ESP32-C6-MINI-1 ESPRESSIF | Alldatasheet

Document overview

  • Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
  • PDF pages: 47

Technical content

Datasheet sections

  • 1 Module Overview
  • 1.1 Features
  • 1.2 Series Comparison
  • 1.3 Applications
  • 2 Block Diagram
  • 3 Pin Definitions
  • 3.1 Pin Layout
  • 3.2 Pin Description
  • 4 Boot Configurations
  • 4.1 Chip Boot Mode Control
  • 4.2 SDIO Sampling and Driving Clock Edge Control
  • 4.3 ROM Messages Printing Control
  • 4.4 JTAG Signal Source Control
  • 5 Peripherals
  • 5.1 Peripheral Overview
  • 5.2 Peripheral Description
  • 5.2.1 Connectivity Interface
  • 5.2.1.1 UART Controller
  • 5.2.1.2 SPI Controller
  • 5.2.1.3 I2C Controller
  • 5.2.1.4 I2S Controller
  • 5.2.1.5 Pulse Count Controller
  • 5.2.1.6 USB Serial/JTAG Controller
  • 5.2.1.7 Two-wire Automotive Interface
  • 5.2.1.9 LED PWM Controller
  • 5.2.1.10 Motor Control PWM
  • 5.2.1.11 Remote Control Peripheral
  • 5.2.1.12 Parallel IO Controller
  • 5.2.2 Analog Signal Processing
  • 5.2.2.1 SAR ADC
  • 5.2.2.2 Temperature Sensor
  • 6 Electrical Characteristics
  • 6.1 Absolute Maximum Ratings
  • 6.2 Recommended Operating Conditions
  • 6.4 Current Consumption Characteristics
  • 6.4.1 Current Consumption in Active Mode

Datasheet sections

  • 6.4.2 Current Consumption in Other Modes
  • 7 RF Characteristics
  • 8 Module Schematics
  • 9 Peripheral Schematics
  • 10 Physical Dimensions
  • 10.1 Module Dimensions
  • 10.2 Dimensions of External Antenna Connector
  • 11 PCB Layout Recommendations
  • 11.1 PCB Land Pattern
  • 11.2 Module Placement for PCB Design
  • 12 Product Handling
  • 12.1 Storage Conditions
  • 12.2 Electrostatic Discharge (ESD)
  • 12.3 Reflow Profile
  • 12.4 Ultrasonic Vibration

Datasheet Version 1.3 Module that supports 2.4 GHz Wi-Fi 6 (802.11ax), Bluetooth® 5 (LE), Zigbee and Thread (802.15.4) Built around ESP32-C6 series of SoCs, 32-bit RISC-V single-core microprocessor Flash up to 8 MB in chip package

22 GPIOs, rich set of peripherals

On-board PCB antenna or external antenna connector ESP32-C6-MINI-1 ESP32-C6-MINI-1U www.espressif.com

1 Module Overview

Note: Check the link or the QR code to make sure that you use the latest version of this document: https://espressif.com/documentation/esp32-c6-mini-1_mini-1u_datasheet_en.pdf

1.1 Features

  • ESP32-C6FH4/ESP32-C6FH8 embedded, 32-bit RISC-V single-core microprocessor, up to

160 MHz

  • ROM: 320 KB
  • HP SRAM: 512 KB
  • LP SRAM: 16 KB
  • Flash up to 8 MB in chip package Wi-Fi
  • 1T1R in 2.4 GHz band
  • Operating frequency: 2412~ 2484 MHz
  • IEEE 802.11ax-compliant – 20 MHz-only non-AP mode – MCS0 ~ MCS9 – Uplink and downlink OFDMA, especially suitable for simultaneous connections in high-density environments – Downlink MU-MIMO (multi-user, multiple input, multiple output) to increase network capacity – Beamformee that improves signal quality – Channel quality indication (CQI) – DCM (dual carrier modulation) to improve link robustness – Spatial reuse to maximize parallel transmissions – T arget wake time (TWT) that optimizes power saving mechanisms
  • Fully compatible with IEEE 802.11b/g/n protocol – 20 MHz and 40 MHz bandwidth – Data rate up to 150 Mbps – Wi-Fi Multimedia (WMM) – TX/RX A-MPDU, TX/RX A-MSDU – Immediate Block ACK – Fragmentation and defragmentation – Transmit opportunity (TXOP) – Automatic Beacon monitoring (hardware TSF) – 4 × virtual Wi-Fi interfaces – Simultaneous support for Infrastructure BSS in Station mode, SoftAP mode, Station + SoftAP mode, and promiscuous mode Note that when ESP32-C6 scans in Station mode, the SoftAP channel will change along with the Station channel – 802.11mc FTM Bluetooth®
  • Bluetooth LE: Bluetooth 5.3 certified
  • Bluetooth mesh
  • High power mode (20 dBm)
  • Speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps
  • Advertising extensions
  • Multiple advertisement sets Espressif Systems 2 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3
  • Channel selection algorithm #2
  • LE power control
  • Internal co-existence mechanism between Wi-Fi and Bluetooth to share the same antenna IEEE 802.15.4
  • Compliant with IEEE 802.15.4-2015 protocol
  • OQPSK PHY in 2.4 GHz band
  • Data rate: 250 Kbps
  • Thread 1.3
  • Zigbee 3.0 Peripherals
  • GPIO, SPI, parallel IO interface, UART , I2C, I2S, RMT (TX/RX), pulse counter, LED PWM, USB Serial/JTAG controller, MCPWM, SDIO2.0 slave controller, GDMA, TWAI® controller, on-chip debug functionality via JTAG, event task matrix, ADC, temperature sensor, system timer, general-purpose timers, and watchdog timers Integrated Components on Module
  • 40 MHz crystal oscillator Antenna Options
  • On-board PCB antenna (ESP32-C6-MINI-1)
  • External antenna via a connector (ESP32-C6-MINI-1U) Operating Conditions
  • Operating voltage/Power supply: 3.0~ 3.6 V
  • Operating ambient temperature: – 85 °C version module: –40~ 85 °C – 105 °C version module: –40~ 105 °C Certification
  • RF certification: Seecertificates
  • Green certification: RoHS/REACH Test
  • HTOL/HTSL/uHAST/TCT/ESD

1.2 Series Comparison

ESP32-C6-MINI-1 and ESP32-C6-MINI-1U are two powerful, general-purpose Wi-Fi, IEEE 802.15.4, and Bluetooth LE modules. The rich set of peripherals and high performance make the module an ideal choice for smart homes, industrial automation, health care, consumer electronics, etc. ESP32-C6-MINI-1 comes with a PCB antenna. ESP32-C6-MINI-1U comes with a connector for an external antenna. They both feature an SPI flash up to 8 MB. Espressif Systems 3 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

The series comparison for the two modules is as follows: Table 1: ESP32-C6-MINI-1 (ANT) Series Comparison1 Ambient Temp.4 Size5 Ordering Code Flash2,3 (°C) (mm) ESP32-C6-MINI-1-N4 4 MB (Quad SPI) –40 ~ 85 13.2 × 16.6 × 2.4ESP32-C6-MINI-1-H4 –40 ~ 105ESP32-C6-MINI-1-H8 8 MB (Quad SPI) 1 This table shares the same notes presented in T able2 below. Table 2: ESP32-C6-MINI-1U (CONN) Series Comparison Ambient Temp.4 Size5 Ordering Code Flash2,3 (°C) (mm) ESP32-C6-MINI-1U-N4 4 MB (Quad SPI) –40 ~ 85 13.2 × 12.5 × 2.4ESP32-C6-MINI-1U-H4 –40 ~ 105ESP32-C6-MINI-1U-H8 8 MB (Quad SPI)

2 By default, the SPI flash on the module operates at a maximum clock frequency

of 80 MHz and does not support the auto suspend feature. If you need the flash auto suspend feature, pleasecontact us. 3 The flash is integrated in the chip’s package.

4 Ambient temperature specifies the recommended temperature range of the en-

vironment immediately outside the Espressif module. 5 For details, refer to Section10.1Module Dimensions. At the core of the modules is ESP32-C6FH4/ESP32-C6FH8, a 32-bit RISC-V single-core processor. For more information on ESP32-C6FH4/ESP32-C6FH8, please refer toESP32-C6 Series Datasheet.

1.3 Applications

  • Smart Home
  • Industrial Automation
  • Health Care
  • Consumer Electronics
  • Smart Agriculture
  • POS Machines
  • Service Robot
  • Audio Devices
  • Generic Low-power IoT Sensor Hubs
  • Generic Low-power IoT Data Loggers Espressif Systems 4 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

1 ESP32-C6-MINI-1 (ANT) Series Comparison 1 4

2 ESP32-C6-MINI-1U (CONN) Series Comparison 4

3 Pin Definitions 10

4 Default Configuration of Strapping Pins 12

5 Description of Timing Parameters for the Strapping Pins 13

6 Chip Boot Mode Control 13

7 SDIO Input Sampling Edge/Output Driving Edge Control 14

8 UART0 ROM Message Printing Control 14

9 USB Serial/JTAG ROM Message Printing Control 15

10 JTAG Signal Source Control 15

12 Recommended Operating Conditions 25

13 DC Characteristics (3.3 V, 25 °C) 25 14 Current Consumption for Wi-Fi (2.4 GHz) in Active Mode 26

15 Current Consumption for Bluetooth LE in Active Mode 26

16 Current Consumption for 802.15.4 in Active Mode 26

17 Current Consumption in Modem-sleep Mode 27

18 Current Consumption in Low-Power Modes 27

19 Wi-Fi RF Characteristics 28

20 TX Power with Spectral Mask and EVM Meeting 802.11 Standards 28

21 TX EVM Test1 28

22 RX Sensitivity 29

23 Maximum RX Level 30

24 RX Adjacent Channel Rejection 30

25 Bluetooth LE RF Characteristics 31

26 Bluetooth LE - Transmitter Characteristics - 1 Mbps 31

27 Bluetooth LE - Transmitter Characteristics - 2 Mbps 31

28 Bluetooth LE - Transmitter Characteristics - 125 Kbps 32

29 Bluetooth LE - Transmitter Characteristics - 500 Kbps 32

30 Bluetooth LE - Receiver Characteristics - 1 Mbps 32

31 Bluetooth LE - Receiver Characteristics - 2 Mbps 33

32 Bluetooth LE - Receiver Characteristics - 125 Kbps 34

33 Bluetooth LE - Receiver Characteristics - 500 Kbps 34

34 802.15.4 RF Characteristics 34 35 802.15.4 Transmitter Characteristics - 250 Kbps 35 36 802.15.4 Receiver Characteristics - 250 Kbps 35 Espressif Systems 7 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

1 ESP32-C6-MINI-1 Block Diagram 9

2 ESP32-C6-MINI-1U Block Diagram 9

3 Pin Layout (Top View) 10

4 Visualization of Timing Parameters for the Strapping Pins 13

5 ESP32-C6-MINI-1 Schematics 36

6 ESP32-C6-MINI-1U Schematics 37

7 Peripheral Schematics 38

8 ESP32-C6-MINI-1 Physical Dimensions 39

9 ESP32-C6-MINI-1U Physical Dimensions 39

10 Dimensions of External Antenna Connector 40

11 ESP32-C6-MINI-1 Recommended PCB Land Pattern 41

12 ESP32-C6-MINI-1U Recommended PCB Land Pattern 42

13 Reflow Profile 43

Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

2 Block Diagram

SPI FlashESP32-C6RF Matching40 MHzCrystalGNDENGPIOsAntenna3V3 Figure 1: ESP32-C6-MINI-1 Block Diagram SPI FlashESP32-C6RF Matching40 MHzCrystalGNDENGPIOsAntenna3V3 Figure 2: ESP32-C6-MINI-1U Block Diagram Espressif Systems 9 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

3 Pin Definitions

3.1 Pin Layout

The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to scale, please refer to Figure10.1Module Dimensions. The pin diagram is applicable for ESP32-C6-MINI-1 and ESP32-C6-MINI-1U, but the latter has no keepout zone. Pin Layout (Top View) Pin 49GNDGNDGNDPin 10 Pin 1Pin 8Pin 5Pin 4Pin 12Pin 15Pin 14Pin 17Pin 29 Pin 453V3IO4IO13IO1IO14IO8GNDIO15IO9IO21IO22NCPin 50GNDPin 2 Pin 20Pin 9Pin 13 GNDPin 16IO2 Pin 22 IO0 Pin 21Pin 18Pin 51GNDPin 24 Pin 33Pin 30Pin 32Pin 34Pin 36Pin 40GNDPin 47Pin 44GNDGNDGNDGNDPin 7NCENIO3Pin 6Pin 3Pin 53GND Pin 11GNDPin 52GNDIO5IO12NCIO19IO7IO20IO23Pin 19Pin 23Pin 25 NCRXD0Pin 26GNDTXD0Pin 27GNDNCPin 28Pin 31GNDGNDGNDPin 35GNDGNDGNDGNDPin 38 GNDGNDPin 37Keepout ZonePin 39Pin 41Pin 42Pin 43GNDNCPin 46Pin 48GNDIO6IO18NC GNDGND Figure 3: Pin Layout (Top View)

3.2 Pin Description

The module has 53 pins. See pin definitions in T able3 Pin Definitions. For peripheral pin configurations, please refer toESP32-C6 Series Datasheet. Table 3: Pin Definitions Name No. Type1 Function GND 1, 2, 11, 14, 36∼53 P Ground 3V3 3 P Power supply Cont’d on next page Espressif Systems 10 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

Table 3 – cont’d from previous page Name No. Type1 Function NC 4 — NC IO2 5 I/O/T GPIO2, LP_GPIO2, LP_UART _RTSN, ADC1_CH2, FSPIQ IO3 6 I/O/T GPIO3, LP_GPIO3, LP_UART _CTSN, ADC1_CH3 NC 7 — NC EN 8 I High: on, enables the chip. Low: off, the chip powers off. Note: Do not leave the EN pin floating. IO4 9 I/O/T MTMS, GPIO4, LP_GPIO4, LP_UART _RXD, ADC1_CH4, FSPIHD IO5 10 I/O/T MTDI, GPIO5, LP_GPIO5, LP_UART _ TXD, ADC1_CH5, FSPIWP IO0 12 I/O/T GPIO0, XTAL_32K_P, LP_GPIO0, LP_UART _DTRN, ADC1_CH0 IO1 13 I/O/T GPIO1, XTAL_32K_N, LP_GPIO1, LP_UART _DSRN, ADC1_CH1 IO6 15 I/O/T MTCK, GPIO6, LP_GPIO6, LP_I2C_SDA, ADC1_CH6, FSPICLK IO7 16 I/O/T MTDO, GPIO7 , LP_GPIO7 , LP_I2C_SCL, FSPID IO12 17 I/O/T GPIO12, USB_D- IO13 18 I/O/T GPIO13, USB_D+ IO14 19 I/O/T GPIO14 IO15 20 I/O/T GPIO15 NC 21 — NC IO8 22 I/O/T GPIO8 IO9 23 I/O/T GPIO9 IO18 24 I/O/T GPIO18, SDIO_CMD, FSPICS2 IO19 25 I/O/T GPIO19, SDIO_CLK, FSPICS3 IO20 26 I/O/T GPIO20, SDIO_DATA0, FSPICS4 IO21 27 I/O/T GPIO21, SDIO_DATA1, FSPICS5 IO22 28 I/O/T GPIO22, SDIO_DATA2 IO23 29 I/O/T GPIO23, SDIO_DATA3 RXD0 30 I/O/T U0RXD, GPIO17 , FSPICS1 TXD0 31 I/O/T U0TXD, GPIO16, FSPICS0 NC 32 — NC NC 33 — NC NC 34 — NC NC 35 — NC 1 P: power supply; I: input; O: output; T: high impedance. Espressif Systems 11 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

4 Boot Configurations

Note: The content below is excerpted fromESP32-C6 Series Datasheet> SectionBoot Configurations via Strapping Pins and eFuses. For the strapping pin mapping between the chip and modules, please refer to Chapter8 Module Schematics. The module allows for configuring the following boot parameters through strapping pins and eFuse parameters at power-up or a hardware reset, without microcontroller interaction.

  • Chip boot mode – Strapping pin: GPIO8 and GPIO9
  • SDIO Sampling and Driving Clock Edge – Strapping pin: MTMS and MTDI
  • ROM message printing – Strapping pin: GPIO8 – eFuse parameter: EFUSE_UART _PRINT _CONTROL and EFUSE_DIS_USB_SERIAL_JTAG_ROM_PRINT
  • JTAG signal source – Strapping pin: GPIO15 – eFuse parameter: EFUSE_DIS_PAD_JTAG, EFUSE_DIS_USB_JTAG, and EFUSE_JTAG_SEL_ENABLE The default values of all the above eFuse parameters are 0, which means that they are not burnt. Given that eFuse is one-time programmable, once programmed to 1, it can never be reverted to 0. For how to program eFuse parameters, please refer toESP32-C6 Technical Reference Manual> ChaptereFuse Controller. The default values of the strapping pins, namely the logic levels, are determined by pins’ internal weak pull-up/pull-down resistors at reset if the pins are not connected to any circuit, or connected to an external high-impedance circuit. Table 4: Default Configuration of Strapping Pins Strapping Pin Default Configuration Bit Value MTMS Floating – MTDI Floating – GPIO8 Floating – GPIO9 Weak pull-up 1 GPIO15 Floating – To change the bit values, the strapping pins should be connected to external pull-down/pull-up resistances. If the ESP32-C6 is used as a device by a host MCU, the strapping pin voltage levels can also be controlled by the host MCU. All strapping pins have latches. At system reset, the latches sample the bit values of their respective strapping pins and store them until the chip is powered down or shut down. The states of latches cannot be changed in Espressif Systems 12 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

any other way. It makes the strapping pin values available during the entire chip operation, and the pins are freed up to be used as regular IO pins after reset. The timing of signals connected to the strapping pins should adhere to thesetup timeand hold time specifications in T able5 and Figure4. Table 5: Description of Timing Parameters for the Strapping Pins Parameter Description Min (ms) tSU Setup timeis the time reserved for the power rails to stabilize be- fore the CHIP_PU pin is pulled high to activate the chip. 0 tH Hold timeis the time reserved for the chip to read the strapping pin values after CHIP_PU is already high and before these pins start operating as regular IO pins. Strapping pin VIL_nRST VIH tSU tH CHIP_PU Figure 4: Visualization of Timing Parameters for the Strapping Pins

4.1 Chip Boot Mode Control

GPIO8 and GPIO9 control the boot mode after the reset is released. See T able6 Chip Boot Mode Control. Table 6: Chip Boot Mode Control Boot Mode GPIO8 GPIO9 SPI boot mode Any value 1 Joint download boot mode2 1 0 1 Bold marks the default value and configuration.

2 Joint Download Boot mode supports the following

download methods:

  • USB-Serial-JTAG Download Boot
  • UART Download Boot
  • SDIO Download Boot Espressif Systems 13 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

4.2 SDIO Sampling and Driving Clock Edge Control

The strapping pin MTMS and MTDI can be used to decide on which clock edge to sample signals and drive output lines. See T able7 SDIO Input Sampling Edge/Output Driving Edge Control. Table 7: SDIO Input Sampling Edge/Output Driving Edge Control Edge behavior MTMS MTDI Falling edge sampling, falling edge output 0 0 Falling edge sampling, rising edge output 0 1 Rising edge sampling, falling edge output 1 0 Rising edge sampling, rising edge output 1 1

1 MTMS and MTDI are floating by default, so above are not

default configurations.

4.3 ROM Messages Printing Control

During the boot process, ROM message printing is enabled if LP_AON_STORE4_REG[0] is 0 (default), and disabled if LP_AON_STORE4_REG[0] is 1. When ROM message printing is enabled, the messages can be printed to:

  • (Default) UART0 and USB Serial/JTAG controller
  • USB Serial/JTAG controller
  • UART0 EFUSE_UART _PRINT _CONTROL and GPIO8 control ROM messages printing toUART0 as shown in T able8 UART0 ROM Message Printing Control. Table 8: UART0 ROM Message Printing Control UART0 ROM Code PrintingEFUSE_UART _PRINT _CONTROLGPIO8 Enabled

0 Ignored

3 Ignored

1 Bold marks the default value and configuration. EFUSE_DIS_USB_SERIAL_JTAG_ROM_PRINT controls the printing toUSB Serial/JTAG controlleras shown in T able9 USB Serial/JTAG ROM Message Printing Control. Espressif Systems 14 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

Table 9: USB Serial/JTAG ROM Message Printing Control USB Serial/JTAG ROM Code Printing EFUSE_DIS_USB_SERIAL_JTAG2 EFUSE_DIS_USB_SERIAL_JTAG_ROM_PRINT Enabled 0 0 Disabled 0 1

1 Ignored

1 Bold marks the default value and configuration. 2 EFUSE_DIS_USB_SERIAL_JTAG controls whether to disable USB Serial/JTAG.

4.4 JTAG Signal Source Control

The strapping pin GPIO15 can be used to control the source of JTAG signals during the early boot process. This pin does not have any internal pull resistors and the strapping value must be controlled by the external circuit that cannot be in a high impedance state. As T able10 JTAG Signal Source Controlshows, GPIO15 is used in combination with EFUSE_DIS_PAD_JTAG, EFUSE_DIS_USB_JTAG and EFUSE_JTAG_SEL_ENABLE. Table 10: JTAG Signal Source Control JTAG Signal Source EFUSE_DIS_PAD_JTAG EFUSE_DIS_USB_JTAG EFUSE_JTAG_SEL_ENABLE GPIO15 USB Serial/JTAG Controller 0 0 0 Ignored 0 0 1 1 1 0 Ignored Ignored JTAG pins2 0 0 1 0 0 1 Ignored Ignored JTAG is disabled 1 1 Ignored Ignored 1 Bold marks the default value and configuration. 2 JTAG pins refer to MTDI, MTCK, MTMS, and MTDO. Espressif Systems 15 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

5 Peripherals

5.1 Peripheral Overview

ESP32-C6FH4/ESP32-C6FH8 integrates a rich set of peripherals including SPI, parallel IO interface, UART , I2C, I2S, RMT (TX/RX), LED PWM, USB Serial/JTAG controller, MCPWM, SDIO2.0 slave controller, GDMA, TWAI® controller, on-chip debug functionality via JTAG, event task matrix, ADC, as well as up to 22 GPIOs, etc. For detailed information about module peripherals, please refer toESP32-C6 Series Datasheet> Section Functional Description. Note that the ADC measurement range and accuracy in the ESP32-C6 Series Datasheetare applicable to modules manufactured on and after the PW Number PW-2023-06-XXXon packaging labels. For modules manufactured earlier than these PW numbers, please ask our sales team to provide the actual range and accuracy according to batches. Note: The content below is sourced fromESP32-C6 Series Datasheet> SectionPeripherals. Some information may not be applicable to ESP32-C6-MINI-1 and ESP32-C6-MINI-1U as not all the IO signals are exposed on the module. To learn more about peripheral signals, please refer toESP32-C6 Technical Reference Manual> SectionPeripheral Signal List.

5.2 Peripheral Description

This section describes the chip’s peripheral capabilities, covering connectivity interfaces and on-chip sensors that extend its functionality.

5.2.1 Connectivity Interface

This subsection describes the connectivity interfaces on the chip that enable communication and interaction with external devices and networks.

5.2.1.1 UART Controller

The UART Controller in the ESP32-C6 chip facilitates the transmission and reception of asynchronous serial data between the chip and external UART devices. It consists of two UART s in the main system, and one low-power LP UART . Feature List

  • Programmable baud rates up to 5 MBaud
  • RAM shared by TX FIFOs and RX FIFOs
  • Support for various lengths of data bits and stop bits
  • Parity bit support
  • Special character AT _CMD detection
  • RS485 protocol support (not supported by LP UART)
  • IrDA protocol support (not supported by LP UART) Espressif Systems 16 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3
  • High-speed data communication using GDMA (not supported by LP UART)
  • Receive timeout feature
  • UART as the wake-up source
  • Software and hardware flow control Pin Assignment For details, seeESP32-C6 Series Datasheet> SectionPeripheral Pin Assignment.

5.2.1.2 SPI Controller

ESP32-C6 has the following SPI interfaces:

  • SPI0 used by ESP32-C6’s cache and GDMA to access in-package or off-package flash
  • SPI1 used by the CPU to access in-package or off-package flash
  • SPI2 is a general-purpose SPI controller with access to general-purpose DMA channels SPI0 and SPI1 are reserved for system use, and only SPI2 is available for users. Features of SPI0 and SPI1
  • Supports Single SPI, Dual SPI, Quad SPI (QPI) modes
  • Data transmission is in bytes Features of SPI2
  • Supports operation as a master or slave
  • Support for GDMA
  • Supports Single SPI, Dual SPI, Quad SPI (QPI) modes
  • Configurable clock polarity (CPOL) and phase (CPHA)
  • Configurable clock frequency
  • Data transmission is in bytes
  • Configurable read and write data bit order: most-significant bit (MSB) first, or least-significant bit (LSB) first
  • As a master – Supports 2-line full-duplex communication with clock frequency up to 80 MHz – Supports 1-, 2-, 4-line half-duplex communication with clock frequency up to 80 MHz – Provides six FSPICS… pins for connection with six independent SPI slaves – Configurable CS setup time and hold time
  • As a slave – Supports 2-line full-duplex communication with clock frequency up to 40 MHz Espressif Systems 17 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

– Supports 1-, 2-, 4-line half-duplex communication with clock frequency up to 40 MHz Pin Assignment For details, seeESP32-C6 Series Datasheet> SectionPeripheral Pin Assignment.

5.2.1.3 I2C Controller

The I2C Controller supports communication between the master and slave devices using the I2C bus. Feature List

  • Two I2C controllers: one in the main system and one in the low-power system
  • Communication with multiple external devices
  • Master and slave modes for I2C, and master mode only for LP I2C
  • Standard mode (100 Kbit/s) and fast mode (400 Kbit/s)
  • SCL clock stretching in slave mode
  • Programmable digital noise filtering
  • Support for 7-bit and 10-bit addressing, as well as dual address mode Pin Assignment For details, seeESP32-C6 Series Datasheet> SectionPeripheral Pin Assignment.

5.2.1.4 I2S Controller

The I2S Controller in the ESP32-C6 chip provides a flexible communication interface for streaming digital data in multimedia applications, particularly digital audio applications. Feature List

  • Master mode and slave mode
  • Full-duplex and half-duplex communications
  • Separate TX and RX units that can work independently or simultaneously
  • A variety of audio standards supported: – TDM Philips standard – TDM MSB alignment standard – TDM PCM standard – PDM standard
  • PCM-to-PDM TX interface
  • Configurable high-precision BCK clock, with frequency up to 40 MHz Espressif Systems 18 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

– Sampling frequencies can be 8 kHz, 16 kHz, 32 kHz, 44.1 kHz, 48 kHz, 88.2 kHz, 96 kHz, 128 kHz, 192 kHz, etc.

  • 8-/16-/24-/32-bit data communication
  • Direct Memory Access (DMA)
  • A-law and ￿-law compression/decompression algorithms for improved signal-to-quantization noise ratio
  • Flexible data format control Pin Assignment For details, seeESP32-C6 Series Datasheet> SectionPeripheral Pin Assignment.

5.2.1.5 Pulse Count Controller

The Pulse Count Controller (PCNT) is designed to count input pulses by tracking rising and falling edges of the input pulse signal. Feature List

  • Four independent pulse counters with two channels each
  • Counter modes: increment, decrement, or disable
  • Glitch filtering for input pulse signals and control signals
  • Selection between counting on rising or falling edges of the input pulse signal Pin Assignment For details, seeESP32-C6 Series Datasheet> SectionPeripheral Pin Assignment.

5.2.1.6 USB Serial/JTAG Controller

The USB Serial/JTAG controller in the ESP32-C6 chip provides an integrated solution for communicating to the chip over a standard USB CDC-ACM serial port as well as a convenient method for JTAG debugging. It eliminates the need for external chips or JTAG adapters, saving space and reducing cost. Feature List

  • USB 2.0 full speed compliant, capable of up to 12 Mbit/s transfer speed (Note that this controller does not support the faster 480 Mbit/s high-speed transfer mode)
  • CDC-ACM virtual serial port and JTAG adapter functionality
  • CDC-ACM: – CDC-ACM adherent serial port emulation (plug-and-play on most modern OSes) – Host controllable chip reset and entry into download mode
  • JTAG adapter functionality: – Fast communication with CPU debugging core using a compact representation of JTAG instructions Espressif Systems 19 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3
  • Support for reprogramming of attached flash memory through the ROM startup code
  • Internal PHY Pin Assignment For details, seeESP32-C6 Series Datasheet> SectionPeripheral Pin Assignment.

5.2.1.7 Two-wire Automotive Interface

The Two-wire Automotive Interface (TWAI®) is a multi-master, multi-cast communication protocol designed for automotive applications. The TWAI controller facilitates the communication based on this protocol. Feature List

  • Compatible with ISO 11898-1 protocol (CAN Specification 2.0)
  • Standard frame format (11-bit ID) and extended frame format (29-bit ID)
  • Bit rates from 1 Kbit/s to 1 Mbit/s
  • Multiple modes of operation: Normal, Listen Only, and Self-Test (no acknowledgment required)
  • Special transmissions: Single-shot and Self Reception
  • Acceptance filter (single and dual filter modes)
  • Error detection and handling: error counters, configurable error warning limit, error code capture, arbitration lost capture, automatic transceiver standby Pin Assignment For details, seeESP32-C6 Series Datasheet> SectionPeripheral Pin Assignment. 5.2.1.8 SDIO 2.0 Slave Controller The SDIO 2.0 Slave Controller in the ESP32-C6 chip provides hardware support for the Secure Digital Input/Output (SDIO) device interface. It allows an SDIO host to access the ESP32-C6 via an SDIO bus protocol. Feature List
  • Compatible with SD Physical Layer Specification V2.00 and SDIO V2.00 specifications
  • Support for SPI, 1-bit SDIO, and 4-bit SDIO transfer modes
  • Clock range of 0 ~ 50 MHz
  • Configurable sample and drive clock edge
  • Integrated and SDIO-accessible registers for information interaction
  • Support for SDIO interrupt mechanism
  • Automatic padding data and discarding the padded data on the SDIO bus
  • Block size up to 512 bytes Espressif Systems 20 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3
  • Interrupt vector between the host and slave for bidirectional interrupt
  • Support DMA for data transfer
  • Support for wake-up from sleep when connection is retained Pin Assignment For details, seeESP32-C6 Series Datasheet> SectionPeripheral Pin Assignment.

5.2.1.9 LED PWM Controller

The LED PWM Controller (LEDC) is designed to generate PWM signals for LED control. Feature List

  • Six independent PWM generators
  • Maximum PWM duty cycle resolution of 20 bits
  • Four independent timers with 20-bit counters, configurable fractional clock dividers and counter overflow values
  • Adjustable phase of PWM signal output
  • PWM duty cycle dithering
  • Automatic duty cycle fading – Linear duty cycle fading — only one duty cycle range – Gamma curve fading — up to 16 duty cycle ranges for each PWM generator, with independently configured fading direction (increase or decrease), fading amount, number of fades, and fading frequency
  • PWM signal output in low-power mode (Light-sleep mode)
  • Event generation and task response achieved by the Event T ask Matrix (ETM) Pin Assignment For details, seeESP32-C6 Series Datasheet> SectionPeripheral Pin Assignment.

5.2.1.10 Motor Control PWM

The Motor Control Pulse Width Modulator (MCPWM) is designed for driving digital motors and smart light. The MCPWM is divided into five main modules: PWM timers, PWM operators, Capture module, Fault Detection module, and Event T ask Matrix (ETM) module. Feature List

  • Three PWM timers for precise timing and frequency control – Every PWM timer has a dedicated 8-bit clock prescaler Espressif Systems 21 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

– The 16-bit counter in the PWM timer can work in count-up mode, count-down mode, or count-up-down mode – Hardware or software synchronization to trigger a reload on the PWM timer or the prescaler’s restart, with selectable hardware synchronization source

  • Three PWM operators for generating waveform pairs – Six PWM outputs to operate in several topologies – Configurable dead time on rising and falling edges; each set up independently – Modulating of PWM output by high-frequency carrier signals, useful when gate drivers are insulated with a transformer
  • Capture module for hardware-based signal processing – Speed measurement of rotating machinery – Measurement of elapsed time between position sensor pulses – Period and duty cycle measurement of pulse train signals – Decoding current or voltage amplitude derived from duty-cycle-encoded signals of current/voltage sensors – Three individual capture channels, each of which with a 32-bit time-stamp register – Selection of edge polarity and prescaling of input capture signals – The capture timer can sync with a PWM timer or external signals
  • Fault Detection module – Programmable fault handling in both cycle-by-cycle mode and one-shot mode – A fault condition can force the PWM output to either high or low logic levels
  • Event generation and task response achieved by the Event T ask Matrix (ETM) Pin Assignment For details, seeESP32-C6 Series Datasheet> SectionPeripheral Pin Assignment.

5.2.1.11 Remote Control Peripheral

The Remote Control Peripheral (RMT) controls the transmission and reception of infrared remote control signals. Feature List

  • Four channels for sending and receiving infrared remote control signals
  • Independent transmission and reception capabilities for each channel
  • Support for Normal TX/RX mode, Wrap TX/RX mode, Continuous TX mode
  • Modulation on TX pulses and Demodulation on RX pulses
  • RX filtering for improved signal reception Espressif Systems 22 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3
  • Ability to transmit data simultaneously on multiple channels
  • Clock divider counter, state machine, and receiver for each RX channel
  • Default allocation of RAM blocks to channels based on channel number
  • RAM containing 16-bit entries with “level” and “period” fields Pin Assignment For details, seeESP32-C6 Series Datasheet> SectionPeripheral Pin Assignment.

5.2.1.12 Parallel IO Controller

The Parallel IO Controller (PARLIO) in the ESP32-C6 chip enables data transfer between external devices and internal memory on a parallel bus through GDMA. It consists of a transmitter (TX unit) and a receiver (RX unit), making it a versatile interface for connecting various peripherals. Feature List

  • 1/2/4/8/16-bit configurable data bus width
  • Half-duplex communication with 16-bit data bus width and full-duplex communication with 8-bit data bus width
  • Bit reordering in 1/2/4-bit data bus width mode
  • RX unit supports 15 receive modes categorized into three major categories: Level Enable mode, Pulse Enable mode, and Software Enable mode
  • TX unit can generate a valid signal aligned with TX Pin Assignment For details, seeESP32-C6 Series Datasheet> SectionPeripheral Pin Assignment.

5.2.2 Analog Signal Processing

This subsection describes components on the chip that sense and process real-world data.

5.2.2.1 SAR ADC

ESP32-C6 integrates a Successive Approximation Analog-to-Digital Converter (SAR ADC) to convert analog signals into digital representations. Feature List

  • 12-bit sampling resolution
  • Analog voltage sampling from up to seven pins
  • Attenuation of input signals for voltage conversion
  • Software-triggered one-time sampling
  • Timer-triggered multi-channel scanning Espressif Systems 23 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3
  • DMA continuous conversion for seamless data transfer
  • Two filters with configurable filter coefficient
  • Threshold monitoring which helps to trigger an interrupt
  • Support for Event T ask Matrix Pin Assignment For details, seeESP32-C6 Series Datasheet> SectionPeripheral Pin Assignment.

5.2.2.2 Temperature Sensor

The Temperature Sensor in the ESP32-C6 chip allows for real-time monitoring of temperature changes inside the chip. Feature List

  • Measurement range: –40°C ~ 125°C
  • Software triggering, wherein the data can be read continuously once triggered
  • Hardware automatic triggering and temperature monitoring
  • Configurable temperature offset based on the environment to improve the accuracy
  • Adjustable measurement range
  • Two automatic monitoring wake-up modes: absolute value mode and incremental value mode
  • Support for Event T ask Matrix Espressif Systems 24 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

6 Electrical Characteristics

6.1 Absolute Maximum Ratings

Stresses above those listed in T able11 Absolute Maximum Ratingsmay cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under T able12 Recommended Operating Conditionsis not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Table 11: Absolute Maximum Ratings Symbol Parameter Min Max Unit VDD33 Power supply voltage –0.3 3.6 V TSTORE Storage temperature –40 105 °C

6.2 Recommended Operating Conditions

Table 12: Recommended Operating Conditions Symbol Parameter Min Typ Max Unit VDD33 Power supply voltage 3.0 3.3 3.6 V IV DD Current delivered by external power supply 0.5 — — A TA Operating ambient temperature 85 °C version –40 — 85 °C105 °C version 105 6.3 DC Characteristics (3.3 V, 25 °C) Table 13: DC Characteristics (3.3 V, 25 °C) Symbol Parameter Min Typ Max Unit CIN Pin capacitance — 2 — pF VIH High-level input voltage 0.75 × VDD1 — VDD1 + 0.3 V VIL Low-level input voltage –0.3 — 0.25 × VDD1 V IIH High-level input current — — 50 nA IIL Low-level input current — — 50 nA VOH 2 High-level output voltage 0.8 × VDD1 — — V VOL2 Low-level output voltage — — 0.1 × VDD1 V IOH High-level source current (VDD1 = 3.3 V, VOH >= 2.64 V, PAD_DRIVER = 3) — 40 — mA IOL Low-level sink current (VDD1 = 3.3 V, VOL =

0.495 V, PAD_DRIVER = 3) — 28 — mA

RPU Pull-up resistor — 45 — kΩ RPD Pull-down resistor — 45 — kΩ VIH_nRST Chip reset release voltage 0.75 × VDD1 — VDD1 + 0.3 V VIL_nRST Chip reset voltage –0.3 — 0.25 × VDD1 V Espressif Systems 25 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

1 VDD is the I/O voltage for pins of a particular power domain. 2 VOH and VOL are measured using high-impedance load.

6.4 Current Consumption Characteristics

6.4.1 Current Consumption in Active Mode

The current consumption measurements are taken with a 3.3 V supply at 25 °C ambient temperature. TX current consumption is rated at a 100% duty cycle. RX current consumption is rated when the peripherals are disabled and the CPU idle. Table 14: Current Consumption for Wi-Fi (2.4 GHz) in Active Mode Work Mode RF Condition Description Peak (mA) Active (RF working) TX 802.11b, 1 Mbps, DSSS @ 20.5 dBm 382 802.11g, 54 Mbps, OFDM @ 19.0 dBm 316 802.11n, HT20, MCS7 @ 18.0 dBm 295 802.11n, HT40, MCS7 @ 17 .5 dBm 280 802.11ax, MCS9 @ 15.5 dBm 251 RX 802.11b/g/n, HT20 78 802.11n, HT40 82 802.11ax, HE20 78 Table 15: Current Consumption for Bluetooth LE in Active Mode Work Mode RF Condition Description Peak (mA) Active (RF working) TX Bluetooth LE @ 19.0 dBm 309 Bluetooth LE @ 9.0 dBm 189 Bluetooth LE @ 0 dBm 131 Bluetooth LE @ –16.0 dBm 94 RX Bluetooth LE 73 Table 16: Current Consumption for 802.15.4 in Active Mode Work Mode RF Condition Description Peak (mA) Active (RF working) TX 802.15.4 @ 19.0 dBm 305 802.15.4 @ 12.0 dBm 190 802.15.4 @ 0 dBm 120 802.15.4 @ –16.0 dBm 86 RX 802.15.4 73 Espressif Systems 26 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

Note: The content below is excerpted fromSection Current Consumption in Other Modesin ESP32-C6 Series Datasheet.

6.4.2 Current Consumption in Other Modes

Table 17: Current Consumption in Modem-sleep Mode Typ (mA) Mode CPU Frequency (MHz) Description All Peripherals Clocks Disabled All Peripherals Clocks Enabled1 Modem-sleep 2,3

160 CPU is running 27 38

80 CPU is running 19 30

1 In practice, the current consumption might be different depending on which peripherals are

enabled. 2 In Modem-sleep mode, Wi-Fi is clock gated. 3 In Modem-sleep mode, the consumption might be higher when accessing flash. Table 18: Current Consumption in Low-Power Modes Mode Description Typ (µA) Light-sleep CPU and wireless communication modules are powered down, peripheral clocks are disabled, and all GPIOs are high-impedance 180 CPU, wireless communication modules and peripherals are pow- ered down, and all GPIOs are high-impedance 35 Deep-sleep RTC timer and LP memory are powered on 7 Power off CHIP_PU is set to low level, the chip is powered off 1 Espressif Systems 27 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

7 RF Characteristics

This section contains tables with RF characteristics of the Espressif product. The RF data is measured at the antenna port, where RF cable is connected, including the front-end loss. The external antennas used for the tests on the modules with external antenna connectors have an impedance of 50 Ω.Devices should operate in the center frequency range allocated by regional regulatory authorities. The target center frequency range and the target transmit power are configurable by software. SeeESP RF Test Tooland TestGuide for instructions. Unless otherwise stated, the RF tests are conducted with a 3.3 V (±5%) supply at 25 ºC ambient temperature. 7 .1Wi-Fi Radio Table 19: Wi-Fi RF Characteristics Name Description Center frequency range of operating channel2412 ~ 2484 MHz Wi-Fi wireless standard IEEE 802.11b/g/n/ax 7 .1.1Wi-Fi RF Transmitter (TX) Characteristics Table 20: TX Power with Spectral Mask and EVM Meeting 802.11 Standards Min Typ Max Rate (dBm) (dBm) (dBm) 802.11b, 1 Mbps, DSSS — 20.5 — 802.11b, 11 Mbps, CCK — 20.5 — 802.11g, 6 Mbps, OFDM — 19.5 — 802.11g, 54 Mbps, OFDM — 18.5 — 802.11n, HT20, MCS0 — 18.5 — 802.11n, HT20, MCS7 — 17 .5 — 802.11n, HT40, MCS0 — 18.0 — 802.11n, HT40, MCS7 — 17 .0 — 802.11ax, HE20, MCS0 — 18.5 — 802.11ax, HE20, MCS9 — 14.0 — Table 21: TX EVM Test1 Min Typ Limit Rate (dB) (dB) (dB) 802.11b, 1 Mbps, DSSS — –25.0 –10.0 802.11b, 11 Mbps, CCK — –25.0 –10.0 802.11g, 6 Mbps, OFDM — –24.0 –5.0 Cont’d on next page Espressif Systems 28 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

Table 21 – cont’d from previous page Min Typ Limit Rate (dB) (dB) (dB) 802.11g, 54 Mbps, OFDM — –28.0 –25.0 802.11n, HT20, MCS0 — –27 .5 –5.0 802.11n, HT20, MCS7 — –30.0 –27 .0 802.11n, HT40, MCS0 — –27 .0 –5.0 802.11n, HT40, MCS7 — –29.5 –27 .0 802.11ax, HE20, MCS0 — –27 .0 –5.0 802.11ax, HE20, MCS9 — –34.0 –32.0

1 EVM is measured at the corresponding typical TX power provided

in T able20 TX Power with Spectral Mask and EVM Meeting 802.11 Standards above. 7 .1.2Wi-Fi RF Receiver (RX) Characteristics For RX tests, the PER (packet error rate) limit is 8% for 802.11b, and 10% for 802.11g/n/ax. Table 22: RX Sensitivity Min Typ Max Rate (dBm) (dBm) (dBm) 802.11b, 1 Mbps, DSSS — –99.0 — 802.11b, 2 Mbps, DSSS — –96.0 — 802.11b, 5.5 Mbps, CCK — –93.2 — 802.11b, 11 Mbps, CCK — –89.4 — 802.11g, 6 Mbps, OFDM — –94.0 — 802.11g, 9 Mbps, OFDM — –92.6 — 802.11g, 12 Mbps, OFDM — –92.0 — 802.11g, 18 Mbps, OFDM — –89.4 — 802.11g, 24 Mbps, OFDM — –86.4 — 802.11g, 36 Mbps, OFDM — –82.6 — 802.11g, 48 Mbps, OFDM — –78.0 — 802.11g, 54 Mbps, OFDM — –77 .0 — 802.11n, HT20, MCS0 — –93.6 — 802.11n, HT20, MCS1 — –91.8 — 802.11n, HT20, MCS2 — –88.8 — 802.11n, HT20, MCS3 — –85.6 — 802.11n, HT20, MCS4 — –82.8 — 802.11n, HT20, MCS5 — –78.0 — 802.11n, HT20, MCS6 — –76.6 — 802.11n, HT20, MCS7 — –75.0 — 802.11n, HT40, MCS0 — –91.0 — 802.11n, HT40, MCS1 — –88.6 — 802.11n, HT40, MCS2 — –85.6 — Cont’d on next page Espressif Systems 29 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

Table 22 – cont’d from previous page Min Typ Max Rate (dBm) (dBm) (dBm) 802.11n, HT40, MCS3 — –82.6 — 802.11n, HT40, MCS4 — –79.0 — 802.11n, HT40, MCS5 — –74.8 — 802.11n, HT40, MCS6 — –73.0 — 802.11n, HT40, MCS7 — –71.8 — 802.11ax, HE20, MCS0 — –93.8 — 802.11ax, HE20, MCS1 — –91.0 — 802.11ax, HE20, MCS2 — –87 .4 — 802.11ax, HE20, MCS3 — –85.0 — 802.11ax, HE20, MCS4 — –81.4 — 802.11ax, HE20, MCS5 — –77 .0 — 802.11ax, HE20, MCS6 — –76.0 — 802.11ax, HE20, MCS7 — –74.4 — 802.11ax, HE20, MCS8 — –70.4 — 802.11ax, HE20, MCS9 — –68.2 — Table 23: Maximum RX Level Min Typ Max Rate (dBm) (dBm) (dBm) 802.11b, 1 Mbps, DSSS — 5 — 802.11b, 11 Mbps, CCK — 5 — 802.11g, 6 Mbps, OFDM — 5 — 802.11g, 54 Mbps, OFDM — 0 — 802.11n, HT20, MCS0 — 5 — 802.11n, HT20, MCS7 — 0 — 802.11n, HT40, MCS0 — 5 — 802.11n, HT40, MCS7 — 0 — 802.11ax, HE20, MCS0 — 5 — 802.11ax, HE20, MCS9 — 0 — Table 24: RX Adjacent Channel Rejection Min Typ Max Rate (dB) (dB) (dB) 802.11b, 1 Mbps, DSSS — 38 — 802.11b, 11 Mbps, CCK — 38 — 802.11g, 6 Mbps, OFDM — 31 — 802.11g, 54 Mbps, OFDM — 20 — 802.11n, HT20, MCS0 — 31 — Cont’d on next page Espressif Systems 30 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

Table 24 – cont’d from previous page Min Typ Max Rate (dB) (dB) (dB) 802.11n, HT20, MCS7 — 16 — 802.11n, HT40, MCS0 — 28 — 802.11n, HT40, MCS7 — 10 — 802.11ax, HE20, MCS0 — 25 — 802.11ax, HE20, MCS9 — 2 — 7 .2 Bluetooth 5 (LE) Radio Table 25: Bluetooth LE RF Characteristics Name Description Center frequency range of operating channel2402 ~ 2480 MHz RF transmit power range –16.0 ~ 19.0 dBm 7 .2.1Bluetooth LE RF Transmitter (TX) Characteristics Table 26: Bluetooth LE - Transmitter Characteristics - 1 Mbps Parameter Description Min Typ Max Unit Carrier frequency offset and drift Modulation characteristics ∆ F1avg — 249.9 — kHz Min. ∆ F2max (for at least 99.9% of all∆ F2max) — 212.1 — kHz ∆ F2avg/∆ F1avg — 0.88 — — In-band emissions ± 2 MHz offset — –29 — dBm ± 3 MHz offset — –36 — dBm > ± 3 MHz offset — –39 — dBm Table 27: Bluetooth LE - Transmitter Characteristics - 2 Mbps Parameter Description Min Typ Max Unit Carrier frequency offset and drift Modulation characteristics ∆ F1avg — 499.4 — kHz Cont’d on next page Espressif Systems 31 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

Table 27 – cont’d from previous page Parameter Description Min Typ Max Unit Min. ∆ F2max (for at least 99.9% of all∆ F2max) — 443.5 — kHz ∆ F2avg/∆ F1avg — 0.95 — — In-band emissions ± 4 MHz offset — –40 — dBm ± 5 MHz offset — –41 — dBm > ± 5 MHz offset — –42 — dBm Table 28: Bluetooth LE - Transmitter Characteristics - 125 Kbps Parameter Description Min Typ Max Unit Carrier frequency offset and drift Modulation characteristics ∆ F1avg — 250.0 — kHz Min. ∆ F1max (for at least 99.9% of all∆ F1max) — 238.0 — kHz In-band emissions ± 2 MHz offset — –29 — dBm ± 3 MHz offset — –36 — dBm > ± 3 MHz offset — –39 — dBm Table 29: Bluetooth LE - Transmitter Characteristics - 500 Kbps Parameter Description Min Typ Max Unit Carrier frequency offset and drift Modulation characteristics ∆ F2avg — 230.7 — kHz Min. ∆ F2max (for at least 99.9% of all∆ F2max) — 217 .6 — kHz In-band emissions ± 2 MHz offset — –28 — dBm ± 3 MHz offset — –36 — dBm > ± 3 MHz offset — –39 — dBm 7 .2.2 Bluetooth LE RF Receiver (RX) Characteristics Table 30: Bluetooth LE - Receiver Characteristics - 1 Mbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –98.0 — dBm Maximum received signal @30.8% PER — — 8 — dBm Cont’d on next page Espressif Systems 32 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

Table 30 – cont’d from previous page Parameter Description Min Typ Max Unit C/I and receiver selectivity performance Co-channel F = F0 MHz — 7 — dB Adjacent channel F = F0 + 1 MHz — 4 — dB F = F0 – 1 MHz — 3 — dB F = F0 + 2 MHz — –21 — dB F = F0 – 2 MHz — –22 — dB F = F0 + 3 MHz — –28 — dB F = F0 – 3 MHz — –36 — dB F ≥ F0 + 4 MHz — –27 — dB F ≤ F0 – 4 MHz — –36 — dB Image frequency — — –26 — dB Adjacent channel to image frequency F = Fimage + 1 MHz — –29 — dB F = Fimage – 1 MHz — –28 — dB

30 MHz~ 2000 MHz — –16 — dBm

Out-of-band blocking performance 2003 MHz~ 2399 MHz — –24 — dBm

2484 MHz~ 2997 MHz — –16 — dBm

3000 MHz~ 12.75 GHz — –1 — dBm Intermodulation — — –27 — dBm Table 31: Bluetooth LE - Receiver Characteristics - 2 Mbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –95.0 — dBm Maximum received signal @30.8% PER — — 8 — dBm C/I and receiver selectivity performance Co-channel F = F0 MHz — 8 — dB Adjacent channel F = F0 + 2 MHz — 3 — dB F = F0 – 2 MHz — 2 — dB F = F0 + 4 MHz — –23 — dB F = F0 – 4 MHz — –25 — dB F = F0 + 6 MHz — –31 — dB F = F0 – 6 MHz — –35 — dB F ≥ F0 + 8 MHz — –36 — dB F ≤ F0 – 8 MHz — –36 — dB Image frequency — — –23 — dB Adjacent channel to image frequency F = Fimage + 2 MHz — –30 — dB F = Fimage – 2 MHz — 3 — dB

30 MHz~ 2000 MHz — –18 — dBm

Out-of-band blocking performance 2003 MHz~ 2399 MHz — –28 — dBm 3000 MHz~ 12.75 GHz — –1 — dBm Intermodulation — — –29 — dBm Espressif Systems 33 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

Table 32: Bluetooth LE - Receiver Characteristics - 125 Kbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –105.5 — dBm Maximum received signal @30.8% PER — — 8 — dBm C/I and receiver selectivity performance Co-channel F = F0 MHz — 2 — dB Adjacent channel F = F0 + 1 MHz — –1 — dB F = F0 – 1 MHz — –3 — dB F = F0 + 2 MHz — –31 — dB F = F0 – 2 MHz — –27 — dB F = F0 + 3 MHz — –33 — dB F = F0 – 3 MHz — –42 — dB F ≥ F0 + 4 MHz — –31 — dB F ≤ F0 – 4 MHz — –48 — dB Image frequency — — –31 — dB Adjacent channel to image frequency F = Fimage + 1 MHz — –36 — dB F = Fimage – 1 MHz — –33 — dB Table 33: Bluetooth LE - Receiver Characteristics - 500 Kbps Parameter Description Min Typ Max Unit Sensitivity @30.8% PER — — –101.5 — dBm Maximum received signal @30.8% PER — — 8 — dBm C/I and receiver selectivity performance Co-channel F = F0 MHz — 4 — dB Adjacent channel F = F0 + 1 MHz — 1 — dB F = F0 – 1 MHz — –1 — dB F = F0 + 2 MHz — –23 — dB F = F0 – 2 MHz — –24 — dB F = F0 + 3 MHz — –33 — dB F = F0 – 3 MHz — –41 — dB F ≥ F0 + 4 MHz — –31 — dB F ≤ F0 – 4 MHz — –41 — dB Image frequency — — –30 — dB Adjacent channel to image frequency F = Fimage + 1 MHz — –35 — dB F = Fimage – 1 MHz — –27 — dB 7 .3 802.15.4 Radio Table 34: 802.15.4 RF Characteristics Name Description Center frequency range of operating channel2405 ~ 2480 MHz 1 Zigbee in the 2.4 GHz range supports 16 channels at 5 MHz spacing from channel 11 to channel 26. Espressif Systems 34 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

7 .3.1802.15.4 RF Transmitter (TX) Characteristics Table 35: 802.15.4 Transmitter Characteristics - 250 Kbps Parameter Min Typ Max Unit RF transmit power range –16.0 — 19.0 dBm EVM — 13% — — 7 .3.2 802.15.4 RF Receiver (RX) Characteristics Table 36: 802.15.4 Receiver Characteristics - 250 Kbps Parameter Description Min Typ Max Unit Sensitivity @1% PER — — –104.0 — dBm Maximum received signal @1% PER — — 8 — dBm Relative jamming level Adjacent channel F = F0 + 5 MHz — 27 — dB F = F0 – 5 MHz — 32 — dB Alternate channel F = F0 + 10 MHz — 47 — dB F = F0 – 10 MHz — 50 — dB Espressif Systems 35 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

8 Module Schematics

This is the reference design of the module. GPIO2 GPIO3 CHIP_EN GPIO1 GPIO0 GPIO8 GPIO9 U0RXD U0TXD GPIO5 GPIO4 GPIO6 GPIO23 GPIO22 GPIO21 GPIO20 GPIO19 GPIO18 GPIO7 GPIO12 GPIO13 GPIO14 GPIO15 CHIP_EN GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO12 GPIO13 GPIO14 GPIO15 LNA_IN U0RXD U0TXD GPIO18 GPIO19 GPIO20 GPIO21 GPIO22 GPIO23 RF_ANT VDD33 GND GND GND GND GND GND VDD33 GND GND GND GND VDD33 VDD33 GND GND GND GND VDD33 GND GND GND GND ESP32-C6-MINI-1(pin-out) The values of C8, L2 and C9 vary with the actual PCB board. The values of C1 and C2 vary with the selection of the crystal. The value of R1 varies with the actual PCB board. NC: No component. TBD 10uF 0.1uF 40MHz XIN GND XOUT GND 0.1uF 499 10nF ESP32-C6-MINI-1 GND 3V3 IO9 NC IO2 IO3 NC IO4 IO5 IO6 IO7 IO12 IO13 IO14 NC TXD0 RXD0 NC NC IO20 IO23 IO22 IO21 NC IO8 IO0 IO1 GND IO15 NC IO18 EPAD GND GND GND GND EN GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND IO19 ESD TBD C10 0.1uF 2.0nH(0.1nH) ESP32-C6-QFN32 VDDA3P3 VDDA3P3 GPIO3 GPIO12 MTMS MTDO MTCK MTDI GPIO13 VDDPST1 GPIO2 GPIO8 GPIO9 XTAL_32K_P XTAL_32K_N CHIP_PU U0RXD U0TXD SDIO_CLK SDIO_DATA0 SDIO_DATA1 SDIO_DATA2 XTAL_N XTAL_P VDDA1 ANT GND GPIO15 VDDPST2 SDIO_CMD SDIO_DATA3 VDDA2 GPIO14 ANT1 PCB_ANT TBD TBD C12 0.1uF TBD 1uF Figure 5: ESP32-C6-MINI-1 Schematics Espressif Systems 36 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

CHIP_EN GPIO1 GPIO0 GPIO8 GPIO9 U0RXD U0TXD GPIO5 GPIO4 GPIO6 GPIO23 GPIO22 GPIO21 GPIO20 GPIO19 GPIO18 GPIO7 GPIO12 GPIO13 GPIO14 GPIO15 CHIP_EN GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO12 GPIO13 GPIO14 GPIO15 LNA_IN U0RXD U0TXD GPIO18 GPIO19 GPIO20 GPIO21 GPIO22 GPIO23 RF_ANT VDD33 GND GND GND GND GND GND VDD33 GND GND GND GND VDD33 VDD33 GND GND GND GND VDD33 GND GND GND GND GND ESP32-C6-MINI-1U(pin-out) The values of C8, L2 and C9 vary with the actual PCB board. The values of C1 and C2 vary with the selection of the crystal. The value of R1 varies with the actual PCB board. NC: No component. TBD 10uF 0.1uF 40MHz XIN GND XOUT GND 0.1uF 499 10nF ESP32-C6-MINI-1U GND 3V3 IO9 NC IO2 IO3 NC IO4 IO5 IO6 IO7 IO12 IO13 IO14 NC TXD0 RXD0 NC NC IO20 IO23 IO22 IO21 NC IO8 IO0 IO1 GND IO15 NC IO18 EPAD GND GND GND GND EN GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND IO19 ESD TBD C10 0.1uF 2.0nH(0.1nH) TBD ESP32-C6-QFN32 VDDA3P3 VDDA3P3 GPIO3 GPIO12 MTMS MTDO MTCK MTDI GPIO13 VDDPST1 GPIO2 GPIO8 GPIO9 XTAL_32K_P XTAL_32K_N CHIP_PU U0RXD U0TXD SDIO_CLK SDIO_DATA0 SDIO_DATA1 SDIO_DATA2 XTAL_N XTAL_P VDDA1 ANT GND GPIO15 VDDPST2 SDIO_CMD SDIO_DATA3 VDDA2 GPIO14 TBD TBD ESD(NC) C12 0.1uF ANT1 CONN 1uF Figure 6: ESP32-C6-MINI-1U Schematics Espressif Systems 37 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

9 Peripheral Schematics

This is the typical application circuit of the module connected with peripheral components (for example, power supply, antenna, reset button, JTAG interface, and UART interface). IO3 IO2 EN IO4 IO5 IO1 IO0 IO6 IO7 IO12 IO13 TXD0 RXD0 IO19 IO20 IO21 IO22 IO23 IO18 IO15 IO14 IO8 IO9 USB_D+ USB_D- IO8 IO6 TCK IO7 TDO TMS IO4 IO5 TDI GND VDD33 GND GND GND GND GND VDD33 GND GND GND GND VDD33 GND GND VDD33 X1: ESR = Max. 70 KΩ NC: No component. ESP32-C6-MINI-1U TBD 0(NC) NC SW1 12pF(NC) 0(NC) TBD TBD 22uF JP2 Boot Option JP4 JTAG JP1 UART TBD JP3 USB ESP32-C6-MINI-1 GND 3V3 IO9 NC IO2 IO3 NC IO4 IO5 IO6 IO7 IO12 IO13 IO14 NC TXD0 RXD0 NC NC IO20 IO23 IO22 IO21 NC IO8 IO0 IO1 GND IO15 NC IO18 EPAD GND GND GND GND EN GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND IO19 0.1uF 12pF(NC) TBD TBD 32.768KHz(NC) 10K 0.1uF Figure 7: Peripheral Schematics

  • Soldering the EPAD to the ground of the base board is not a must, however, it can optimize thermal performance. If you choose to solder it, please apply the correct amount of soldering paste. Too much soldering paste may increase the gap between the module and the baseboard. As a result, the adhesion between other pins and the baseboard may be poor.
  • To ensure that the power supply to the ESP32-C6 chip is stable during power-up, it is advised to add an RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and C = 1µF. However, specific parameters should be adjusted based on the power-up timing of the module and the power-up and reset sequence timing of the chip. For ESP32-C6’s power-up and reset sequence timing diagram, please refer toESP32-C6 Series Datasheet> SectionPower Supply. Espressif Systems 38 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

10 Physical Dimensions

10.1 Module Dimensions

11.20 Figure 8: ESP32-C6-MINI-1 Physical Dimensions Figure 9: ESP32-C6-MINI-1U Physical Dimensions Note: For information about tape, reel, and product marking, please refer toEspressif Module Packaging Information. Espressif Systems 39 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

10.2 Dimensions of External Antenna Connector

ESP32-C6-MINI-1U uses the third generation external antenna connector as shown in Figure10 Dimensions of External Antenna Connector. This connector is compatible with the following connectors:

  • W.FL Series connector from Hirose
  • MHF III connector from I-PEX
  • AMMC connector from Amphenol SECTION: A-ASCALE: 1:1 A1.7 1.7 0.85 2.05±0.101.40 A 0.10 0.57 INSULATION RESISTANCE: 500MOHM Min.DIELECTRIC WITHSTANDING VOLTAGE: 200V AC FOR 1MINUTE; CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER;PERFORMANCE:CONTACT RESISTANCE: 20mOHM Max. HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0;SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; CONTACT GROUND CONTACT 2.00±0.10 Unit: mmTolerance: +/-0.1 mm HOUSINGCONTACT SHELL Figure 10: Dimensions of External Antenna Connector Espressif Systems 40 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

11 PCB Layout Recommendations

11.1 PCB Land Pattern

  • Figures for recommended PCB land patterns with all the dimensions needed for PCB design. See Figure

11 ESP32-C6-MINI-1 Recommended PCB Land Patternand Figure12 ESP32-C6-MINI-1U Recommended

  • Source files of recommended PCB land patterns to measure dimensions not covered in Figure11 and

Figure 12. You can view the source files forESP32-C6-MINI-1 and ESP32-C6-MINI-1U with Autodesk

  • 3D models ofESP32-C6-MINI-1 and ESP32-C6-MINI-1U. Please make sure that you download the 3D model file in .STEP format (beware that some browsers might add .txt). Figure 11: ESP32-C6-MINI-1 Recommended PCB Land Pattern Espressif Systems 41 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

Figure 12: ESP32-C6-MINI-1U Recommended PCB Land Pattern

11.2 Module Placement for PCB Design

If module-on-board design is adopted, attention should be paid while positioning the module on the base board. The interference of the base board on the module’s antenna performance should be minimized. For details about module placement for PCB design, please refer toESP32-C6 Hardware Design Guidelines> Section Positioning a Module on a Base Board. Espressif Systems 42 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

12 Product Handling

12.1 Storage Conditions

The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric environment of < 40 °C and 90%RH. The module is rated at the moisture sensitivity level (MSL) of 3. After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and 60%RH. If the above conditions are not met, the module needs to be baked.

12.2 Electrostatic Discharge (ESD)

  • Human body model (HBM): ±2000 V
  • Charged-device model (CDM): ±500 V

12.3 Reflow Profile

Solder the module in a single reflow. 50 1000 150 200 250 200 100 150 250 Time (s) 217 Preheating 150 – 200 °C 60 – 120 s Ramp-up 25 – 150 °C 60 – 90 s 1 – 3 °C/s Soldering > 217 °C 60 – 90 s Peak temperature: 235 – 250 °C Peak time: 30 – 70 s Soldering time: > 30 s Solder: Sn-Ag-Cu (SAC/three.case/zero.case/five.case) lead-free solder T emperature (°C) 180 230 Cooling < 180 °C –5 ~ –1 °C/s Figure 13: Reflow Profile Espressif Systems 43 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

12.4 Ultrasonic Vibration

Avoid exposing Espressif modules to vibration from ultrasonic equipment, such as ultrasonic welders or ultrasonic cleaners. This vibration may induce resonance in the in-module crystal and lead to its malfunction or even failure. As a consequence,the module may stop working or its performance may deteriorate. Espressif Systems 44 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

Related Documentation and Resources Related Documentation and Resources Related Documentation

  • ESP32-C6 Series Datasheet – Specifications of the ESP32-C6 hardware.
  • ESP32-C6 TechnicalReferenceManual – Detailed information on how to use the ESP32-C6 memory and periph- erals.
  • ESP32-C6 Hardware Design Guidelines – Guidelines on how to integrate the ESP32-C6 into your hardware prod- uct.
  • Certificates https:/ /espressif.com/en/support/documents/certificates
  • ESP32-C6 Product/Process Change Notifications (PCN) https:/ /espressif.com/en/support/documents/pcns?keys=ESP32-C6
  • Documentation Updates and Update Notification Subscription https:/ /espressif.com/en/support/download/documents Developer Zone
  • ESP-IDF Programming Guide for ESP32-C6 – Extensive documentation for the ESP-IDF development framework.
  • ESP-IDF and other development frameworks on GitHub. https:/ /github.com/espressif
  • ESP32 BBS Forum– Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions, share knowledge, explore ideas, and help solve problems with fellow engineers. https:/ /esp32.com/
  • The ESP Journal– Best Practices, Articles, and Notes from Espressif folks. https:/ /blog.espressif.com/
  • See the tabsSDKs and Demos, Apps, Tools, AT Firmware. https:/ /espressif.com/en/support/download/sdks-demos Products
  • ESP32-C6 Series SoCs– Browse through all ESP32-C6 SoCs. https:/ /espressif.com/en/products/socs?id=ESP32-C6
  • ESP32-C6 Series Modules– Browse through all ESP32-C6-based modules. https:/ /espressif.com/en/products/modules?id=ESP32-C6
  • ESP32-C6 Series DevKits– Browse through all ESP32-C6-based devkits. https:/ /espressif.com/en/products/devkits?id=ESP32-C6
  • ESP Product Selector– Find an Espressif hardware product suitable for your needs by comparing or applying filters. https:/ /products.espressif.com/#/product-selector?language=en Contact Us
  • See the tabsSales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples (Online stores),Become Our Supplier, Comments & Suggestions. https:/ /espressif.com/en/contact-us/sales-questions Espressif Systems 45 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

Revision History

Date Version Release notes 2025-03-21 v1.3

  • In Chapter1 Module Overview, renamed Section 1.2Description to 1.2 Series Comparison
  • Improved the structure, formatting, and wording in: – Chapter 4 Boot Configurations(used to be Section 3.3Strapping Pins) – Chapter 5 Peripherals (used to be Chapter 4Peripherals) – Chapter 10 Physical Dimensionsand Chapter11 PCB Layout Recom- mendations (used to be Chapter 9Physical Dimensions and PCB Land Pattern)
  • In Section7 .1Wi-Fi Radio, updated data in T able20 TX Power with Spectral Mask and EVM Meeting 802.11 Standardsand T able22 RX Sensitivity
  • Added Section11.2 Module Placement for PCB Design 2024-08-20 v1.2
  • In Section1.1Featuresand 1.2 Series Comparison, updated flash size from

4 MB to up to 8 MB flash

  • In Section1.2 Series Comparison, added information about ESP32-C6- MINI-1-H8 and ESP32-C6-MINI-1U-H8, and added a table note about the maximum clock frequency supported by SPI flash
  • In Section 1.1 Features, 1.2 Series Comparison, and 5.1 Peripheral Overview, added information about ESP32-C6FH8 2024-01-19 v1.1
  • In Section1.1Features, added information about certification and test
  • In Section6.4.1 Current Consumption in Active Mode, updated the mini- mum RF transmit power for Bluetooth LE and 802.15.4 in active mode from -24 dBm to -16 dBm, and updated the maximum power from 20 dBm to 19 dBm
  • In Chapter7 RF Characteristics, updated the RF transmit power range for Bluetooth LE and 802.15.4 from -24~ 20 dBm to -16~ 19 dBm
  • In Section11 PCB Layout Recommendations, added information about the recommended PCB land pattern of ESP32-C6-MINI-1U module, and 3D models of ESP32-C6-MINI-1 and ESP32-C6-MINI-1U modules 2023-06-27 v1.0
  • Added Chapter5 Peripherals and removed peripheral-related information from 1.2 Series Comparison
  • Updated T able8 ESP32-C6-MINI-1 Physical Dimensionsand T able9 ESP32-C6-MINI-1U Physical Dimensionsto change the tolerance in the top view from 0.25 to 0.2 2023-04-17 v0.6 Added information about ESP32-C6-MINI-1U module 2023-02-16 v0.5 Preliminary release Espressif Systems 46 Submit Documentation Feedback ESP32-C6-MINI-1 & MINI-1U Datasheet v1.3

Disclaimer and Copyright Notice Information in this document, including URL references, is subject to change without notice. ALL THIRD PARTY’S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES TO ITS AUTHENTICITY AND ACCURACY . NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY , NON-INFRINGEMENT , FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a registered trademark of Bluetooth SIG. All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners, and are hereby acknowledged. Copyright © 2025 Espressif Systems (Shanghai) Co., Ltd. All rights reserved. www.espressif.com