CBT-BGA-6036 IRONWOOD | Alldatasheet
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RECOMMENDED TORQUE: 10-16 IN-LBS TOP VIEW CBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS FEATURES: Wide temperature range (-55C to +180C)• High current capability (up to 4A)• Excellent signal integrity at high frequencies• Low and stable contact resistance for reliable production yield• Highly compliant to accommodate wide co-planarity variations• Automated probe manufacturing enables low cost and short lead time• Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Socket Specification Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. B DATE: 02/14/2014 Material: N/A Finish: N/A Weight: 129.30 CBT-BGA-6036 Drawing SCALE: 1:1 SHEET: 1 OF 5 ENG: B. Schatz FILE: CBT-BGA-6036 Dwg DRAWN BY: M. Raske
0.80 TYP
4X 1.700±0.100 THRU ALL NON-PLATED 2X 0.8500+ 0.0250
0.0125 THRU ALL
23.450 Bottom Guide
23.075 Bottom Guide 0.375* 4.7825 11.1125 9.8625 (2x) 11.1125 7.3225 11.1125 11.4875 9.8625 (3x) 9.8625 (3x) 7.60 (20x) 7.60 (20x) 7.225 (20x) 7.975 (20x) 9.8625 (2x) LATCH OUTLINE: MAX COMPONENT HEIGHT OF 4.5mm SOCKET BASE OUTLINE: MAX COMPONENT HEIGHT OF 6mm 0.035 A B
0.025 A B
A B Target PCB Recommendations Total thickness: 1.59mm min. Plating: Gold or Solder finish PCB Pad height: max .0508mm below than solder mask *Note: BGA pattern is not symmetrical with respect to the mounting holes Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Recommended PCB Layout Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. B DATE: 02/14/2014 Material: N/A Finish: N/A Weight: 129.30 CBT-BGA-6036 Drawing SCALE: 5:2 SHEET: 2 OF 5 ENG: B. Schatz FILE: CBT-BGA-6036 Dwg DRAWN BY: M. Raske
D E e b (400x)
0.25 C A B
0.10 B C J A DETAIL J SCALE 8 : 1 A 1. Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. 3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane C. 4. Datum C (seating plane) is defined by the spherical crowns of the solder balls. 5. Parallelism measurement shall exclude any effect of mark on top surface of package. IRONWOOD PACKAGE CODE: BGA400H DIM Minimum Maximum A - 4.0 A1 0.2 0.4 b - 0.5 D 17.0 +/- 0.2mm E 17.0 +/- 0.2mm e 0.80 ARRAY 20 x 20 PIN COUNT 400 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Compatible BGA Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. B DATE: 02/14/2014 Material: N/A Finish: N/A Weight: 129.30 CBT-BGA-6036 Drawing SCALE: 4:1 SHEET: 3 OF 5 ENG: B. Schatz FILE: CBT-BGA-6036 Dwg DRAWN BY: M. Raske
24.725 19.725 1.70 (4) 1.31 7.00 15.00 1.59 PIN DETAIL SCALE 16:1 INSULATION PLATE DETAIL ITEM # Description Material
1 Compression Screw 7075-T6 Aluminum Alloy
2 Socket Lid 7075-T6 Aluminum Alloy
3 Precision Compression Spring Zinc Plated Music Wire
4 Latch 7075-T6 Aluminum Alloy
5 Hinge Pin and Snap Ring AISI 1045 Steel
6 Compression Plate 7075-T6 Aluminum Alloy
7 BGA400 0.8mm Pitch FR4
8 Socket Base 7075-T6 Aluminum Alloy
9 Dowel pin Stainless Steel (18-8)
10 Floating Guide Semitron MDS 100
11 Middle Guide Semitron MDS 100
12 Bottom Pogo Guide Semitron MDS 100
13 Target PCB Material <not specified>
14 Insulation Plate High Temp FR4
15 Backing Plate 7075-T6 Aluminum Alloy
16 0-80 Socket Head Cap Screw Alloy Steel 17 0-80 Flat Head Screw PEEK unfilled
18 Pogo Pin
19 Pin Guide Spring Alloy Steel (SS)
20 Spring Clamshell lid assembly Steel Music Wire
21 M3 Socket Head Cap Screw 18-8 Stainless Steel
Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Socket Assy, Insulation Plate Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. B DATE: 02/14/2014 Material: N/A Finish: N/A Weight: 129.30 CBT-BGA-6036 Drawing SCALE: 3:2 SHEET: 4 OF 5 ENG: B. Schatz FILE: CBT-BGA-6036 Dwg DRAWN BY: M. Raske
Rev Date Initials Description B 3/24/15 RP/MR Changed spring pin and guides to new design, dowel pin protrusion adjusted, if needed, metal screws replaced with plastic screws, if needed. Contact Ironwood for details. Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Sheet1 Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. B DATE: 02/14/2014 Material: Finish: Weight: CBT-BGA-6036 Drawing SCALE: 3:2 SHEET: 5 OF 5 ENG: B. Schatz FILE: CBT-BGA-6036 Dwg DRAWN BY: M. Raske©2015 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com