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –93 — dBm Maximum received signal @30.8% PER— — 0 — dBm Co-channel C/I — — 10 — dB Adjacent channel selectivity C/I F = F0 + 2 MHz — –7 — dB F = F0 – 2 MHz — –7 — dB F = F0 + 4 MHz(1) — — — dB F = F0 – 4 MHz — –34 — dB F ≥ F0 + 6 MHz — –39 — dB F ≤ F0 – 6 MHz — –39 — dB Image frequency — — –27 — dB Adjacent channel to image frequency F = Fimage + 2 MHz — –39 — dB F = Fimage – 2 MHz(2) — — — dB Out-of-band blocking performance

30 MHz~ 2000 MHz — –17 — dBm

2003 MHz~ 2399 MHz — –19 — dBm

3000 MHz~ 12.75 GHz — –22 — dBm Intermodulation — — –40 — dBm 1 Refer to the value of Image frequency. 2 Refer to the value of Adjacent channel selectivity C/I when F = F0 + 2 MHz. Table 29: Bluetooth LE - Receiver Characteristics - 125 Kbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –104 — dBm Maximum received signal @30.8% PER— — 10 — dBm Co-channel C/I — — 2 — dB Adjacent channel selectivity C/I F = F0 + 1 MHz — –6 — dB F = F0 – 1 MHz — –5 — dB F = F0 + 2 MHz — –40 — dB F = F0 – 2 MHz — –42 — dB F ≥ F0 + 3 MHz(1) — — — dB F ≤ F0 – 3 MHz — –46 — dB Image frequency — — –34 — dB Adjacent channel to image frequency F = Fimage + 1 MHz — –44 — dB F = Fimage – 1 MHz — –37 — dB 1 Refer to the value of Adjacent channel to image frequency when F = Fimage – 1 MHz. Table 30: Bluetooth LE - Receiver Characteristics - 500 Kbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –99 — dBm Cont’d on next page Espressif Systems 28 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

Table 30 – cont’d from previous page Parameter Description Min Typ Max Unit Maximum received signal @30.8% PER— — 10 — dBm Co-channel C/I — — 3 — dB Adjacent channel selectivity C/I F = F0 + 1 MHz — –5 — dB F = F0 – 1 MHz — –7 — dB F = F0 + 2 MHz — –39 — dB F = F0 – 2 MHz — –40 — dB F ≥ F0 + 3 MHz(1) — — — dB F ≤ F0 – 3 MHz — –40 — dB Image frequency — — –34 — dB Adjacent channel to image frequency F = Fimage + 1 MHz — –43 — dB F = Fimage – 1 MHz — –38 — dB 1 Refer to the value of Adjacent channel to image frequency when F = Fimage – 1 MHz. Espressif Systems 29 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

8 Module Schematics

This is the reference design of the module. D D C C B B A A The values of C8, L2 and C9 vary with the actual PCB board. The values of C1 and C2 vary with the selection of the crystal. The value of R1 varies with the actual PCB board. R1 could be a resistor or inductor, the initial value is suggested to be 24 nH. ESP32-C3-MINI-1(pin-out) NC: No component. 50 ohm Impedance Control GNDVDD33 GND GND GNDGND GND GND GND GND VDD33 GND GNDGND VDD33 VDD33 GND GND GND GND VDD_SPI VDD33 GND GND GND VDD33 Title Size Page Name Rev Date: Sheet of Confidential and Proprietary<02_ESP32-C3-MINI-1> V1.1 ESP32-C3-MINI-1 2 2Thursday, January 23, 2025 Title Size Page Name Rev Date: Sheet of Confidential and Proprietary<02_ESP32-C3-MINI-1> V1.1 ESP32-C3-MINI-1 2 2Thursday, January 23, 2025 Title Size Page Name Rev Date: Sheet of Confidential and Proprietary<02_ESP32-C3-MINI-1> V1.1 ESP32-C3-MINI-1 2 2Thursday, January 23, 2025 U2 ESP32-C3FH4 LNA_IN1 VDD3P32 VDD3P33 XTAL_32K_P4 XTAL_32K_N5 GPIO26 CHIP_EN7 MTMS 9 MTDI 10 VDD3P3_RTC 11 MTCK 12 MTDO 13 GPIO8 14 GPIO9 15 GPIO10 16 VDD3P3_CPU 17VDD_SPI 18SPIHD 19SPIWP 20SPICS0 21SPICLK 22SPID 23SPIQ 24 U0RXD 27 U0TXD 28 XTAL_N 29 XTAL_P 30 GND 33 GPIO38 VDDA 32 VDDA 31 GPIO19 26 GPIO18 25 ESP32-C3-MINI-1 GND1 3V33 IO9 23 NC4 IO25 IO36 NC7 NC9 NC10 NC 15 IO10 16 NC 17 IO4 18 IO5 19 NC 32 TXD0 31 RXD0 30 NC 34 NC 33 IO18 26 NC 29 NC 28 IO19 27 IO7 21 IO8 22 IO0 12 IO1 13 GND52 IO6 20 NC 35 NC 24 EPAD 49 GND2 GND53 GND 51 GND 50 EN8 GND 36 GND 37 GND 38 GND 39 GND 40 GND 41 GND 42 GND 43 GND 44 GND 45 GND 46 GND 47 GND 48 GND 14 GND11 NC 25 0.1uF ANT1 PCB_ANT TBD 40MHz(±10ppm) XIN 1 GND 2XOUT 3 GND 4 ESD 10uF C11 1uF R1 0 0.1uF 10nF TBD L1 2.0nH 1uF C10 0.1uF R2 499 L2 TBD C12 0.1uF TBD TBD R8 10K(NC) GPIO19 CHIP_EN GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 U0RXD GPIO18 LNA_IN GPIO9 GPIO10 GPIO0 GPIO1 SPICS0 GPIO2 GPIO3 RF_ANT U0TXD GPIO2 GPIO3 CHIP_EN GPIO1 GPIO0 GPIO10 GPIO6 GPIO7 GPIO8 GPIO9 GPIO18 GPIO19 U0RXD U0TXD GPIO4 GPIO5 Figure 5: ESP32-C3-MINI-1 Schematics Espressif Systems 30 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

The values of C8, L2 and C9 vary with the actual PCB board. The values of C1 and C2 vary with the selection of the crystal. The value of R1 varies with the actual PCB board. R1 could be a resistor or inductor, the initial value is suggested to be 24 nH. ESP32-C3-MINI-1U(pin-out) NC: No component. 50 ohm Impedance Control GNDVDD33 GND GND GNDGND GND GND GND GND VDD33 GND GND VDD33 VDD33 GND GND GND GND VDD_SPI VDD33 GND GND GND GND VDD33 Title Size Page Name Rev Date: Sheet of Confidential and Proprietary<02_ESP32-C3-MINI-1U> V1.2 ESP32-C3-MINI-1U 2 2Thursday, January 23, 2025 Title Size Page Name Rev Date: Sheet of Confidential and Proprietary<02_ESP32-C3-MINI-1U> V1.2 ESP32-C3-MINI-1U 2 2Thursday, January 23, 2025 Title Size Page Name Rev Date: Sheet of Confidential and Proprietary<02_ESP32-C3-MINI-1U> V1.2 ESP32-C3-MINI-1U 2 2Thursday, January 23, 2025 TBD ESD TBD R8 10K(NC) ANT1 CONN

3 ESP32-C3-MINI-1U

GND 36 GND 37 GND 38 GND 39 GND 40 GND 41 GND 42 GND 43 GND 44 GND 45 GND 46 GND 47 GND 48 GND 14 GND11 NC 25 R1 0 C12 0.1uF 1uF C10 0.1uF R2 499 TBD TBD L1 2.0nH 0.1uF 10uF L2 TBD 0.1uF 10nF U2 ESP32-C3FH4 LNA_IN1 VDD3P32 VDD3P33 XTAL_32K_P4 XTAL_32K_N5 GPIO26 CHIP_EN7 MTMS 9 MTDI 10 VDD3P3_RTC 11 MTCK 12 MTDO 13 GPIO8 14 GPIO9 15 GPIO10 16 VDD3P3_CPU 17VDD_SPI 18SPIHD 19SPIWP 20SPICS0 21SPICLK 22SPID 23SPIQ 24 U0RXD 27 U0TXD 28 XTAL_N 29 XTAL_P 30 GND 33 GPIO38 VDDA 32 VDDA 31 GPIO19 26 GPIO18 25 C11 1uF 40MHz(±10ppm) XIN 1 GND 2XOUT 3 GND 4 GPIO19 CHIP_EN GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 U0RXD GPIO18 LNA_IN GPIO9 GPIO10 GPIO0 GPIO1 SPICS0 GPIO2 GPIO3 RF_ANT U0TXD GPIO2 GPIO3 CHIP_EN GPIO1 GPIO0 GPIO10 GPIO6 GPIO7 GPIO8 GPIO9 GPIO18 GPIO19 U0RXD U0TXD GPIO4 GPIO5 Figure 6: ESP32-C3-MINI-1U Schematics Espressif Systems 31 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

9 Peripheral Schematics

This is the typical application circuit of the module connected with peripheral components (for example, power supply, antenna, reset button, JTAG interface, and UART interface). D D C C B B A A NC: No component. ESP32-C3-MINI-1 ESP32-C3-MINI-1U IO4 IO5 IO6 IO7 IO8 IO2 IO3 EN IO9 IO0 IO1 IO10 RXD0 TXD0 EN TMS TDI TCK TDO IO19 IO18 USB_D- USB_D+ GND VDD33 GND GND GND GND GND VDD33GND GND GNDGND VDD33 GND TBD R7 NC TBD C4 0.1uF R2 0 R9 10K JP2 Boot Option GND1 3V33 IO9 23 NC4 IO25 IO36 NC7 NC9 NC10 NC 15 IO10 16 NC 17 IO4 18 IO5 19 NC 32 TXD0 31 RXD0 30 NC 34 NC 33 IO18 26 NC 29 NC 28 IO19 27 IO7 21 IO8 22 IO0 12 IO1 13 GND52 IO6 20 NC 35 NC 24 EPAD 49 GND2 GND53 GND 51 GND 50 EN8 GND 36 GND 37 GND 38 GND 39 GND 40 GND 41 GND 42 GND 43 GND 44 GND 45 GND 46 GND 47 GND 48 GND 14 GND11 NC 25 R6 0 JP3 USB 10uF C8 12pF(NC) 0.1uF C7 12pF(NC) SW1 JP4 UART 32.768kHz(NC) 1 2 JP1 JTAG 1 1 2 2 3 3 4 4 R6 0(NC) R8 10KR5 0(NC) TBD R4 0 TBD Figure 7: Peripheral Schematics

• Soldering the EPAD to the ground of the base board is not a must, however, it can optimize thermal performance. If you choose to solder it, please apply the correct amount of soldering paste. Too much soldering paste may increase the gap between the module and the baseboard. As a result, the adhesion between other pins and the baseboard may be poor.
• To ensure that the power supply to the ESP32-C3 chip is stable during power-up, it is advised to add an RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and C = 1µF. However, specific parameters should be adjusted based on the power-up timing of the module and the power-up and reset sequence timing of the chip. For ESP32-C3’s power-up and reset sequence timing diagram, please refer toESP32-C3 Series Datasheet> SectionPower Supply. Espressif Systems 32 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

10 Physical Dimensions

10.1 Module Dimensions

5.4 Top viewSide viewBottom view2.4±0.15 Figure 8: ESP32-C3-MINI-1 Physical Dimensions 5.4 5.6 Figure 9: ESP32-C3-MINI-1U Physical Dimensions Note: For information about tape, reel, and product marking, please refer toEspressif Module Packaging Information. Espressif Systems 33 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

10.2 Dimensions of External Antenna Connector

ESP32-C3-MINI-1U uses the third generation external antenna connector as shown in Figure10 Dimensions of External Antenna Connector. This connector is compatible with the following connectors:

• W.FL Series connector from Hirose
• MHF III connector from I-PEX
• AMMC connector from Amphenol SECTION: A-ASCALE: 1:1 A1.7 1.7 0.85 2.05±0.101.40 A 0.10 0.57 INSULATION RESISTANCE: 500MOHM Min.DIELECTRIC WITHSTANDING VOLTAGE: 200V AC FOR 1MINUTE; CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER;PERFORMANCE:CONTACT RESISTANCE: 20mOHM Max. HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0;SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; CONTACT GROUND CONTACT 2.00±0.10 Unit: mmTolerance: +/-0.1 mm HOUSINGCONTACT SHELL Figure 10: Dimensions of External Antenna Connector fig:10.2-ant-connector Espressif Systems 34 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

11 PCB Layout Recommendations

11.1 PCB Land Pattern

• Figures for recommended PCB land patterns with all the dimensions needed for PCB design. See Figure

11 ESP32-C3-MINI-1 Recommended PCB Land Patternand Figure12 ESP32-C3-MINI-1U Recommended

• Source files of recommended PCB land patterns to measure dimensions not covered in Figure11 and

Figure 12. You can view the source files forESP32-C3-MINI-1 and ESP32-C3-MINI-1U with Autodesk

• 3D models ofESP32-C3-MINI-1 and ESP32-C3-MINI-1U. Please make sure that you download the 3D model file in .STEP format (beware that some browsers might add .txt). Figure 11: ESP32-C3-MINI-1 Recommended PCB Land Pattern Espressif Systems 35 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

Figure 12: ESP32-C3-MINI-1U Recommended PCB Land Pattern

11.2 Module Placement for PCB Design

If module-on-board design is adopted, attention should be paid while positioning the module on the base board. The interference of the base board on the module’s antenna performance should be minimized. For details about module placement for PCB design, please refer toESP32-C3 Hardware Design Guidelines> Section Positioning a Module on a Base Board. Espressif Systems 36 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

12 Product Handling

12.1 Storage Conditions

The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric environment of < 40 °C and 90%RH. The module is rated at the moisture sensitivity level (MSL) of 3. After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and 60%RH. If the above conditions are not met, the module needs to be baked.

12.2 Electrostatic Discharge (ESD)

• Human body model (HBM): ±2000 V
• Charged-device model (CDM): ±500 V

12.3 Reflow Profile

Solder the module in a single reflow. 50 1000 150 200 250 200 100 150 250 Time (s) 217 Preheating 150 – 200 °C 60 – 120 s Ramp-up 25 – 150 °C 60 – 90 s 1 – 3 °C/s Soldering ＞ 217 °C 60 – 90 s Peak temperature: 235 – 250 °C Peak time: 30 – 70 s Soldering time: ＞ 30 s Solder: Sn-Ag-Cu (SAC/three.case/zero.case/five.case) lead-free solder T emperature (°C) 180 230 Cooling ＜ 180 °C –5 ~ –1 °C/s Figure 13: Reflow Profile Espressif Systems 37 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

12.4 Ultrasonic Vibration

Avoid exposing Espressif modules to vibration from ultrasonic equipment, such as ultrasonic welders or ultrasonic cleaners. This vibration may induce resonance in the in-module crystal and lead to its malfunction or even failure. As a consequence,the module may stop working or its performance may deteriorate. Espressif Systems 38 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

Related Documentation and Resources Related Documentation and Resources Related Documentation

• ESP32-C3 Series Datasheet – Specifications of the ESP32-C3 hardware.
• ESP32-C3 TechnicalReferenceManual – Detailed information on how to use the ESP32-C3 memory and periph- erals.
• ESP32-C3 Hardware Design Guidelines – Guidelines on how to integrate the ESP32-C3 into your hardware prod- uct.
• ESP32-C3 Series SoC Errata – Descriptions of known errors in ESP32-C3 series of SoCs.
• Certificates https:/ /espressif.com/en/support/documents/certificates
• ESP32-C3 Product/Process Change Notifications (PCN) https:/ /espressif.com/en/support/documents/pcns?keys=ESP32-C3
• ESP32-C3 Advisories– Information on security, bugs, compatibility, component reliability. https:/ /espressif.com/en/support/documents/advisories?keys=ESP32-C3
• Documentation Updates and Update Notification Subscription https:/ /espressif.com/en/support/download/documents Developer Zone
• ESP-IDF Programming Guide for ESP32-C3 – Extensive documentation for the ESP-IDF development framework.
• ESP-IDF and other development frameworks on GitHub. https:/ /github.com/espressif
• ESP32 BBS Forum– Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions, share knowledge, explore ideas, and help solve problems with fellow engineers. https:/ /esp32.com/
• The ESP Journal– Best Practices, Articles, and Notes from Espressif folks. https:/ /blog.espressif.com/
• See the tabsSDKs and Demos, Apps, Tools, AT Firmware. https:/ /espressif.com/en/support/download/sdks-demos Products
• ESP32-C3 Series SoCs– Browse through all ESP32-C3 SoCs. https:/ /espressif.com/en/products/socs?id=ESP32-C3
• ESP32-C3 Series Modules– Browse through all ESP32-C3-based modules. https:/ /espressif.com/en/products/modules?id=ESP32-C3
• ESP32-C3 Series DevKits– Browse through all ESP32-C3-based devkits. https:/ /espressif.com/en/products/devkits?id=ESP32-C3
• ESP Product Selector– Find an Espressif hardware product suitable for your needs by comparing or applying filters. https:/ /products.espressif.com/#/product-selector?language=en Contact Us
• See the tabsSales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples (Online stores),Become Our Supplier, Comments & Suggestions. https:/ /espressif.com/en/contact-us/sales-questions Espressif Systems 39 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

Revision History

Date Version Release notes 2025-04-14 v2.0 According to updates inCompatibility Advisory for ESP32-C3 Chip Revision v1.1, updated SRAM space in note 6 for T ableESP32-C3-MINI-1U (CONN) Series Comparison 2025-01-24 v1.9 Updated chip in ESP32-C3-MINI-1-N4 and ESP32-C3-MINI-1U-N4 from ESP32- C3FN4 to ESP32-C3FH4 2024-11-20 v1.8

• T able1 ESP32-C3-MINI-1 (ANT) Series Comparison1 and 2 ESP32-C3- MINI-1U (CONN) Series Comparison: – Added the ESP32-C3-MINI-1-N4X, ESP32-C3-MINI-1U-N4X, and ESP32-C3-MINI-1U-H4X variants – Marked the ESP32-C3-MINI-1U-N4 and ESP32-C3-MINI-1U-H4 vari- ants as Not Recommended for New Designs (NRND)
• Added T able13 Current Consumption for Bluetooth LE in Active Mode 2024-09-19 v1.7
• T able2 ESP32-C3-MINI-1U (CONN) Series Comparison: Updated flash program/erase cycles, data retention time (note 4) and maximum clock frequency (note 7)
• Improved the wording and structure of following sections: – Updated Section ”Strapping Pins” and renamed to4 Boot Configu- rations – Added Chapter5 Peripherals – Updated T able ”Wi-Fi RF Standards” and renamed to ”Wi-Fi RF Char- acteristics” – Added Section11.2 Module Placement for PCB Design – Optimized Figure13 Reflow Profile 2024-07-29 v1.6 Added Compatibility Advisory for ESP32-C3 Chip Revision v1.1 to the notes of T ableESP32-C3-MINI-1U (CONN) Series Comparison 2024-06-05 v1.5
• Added new variant ESP32-C3-MINI-1-H4X
• Marked the ESP32-C3-MINI-1-N4, ESP32-C3-MINI-1-H4, and ESP32-C3- MINI-1-H4-AZ variants as Not Recommended for New Designs (NRND) Cont’d on next page Espressif Systems 40 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

Cont’d from previous page Date Version Release notes 2024-05-15 v1.4

• Updated note 5 of T ableESP32-C3-MINI-1 (ANT) Series Comparison1 and T ableESP32-C3-MINI-1U (CONN) Series Comparison
• Updated the formatting of Section4 Boot Configurations
• Updated the maximum value of ”RF power control range” to 20 dBm in T ableBluetooth LE RF Characteristics
• Updated the note about solder paste in Section9 Peripheral Schematics
• Updated the markings of dimensions and thermal pad vias in Section11.1 PCB Land Pattern 2022-11-08 v1.3
• Added a new variant ESP32-C3-MINI-1-H4-AZ
• Changed T ableOrdering Informationto T ableESP32-C3-MINI-1 (ANT) Se- ries Comparison1 and T ableESP32-C3-MINI-1U (CONN) Series Compari- son
• Updated test condition descriptions and data in Section6.4 Current Con- sumption Characteristics
• Updated ”RF power control range” in T ableBluetooth LE RF Characteris- tics
• Added descriptions in Section11.1PCB Land Pattern 2022-06-30 v1.2 Added Section12.4 Ultrasonic Vibration 2022-05-16 v1.1
• Added a note under T ableOrdering Information
• Updated Chapter8 Module Schematics 2021-06-21 v1.0
• Updated module description on the title page
• Deleted Section ”About This Document”
• Restructured Section1.1Features
• Added ordering code in T ableOrdering Information
• Added descriptions in Section10.2 Dimensions of External Antenna Con- nector
• Updated Section ”Learning Resources” and renamed toRelated Docu- mentation and Resources
• Replaced ”chip family” with ”chip series” following Espressif’s taxonomy 2021-04-16 v0.7 Added information about ESP32-C3-MINI-1U module 2021-02-22 v0.6 Updated the value of C7 to 0.1µF in Chapter8 Module Schematics 2021-02-05 v0.5 Preliminary release Espressif Systems 41 Submit Documentation Feedback ESP32-C3-MINI-1 & MINI-1U Datasheet v2.0

Disclaimer and Copyright Notice Information in this document, including URL references, is subject to change without notice. ALL THIRD PARTY’S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES TO ITS AUTHENTICITY AND ACCURACY . NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY , NON-INFRINGEMENT , FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a registered trademark of Bluetooth SIG. All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners, and are hereby acknowledged. Copyright © 2025 Espressif Systems (Shanghai) Co., Ltd. All rights reserved. www.espressif.com