XC9290 TOREX | Alldatasheet

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HiSAT-COT ® Control Extremely Small 600mA Step-Down DC/DC Converters ■FEATURES Input Voltage Range : 2.5V ~ 6.0V Output Voltage Range : 0.7V ~ 3.6V (±2.0%) Output Current : 600mA Quiescent Current : 11μA Oscillation Frequency : 4MHz, 6MHz Efficiency (fOSC=4MHz) : 90.0% (VIN=3.7V,VOUT=1.8V,IOUT=200mA) Control Methods : HiSAT-COT Control PWM Control (XC9290) PWM/PFM Auto (XC9291) Protection Functions : Current Limit Functions : Soft-Start, UVLO CL Discharge (Type B) Input / Output Capacitor : Ceramic Capacitor Operating Ambient Temperature : -40℃ ~ 105℃ Package : LGA-6B01 (1.2 x 1.2 x 0.3mm) WLP-5-08 (0.88 x 0.96 x 0.33mm) Environmentally : EU RoHS Compliant, Pb Free ■GENERAL DESCRIPTION The XC9290/XC9291 series are 600 mA synchronous rectification DC/DC converters adopting HiSAT-COT (*) control. Due to capacitor can be used for the input capacitance (CIN) and the output capacitance (CL), realizing that the mounting area including peripheral components can be reduced to 3.15 mm2. Due to increasing the oscillation frequency to a high frequency, the mounting area is reduced. Additionally, an efficiency equal to or higher than that of conventional products can realize by improving on-resistance and current consumption. Because of these features, XC9290/ XC9291 series are ideal for equipment requiring miniaturization and low-profile mounting area, and battery-powered equipment such as mobile equipment. Moreover, the high-speed transient response technology of the HiSAT-COT control makes it possible to minimize the fluctuation of the output voltage for a load transient condition. This feature is optimal for applications requiring a fast response and output voltage stability for an instantaneous load fluctuation like FPGA. (*) HiSAT-COT is a proprietary high-speed transient response technology for DC/DC converter which was developed by Torex. It is Ideal for the LSI's that require high precision and high stability power supply voltage. ■APPLICATIONS

  • Smart phones / Mobile phones
  • Wireless earphone / Headset
  • Wearable devices
  • DSC / Camcorder
  • Portable game consoles
  • Smartcard
  • Power supply for module
  • Various small power sources ■TYPICAL APPLICATION CIRCUIT ETR05089-001d ☆Green Operation Compatible ■TYPICAL PERFORMANCE CHARACTERISTICS ■PCB IMAGE XC9290B18D / XC9291B18D (VOUT=1.8V, fOSC=4MHz) L = 1.0μH (DFE18SAN1R0MG0L), CIN = CL = 4.7μF (GRM035R60J475ME15) VIN 2.5 ~ 6.0V CIN : 4.7uF (0.6x0.3x0.5 mm) VIN LX GND VOUT L : 0.47uH (0.8x0.45x0.65mm) ENEN XC9290/XC9291 CL : 4.7uF (0.6x0.3x0.5 mm) VOUT 1.8V / 600mA

■BLOCK DIAGRAM 1) Type A Vref with Soft Start S R Q On Time Generator VIN VOUT Synch. Buffer Driver Logic Current Limit EN Control Logic, UVLO Phase Compensation Error Amp. Comparator CFB VOUT GND Lx VIN EN PWM/PFM Selector (*) "PWM/PFM Selector" in the XC9290 series is fixed to PWM control. "PWM/PFM Selector" In the XC9291 series is fixed to PWM/PFM automatic switching control. Diodes inside the circuit are an ESD protection diode and a parasitic diode. 2) Type B (*) "PWM/PFM Selector" in the XC9290 series is fixed to PWM control. "PWM/PFM Selector" In the XC9291 series is fixed to PWM/PFM automatic switching control. Diodes inside the circuit are an ESD protection diode and a parasitic diode. Vref with Soft Start S R Q On Time Generator VIN VOUT Synch. Buffer Driver Logic Current Limit EN Control Logic, UVLO CL Auto-Discharge Phase Compensation Error Amp. Comparator CFB GND Lx VIN EN PWM/PFM Selector VOUT

■PRODUCT CLASSIFICATION

  • Ordering Information XC9290①②③④⑤⑥-⑦ : PWM Control XC9291①②③④⑤⑥-⑦ : PWM/PFM Automatic switching control DESIGNATOR ITEM SYMBOL DESCRIPTION ① Type A Refer to Selection Guide B ②③ Output Voltage 07 ~ 36 Output voltage 1.25V → ②=1, ③=C 0.05V increments : 0.05=A, 0.15=B, 0.25=C, ④ Oscillation Frequency D 4.0MHz E 6.0MHz ⑤⑥-⑦(*1) Packages (Order Unit) 1R-G LGA-6B01 (5,000pcs/Reel) 0R-G WLP-5-08 (5,000pcs/Reel) (*1) The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.
  • Selection Guide FUNCTION A TYPE B TYPE Enable Yes UVLO Yes Soft-Start Time Fixed CL Discharge No Yes Current Limit (Automatic Recovery) Yes

■PIN CONFIGURATION WLP-5-08 (BOTTOM VIEW) LGA-6B01 (BOTTOM VIEW) VIN LX VOUT NC EN EN VOUT VIN LX GND GND ■PIN ASSIGNMENT PIN NUMBER PIN NAME FUNCTIONS LGA-6B01 WLP-5-08 1 4 VOUT Output Voltage Monitor 2 - NC No Connection 3 1 EN Enable 4 2 VIN Power Input 5 5 Lx Switching 6 3 GND Ground ■FUNCTION PIN NAME SIGNAL STATUS EN L Stand-by H Active OPEN Undefined State (*1) (*1) Please do not leave the EN pin open.

■ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL RATINGS UNITS VIN Pin Voltage VIN -0.3 ~ 7.0 V Lx Pin Voltage VLx -0.3 ~ VIN + 0.3 or 7.0 (*1) V VOUT Pin Voltage VOUT -0.3 ~ VIN + 0.3 or 4.0 (*2) V EN Pin Voltage VEN -0.3 ~ 7.0 V Power Dissipation (Ta=25℃) LGA-6B01 Pd 760 (JESD51-7 board) (*3) mW WLP-5-08 500 (JESD51-7 board) (*3) Operating Ambient Temperature Topr -40 ~ 105 ℃ Storage Temperature Tstg -55 ~ 125 ℃ * All voltages are described based on the GND pin. (*1) The maximum value should be either VIN+0.3V or 7.0V in the lowest. (*2) The maximum value should be either VIN+0.3V or 4.0V in the lowest. (*3) The power dissipation figure shown is PCB mounted and is for reference only. Please refer to PACKAGING INFORMATION for the mounting condition. ■RECOMMENDED OPERATING CONDITIONS PARAMETER SYMBOL MIN. TYP. MAX. UNITS Input Voltage VIN 2.5 - 6.0 V EN Pin Voltage VEN 0.0 - 6.0 V Operating Ambient Temperature Topr -40 - 105 ℃ Input Capacitor (Effective Value) CIN 0.63 - 1000 (*2) μF Output Capacitor (Effective Value) VOUT(T)<1.0V CL 4.13 - 100 (*3) μF 1.0V≦VOUT(T)<1.2V 3.76 1.2V≦VOUT(T)<1.5V 3.29 1.5V≦VOUT(T)<1.9V 2.82 1.9V≦VOUT(T)<2.4V 2.35 2.4V≦VOUT(T)<3.2V 1.88 3.2V≦VOUT(T) 1.41 Inductor fOSC = 4.0MHz VOUT(T)≦1.8V L * All voltages are described based on the GND pin. (*1) Some ceramic capacitors have an effective capacitance that is significantly lower than the nominal value due to the applied DC bias and ambient temperature. For the input / output capacitance of this IC, use an appropriate ceramic capacitor according to the DC bias usage conditions (ambient temperature, input / output voltage) so that the effective capacitance value is equal to or higher than the recommended component. (*2) If using a large-capacity capacitor such as an electrolytic capacitor or tantalum capacitor as the input capacitance, place a low ESR ceramic capacitor in parallel. If a ceramic capacitor is not placed, high-frequency voltage fluctuations will increase and the IC may malfunction. (*3) If using a large-capacity capacitor as the output capacitance, output stability may decrease and ripple voltage may increase. Even within the recommended capacitance range, output stability may be reduced depending on the type of capacitor such as ESR etc. used, so please verify this fully on the actual equipment before using.

■ELECTRICAL CHARACTERISTICS PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS CIRCUIT Output Voltage (*1) VOUT VIN= VOUT(T)+2.0V VOUT=VOUT(T)×1.2→VOUT(T)×0.8 VOUT Voltage when Lx pin voltage changes from "L" level to "H" level Operating Voltage Range VIN 2.5 - 6.0 V ② Maximum Output Current IOUTMAX When connected to external components, VIN= VOUT(T)+2.0V 600 - - mA ② UVLO Detect Voltage VUVLOD VIN=2.5V to 1.6V, VOUT=0V, VEN=VIN VIN voltage when Lx pin changes from "H" to "L" level 1.7 2.0 - V ① UVLO Release Voltage VUVLOR VIN=1.6V to 2.5V, VOUT=0V, VEN=VIN VIN voltage when Lx pin changes from "L" to "H" level - 2.14 2.3 V ① Quiescent Current (XC9290) Iq VOUT=4.0V - 700 1560 μA ③ Quiescent Current (XC9291) Iq VOUT=4.0V - 11.0 24.0 μA ③ Stand-by Current ISTB VIN=6.0V, VEN=0V, VOUT=0V, VLx=0V - 0.0 0.6 μA ④ ON time tON When connected to external components, VIN= VOUT(T)+2.0V, IOUT=1mA - <E-5> - ns ② Lx SW”H”ON Resistance RLXH VIN=3.6V, VOUT=0V, ILX=100mA WLP-5-08 - 0.32 - Ω ⑥ LGA-6B01 0.50 Lx SW”L”ON Resistance RLXL VIN=3.6V, VOUT=3.9V, ILX=100mA WLP-5-08 - 0.26 - Ω ⑤ LGA-6B01 0.35 Lx SW ”H” Leakage Current ILeakH VIN=6.0V, VEN=0V, VOUT=0V, VLX=6.0V - 0.0 1.0 μA ④ Lx SW ”L” Leakage Current ILeakL VIN=6.0V, VEN=0V, VOUT=0V, VLX=0V - 0.0 0.3 μA ④ Current Limit ILIMH VIN=3.6V, VOUT=0V, ILx until Lx pin oscillates 770 (*2) 1000 1500 (*2) mA ⑥ Output Voltage Temperature Characteristics ΔVOUT/ (VOUT・ ΔTopr) VIN= VOUT(T)+2.0V VOUT=VOUT(T)×1.2→VOUT(T)×0.8 VOUT Voltage when Lx pin voltage changes from "L" level to "H" level, -40℃≦Topr≦105℃ - ±100 - ppm/ ℃ ① EN ”H” Voltage VENH VIN=6.0V, VOUT=0V, VEN Voltage which Lx pin holding “H” level 25℃ 1.2 - 6.0 V ① -40℃ ≦Topr≦105℃ (*2) EN ”L” Voltage VENL VIN=6.0V, VOUT=0V, VEN Voltage which Lx pin holding “L” level 25℃ GND - 0.3 V ① -40℃ ≦Topr≦105℃ (*2) EN ”L” Current IENL VIN=6.0V, VEN=0V, VOUT=0V -0.1 0.0 0.1 μA ④ Soft-Start Time tSS VIN=3.6V, VEN=0V→3.6V, VOUT=VOUT(T)×0.9 After "H" is fed to EN, the time by when clocks are generated at Lx pin. 54 130 240 μs ① CL Discharge Resistance (B Type) RDCHG VEN=0V, VOUT=1.0V 150 180 210 Ω ⑦ Unless otherwise stated : VIN=5V, VEN=5V, VOUT(T)=Nominal Value, "H" level = VIN - 1.2V ~ VIN, "L" level = -0.1V ~ 0.1V NOTE: (*1) For PWM control. (*2) Design value for WLP-5-08 (*3) Design value Ta=25℃

■ELECTRICAL CHARACTERISTICS (Continued) SPEC Table NOMINAL OUTPUT VOLTAGE VOUT tON fosc=4.0MHz fosc=6.0MHz UNITS V V V ns ns 0.70 0.686 0.700 0.714 65 43 0.75 0.735 0.750 0.765 68 45 0.80 0.784 0.800 0.816 71 48 0.85 0.833 0.850 0.867 75 50 0.90 0.882 0.900 0.918 78 52 0.95 0.931 0.950 0.969 81 54 1.00 0.980 1.000 1.020 83 56 1.05 1.029 1.050 1.071 86 57 1.10 1.078 1.100 1.122 89 59 1.15 1.127 1.150 1.173 91 61 1.20 1.176 1.200 1.224 94 63 1.25 1.225 1.250 1.275 96 64 1.30 1.274 1.300 1.326 98 66 1.35 1.323 1.350 1.377 101 67 1.40 1.372 1.400 1.428 103 69 1.45 1.421 1.450 1.479 105 70 1.50 1.470 1.500 1.530 107 71 1.55 1.519 1.550 1.581 109 73 1.60 1.568 1.600 1.632 111 74 1.65 1.617 1.650 1.683 113 75 1.70 1.666 1.700 1.734 115 77 1.75 1.715 1.750 1.785 117 78 1.80 1.764 1.800 1.836 118 79 1.85 1.813 1.850 1.887 120 80 1.90 1.862 1.900 1.938 122 81 1.95 1.911 1.950 1.989 123 82 2.00 1.960 2.000 2.040 125 83 2.05 2.009 2.050 2.091 127 84 2.10 2.058 2.100 2.142 128 85 2.15 2.107 2.150 2.193 130 86 2.20 2.156 2.200 2.244 131 87 2.25 2.205 2.250 2.295 132 88 2.30 2.254 2.300 2.346 134 89 2.35 2.303 2.350 2.397 135 90 2.40 2.352 2.400 2.448 136 91 2.45 2.401 2.450 2.499 138 92 2.50 2.450 2.500 2.550 139 93 2.55 2.499 2.550 2.601 140 93 2.60 2.548 2.600 2.652 141 94

■ELECTRICAL CHARACTERISTICS (Continued) SPEC Table NOMINAL OUTPUT VOLTAGE VOUT tON fosc=4.0MHz fosc=6.0MHz UNITS V V V ns ns 2.65 2.597 2.650 2.703 142 95 2.70 2.646 2.700 2.754 144 96 2.75 2.695 2.750 2.805 145 96 2.80 2.744 2.800 2.856 146 97 2.85 2.793 2.850 2.907 147 98 2.90 2.842 2.900 2.958 148 99 2.95 2.891 2.950 3.009 149 99 3.00 2.940 3.000 3.060 150 100 3.05 2.989 3.050 3.111 151 101 3.10 3.038 3.100 3.162 152 101 3.15 3.087 3.150 3.213 153 102 3.20 3.136 3.200 3.264 154 103 3.25 3.185 3.250 3.315 155 103 3.30 3.234 3.300 3.366 156 104 3.35 3.283 3.350 3.417 157 104 3.40 3.332 3.400 3.468 157 105 3.45 3.381 3.450 3.519 158 106 3.50 3.430 3.500 3.570 159 106 3.55 3.479 3.550 3.621 160 107 3.60 3.528 3.600 3.672 161 107

< Circuit No.① > < Circuit No.② > < Circuit No.③ > < Circuit No.④ > < Circuit No.⑥ >< Circuit No.⑤ > < Circuit No.⑦ > B TYPE 4.7μF VIN LX EN VOUT GND Wave Form Measure Point 1μF Rpulldown 100ΩV V V RL CL L CIN Wave Form Measure Point VIN LX EN VOUT GND fosc=4M Hz L : 1.0μH CIN : 4.7μF(cera mic) CL : 4.7μF(cera mic) V A V Rpulldown 100Ω VIN LX EN VOUT GND IEN H 2.2μF A A VIN LX EN VOUT GNDIEN L ILeak H ILeak L A A A VIN LX EN VOUT GND ILx2.2μF A V V ILIM H 1μF Wave Form Measure Point VIN LX EN VOUT GND 2.2μF VIN LX EN VOUT GND 2.2μF A V fosc=6M Hz L : 0.47μH CIN : 4.7μF(cera mic) CL : 4.7μF(cera mic) ■TEST CIRCUITS

■TYPICAL APPLICATION CIRCUIT VIN CIN VIN LX GND VOUT CL L VOUT ENEN 【Typical Examples】 f osc=4.0MHz Condition : VOUT(T) ≦ 1.8V MANUFACTURER PRODUCT NUMBER VALUE SIZE(L×W×T) L TAIYO YUDEN LSCNB1005EET1R0MB 1.0μH 1.0×0.5×0.55(mm) LSCNB1005EETR47MB 0.47μH 1.0×0.5×0.55(mm) TDK TFM160808ALC-1R0MTAA 1.0μH 1.6×0.8×0.8(mm) murata DFE18SAN1R0MG0L 1.0μH 1.6×0.8×1.0(mm) DFE18SANR47MG0L 0.47μH 1.6×0.8×1.0(mm) DFE201210U-2R2M 2.2μH 2.0×1.2×1.0(mm) Condition : 1.8V < VOUT(T) MANUFACTURER PRODUCT NUMBER VALUE SIZE(L×W×T) L TAIYO YUDEN LSCNB1005EET1R0MB 1.0μH 1.0×0.5×0.55(mm) TDK TFM160808ALC-1R0MTAA 1.0μH 1.6×0.8×0.8(mm) murata DFE18SAN1R0MG0L 1.0μH 1.6×0.8×1.0(mm) DFE201210U-2R2M 2.2μH 2.0×1.2×1.0(mm) 【Typical Examples】 f osc=6.0MHz MANUFACTURER PRODUCT NUMBER VALUE SIZE(L×W×T) L TAIYO YUDEN LSCNB1005EETR47MB 0.47μH 1.0×0.5×0.55(mm) LSCNB1005EET1R0MB 1.0μH 1.0×0.5×0.55(mm) murata DFE18SANR47MG0L 0.47μH 1.6×0.8×1.0(mm) DFE18SAN1R0MG0L 1.0μH 1.6×0.8×1.0(mm)

■TYPICAL APPLICATION CIRCUIT 【Typical Examples】(*1) MANUFACTURER PRODUCT NUMBER VALUE SIZE(L×W×T) CIN(*2) TAIYO YUDEN MSASL105SB5225KFNA01 2.2μF/10V 1.0×0.5×0.5(mm) CL (*1) Some ceramic capacitors have an effective capacitance that is significantly lower than the nominal value due to the applied DC bias and ambient temperature. For the input / output capacitance of this IC, use an appropriate ceramic capacitor according to the DC bias usage conditions (ambient temperature, input / output voltage) so that the effective capacitance value is equal to or higher than the recommended component. (*2) If using a large-capacity capacitor such as an electrolytic capacitor or tantalum capacitor as the input capacitance, place a low ESR ceramic capacitor in parallel. If a ceramic capacitor is not placed, high-frequency voltage fluctuations will increase and the IC may malfunction. (*3) If using a large-capacity capacitor as the output capacitance, output stability may decrease and ripple voltage may increase. Even within the recommended capacitance range, output stability may be reduced depending on the type of capacitor such as ESR etc. used, so please verify this fully on the actual equipment before using.

■OPERATIONAL EXPLANATION This IC consists of a reference voltage source, error amplifier, comparator, phase compensation, on time generation circuit, current limiter circuit, UVLO circuit and so on. Vref with Soft Start S R Q On Time Generator VIN VOUT Synch. Buffer Driver Logic Current Limit EN Control Logic, UVLO CL Auto-Discharge Phase Compensation Error Amp. Comparator CFB GND Lx VIN EN PWM/PFM Selector VOUT BLOCK DIAGRAM (Type B) The control method is HiSAT-COT (High Speed circuit Architecture for Transient with Constant On Time), which features the On time control method and the fast transient response with low ripple voltage.

■OPERATIONAL EXPLANATION (Continued) ＜Nomal operation＞ In HiSAT-COT control, ON time (tON) dependent on input voltage and output voltage is generated and Pch driver FET. Is turned on. The on-time is set as follows during light loads. 4MHz : t ON = (VOUT / VIN) x 250ns 6MHz : t ON = (VOUT / VIN) x 167ns The on-time also depends on the output current. The above setting values may not be achieved under heavy loads. The off time (t OFF) is controlled by comparing the output voltage and the reference voltage with the error amplifier and the comparator. Specifically, the reference voltage and a voltage which is obtained by dividing the output voltage with R1 and R2 are compared with using the error amplifier, apply phase compensation to the output of the error amplifier, and send it to the comparator. In the comparator, the output of the error amplifier is compared with the reference voltage, and when it falls below the reference voltage, the SR latch is set and it becomes the ON period again. XC9290 series The XC9290 series (PWM control) operates in continuous conduction mode and operates at a stable oscillation frequency regardless of the load. The oscillation frequency can be obtained by the following equation. fOSC = (VOUT / VIN) x (1 / tON) XC9291 series The XC9291 series ( PWM/PFM automatic switching control) lowers the oscillation frequency at light load by operating in discontinuous conduction mode at light load. As the output current increases, the switching frequency increases proportionally. By t his operation, it is possible to reduce switching loss at light load and achieve high efficiency from light load to heavy load. XC9290 series : Example of light load operation XC9290 series : Example of heavy load operation XC9291 series : Example of light load operation XC9291 series : Example of heavy load operation 0mA Lx tON fOSC Coil Current IOUT 0mA Lx tON fOSC Coil Current IOUT tON 0mA IOUT Lx Coil Current 0mA Lx tON fOSC Coil Current IOUT

■OPERATIONAL EXPLANATION (Continued) ＜100% Duty cycle mode＞ In conditions where the input-output voltage difference is small or transient response, the Pch driver FET might keep on turning on and the 100% duty cycle mode might be set. The 100% duty cycle mode achieves highspeed response and output voltage stability under the condition where input-output voltage difference is small. ＜EN function＞ When "H" voltage (VENH) is fed to the EN pin, normal operation starts after raising the output voltage with the soft-start function. When the "L" voltage (VENL) is fed to the EN pin, it enters the stand-by state and the current consumption is suppressed to ISTB (TYP . 0.0μA). Additionally, Pch driver FET and Nch driver FET are turned off. ＜Start Mode / Soft-Start function＞ It is a function to raise the output voltage gradually and suppress inrush current. After the "H" voltage (V ENH) is fed to the EN pin, the reference voltage which is connected to the error amplifier increases linearly during the soft-start period. As a result, the output voltage increases in proportion to the increase of the reference voltage. This operation can prevent a large inrush current and smoothly raise the output voltage. During the soft-start function, the operation is the same as normal operation except that the reference voltage increases linearly. tSS VOUT(T) x 0.9 VEN VOUT VENH

■OPERATIONAL EXPLANATION (Continued) ＜Current Limit＞ The current limit function monitors a current flowing through Pch driver FET and Nch driver FET and limits the current. The operation at overcurrent is as follows. 1) When the current flowing through the Pch driver FET increases and reaches the current limit value ILIMH=1000mA (TYP.), the current limit state is set and the Pch driver FET is forcibly turned off. 2) The Nch driver FET turns on after turning off the Pch driver FET by the current limit function. The Pch driver FET is prohibited to turn on until the current value flowing through the Nch driver FET drops to ILIML=800mA (TYP.). 3) Repeat the operations 1) and 2) during the current limit state. 4) When the current limit state is canceled, it automatically returns to normal operation. ILIMH LIML Coil Current Current Limit State I Lx VOUT Normal operation IOUT

■OPERATIONAL EXPLANATION (Continued) ＜UVLO function＞ When the VIN voltage becomes VUVLOD (TYP . 2.0V) or less, the UVLO function operates to forcibly turn off the Pch driver FET to prevent erroneous pulse output due to operation instability of the internal circuit. When the VIN voltage becomes VUVLOR (TYP . 2.14V) or more, the UVLO function is canceled. After the UVLO function is canceled, the output voltage rises with the soft-start function, and then the normal operation is performed. Moreover, during the UVLO operation, the internal circuit is operating because stopping by UVLO is not same to a stand-by mode and just switching operation is stopped. ＜CL Discharge function＞ B type uses an Nch FET and resistor connected to the VOUT pin to rapidly discharge the charge on the output capacitor. In order to prevent malfunction of application due to charge remaining on the output capacitor(EN=”L”) during stand-by. It also operates in the UVLO detection state. The output voltage during discharging can be calculated by the following equation. V = VOUT (T) × e -t / τ t =τ Ln (VOUT (T) / V) V : Output voltage during discharge V OUT (T) : Output voltage t : Discharge time C L : Effective capacitance of Output capacitor R DCHG : CL auto-discharge resistance τ : CL×RDCHG

■NOTE ON USE 1) For the phenomenon of temporal and transitional voltage decrease or voltage increase, the IC may be damaged or deteriorated if IC is used beyond the absolute MAX. specifications. Also, if used under out of the recommended operating range, the IC may not operate normally or may cause deterioration. 2) Spike noise and ripple voltage arise in a switching regulator as with a DC/DC converter. These are greatly influenced by external component selection, such as the coil inductance, capacitance values, and board layout of external components. Once the design has been completed, verification with actual components should be done. 3) The DC/DC converter characteristics depend greatly on the externally connected components as well as on the characteristics of this IC, so refer to the specifications and standard circuit examples of each component when carefully considering which components to select. Especially for CL capacitor, it is recommended to use an appropriate ceramic capacitor according to the DC bias usage conditions (ambient temperature, input / output voltage) so that the effective capacitance value is equal to or higher than the recommended component. 4) Due to propagation delay inside the product, the on time generated by the on time generation circuit is not the same as the on time that is the ratio of the input voltage to the output voltage. 5) The actual coil current may at times exceed the current limit value (ILIMH) due to propagation delays in the current limiting circuit. 6) When a coil with poor DC superimposition characteristics is used, it may not be possible to draw a current of Iout=600mA at high temperatures. In this case, either change the coil to one with a large inductance value or use a coil with better DC superimposition characteristics. 7) The XC9291 series may experience a drop in output voltage in heavy-load areas. In addition, near the switching of 100% duty cycle mode in the heavy-load area, the phenomenon that the output voltage drops may occur periodically, which may increase the ripple voltage. <Condition> XC9291x18E (VOUT(T)=1.8V, fosc=6MHz) VIN=2.5V, IOUT=300mA, Ta=105℃ L : 0.47μH CIN : 4.7μF (GRM035R60J475ME15) CL : 4.7μF (GRM035R60J475ME15)

■NOTE ON USE 8) At high temperatures, the leakage current of the Pch driver FET increases. Due to this leakage current, the output voltage may rise under "light load conditions of the XC9291 series (PWM/PFM automatic switching control)" and "standby state of the A type (without CL discharge function)". 9) For the XC9290 series (PWM control), the output voltage may drop during load transient fluctuations (100mA/µs or more) from an output current of 300mA or more to a light load when the input/output potential difference is 1V or less. 10) Torex places an importance on improving our products and their reliability. We request that users incorporate fail safe designs and post aging protection treatment when using Torex products in their systems. <Condition> XC9290x33D (VOUT(T)=3.3V, fosc=4MHz) VIN=3.6V, IOUT=370mA→1mA (tf=1μs), Ta=25℃ L : 2.2μH CIN : 4.7μF (GRM035R60J475ME15) CL : 4.7μF (GRM035R60J475ME15)

■NOTE ON USE (Continued) 11) Note on mounting (WLP) 1. Mount pad design should be optimized for user's conditions. 2. Sn-AG-Cu is used for the package terminals. If eutectic solder is used, mounting reliability is decreased. Please do not use eutectic solder paste. 3. When underfill agent is used to increase interfacial bonding strength, please take enough evaluation for selection. Some underfill materials and applied conditions may decrease bonding reliability. 4. The IC has exposed surface of silicon material in the top marking face and sides so that it is weak against mechanical damages. Please take care of handling to avoid cracks and breaks. 5. The IC has exposed surface of silicon material in the top marking face and sides. Please use the IC with keeping the circuit open (avoiding short-circuit from the out). 6. Semi-transparent resin is coated on the circuit face of the package. Please be noted that the usage under strong lights may affects device performance. 12) Instructions of pattern layouts Especially noted in the pattern layout are as follows. Please refer to the reference pattern layout on the next page. 1. Wire the large current line using thick, short connecting traces. This makes it possible to reduce the wire impedance, which is expected to reduce noise and improve heat dissipation. If the wire impedance of the large current line is large, it may cause noise or the IC to not operate normally. 2. Place the input capacitance C IN, output capacitance CL, inductor L and IC which the large current flows on the same surface. If they are placed on both sides, a large current will flow through Via, which has high impedance, it may cause noise and the IC may not operate normally. 3. Please mount each external component as close to the IC as possible. Especially place the input capacitance CIN near the IC and connect it with as low impedance as possible. If the input capacity CIN and IC are too far apart, it may cause noise or the IC may not operate normally.

■NOTE ON USE (Continued) ＜Reference pattern layout＞ WLP-5-08 Layer 3 Layer 4 Layer 1 Layer 2 LGA-6B01 Layer 3 Layer 4 Layer 1 Layer 2

■TYPICAL PERFORMANCE CHARACTERISTICS (1) Efficiency vs. Output Current 100 0.1 1 10 100 1000 Efficiency: EFFI (%) Output Current: IOUT (mA) VOUT(T)=0.8V, fOSC=6MHz L = 0.47μH(DFE18SANR47MG0L) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(GRM035R60J475ME15) XC9290 V IN=3.7V XC9290 V IN=5.0V XC9291 V IN=3.7V XC9291 V IN=5.0V 100 0.1 1 10 100 1000 Efficiency: EFFI (%) Output Current: IOUT (mA) VOUT(T)=1.0V, fOSC=6MHz XC9290 V IN=3.7V XC9290 V IN=5.0V XC9291 V IN=3.7V XC9291 V IN=5.0V L = 0.47μH(DFE18SANR47MG0L) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(GRM035R60J475ME15) VIN=3.7V VIN=5.0V 100 0.1 1 10 100 1000 Efficiency: EFFI (%) Output Current: IOUT (mA) VOUT(T)=1.0V, fOSC=4MHz XC9290 V IN=3.7V XC9290 V IN=5.0V XC9291 V IN=3.7V XC9291 V IN=5.0V L = 1.0μH(DFE18SAN1R0MG0L) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(GRM035R60J475ME15) 100 0.1 1 10 100 1000 Efficiency: EFFI (%) Output Current: IOUT (mA) VOUT(T)=0.8V, fOSC=4MHz L = 1.0μH(DFE18SAN1R0MG0L) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(GRM035R60J475ME15) XC9290 V IN=3.7V XC9290 V IN=5.0V XC9291 V IN=3.7V XC9291 V IN=5.0V 100 0.1 1 10 100 1000 Efficiency: EFFI (%) Output Current: IOUT (mA) VOUT(T)=1.8V, fOSC=6MHz L = 0.47μH(DFE18SANR47MG0L) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(GRM035R60J475ME15) XC9290 V IN=3.7V XC9290 V IN=5.0V XC9291 V IN=3.7V XC9291 V IN=5.0V 100 0.1 1 10 100 1000 Efficiency: EFFI (%) Output Current: IOUT (mA) VOUT(T)=1.8V, fOSC=4MHz L = 1.0μH(DFE18SAN1R0MG0L) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(GRM035R60J475ME15) XC9290 V IN=3.7V XC9290 V IN=5.0V XC9291 V IN=3.7V XC9291 V IN=5.0V

(1) Efficiency vs. Output Current (Continued) 100 0.1 1 10 100 1000 Efficiency: EFFI (%) Output Current: IOUT (mA) VOUT(T)=3.3V, fOSC=6MHz XC9290 V IN=5.0V XC9291 V IN=5.0V L = 0.47μH(DFE18SANR47MG0L) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(GRM035R60J475ME15) 100 0.1 1 10 100 1000 Efficiency: EFFI (%) Output Current: IOUT (mA) VOUT(T)=3.3V, fOSC=4MHz XC9290 V IN=5.0V XC9291 V IN=5.0V L = 1.0μH(DFE18SAN1R0MG0L) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(GRM035R60J475ME15) ■TYPICAL PERFORMANCE CHARACTERISTICS

(2) Output Voltage vs. Output Current 1.10 1.15 1.20 1.25 1.30 0.1 1 10 100 1000 Output Voltage: VOUT (V) Output Current: IOUT (mA) XC9290B12E(VOUT(T)=1.2V, fOSC=6MHz) VIN=2.5V VIN=3.7V VIN=5.5V 1.08 1.14 1.20 1.26 1.32 0.1 1 10 100 1000 Output Voltage: VOUT (V) Output Current: IOUT (mA) XC9291B12E(VOUT(T)=1.2V, fOSC=6MHz) L = 0.47μH(DFE18SANR47MG0L) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(GRM035R60J475ME15) L = 0.47μH(DFE18SANR47MG0L) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(GRM035R60J475ME15) 1.10 1.15 1.20 1.25 1.30 0.1 1 10 100 1000 Output Voltage: VOUT (V) Output Current: IOUT (mA) XC9290B12D(VOUT(T)=1.2V, fOSC=4MHz) VIN=2.5V VIN=3.7V VIN=5.5V L = 1.0μH(DFE18SAN1R0MG0L) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(GRM035R60J475ME15) 1.08 1.14 1.20 1.26 1.32 0.1 1 10 100 1000 Output Voltage: VOUT (V) Output Current: IOUT (mA) XC9291B12D(VOUT(T)=1.2V, fOSC=4MHz) L = 1.0μH(DFE18SAN1R0MG0L) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(GRM035R60J475ME15) 1.62 1.68 1.74 1.80 1.86 1.92 1.98 0.1 1 10 100 1000 Output Voltage: VOUT (V) Output Current: IOUT (mA) XC9290B18D(VOUT(T)=1.8V, fOSC=4MHz) L = 1.0μH(DFE18SAN1R0MG0L) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(GRM035R60J475ME15) VIN=2.5V VIN=3.7V VIN=5.5V 1.62 1.68 1.74 1.80 1.86 1.92 1.98 0.1 1 10 100 1000 Output Voltage: VOUT (V) Output Current: IOUT (mA) XC9290B18E(VOUT(T)=1.8V, fOSC=6MHz) L = 0.47μH(DFE18SANR47MG0L) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(GRM035R60J475ME15) VIN=2.5V VIN=3.7V VIN=5.5V VIN=2.5V VIN=3.7V VIN=4.2V VIN=5.0V VIN=5.5V VIN=2.5V VIN=3.7V VIN=4.2V VIN=5.0V VIN=5.5V ■TYPICAL PERFORMANCE CHARACTERISTICS

(2) Output Voltage vs. Output Current (Continued) 1.62 1.68 1.74 1.80 1.86 1.92 1.98 0.1 1 10 100 1000 Output Voltage: VOUT (V) Output Current: IOUT (mA) XC9291B18E(VOUT(T)=1.8V, fOSC=6MHz) L = 0.47μH(DFE18SANR47MG0L) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(GRM035R60J475ME15) 1.62 1.68 1.74 1.80 1.86 1.92 1.98 0.1 1 10 100 1000 Output Voltage: VOUT (V) Output Current: IOUT (mA) XC9291B18D(VOUT(T)=1.8V, fOSC=4MHz) L = 1.0μH(DFE18SAN1R0MG0L) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(GRM035R60J475ME15) VIN=2.5V VIN=3.7V VIN=5.5V 3.00 3.10 3.20 3.30 3.40 3.50 3.60 0.1 1 10 100 1000 Output Voltage: VOUT (V) Output Current: IOUT (mA) XC9290B33E(VOUT(T)=3.3V, fOSC=6MHz) L = 0.47μH(DFE18SANR47MG0L) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(GRM035R60J475ME15) VIN=5.0V VIN=5.5V 3.00 3.10 3.20 3.30 3.40 3.50 3.60 0.1 1 10 100 1000 Output Voltage: VOUT (V) Output Current: IOUT (mA) XC9291B33E(VOUT(T)=3.3V, fOSC=6MHz) L = 0.47μH(DFE18SANR47MG0L) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(GRM035R60J475ME15) VIN=4.2V VIN=5.0V VIN=5.5V 3.00 3.10 3.20 3.30 3.40 3.50 3.60 0.1 1 10 100 1000 Output Voltage: VOUT (V) Output Current: IOUT (mA) XC9290B33D(VOUT(T)=3.3V, fOSC=4MHz) L = 1.0μH(DFE18SAN1R0MG0L) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(GRM035R60J475ME15) VIN=5.0V VIN=5.5V 3.00 3.10 3.20 3.30 3.40 3.50 3.60 0.1 1 10 100 1000 Output Voltage: VOUT (V) Output Current: IOUT (mA) XC9291B33D(VOUT(T)=3.3V, fOSC=4MHz) L = 1.0μH(DFE18SAN1R0MG0L) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(GRM035R60J475ME15) VIN=4.2V VIN=5.0V VIN=5.5V VIN=2.5V VIN=3.7V VIN=5.5V ■TYPICAL PERFORMANCE CHARACTERISTICS

(3) Ripple Voltage vs. Output Current 100 0 1 10 100 1000 Ripple Voltage: Vr(mV) Output Current: IOUT (mA) VOUT(T)=1.0V, fOSC=6MHz XC9290 XC9291 VIN=3.7V L = 0.47μH(LSCNB1005EETR47MB) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(C1005X5R0J475K) 100 0 1 10 100 1000 Ripple Voltage: Vr(mV) Output Current: IOUT (mA) VOUT(T)=1.0V, fOSC=4MHz XC9290 XC9291 VIN=3.7V L = 1.0μH(LSCNB1005EET1R0MB) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(C1005X5R0J475K) 100 0.1 1 10 100 1000 Ripple Voltage: Vr(mV) Output Current: IOUT (mA) VOUT(T)=1.8V, fOSC=6MHz XC9290 XC9291 VIN=3.7V L = 0.47μH(LSCNB1005EETR47MB) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(C1005X5R0J475K) 100 0.1 1 10 100 1000 Ripple Voltage: Vr(mV) Output Current: IOUT (mA) VOUT(T)=3.3V, fOSC=6MHz XC9290 XC9291 VIN=5.0V L = 0.47μH(LSCNB1005EETR47MB) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(C1005X5R0J475K) 100 0.1 1 10 100 1000 Ripple Voltage: Vr(mV) Output Current: IOUT (mA) VOUT(T)=1.8V, fOSC=4MHz XC9290 XC9291 VIN=3.7V L = 1.0μH(LSCNB1005EET1R0MB) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(C1005X5R0J475M050BC) 100 0.1 1 10 100 1000 Ripple Voltage: Vr(mV) Output Current: IOUT (mA) VOUT(T)=3.3V, fOSC=4MHz XC9290 XC9291 VIN=5.0V L = 1.0μH(LSCNB1005EET1R0MB) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(C1005X5R0J475K) ■TYPICAL PERFORMANCE CHARACTERISTICS

(4) Output Voltage vs. Ambient Temperature (5) UVLO Voltage vs. Ambient Temperature (6) Quiescent Current vs. Ambient Temperature (7) Stand-by Current vs. Ambient Temperature 1.62 1.68 1.74 1.80 1.86 1.92 1.98 -50 -25 0 25 50 75 100 125 Output Voltage: VOUT (V) Ambient Temperature: Ta (℃) VOUT(T)=1.8V VIN=3.8V VIN=6.0V 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 -50 -25 0 25 50 75 100 125 UVLO Voltage (V) Ambient Temperature: Ta (℃) UVLO Release Voltage UVLO Detect Voltage 100 200 300 400 500 600 700 800 900 1000 -50 -25 0 25 50 75 100 125 Quiescent Current: Iq (μA) Ambient Temperature: Ta (℃) XC9290 VIN=2.5V VIN=3.6V VIN=5.0V -50 -25 0 25 50 75 100 125 Stand-by Current: ISTB (μA) Ambient Temperature: Ta (℃) VIN=2.5V VIN=3.7V VIN=6.0V -50 -25 0 25 50 75 100 125 Quiescent Current: Iq (μA) Ambient Temperature: Ta (℃) XC9291 VIN=2.5V VIN=3.6V VIN=5.0V ■TYPICAL PERFORMANCE CHARACTERISTICS

(8) Oscillation Frequency vs. Output Current 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 0.1 1 10 100 1000 Oscillation Freqency: fOSC (MHz) Output Current: IOUT (mA) XC9290B08E(VOUT(T)=0.8V, fOSC=6MHz) VIN=3.0V VIN=3.7V VIN=5.0V L = 0.47μH(DFE18SANR47MG0L) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(GRM035R60J475ME15) 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 0.1 1 10 100 1000 Oscillation Freqency: fOSC (MHz) Output Current: IOUT (mA) XC9290B33E(VOUT(T)=3.3V, fOSC=6MHz) L = 0.47μH(DFE18SANR47MG0L) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(GRM035R60J475ME15) VIN=4.5V VIN=5.0V VIN=5.5V 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 0.1 1 10 100 1000 Oscillation Freqency: fOSC (MHz) Output Current: IOUT (mA) XC9290B18E(VOUT(T)=1.8V, fOSC=6MHz) L = 0.47μH(DFE18SANR47MG0L) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(GRM035R60J475ME15) VIN=3.0V VIN=3.7V VIN=5.0V ■TYPICAL PERFORMANCE CHARACTERISTICS

(8) Oscillation Frequency vs. Output Current (Continued) 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 0.1 1 10 100 1000 Oscillation Freqency: fOSC (MHz) Output Current: IOUT (mA) XC9290B08D(VOUT(T)=0.8V, fOSC=4MHz) VIN=3.0V VIN=3.7V VIN=5.0V L = 1.0μH(DFE18SAN1R0MG0L) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(GRM035R60J475ME15) 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 0.1 1 10 100 1000 Oscillation Freqency: fOSC (MHz) Output Current: IOUT (mA) XC9290B18D(VOUT(T)=1.8V, fOSC=4MHz) L = 1.0μH(DFE18SAN1R0MG0L) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(GRM035R60J475ME15) VIN=3.0V VIN=3.7V VIN=5.0V 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 0.1 1 10 100 1000 Oscillation Freqency: fOSC (MHz) Output Current: IOUT (mA) XC9290B33D(VOUT(T)=3.3V, fOSC=4MHz) L = 1.0μH(DFE18SAN1R0MG0L) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(GRM035R60J475ME15) VIN=4.5V VIN=5.0V VIN=5.5V ■TYPICAL PERFORMANCE CHARACTERISTICS

(9) Lx SW ”H” ON Resistance vs. Ambient Temperature (10) Lx SW ”L” ON Resistance vs. Ambient Temperature (11) Lx SW ”H” Leakage Current vs. Ambient Temperature (12) Lx SW ”L” Leakage Current vs. Ambient Temperature (13) EN ”H” Voltage vs. Ambient Temperature (14) EN ”L” Voltage vs. Ambient Temperature 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -50 -25 0 25 50 75 100 125 Lx SW Pch ON Resistance: R LxH (Ω) Ambient Temperature : Ta (℃) VIN=2.5V VIN=3.6V VIN=6.0V Package : WLP-5-08 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -50 -25 0 25 50 75 100 125 Lx SW Nch ON Resistance: RLxL (Ω) Ambient Temperature : Ta (℃) VIN=2.5V VIN=3.6V VIN=6.0V Package : WLP-5-08 -50 -25 0 25 50 75 100 125 LxSW”H” Leakage Current: ILeakH (μA) Ambient Temperature: Ta (℃) VIN=6.0V -50 -25 0 25 50 75 100 125 LxSW”L” Leakage Current: ILeakL (μA) Ambient Temperature: Ta (℃) VIN=6.0V 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 -50 -25 0 25 50 75 100 125 EN ”H” Voltage VENH (V) Ambient Temperature: Ta (℃) VIN=2.5V VIN=3.6V VIN=6.0V 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 -50 -25 0 25 50 75 100 125 EN ”L” Voltage VENL (V) Ambient Temperature: Ta (℃) VIN=2.5V VIN=3.6V VIN=6.0V ■TYPICAL PERFORMANCE CHARACTERISTICS

(15) Current Limit vs. Ambient Temperature (16) Soft-Start Time vs. Ambient Temperature (17) CL Discharge Resistance vs. Ambient Temperature 600 700 800 900 1000 1100 1200 1300 1400 -50 -25 0 25 50 75 100 125 Current Limit: ILIMH (mA) Ambient Temperature: Ta (℃) VIN=2.5V VIN=3.6V VIN=6.0V 100 200 300 400 500 -50 -25 0 25 50 75 100 125 Soft-Start Time tSS (μs) Ambient Temperature: Ta (℃) VIN=2.5V VIN=3.6V VIN=5.0V 100 200 300 400 500 600 -50 -25 0 25 50 75 100 125 CL Discharge Resistance: RDCHG (Ω) Ambient Temperature: Ta (℃) XC9290B/XC9291B(V OUT=1.0V) VIN=2.5V VIN=3.6V VIN=5.0V ■TYPICAL PERFORMANCE CHARACTERISTICS

(18) Load Transient Respones VOUT:50mV/div IOUT:300mA IOUT:1mA 200μs/div VOUT:50mV/div IOUT:300mA IOUT:1mA 200μs/div VOUT:50mV/div IOUT:300mA IOUT:1mA 200μs/div VOUT:50mV/div IOUT:300mA IOUT:1mA 200μs/div VOUT:50mV/div IOUT:300mA IOUT:1mA 200μs/div VOUT:50mV/div IOUT:300mA IOUT:1mA 200μs/div XC9290x10E (VOUT(T) = 1.0V, fOSC = 6MHz) VIN = 5.0V IOUT = 1mA ⇔300mA (tr, tf = 5μs) L = 0.47μH(LSCNB1005EETR47MB) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(C1005X5R0J475K) XC9291x10E (VOUT(T) = 1.0V, fOSC = 6MHz) VIN = 5.0V IOUT = 1mA ⇔300mA (tr, tf = 5μs) L = 0.47μH(LSCNB1005EETR47MB) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(C1005X5R0J475K) XC9290x18E (VOUT(T) = 1.8V, fOSC = 6MHz) VIN = 5.0V IOUT = 1mA ⇔ 300mA (tr, tf = 5μs) L = 0.47μH(LSCNB1005EETR47MB) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(C1005X5R0J475K) XC9291x18E (VOUT(T) = 1.8V, fOSC = 6MHz) VIN = 5.0V IOUT = 1mA ⇔ 300mA (tr, tf = 5μs) L = 0.47μH(LSCNB1005EETR47MB) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(C1005X5R0J475K) XC9290x33E (VOUT(T) = 3.3V, fOSC = 6MHz) VIN = 5.0V IOUT = 1mA ⇔300mA (tr, tf = 5μs) L = 0.47μH(LSCNB1005EETR47MB) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(C1005X5R0J475K) XC9291x33E (VOUT(T) = 3.3V, fOSC = 6MHz) VIN = 5.0V IOUT = 1mA ⇔300mA (tr, tf = 5μs) L = 0.47μH(LSCNB1005EETR47MB) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(C1005X5R0J475K) ■TYPICAL PERFORMANCE CHARACTERISTICS

(18) Load Transient Respones(Continued) VOUT:50mV/div IOUT:300mA IOUT:1mA 200μs/div VOUT:50mV/div IOUT:300mA IOUT:1mA 200μs/div VOUT:50mV/div IOUT:300mA IOUT:1mA 200μs/div VOUT:50mV/div IOUT:300mA IOUT:1mA 200μs/div VOUT:50mV/div IOUT:300mA IOUT:1mA 200μs/div VOUT:50mV/div IOUT:300mA IOUT:1mA 200μs/div XC9290x10D (VOUT(T) = 1.0V, fOSC = 4MHz) VIN = 5.0V IOUT = 1mA ⇔300mA (tr, tf = 5μs) L = 1.0μH(LSCNB1005EET1R0MB) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(C1005X5R0J475K) XC9291x10D (VOUT(T) = 1.0V, fOSC = 4MHz) VIN = 5.0V IOUT = 1mA ⇔300mA (tr, tf = 5μs) L = 1.0μH(LSCNB1005EET1R0MB) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(C1005X5R0J475K) XC9290x18D (VOUT(T) = 1.8V, fOSC = 4MHz) VIN = 5.0V IOUT = 1mA ⇔300mA (tr tf = 5μs) L = 1.0μH(LSCNB1005EET1R0MB) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(C1005X5R0J475K) XC9291x18D (VOUT(T) = 1.8V, fOSC = 4MHz) VIN = 5.0V IOUT = 1mA ⇔ 300mA (tr, tf = 5μs) L = 1.0μH(LSCNB1005EET1R0MB) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(C1005X5R0J475K) XC9290x33D (VOUT(T) = 3.3V, fOSC = 4MHz) VIN = 5.0V IOUT = 1mA ⇔300mA (tr, tf = 5μs) L = 1.0μH(LSCNB1005EET1R0MB) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(C1005X5R0J475K) XC9291x33D (VOUT(T) = 3.3V, fOSC = 4MHz) VIN = 5.0V IOUT = 1mA ⇔300mA (tr, tf = 5μs) L = 1.0μH(LSCNB1005EET1R0MB) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(C1005X5R0J475K) ■TYPICAL PERFORMANCE CHARACTERISTICS

■TYPICAL PERFORMANCE CHARACTERISTICS (19) Start-up (20-1) Shutdown (Without C L discharge function) (20-2) Shutdown (With C L discharge function) XC9290x18E (VOUT(T) = 1.8V, fOSC = 6MHz ) VIN = 3.6V VEN = 0.0V⇒5.0V L = 0.47μH(LSCNB1005EETR47MB) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(GRM035R60J475ME15) Load = 1.8kΩ VEN:5.0V/div VOUT:500mV/div IIN:100mA/div 100μs/div XC9291x18E (VOUT(T) = 1.8V, fOSC = 6MHz ) VIN = 3.6V VEN = 0.0V⇒5.0V L = 0.47μH(LSCNB1005EETR47MB) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(GRM035R60J475ME15) Load = 1.8kΩ VEN:5.0V/div VOUT:500mV/div IIN:100mA/div 100μs/div XC9291A18E (VOUT(T) = 1.8V, fOSC = 6MHz ) VIN = 3.6V VEN = 5.0V⇒0.0V L = 0.47μH(LSCNB1005EETR47MB) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(GRM035R60J475ME15) Load = 1.8kΩ XC9291B18E (VOUT(T) = 1.8V, fOSC = 6MHz ) VIN = 3.6V VEN = 5.0V⇒0.0V L = 0.47μH(LSCNB1005EETR47MB) CIN = 4.7μF(GRM035R60J475ME15) CL = 4.7μF(GRM035R60J475ME15) Load = 1.8kΩ VEN:5.0V/div VOUT:500mV/div 10ms/div VEN:5.0V/div VOUT:500mV/div 10ms/div

■PACKAGING INFORMATION For the latest package information go to, www.torexsemi.com/technical-support/packages PACKAGE OUTLINE / LAND PATTERN THERMAL CHARACTERISTICS LGA-6B01 LGA-6B01 PKG LGA-6B01 Power Dissipation WLP-5-08 WLP-5-08 PKG WLP-5-08 Power Dissipation

■MARKING RULE ① represents products series MARK PRODUCT SERIESIES ② represents type, Oscillation Frequency, and the second decimal place of the output voltage ③ represents output voltage 0 0.7 0.75 F 2.2 2.25 1 0.8 0.85 H 2.3 2.35 2 0.9 0.95 K 2.4 2.45 3 1.0 1.05 L 2.5 2.55 4 1.1 1.15 M 2.6 2.65 5 1.2 1.25 N 2.7 2.75 6 1.3 1.35 P 2.8 2.85 7 1.4 1.45 R 2.9 2.95 8 1.5 1.55 S 3.0 3.05 9 1.6 1.65 T 3.1 3.15 A 1.7 1.75 U 3.2 3.25 B 1.8 1.85 V 3.3 3.35 C 1.9 1.95 X 3.4 3.45 D 2.0 2.05 Y 3.5 3.55 E 2.1 2.15 Z 3.6 - ④⑤ represents production lot number 01～09, 0A～0Z, 11～9Z, A1～A9, AA～AZ, B1～ZZ in order. (G, I, J, O, Q, W excluded) * No character inversion used. F H MARK Oscillation Frequency PRODUCT SERIESIES A 6.0MHz E 4.0MHz H PRODUCT SERIESIES MARK OUTPUT VOLTAGE (V) PRODUCT SERIESIES MARK OUTPUT VOLTAGE (V) LGA-6B01 WLP-5-08 1 4 2 3 ③ ①②

  1. The product and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. The information in this datasheet is intended to illustrate the operation and characteristics of our products. We neither make warranties or representations with respect to the accuracy or completeness of the information contained in this datasheet nor grant any license to any intellectual property rights of ours or any third party concerning with the information in this datasheet. 3. Applicable export control laws and regulations should be complied and the procedures required by such laws and regulations should also be followed, when the product or any information contained in this datasheet is exported. 4. The product is neither intended nor warranted for use in equipment of systems which require extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss of human life, bodily injury, serious property damage including but not limited to devices or equipment used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and other transportation industry and 5) safety devices and safety equipment to control combustions and explosions. Do not use the product for the above use unless agreed by us in writing in advance. 5. Although we make continuous efforts to improve the quality and reliability of our products; nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal injury and/or property damage resulting from such failure, customers are required to incorporate adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention features. 6. Our products are not designed to be Radiation-resistant. 7. Please use the product listed in this datasheet within the specified ranges. 8. We assume no responsibility for damage or loss due to abnormal use. 9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex Semiconductor Ltd in writing in advance. TOREX SEMICONDUCTOR LTD.