CHM1291

CHM1291 UMS | Alldatasheet

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Technical content

Ref. : DSCHM12917166 - 15 Jun 07 1/6 Specifications subject to change without notice Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 25-32GHz Single Side Band Mixer GaAs Monolithic Microwave IC

Description

The CHM1291 is a multifunction chip (MFC) which integrates a LO buffer amplifier and a sub- harmonically balanced diodes mixer for 2LO suppression and image rejection. It is usable both for up-conversion and down-conversion. It is designed for a wide range of applications, typically commercial communication systems for broadband local access (LMDS). The backside of the chip is both RF and DC grounded. This helps simplify the assembly process. The circuit is manufactured with a P-HEMT process, 0.25µm gate length, via holes through the substrate, air bridges and electron beam gate lithography. It is available in chip form. Main Features ■ Broadband performance : 25-32GHz ■ 11dB conversion Loss ■ 15dBc image rejection ■ +5dBm LO input power ■ +1dBm input power (1dB gain comp.) ■ Low DC power consumption, 55mA@3.5V ■ Chip size : 2.06 x 1.25 x 0.10mm -44 -40 -36 -32 -28 -24 -20 -16 -12 IF Frequency (GHz) Conv. Loss (dB), LO & 2xLO leakage (dBm) CL sup ( dB ) CL inf ( dB ) Img Supp ( dBc ) P LO @ RF ( dBm ) P 2xLO @ RF ( dBm ) Main Characteristics Tamb=+25° C Symbol Parameter Min Typ Max Unit FRF RF frequency range 25 32 GHz FLO LO frequency range 12 15.5 GHz FIF IF frequency range 0.1 3 GHz Lc Conversion Loss 11 15 dB ESD Protection : Electrostatic discharge sensitive device. Observe handling precautions ! Up-Conversion supradyne mode with external combiner P LO=+5dBm F LO=14GHz

CHM1291 25-32GHz SSB Mixer Ref. : DSCHM12917166 - 15 Jun 07 2/6 Specifications subject to change without notice Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Electrical Characteristics for Broadband Operation Tamb=+25° C, Vd=3.5V, Id=55mA Symbol Parameter Min Typ Max Unit FRF RF frequency range 25 32 GHz FLO LO frequency range 12 15.5 GHz FIF IF frequency range 0.1 3 GHz Lc Conversion Loss 11 15 dB PLO LO Input power +5 dBm 2xLO Leak 2xLO Leakage (for P LO =+5dBm) -35 -30 dBm Img Rej Image Rejection (1) 13 15 dBc P1dB Input power at 1dB gain compression -2 0 dBm P03 Input power at 3dB gain compression 0 +2 dBm IP3 Input 3 rd order intercept point +8 dBm LO Match LO VSWR (2) 2.0:1 RF Match RF VSWR (2) 2.0:1 IF Match IF VSWR (2) 2.0:1 Id Bias current 55 mA (1) With external quadrature hybrid coupler (reference on request). The minimal value depends on the quality of the external quadrature combiner. (2) A bonding wire of typically 0.1 to 0.15nH will improve the accesses matching. Current source biasing network is recommended. Absolute Maximum Ratings Tamb=+25° C (1) Symbol Parameter Values Unit Vd Drain bias voltage 4.0 V Id Drain bias current 100 mA Ta Operating temperature range -40 to +85 ° C Tstg Storage temperature range -55 to +155 ° C (1) Operation of this device above anyone of these parameters may cause permanent damage. (2) Duration < 1s.

25-32GHz SSB Mixer CHM1291 Ref. : DSCHM12917166 - 15 Jun 07 3/6 Specification s subject to change without notice Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Typical On-wafer Measurements in Up-Conversion mode with external IF quadrature combiner Bias conditions: Tamb=+25° C, Vd=3.5V, Id=55mA -44 -40 -36 -32 -28 -24 -20 -16 -12 IF Frequency (GHz) Conv. Loss (dB), LO & 2xLO leakage (dBm) CL sup ( dB ) CL inf ( dB ) Img Supp ( dBc ) P LO @ RF ( dBm ) P 2xLO @ RF ( dBm ) -44 -40 -36 -32 -28 -24 -20 -16 -12 IF Frequency (GHz) Conv. Loss (dB), LO & 2xLO leakage (dBm) CL sup ( dB ) CL inf ( dB ) Img Supp ( dBc ) P LO @ RF ( dBm ) P 2xLO @ RF ( dBm ) -54 -50 -46 -42 -38 -34 -30 -26 -22 -18 -14 -10 12 12,5 13 13,5 14 14,5 15 15,5 16 LO Frequency (GHz) Conv. Loss (dB), LO & 2xLO leakage (dBm) CL sup ( dB ) CL inf ( dB ) Img Supp (dBc) P LO @ RF ( dBm ) P 2xLO @ RF ( dBm ) -54 -50 -46 -42 -38 -34 -30 -26 -22 -18 -14 -10 12 12,5 13 13,5 14 14,5 15 15,5 16 LO Frequency (GHz) Conv. Loss (dB), LO & 2xLO leakage (dBm) CL sup ( dB ) CL inf ( dB ) Img Supp (dBc) P LO @ RF ( dBm ) P 2xLO @ RF ( dBm ) Typical On-wafer Compression Measurements in Up-Conversion mode with external IF quadrature combiner Bias conditions: Tamb=+25° C, Vd=3.5V, Id=55mA -30 -28 -26 -24 -22 -20 -18 -16 -14 -12 -10 -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 2 4 6 IF Input power (dBm) Output power & Conv. Loss (dBm & dB) P RF 30GHz CL 30GHz -30 -28 -26 -24 -22 -20 -18 -16 -14 -12 -10 -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 2 4 6 IF Input power (dBm) Output power & Conv. Loss (dBm & dB) P RF 26GHz CG 26GHz Up-Conversion supradyne mode with external combiner P LO=+5dBm F LO=14GHz Up-Conversion infradyne mode with external combiner P LO=+5dBm F LO=14GHz Up-Conversion supradyne mode with external combiner P LO=+5dBm F IF=2,0GHz Up-Conversion infradyne mode with external combiner P LO=+5dBm F IF=2,0GHz Up-Conversion supradyne mode with external combiner LO=14GHz P LO=+5dBm F IF=2,0GHz (RF=30GHz) Up-Conversion infradyne mode with external combiner LO=14GHz P LO=+5dBm F IF=2,0GHz (RF=26GHz)

CHM1291 25-32GHz SSB Mixer Ref. : DSCHM12917166 - 15 Jun 07 4/6 Specifications subject to change without notice Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Typical On-wafer Measurements in Down-Conversion mode with external IF quadrature combiner Bias conditions: Tamb=+25° C, Vd=3.5V, Id=55mA -34 -32 -30 -28 -26 -24 -22 -20 -18 -16 -14 -12 -10 21,5 22,0 22,5 23,0 23,5 24,0 24,5 25,0 25,5 26,0 26,5 RF Frequency (GHz) Conversion Loss (dB) CL I Sup ( dB ) CL I Inf ( dB ) CL Q Sup ( dB ) CL Q Inf ( dB ) F LO -34 -32 -30 -28 -26 -24 -22 -20 -18 -16 -14 -12 -10 25,5 26,0 26,5 27,0 27,5 28,0 28,5 29,0 29,5 30,0 30,5 RF Frequency (GHz) Conversion Loss (dB) CL I Sup ( dB ) CL I Inf ( dB ) CL Q Sup ( dB ) CL Q Inf ( dB ) F LO -34 -32 -30 -28 -26 -24 -22 -20 -18 -16 -14 -12 -10 29,5 30,0 30,5 31,0 31,5 32,0 32,5 33,0 33,5 34,0 34,5 RF Frequency (GHz) Conversion Loss (dB) CL I Sup ( dB ) CL I Inf ( dB ) CL Q Sup ( dB ) CL Q Inf ( dB ) F LO -54 -50 -46 -42 -38 -34 -30 -26 -22 -18 -14 -10 12 12,5 13 13,5 14 14,5 15 15,5 16 LO Frequency (GHz) Conv. Loss (dB), LO & 2xLO leakage (dBm) CL I Sup ( dB ) CL I Inf ( dB ) CL Q Sup ( dB ) CL Q Inf ( dB ) P LO @ RF ( dBm ) P 2xLO ( dBm ) Typical On-wafer Measurements in Down-Conversion mode without external IF quadrature combiner Bias conditions: Tamb=+25° C, Vd=3.5V, Id=55mA -58 -54 -50 -46 -42 -38 -34 -30 -26 -22 -18 -14 -10 0 1 2 3 4 5 6 7 IF Frequency (GHz) Conv. Loss (dB) LO & 2LO leakage (dBm) CL I Sup ( dB ) CL Q Sup ( dB ) P LO @ IF ( dBm ) P 2XLO @ IF ( dBm ) -58 -54 -50 -46 -42 -38 -34 -30 -26 -22 -18 -14 -10 0 1 2 3 4 5 6 7 IF Frequency (GHz) Conv. Loss (dB) LO & 2LO leakage (dBm) CL I Inf ( dB ) CL Q Inf ( dB ) P LO @ IF ( dBm ) P 2XLO @ IF ( dBm ) Down-Conversion mode with external combiner P LO=+5dBm F LO=12GHz Down-Conversion mode with external combiner P LO=+5dBm F LO=14GHz Down-Conversion mode with external combiner P LO=+5dBm F LO=16GHz Down-Conversion mode with external combiner P LO=+5dBm F IF=2,0GHz Down-Conversion supradyne mode without external combiner F LO=13GHz P LO=+5dBm F RF=26 to 33GHz Down-Conversion infradyne mode without external combiner F LO=15GHz P LO=+5dBm F RF=23 to 29GHz

25-32GHz SSB Mixer CHM1291 Ref. DSCHM12917166 - 15 Jun 07 5/6 Specifications s ubject to change without notice Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Chip Assembly and Mechanical Data Note : Supply feed should be capacitively bypassed. 25µm diameter gold wire is recommended Bonding pad positions ( Chip thickness : 100µm. All dimensions are in micrometers )

CHM1291 25-32GHz SSB Mixer Ref. : DSCHM12917166 - 15 Jun 07 6/6 Specifications subject to change without notice Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09

Ordering Information

Chip form : CHM1291-99F/00 Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S. . Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use as critical components in life support devices or systems without express written approval from United Monolithic Semiconductors S.A.S.