CHR3693-QDG

CHR3693-QDG_15 UMS | Alldatasheet

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Technical content

Ref. : DSCHR3693QDG2181 - 29 Jun 12 1/14 Specifications subject to change without notice United Monolithic Semiconductors S.A.S. Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 21-26.5GHz Integrated Down converter GaAs Monolithic Microwave IC in SMD package

Description

The CHR3693-QDG is a multifunction chip, which integrates a balanced cold F ET mixer, a time two multiplier, and a RF self biased LNA. It is designed for a wide range of applications, typically commercial communication systems. The circuit is manufactured with a pHEMT process, 0.25µm gate length, via holes through the substrate and air bridges. It is supplied in lead-free SMD package. Main Features Conversion gain (Inf. & Sup. Mode) F_FI=3GHz F_FI=2GHz Q (supradyne) I (infradyne) F_FI=3GHz F_FI=2GHz Q (supradyne) I (infradyne) F_FI=3GHz F_FI=2GHz Q (supradyne) I (infradyne) F_FI=3GHz F_FI=2GHz Q (supradyne) I (infradyne) ■ Broadband performance 21-26.5GHz ■ 14dB gain ■ -5dBm input IP3 ■ 18dBc image rejection ■ DC bias: Vd=4.0Volt@Id=160mA ■ 24LQFN4x4 ■ MSL Level: 1 Main Electrical Characteristics Tamb.= +25°C, Vdx=Vdl=4.0V, Vgx=-0.9V, Vgm=-0.7V Symbol Parameter Min Typ Max Unit F_RF RF frequency range 21 26.5 GHz F_LO LO frequency range 9 14 GHz F_IF IF frequency range DC 3.5 GHz Gc Conversion gain 12 14 dB ESD Protection: Electrostatic discharge sensitive device. Observe handling precautions! UMS R3693 YYWW

CHR3693-QDG 21-26.5GHz Integrated Down converter Ref. : DSCHR3693QDG2181 - 29 Jun 12 2/14 Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34

Electrical Characteristics

Tamb.= +25°C, Vdx=Vdl = +4.0V, Vgx=-0.9V, Vgm=-0.7V Symbol Parameter Min Typ Max Unit F_RF RF frequency range 21 26.5 GHz F_LO LO frequency range 9 14 GHz F_IF IF frequency range DC 3.5 GHz Gc Conversion gain 12 14 dB NF Noise Figure for IF>0.1GHz 2 2.5 dB P_LO LO Input power 2 5 dBm Img Sup Image Suppression(1) 15 18 dBc IIP3 Input IP3 -2 dBm LO_RL LO return loss -9 -7 dB RF_RL RF return loss (21 to 24GHz) RF return loss (24 to 26.5GHz) -12 dB dB LO/RF Isolation LO  RF 45 dBc 2LO/RF Isolation 2LO  RF 35 dBc Id Bias current(2) (Idl + Idx) 120 160 200 mA (1) With external I/Q 90° hybrid coupler (2) Typically, Idl= 90mA, Idx=70mA These values are representative of onboard measurements as defined on the drawing at paragraph “Evaluation mother board”. Absolute Maximum Ratings (1) Tamb.= +25°C Symbol Parameter Values Unit Vd Maximum drain bias voltage 4.5 V Id Maximum drain bias current 230 mA Vg Gate bias voltage -2.0 to +0.4 V P_RF Maximum RF input power (2) 10 dBm P_LO Maximum LO input power (2) 10 dBm Tch Maximum channel temperature 175 °C Ta Operating temperature range -40 to +85 °C Tstg Storage temperature range -55 to +150 °C (1) Operation of this device above anyone of these parameters may cause permanent damage. (2) Duration < 1s.

21-26.5GHz Integrated Down converter CHR3693-QDG Ref. : DSCHR3693QDG2181 - 29 Jun 12 3/14 Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 Device thermal performances All the figures given in this section are obtained a ssuming that the QFN device is cooled down only by conduction through the package thermal pad (no convection mode considered). The temperature is monitored at the package back-side interface (Tcase) as shown below. The system maximum temperature must be ad justed in order to guarantee that Tcase remains below than the maximum value specified in the next table. So, the system PCB must be designed to comply with this requirement. A derating must be applied on the dissipated power if the Tcase temperature can not be maintained below than the maximum temperature specified (see the curve Pdiss. Max) in order to guarantee the nominal device life time (MTTF). Recommended max. junction temperature (Tj max) : 124 °C Junction temperature absolute maximum rating : 175 °C Max. continuous dissipated power (Pdiss. Max.) : 0.64 W => Pdiss. Max. derating above Tcase(1)= 85 °C : 16 mW/°C Junction-Case thermal resistance (Rth J-C)(2) : <60 °C/W Minimum Tcase operating temperature(3) : -40 °C Maximum Tcase operating temperature(3) : 85 °C Minimum storage temperature : -55 °C Maximum storage temperature : 150 °C (1 ) Derating at junction temperature constant = Tj max. (2) Rth J-C is calculated for a worst case considering the ho ttest junctio n of the M M IC and all the devices biased. (3) Tcase=Package back side temperature measured under the die-attach-pad (see the drawing below). 6.4 DEVICE THERMAL SPECIFICATION : Product name 0.1 0.2 0.3 0.4 0.5 0.6 0.7 -50 -25 0 25 50 75 100 125 150 Pdiss. Max. @Tj <Tj max (W) Tcase (°C) Pdiss. Max. @Tj <Tj max (W) Tcase Example: QFN 16L 3x3 Location of temeprature reference point (Tcase) on package's bottom side Example : QFN 16L 3x3 Location of temperature reference point (Tcase) on package’s bottom side

CHR3693-QDG 21-26.5GHz Integrated Down converter Ref. : DSCHR3693QDG2181 - 29 Jun 12 4/14 Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 Typical Board Measurements Tamb=25°C, Vdx=Vdl=4V, Typical Vgx=-0.9V & Vgm=-0.7V P_LO=2dBm, F_IF=2GHz These values are representative of onboard measurements as defined on the drawing at page 12 (paragraph “Evaluation mother board”) (in connector access planes). Conversion Gain in infradyne mode versus frequency F_RF = 2xF_LO-F_IF Conversion Gain in supradyne mode versus frequency F_RF = 2xF_LO+F_IF -40°C +25°C +80°C -40°C +25°C +80°C

21-26.5GHz Integrated Down converter CHR3693-QDG Ref. : DSCHR3693QDG2181 - 29 Jun 12 5/14 Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 Typical Board Measurements Tamb=25°C, Vdx=Vdl=4V, Typical Vgx=-0.9V & Vgm=-0.7V P_LO=2dBm, F_IF=2GHz Image Frequency rejection (inf. & sup. Mode) @ -40, +25, +80°C -40°C +25°C +80°C Q (supradyne) I (infradyne) -40°C +25°C +80°C Q (supradyne) I (infradyne) Q (supradyne) I (infradyne)

CHR3693-QDG 21-26.5GHz Integrated Down converter Ref. : DSCHR3693QDG2181 - 29 Jun 12 6/14 Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 Typical Board Measurements Tamb=25°C, Vdx=Vdl=4V, Typical Vgx=-0.9V & Vgm=-0.7V P_LO=2dBm, F_IF=2GHz Board losses have been de-embedded (results in package access planes) Noise Figure in infradyne mode versus frequency F_RF = 2xF_LO-F_IF 20 21 22 23 24 25 26 Noise Figure (dB) Frequency (GHz) NF LSB @+85°C NF LSB @+25°C NF LSB @-40°C Noise Figure in supradyne mode versus frequency F_RF = 2xF_LO+F_IF 20 21 22 23 24 25 26 Noise Figure (dB) Frequency (GHz) NF USB @+85°C NF USB @+25°C NF USB @-40°C

21-26.5GHz Integrated Down converter CHR3693-QDG Ref. : DSCHR3693QDG2181 - 29 Jun 12 7/14 Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 Typical Board Measurements Tamb=25°C, Vdx=Vdl=4V, Typical Vgx=-0.9V & Vgm=-0.7V P_LO=2dBm Compression versus PRF (infradyne and supradyne modes) F_RF=21GHz & F_IF=3GHz Q (supradyne) I (infradyne) +25°C -40°C +80°C Q (supradyne) I (infradyne) Q (supradyne) I (infradyne) +25°C -40°C +80°C Compression versus PRF (infradyne and supradyne modes) F_RF=26GHz & F_IF=2GHz Q (supradyne) I (infradyne) +25°C -40°C +80°C Q (supradyne) I (infradyne) Q (supradyne) I (infradyne) +25°C -40°C +80°C

CHR3693-QDG 21-26.5GHz Integrated Down converter Ref. : DSCHR3693QDG2181 - 29 Jun 12 8/14 Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 Typical Board Measurements Tamb=25°C, Vdx=Vdl=4V, Typical Vgx=-0.9V & Vgm=-0.7V Input IP3 versus RF power P_LO=2dBm, F_FI=2GHz P_RF 2tones (dBm) IIP3 (dBm) 21GHz @ -40°C 23.6GHz @ -40°C 26.5GHz @ -40°C 21GHz @ 25°C 23.6GHz @ 25°C 26.5GHz @ 25°C 21GHz @ 80°C 23.6GHz @ 80°C 26.5GHz @ 80°C Isolations LO/RF & 2LO/RF P_LO=2, 4 & 6dBm Isolation LO-RF Isolation 2LO-RF PLO=2dBm PLO=4dBm PLO=6dBm

21-26.5GHz Integrated Down converter CHR3693-QDG Ref. : DSCHR3693QDG2181 - 29 Jun 12 9/14 Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 Typical Board Measurements Tamb=25°C, Vdx=Vdl=4V, Typical Vgx=-0.9V & Vgm=-0.7V LO Return Loss @ P_LO=0dBm LO Freq (GHz) RF Return Loss @ P_RF=-30dBm RF Freq (GHz)

CHR3693-QDG 21-26.5GHz Integrated Down converter Ref. : DSCHR3693QDG2181 - 29 Jun 12 10/14 Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 Package outline (1) Matt tin, Lead Free (Green) 1- NC 9- Vdx 17- Gnd(2) Units : mm 2- Gnd(2) 10- NC 18- NC From the standard : JEDEC MO-220 3- Gnd(2) 11- NC 19- I-IF out (VGGD) 4- RF in 12- Vgx 20- Gnd(2) 25- GND 5- Gnd(2) 13- Gnd(2) 21- Gnd(2) 6- Gnd(2) 14- Gnd(2) 22- Q-IF out 7- Vdl 15- LO IN 23- NC 8- Vgm 16- Gnd(2) 24- NC (1) The package outline drawing included to this data-sheet is given for indication. Refer to the application note AN0017 (http://www.ums-gaas.com) for exact package dimensions. (2) It is strongly recommended to ground all pins marked “Gnd” through the PCB board. Ensure that the PCB board is designed to provide the best possible ground to the package.

21-26.5GHz Integrated Down converter CHR3693-QDG Ref. : DSCHR3693QDG2181 - 29 Jun 12 11/14 Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 Definition of the Sij reference planes The reference planes used for Sij measurements given above are sy mmetrical from the symmetrical axis of the package (see drawing beside). The input and output reference planes are located at 3.18mm offset (input wise and output wise respectively) from this axis. Then, the given Sij parameters incorporate the land pattern of the evaluation motherboard recommended in paragraph "Evaluation mother board". 3.1 8 3.1 8

CHR3693-QDG 21-26.5GHz Integrated Down converter Ref. : DSCHR3693QDG2181 - 29 Jun 12 12/14 Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 Evaluation mother board ■ Compatible with the proposed footprint. ■ Based on typically Ro4003 / 8mils or equivalent. ■ Using a micro-strip to coplanar transition to access the package. ■ Recommended for the implementation of this product on a module board. ■ Decoupling capacitors of 10nF ±10% are recommended for all DC accesses. ■ See application note AN0017 for details. 10nF capacitor 0603 Hybrid coupler 90° (ex. Anaren 11306-3)

21-26.5GHz Integrated Down converter CHR3693-QDG Ref. : DSCHR3693QDG2181 - 29 Jun 12 13/14 Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 Note

CHR3693-QDG 21-26.5GHz Integrated Down converter Ref. : DSCHR3693QDG2181 - 29 Jun 12 14/14 Specifications subject to change without notice Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34 Recommended package footprint Refer to the application note AN0017 available at http://www.ums-gaas.com for package foot print recommendations. SMD mounting procedure For the mounting process standard techniques involving solder paste and a suitable reflow process can be used. For further details, see application note AN0017. Recommended environmental management UMS products are compliant with the regulation in particular with the directives RoHS N°2011/65 and REACh N°1907/2006. More environmental data are available in the application note AN0019 also available at http://www.ums-gaas.com. Recommended ESD management Refer to the application note AN0020 available at http://www.ums-gaas.com for ESD sensitivity and handling recommendations for the UMS package products.

Ordering Information

QFN 4x4 RoHS compliant package: CHR3693-QDG/XY Stick: XY = 20 Tape & reel: XY = 21 Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of United Monolithic Se miconductors S.A.S. . Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for us e as critical components in life support devices or systems without express written approval from United Monolithic Semiconductors S.A.S.