CHM1290 UMS | Alldatasheet

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Technical content

Ref. : DSCHM12902045 - 14-Feb.-02 1/6 Specifications subject to change without notice Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 20-30GHz SUB-HARMONICALLY PUMPED MIXER GaAs Monolithic Microwave IC

Description

The CHM1290 is a MFC which integrates a self biased LO buffer amplifier and a sub- harmonically diodes mixer for 2LO suppression It is usable both for up-conversion and down- conversion. It is designed for a wide range of applications, typically commercial communication systems for broadband local access (LMDS). The backside of the chip is both RF and DC grounds. This helps simplify the assembly process. The circuit is manufactured with a PM-HEMT process, 0.25µm gate length, capacities over via holes, via holes through the substrate, air bridges and electron beam gate lithography. It is available in chip form. Main Features

  • Broadband performance : 20-30GHz
  • 10dB conversion Loss
  • 29dB 2LO to RF isolation
  • -4dBm LO input power
  • -3dBm input power 1 dB compression
  • Low DC power consumption, 33mA@4.0V
  • Chip size : 0.86 X 1.28 X 0.10 mm Main Characteristics Tamb. = 25°C Parameter Min Typ Max Unit FRF RF frequency range 20 30 GHz FLO LO frequency range 10 15 GHz FIF IF frequency range DC 6 GHz Lc Conversion Loss 10 12 dB ESD Protection : Electrostatic discharge sensitive device. Observe handling precautions !

20-30GHz SHP Mixer CHM1290 Ref. : DSCHM12902045 - 14-Feb.-02 2/6 Specifications subject to change without notice Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Electrical Characteristics for Broadband Operation Tamb = +25°C, Vd = 4.0V Id=33mA Symbol Parameter Min Typ Max Unit FRF RF frequency range 20 30 GHz FLO LO frequency range 10 15 GHz FIF IF frequency range DC 6 GHz Lc Conversion Loss 10 12 dB PLO LO Input power -4 8 dBm 2xLO Leak 2xLO Leakage (for P LO=-4dBm) 30 dBm IP1dB Input power at 1dB gain compression -3 0 3 dBm LO Match LO Matching 2.0:1 RF Match RF Matching 2.0:1 IF Match IF Matching 2.0:1 Sz Chip size 1.1 mm² Id Bias current 33 mA Absolute Maximum Ratings Tamb. = 25°C (1) Symbol Parameter Values Unit Vd Drain bias voltage 5.0 V Id Drain bias current 50 mA Pin Maximum peak input power overdrive (2) TBD dBm Ta Operating temperature range -40 to +85 °C Tstg Storage temperature range -55 to +155 °C (1) Operation of this device above anyone of these parameters may cause permanent damage. (2) Duration < 1s.

20-30GHz SHP Mixer CHM1290 Ref. : DSCHM12902045 - 14-Feb.-02 3/6 Specifications subject to change without notice Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 CHM1290 : Conversion Loss & Leakages Vds = 4.0V, Ids = 33mA ; LO Power = -4dBm / IF Frequency = 1.0GHz -25.0 -22.5 -20.0 -17.5 -15.0 -12.5 -10.0 -7.5 -5.0 -2.5 0.0 LO Frequency ( GHz ) Conversion Loss ( dB ) -45 -40 -35 -30 -25 -20 -15 -10 Leakage @ LO & 2xLO ( dBm ) Lc (2xLO+IF) Lc (2xLO-IF) P LO @ RF P 2*LO @ RF CHM2190 : Conversion LOSS Vds = 4.0V, Ids = 33mA LO Power = -4dBm / IF Frequency = 2.0GHz -15 -14 -13 -12 -11 -10 LO Frequency ( GHz ) Conversion Gain ( dB ) RF Freq. = 22GHz RF Freq. = 30GHz

20-30GHz SHP Mixer CHM1290 Ref. : DSCHM12902045 - 14-Feb.-02 4/6 Specifications subject to change without notice Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 CHM1290 : Conversion Loss & Leakages Vds = 4.0V, Ids = 33mA ; LO Power = 0dBm / IF Frequency = 1.0GHz -25.0 -22.5 -20.0 -17.5 -15.0 -12.5 -10.0 -7.5 -5.0 -2.5 0.0 LO Frequency ( GHz ) Conversion Loss ( dB ) -45 -40 -35 -30 -25 -20 -15 -10 Leakage @ LO & 2xLO ( dBm ) Lc (2xLO+IF) Lc (2xLO-IF) P LO @ RF P 2*LO @ RF

20-30GHz SHP Mixer CHM1290 Ref. : DSCHM12902045 - 14-Feb.-02 5/6 Specifications subject to change without notice Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Chip Assembly and Mechanical Data 120pF 10nF Vd Voltage RF Input/Output bonding wires as short as possible IF Input/Output DC coupled to diodes LO Input/Output bonding wires as short as possible Note : Supply feed should be capacitively bypassed. 25µm diameter gold wire is recommended Bonding pad positions 810 +/- 35 760 1280 +/- 35 140 260 860 ( Chip thickness : 100µm. All dimensions are in micrometers )

20-30GHz SHP Mixer CHM1290 Ref. : DSCHM12902045 - 14-Feb.-02 6/6 Specifications subject to change without notice Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09

Ordering Information

Chip form : CHM1290-99F/00 Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S. . Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use as critical components in life support devices or systems without express written approval from United Monolithic Semiconductors S.A.S.