CND2047 UMS | Alldatasheet
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Technical content
Ref. : DSCND20470077 -17-Mar-00 1 /10 Specifications subject to change without notice United Monolithic Semiconductors S.A.S. Route Départementale 128 - B.P.46 - 91401 Orsay Cedex France Tel. : +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 10GHz Frequency Divider by 4 Fixed Modulus Prescaler GaAs Monolithic Microwave IC
Description
The CND2047 is a low power consumption very high speed divider by 4 GaAs prescaler manufactured with a 0.7µm self aligned implanted MESFET process. The design is full differential input/output that allows direct drive into 50 Ω load. The CND2047 is available in chip form and in 2 packages form: * low cost SOIC8 plastic package * 8 lead Flat Pack ceramic surface mount package Main Features ¦ Very broad operating frequency range ¦ Low power dissipation: 300mW ¦ Single supply operation: 3V to 5V ¦ High input sensitivity: -10dBm@8 Ghz at 25°C and -5dBm@8Ghz at 125°C ¦ Low phase noise: -139dBc/Hz at 1KHz 2047 FTP8 ceramic package SOIC8 plastic package Main Characteristics Tamb= +25°C Symbol Parameter Min Typ Max Unit Vdd Drain voltage 3 5 6 V Pdiss Power dissipation 120 300 400 mW Fmax Maximum input frequency FTP8 SOIC8 GHz ESD Protections: Electrostatic discharge sensitive device observe handling precautions!
CND2047 10GHz Frequency Divider by 4 Ref. : DSCND20470077 -17-Mar-00 2 /10 Specifications subject to change without notice Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Guaranteed electrical specifications over the temperature range of -55°C to +125°C but tested at Tamb=25°C under configuration described in Fig.1 ( Vdd=5V ; Differential inputs; Pin=0dBm ; Zo=50 Ω ) Symbol Parameter Min Typ Max Unit Fmax Maximum input frequency 8.25 8.75 GHz Idd Supply current 60 75 mA Typical design information over the temperature range of -55°C to +125°C ( Vdd=5V, Zo=50 Ω ) Symbol Parameter Min Typ Max Unit Fmax Maximum input frequency differential input Pin= -5dBm Pin= 0dBm one input Pin= -5dBm Pin= 0dBm 8.25 7.5 8.5 8.75 8.5 GHz Ghz Ghz Ghz Pout Output power -4 -1.5 dBm Idd Supply current 60 75 mA Typical design information over the temperature range of -55°C to +125°C. ( Vdd=3.3V, Zo=50 Ω ) Symbol Parameter Min Typ Max Unit Fmax Maximum input frequency differential input Pin= -5dBm Pin= 0dBm one input Pin= -5dBm Pin= 0dBm 7.5 7.5 8.5 7.5 GHz Ghz Ghz Ghz Pout Output power -7 -4.5 dBm Idd Supply current 40 55 mA
10GHz Frequency Divider by 4 CND2047 Ref. : DSCND20470077 -17-Mar-00 3 /10 Specifications subject to change without notice Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Guaranteed electrical specifications over the temperature range of -40°C to +85°C but tested at Tamb=25°C under configuration described in Fig.1 ( Vdd=5V ; Differential inputs; Pin=0dBm ; Zo=50 Ω ) Symbol Parameter Min Typ Max Unit Fmax Maximum input frequency 8.5 9 GHz Idd Supply current 60 75 mA Typical design information over the temperature range of -40°C to +85°C ( Vdd=5V, Zo=50 Ω ) Symbol Parameter Min Typ Max Unit Fmax Maximum input frequency differential input Pin= -5dBm Pin= 0dBm one input Pin= -5dBm Pin= 0dBm 8.5 7.25 7.75 8.5 7.75 8.25 GHz Ghz Ghz Ghz Pout Output power -4 -1.5 dBm Idd Supply current 60 75 mA Typical design information over the temperature range of -40°C to +85°C. ( Vdd=3.3V, Zo=50 Ω ) Symbol Parameter Min Typ Max Unit Fmax Maximum input frequency differential input Pin= -5dBm Pin= 0dBm one input Pin= -5dBm Pin= 0dBm 7.5 6.5 6.75 7.5 7.25 GHz Ghz Ghz Ghz Pout Output power -7 -4.5 dBm Idd Supply current 40 55 mA
CND2047 10GHz Frequency Divider by 4 Ref. : DSCND20470077 -17-Mar-00 4 /10 Specifications subject to change without notice Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Absolute Maximum Ratings (1) Tamb= 25°C Symbol Parameter Values Units Vdd Drain voltage 7 V Pin Maximum input power 15 dBm Top Operating temperature range SOIC8 Die form / FTP8 -40 to +85 -55 to +125 Tstg Storage temperature range -65 to +175 °C (1) Operation of this device above anyone of these parameters may cause permanent damage
10GHz Frequency Divider by 4 CND2047 Ref. : DSCND20470077 -17-Mar-00 5 /10 Specifications subject to change without notice Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Typical Characteristics Tamb= 25°C, Zo=50 Ω , Vdd=5V Output power level vs Input frequency and Vdd -10 1 3 5 7 9 11 Output level (dBm) Vdd=5V Vdd=3.3V Frequency (GHz) Device current vs Voltage and Temperature 2,5 3 3,5 4 4,5 5 5,5 6 25°C -55°C 125°C Vdd (V) Idd (mA) SSB phase noise vs. Offset frequency (Fin=3.9 Ghz) -160 -140 -120 -100 -80 -60 -40 -20 10 100 1000 10000 100000 Offset frequency (Hz) SSB phase noise (dBc/Hz)
CND2047 10GHz Frequency Divider by 4 Ref. : DSCND20470077 -17-Mar-00 6 /10 Specifications subject to change without notice Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Fmax vs Vdd (Pin=0dBm; differential inputs) 2 2,5 3 3,5 4 4,5 5 5,5 6 Vdd (Volts) Frequency (GHz) SOIC8 FTP8 FTP8 package / Die form Input sensitivity vs. Input frequency and temperature (Vdd=5V; differential inputs) -55 -45 -35 -25 -15 1,00 3,00 5,00 7,00 9,00 11,00 Frequency (GHz) Input level (dBm) +25°C +125°C -55°C SOIC8 package Input sensitivity vs. Input frequency and temperature (Vdd=5V; differential inputs) -55,00 -45,00 -35,00 -25,00 -15,00 -5,00 5,00 15,00 1,00 3,00 5,00 7,00 9,00 11,00 Frequency (GHz) Input level (dBm) +80 +25 -40
10GHz Frequency Divider by 4 CND2047 Ref. : DSCND20470077 -17-Mar-00 7 /10 Specifications subject to change without notice Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Typical bias tuning Tamb=25°C Signal generator
50 Ohms load
180° Vdd 5 8 Fig.1 : Typical measurement and RF biasing configuration (differential inputs) 1 nFSignal generator F/4 RF output (50 Ohms) F/4 RF output (50 Ohms) Q QB Vdd 5 8 Fig.2 : RF biasing configuration with single input Fig.3 : Chip block diagram
CND2047 10GHz Frequency Divider by 4 Ref. : DSCND20470077 -17-Mar-00 8 /10 Specifications subject to change without notice Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 SOIC8 Mechanical Data 5+/-0.15 [20+/-0.006] 3.81 [.15] 1.27 [0.05] 0.4 [.015] 8° max 1.7 max 1.4 [0.055] 0.1+/-0.15 [.004+/-.006] 0.2 [0.006] unité: mm Unit: [In] Tolérance générale: +/-0.05 [general tolerance: +/-.002] 1 4 8 5 6+/-0,15 (,236+/-,006) 3,7 (1,45) Pin out Signal
1 Vdd
3 CKB
4 Ground
5 Ground
8 Vdd
10GHz Frequency Divider by 4 CND2047 Ref. : DSCND20470077 -17-Mar-00 9 /10 Specifications subject to change without notice Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 FTP8 Mechanical Data ±0,02 3,81 1,27 typ. 0,38 4,6 max 0,127 Unite: mm 2047 Datecode 0,127 max 2,00 max4 9,56 - 10,16 4,6 max 1,00 - 1,77 Pin out Signal
CND2047 10GHz Frequency Divider by 4 Ref. : DSCND20470077 -17-Mar-00 10 /10 Specifications subject to change without notice Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Chip Mechanical Data Vdd Vdd Vdd1 CKB CK GND GND GND QB Q UMS 7151 dimensions in µm : Thickness= 300µm ± 20µm Pads area: 100*100µm Recommended die attach Epoxy die attach is recommended. Minimum quantity of electrically conductive epoxy must be used, with a narrow fillet around the die after contact Recommended bonding Bonding pads of the product are covered with aluminium metallic layer. Wedge or ball bonding can be used. Aluminium wire has be used if the assembly process is up to 250°C. Otherwise the use of gold wire is possible. The ground bounding length should be as short as possible to optimize the use of the product. The bonder should be properly grounded. Note 1: Vdd1 is used to connect the output buffers (on Q/QB) and can be applied separately from Vdd.
Ordering Information
Chip form :CND2047-99F/00 Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S. . Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use as critical components in life support devices or systems without express written approval from United Monolithic Semiconductors S.A.S.