ESP32-MINI-1U-H4

ESP32-MINI-1 ESPRESSIF | Alldatasheet

Document overview

• Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
• PDF pages: 47

Technical content

Datasheet sections

• 1 Module Overview
• 1.1 Features
• 1.2 Series Comparison
• 1.3 Applications
• 2 Block Diagram
• 3 Pin Definitions
• 3.1 Pin Layout
• 3.2 Pin Description
• 4 Boot Configurations
• 4.1 Chip Boot Mode Control
• 4.2 Internal LDO (VDD_SDIO) Voltage Control
• 4.3 U0TXD Printing Control
• 4.4 Timing Control of SDIO Slave
• 4.5 JTAG Signal Source Control
• 5 Peripherals
• 5.1 Peripheral Overview
• 5.2 Digital Peripherals
• 5.2.1 General Purpose Input / Output Interface (GPIO)
• 5.2.2 Serial Peripheral Interface (SPI)
• 5.2.3 Universal Asynchronous Receiver Transmitter (UART)
• 5.2.4 I2C Interface
• 5.2.5 I2S Interface
• 5.2.6 Remote Control Peripheral
• 5.2.7 Pulse Counter Controller (PCNT)
• 5.2.8 LED PWM Controller
• 5.2.9 Motor Control PWM
• 5.2.10 SD/SDIO/MMC Host Controller
• 5.2.11 SDIO/SPI Slave Controller
• 5.2.12 TWAI® Controller
• 5.2.13 Ethernet MAC Interface
• 5.3 Analog Peripherals
• 5.3.1 Analog-to-Digital Converter (ADC)
• 5.3.2 Digital-to-Analog Converter (DAC)
• 5.3.3 Touch Sensor
• 6 Electrical Characteristics
• 6.1 Absolute Maximum Ratings
• 6.2 Recommended Operating Conditions

Datasheet sections

• 6.4 Current Consumption in Active Mode
• 7 RF Characteristics
• 7.1 Wi-Fi Radio
• 7.1.1 Wi-Fi RF Transmitter (TX) Characteristics
• 7.1.2 Wi-Fi RF Receiver (RX) Characteristics
• 7.2 Bluetooth Radio
• 7.2.1 Receiver – Basic Data Rate
• 7.2.2 Transmitter – Basic Data Rate
• 7.2.3 Receiver – Enhanced Data Rate
• 7.2.4 Transmitter – Enhanced Data Rate
• 7.3 Bluetooth LE Radio
• 7.3.1 Bluetooth LE RF Receiver (RX) Characteristics
• 7.3.2 Bluetooth LE RF Transmitter (TX) Characteristics
• 8 Module Schematics
• 9 Peripheral Schematics
• 10 Physical Dimensions
• 10.1 Module Dimensions
• 10.2 Dimensions of External Antenna Connector
• 11 PCB Layout Recommendations
• 11.1 PCB Land Pattern
• 11.2 Module Placement for PCB Design
• 12 Product Handling
• 12.1 Storage Conditions
• 12.2 Electrostatic Discharge (ESD)
• 12.3 Reflow Profile
• 12.4 Ultrasonic Vibration

Datasheet Version 1.5

2.4 GHz Wi-Fi + Bluetooth® + Bluetooth LE module

Built around ESP32 series of SoC, Xtensa® dual-core 32-bit LX6 microprocessor

4 MB flash

28 GPIOs, rich set of peripherals

On-board PCB antenna or external antenna connector ESP32-MINI-1 ESP32-MINI-1U www.espressif.com

1 Module Overview

Note: Check the link or the QR code to make sure that you use the latest version of this document: https://espressif.com/sites/default/files/documentation/esp32-mini-1_datasheet_en.pdf

1.1 Features

• ESP32-U4WDH embedded, Xtensa dual-core 32-bit LX6 microprocessor, up to 240 MHz
• 448 KB ROM
• 520 KB SRAM
• 16 KB SRAM in RTC
• 4 MB SPI flash Wi-Fi
• 802.11b/g/n
• Bit rate: 802.11n up to 150 Mbps
• A-MPDU and A-MSDU aggregation
• 0.4µs guard interval support
• Center frequency range of operating channel: 2412~ 2484 MHz Bluetooth®
• Bluetooth v4.2 BR/EDR and Bluetooth LE specification
• Class-1, class-2, and class-3 transmitter
• AFH
• CVSD and SBC Peripherals
• Up to 28 GPIOs – 5 strapping GPIOs – 6 GPIOs used for in-package flash – 6 input-only GPIOs
• SD card, UART, SPI, SDIO, I2C, LED PWM, motor PWM, I2S, infrared remote controller, pulse counter, GPIO, touch sensor, ADC, DAC, Ethernet, TWAI® (compatible with ISO 11898-1, i.e. CAN Specification 2.0) Integrated Components on Module
• 40 MHz crystal oscillator Antenna Options
• ESP32-MINI-1: On-board PCB antenna
• ESP32-MINI-1U: external antenna via a connector Operating Conditions
• Operating voltage/Power supply: 3.0~ 3.6 V
• Operating ambient temperature: – 85 °C version module: –40~ 85 °C – 105 °C version module: –40~ 105 °C Certification
• RF certification: SeeCertificates
• Green certification: REACH/RoHS Test
• Reliability: HTOL/HTSL/uHAST/TCT/ESD Espressif Systems 2 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

1.2 Series Comparison

ESP32-MINI-1 and ESP32-MINI-1U are highly-integrated, small-sized Wi-Fi + Bluetooth + Bluetooth LE MCU modules that have a rich set of peripherals. The modules are ideal choices for a wide variety of IoT applications, ranging from home automation, smart building, consumer electronics to industrial control, especially suitable for applications within a compact space, such as bulbs, switches and sockets. ESP32-MINI-1 comes with an on-board PCB antenna, and ESP32-MINI-1U with a connector for external antenna. They both feature a 4 MB flash integrated in the chip’s package. Both ESP32-MINI-1 and ESP32-MINI-1U come in two versions:

• 85 °C version
• 105 °C version The two versions only vary in maximum ambient temperature. In this datasheet unless otherwise stated, ESP32-MINI-1 refers to both ESP32-MINI-1-N4 and ESP32-MINI-1-H4, whereas ESP32-MINI-1U refers to both ESP32-MINI-1U-N4 and ESP32-MINI-1U-H4. The series comparison for ESP32-MINI-1 and ESP32-MINI-1U is as follows: Table 1: ESP32-MINI-1 Series Comparison1 Ambient Temp.2 Size3 Ordering Code Flash (°C) (mm) ESP32-MINI-1-N4 4 MB –40 ~ 85 13.2 × 19.0 × 2.4ESP32-MINI-1-H4 4 MB –40 ~ 105 1 This table shares the same notes presented in Table2below. Table 2: ESP32-MINI-1U Series Comparison Ambient Temp.2 Size3 Ordering Code Flash4 (°C) (mm) ESP32-MINI-1U-N4 4 MB –40 ~ 85 13.2 × 13.5 × 2.4ESP32-MINI-1U-H4 4 MB –40 ~ 105

2 Ambient temperature specifies the recommended temperature

range of the environment immediately outside the Espressif mod- ule. 3 For details, refer to Section10.1Module Dimensions. 4 The flash is integrated in the chip’s package. The flash supports: - More than 100,000 program/erase cycles - More than 20 years data retention time At the core of this module is ESP32-U4WDH, an Xtensa 32-bit LX6 CPU that operates at up to 240 MHz. You can power off the CPU and make use of the low-power co-processor to constantly monitor the peripherals for changes or exceeding of thresholds. Espressif Systems 3 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

Note:

• For more information on ESP32-U4WDH, please refer toESP32 Series Datasheet.
• For chip revision identification, ESP-IDF release that supports a specific chip revision, and other information on chip revisions, please refer toESP32 Series SoC Errata> SectionChip Revision.

1.3 Applications

• Smart Home
• Industrial Automation
• Health Care
• Consumer Electronics
• Smart Agriculture
• POS Machines
• Service Robot
• Audio Devices
• Generic Low-power IoT Sensor Hubs
• Generic Low-power IoT Data Loggers
• Cameras for Video Streaming
• Speech Recognition
• Image Recognition
• SDIO Wi-Fi + Bluetooth Networking Card Espressif Systems 4 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

1 ESP32-MINI-1 Series Comparison 1 3

2 ESP32-MINI-1U Series Comparison 3

3 Pin Definitions 11

4 Default Configuration of Strapping Pins 13

5 Description of Timing Parameters for the Strapping Pins 14

6 Chip Boot Mode Control 14

7 U0TXD Printing Control 16

8 Timing Control of SDIO Slave 16

9 ADC Characteristics 24

10 ADC Calibration Results 25

11 Capacitive-Sensing GPIOs Available on ESP32 25

13 Recommended Operating Conditions 27

14 DC Characteristics (3.3 V, 25 °C) 27

15 Current Consumption Depending on RF Modes 28

16 Wi-Fi RF Characteristics 29

17 TX Power with Spectral Mask and EVM Meeting 802.11 Standards 29

18 TX EVM Test1 29

19 RX Sensitivity 30

20 Maximum RX Level 31

21 RX Adjacent Channel Rejection 31

22 Receiver Characteristics – Basic Data Rate 31

23 Transmitter Characteristics – Basic Data Rate 32

24 Receiver Characteristics – Enhanced Data Rate 32

25 Transmitter Characteristics – Enhanced Data Rate 33

26 Bluetooth LE RF Characteristics 34

27 Receiver Characteristics – Bluetooth LE 34

28 Transmitter Characteristics – Bluetooth LE 34

Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

1 ESP32-MINI-1 Block Diagram 9

2 ESP32-MINI-1U Block Diagram 9

3 ESP32-MINI-1 Pin Layout (Top View) 10

4 ESP32-MINI-1U Pin Layout (Top View) 11

5 Visualization of Timing Parameters for the Strapping Pins 14

6 Chip Boot Flow 15

7 ESP32-MINI-1 Schematics 36

8 ESP32-MINI-1U Schematics 37

9 Peripheral Schematics 38

10 ESP32-MINI-1 Physical Dimensions 39

11 ESP32-MINI-1U Physical Dimensions 39

12 Dimensions of External Antenna Connector 40

13 ESP32-MINI-1 Recommended PCB Land Pattern 41

14 ESP32-MINI-1U PCB Recommended PCB Land Pattern 42

15 Reflow Profile 43

Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

2 Block Diagram

SPI FlashESP32-U4WDHRF Matching40 MHzCrystal3V3ESP32-MINI-1ENGPIOsAntenna Figure 1: ESP32-MINI-1 Block Diagram SPI FlashESP32-U4WDHRF Matching40 MHzCrystal3V3ESP32-MINI-1UENGPIOsAntenna Figure 2: ESP32-MINI-1U Block Diagram Espressif Systems 9 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

3 Pin Definitions

3.1 Pin Layout

Thepindiagramsbelowshowtheapproximatelocationofpinsonthemodule. Fortheactualdiagramdrawnto scale, please refer to Figure10.1Module Dimensions. Keepout Zone Pin 55GNDGNDGNDGNDGNDGNDGNDGNDGNDGND3V3I37I38I39ENI34I35IO32GNDI36IO33IO25IO26IO27IO14IO12IO13IO15IO2IO0IO4NCNCIO9IO10GNDIO23NCIO19IO22IO21RXD0TXD0NCGNDGNDGNDIO18IO5GNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDPin 1Pin 2Pin 3Pin 4Pin 5Pin 6Pin 7Pin 8Pin 9Pin 10Pin 11Pin 12Pin 13Pin 14Pin 15Pin 16Pin 17Pin 18Pin 19Pin 20Pin 21Pin 22Pin 23Pin 24Pin 25Pin 26Pin 27Pin 28Pin 29Pin 30Pin 31Pin 32Pin 33Pin 34Pin 35Pin 36Pin 37Pin 38Pin 39Pin 40Pin 41Pin 42Pin 43Pin 44Pin 45Pin 46Pin 47Pin 48Pin 49Pin 50Pin 51Pin 52Pin 53Pin 54 Figure 3: ESP32-MINI-1 Pin Layout (Top View) Espressif Systems 10 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

Pin 55GNDGNDGNDGNDGNDGNDGNDGNDGND3V3I37I38I39ENI34I35IO32GNDI36IO33IO25IO26IO27IO14IO12IO13IO15IO2IO0IO4NCNCIO9IO10GNDIO23NCIO19IO22IO21RXD0TXD0NCGNDGNDGNDIO18IO5GNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDPin 1Pin 2Pin 3Pin 4Pin 5Pin 6Pin 7Pin 8Pin 9Pin 10Pin 11Pin 12Pin 13Pin 14Pin 15Pin 16Pin 17Pin 18Pin 19Pin 20Pin 21Pin 22Pin 23Pin 24Pin 25Pin 26Pin 27Pin 28Pin 29Pin 30Pin 31Pin 32Pin 33Pin 34Pin 35Pin 36Pin 37Pin 38Pin 39Pin 40Pin 41Pin 42Pin 43Pin 44Pin 45Pin 46Pin 47Pin 48Pin 49Pin 50Pin 51Pin 52Pin 53Pin 54 Figure 4: ESP32-MINI-1U Pin Layout (Top View)

3.2 Pin Description

ESP32-MINI-1 and ESP32-MINI-1U each has 55 pins. See pin definitions in Table3Pin Description. For peripheral pin configurations, please refer to Section5.2Digital Peripherals. Table 3: Pin Definitions Name No. Type* Function GND 1, 2, 27, 38~

55 P Ground

I36 4 I GPIO36, ADC1_CH0, RTC_GPIO0 I37 5 I GPIO37, ADC1_CH1, RTC_GPIO1 I38 6 I GPIO38, ADC1_CH2, RTC_GPIO2 I39 7 I GPIO39, ADC1_CH3, RTC_GPIO3 EN 8 I High: enables the chip Low: the chip shuts down Note: do not leave the pin floating I34 9 I GPIO34, ADC1_CH6, RTC_GPIO4 Cont’d on next page Espressif Systems 11 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

Table 3 – cont’d from previous page Name No. Type Function I35 10 I GPIO35, ADC1_CH7, RTC_GPIO5 IO32 11 I/O GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4, TOUCH9, RTC_GPIO9 IO33 12 I/O GPIO33,XTAL_32K_N(32.768kHzcrystaloscillatoroutput),ADC1_CH5, TOUCH8, RTC_GPIO8 IO25 13 I/O GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0 IO26 14 I/O GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1 IO27 15 I/O GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV IO14 16 I/O GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK, EMAC_TXD2 IO12 17 I/O GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2, SD_DATA2, EMAC_TXD3 IO13 18 I/O GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK,HSPID,HS2_DATA3, SD_DATA3, EMAC_RX_ER IO15 19 I/O GPIO15, ADC2_CH3, TOUCH3, RTC_GPIO13, MTDO, HSPICS0, HS2_CMD, SD_CMD, EMAC_RXD3 IO2 20 I/O GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0, SD_DATA0 IO0 21 I/O GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK IO4 22 I/O GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1, EMAC_TX_ER NC 23 - No connect NC 24 - No connect IO9 25 I/O GPIO9, HS1_DATA2, U1RXD, SD_DATA2 IO10 26 I/O GPIO10, HS1_DATA3, U1TXD, SD_DATA3 NC 28 - No connect IO5 29 I/O GPIO5, HS1_DATA6, VSPICS0, EMAC_RX_CLK IO18 30 I/O GPIO18, HS1_DATA7, VSPICLK IO23 31 I/O GPIO23, HS1_STROBE, VSPID IO19 32 I/O GPIO19, VSPIQ, U0CTS, EMAC_TXD0 IO22 33 I/O GPIO22, VSPIWP, U0RTS, EMAC_TXD1 IO21 34 I/O GPIO21, VSPIHD, EMAC_TX_EN RXD0 35 I/O GPIO3, U0RXD, CLK_OUT2 TXD0 36 I/O GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2 NC 37 - No connect * Pins GPIO6, GPIO7, GPIO8, GPIO11, GPIO16, and GPIO17 on the ESP32-U4WDH chip are connected to the SPI flash integrated in the chip and cannot be used for other purposes except for connecting external PSRAM. * P: power supply; I: input; O: output. Highligted cells: Input only pins, output is not supported due to lack of pull-up/pull-down resistors. Espressif Systems 12 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

4 Boot Configurations

Note: The content below is excerpted fromESP32 Series Datasheet> SectionBoot Configurations. For the strapping pin mapping between the chip and modules, please refer to Chapter8Module Schematics. The chip allows for configuring the following boot parameters through strapping pins and eFuse bits at power-up or a hardware reset, without microcontroller interaction.

• Chip boot mode – Strapping pin: GPIO0 and GPIO2
• Internal LDO (VDD_SDIO) Voltage – Strapping pin: MTDI – eFuse bit: EFUSE_SDIO_FORCE and EFUSE_SDIO_TIEH
• U0TXD printing – Strapping pin: MTDO
• Timing of SDIO Slave – Strapping pin: MTDO and GPIO5
• JTAG signal source – eFuse bit: EFUSE_DISABLE_JTAG The default values of all the above eFuse bits are 0, which means that they are not burnt. Given that eFuse is one-time programmable, once an eFuse bit is programmed to 1, it can never be reverted to 0. For how to program eFuse bits, please refer toESP32 Technical Reference Manual> ChaptereFuse Controller. The default values of the strapping pins, namely the logic levels, are determined by pins’ internal weak pull-up/pull-down resistors at reset if the pins are not connected to any circuit, or connected to an external high-impedance circuit. Table 4: Default Configuration of Strapping Pins Strapping Pin Default Configuration Bit Value GPIO0 Pull-up 1 GPIO2 Pull-down 0 MTDI Pull-down 0 MTDO Pull-up 1 GPIO5 Pull-up 1 To change the bit values, the strapping pins should be connected to external pull-down/pull-up resistances. If the ESP32 is used as a device by a host MCU, the strapping pin voltage levels can also be controlled by the host MCU. All strapping pins have latches. At system reset, the latches sample the bit values of their respective strapping pins and store them until the chip is powered down or shut down. The states of latches cannot be changed in Espressif Systems 13 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

any other way. It makes the strapping pin values available during the entire chip operation, and the pins are freed up to be used as regular IO pins after reset. The timing of signals connected to the strapping pins should adhere to thesetup timeandhold time specifications in Table5and Figure5. Table 5: Description of Timing Parameters for the Strapping Pins Parameter Description Min (ms) tSU Setup timeisthetimereservedforthepowerrailstostabilizebe- fore the CHIP_PU pin is pulled high to activate the chip. 0 tH Hold timeis the time reserved for the chip to read the strapping pin values after CHIP_PU is already high and before these pins start operating as regular IO pins. Strapping pin VIL_nRST VIH tSU tH CHIP_PU Figure 5: Visualization of Timing Parameters for the Strapping Pins

4.1 Chip Boot Mode Control

GPIO0 and GPIO2 control the boot mode after the reset is released. See Table6Chip Boot Mode Control. Table 6: Chip Boot Mode Control Boot Mode GPIO0 GPIO2 SPI Boot Mode 1 Any value Joint Download Boot Mode2 0 0 1 Bold marks the default value and configuration.

2 Joint Download Boot mode supports the following

download methods:

• SDIO Download Boot
• UART Download Boot In Joint Download Boot mode, the detailed boot flow of the chip is put below6. Espressif Systems 14 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

Figure 6: Chip Boot Flow uart_download_dis controls boot mode behaviors: It permanently disables Download Boot mode when uart_download_dis is set to 1 (valid only for ESP32 chip revisions v3.0 and higher).

4.2 Internal LDO (VDD_SDIO) Voltage Control

MTDI is used to select the VDD_SDIO power supply voltage at reset:

• MTDI = 0 (by default), VDD_SDIO pin is powered directly from VDD3P3_RTC. Typically this voltage is 3.3 V. For more information, seeESP32 Series Datasheet> SectionPower Scheme.
• MTDI = 1, VDD_SDIO pin is powered from internal 1.8 V LDO. This functionality can be overridden by setting EFUSE_SDIO_FORCE to 1, in which case the EFUSE_SDIO_TIEH determines the VDD_SDIO voltage:
• EFUSE_SDIO_TIEH = 0, VDD_SDIO connects to 1.8 V LDO.
• EFUSE_SPI_TIEH = 1, VDD_SDIO connects to VDD3P3_RTC. Espressif Systems 15 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

4.3 U0TXD Printing Control

During booting, the strapping pin MTDO can be used to control the U0TXD Printing, as Table7shows. Table 7: U0TXD Printing Control U0TXD Printing Control MTDO Enabled 1 1 Disabled 0

1 Bold marksthedefaultvalueand

configuration.

4.4 Timing Control of SDIO Slave

The strapping pin MTDO and GPIO5 can be used to control the timing of SDIO slave, see Table8Timing Control of SDIO Slave. Table 8: Timing Control of SDIO Slave Edge behavior MTDO GPIO5 Falling edge sampling, falling edge output 0 0 Falling edge sampling, rising edge output 0 1 Rising edge sampling, falling edge output 1 0 Rising edge sampling, rising edge output 1 1 1 Bold marks the default value and configuration.

4.5 JTAG Signal Source Control

If EFUSE_DISABLE_JTAG is set to 1, the source of JTAG signals can be disabled. Espressif Systems 16 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

5 Peripherals

5.1 Peripheral Overview

ESP32-U4WDH chip integrate a rich set of peripherals including SPI, I2S, UART, I2C, pulse count controller, TWAI®, ADC, DAC, touch sensor, etc. To learn more about on-chip components, please refer toESP32 Series Datasheet> SectionFunctional Description. Note:

• Thecontentbelowissourcedfrom ESP32 Series Datasheet>Section Functional Description. Someinformation maynotbeapplicabletoESP32-MINI-1andESP32-MINI-1UasnotalltheIOsignalsareexposedonthemodule.
• To learn more about peripheral signals, please refer toESP32 Technical Reference Manual> SectionPeripheral Signal List.

5.2 Digital Peripherals

5.2.1 General Purpose Input / Output Interface (GPIO)

ESP32 has 34 GPIO pins which can be assigned various functions by programming the appropriate registers. There are several kinds of GPIOs: digital-only, analog-enabled, capacitive-touch-enabled, etc. Analog-enabled GPIOs and Capacitive-touch-enabled GPIOs can be configured as digital GPIOs. Most of the digital GPIOs can be configured as internal pull-up or pull-down, or set to high impedance. When configured as an input, the input value can be read through the register. The input can also be set to edge-trigger or level-trigger to generate CPU interrupts. Most of the digital IO pins are bi-directional, non-inverting and tristate, including input and output buffers with tristate control. These pins can be multiplexed with other functions, such as the SDIO, UART, SPI, etc. (More details can be found in ESP32 Series Datasheet> Appendix, TableIO_MUX. ) For low-power operations, the GPIOs can be set to hold their states.

5.2.2 Serial Peripheral Interface (SPI)

ESP32 integrates four SPI controllers which can be used to communicate with external devices that use the SPI protocol. Controller SPI0 is used as a buffer for accessing external memory. Controller SPI1 can be used as a master. Controllers SPI2 and SPI3 can be configured as either a master or a slave. SPI1, SPI2, and SPI3 use signal buses prefixed with SPI, HSPI, and VSPI, respectively. Features of General Purpose SPI (GP-SPI)

• Programmable data transfer length, in multiples of 1 byte
• Four-line full-duplex/half-duplex communication and three-line half-duplex communication support
• Master mode and slave mode
• Programmable CPOL and CPHA Espressif Systems 17 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

• Programmable clock Pin Assignment For SPI, the pins are multiplexed with GPIO6 ~ GPIO11 via the IO MUX. For HSPI, the pins are multiplexed with GPIO2, GPIO4, GPIO12 ~ GPIO15 via the IO MUX. For VSPI, the pins are multiplexed with GPIO5, GPIO18 ~ GPIO19, GPIO21 ~ GPIO23 via the IO MUX. For more information about the pin assignment, seeESP32 Series Datasheet> SectionPeripheral Pin Configurations andESP32 Technical Reference Manual> ChapterIO_MUX and GPIO Matrix.

5.2.3 Universal Asynchronous Receiver Transmitter (UART)

The UART in the ESP32 chip facilitates the transmission and reception of asynchronous serial data between the chip and external UART devices. It consists of two UARTs in the main system, and one low-power LP UART. Feature List

• Programmable baud rate
• RAM shared by TX FIFOs and RX FIFOs
• Supports input baud rate self-check
• Support for various lengths of data bits and stop bits
• Parity bit support
• Asynchronous communication (RS232 and RS485) and IrDA support
• Supports DMA to communicate data in high speed
• Supports UART wake-up
• Supports both software and hardware flow control Pin Assignment The pins for UART can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, seeESP32 Series Datasheet> SectionPeripheral Pin Configurations andESP32 Technical Reference Manual> ChapterIO_MUX and GPIO Matrix.

5.2.4 I2C Interface

ESP32 has two I2C bus interfaces which can serve as I2C master or slave, depending on the user’s configuration. Feature List

• Two I2C controllers: one in the main system and one in the low-power system
• Standard mode (100 Kbit/s)
• Fast mode (400 Kbit/s) Espressif Systems 18 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

• Up to 5 MHz, yet constrained by SDA pull-up strength
• Support for 7-bit and 10-bit addressing, as well as dual address mode
• Supports continuous data transmission with disabled Serial Clock Line (SCL)
• Supports programmable digital noise filter Users can program command registers to control I2C interfaces, so that they have more flexibility. Pin Assignment For regular I2C, the pins used can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, seeESP32 Series Datasheet> SectionPeripheral Pin Configurations andESP32 Technical Reference Manual> ChapterIO_MUX and GPIO Matrix.

5.2.5 I2S Interface

The I2S Controller in the ESP32 chip provides a flexible communication interface for streaming digital data in multimedia applications, particularly digital audio applications. Feature List

• Master mode and slave mode
• Full-duplex and half-duplex communications
• A variety of audio standards supported
• Configurable high-precision output clock
• Supports PDM signal input and output
• Configurable data transmit and receive modes Pin Assignment The pins for the I2S Controller can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, seeESP32 Series Datasheet> SectionPeripheral Pin Configurations andESP32 Technical Reference Manual> ChapterIO_MUX and GPIO Matrix.

5.2.6 Remote Control Peripheral

The Remote Control Peripheral (RMT) controls the transmission and reception of infrared remote control signals. Feature List

• Eight channels for sending and receiving infrared remote control signals
• Independent transmission and reception capabilities for each channel
• Clock divider counter, state machine, and receiver for each RX channel
• Supports various infrared protocols Espressif Systems 19 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

The pins for the Remote Control Peripheral can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, seeESP32 Series Datasheet> SectionPeripheral Pin Configurations andESP32 Technical Reference Manual> ChapterIO_MUX and GPIO Matrix.

5.2.7 Pulse Counter Controller (PCNT)

The pulse counter controller (PCNT) is designed to count input pulses by tracking rising and falling edges of the input pulse signal. Feature List

• Eight independent pulse counter units
• Each pulse counter unit has a 16-bit signed counter register and two channels
• Counter modes: increment, decrement, or disable
• Glitch filtering for input pulse signals and control signals
• Selection between counting on rising or falling edges of the input pulse signal Pin Assignment The pins for the Pulse Count Controller can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, seeESP32 Series Datasheet> SectionPeripheral Pin Configurations andESP32 Technical Reference Manual> ChapterIO_MUX and GPIO Matrix.

5.2.8 LED PWM Controller

The LED PWM Controller (LEDC) is designed to generate PWM signals for LED control. Feature List

• Sixteen independent PWM generators
• Maximum PWM duty cycle resolution of 20 bits
• Eight independent timers with 20-bit counters, configurable fractional clock dividers and counter overflow values
• Adjustable phase of PWM signal output
• PWM duty cycle dithering
• Automatic duty cycle fading Pin Assignment The pins for the LED PWM Controller can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, seeESP32 Series Datasheet> SectionPeripheral Pin Configurations andESP32 Technical Reference Manual> ChapterIO_MUX and GPIO Matrix. Espressif Systems 20 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

5.2.9 Motor Control PWM

The Pulse Width Modulation (PWM) controller can be used for driving digital motors and smart lights. The controller consists of PWM timers, the PWM operator and a dedicated capture sub-module. Each timer provides timing in synchronous or independent form, and each PWM operator generates a waveform for one PWM channel. The dedicated capture sub-module can accurately capture events with external timing. Feature List

• Three PWM timers for precise timing and frequency control – Every PWM timer has a dedicated 8-bit clock prescaler – The 16-bit counter in the PWM timer can work in count-up mode, count-down mode, or count-up-down mode – A hardware sync can trigger a reload on the PWM timer with a phase register. It will also trigger the prescaler’ restart, so that the timer’s clock can also be synced, with selectable hardware synchronization source
• Three PWM operators for generating waveform pairs – Six PWM outputs to operate in several topologies – Configurable dead time on rising and falling edges; each set up independently – Modulating of PWM output by high-frequency carrier signals, useful when gate drivers are insulated with a transformer
• Fault Detection module – Programmable fault handling in both cycle-by-cycle mode and one-shot mode – A fault condition can force the PWM output to either high or low logic levels
• Capture module for hardware-based signal processing – Speed measurement of rotating machinery – Measurement of elapsed time between position sensor pulses – Period and duty cycle measurement of pulse train signals – Decoding current or voltage amplitude derived from duty-cycle-encoded signals of current/voltage sensors – Three individual capture channels, each of which with a 32-bit time-stamp register – Selection of edge polarity and prescaling of input capture signals – The capture timer can sync with a PWM timer or external signals Pin Assignment The pins for the Motor Control PWM can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, seeESP32 Series Datasheet> SectionPeripheral Pin Configurations andESP32 Technical Reference Manual> ChapterIO_MUX and GPIO Matrix. Espressif Systems 21 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

5.2.10 SD/SDIO/MMC Host Controller

An SD/SDIO/MMC host controller is available on ESP32. Feature List

• Supports two external cards
• Supports SD Memory Card standard: version 3.0 and version 3.01)
• Supports SDIO Version 3.0
• Supports Consumer Electronics Advanced Transport Architecture (CE-ATA Version 1.1)
• Supports Multimedia Cards (MMC version 4.41, eMMC version 4.5 and version 4.51) The controller allows up to 80 MHz clock output in three different data-bus modes: 1-bit, 4-bit, and 8-bit modes. It supports two SD/SDIO/MMC4.41 cards in a 4-bit data-bus mode. It also supports one SD card operating at 1.8 V. Pin Assignment The pins for SD/SDIO/MMC Host Controller are multiplexed with GPIO2, GPIO4, GPIO6 ~ GPIO15 via IO MUX. For more information about the pin assignment, seeESP32 Series Datasheet> SectionPeripheral Pin Configurations andESP32 Technical Reference Manual> ChapterIO_MUX and GPIO Matrix.

5.2.11 SDIO/SPI Slave Controller

ESP32 integrates an SD device interface that conforms to the industry-standard SDIO Card Specification Version 2.0, and allows a host controller to access the SoC, using the SDIO bus interface and protocol. ESP32 acts as the slave on the SDIO bus. The host can access the SDIO-interface registers directly and can access sharedmemoryviaaDMAengine,thusmaximizingperformancewithoutengagingtheprocessorcores. Feature List The SDIO/SPI slave controller supports the following features:

• SPI, 1-bit SDIO, and 4-bit SDIO transfer modes over the full clock range from 0 to 50 MHz
• Configurable sampling and driving clock edge
• Special registers for direct access by host
• Interrupts to host for initiating data transfer
• Automatic loading of SDIO bus data and automatic discarding of padding data
• Block size of up to 512 bytes
• Interrupt vectors between the host and the slave, allowing both to interrupt each other
• Supports DMA for data transfer Espressif Systems 22 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

The pins for SDIO/SPI Slave Controller are multiplexed with GPIO2, GPIO4, GPIO6 ~ GPIO15 via IO MUX. For more information about the pin assignment, seeESP32 Series Datasheet> SectionPeripheral Pin Configurations andESP32 Technical Reference Manual> ChapterIO_MUX and GPIO Matrix.

5.2.12 TWAI® Controller

The Two-wire Automotive Interface (TWAI®) is a multi-master, multi-cast communication protocol designed for automotive applications. The TWAI controller facilitates the communication based on this protocol. Feature List

• Compatible with ISO 11898-1 protocol (CAN Specification 2.0)
• Standard frame format (11-bit ID) and extended frame format (29-bit ID)
• Bit rates: – From 25 Kbit/s to 1 Mbit/s in chip revision v0.0/v1.0/v1.1 – From 12.5 Kbit/s to 1 Mbit/s in chip revision v3.0/v3.1
• Multiple modes of operation: Normal, Listen Only, and Self-Test
• 64-byte receive FIFO
• Special transmissions: single-shot transmissions and self reception
• Acceptance filter (single and dual filter modes)
• Error detection and handling: error counters, configurable error interrupt threshold, error code capture, arbitration lost capture Pin Assignment The pins for the Two-wire Automotive Interface can be chosen from any GPIOs via the GPIO Matrix. For more information about the pin assignment, seeESP32 Series Datasheet> SectionPeripheral Pin Configurations andESP32 Technical Reference Manual> ChapterIO_MUX and GPIO Matrix.

5.2.13 Ethernet MAC Interface

An IEEE-802.3-2008-compliant Media Access Controller (MAC) is provided for Ethernet LAN communications. ESP32 requires an external physical interface device (PHY) to connect to the physical LAN bus (twisted-pair, fiber, etc.). The PHY is connected to ESP32 through 17 signals of MII or nine signals of RMII. Feature List

• 10 Mbps and 100 Mbps rates
• Dedicated DMA controller allowing high-speed transfer between the dedicated SRAM and Ethernet MAC
• Tagged MAC frame (VLAN support)
• Half-duplex (CSMA/CD) and full-duplex operation Espressif Systems 23 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

• MAC control sublayer (control frames)
• 32-bit CRC generation and removal
• Several address-filtering modes for physical and multicast address (multicast and group addresses)
• 32-bit status code for each transmitted or received frame
• Internal FIFOs to buffer transmit and receive frames. The transmit FIFO and the receive FIFO are both 512 words (32-bit)
• Hardware PTP (Precision Time Protocol) in accordance with IEEE 1588 2008 (PTP V2)
• 25 MHz/50 MHz clock output Pin Assignment For information about the pin assignment of Ethernet MAC Interface, seeESP32 Series Datasheet> Section Peripheral Pin ConfigurationsandESP32 Technical Reference Manual> ChapterIO_MUX and GPIO Matrix.

5.3 Analog Peripherals

5.3.1 Analog-to-Digital Converter (ADC)

ESP32 integrates two 12-bit SAR ADCs and supports measurements on 18 channels (analog-enabled pins). TheULPcoprocessorinESP32isalsodesignedtomeasurevoltage,whileoperatinginthesleepmode,which enables low-power consumption. The CPU can be woken up by a threshold setting and/or via other triggers. Table9describes the ADC characteristics. Table 9: ADC Characteristics Parameter Description Min Max Unit DNL (Differential nonlinearity) RTC controller; ADC connected to an –7 7 LSBexternal 100 nF capacitor; DC signal input; INL (Integral nonlinearity) ambient temperature at 25 °C; –12 12 LSBWi-Fi&Bluetooth off Sampling rate RTC controller — 200 ksps DIG controller — 2 Msps Notes:

• When atten = 3 and the measurement result is above 3000 (voltage at approx. 2450 mV), the ADC accuracy will be worse than described in the table above.
• To get better DNL results, users can take multiple sampling tests with a filter, or calculate the average value.
• The input voltage range of GPIO pins within VDD3P3_RTC domain should strictly follow the DC characteristics provided in Table14. Otherwise, measurement errors may be introduced, and chip performance may be affected. Espressif Systems 24 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

By default, there are ±6% differences in measured results between chips. ESP-IDF provides couple of calibrationmethodsfor ADC1. Results after calibration using eFuse Vref value are shown in Table10. For higher accuracy, users may apply other calibration methods provided in ESP-IDF, or implement their own. Table 10: ADC Calibration Results Parameter Description Min Max Unit Total error Atten = 0, effective measurement range of 100∼ 950 mV –23 23 mV Atten = 1, effective measurement range of 100∼ 1250 mV –30 30 mV Atten = 2, effective measurement range of 150∼ 1750 mV –40 40 mV Atten = 3, effective measurement range of 150∼ 2450 mV –60 60 mV Pin Assignment With appropriate settings, the ADCs can be configured to measure voltage on 18 pins maximum. For detailed information about the pin assignment, seeESP32 Series Datasheet> SectionPeripheral Pin Configurations andESP32 Technical Reference Manual> ChapterIO_MUX and GPIO Matrix.

5.3.2 Digital-to-Analog Converter (DAC)

Two 8-bit DAC channels can be used to convert two digital signals into two analog voltage signal outputs. The design structure is composed of integrated resistor strings and a buffer. This dual DAC supports power supply as input voltage reference. The two DAC channels can also support independent conversions. Pin Assignment The DAC can be configured by GPIO 25 and GPIO 26. For detailed information about the pin assignment, see ESP32 Series Datasheet> SectionPeripheral Pin ConfigurationsandESP32 Technical Reference Manual> ChapterIO_MUX and GPIO Matrix.

5.3.3 Touch Sensor

ESP32 has 10 capacitive-sensing GPIOs, which detect variations induced by touching or approaching the GPIOs with a finger or other objects. The low-noise nature of the design and the high sensitivity of the circuit allow relatively small pads to be used. Arrays of pads can also be used, so that a larger area or more points can be detected. Pin Assignment The 10 capacitive-sensing GPIOs are listed in Table11. Table 11: Capacitive-Sensing GPIOs Available on ESP32 Capacitive-Sensing Signal Name Pin Name T0 GPIO4 T1 GPIO0 T2 GPIO2 T3 MTDO T4 MTCK Espressif Systems 25 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

Capacitive-Sensing Signal Name Pin Name T5 MTDI T6 MTMS T7 GPIO27 T8 32K_XN T9 32K_XP Note: ESP32 Touch Sensor has not passed the Conducted Susceptibility (CS) test for now, and thus has limited application scenarios. Espressif Systems 26 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

6 Electrical Characteristics

6.1 Absolute Maximum Ratings

Stresses above those listed inAbsolute Maximum RatingsAbsolute Maximum Ratingsmay cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Table13Recommended Operating Conditionsis not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Table 12: Absolute Maximum Ratings Symbol Parameter Min Max Unit VDD33 Power supply voltage –0.3 3.6 V TSTORE Storage temperature –40 105 °C * Please see Appendix IO MUX ofESP32 Series Datasheetfor IO’s power do- main.

6.2 Recommended Operating Conditions

Table 13: Recommended Operating Conditions Symbol Parameter Min Typ Max Unit VDD33 Power supply voltage 3.0 3.3 3.6 V IV DD Current delivered by external power supply 0.5 — — A T Operating ambient temperature 85 °C version –40 — 85 °C105 °C version 105 6.3 DC Characteristics (3.3 V, 25 °C) Table 14: DC Characteristics (3.3 V, 25 °C) Symbol Parameter Min Typ Max Unit CIN Pin capacitance — 2 — pF VIH High-level input voltage 0.75 × VDD1 — VDD1 + 0.3 V VIL Low-level input voltage –0.3 — 0.25 × VDD1 V IIH High-level input current — — 50 nA IIL Low-level input current — — 50 nA VOH High-level output voltage 0.8 × VDD1 — — V VOL Low-level output voltage — — 0.1 × VDD1 V Cont’d on next page Espressif Systems 27 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

Table 14 – cont’d from previous page Symbol Parameter Min Typ Max Unit IOH High-level source current (VDD1 = 3.3 V, VOH >= 2.64 V, output drive strength set to the maximum) VDD3P3_CPU power domain 1, 2 — 40 — mA VDD3P3_RTC power domain 1, 2 — 40 — mA VDD_SDIO power domain1, 3 — 20 — mA IOL Low-level sink current (VDD1 = 3.3 V, VOL = 0.495 V, output drive strength set to the maximum) — 28 — mA RPU Resistance of internal pull-up resistor — 45 — kΩ RPD Resistance of internal pull-down resistor — 45 — kΩ VIL_nRST Low-level input voltage of CHIP_PU to shut down the chip — — 0.6 V 1 Please see Appendix IO MUX ofESP32 Series Datasheetfor IO’s power domain. VDD is the I/O voltage for a particular power domain of pins.

2 For VDD3P3_CPU and VDD3P3_RTC power domain, per-pin current sourced in the same domain is

gradually reduced from around 40 mA to around 29 mA, VOH>=2.64 V, as the number of current- source pins increases. 3 Pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test.

6.4 Current Consumption in Active Mode

The current consumption measurements are taken with a 3.3 V supply at 25 °C ambient temperature. TX current consumption is rated at a 100% duty cycle. RX current consumption is rated when the peripherals are disabled and the CPU idle. Table 15: Current Consumption Depending on RF Modes Work Mode Description Peak (mA) Active (RF working) TX 802.11b, 20 MHz, 1 Mbps, @19.5 dBm 379 802.11g, 20 MHz, 54 Mbps, @15 dBm 276 802.11n, 20 MHz, MCS7, @13 dBm 258 802.11n, 40 MHz, MCS7, @13 dBm 260 RX 802.11b/g/n, 20 MHz 112 802.11n, 40 MHz 118 Owing to the use of advanced power-management technologies, the module can switch between different power modes. For details on different power modes, please refer to SectionRTC and Low-Power Management inESP32 Series Datasheet. Espressif Systems 28 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

7 RF Characteristics

This section contains tables with RF characteristics of the Espressif product. The RF data is measured at the antenna port, where RF cable is connected, including the front-end loss. The external antennas used for the tests on the modules with external antenna connectors have an impedance of 50Ω.Devices should operate in the center frequency range allocated by regional regulatory authorities. The target center frequency range and the target transmit power are configurable by software. SeeESPRFTest ToolandTestGuidefor instructions. Unless otherwise stated, the RF tests are conducted with a 3.3 V (±5%) supply at 25 ºC ambient temperature. 7 .1Wi-Fi Radio Table 16: Wi-Fi RF Characteristics Name Description Center frequency range of operating channel2412~ 2484 MHz Wi-Fi wireless standard IEEE 802.11b/g/n 7 .1.1Wi-Fi RF Transmitter (TX) Characteristics Table 17: TX Power with Spectral Mask and EVM Meeting 802.11 Standards Min Typ MaxRate (dBm) (dBm) (dBm) 802.11b, 1 Mbps — 19.5 — 802.11b, 11 Mbps — 19.5 — 802.11g, 6 Mbps — 18.0 — 802.11g, 54 Mbps — 14.0 — 802.11n, HT20, MCS0 — 18.0 — 802.11n, HT20, MCS7 — 13.0 — 802.11n, HT40, MCS0 — 18.0 — 802.11n, HT40, MCS7 — 13.0 — Table 18: TX EVM Test1 Min Typ Limit Rate (dB) (dB) (dB) 802.11b, 1 Mbps, DSSS — –25.0 –10.0 802.11b, 11 Mbps, CCK — –25.0 –10.0 802.11g, 6 Mbps, OFDM — –24.0 –5.0 802.11g, 54 Mbps, OFDM — –28.0 –25.0 802.11n, HT20, MCS0 — –24.0 –5.0 Cont’d on next page Espressif Systems 29 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

Table 18 – cont’d from previous page Min Typ Limit Rate (dB) (dB) (dB) 802.11n, HT20, MCS7 — –30.0 –27.0 802.11n, HT40, MCS0 — –24.0 –5.0 802.11n, HT40, MCS7 — –30.0 –27.0

1 EVM is measured at the corresponding typical TX power provided

in Table17Wi-Fi RF Transmitter (TX) Characteristicsabove. 7 .1.2Wi-Fi RF Receiver (RX) Characteristics Table 19: RX Sensitivity Min Typ MaxRate (dBm) (dBm) (dBm) 802.11b, 1 Mbps, DSSS — –97.0 — 802.11b, 2 Mbps, DSSS — –94.0 — 802.11b, 5.5 Mbps, CCK — –92.0 — 802.11b, 11 Mbps, CCK — –88.0 — 802.11g, 6 Mbps, OFDM — –93.0 — 802.11g, 9 Mbps, OFDM — –91.0 — 802.11g, 12 Mbps, OFDM — –89.0 — 802.11g, 18 Mbps, OFDM — –87.0 — 802.11g, 24 Mbps, OFDM — –84.0 — 802.11g, 36 Mbps, OFDM — –80.0 — 802.11g, 48 Mbps, OFDM — –77.0 — 802.11g, 54 Mbps, OFDM — –75.0 — 802.11n, HT20, MCS0 — –92.0 — 802.11n, HT20, MCS1 — –88.0 — 802.11n, HT20, MCS2 — –86.0 — 802.11n, HT20, MCS3 — -83.0 — 802.11n, HT20, MCS4 — –80.0 — 802.11n, HT20, MCS5 — –76.0 — 802.11n, HT20, MCS6 — –74.0 — 802.11n, HT20, MCS7 — –72.0 — 802.11n, HT40, MCS0 — –89.0 — 802.11n, HT40, MCS1 — –85.0 — 802.11n, HT40, MCS2 — –83.0 — 802.11n, HT40, MCS3 — –80.0 — 802.11n, HT40, MCS4 — –76.0 — 802.11n, HT40, MCS5 — –72.0 — 802.11n, HT40, MCS6 — –71.0 — 802.11n, HT40, MCS7 — –69.0 — Espressif Systems 30 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

Table 20: Maximum RX Level Min Typ MaxRate (dBm) (dBm) (dBm) 802.11b, 1 Mbps — 5 — 802.11b, 11 Mbps — 5 — 802.11g, 6 Mbps — 0 — 802.11g, 54 Mbps — –8 — 802.11n, HT20, MCS0 — 0 — 802.11n, HT20, MCS7 — –8 — 802.11n, HT40, MCS0 — 0 — 802.11n, HT40, MCS7 — –8 — Table 21: RX Adjacent Channel Rejection Min Typ MaxRate (dB) (dB) (dB) 802.11b, 1 Mbps, DSSS — 35 — 802.11b, 11 Mbps, CCK — 35 — 802.11g, 6 Mbps, OFDM — 27 — 802.11g, 54 Mbps, OFDM — 13 — 802.11n, HT20, MCS0 — 27 — 802.11n, HT20, MCS7 — 12 — 802.11n, HT40, MCS0 — 16 — 802.11n, HT40, MCS7 — 7 — 7 .2 Bluetooth Radio 7 .2.1Receiver – Basic Data Rate Table 22: Receiver Characteristics – Basic Data Rate Parameter Conditions Min Typ Max Unit Sensitivity @0.1% BER — –90 –89 –88 dBm Maximum received signal @0.1% BER — 0 — — dBm Co-channel C/I — — +7 — dB Adjacent channel selectivity C/I F = F0 + 1 MHz — — –6 dB F = F0 – 1 MHz — — –6 dB F = F0 + 2 MHz — — –25 dB F = F0 – 2 MHz — — –33 dB F = F0 + 3 MHz — — –25 dB F = F0 – 3 MHz — — –45 dB Cont’d on next page Espressif Systems 31 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

Table 22 – cont’d from previous page Parameter Conditions Min Typ Max Unit Out-of-band blocking performance

30 MHz~ 2000 MHz –10 — — dBm

2000 MHz~ 2400 MHz –27 — — dBm

2500 MHz~ 3000 MHz –27 — — dBm

3000 MHz~ 12.5 GHz –10 — — dBm Intermodulation — –36 — — dBm 7 .2.2 Transmitter – Basic Data Rate Table 23: Transmitter Characteristics – Basic Data Rate Parameter Conditions Min Typ Max Unit RF transmit power* — — 0 — dBm Gain control step — — 3 — dB RF power control range — –12 — +9 dBm +20 dB bandwidth — — 0.9 — MHz Adjacent channel transmit power F = F0 ± 2 MHz — –55 — dBm F = F0 ± 3 MHz — –55 — dBm F = F0 ± > 3 MHz — –59 — dBm ∆ f1avg — — — 155 kHz ∆ f2max — 127 — — kHz ICFT — — –7 — kHz Drift rate — — 0.7 — kHz/50 µs Drift (DH1) — — 6 — kHz Drift (DH5) — — 6 — kHz * There are a total of eight power levels from 0 to 7, and the transmit power ranges from –12 dBm to 9 dBm. When the power level rises by 1, the transmit power increases by 3 dB. Power level 4 is used by default and the corresponding transmit power is 0 dBm. 7 .2.3 Receiver – Enhanced Data Rate Table 24: Receiver Characteristics – Enhanced Data Rate Parameter Conditions Min Typ Max Unit π/4 DQPSK Sensitivity @0.01% BER — –90 –89 –88 dBm Maximum received signal @0.01% BER — — 0 — dBm Co-channel C/I — — 11 — dB Adjacent channel selectivity C/I F = F0 + 1 MHz — –7 — dB F = F0 – 1 MHz — –7 — dB F = F0 + 2 MHz — –25 — dB F = F0 – 2 MHz — –35 — dB Cont’d on next page Espressif Systems 32 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

Table 24 – cont’d from previous page Parameter Conditions Min Typ Max Unit F = F0 + 3 MHz — –25 — dB F = F0 – 3 MHz — –45 — dB 8DPSK Sensitivity @0.01% BER — –84 –83 –82 dBm Maximum received signal @0.01% BER — — –5 — dBm C/I c-channel — — 18 — dB Adjacent channel selectivity C/I F = F0 + 1 MHz — 2 — dB F = F0 – 1 MHz — 2 — dB F = F0 + 2 MHz — –25 — dB F = F0 – 2 MHz — –25 — dB F = F0 + 3 MHz — –25 — dB F = F0 – 3 MHz — –38 — dB 7 .2.4 Transmitter – Enhanced Data Rate Table 25: Transmitter Characteristics – Enhanced Data Rate Parameter Conditions Min Typ Max Unit RF transmit power (see note under Table23) — — 0 — dBm Gain control step — — 3 — dB RF power control range — –12 — +9 dBm π/4 DQPSK max w0 — — –0.72 — kHz π/4 DQPSK max wi — — –6 — kHz π/4 DQPSK max |wi + w0| — — –7.42 — kHz 8DPSK max w0 — — 0.7 — kHz 8DPSK max wi — — –9.6 — kHz 8DPSK max |wi + w0| — — –10 — kHz π/4 DQPSK modulation accuracy RMS DEVM — 4.28 — % 99% DEVM — 100 — % Peak DEVM — 13.3 — %

8 DPSK modulation accuracy

RMS DEVM — 5.8 — % 99% DEVM — 100 — % Peak DEVM — 14 — % In-band spurious emissions F = F0 ± 1 MHz — –46 — dBm F = F0 ± 2 MHz — –44 — dBm F = F0 ± 3 MHz — –49 — dBm EDR differential phase coding — — 100 — % 7 .3 Bluetooth LE Radio Espressif Systems 33 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

Table 26: Bluetooth LE RF Characteristics Name Description Center frequency range of operating channel2402~ 2480 MHz RF transmit power range –12.0~ 9.0 dBm 7 .3.1Bluetooth LE RF Receiver (RX) Characteristics Table 27: Receiver Characteristics – Bluetooth LE Parameter Conditions Min Typ Max Unit Sensitivity @30.8% PER — –94 –93 –92 dBm Maximum received signal @30.8% PER — 0 — — dBm Co-channel C/I — — +10 — dB Adjacent channel selectivity C/I F = F0 + 1 MHz — –5 — dB F = F0 – 1 MHz — –5 — dB F = F0 + 2 MHz — –25 — dB F = F0 – 2 MHz — –35 — dB F = F0 + 3 MHz — –25 — dB F = F0 – 3 MHz — –45 — dB Out-of-band blocking performance

2000 MHz ~ 2400

–27 — — dBm

2500 MHz ~ 3000

–27 — — dBm 3000 MHz~ 12.5 GHz –10 — — dBm Intermodulation — –36 — — dBm 7 .3.2 Bluetooth LE RF Transmitter (TX) Characteristics Table 28: Transmitter Characteristics – Bluetooth LE Parameter Conditions Min Typ Max Unit RF transmit power (see note under Table 23) — — 0 — dBm Gain control step — — 3 — dB RF power control range — –12 — +9 dBm Adjacent channel transmit power F = F0 ± 2 MHz — –55 — dBm F = F0 ± 3 MHz — –57 — dBm F = F0 ± > 3 MHz — –59 — dBm ∆ f1avg — — — 265 kHz ∆ f2max — 210 — — kHz ICFT — — –10 — kHz Drift rate — — 0.7 — kHz/50 µs Espressif Systems 34 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

Parameter Conditions Min Typ Max Unit Drift — — 2 — kHz Espressif Systems 35 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

8 Module Schematics

This is the reference design of the module. D D C C B B A A The values of C15, L4 and C14 vary with the actual PCB board. The values of C1 and C2 vary with the selection of the crystal. The value of R2 varies with the actual PCB board. NC: No component. GPIO16:SPICS GPIO17:SPIDO SD_CMD:SPIHD SD_CLK:SPICLK SD_D0:SPIWP SD_D1:SPIDI ESP32-MINI-1(pin-out) EN GPI35 GPI36 GPI37 GPI38 GPI39 GPI34 RF_ANT GPIO32 U0TXD GPIO33 GPIO25 GPIO26 GPIO27 GPIO14 GPIO12 GPIO15 GPIO13 GPIO2 GPIO0 GPIO4 GPIO10 GPIO9 GPIO18 GPIO5 GPIO23 GPIO19 GPIO22 U0RXD GPIO21 LNA_IN GPIO26 GPIO27 GPIO14 GPIO12 GPIO32 GPI35 GPI34 EN GPI39 GPI38 GPI37 GPI36 GPIO15 GPIO2 GPIO0 GPIO4 GPIO13 GPIO19 GPIO22 GPIO21 GPIO9 GPIO10 GPIO5 GPIO18 GPIO23 U0RXD U0TXD GPIO25 GPIO33 GND GND GND GND VDD33 GNDGND GND GNDGND GND GND GND GND GND GNDGND GND GND VDD33 VDD33 VDD33 GND VDD_SDIO VDD33 GND GND VDD33 GND Title Size Page Name Rev Date: Sheet o f Confidential and Proprietary <02_ESP32-MINI-1> V1.0 <ESP32-MINI-1> 2 2Friday, July 16, 2021 Title Size Page Name Rev Date: Sheet o f Confidential and Proprietary <02_ESP32-MINI-1> V1.0 <ESP32-MINI-1> 2 2Friday, July 16, 2021 Title Size Page Name Rev Date: Sheet o f Confidential and Proprietary <02_ESP32-MINI-1> V1.0 <ESP32-MINI-1> 2 2Friday, July 16, 2021 ESP32-MINI-1 GND1 3V33 I364 I375 I386 I397 EN8 I349 I3510 IO3211 IO3312 IO2513 GND 40 NC 37GND 38 TXD0 36 RXD0 35 IO21 34 IO22 33 IO19 32 IO23 31 IO18 30 IO5 29 IO27 15 IO14 16 IO12 17 IO13 18 IO10 26 GND 27 IO26 14 GND 39 IO15 19 IO2 20 IO0 21 IO4 22 NC 23 NC 24 IO9 25 GND2 NC 28 GND 41 GND 42 GND 43 GND 44 GND 45 GND 46 GND 47 GND 48 GND 49 GND 50 GND 51 GND 52 GND 53 GND 54 EPAD 55 C18 1uF R1 20K(5%) 100pF C15 TBD 10nF/6.3V(10%) 0.1uF L5 2.0nH TBD C20 1uF R2 0 C11 1uF L4 TBD C21 NC 3.3nF/6.3V(10%) 0.1uF C14 TBD ANT1 PCB_ANT 40MHz(±10ppm)XIN 1 GND 2XOUT 3 GND 4 C19 0.1uF R3 499 C10 0.1uF U2 ESP32-U4WDH VDDA1 LNA_IN2 VDD3P33 VDD3P34 SENSOR_VP5 SENSOR_CAPP6 SENSOR_CAPN7 SENSOR_VN8 CHIP_PU9 VDET_110 VDET_211 32K_XP12 32K_XN13 GPIO2514 GPIO26 15 GPIO27 16 MTMS 17 MTDI 18 VDD3P3_RTC 19 MTCK 20 MTDO 21 GPIO2 22 GPIO0 23 GPIO4 24 VDD_SDIO 26 GPIO16 25 GPIO17 27SD_DATA_2 28SD_DATA_3 29SD_CMD 30SD_CLK 31SD_DATA_0 32 GND 49 SD_DATA_1 33GPIO5 34GPIO18 35 GPIO19 38 CAP2 47 VDDA 43 XTAL_N 44 XTAL_P 45 GPIO23 36 U0TXD 41 GPIO22 39 GPIO21 42 VDD3P3_CPU 37 CAP1 48 VDDA 46 U0RXD 40 TBD C13 10uF ESD Figure 7: ESP32-MINI-1 Schematics Espressif Systems 36 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

The values of C15, L4 and C14 vary with the actual PCB board. The values of C1 and C2 vary with the selection of the crystal. The value of R2 varies with the actual PCB board. NC: No component. GPIO16:SPICS GPIO17:SPIDO SD_CMD:SPIHD SD_CLK:SPICLK SD_D0:SPIWP SD_D1:SPIDI ESP32-MINI-1U(pin-out) EN GPI35 GPI36 GPI37 GPI38 GPI39 GPI34 RF_ANT GPIO32 U0TXD GPIO33 GPIO25 GPIO26 GPIO27 GPIO14 GPIO12 GPIO15 GPIO13 GPIO2 GPIO0 GPIO4 GPIO10 GPIO9 GPIO18 GPIO5 GPIO23 GPIO19 GPIO22 U0RXD GPIO21 LNA_IN GPIO26 GPIO27 GPIO14 GPIO12 GPIO32 GPI35 GPI34 EN GPI39 GPI38 GPI37 GPI36 GPIO15 GPIO2 GPIO0 GPIO4 GPIO13 GPIO19 GPIO22 GPIO21 GPIO9 GPIO10 GPIO5 GPIO18 GPIO23 U0RXD U0TXD GPIO25 GPIO33 GND GND GND GND VDD33 GNDGND GND GNDGND GND GND GND GND GND GNDGND GND GND VDD33 VDD33 VDD33 GND VDD_SDIO VDD33 GND GND VDD33 GND Title Size Page Name Rev Date: Sheet o f Confidential and Proprietary <02_ESP32-MINI-1U> V1.0 <ESP32-MINI-1U> 2 2Thursday, April 01, 2021 Title Size Page Name Rev Date: Sheet o f Confidential and Proprietary <02_ESP32-MINI-1U> V1.0 <ESP32-MINI-1U> 2 2Thursday, April 01, 2021 Title Size Page Name Rev Date: Sheet o f Confidential and Proprietary <02_ESP32-MINI-1U> V1.0 <ESP32-MINI-1U> 2 2Thursday, April 01, 2021 R1 20K(5%) C18 1uF ESP32-MINI-1U GND1 3V33 I364 I375 I386 I397 EN8 I349 I3510 IO3211 IO3312 IO2513 GND 40 NC 37GND 38 TXD0 36 RXD0 35 IO21 34 IO22 33 IO19 32 IO23 31 IO18 30 IO5 29 IO27 15 IO14 16 IO12 17 IO13 18 IO10 26 GND 27 IO26 14 GND 39 IO15 19 IO2 20 IO0 21 IO4 22 NC 23 NC 24 IO9 25 GND2 NC 28 GND 41 GND 42 GND 43 GND 44 GND 45 GND 46 GND 47 GND 48 GND 49 GND 50 GND 51 GND 52 GND 53 GND 54 EPAD 55 100pF C15 TBD 10nF/6.3V(10%) 0.1uF L5 2.0nH C20 1uF TBD C11 1uF R2 0 L4 TBD 3.3nF/6.3V(10%) C21 NC C14 TBD 0.1uF ANT1 IPEX R3 499 C19 0.1uF 40MHz(±10ppm)XIN 1 GND 2XOUT 3 GND 4 C10 0.1uF ESD C13 10uF TBD U2 ESP32-U4WDH VDDA1 LNA_IN2 VDD3P33 VDD3P34 SENSOR_VP5 SENSOR_CAPP6 SENSOR_CAPN7 SENSOR_VN8 CHIP_PU9 VDET_110 VDET_211 32K_XP12 32K_XN13 GPIO2514 GPIO26 15 GPIO27 16 MTMS 17 MTDI 18 VDD3P3_RTC 19 MTCK 20 MTDO 21 GPIO2 22 GPIO0 23 GPIO4 24 VDD_SDIO 26 GPIO16 25 GPIO17 27SD_DATA_2 28SD_DATA_3 29SD_CMD 30SD_CLK 31SD_DATA_0 32 GND 49 SD_DATA_1 33GPIO5 34GPIO18 35 GPIO19 38 CAP2 47 VDDA 43 XTAL_N 44 XTAL_P 45 GPIO23 36 U0TXD 41 GPIO22 39 GPIO21 42 VDD3P3_CPU 37 CAP1 48 VDDA 46 U0RXD 40 Figure 8: ESP32-MINI-1U Schematics Espressif Systems 37 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

9 Peripheral Schematics

This is the typical application circuit of the module connected with peripheral components (for example, power supply, antenna, reset button, JTAG interface, and UART interface). D D C C B B A A IO12 should be kept low when the module is powered on. NC: No component. X1: ESR = Max. 70 KΩ ESP32PMINIP1U ESP32PMINIP1 EN IO22 RXD0 TXD0 IO26 IO2 IO15 IO13 IO12 IO27 IO14 I36 TDI TCK TDO TMS IO21 IO19 IO5 IO23 IO9 IO10 I37 I38 I39 I34 I35 IO0 IO4 EN IO18 IO33 IO32 IO25 GND VDD33 GND GND VDD33 GND GND GND GND GND GND SW1 R2 0 TBD 32.768kHz(NC) 1 2 JP1 UART TBD R5 NC 0.1uF JP3 JTAG 1 1 2 2 3 3 4 4 C4 0.1uF C512pF(NC) 0(NC) 0(NC) JP2 Boot Option C612pF(NC) GND1 3V33 I364 I375 I386 I397 EN8 I349 I3510 IO3211 IO3312 IO2513 GND 40 NC 37GND 38 TXD0 36 RXD0 35 IO21 34 IO22 33 IO19 32 IO23 31 IO18 30 IO5 29 IO27 15 IO14 16 IO12 17 IO13 18 IO10 26 GND 27 IO26 14 GND 39 IO15 19 IO2 20 IO0 21 IO4 22 NC 23 NC 24 IO9 25 GND2 NC 28 GND 41 GND 42 GND 43 GND 44 GND 45 GND 46 GND 47 GND 48 GND 49 GND 50 GND 51 GND 52 GND 53 GND 54 EPAD 55 22uF Figure 9: Peripheral Schematics

• Soldering Pad 55 to the Ground of the base board is not necessary for a satisfactory thermal performance. If you choose to solder it, please apply the correct amount of soldering paste. Too much solderingpastemayincreasethegapbetweenthemoduleandthebaseboard. Asaresult,theadhesion between other pins and the baseboard may be poor.
• To ensure that the power supply to the ESP32 chip is stable during power-up, it is advised to add an RC delaycircuitattheENpin. TherecommendedsettingfortheRCdelaycircuitisusuallyR=10k Ω andC= 1µF. However, specific parameters should be adjusted based on the power-up timing of the module and the power-up and reset sequence timing of the chip. For ESP32’s power-up and reset sequence timing diagram, please refer to SectionPower SchemeinESP32 Series Datasheet.
• UART0 is used to download firmware and log output. When using the AT firmware, please note that the UART GPIO is already configured (refer toHardwareConnection). It is recommended to use the default configuration. Espressif Systems 38 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

10 Physical Dimensions

10.1 Module Dimensions

Top viewSide viewBottom view2.4±0.15 40.611 Unit: mm Figure 10: ESP32-MINI-1 Physical Dimensions Figure 11: ESP32-MINI-1U Physical Dimensions Note: For information about tape, reel, and product marking, please refer toEspressif Module Package Information. Espressif Systems 39 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

10.2 Dimensions of External Antenna Connector

ESP32-MINI-1U uses the third generation external antenna connector as shown in Figure12. This connector is compatible with the following connectors:

• W.FL Series connector from Hirose
• MHF III connector from I-PEX
• AMMC connector from Amphenol SECTION: A-ASCALE: 1:1 A1.7 1.7 0.85 2.05±0.101.40 A 0.10 0.57 INSULATION RESISTANCE: 500MOHM Min.DIELECTRIC WITHSTANDING VOLTAGE: 200V AC FOR 1MINUTE; CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER;PERFORMANCE:CONTACT RESISTANCE: 20mOHM Max. HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0;SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; CONTACT GROUND CONTACT 2.00±0.10 Unit: mmTolerance: +/-0.1 mm HOUSINGCONTACT SHELL Figure 12: Dimensions of External Antenna Connector Espressif Systems 40 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

11 PCB Layout Recommendations

11.1 PCB Land Pattern

This section provides the following resources for your reference:

• Figures for recommended PCB land patterns with all the dimensions needed for PCB design. See Figure 13ESP32-MINI-1 Recommended PCB Land Patternand Figure14ESP32-MINI-1U PCB Recommended PCB Land Pattern.
• Source files of recommended PCB land patterns to measure dimensions not covered in Figure13and Figure14. You can view the source files forESP32-MINI-1andESP32-MINI-1UwithAutodeskViewer.
• 3D models ofESP32-MINI-1andESP32-MINI-1U. Please make sure that you download the 3D model file in .STEP format (beware that some browsers might add .txt). Unit: mm: Pad Figure 13: ESP32-MINI-1 Recommended PCB Land Pattern Espressif Systems 41 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

Figure 14: ESP32-MINI-1U PCB Recommended PCB Land Pattern

11.2 Module Placement for PCB Design

If module-on-board design is adopted, attention should be paid while positioning the module on the base board. The interference of the base board on the module’s antenna performance should be minimized. For details about module placement for PCB design, please refer toESP32 Hardware Design Guidelines> SectionPositioning a Module on a Base Board. Espressif Systems 42 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

12 Product Handling

12.1 Storage Conditions

The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric environment of < 40 °C and 90%RH. The module is rated at the moisture sensitivity level (MSL) of 3. After unpacking, the module must be soldered within 168 hours with the factory conditions 25 ± 5 °C and 60 %RH. If the above conditions are not met, the module needs to be baked.

12.2 Electrostatic Discharge (ESD)

• Human body model (HBM): ±2000 V
• Charged-device model (CDM): ±500 V

12.3 Reflow Profile

Solder the module in a single reflow. 50 150 1 ~ 3 ℃/s 200 250 200 –1 ~ –5 ℃/s Cooling zone 100 217 100 250 Reflow zone !217 ℃ 60 ~ 90 s Temperature (℃) Preheating zone 150 ~ 200 ℃ 60 ~ 120 s Ramp-up zone Peak Temp. 235 ~ 250 ℃ Soldering time > 30 s Time (sec.) Ramp-up zone — Temp. : 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s Reflow zone — Temp.: >217 ℃ 7LPH 60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy Figure 15: Reflow Profile Espressif Systems 43 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

12.4 Ultrasonic Vibration

Avoid exposing Espressif modules to vibration from ultrasonic equipment, such as ultrasonic welders or ultrasoniccleaners. Thisvibrationmayinduceresonanceinthein-modulecrystalandleadtoitsmalfunctionor even failure. As a consequence,the module may stop working or its performance may deteriorate. Espressif Systems 44 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

Related Documentation and Resources Related Documentation and Resources Related Documentation

• ESP32SeriesDatasheet–Specifications of the ESP32 hardware.
• ESP32TechnicalReferenceManual–Detailed information on how to use the ESP32 memory and peripherals.
• ESP32HardwareDesignGuidelines–Guidelines on how to integrate the ESP32 into your hardware product.
• ESP32ECOandWorkaroundsforBugs–Correction of ESP32 design errors.
• ESP32SeriesSoCErrata–Descriptions of known errors in ESP32 series of SoCs.
• Certificates https://espressif.com/en/support/documents/certificates
• ESP32 Product/Process Change Notifications (PCN) https://espressif.com/en/support/documents/pcns
• ESP32 Advisories–Information on security, bugs, compatibility, component reliability. https://espressif.com/en/support/documents/advisories
• Documentation Updates and Update Notification Subscription https://espressif.com/en/support/download/documents Developer Zone
• ESP-IDFProgrammingGuideforESP32–Extensive documentation for the ESP-IDF development framework.
• ESP-IDF and other development frameworks on GitHub. https://github.com/espressif
• ESP32 BBS Forum–Engineer-to-Engineer(E2E)CommunityforEspressifproductswhereyoucanpostquestions, share knowledge, explore ideas, and help solve problems with fellow engineers. https://esp32.com/
• The ESP Journal–Best Practices, Articles, and Notes from Espressif folks. https://blog.espressif.com/
• See the tabsSDKs and Demos,Apps,Tools,AT Firmware. https://espressif.com/en/support/download/sdks-demos Products
• ESP32 Series SoCs–Browse through all ESP32 SoCs. https://espressif.com/en/products/socs?id=ESP32
• ESP32 Series Modules–Browse through all ESP32-based modules. https://espressif.com/en/products/modules?id=ESP32
• ESP32 Series DevKits–Browse through all ESP32-based devkits. https://espressif.com/en/products/devkits?id=ESP32
• ESP Product Selector–FindanEspressifhardwareproductsuitableforyourneedsbycomparingorapplyingfilters. https://products.espressif.com/#/product-selector?language=en Contact Us
• Seethetabs Sales Questions,Technical Enquiries,Circuit Schematic & PCB Design Review,Get Samples (Online stores),Become Our Supplier,Comments & Suggestions. https://espressif.com/en/contact-us/sales-questions Espressif Systems 45 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

Revision History

Date Version Release Notes 2025-03-18 v1.5

• Improved the wording and structure of following sections: – Updated SectionFeaturesandSeries Comparison – Updated Section ”Strapping Pins” and renamed toBoot Configura- tions – Added Chapter5: Peripherals – Section7: RF Characteristics: * Updated Table ”Wi-Fi RF Standards” and renamed toWi-Fi RF Characteristics * Added Table18: Wi-Fi RF Transmitter (TX) Characteristics * Added TableBluetooth LE RF Characteristics – Section9: Peripheral Schematics: Added a note about UART – Renamed Chapter ”Physical Dimensions and PCB Land Pattern” to Physical Dimensionsand added Chapter11: PCB Layout Recom- mendations 2024-07-02 v1.4 Table3Pin Description: Added a note for input-only GPIO pins 2023-08-28 v1.3
• Table3: Pin Description: Updatedthefirstnoteaboutchippinsconnect- ing flash
• Section 9: Peripheral Schematics: Updated the first note about EPAD soldering
• Section11.1: PCB Land Pattern: Added the 3D file for ESP32-MINI-1U 2023-01-17 v1.2 Major updates:
• Removed contents about hall sensor according toPCN20221202
• Added Section12.4: Ultrasonic Vibration Other updates:
• Added strapping pin timing in Section4: Boot Configurations
• Added source files of PCB land patterns and 3D models of the modules (if available) in Section11.1: PCB Land Pattern 2021-11-09 v1.1 Upgraded the module embedded chip from single-core to dual-core¹ Updated the description to TWAI Updated Table13: Recommended Operating Conditions 2021-07-14 v1.0 Added ESP32-MINI-1U module Updated the document formatting 2020-12-04 v0.5 Pre-release ¹Themoduleembeddedchip(ESP32-U4WDH)isupgradedfromsingle-coretodual-core,see PCN-2021-021. Estimatedeffectivedate: January 1, 2022. The single-core version coexists with the new dual-core version around January 1, 2022. The physical product is subject to batch tracking. Espressif Systems 46 Submit Documentation Feedback ESP32-MINI-1 & MINI-1U Datasheet v1.5

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