CHR3663-QEG_11 UMS | Alldatasheet
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Technical content
Ref. :DSCHR3663-QEG1192 - 11 Jul 11 1/18 Specifications subject to change without notice United Monolithic Semiconductors S.A.S. Route Départementale 128 - BP46 - 91401 Orsay Cedex France Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 17-24GHz Integrated Down Converter GaAs Monolithic Microwave IC in SMD package
Description
The CHR3663 -QEG is a multifunction part, which integrates a balanced cold FET mixer, a multiplier by two, and a RF LNA including gain control. It is designed for a wide range of applications, typically commercial communication systems and ISM. The circuit is manufactured with a robust high volume pHEMT process, 0.25µm gate length. It is available in lead-free SMD package. Main Features ■ Broadband RF performance 17-24GHz ■ 11dB conversion gain ■ 15dBc Image Rejection ■ 3dBm Input IP3 ■ 15dB Gain control ■ 24LQFN4x5 ■ MSL1 Main Characteristics Tamb = +25°C, Vd = 4.5V Symbol Parameter Min Typ Max Unit FRF RF frequency range 17.0 24.0 GHz FLO LO frequency range 7.0 14.0 GHz FIF IF frequency range DC 3.5 GHz Gc Conversion gain 11 dB ESD Protections: Electrostatic discharge sensitive device observe handling precautions! -16 -14 -12 -10 17 18 19 20 21 22 23 24 25 26 RF Frequency (GHz) Conversion Gain (dB) Gcmax_SUP@2GHz Gcmin_SUP@2GHz Gcmax_INF@2GHz Gcmin_INF@2GHz UMS R3663 YYWW
CHR3663-QEG 17–24GHz Down Converter Ref. : DSCHR3663-QEG1192 - 11 Jul 11 2/18 Specifications subject to change without notice Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
Electrical Characteristics
Tamb = +25°C, VD = VDL = 4.5V Symbol Parameter Min Typ Max Unit FRF RF frequency range 17.0 24.0 GHz FLO LO frequency range 7.0 14.0 GHz FIF IF frequency range DC 3.5 GHz Gc Conversion gain@ min. attenuation (1) 8.5 11.0 dB G Gain control range 15 dB NF Noise Figure@ min. attenuation, for IF>0.1GHz 3.5 4.5 dB Im_rej Image rejection (1) 15 dBc PLO LO Input power 0 dBm IIP3 Input IP3@ min. att. 0 3 dBm 2LO/RF 2LO leakage at RF port @ max. gain -40 dBm VD, VDL DC drain voltage 4.5 V Id Drain current 380 mA VGL LNA DC gate voltage -0.4 V GC2, GC3 Gain control DC voltage -2.0 +0,6 V VGM Mixer DC gate voltage -0.7 V These values are representative of onboard measurements as defined on the drawing at paragraph “Evaluation mother board”. (1) An external combiner 90° is required on I / Q. Note: Id not affected by GC2, GC3.
17–24GHz Down Converter CHR3663-QEG Ref. : DSCHR3663-QEG1192 - 11 Jul 11 3/18 Specifications subject to change without notice Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Absolute Maximum Ratings (1) Tamb = +25°C Symbol Parameter Values Unit Vd Maximum drain bias voltage 5 V Id Maximum drain bias current 450 mA VGL,VGM LNA, mixer DC gate voltage -2.0 to +0.4 V GC1, 2 Gain control voltage -2.5 to + 0.8 V P_RF Maximum peak input power overdrive 10 dBm P_LO Maximum LO input power 10 dBm Tch Maximum channel temperature 175 °C Ta Operating temperature range -40 to +85 °C Tstg Storage temperature range -55 to +125 °C (1) Operation of this device above anyone of these paramaters may cause permanent damage.
CHR3663-QEG 17–24GHz Down Converter Ref. : DSCHR3663-QEG1192 - 11 Jul 11 4/18 Specifications subject to change without notice Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Device thermal performances All the figures given in this section are obtained assuming that the QFN device is cooled down only by conduction through the package thermal pad (no convection mode considered). The temperature is monitored at the package back-side interface (Tcase) as shown below. The system maximum temperature must be adjusted in order to guarantee that Tcase remains below than the maximum value specified in the next table. So, the system PCB must be designed to comply with this requirement. A derating must be applied on the dissipated power if the Tcase temperature can not be maintained below than the maximum temperature specified in order to guarantee the nominal device life time (MTTF) (see the curve Pdiss. Max). Recommanded max. junction temperature (Tj max) : 143 °C Junction temperature absolute maximum rating : 175 °C Max. continuous dissipated power @ Tcase= 85 °C : 1,71 W => Pdiss derating above Tcase(1)= 85 °C : 29 mW/°C Junction-Case thermal resistance (Rth J-C)(2) : <34 °C/W Min. package back side operating temperature(3) : -40 °C Max. package back side operating temperature(3) : 85 °C Min. storage temperature : -55 °C Max. storage temperature : 125 °C (1) Derating at junction temperature constant = Tj max (2) Rth J-C is calculated for a worst case where the hotter junction of the MMIC is considered. (3) Tcase=Package back side temperature measured under the die-attach-pad (see the drawing below). 5.6 DEVICE THERMAL SPECIFICATION : CHR3663-QEG 0,2 0,4 0,6 0,8 1,2 1,4 1,6 1,8 -50 -25 0 25 50 75 100 125 Tcase (°C) Pdiss. Max. (W) Pdiss. Max. (W) Tcase Example of QFN 16L 3x3 back-side view, temperature reference point (Tcase) location.
CHR3663-QEG 17–24GHz Down Converter Ref. : DSCHR3663-QEG1192 - 11 Jul 11 12/18 Specifications subject to change without notice Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Figure 15: Noise Figure in Infradyne Mode vs Temperature & Frequency F_RF = 2xF_LO-F_IF, F_IF = 2.0GHz, GC2 = GC3 = -1.5V 16 17 18 19 20 21 22 23 24 25 26 RF Frequency (GHz) Noise Figure (dB) NF_INF@-40°C NF_INF@25°C NF_INF@85°C
17–24GHz Down Converter CHR3663-QEG Ref. : DSCHR3663-QEG1192 - 11 Jul 11 13/18 Specifications subject to change without notice Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Package outline (1) 1- Nc 9- VGL 17- Nc 25- GND Exposed pad 2- Nc 10- VDL 18- Nc 3- Nc 11- VGM 19- Nc 4- GND(2) 12- VD 20- IF_I out 5- RF in 13- Nc 21- GND(2) 6- GND(2) 14- GND(2) 22- IF_Q out 7- GC3 15- LO in 23- Nc 8- GC2 16- GND(2) 24- Nc (1)The package outline drawing included to this data -sheet is given for indication. Refere to the application note AN0017 available at http://www.ums-gaas.com for exact package dimensions. (2)It is strongly recommended to ground on the PCB board all the pins referenced as GND.
CHR3663-QEG 17–24GHz Down Converter Ref. : DSCHR3663-QEG1192 - 11 Jul 11 14/18 Specifications subject to change without notice Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Evaluation mother board Compatible with the proposed footprint. Based on typically Ro4003 / 8mils or equivalent. Using a microstrip to coplanar transition to access the package. Recommended for the implementation of this product on a module board. Decoupling capacitors of 10nF 10% are recommended for all DC accesses. (See application note AN0017 for details). GC3 GC2 VGL VDL VGM VD Decoupling Capacitors = 10nF Hybrid coupler Anaren 90° 2-4GHz
17–24GHz Down Converter CHR3663-QEG Ref. : DSCHR3663-QEG1192 - 11 Jul 11 15/18 Specifications subject to change without notice Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Notes Due to ESD protection circuits on RF and LO inputs, an external capacitance might be requested to isolate the product from external voltage that could be present on these accesses in the application. ESD protections are also implemented on gate accesses. The DC connections do not include any decoupling capacitor in package, therefore it is mandatory to provide a good external DC decoupling on the PC board, as close as possible to the package. RF IN GND IF_Q IF_I NC VDL GC3 GC2 VGL VGM VD20 1 2 3 4 5 6 141516171819 LO IN NC NC NC NC GND GND NC GND GND NC NC NC RF IN GND IF_Q IF_I NC VDL GC3 GC2 VGL VGM VD20 1 2 3 4 5 6 141516171819 LO IN NC NC NC NC GND GND NC GND GND NC NC NC GND IF_Q IF_I NC VDL GC3 GC2 VGL VGM VD20 1 2 3 4 5 6 141516171819 LO IN NC NC NC NC GND GND NC GND GND NC NC NC
CHR3663-QEG 17–24GHz Down Converter Ref. : DSCHR3663-QEG1192 - 11 Jul 11 16/18 Specifications subject to change without notice Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 DC Schematic LNA: 4.5V, 110mA LO Buffer: 4.5V, 270mA 510 100 725 1.6k 510 220 190 40 4x75µm 1k 25 Differential Amplifier Differential Multiplier Buffer 1 Buffer 2 100 185 16 960 2x75µm 25960 1k 100 15 40 40 Vd= 4.5V, 270mA 90mA 30mA 65mA 85mA 200 50 50 Mixer 510 100 725 1.6k 510 220 190 40 4x75µm 1k 25 Differential Amplifier Differential Multiplier Buffer 1 Buffer 2 100 185 16 960 2x75µm 25960 1k 100 15 40 40 Vd= 4.5V, 270mA 90mA 30mA 65mA 85mA 200 50 50 Mixer Vd=4.5V, 110mA 52mA GC3 64310 2k 45 22 1.3k 1.8k 17 Vg~ -0.35V 3.4k 3.4k 1x100µm 1x100µm 1x100µm 1x100µm 1x100µm 1x100µm 17mA 41mA GC2 1.5k Vd=4.5V, 110mA 52mA GC3 6464310 2k 45 22 1.3k 1.8k 17 Vg~ -0.35V 3.4k 3.4k3.4k 1x100µm 1x100µm 1x100µm 1x100µm 1x100µm 1x100µm 17mA 41mA GC2 1.5k
17–24GHz Down Converter CHR3663-QEG Ref. : DSCHR3663-QEG1192 - 11 Jul 11 17/18 Specifications subject to change without notice Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Notes:
CHR3663-QEG 17–24GHz Down Converter Ref. : DSCHR3663-QEG1192 - 11 Jul 11 18/18 Specifications subject to change without notice Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Recommended package footprint Refer to the application note AN0017 available at http://www.ums-gaas.com for package foot print recommendations and exact package dimensions. SMD mounting procedure For the mounting process standard techniques involving solder paste and a suitable reflow process can be used. For further details, see application note AN0017. Recommended environmental management Refer to the application note AN0019 available at http://www.ums-gaas.com for environmental data on UMS package products. Recommended ESD management Refer to the application note AN0020 available at http://www.ums-gaas.com for ESD sensitivity and handling recommendations for the UMS package products.
Ordering Information
QFN 4x5 RoHS compliant package: CHR3663-QEG/XY Stick: XY = 20 Tape & reel: XY = 21 Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors S.A.S. assumes no responsibility for th e consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of United Monolithic Semicondu ctors S.A.S. . Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use as cr itical components in life support devices or systems without express written approval from United Monolithic Semiconductors S.A.S.