XC9248 TOREX | Alldatasheet
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18V Driver Transistor Built-In Synchronous Step-Down DC/DC Converter ç ˙GENERAL DESCRIPTION The XC9248 series is 18V bootstrap synchronous step-down DC/DC converter with built-in Nch-Nch driver transistors. With an input voltage range from 4.5V to 18V and a maximum out put current of 2.2A, the series is suitable for digital home appliance power supplies and can be used with small ceramic capacitors. The series has a 0.8V reference voltage, and using externally connected resistors, the output voltage can be set freely from 1.0V to 12V. The control method is synchronous PWM (Source/ Sink). The soft start time is internally set to 2.8ms (TYP.), also can be adjusted using external capacitor. With UVLO (Under Voltage Lock Out) function, the internal dr iver transistors are forced OFF when input voltage falls down below 3.8V (TYP.). The series includes over current protection, V OUT short-circuit protection, Lx short-circuit protection, V OUT overvoltage protection and thermal shutdown. ˙APPLICATIONS ˔Digital home appliance ˔Office automation equipment ˔Notebook computers ˔Car accessories power supplies ˙TYPICAL APPLICATION CIRCUIT ETR05022-004 ˙FEATURES Input Voltage ： 4.5V ～ 18V Output Voltage ： 1.0V～12V (VFB=0.8V±1.5%) (*1) Output Current ： 2.2A Efficiency ： 93.8% (*1) @VIN=12V,VOUT=5V, IOUT=700mA Oscillation Frequency ： 500kHz Maximum Duty Cycle ： 79% Soft-Start Time ： Fixed2.8ms, set by external capacitor Protection Circuit ： UVLO High side over current protection Low side over current protection V OUT Short-circuit Protection LX Short-circuit Protection VOUT Over voltage protection Thermal shutdown Package ： SOP-8FD Environmentally Friendly ： EU RoHS Compliant, Pb Free (*1) Performance depends on external components and wiring on the PCB. Efficiency vs. Output Current ˙TYPICAL PERFORMANCE CHARACTERISTICS L VOUTVIN EN CSSCIN CBST CVL CL CFB RFB1 RFB2 VIN EN SS FB LX GND BST VL Ta=25°C 100 0 500 1000 1500 2000 Output Current : I OUT [mA] Efficiency [%] VIN=12V , VOUT=3.3V VIN=12V , VOUT=5V
˙BLOCK DIAGRAM * Internal diodes include an ESD protection diode and a parasitic diode. ˙PRODUCT CLASSIFICATION ˔Ordering Information XC9248①②③④⑤⑥-⑦ (*1) The “-G” suffix denotes Halogen and Antimony free as well as being fully RoHS compliant.
- Selection Guide (*1) The over-current protection latch is an integral latch type. (*2) To prevent an extremely large rush current from flowing in th e event that Lx is short-circui ted, both the A & B types have an Lx short protection latch function. DESIGNATOR ITEM SYMBOL DESCRIPTION A ① TYPE B Refer to Selection Guide ②③ FB Voltage 08 FB voltage is fixed in 0.8V ④ Oscillation Frequency 5 500kHz ⑤⑥-⑦ (*1) Package QR-G SOP-8FD (1,000/Reel) TYPE CURRENT LIMITER LATCH FOR CURRENT LIMITER LATCH FOR VOUT-SHORT LATCH FOR LX-SHORT (*2) A YES YES (*1) YES YES B YES NO NO YES TYPE ENABLE UVLO CL AUTO-DISCHARGE THERMAL SHUTDOWN A YES YES YES YES B YES YES YES YES
˙PIN CONFIGURATION çççççççççççççççççççççççç ˙PIN CONFIGURATION ˙FUNCTION (*1) On the XC9248 series, causes unspecified behavior and thus is prohibited. PIN NUMBER PIN NAME FUNCTIONS
1 VIN Power Input
2 EN Enable
3 SS External Soft-start
4 FB FB Voltage Monitor
5 VL Internal Regulator Output
6 BST Pre Driver Supply
7 GND Ground
8 LX Switching Output
(*1) * The dissipation pad for the SOP-8FD package should be solder-plated in recommended mount pattern and metal masking so as to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the GND (No.7) pin. SOP-8FD (TOP VIEW) VIN 1 EN 2 SS 3 FB 4 8 LX
7 GND
6 BST
˙ABSOLUTE MAXIMUM RATINGS Ta=25ˆ PARAMETER SYMBOL RATINGS UNITS VIN Pin Voltage V IN -0.3 ～ +20 V EN Pin Voltage V EN -0.3 ～ +20 V LX Pin Voltage V LX -0.3 ～ V IN +0.3 or +20 (*1) V BST Pin Voltage V BST VL-0.3～VL+20 VLX -0.3～ V LX +5.5 V VL Pin Voltage V VL -0.3 ～ V IN +0.3 or +5.5 (*2) V FB Pin Voltage V FB -0.3 ～ +5.5 V SS Pin Voltage V SS -0.3 ～ +5.5 V LX Pin Current I LX ±5 A VL Pin Current I VL 85 mA Power Dissipation Pd 300 mW Operating Ambient Temperature Topr -40～+105 °C Storage Temperature Tstg -50～+125 °C All voltages are described based on the ground voltage. (*1) The maximum value should be either VIN+0.3 or +20V in the lowest. (*1) The maximum value should be either VIN+0.3 or +5.5V in the lowest.
˙ELECTRICAL CHARACTERISTICS XC9248 Series Ta=25 ˆ PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS CIRCUIT Operating Voltage Range V IN When connected to external components VIN ≦7V: Setup VOUT=3.3V VIN >7V: Setup VOUT=5V 4.5 - 18 V ① FB Voltage Temperature Characteristics VFB/ (VFB・ΔTopr) -40℃≦Topr≦105℃ ±40 ppm/℃ ② Maximum Output Current I OUTMAX When connected to external components 2.2 (*1) - - A ① Supply Current I q V IN=VEN=18V, VFB=0.9V - 0.76 1.10 mA ③ Stand-by Current I STB V IN=18V, VEN=0V, VFB=OPEN - 38 51 ЖAç ③ Oscillation Frequency f OSC V FB=0.7V, VSS=OPEN 450 500 550 kHz ② Maximum Duty Cycle D max V FB=0.7V, VSS=OPEN 74 79 - % ② UVLO Detection Voltage V UVLOD VIN=Sweep (4.5V→3.5V) , VEN=2V, VFB=0.9V Voltage when VL pin changes from “H” level to “L” level (*2) 3.50 3.80 4.45 V ④ UVLO Release Voltage V UVLOR VIN=Sweep (3.5V→4.5V), VEN=2V, VFB=0.9V Voltage when VL pin changes from “L” level to “H” level (*2) 3.55 3.90 4.50 V ④ Low side Current Limit I LIMLS VOUT=4.5V (Forced), Bottom point of LX pin current 2.1 - - A ⑦ Integral Latch Time (Type A) tLAT VFB=0.9V, ILX = ILIMLS Time until SS pin changes from “H” level to “L” level (*2) 0.4 1.1 1.8 ms ⑤ Internal Soft-start Time t SS VIN=12V, VEN=2V, VFB=0.72V, VSS=OPEN Time until LX pin oscillates - 2.8 - ms ② SS Terminal Current I SS V SS=0V, VLX=VFB=OPEN 2 4 6 ЖAç ⑥ SS Threshold Voltage V SSTH VFB=0.72V, VSS=OPEN Voltage when LX pin oscillates 1.2 1.8 2.4 V ② OVP Detection Voltage V OVPD V FB=Sweep (0.788V→1.2V), VSS=OPEN - 0.9 1.2 V ② Efficiency EFFI (*3) Setup VOUT=5V, IOUT=0.7A When connected to external components - 93.8 - % ⑧ Lx SW ”H” ON Resistance R LXH - 0.12 (*4) - Ω - Lx SW ”L” ON Resistance R LXL - 0.12 (*4) - Ω - EN ”H” Voltage V ENH VIN=12V, VFB=0.9V, VEN=Sweep (0.2V→1.4V) Voltage when VL pin changes from “L” level to “H” level (*2) 1.4 - - V ④ EN ”L” Voltage V ENL VIN=12V, VFB=0.9V, VEN=Sweep (1.4V→0.2V) Voltage when VL pin changes from “H” level to “L” level (*2) - - 0.2 V ④ LX ”L” Current ILXL V IN=18V , VEN=VLX=0V , VFB=VSS=OPEN -1 0 - ЖAçᶈ EN ”H” Current IENH V IN=VEN=18V , VLX=VFB=VSS=OPEN - 16 21 ЖAçᶈ EN ”L” Current IENL V IN=18V , VEN=0V , VLX=VFB=VSS=OPEN -0.1 - 0.1 ЖAçᶈ FB ”H” Current IFBH V IN=18V , VEN=0V , VFB=5V , VLX=VSS=OPEN -0.1 - 0.1 ЖAçᶈ FB ”L” Current IFBL V IN=18V , VEN=VFB=0V , VLX=VSS=OPEN -0.1 - 0.1 ЖAçᶈ Thermal Shutdown Temperature TTSD ç - 150 - °C - Hysteresis Width THYS ç - 25 - °C - CL Discharge Resistance RDCHG V IN=12V , VEN=0V , VLX=2V , VFB=VSS=OPEN - 300 - Њ ᶈ CL Discharge Current IDCHG V IN=12V , VEN=0V , VLX=12V , VFB=VSS=OPEN - 9 - mA ᶈ Unless otherwise stated, V IN=VEN=12V (*1) Mount conditions affect heat dissipation. Maximum output current is not guaranteed when Thermal Shutdown starts to operate earlier. (*2) (*3) EFFI = {[(output voltage)×(output current)]÷[(input voltage)×(input current)]}×100 (*4) Design value
■TEST CIRCUITS CIRCUIT① CIRCUIT② CIRCUIT③ CIRCUIT④ CIRCUIT⑤ CIRCUIT⑥ CIRCUIT⑦ CIRCUIT⑧ VIN GND EN LX BST FB VL SS CBST L CL CVL CIN CIN : 10μF 2parallel(ceramic) CVL : 0.1μF(ceramic) CBST : 0.1μF(ceramic) CL : 22μF 2parallel(ceramic) CFBRFB1 RFB2 L : 6.8μH R FB1 : 43kΩ RFB2 : 8.2kΩ CFB : 470pF VOUT Wave Form Measurement Point (Current Probe)
˙TYPICAL APPLICATION CIRCUIT ç ç ç ç ç ç ç ç ç ç ç ç ç 【Typical Examples】 MANUFACTURER PART NUMBER VALUE TDK CLF10040T100N 10μH TDK CLF7045T6R8N 6.8μH TAIYO YUDEN NR6045T4R5M 4.5μH L TAIYO YUDEN NR6028T2R2N 2.2μH C2012X5R1E106K 10μF/25V 2parallel CIN (*1) TDK C3216X7R1E106K 10μF/25V 2parallel C2012X5R1A226M 22μF/10V 2parallel C3216X5R1E226M 22μF/25V 2parallel C3225X7R1C226M 22μF/16V 2parallel CL (*1) TDK C4532X7R1E226M 22μF/25V 2parallel CSS 0.1μF (*2)/10V CBST 0.1μF/10V CVL 0.1μF/10V (*1) Select components appropriate to the usage conditions (ambient temperature, input & output voltage). (*2) For the coil capacitance value, please refer to P.8 < External soft-start setting >. <Coil current setting > For stable operation by current feedback control, the XC9248 series is optimum when the peak-to-peak current (Ipk) in the coil is set approximately between 0.5A to 1A. The Ipk value can be calculated by using the following equation: Ipk[A] = (VIN－VOUT ) × VOUT / VIN / 0.5 / L[μH] ç L : Coil Inductance ç 【Examples】 VIN[V] VOUT[V] L[μH] Ipk[A] 5.0 1.0 2.2 0.73 5.0 2.5 3.3 0.76 12.0 3.3 6.8 0.70 12.0 5.0 6.8 0.86 18.0 5.0 10.0 0.72 18.0 12.0 10.0 0.80
˙TYPICAL APPLICATION CIRCUIT (Continued) ç <VOUT setting> The output voltage can be set by connecting external dividing resistors. The output voltage is determined by the values of R FB1 and RFB2 as given in the equation below. The total of R FB1 and RFB2 should be less than 150kΩ. Output voltage range can be set freely from 1.0V to 12V with a 0.8V reference voltage. ç VOUT=0.8×(RFB1+RFB2)/RFB2 ç Adjust the value of the phase compensation speed-up capacitor CFB so that fzfp=1 / (2 × π × CFB x RFB1) is about 7kHz. Adjustments are required from 5kHz to 50kHz depending on t he application, value of inductance (L), and value of load capacitance (CL). ç 【Examples】 RFB1=47kΩ, RFB2=15kΩ, VOUT=0.8V×(47kΩ+15kΩ) /15kΩ =3.3V CFB=470pF, fzfb=1/(2×π×470pF×47kΩ)=7.2kHz ç < Minimum VOUT > The Minimum VOUT is set by MINDUTY. The MINDUTY changes by the external inductance(L). For the L value, please choose the optimal value – see P.7 <Coil current setting>. The Minimum V OUT can be calculated by using the following equation: VOUT= VIN × MINDUTY / 100 【L vs. MINDUTY】 L[μH] MINDUTY[%] 2.2 18 3.3 20 4.7 21 6.8 21 10 22 <External soft-start setting> A capacitor can be connected to the SS pin to set a time longer than the internal soft-start time voluntarily. By setting the EN pin to the V ENH voltage or higher, a current ISS=4μA (TYP.) flows to the SS pin and charges the capacitor. When the SS pin voltage attains the SS threshold voltage VSSTH=1.8V (TYP .), the output voltage reaches about 90% of the set voltage. External soft-start can be calculated by using the following equation: ç External soft-start time=VSSTH × CSS / ISS 【Examples】 CSS=0.1μF, External soft-start time=1.8V × 0.1μF / 4μA × 1000=45ms ç ç ç ç ç ç ç ç ç ç ç ç ç ç CSS External soft-start time 0.01 μF 0.047 μF 0.1 μF 0.47 μF μF 4.7 μF 4.5ms 20ms 45ms 200ms 450ms 2000ms
˙OPERATIONAL EXPLANATION ç The XC9248 series consists of a reference voltage source, an internal reference voltage source, ramp wave circuit, error amplifier, PWM comparator, phase compensation circuit, Nch MO S driver transistor, current limiter circuit, UVLO, short protection circuit, thermal shutdown circuit, over voltage protection and others. (See the block diagram below.) By using the error amplifier, the FB pin voltage is compared with the internal reference voltage. The signal is input into the PWM comparator to determine the on time of switching. The si gnal from the error amplifier is compared with the ramp wave from the ramp wave circuit, and the resulting output is delivered to the output buffer circuit to provide on-time of the duty cycle at the LX pin. This process is continuously performed to ensure stable output voltage. The current feedback circuit monitors the Nch MOS driver tr ansistor current for each switch ing operation, and modulates the error amplifier output signal to provide multiple feedback si gnals. This enables a stable feedback loop even when using a low ESR capacitor such as ceramic, which results in ensuring stable output voltage. ç XC9248 Series ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç <Reference Voltage Source> The reference voltage source provides the reference voltage to ensure stable output voltage of the DC/DC converter. <Ramp Wave Circuit> The ramp wave circuit determines switching frequency. The fr equency is fixed 500kHz internally. Clock pulses generated in this circuit are used to produce ramp waveforms needed for PWM operation, and to synchronize all the internal circuits. <Error Amplifier> The error amplifier is designed to monito r output voltage. The amplifier compares the reference voltage with the feedback voltage. When a voltage lower than the refer ence voltage is fed back, t he output voltage of the error amplifier increases. The gain and frequency characteristics of the erro r amplifier output are fixed internally to deliver an optimized signal to the mix er. The error amplifier output signal optimized in the mixer is modulated with the current feedback signal. This signal is delivered to the PWM comparator. ç ç ç ç ç ç ç ç ç
˙OPERATIONAL EXPLANATION (Continued) ç <Current limiting> The current limiting circuit of the XC9248 series monitors the current that flows through the Low side and High side Nch MOS driver Tr, and when over-current is detected, the current limiting function activates. ① Low side driver current limiting The current in the Low side driver Tr. is detected to equivalently monitor the bottom value of the coil current. The Low side driver current limiting function prohibits the High side driver Tr. from turning on in an over-current state where the bottom value of the coil current is higher than the Low side driver current limit value ILIMLS. Control to lower the switching frequency f OSC is also performed. When the over-curre nt state is released, normal operation resumes. ② High side driver current limiting + Low side driver current limiting The current in the High side driver Tr. is detected to equivalently monitor the peak value of the coil current. The High side driver current limiting function forcibly turns off the High side driver Tr. when the peak value of the coil curr ent reaches the High side driver current limit value ILIMHS. ILIMLS < ILIMHS is set inside the IC, and therefore the Low side driver current limiting function of ① above also detects the over-current state at this ti me. When the over-current state is released, normal operation resumes. ③ Over-current latch (Type A) Type A turns off the High side and Low side driver transistors when state ① or ② continues for 1.1 ms (TYP.). The LX pin is in the CL discharged state, and is latch-stopped at the GND level (0V). The latch-stopped state only stops the pulse output from the Lx pin; the internal circuitry of the IC continues to operate. To restart after latch-stopping, L level and then H level must be input into the EN pin, or V IN pin re-input must be performed (after lowering the voltage below the UVLO detection voltage) to resume operation by soft start. The over-current latch function may occasionally be released fr om the current limit detection st ate by the effects of ambient noise, and it may also happen that the latch time becomes longer or latching does not take place due to board conditions. For this reason, place the input capacitor as close as possible to the IC. Type B is an automatic recovery type that performs the operation of ① or ② until the over-current state is released. Low side driver current limit value I LIMLS=2.1A (MIN.) High side driver current limit value ILIMHS=4.1A (TYP .) ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç
˙OPERATIONAL EXPLANATION (Continued) ç <Thermal Shutdown> For protection against heat damage of the ICs, thermal shutdown function moni tors chip temperature. The thermal shutdown circuit starts operating and the Nch MOS driver transistor will be turned off when the chip’s temperature reaches 150℃. The LX pin enters the CL discharged state and stops functioning at GND level (0V). When the temperature drops to 125℃ or less after shutting of the current flow, the IC performs the soft-start function to initiate output startup operation. <UVLO Circuit> When the VIN voltage becomes 3.8V (TYP.) or lower, the Nch MOS driver transistor is forced OFF. The L X pin enters the CL discharged state and stops functionin g at GND level (0V). When the V IN voltage becomes 3.9V (TYP.) or higher, switching operation takes place. By releasing the UVLO function, the IC performs the soft-start function to initiate output startup operation. The soft-start function operates even when the VIN voltage falls momentarily below the UVLO detect voltage. The UVLO circuit does not cause a complete shutdown of t he IC, but causes pulse output to be sus pended; therefore, the internal circuitry remains in operation. ç <Bootstrap method> An Nch MOS driver Tr. is used for the High side driver, and a voltage higher than the VIN voltage is needed to turn the driver on. For that purpose, the bootstr ap method is used to generate a voltage higher than the V IN voltage. The C BST capacitance is connected between BST and LX, and because the VLX voltage is lower than the 4.6V (TYP.) VL voltage that is the internal power supply, CBST is charged from VL. <VOUT short-circuit protection> With the A type, when the output voltage VOUT is shorted to GND or is near a shorted state (the FB voltage is1/2 or lower), and a current over the current limit flows to the High side or Low side driver Tr., a VOUT short circuit is detected and the High side and Low side driver Trs. are immediately turned off and latched. The LX pin enters the CL discharged state and stops functioning at GND level (0V). Once in the latched state, operation is resumed by either turning the IC off and restarting with the EN pin, or by re-input into the VIN pin (the voltage is lowered below the under-voltage lockout detection voltage once). <LX short-circuit protection> If the event that the L X pin shorts to GND, L X short-circuit protection activates for pr otection from over-current due to rush current and to protect the IC. If the LX pin shorts to GND, High side current limiting will activate due to rush current when the High side driver Tr. turns on. The High side driver Tr. turn offs, and the Low side driver Tr. turns on at the same time. At this time, if Low side current li miting did not activate, an L X short-circuit is detected, and the Low side driver is turned off and la tched at the same time as the High side driver Tr. Once in the latched state, operation is resumed by either turning the IC off and restarting with the EN pin, or by re-input into the VIN pin (the voltage is lowered below the under-voltage lockout detection voltage once). <VOUT over-voltage protection> To minimize output voltage overshoot, V OUT over-voltage protection activates when V OUT overshoot occurs due to the output resistance changing from a heavy load to a light load or otherwise. When VOUT overshoot occurs and the FB voltage that senses VOUT rises to 0.9V (TYP .) or more, the High side driver Tr. is immediately turned off and the Low side driver Tr. is turned on to prevent VOUT overshoot. When the FB voltage falls to 0.8V (TYP.) or less due to hysteresis, the High side driver Tr. turns on at the next clock cycle. ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç
˙OPERATIONAL EXPLANATION (Continued) ç <CL high-speed discharge function> When L level is input into the EN pin and the IC enter s the standby state, the char ge on the output capacitor C L can be discharged at high speed with the Nch MOS switch Tr. incorporated between L X and GND. This enables the prevention of application malfunctioning due to CL charge remaining when the IC stops. The CL discharge time can be calculated from the equation below. Note that the equation varies depending on the set voltage VOUT(E). (1) Equation when the set voltage VOUT(E) is 1V to 4V. The CL discharge time is determined by C L and R DCHG. If the time constant of C L and R DCHG is τ(τ= CL×RDCHG), the output voltage discharge time can be calculated by using the following equation: ç V = VOUT(E) × e -t / τ or t = τln ( VOUT(E) / V ) V : Output voltage after discharge VOUT(E) : Output voltage t : Discharge time τ: CL×RDCHGç ç (2) Equation when the set voltage VOUT(E) is 4.1V to 12V. The CL discharge time is determined by constant current until VOUT(E) is 4 V. When 4V or less, it is determined by CL and RDCHG as in (1). If τ(τ= CL×RDCHG) is the time constant of CL and RDCHG and the CL discharge current is IDCHG, the discharge time of the output voltage can be calculated by using the following equation: t = τln ( 4 / V ) + CL × (VOUT(E) - 4) / IDCHG V : Output voltage after discharge VOUT(E) : Output voltage, t: Discharge time τ: CL×RDCHG IDCHG : CL : Discharge time ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç
˙NOTE ON USE 1. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be exceeded. 2. The DC/DC converter characteristics depend greatly on the externally connected components as well as on the characteristics of this IC, so refer to the specifications and typical standard circuit examples of each component when carefully considering which components to select. Be especially careful of the capacitor characteristics and use B characteristics (JIS standard) or X7R, X5R (EIA standard) ceramic capacitors. 3. Where wiring impedance is high, operations may become unstable due to noise and/or phase lag depending on output current. Please wire the input capacitor (CIN) and the output capacitor (CL) as close to the IC as possible. ç 4. This IC monitors Peak to Peak current in the coil by means of a Low side driver current limiting circuit and a High side driver current limiting circuit. The Peak to Peak current varies depending on the difference between the input voltage and the output voltage as well as the L value of the coil and thus, in some cases, current limiting may activate too frequently and cause operation to become unstable or the current may not reach the maximum output current. 5. With the A type, when a sharp load fluctuation occurs, the VOUT voltage drop is conveyed directly to the FB pin through CFB, and short-circuit protection may activate at a voltage higher than 1/2 the VOUT voltage. 6. The VL pin is the output of the internal regulator for operation of the DC/DC control block. For stable operation, always connect an external capacitor CVL to the VL pin. Do not use the VL pin for external power supply, as it has been optimized as a local power supply. 7. With this IC, operation may become unstable at the minimum operating voltage or less. 8. Make sure that the absolute maximum ratings of the external components and of this IC are not exceeded. 9. Torex places an importance on improving our products and their reliability. We request that users incorporate fail-safe designs and post-aging protec tion treatment when using Torex products in their systems. ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç
˙NOTE ON USE (Continued) ç 10. Instructions for pattern layouts (1) In order to stabilize VIN voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as possible to the VIN and GND pins. (2) Please mount each external component as close to the IC as possible. (3) Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit impedance. (4) Make sure that the GND traces are as thick as possible, as variations in ground potential caused by high ground currents at the time of switching may result in instability of the IC. (5) Internal driver transistors bring on heat because of the output current (IOUT) and ON resistance of the Nch MOS driver transistors. ç ç <Reference Pattern Layout>ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç PCB mountedç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç ç st Layer 2 nd Layer
■TYPICAL PERFORMANCE CHARACTERISTICS (1) Efficiency vs. Output current (2) Output Voltage vs. Output Currnt XC9248(VIN=12V , VOUT=3.3V) 100 1 10 100 1000 10000 Output Current :IOUT[mA] Efficiency :EFFI[%] L=6.8μF(CLF7045T6R8N) CIN=10μF×2(C2012X5R1E106K), CL=22μF×2(C2012X5R1A226K) XC9248(VIN=12V , VOUT=5V) 100 1 10 100 1000 10000 Output Current :IOUT[mA] Efficiency :EFFI[%] L=6.8μF(CLF7045T6R8N) CIN=10μF×2(C2012X5R1E106K), CL=22μF×2(C2012X5R1A226K) XC9248(VIN=9V , VOUT=4V) 100 1 10 100 1000 10000 Output Current :IOUT[mA] Efficiency :EFFI[%] L=4.5μF(NR6045T4R5M) CIN=10μF×2(C2012X5R1E106K), CL=22μF×2(C2012X5R1A226K) XC9248(VIN=12V , VOUT=3.3V) 3.20 3.22 3.24 3.26 3.28 3.30 3.32 3.34 3.36 3.38 3.40 1 10 100 1000 10000 Output Current :IOUT[mA] Output Voltage : VOUT[V] L=6.8μF(CLF7045T6R8N) CIN=10μF×2(C2012X5R1E106K), CL=22μF×2(C2012X5R1A226K) XC9248(VIN=12V , VOUT=5V) 4.90 4.92 4.94 4.96 4.98 5.00 5.02 5.04 5.06 5.08 5.10 1 10 100 1000 10000 Output Current :IOUT[mA] Output Voltage : VOUT[V] L=6.8μF(CLF7045T6R8N) CIN=10μF×2(C2012X5R1E106K), CL=22μF×2(C2012X5R1A226K) XC9248(VIN=9V , VOUT=4V) 3.90 3.92 3.94 3.96 3.98 4.00 4.02 4.04 4.06 4.08 4.10 1 10 100 1000 10000 Output Current :IOUT[mA] Output Voltage : VOUT[V] L=4.5μF(NR6045T4R5M) CIN=10μF×2(C2012X5R1E106K), CL=22μF×2(C2012X5R1A226K) XC9248(VIN=5V , VOUT=1V) 100 1 10 100 1000 10000 Output Current :IOUT[mA] Efficiency :EFFI[%] L=2.2μF(NR6028T2R2N) CIN=10μF×2(C2012X5R1E106K), CL=22μF×2(C2012X5R1A226K) XC9248(VIN=5V , VOUT=1V) 0.90 0.92 0.94 0.96 0.98 1.00 1.02 1.04 1.06 1.08 1.10 1 10 100 1000 10000 Output Current :IOUT[mA] Output Voltage : VOUT[V] L=2.2μF(NR6028T2R2N) CIN=10μF×2(C2012X5R1E106K), CL=22μF×2(C2012X5R1A226K)
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (3) Ripple Voltage vs. Output Current (4) FB Voltage vs. Ambient Temperature (5) UVLO Voltage vs. Ambient Temperature (6) Oscillation Frequency vs. Ambient Temperature (7) Supply Cu rrent vs. Ambient Temperature XC9248 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2 4.3 4.4 4.5 -50 -25 0 25 50 75 100 125 Ambient Temperature :Ta[℃] UVLO Voltage :VUVLOD,VUVLOR[V] Detection Release XC9248 0.40 0.45 0.50 0.55 0.60 0.65 0.70 0.75 0.80 -50 -25 0 25 50 75 100 125 Ambient Temperature :Ta[℃] Supply Current :Iq[mA] VIN=4.5V VIN=12V VIN=18V XC9248 450 460 470 480 490 500 510 520 530 540 550 -50 -25 0 25 50 75 100 125 Ambient Temperature :Ta[℃] Oscillation Frequency :fosc[kHz] VIN=4.5V VIN=12V VIN=18V XC9248(VIN=12V , VOUT=3.3V) 1 10 100 1000 10000 Output Current :IOUT[mA] Ripple Voltage :Vr[mV] L=6.8μF(CLF7045T6R8N) CIN=10μF×2(C2012X5R1E106K), CL=22μF×2(C2012X5R1A226K) XC9248 0.788 0.790 0.792 0.794 0.796 0.798 0.800 0.802 0.804 0.806 0.808 0.810 0.812 -50 -25 0 25 50 75 100 125 Ambient Temperature :Ta[℃] FB Voltage :VFB[V] VIN=4.5V VIN=12V VIN=18V XC9248(VIN=12V , VOUT=5V) 1 10 100 1000 10000 Output Current :IOUT[mA] Ripple Voltage :Vr[mV] L=6.8μF(CLF7045T6R8N) CIN=10μF×2(C2012X5R1E106K), CL=22μF×2(C2012X5R1A226K) XC9248(VIN=9V , VOUT=4V) 1 10 100 1000 10000 Output Current :IOUT[mA] Ripple Voltage :Vr[mV] L=4.5μF(NR6045T4R5M) CIN=10μF×2(C2012X5R1E106K), CL=22μF×2(C2012X5R1A226K) XC9248(VIN=5V , VOUT=1V) 1 10 100 1000 10000 Output Current :IOUT[mA] Ripple Voltage :Vr[mV] L=2.2μF(NR6028T2R2N) CIN=10μF×2(C2012X5R1E106K), CL=22μF×2(C2012X5R1A226K)
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (8) Stand-by Current vs. Ambient Temperature (9) Lx SW"L" ON Res istance vs. Ambient Temperature (10) Lx "L" Current vs. Ambient Temperature (11) EN "H" Current vs. Ambient Temperature (12) EN "H" Voltage vs. Ambient Temperature (13) EN "L" Voltage vs. Ambient Temperature (14) Internal Soft-Start Time vs. Ambient Temperature (15) SS Te rminal Current vs. Ambient Temperature XC9248 - 5 0 - 2 50 2 55 07 5 1 0 0 1 2 5 Ambient Temperature :Ta[℃] Stand-by Current :ISTB[μA] VIN=4.5V VIN=12V VIN=18V XC9248 -1.0 -0.8 -0.6 -0.4 -0.2 0.0 0.2 0.4 0.6 0.8 1.0 -50 -25 0 25 50 75 100 125 Ambient Temperature :Ta[℃] Lx "L" Current :ILXL[μA] VIN=4.5V VIN=12V VIN=18V XC9248 1.0 1.5 2.0 2.5 3.0 3.5 4.0 -50 -25 0 25 50 75 100 125 Ambient Temperature :Ta[℃] Internal Soft-Start Time :tSS[ms] VIN=4.5V VIN=12V VIN=18V XC9248 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20 -50 -25 0 25 50 75 100 125 Ambient Temperature :Ta[℃] Lx SW"L" ON Resistance :RLXL[Ω] VIN=4.5V VIN=12V VIN=18V XC9248 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 -50 -25 0 25 50 75 100 125 Ambient Temperature :Ta[℃] EN "H" Voltage :VENH[V] VIN=4.5V VIN=12V VIN=18V XC9248 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 -50 -25 0 25 50 75 100 125 Ambient Temperature :Ta[℃] EN "L" Voltage :VENL[V] VIN=4.5V VIN=12V VIN=18V XC9248 -50 -25 0 25 50 75 100 125 Ambient Temperature :Ta[℃] EN "H" Current :IENH[μA] VIN=4.5V VIN=12V VIN=18V XC9248 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 -50 -25 0 25 50 75 100 125 Ambient Temperature :Ta[℃] SS Terminal Current :ISS[μA] VIN=4.5V VIN=12V VIN=18V
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (16) SS Threshold Voltage vs. Ambient Temperature (17) Load Transient Response VIN=12V, VOUT=3.3V, IOUT=No Load→1000mA V IN=12V, VOUT=3.3V, IOUT=1000mA→No Load VIN=9V, VOUT=4V, IOUT=No Load→1000mA V IN=9V, VOUT=4V, IOUT=1000mA→No Load VIN=5V, VOUT=1V, IOUT=No Load→1000mA V IN=5V, VOUT=1V, IOUT=1000mA→No Load XC9248 XC9248 XC9248 XC9248 XC9248 XC9248 VOUT: 500mV/div IOUT=No Load→1000mA 50μs/div50μs/div VOUT: 500mV/div IOUT=1000mA→No Load L=6.8μF(CLF7045T6R8N) CIN=10μF×2(C2012X5R1E106K), CL=22μF×2(C2012X5R1A226K) L=6.8μF(CLF7045T6R8N) CIN=10μF×2(C2012X5R1E106K), CL=22μF×2(C2012X5R1A226K) L=4.5μF(NR6045T4R5M) CIN=10μF×2(C2012X5R1E106K), CL=22μF×2(C2012X5R1A226K) L=4.5μF(NR6045T4R5M) CIN=10μF×2(C2012X5R1E106K), CL=22μF×2(C2012X5R1A226K) L=2.2μF(NR6028T2R2N) CIN=10μF×2(C2012X5R1E106K), CL=22μF×2(C2012X5R1A226K) L=2.2μF(NR6028T2R2N) CIN=10μF×2(C2012X5R1E106K), CL=22μF×2(C2012X5R1A226K) XC9248 1.2 1.4 1.6 1.8 2.0 2.2 2.4 -50 -25 0 25 50 75 100 125 Ambient Temperature :Ta[℃] SS Threshold Voltage :VSSTH[V] VIN=4.5V VIN=12V VIN=18V VOUT: 500mV/div IOUT=No Load→1000mA 50μs/div50μs/div VOUT: 500mV/div IOUT=1000mA→No Load VOUT: 500mV/div IOUT=No Load→1000mA 50μs/div50μs/div VOUT: 500mV/div IOUT=1000mA→No Load
˙PACKAGING INFORMATION ç ˔SOP-8FD (unit: mm)ç ç ç ç ç ç ç ç ç ˔SOP-8FDç Reference Pattern Layout (unit: mm)çççççççç˔ SOP-8FDç Reference Metal Mask Design (unit: mm) 4.9±0.1 0.22±0.03 (1.27） 0.42±0.09 0.1 BOTTOM VIEW (3.3) 2.41.62 4.88 4.88 2.31.52
˙MARKING RULE ① represents products series ② represents products type ③ represents FB voltage and oscillation frequency ④⑤ represents production lot number ( G , I , J , O , Q , W e x c l u d e d ) * No character inversion used. MARK PRODUCT SERIES MARK PRODUCT SERIES MARK VOLTAGE (V) OSCILLATION FREQUENCY PRODUCT SERIES 5 0.8 500kHz XC9248*085**-G 1 23 4 8 7 6 5 ① ② ③ SOP-8FD
- The products and product specifications cont ained herein are subject to change without notice to improve performance characteristic s. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infri ngement of patents, pat ent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not devel oped, designed, or approved for use with such equipment whose failure of malfuncti on can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transpor t; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this dat asheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD.