DRD5940H55

DRD5940H55 DYNEX | Alldatasheet

Document overview

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Technical content

DS6058 – 1 April 2011 (LN28298) www.dynexsemi.com

FEATURES

 Double Side Cooling  High Surge Capability VOLTAGE RATINGS Part and Ordering Number Repetitive Peak Voltages VRRM V Conditions DRD5940H55 DRD5940H52 DRD5940H50 DRD5940H48 DRD5940H46 5500 5200 5000 4800 4600 VRSM = VRRM+100V

ORDERING INFORMATION

When ordering, select the required part number shown in the Voltage Ratings selection table. For example: DRD5940H55 for a 5500V device KEY PARAMETERS VRRM 5500V IF(AV) 5940A IFSM 93600A Outline type code: H (See Package Details for further information) Fig. 1 Package outline

www.dynexsemi.com CURRENT RATINGS Tcase = 75°C unless stated otherwise Symbol Parameter Test Conditions Max. Units Double Side Cooled IF(AV) Mean forward current Half wave resistive load 7640 A IF(RMS) RMS value - 11990 A IF Continuous (direct) on-state current - 10800 A Tcase = 100°C unless stated otherwise Symbol Parameter Test Conditions Max. Units Double Side Cooled IF(AV) Mean forward current Half wave resistive load 5940 A IF(RMS) RMS value - 9330 A IF Continuous (direct) on-state current - 8400 A SURGE RATINGS Symbol Parameter Test Conditions Max. Units IFSM Surge (non-repetitive) on-state current 10ms half sine, Tcase = 150°C 93.6 kA I2t I2t for fusing VR = 0 43.81 MA2s

• 3 - DRD5940H55 www.dynexsemi.com THERMAL AND MECHANICAL RATINGS Symbol Parameter Test Conditions Min. Max. Units Rth(j-c) Thermal resistance – junction to case Double side cooled DC - 0.004 °C/W Rth(c-h) Thermal resistance – case to heatsink Double side cooled DC - 0.0008 °C/W Tvj Virtual junction temperature Blocking VDRM / VRRM -40 150 °C Tstg Storage temperature range -40 160 °C Fm Clamping force 110 130 kN CHARACTERISTICS Symbol Parameter Test Conditions Min. Max. Units VFM Forward voltage At 6000A peak, Tcase = 150°C - 1.26 V IRM Peak reverse current At VDRM, Tcase = 150°C - 600 mA QS Total stored charge IF = 4000A, dIRR/dt =10A/µs - 9000 µC Tcase = 150°C, VR =100V VTO Threshold voltage At Tvj = 150°C - 0.80 V rT Slope resistance At Tvj = 150°C - 0.076 m

www.dynexsemi.com CURVES Fig.2 Maximum forward characteristics Fig.3 Dissipation curves Fig.4 Surge (Non-Repetitive) Forward current vs time Fig.5 Maximum (limit) transient thermal impedance- junction to case 1000 2000 3000 4000 5000 6000 7000 8000 9000 10000 0.8 1 1.2 1.4 1.6 Instantaneous forward current, IF - (A) Instantaneous forward voltage,VF - (V) Tj=150°C 4000 8000 12000 16000 20000 0 1000 2000 3000 4000 5000 6000 Mean power dissipation - (W) Mean on-state current, IT(AV) - (A) 1/2 wave 3 phase 6 phase 10.0 30.0 50.0 70.0 90.0 110.0 130.0 1 10 100 Surge current, ITSM - (KA) Number of cycles Conditons: Tcase=160°C VR=0 Pulse width = 10ms 0.001 0.002 0.003 0.004 0.005 0.001 0.01 0.1 1 10 100 Thermal Impedance Zth(j-c) (°C/W) Time ( s ) Double side cooled

• 5 - DRD5940H55 www.dynexsemi.com PACKAGE DETAILS For further package information, please contact Customer Services. All dimensions in mm, unless stated otherwise. DO NOT SCALE. Package outline type code: H Note: Some packages may be supplied with gate and or tags.

www.dynexsemi.com IMPORTANT INFORMATION: This publication is provided for information only and not for resale. The products and information in this publication are intended for use by appropriately trained technical personnel. Due to the diversity of product applications, the information contained herein is provided as a general guide only and does not constitute any guarantee of suitability for use in a specific application.The user must evaluate the suitability of the product and the completeness of the product data for the application. The user is responsible for product selection and ensuring all safety and any warning r equirements are met. Should additional product information be needed please contact Customer Service. Although we have endeavoured to carefully compile the information in this publication it may contain inaccuracies or typograp hical errors. The information is provided without any warranty or guarantee of any kind. This publication is an uncontrolled document and is subject to change without notice. When referring to it please ensure that it is the most up to date version and has not been superseded. The products are not intended for use in applications where a failure or malfunction may cause loss of life, injury or damage to property. The user must ensure that appropriate safety precautions are taken to prevent or mitigate the consequences of a product failu re or malfunction. The products must not be touched when operating because there is a danger of electrocution or severe burning. Always use protective safety equipment such as appropriate shields for the product and wear safety glasses. Even when disconnec ted any electric charge remaining in the product must be discharged and allowed to cool before safe handling using protective gloves. Extended exposure to conditions outside the product ratings may affect reliability leading to premature product failure. Use outside the product ratings is likely to cause permanent damage to the product. In extreme conditions, as with all semiconductors, this m ay include potentially hazardous rupture, a large current to flow or high voltage arcing, resulting in fire or expl osion. Appropriate application design and safety precautions should always be followed to protect persons and property. Product Status & Product Ordering: We annotate datasheets in the top right hand corner of the front page, to indicate product status if it is not yet fully approved for production. The annotations are as follows:- Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product design is complete and final characterisation for volume production is in progress.The datasheet represents the product as it is now understood but details may change. No Annotation: The product has been approved for prod uction and unless otherwise notified by Dynex any product ordered will be supplied to the current version of the data sheet prevailing at the time of our order acknowledgement. All products and materials are sold and services provided subject to Dynex’s conditions of sale, which are available on request. Any brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LIMITED Doddington Road, Lincoln, Lincolnshire, LN6 3LF United Kingdom. Phone: +44 (0) 1522 500500 Fax: +44 (0) 1522 500550 Web: http://www.dynexsemi.com CUSTOMER SERVICE Phone: +44 (0) 1522 502753 / 502901 Fax: +44 (0) 1522 500020 e-mail: power_solutions@dynexsemi.com  Dynex Semiconductor Ltd. Technical Documentation – Not for resale.