CHR3693-99F UMS | Alldatasheet

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Technical content

Ref. : DSCHR36931192 - 11 Jul 11 1/8 Specifications subject to change without notice United Monolithic Semiconductors S.A.S. Route Départementale 128 - BP46 - 91401 Orsay Cedex France Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 21-26.5GHz Integrated Down converter GaAs Monolithic Microwave IC

Description

The CHR3693-99F is a multifunction chip, which integrates a balanced cold FET mixer, a time two multiplier, and a RF self biased LNA. It is designed for a wide range of applications, typically commercial communication systems. The circuit is manufactured with a pHEMT process, 0.25µm gate length, via holes through the substrate, air bridges and electron beam gate lithography. It is available in chip form. Main Features ■ Broadband performance 21-26.5GHz ■ 18dB gain ■ -7dBm input IP3 ■ 18dBc image rejection ■ DC bias: Vd=4.0Volt@Id=160mA ■ Chip size: 2,45 x 2,45 x 0,1mm Main Electrical Characteristics Tamb.= +25°C, Vdx=Vdl = +4.0V, Vgx=-0.9V, Vgm=-0.7V Symbol Parameter Min Typ Max Unit F_RF RF frequency range 21 26.5 GHz F_LO LO frequency range 9 14 GHz F_IF IF frequency range DC 3.5 GHz Gc Conversion gain 11 15 dB ESD Protection: Electrostatic discharge sensitive device. Observe handling precautions! Vgx X2X2 LO RF Q I Vdx Vgm Vdl

CHR3693-99F 21-26.5GHz Integrated Down converter Ref. : DSCHR36931192 - 11 Jul 11 2/8 Specifications subject to change without notice Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09

Electrical Characteristics

Tamb.= +25°C, Vdx=Vdl = +4.0V, Vgx=-0.9V, Vgm=-0.7V Symbol Parameter Min Typ Max Unit F_RF RF frequency range 21 26.5 GHz F_LO LO frequency range 9 14 GHz F_IF IF frequency range DC 3.5 GHz Gc Conversion gain 11 15 19 dB NF Noise Figure for IF>0.1GHz 3.2 3.7 dB P_LO LO Input power 2 5 dBm Img Sup Image Suppression(2) 15 18 dBc IIP3 Input IP3 -7 dBm LO_RL LO return loss -9.5 -7 dB RF_RL RF return loss (21 to 24GHz) RF return loss (24 to 26.5GHz) -9.5 dB dB Id Bias current(1) (Idl + Idx) 120 160 200 mA (1) Typically, Idl= 90mA, Idx=70mA (2) With external I/Q 90° hybrid coupler These values are representative of on -wafer measurements that are made without bonding wires at the RF ports. A bonding wire of typically 0.1 to 0.15nH will improve the matching at the accesses. Absolute Maximum Ratings (1) Tamb.= +25°C Symbol Parameter Values Unit Vd Maximum drain bias voltage 4.5 V Id Maximum drain bias current 230 mA Vg Gate bias voltage -2.0 to +0.4 V P_RF Maximum RF input power (2) 10 dBm P_LO Maximum LO input power (2) 10 dBm Tch Maximum channel temperature 175 °C Ta Operating temperature range -40 to +85 °C Tstg Storage temperature range -55 to +150 °C (1) Operation of this device above anyone of these parameters may cause permanent damage. (2) Duration < 1s.

21-26.5GHz Integrated Down converter CHR3693-99F Ref. : DSCHR36931192 - 11 Jul 11 3/8 Specifications subject to change without notice Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Typical on wafer Measurements Tamb=25°C, Vdx=Vdl=4V, Typical Vgx=-0.9V & Vgm=-0.7V

CHR3693-99F 21-26.5GHz Integrated Down converter Ref. : DSCHR36931192 - 11 Jul 11 4/8 Specifications subject to change without notice Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Typical on wafer Measurements Tamb=25°C, Vdx=Vdl=4V, Typical Vgx=-0.9V & Vgm=-0.7V

21-26.5GHz Integrated Down converter CHR3693-99F Ref. : DSCHR36931192 - 11 Jul 11 5/8 Specifications subject to change without notice Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Mechanical data Bonding pad positions Chip thickness: 100µm. Chip size: 2450x2450 ±35µm All dimensions are in micrometers Supply feed should be capacitively bypassed. 25µm diameter gold wire is recommended.

CHR3693-99F 21-26.5GHz Integrated Down converter Ref. : DSCHR36931192 - 11 Jul 11 6/8 Specifications subject to change without notice Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Recommended assembly plan 25µm wedge bonding is preferred Recommended circuit bonding table Label Type Decoupling Comment Vgx Vg 120pF Multiplier gate control Vdx Vd 120pF Multiplier chain Drain Supply Vgm Vg 120pF Mixer gate control Vdl Vd 120pF LNA Drain Supply Q OUT I OUT RF IN LO IN To Vgx DC Gate Supply To Vdx DC Drain Supply 120pF To Vgm DC Gate Supply To Vdl DC Drain Supply 120pF 120pF 120pF Q OUT I OUT Q OUT I OUT X2X2 RF IN LO IN To Vgx DC Gate Supply To Vdx DC Drain Supply 120pF120pF To Vgm DC Gate Supply To Vdl DC Drain Supply 120pF 120pF 120pF

21-26.5GHz Integrated Down converter CHR3693-99F Ref. : DSCHR36931192 - 11 Jul 11 7/8 Specifications subject to change without notice Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Notes

CHR3693-99F 21-26.5GHz Integrated Down converter Ref. : DSCHR36931192 - 11 Jul 11 8/8 Specifications subject to change without notice Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Recommended ESD management Refer to the application note AN0020 available at http://www.ums-gaas.com for ESD sensitivity and handling recommendations for the UMS products.

Ordering Information

Chip form: CHR3693-99F/00 Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S. . Specifications mentioned in thi s publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use as critical components in life support devices or systems without express written approval from United Monolithic Semiconductors S.A.S.