DSZ412SE DYNEX | Alldatasheet
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www.dynexsemi.com KEY PARAMETERS VRRM 4400V IF(AV) 219A IFSM 1500A
FEATURES
APPLICATIONS
ORDERING INFORMATION
Order as: DSZ412SE44 Note: Please use the complete part number when ordering and quote this number in any future correspondance relating to your order. DSZ412SE Avalanche Diode Replaces July 2000 version, DS5107-3.3 DS5107-4.0 October 2001 4400DSZ412SE44 Conditions VRSM = VRRM + 100V Lower voltage grades available Type Number Repetitive Peak Reverse Voltage VRRM V Fig. 1 Package outline Outline type code: E (See Package Details for further information)
www.dynexsemi.com IF(AV) IF(RMS) IF RMS value Continuous (direct) forward current Half wave resistive load, THeatsink = 55oC THeatsink = 55oC THeatsink = 55oC 230 360 345 A A A Double Side Cooled IF RMS value Continuous (direct) forward current Half wave resistive load, THeatsink = 55oC THeatsink = 55oC THeatsink = 55oC 140 220 195 A A A IF(RMS) IF(AV) Mean forward current UnitsMax.ConditionsParameterSymbol Mean forward current CURRENT RATINGS THeatsink = 55oC unless otherwise stated Single Side Cooled (Anode side) CURRENT RATINGS Tcase = 75oC unless otherwise stated Symbol Parameter Conditions Double Side Cooled IF(AV) Mean forward current IF(RMS) RMS value IF Continuous (direct) forward current Single Side Cooled (Anode side) IF(AV) Mean forward current IF(RMS) RMS value IF Continuous (direct) forward current UnitsMax. Half wave resistive load 219 A - 344 A - 333 A Half wave resistive load 132 A - 207 A - 181 A
www.dynexsemi.com 1990 A 1500 SURGE RATINGS Symbol Parameter Repetitive peak forward currentIFRM IFSM Surge (non-repetitive) forward current Conditions
11250 A2s
Max. Units A2s A oC/W0.115dc - THERMAL RATINGS AND MECHANICAL DATA Conditions Min. Max. Units oC/W- 0.129 ParameterSymbol Half-waveThermal resistance - junction to heatsinkR th(j-h) oC/W- 0.1503 phase Half sine φ = 30˚; THeatsink = 55oC 10ms; Tj = 150oC 3ms; Tj = 150oC 10PRSM Non-repetitive peak avalanche power kW I2tI 2t for fusing With 50% VRRM , Tj =150˚C 10µs avalanche, Tj = 150˚C Double side cooled Clamping force 3.0kN with mounting compound oC/W0.270dc - oC/W- 0.284Half-waveThermal resistance - junction to heatsinkR th(j-h) oC/W- 0.3053 phase Single side cooled Clamping force 3.0kN with mounting compound oC165 150 oC Tvj Virtual junction temperature Tstg Storage temperature range oC150–55 Reverse (blocking) Forward (conducting) f Frequency Hz40010 - Clamping force kN3.82.5
www.dynexsemi.com CURVES Fig.2 Maximum (limit) forward characteristics V2.1 mA Forward voltage 20At VRRM , Tcase = 150oC At 300A peak, Tcase = 25oC -VFM Symbol Parameter Conditions Min. Max. Units mA10*1* CHARACTERISTICS IRM Peak reverse current At 50 % VRRM , Tcase = 150oC Threshold voltage Slope resistance At Tvj = 150˚C At Tvj =150˚CrT VTO m Ω3.75- V1.12- *This selection for series sharing only upon request.
www.dynexsemi.com Fig.3 Dissipation curves - double side cooled Fig.4 Dissipation curves - single side cooled
www.dynexsemi.com Fig.6 Stored charge Fig.5 Surge (non-repetitive) forward current vs time (with 50% VRRM , Tcase = 150˚C)
www.dynexsemi.com Fig.7 Maximum (limit) transient thermal impedance
www.dynexsemi.com 2 holes Ø 3.6 ± 0.1 x 2.0 ± 0.1 deep (One in each electrode) Cathode Anode Ø 25nom. Ø 42max Ø 25nom. Nominal weight: 65g Package outline type code: E PACKAGE DETAILS For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE. Note: 1. Package maybe supplied with pins and/or tags.
www.dynexsemi.com POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution (PACs). DEVICE CLAMPS Disc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of pre-loaded clamps to suit all of our manufactured devices. This include cube clamps for single side cooling of ‘T’ 22mm Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies. Please refer to our application note on device clamping, AN4839 HEATSINKS Power Assembly has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or Customer Services. CUSTOMER SERVICE CENTRES Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: (613) 723-7035. Fax: (613) 723-1518. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. © Dynex Semiconductor 2001 Publication No. DS5107-4 Issue No. 4.0 October 2001 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC.
99 Bank Street, Suite 410,
Ottawa, Ontario, Canada, K1P 6B9 Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:- Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification.