BT111

BT111 SILABS | Alldatasheet

Document overview

• Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
• PDF pages: 53

Technical content

BT111: Bluetooth® Smart Ready HCI Module DATA SHEET Friday, 24 March 2017 Version 1.27 Not Recommended for New Designs

1.0 First public release

1.1 Minor changes

1.2 FCC and CE update

1.21 Low energy master and slave mode supported

1.22 IC statement modified

1.23 Contact details updated

1.24 Formatting, reel dimensions

1.25 Recommended PCB land pattern added

1.26 Updated certification status

1.27 Updated certification status

Not Recommended for New Designs

Not Recommended for New Designs

14.2. Not Recommended for New Designs

BT111: Bluetooth Smart Ready HCI Module DES CRIPTION BT111 is a low cost and ultra- small Bluetooth Smart Ready HCI module that is designed for applications where both Bluetooth classic and Bluetooth low energy connectivity is needed. BT111 integrates a Bluetooth 4.0 dual mode radio, HCI software stack, USB interface and an antenna. BT111 is compatible with Windows and Linux operating systems and Microsoft and BlueZ Bluetooth stacks and offers OEMs fast and risk free way to integrate Bluetooth 4.0 connectivity into their applications. AP PLICATIONS

• Health and fitness gateways
• Point of sale
• M2M connectivity
• Automotive aftermarket
• Personal navigation devices
• Consumer electronics
• Industrial and home automation gateways KEY

FEATURES

• Bluetooth v.4.0, dual mode compliant
• Support Bluetooth classic
• Supports Bluetooth low energy master and slave mode
• Radio capabilities
• Transmit power: +8dBm
• Receiver sensitivity: -89dBm
• Line-of-sight range: 100+ meters
• Integrated antenna
• Interfaces
• HCI over USB host interface
• 802.11 co-existence interface
• Software programmable GPIO
• PCM or I2S audio interfaces
• Supply voltage: 1.7V to 3.6V or 3.1V to 3.6V
• Temperature range: -30C to +85C
• Ultra compact size: 13.05mm x 9.30mm
• Bluetooth, CE, FCC, IC and Japan PH YSICAL OUTLOOK Not Recommended for New Designs

1 BT111 Product numbering

Antenna: A = Internal Av ailable products and product codes Product code Description BT111-A-HCI BT111 Bluetooth 4.0 HCI module with integrated antenna Not Recommended for New Designs

2 Block Diagram

gure 1: Block diagram of BT111 CS R8510 BT111 is based on CSR8510 dual mode chip. The chip includes all the functions required for a complete Bluetooth radio with on chip LDO regulators. The chip provides SPI, PCM and USB interfaces. Up to 4 general purpose I/Os are available for general usage, such as Wi-Fi coexistence or general indicators. Antenna Antenna is a ceramic monopole chip antenna. See the antenna characteristics in chapter 7. Band Pass Filter The band pass filter filters the out of band emissions from the transmitter to meet the specific regulations for type approvals of various countries. 64k EEPROM The embedded 64k EEPROM can be used to store customizable parameters, such as maximum TX power, PCM configuration, USB product ID, USB vendor ID and USB product description. 26MHz Crystal The embedded 26MHz crystal is used for generating the internal digital clocks. Not Recommended for New Designs

3 Pinout and Terminal Descriptions

PCM_SYNC/SPI_CS/PIO23 PIO5 PIO2 PCM_CLK/SPI_CLK/PIO24 PCM_IN/SPI_MOSI/PIO21 GND VREG_IN_HV PIO0 PCM_OUT/SPI_MISO/PIO22 PIO01 SPI_PCM_SEL GND 16VDD_HOST VREG_IN_USB VREG_OUT_HV VDD_PADS VREG_EN_RST# GND Figure 2: BT111 Power Supply Pin No. Pad Type Description VREG_EN_RST# 20 Input with strong internal pull-down Take high to enable internal regulators. Also acts as active low reset. Maximum voltage is VDD_PADS Note: USB regulator is always enabled and not controlled by this pin VREG_IN_HV 10 Analogue regulator input / output Input to internal high-voltage regulator to 1.8V regulator, 3.3V output from USB regulator. VREG_OUT_HV 18 Analogue regulator output Output from internal high-voltage to 1.8V regulator. Input to second stage internal regulators. VREG_IN_USB 17 Analogue regulator input Input to USB regulator. Connect to external USB bus supply, e.g. USB_VBUS VDD_HOST 16 VDD USB system positive supply VDD_PADS 19 VDD Positive supply for digital I/O pads Table 1: Supply Terminal Descriptions Not Recommended for New Designs

PIO Port Pin No. Pad Type Supply Domain Description PIO0 11 Bidirectional, tristate, with weak internal pull- down VDD_PADS Programmable input/output line PIO1 13 PIO2 6 PIO5 5 Table 2: I/O Terminal Descriptions PCM Interface Pin No. Pad Type Supply Domain Description PCM_OUT/ SPI_MISO/ PIO22 Output, tristate, with weak internal pull- down VDD_PADS PCM syncronous data output SPI data output Programmable input/output line PCM_IN/ SPI_MOSI/ PIO21

8 Input, tristate, with weak internal

Programmable input/output line PCM_SYNC/ SPI_CS#/ PIO23

4 Bidirectional, tristate, with weak

SPI chip select, active low Programmable input/output line PCM_CLK/ SPI_CLK/ PIO24 PC M syncronous data clock SPI clock Programmable input/output line SPI_PCM#_SEL 14 Input with weak internal pull-down High switches SPI/PCM lines to SPI, low switches SPI/PCM lines to PCM/PIO use Table 3: PCM Interface USB Interface Pin No. Pad Type Supply Domain Description USB+ 3 Bidirectional VDD_HOST USB data plus with selectable internal 1.5kΩ pull-up resistor USB- 2 US B data minus Table 4: USB Interface Not Recommended for New Designs

4 External Dimensions and Land Pattern

gure 3: Footprint (top view) Fi gure 4: Recommended PCB land pattern Not Recommended for New Designs

2.1mm (+/- 10%) 1.9mm (+/- 10%) 7.3mm (+/- 0.1mm) 9.3mm (+/-0.1mm) Fi gure 5: External dimensions Not Recommended for New Designs

5 Layout Guidelines

Use good layout practices to avoid excessive noise coupling to supply voltage traces or sensitive analog signal traces. If using overlapping ground planes use stitching vias separated by max 3 mm to avoid emission from the edges of the PCB. Connect all the GND pins directly to a solid GND plane and make sure that there is a low impedance path for the return current following the signal and supply traces all the way from start to the end. A good practice is to dedicate one of the inner layers to a solid GND plane and one of the inner layers to supply voltage planes and traces and route all the signals on top and bottom layers of the PCB. This arrangement will make sure that any return current follows the forward current as close as possible and any loops are minimized. Signals GND Power Signals Fi gure 6: Typical 4-layer PCB construction Overlapping GND layers without GND stitching vias Overlapping GND layers with GND stitching vias shielding the RF energy Fi gure 7: Use of stitching vias to avoid emissions from the edges of the PCB

5.1 BT111-A Layout Guide

For optimal performance of the antenna place the module at the corner of the PCB of the mother board as shown in the Figure 8. Optionally the module can be placed on the long edge of the mother board. In this case the metal clearance area must be extended minimum 10mm from the edge of the module, as shown in Figure 8. The layout of the mother board has an impact on the antenna characteristic and radiation pattern, see the antenna characteristics chapter. Do not place any metal (traces, components, battery etc.) within the clearance area of the antenna. Connect all the GND pins directly to a solid GND plane. Place the GND vias as close to the GND pins as possible. Use good layout practices to avoid any excessive noise coupling to signal lines or supply voltage lines. Avoid placing plastic or any other dielectric material closer than 5 mm from the antenna. Any dielectric closer than 5 mm from the antenna will detune the antenna to lower frequencies. The antenna is optimized for mother board thickness of 1.0 mm. If the mother board is thicker than this, the resonant frequency will be tuned downwards. If the mother board thickness is thinner than 1.0 mm, the resonant frequency will be tuned upwards. S11 is a measure of how big portion of the transmitted power is reflected back from the antenna. An adequate performance can be expected if S11 is less than – 7 dB. If Not Recommended for New Designs

ng PCB thickness more than 1.6 mm, or if there is dielectric material around the antenna which is likely to detune the resonant frequency, the antenna can be tuned in the mother board layout by removing FR4 below the antenna. Mother board BT111 Mother board BT111 Metal clearance area Min. 10mm Figure 8: Recommended layouts for BT111-A Fi gure 9: Impedance matching of the antenna of BT111 with two different mother board PCB thick ness Not Recommended for New Designs

6 Electrical Characteristics

6.1 Absolute Maximum Ratings

Storage temperature -40 +85 ⁰C VREG_IN_USB -0.2 5.85 V VREG_IN_HV -0.2 4.9 V VDD_HOST -0.2 3.7 V VDD_PADS -0.2 3.7 V Other terminal voltages VSS - 0.4V VDD + 0.4 V V Table 5: Absolute maximum ratings Rating Min Max Unit Operating temperature -30 +85 ⁰C VREG_IN_USB 4.25 5.75 V VREG_IN_HV 2.3 4.8 V VDD_HOST 3.1 3.6 V VDD_PADS (* 1.7(* 3.6(* V *) NOTE: The internal EEPROM is powered from VDD_PADS. To write the EEPROM, minimum supply voltage is 2.7V and maximum is 3.3V. For reading the EEPROM the minimum supply voltage is 1.7V and the maximum is 3.6V. Table 6: Recommended operating conditions

6.2 Input/Output Terminal Characteristics

6.2.1 USB Linear Regulator

Input voltage 4.25 5.0 5.75 V Output voltage 3.2 3.3 3.4 V Output current - - 150 mA Table 7: USB linear regulator Not Recommended for New Designs

6.2.2 High- voltage Linear Regulator

Normal Operation Min Typ Max Unit Input voltage 2.3 3.3 4.8 V Output voltage 1.75 1.85 1.95 V Temperature coefficient -200 - 200 ppm/⁰C Output noise (frequency range 100Hz to 100kHz) - - 0.4 mV rms Settling time (settling ti within 10% of final value) - - 5 µs Output current - - 100 mA Quiescent current (excluding load, Iload <1mA) 30 40 60 µA Low-power Mode Quiescent current (excluding load, Iload <100µA) 14 18 23 µA Table 8: High-voltage Linear Regulator

6.2.3 Digital

Normal Operation Min Typ Max Unit Input Voltage VIL input logic level low -0.4 - 0.4 V VIH input logic level high 0.7 x VDD - VDD + 0.4 V Output Voltage VOL output logic level low, IOL = 4.0mA - - 0.4 V VOH output logic level high, IOL = 4.0mA 0.75 x VDD - - V Input and Tristate Currents Strong pull-up -150 -40 -10 µA Striong pull-down 10 40 150 µA Weak pull-up -5 -1.0 -0.33 µA Weak pull-down 0.33 1.0 5.0 µA CI input capacitance 1.0 - 5.0 pF Table 9: Digital I/O characteristics Not Recommended for New Designs

6.3 Current Consumption

(8 dBm) AVG Unit Idle 5 mA USB Suspend 200 µA Inguiry 73 51 mA File Transfer 73 58 mA LE Connected (Master) 74 (* mA LE Scan (Master) 48 (* mA *) LE AVG current consumption depends on the chosen TX interval and scanning window Table 10: Current consumption of BT111 with 8 dBm TX power 6.5 ms TX Peak = 73 mA Peak = 14 mA Fi gure 10: Current consumption profile while creating a SPP connection Peak = 48 mA BGND Current = 6.4 mA Window = 50 ms Fi gure 11: LE scanning with 50 ms window Not Recommended for New Designs

Peak = 74 mA 500 µs AVG = 7.7 mA (with 70 ms interval) Fi gure 12: LE connected with 70 ms interval Fi gure 13: BDR Peak current vs TX power Not Recommended for New Designs

gure 14: LE peak current vs. TX power Not Recommended for New Designs

7 RF Characteristics

7.1 Transmitter Characteristics

RF Characetristics, VDD = 3.3V @ room temperature unless otherwise specified Min Typ Max Bluetooth Specification Unit maximum RF Transmit Power 8 10 20 dBm RF power variation over temperature range 1.5 - dB RF power variation over supply voltage range 0.2 - dB RF power variation over BT band (* 2 - dB RF power control range -21 8 - dBm 20dB band width for modulated carrier 1000 kHz ACP (1 F = F0 ± 2MHz -20 F = F0 ± 3MHz -40 F = F0 > 3MHz -40 Drift rate 10 +/-25 kHz ΔF1avg 165 140<175 kHz ΔF1max 168 140<175 kHz ΔF2avg / ΔF1avg 0.9 >=0.8 *) Channel 0 @2402Mhz has generally 1.0 dB lower TX power than all the other channels. All the channels between 2403 MHz and 2480 MHz are within 0.5 dB. Table 11: Transmitter Characteristics, BDR Not Recommended for New Designs

gure 15: Power control steps of BT111

7.2 Receiver Characteristics

RF characteristis, VDD = 3.3V, room temperature Packet type Min Typ Max Bluetooth Spefication Unit Sensitivity for 0.1% BER DH1 -89 -70 dBm DH3 -89 dBm DH5 -89 dBm 2-DH5 -92 dBm 3-DH5 -85 dBm Sensitivity variation over BT band (* All 2 dB Sensitivity variation over temperature range All TB D dB *) Channel 0 @2402Mhz is generally 1.5dB less sensitive than all the other channels. All the channels between 2403 MHz and 2480 MHz are within 0.5 dB. Table 12: BDR and EDR receiver sensitivity Not Recommended for New Designs

7.3 Radiated Spurious Emissions

(AVG / PEAK) Typ (AVG / PEAK) Max (AVG / PEAK) Limit by the Standard (AVG / PEAK) Unit FCC part 15 transmitter spurious emissions 2nd harmonic 51 / 58 54 / 74 dBuV/m 3rd harmonic < 50 54 / 74 dBuV/m Band edge 2483.5MHz 48 / - 54 / 74 dBuV/m Band edge 2400MHz -50 -20 dBc Band edge 2483.5MHz -35 -20 dB c ETSI EN 300 328 transmitter spurious emissions Band edge 2400MHz -42 -30 dBm 2nd harmonic -36 -30 dBm 3rd harmonic <-40 -30 dBm ETSI EN 300 328 receiver spurious emissions (2400 - 2479) MHz <-70 -47 dBm (1600 - 1653) MHz <-70 -47 dB m Table 13: Radiated Spurious Emissions

7.4 Antenna Characteristics

The antenna is a standard monopole chip antenna. The radiation pattern is strongly dependent on the layout of the mother board. Usually the gain is highest to the directions where there is most GND and weakest to the opposite direction. Typically the total radiated efficiency is around 25% - 35%. The maximum gain is 0.5 dBi. Not Recommended for New Designs

8 Clock Generation

BT111 is using an internal 26 MHz crystal oscillator. All internal digital clock s are generated using a phase locked loop, which is locked to the 26 MHz crystal oscillator. 26 MHz clock is calibrated in production and the calibrated settings are stored to the internal EEPROM of BT111. The 32.768 kHz sleep clock is generated internally to the module. BT111 does not need any external clock sources. Not Recommended for New Designs

9 Bluetooth Stack Microcontroller

BT111 uses a 16-bit RISC MCU for low power consumption and efficient use of memory. The MCU, interrupt controller and event timer run the Bluetooth software stack and control the Bluetooth radio and host interfaces.

10 Programmable I/O Ports

See the Device Terminal Functions section for the list of supplies to the PIOs. PIO lines are configured through software to have either weak or strong pull -ups or pull -downs. All PIO lines are configured as inputs with weak pull- downs at reset and have additional individual bus keeper configuration. The default configuration for all the IO pins is input with weak pull-up.

11 Wi-Fi Coexistence Interface

Dedicated hardware is provided to implement a variety of Wi-Fi coexistence schemes. There is support for:

• Channel skipping AFH
• Priority signaling
• Channel signaling
• Host passing of channel instructions The BT111 supports the Wi-Fi coexistence schemes:
• Unity-3
• Unity-3e
• Unity+ Cont act support (support@bluegiga.com) for more information Not Recommended for New Designs

12 Memory Management

12.1 Memory Management Unit

The MMU provides a number of dynamically allocated ring buffers that hold the data that is in transit between the host and the air. The dynamic allocation of memory ensures efficient use of the available RAM and is performed by a hardware MMU to minimize the overheads on the processor during data/voice transfers.

12.2 System RAM

56KB of integrated RAM supports the RISC MCU and is shared between the ring buf fers for holding voice/data for each active connection and the general-purpose memory required by the Bluetooth stack.

12.3 Internal ROM Memory (5Mb)

5Mb of internal ROM memory is available on BT111. This memory is provided for system firmware, storing BT111 settings and program code.

12.4 Internal EEPROM

64kb internal EEPROM is available on BT111 to store device specific configuration information (PS Keys) such as Bluetooth address, USB descriptors, PCM configuration and maximum TX power . The internal EEPROM is powe red from VDD_PADS. The minimum supply voltage writing the EEPROM is 2.7V and the minimum supply voltage for reading the EEPROM is 1.7V. Not Recommended for New Designs

13 Serial Interfaces

13.1 USB Interface

BT111 has a full-speed (12Mbps) USB interface for communicating with other compatible digital devices. The USB interface on BT111 acts as a USB peripheral, responding to requests from a master host controller. BT 111 supports the Universal Serial Bus Specification, Revision v2.0 (USB v2.0 Specification) and USB Battery Charging Specification, available from http://www.usb.org. For more information on how to integrate the USB interface on BT111 see the WT USB Design Guide available in Bluegiga Techforum. As well as describing USB basics and architecture, the application note describes:

• Power distribution for high and low bus-powered configurations
• Power distribution for self-powered configuration, which includes USB VBUS monitoring
• USB enumeration
• Electrical design guidelines for the power supply and data lines, as well as PCB tracks and the effects of ferrite beads
• USB suspend modes and Bluetooth low-power modes:
• Global suspend
• Selective suspend, includes remote wake
• Wake on Bluetooth, includes permitted devices and set-up prior to selective suspend
• Suspend mode current draw
• PIO status in suspend mode
• Resume, detach and wake PIOs
• Battery charging from USB, which describes dead battery provision, charge currents, charging in suspend Modes and USB VBUS voltage consideration
• USB termination when interface is not in use
• Internal modules, certification and non-specification compliant operation See c hapter 17 for the default USB vendor and product ID settings.

13.2 Programming and Debug Interface

This SPI programming and debug interface can configure the PS Keys stored in the internal EEPROM and can also debug BT111. Bluegiga provides the development and production tools to communicate over this interface from a PC. BT 111 uses a 16-bit data and 16-bit address programming and debug interface. Transactions occur when the internal processor is running or is stopped. Data is written or read one word at a time, or the auto-increment feature is available for the block access. Conf iguring the parameters of the BT111 and running test scripts is also possible via the USB interface with certain limitations; please see Section 14 for more information. Not Recommended for New Designs

14 Audio Interfaces

BT111 has digital audio interface that is configurable as either a PCM or I2S port.

14.1 PCM Interface

The audio PCM interface on the BT111 supports:

• Continuous transmission and reception of PCM encoded audio data over Bluetooth.
• Processor overhead reduction through hardware support for continual transmission and reception of PCM data.
• A bidirectional digital audio interface that routes directly into the baseband layer of the firmware. It does not pass through the HCI protocol layer.
• Hardware on BT111 for sending data to and from a SCO connection.
• Up to 3 SCO connections on the PCM interface at any one time.
• PCM interface master, generating PCM_SYNC and PCM_CLK.
• PCM interface slave, accepting externally generated PCM_SYNC and PCM_CLK.
• Various clock formats including: o Long Frame Sync o Short Frame Sync o GCI timing environments
• 13-bit or 16-bit linear, 8-bit μ-law or A-law companded sample formats.
• Receives and transmits on any selection of 3 of the first 4 slots following PCM_SYNC. The PCM configuration options are enabled by setting PSKEY_PCM_CONFIG32.

14.1.1 PCM Interface Master/Slave

When configured as the master of the PCM interface, BT111 generates PCM_CLK and PCM_SYNC. PCM_OUT PCM_IN PCM_CLK PCM_SYNC 128/256/512/1536/2400kHz 8/48kHz Fi gure 16: BT111 as PCM master Not Recommended for New Designs

PCM_OUT PCM_IN PCM_CLK PCM_SYNC Up to 2400kHz 8/48kHz Fi gure 17: BT111 as PCM slave

14.1.2 Long Frame Sync

Long Frame Sync is the name given to a clocking format that controls the transfer of PCM data words or samples. In Long Frame Sync, the rising edge of PCM_SYNC indicates the start of the PCM word. When BT111 is configured as PCM master, generating PCM_SYNC and PCM_CLK, then PCM_SYNC is 8 bits long. When BT111 is configured as PCM Slave, PCM_SYNC is from 1 cycle PCM_CLK to half the PCM_SYNC rate. Fi gure 18: Long Frame Sync (Shown with 8-bit Companded Sample) BT 111 samples PCM_IN on the falling edge of PCM_CLK and transmits PCM_OUT on the ri sing edge. PCM_OUT is configurable as high impedance on the falling edge of PCM_CLK in the LSB position or on the rising edge.

14.1.3 Short Frame Sync

In Short Frame Sync, the falling edge of PCM_SYNC indicates the start of the PCM word. PCM_SYNC is always 1 clock cycle long. Not Recommended for New Designs

gure 19: Short Frame Sync (shown with 16-bit sample) As with Long Frame Sync, BT111 samples PCM_IN on the falling edge of PCM_CLK and transmits PCM_OUT on the rising edge. PCM_OUT is configurable as high impedance on the falling edge of PCM_CLK in the LSB position or on the rising edge.

14.2 Multi-slot Operation

More than 1 SCO connection over the PCM interface is supported using multiple slots. Up to 3 SCO connections are carried over any of the first 4 slots. Fi gure 20: Multi-slot Operation with 2 Slots and 8-bit Companded Samples

14.2.1 GCI Interface

BT111 is compatible with the GCI, a standard synchronous 2B+D ISDN timing interface. The 2 64kbps B channels are accessed when this mode is configured. Not Recommended for New Designs

gure 21: GCI Interface The start of frame is indicated by the rising edge of PCM_SYNC and runs at 8kHz.

14.2.2 Slots and Sample Formats

BT111 receives and transmits on any selection of the first 4 slots following each sync pulse. Slot durations are either 8 or 16 clock cycles:

• 8 clock cycles for 8-bit sample formats.
• 16 clock cycles for 8-bit, 13-bit or 16-bit sample formats. BT111 supports:
• 13-bit linear, 16-bit linear and 8-bit μ-law or A-law sample formats.
• A sample rate of 8ksps.
• Little or big endian bit order.
• For 16-bit slots, the 3 or 8 unused bits in each slot are filled with sign extension, padded with zeros or a programmable 3-bit audio attenuation compatible with some codecs. Not Recommended for New Designs

gure 22: 16-bit Slot Length and Sample Formats

14.2.3 Additional Features

BT111 has a mute facility that forces PCM_OUT to be 0. In master mode, BT111 is compatible with some codecs which control power down by forcing PCM_SYNC to 0 while keeping PCM_CLK running.

14.2.4 PCM Timing Information

Symbol Parameter Min Typ Max Unit fmclk PCM_CLK Frequency 4MHz DDS generation. Ffrequency selection is programmable. - 128 - kHz 256 512 48MHz DDS generation. Frequency selection is programmable. 2.9 - - Not Recommended for New Designs

• PCM_SYNC frequency for SCO connection - 8 - kHz fmclkh (a) PCM_CLK high 4MHz DDS generation 980 - - ns fmclkl (a) PCM_CLK low 4MHz DDS generation 730 - - ns - PCM_CLK jitter 48MHz DDS generation - - 21 ns pk-pk Table 14: PCM Master Timing (a) Assumes normal system clock operation. Figures vary during low -power modes, when system speeds are reduced. Symbol Parameter Min Typ Max Unit tdmclksynch Delay time from PCM_CLK high to PCM sync high 4MHz DDS generation. Ffrequency selection is programmable. - - 20 ns 48MHz DDS generation - - 40.83 tdmclkpout Delay time from PCM_CLK high to PCM_OUT - - 20 tdmclksyncl Delay time from PCM_CLK low to PCM sync low (long frame sync only) 4MHz DDS generation - - 20 48MHz DDS generation - - 40.83 tdmclklpoutz Delay time from PCM_CLK low to PCM_OUT high impedance - - 20 tdmclkhpoutz Delay time from PCM_CLK high to PCM_OUT high impedance - - 20 tsupinclkl Set-up time for PCM_IN valid to PCM_CLK low 20 - - thpinclkl Hold time for PCM_CLK low to PCM_IN invalid 0 - - Table 15: PCM Master Mode Timing Parameters Not Recommended for New Designs

gure 23: PCM Master Timing Long Frame Sync Fi gure 24: PCM Master Timing Short Frame Sync Not Recommended for New Designs

Symbol Parameter Min Typ Max Unit fsclk PCM clock frequency (Slave mode: Input) 64 - 2048 kHz fsclk PCM clock frequency (GCI mode) 128 - 4096 kHz fsclkl PCM_CLK low time 200 - - ns fsclkh PCM_CLK high time 200 - - ns Table 16: PCM Slave Timing Symbol Parameter Min Typ Max Unit fhsclksynch Hold time from PCM_CLK low to PCM_SYNC high 2 - - ns fsusclksynch Set-up time for PCM_SYNC high to PCM_CLK low 20 - - fdpout Delay time from PCM_SYNC or PCM_CLK, whichever is later, to valid PCM_OUT data (long frame sync only) - - 15 fdsclkhpout Delay time from PCM_SYNC or PCM_CLK, whichever is later, to valid PCM_OUT data - - 15 fdpoutz Delay time from PCM_SYNC or PCM_CLK low, whichever is later, to PCM_OUT data line high impedance - - 20 fsupinsclkl Set-up time for PCM_IN valid to PCM_CLK low 20 - - fhpinsclkl Hold time from PCM_CLK low to PCM_IN valid 2 - - Tab le 17: PCM Slave Mode Timing Parameters Not Recommended for New Designs

gure 25: PCM Slave Timing Long Frame Sync Fi gure 26: PCM Slave Timing Short Frame Sync

14.2.5 PCM_CLK and PCM_SYNC Generation

BT111 has 2 methods of generating PCM_CLK and PCM_SYNC in master mode:

• Generating these signals by DDS from BT111 internal 4MHz clock. Using this mode limits PCM_CLK to 128, 256 or 512kHz and PCM_SYNC to 8kHz.
• Generating these signals by DDS from an internal 48MHz clock, enables a greater range of frequencies to be generated with low jitter but consumes more power. To select this second method set bit 48M_PCM_CLK_GEN_EN in PSKEY_PCM_CONFIG32. When in this mode and with long Not Recommended for New Designs

ame sync, the length of PCM_SYNC is either 8 or 16 cycles of PCM_CLK, determined by LONG_LENGTH_SYNC_EN in PSKEY_PCM_CONFIG32. Following equation describes PCM_CLK frequency when generated from the internal 48MHz clock: Eq uation 1: PCM_CLK Frequency Generated Using the Internal 48MHz Clock Set the frequency of PCM_SYNC relative to PCM_CLK using following equation: Eq uation 2: PCM_SYNC Frequency Relative to PCM_CLK CN T_RATE, CNT_LIMIT and SYNC_LIMIT are set using PSKEY_PCM_LOW_JITTER_CONFIG. As an example, to generate PCM_CLK at 512kHz with PCM_SYNC at 8kHz, set PSKEY_PCM_LOW_JITTER_CONFIG to 0x08080177.

14.2.6 PCM Configuration

Configure the PCM by using PSKEY_PCM_CONFIG32 and PSKEY_PCM_LOW_JITTER_CONFIG, see your PS Key file. The default for PSKEY_PCM_CONFIG32 is 0x00800000, i.e. first slot following sync is active, 13- bit linear voice format, long frame sync and interface master generating 256kHz PCM_CLK from 4MHz internal clock with no tri-state of PCM_OUT.

14.3 Digital Audio Interface (I2S)

The digital audio interface supports the industry standard formats for I ²S, left -justified or right -justified. The interface shares the same pins as the PCM interface, which means each audio bus is mutually exclusive in its usage. Table 17 lists these alternative functions. PCM Interface I2S Interface PCM_OUT SD_OUT PCM_IN SD_IN PCM_SYNC WS PCM_CLK SCK Table 18: Alternative Function of the Digital Audio Bus Interface on the PCM Interface Conf igure the digital audio interface using PSKEY_DIGITAL_AUDIO_CONFIG . Table 18 describes the values for the PS Key (PSKEY_DIGITAL_AUDIO_CONFIG) that is used to set -up the digital audio interface. For example, to configure an I2S interface with 16-bit SD data set PSKEY_DIGITAL_CONFIG to 0x0406. Not Recommended for New Designs

D[0] 0x0001 CONFIG_JUSTIFY_FORMAT 0 for left justified, 1 for right justified D[1] 0x0002 CONFIG_LEFT_JUSTIFY_DELAY For left justified formats: 0 is MSB of SD data occurs in the first SCLK period following WS transition. 1 is MSB of SD data occurs in the second SCLK period. D[2] 0x0004 CONFIG_CHANNEL_POLARITY For 0, SD data is left channel when WS is high. For 1 SD data is right channel. D[3] 0x0008 CONFIG_AUDIO_ATTEN_EN For 0, 17 bit SD data is rounded down to 16 bits. For 1, the audio attenuation defined in CONFIG_AUDIO_ATTEN is applied over 24 bits with saturated rounding. Requires CONFIG_16_BIT_CROP_EN to be 0. D[7:4] 0x00F0 CONFIG_AUDIO_ATTEN Attenuation in 6 dB steps. D[9:8] 0x0300 CONFIG_JUSTIFY_RESOLUTION Resolution of data on SD_IN, 00=16 bit, 01=20 bit, 10=24 bit, 11=Reserved. This is required for right justified format and with left justified LSB first. D[10] 0x0400 CONFIG_16_BIT_CROP_EN For 0, 17 bit SD_IN data is rounded down to 16 bits. For 1 only the most significant 16 bits of data are received. Table 19: PSKEY_DIGITAL_AUDIO_CONFIG Not Recommended for New Designs

gure 27: Digital Audio Interface Modes The internal representation of audio samples within BT111 is 16-bit and data on SD_OUT is limited to 16-bit per channel. Symbol Parameter Min Typ Max Unit - SCK Frequency - - 6.2 MHz - WS Frequency - - 96 kHz tch SCK high time 80 - - ns tcl SCK low time 80 - - ns Table 20: Digital Audio Interface Slave Timing Not Recommended for New Designs

Symbol Parameter Min Typ Max Unit tssu WS valid SCK high set-up time 20 - - ns tsh SCK high to WS invalid hold time 2.5 - - ns topd SCK low to SD_OUT valid delay time - - 20 ns tisu SD_IN valid to SCK high set-up time 20 - - ns tih SCK high to SD_IN invalid hold time 2.5 - - ns Tab le 21: I2C Slave Mode Timing Fi gure 28: Digital Audio Interface Slave Timing Symbol Parameter Min Typ Max Unit - SCK Frequency - - 6.2 MHz - WS Frequency - - 96 kHz Table 22: Digital Audio Interface Master Timing Not Recommended for New Designs

Symbol Parameter Min Typ Max Unit tspd SCK low to WS valid delay time - - 39.27 ns topd SCK low to SD_OUT valid delay time - - 18.44 ns tisu SD_IN valid to SCK high set-up time 18.44 - - ns tih SCK high to SD_IN invalid hold time 0 - - ns Table 23: I2S Master Mode Timing Parameters, WS and SCK as Outputs Fi gure 29: Digital Audio Interface Master Timing Not Recommended for New Designs

15 Power Control and Regulation

LDO 3V3 LDO 1V8 LDO 1V35VBUS (4.25V – 5.75V) VREG_IN_HV (3.3V OUT / 2.3V – 4.8V IN) VREG_OUT_HV 1.8V OUT / 1.7V – 1.95V IN VREG_EN_RST# LDO 1V35 LDO 1V25 Fi gure 30: Internal regulators and powering of BT111

15.1 Voltage Regulator Enable

All the regulators are enabled, except the USB linear regulator, by taking the VREG_EN_RST# pin above 1V. Also the BT111 firmware automatically controls the regulators. Important Note: VREG_EN_RST# should not be taken high before the supply on VREG_IN_HV is present. The VREG_EN_RST# pin is connected internally to the reset function and is powered from VDD_PADS, so do not apply voltages above VDD_PADS to the VREG_EN_RST# pin. The VREG_EN_RST# pin is pulled down internally.

15.2 USB Linear Regulator

The integrated USB LDO linear regulator is available as a 3.30V supply rail and is intended to supply the USB interface and the high- voltage linear regulator. The input voltage range is between 4.25V and 5.75V. The maximum current from this regulator is 150mA. This regulator is enabled by default. If the USB linear regulator is not required leave its input (VREG_IN_USB) unconnected.

15.3 High Voltage Linear Regulator

The integrated high-voltage linear regulator is available to power the main 1.8V supply rail. The input voltage range is between 2.3V and 4.8V. The maximum current from this regulator is 100mA. Take VREG_EN_RST# high to enable this regulator. Im portant Note: VREG_EN_RST# should not be taken high before the supply on VREG_IN_HV is present. If this regulator is not required then leave VREG_IN_HV unconnected or tied to VREG_OUT_HV. Not Recommended for New Designs

15.4 Low Voltage Linear Regulators

BT111 has three integrated low voltage linear regulators providing the internal supply voltages for RF and digital circuits of BT111. The input voltage range is between 1.70V and 1.95V.

15.5 Powering Sequence

All the power supplies should be powered at the same time. The order of powering the supplies relative to the I/O supply, VDD_PADS to VDD_HOST, is not important. If the I/O supply is powered before VDD_DIG, all digital I/Os are weak pull-downs irrespective of the reset state.

15.6 Reset

The reset function is internally tied to the VREG_EN_RST# pin. BT111 is reset from several sources:

• VREG_EN_RST# pin
• Power-on reset
• Via a software-configured watchdog timer The VREG_EN_RST# pin is an active low reset. Assert the reset signal for a period >5ms to ensure a full reset. Important Note: Bluegiga does not recommend assertions of the reset of <5ms on the VREG_EN_RST# pin, as any glitches on this line can affect I/O integrity without triggering a reset. A warm r eset function is also available under software control. After a warm reset the RAM data remains available. Pin Name/Group I/O Type No Core Supply Reset Full Chip Reset VREG_EN_RST# Digital input Strong pull-down N/A SPI_CLK/PCM_CLK / PIO[24] Digital bidirectional tristated Weak pull-down Weak pull-down SPI_CS# / PCM_SYNC / PIO[23] Digital bidirectional tristated Weak pull-up (SPI) Weak pull-down (PCM) Weak pull-up (SPI) Weak pull-down (PCM / PIO) SPI_MISO / PCM_OUT / PIO[22] Digital output tristated Weak pull-down Weak pull-down SPI_MOSI / PCM_OUT / PIO[21] Digital input Weak pull-down Weak pull-down PIO[5:0] Digital bidirectional tristated Weak pull-down Weak pull-down Table 24: Digital Pin States on Reset Not Recommended for New Designs

16 Example Schematic

gure 31: Example schematic for BT111 Not Recommended for New Designs

17 Software

BT111 is supplied with an on-chip Bluetooth v4.0 specification qualified HCI Controller stack firmware. It also has an EEPROM chip, which allows modifications of many configuration parameters (PS-keys) of the Bluetooth chip. When the BT111 development kit is plugged into your PC, it will show up as a generic Bluetooth Controller, and the Bluetooth Host stack installed on your PC will take control of it. To access BT111’s configuration parameters, which are stored on its EEPROM chip, you need the included SPI connector and PSTool software from the CSR Blue Suite tool collection. BlueSuite is available on the Bluegiga Techforum at http://techforum.bluegiga.com. PSTool contains a full list of the parameters that are possible to modify, along with their descriptions. Some common parameter keys are: - (0x0108) PSKEY_DEVICE_NAME – Bluetooth name of the device - (0x02be) PSKEY_USB_VENDOR_ID – USB Vend or ID, if you have your own VID and wish to use it (Default is 0a12 which is CSR’s VID) - (0x02bf) PSKEY_USB_PRODUCT_ID – USB Product ID (Default is 0) Please see the quick start guide for more information and examples. Not Recommended for New Designs

17.1 On-chip Software

17.1.1 Bluetooth HCI Stack

Figure 32 shows an example implementation. An internal processor runs the Bluetooth stack up to the HCI. The host processor must provide all the upper layers of Bluetooth protocol including the application. Bluetooth HCI Handling ULP HIF Handling LM ULP LL Control Handling LC: Bluetooth per Packet Code LC: ULP per packet Code LC: Bluetooth per Packet Code LC: ULP per Packet Code Host Transport Device Drivers Generic Command and Event Handling Generic HCI Handling LC Core Scheduler 2.4GHz Radio Hardware Fi gure 32: Example FW Architecture

17.1.2 Latest Feature of the HCI Stack

BT111 is based on Bluetooth v4.0 qualified chip CSR8510 by CSR. This introduces the following features:

• Generic Alternate MAC/PHY (AMP)
• Generic Test Methodology for AMP
• 802.11 Protocol Adaptation Layer
• Enhanced Power Control
• Enhanced USB and SDIO HCI Transports
• HCI read Encryption Key Size command
• Unicast Connectionless Data For Bluetooth v3.0 + HS operation a separate 802.11 IC is used in conjunction with BT111 Not Recommended for New Designs

18 Soldering Recommendations

BT111 is compatible with a industrial standard reflow profile for Pb- free solders. The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and particular type of solder paste used. Consult the datasheet of particular solder paste for profile configurations. Bluegiga Technologies will give following recommendations for soldering the module to ensure the reliable solder joint and operation of the module after soldering. Since the profile used is process and layout dependent, the optimal profile should be studied case by case. Thus the following recommendation should be taken into account as a starting point.

• Refer to technical documentations of particular solder paste for profile configurations
• Avoid using more than one flow.
• Reliability of the solder joint and self -alignment of the component are dependent on the solder volume. Minimum of 150µm stencil thickness is recommended.
• Aperture size of the stencil should be 1:1 with the pad size.
• A low residue, “no clean” solder paste should be used due to low mounted height of the component. Not Recommended for New Designs

19 Certifications

19.1 Bluetooth

BT111 is based on Bluetooth v4.0 qualified chip CSR8510 by CSR. BT111 can be used as a controller subsystem with the Bluetooth QD ID B017701. To make a complete Bluetooth end product, Controller Subsystem is used together with a qualified Host Subsystem.

19.2 FCC/IC (USA/Canada)

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Any changes or modifications not expressly approved by Bluegiga Technologies could void the user’s authority to operate the equipment. FCC RF Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure compliance. This transmitter meets both portable and mobile limits as demonstrated in the RF Exposure Analysis and should not be used closer than 5 mm from a human body in portable configuration. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. IC Statements: This device complies with Industry Canada licence- exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically OEM Responsibilities to comply with FCC and Industry Canada Regulations The BT111 module has been certified for integration into products only by OEM integrators under the following condition:

• The antenna(s) must be installed such that a minimum separation distance of 5 m m is maintained between the radiator (antenna) and all persons at all times.
• The transmitter module must not be co- located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. Not Recommended for New Designs

long as the two condition above is met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end- product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). IM PORTANT NOTE: In the event that these conditions can not be met (for certain configurations or co - location with another transmitter), then the FCC and Industry Canada authorizations are no longer considered valid and the FCC ID and IC Certification Number can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re- evaluating the end product (including the transmitter) and obtaining a separate FCC and Industry Canada authorization. En d Product Labeling The BT111 m odule is labeled with its own FCC ID and IC Certification Number. If the F CC ID and IC Certification Number are not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following: “Co ntains Transmitter Module FCC ID: QOQBT111” “Contains Transmitter Module IC: 5123A-BGTBT111” or “Contains FCC ID: QOQBT112” “Contains IC: 5123A-BGTBT111” The O EM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product.

19.2.1 FCC et IC

Déclaration d’IC : Ce dispositif est conforme aux normes RSS exemptes de licence d’Industrie Canada. Son fonctionnement est assujetti aux deux conditions suivantes : (1) ce dispositif ne doit pas provoquer de perturbation et (2) ce dispositif doit accepter toute perturbation, y compris les perturbations qui peuvent entraîner un fonctionnement non désiré du dispositif. Selon les réglementations d’Industrie Canada, cet émetteur radio ne doit fonctionner qu’avec une antenne d’une typologie spécifique et d’un gain maximum (ou inférieur) approuvé pour l’émetteur par Industrie Canada. Po ur réduire les éventuelles perturbations radioélectriques nuisibles à d’autres utilisateurs, le type d’antenne et son gain doivent être choisis de manière à ce que la puissance isotrope rayonnée équivalente Responsabilités des OEM quant à la conformité avec les réglementations de FCC et d’Industrie Canada Les modules BT111 ont été certifiés pour entrer dans la fabrication de produits exclusivement réalisés par des intégrateurs dans les conditions suivantes : Not Recommended for New Designs

• L’antenne (ou les antennes) doit être installée de façon à maintenir à tout instant une distance minimum de 5 mm entre la source de radiation (l’antenne) et toute personne physique.
• Le module transmetteur ne doit pas être installé ou utilisé en concomitance avec une autre antenne ou un autre transmetteur. Tant que ces deux conditions sont réunies, il n’est pas nécessaire de procéder à des tests supplémentaires sur le transmetteur. Cependant, l’intégrateur est responsable des tests effectués sur le produit final afin de se mettre en conformité avec d’éventuelles exigences complémentaires lorsque le module est installé (exemple : émissions provenant d’appareils numériques, exigences vis-à-vis de périphériques informatiques, etc.) REM ARQUE IMPORTANTE : En cas d’inobservance de ces conditions (en ce qui concerne certaines configurations ou l’emplacement du dispositif à proximité d’un autre émetteur), les autorisations de FCC et d’Industrie Canada ne seront plus considérées valables et l’identification de FCC et le numéro de certification d’IC ne pourront pas être utilisés sur le produit final. Dans ces cas, l’intégrateur OEM sera chargé d’évaluer à nouveau le produit final (y compris l’émetteur) et d’obtenir une autorisation indépendante de FCC et d’Industrie Canada. Éti quetage du produit final Le module BT111 est étiqueté avec sa propre identification FCC et son propre numéro de certification IC. Si l’identification FCC et le numéro de certification IC ne sont pas visibles lorsque le module est installé à l’intérieur d’un autre dispositif, la partie externe du dispositif dans lequel le module est installé devra également présenter une étiquette faisant référence au module inclus. Dans ce cas, le produit final devra être étiqueté sur une zone visible avec les informations suivantes : « Co ntient module émetteur identification FCC : QOQBT111 » « Contient module émetteur IC : 5123A-BGTBT111 » ou « Contient identification FCC : QOQBT111 » « Contient IC : 5123A-BGTBT111 » Dans l e guide d’utilisation du produit final, l’intégrateur OEM doit s’abstenir de fournir des informations à l’utilisateur final portant sur les procédures à suivre pour installer ou retirer ce module RF ou pour changer les paramètres RF.

19.3 CE (Europe)

BLE112 is in conformity with the essential requirements and other relevant requirements of the R&TTE Directive (1999/5/EC). The product is conformity with the following standards and/or normative documents .

• EMC (immunity only) EN 301 489-17 V2.1.1
• Radiated emissions EN 300 328 V1.8.1
• Safety EN60950-1:2006+A11:2009+A1:2010+A12:2011 Not Recommended for New Designs

19.4 Japan

BT111 has type approval with certification ID R 209- J00078 Not Recommended for New Designs

20 Moisture Sensitivity Level (MSL) classification

Moisture sensitivity level (MSL) of this product is 3. Please follow the handling guidelines of the standard IPC/JEDEC J-STD-020 and J-STD-033. Not Recommended for New Designs

21 Packaging and Reel Information

gure 33: BT111 reel dimensions Not Recommended for New Designs

gure 34: Package tape dimensions Not Recommended for New Designs

http://www.silabs.com Silicon Laboratories Inc.

400 West Cesar Chavez

Austin, TX 78701 USA Smart. Connected. Energy-Friendly.Products www.silabs.com/products Quality www.silabs.com/quality Support and Community community.silabs.com Disclaimer Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Silicon Labs shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses granted hereunder to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any Life Support System without the specific written consent of Silicon Labs. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Trademark Information Silicon Laboratories Inc.® , Silicon Laboratories®, Silicon Labs®, SiLabs® and the Silicon Labs logo®, Bluegiga®, Bluegiga Logo®, Clockbuilder®, CMEMS®, DSPLL®, EFM®, EFM32®, EFR, Ember®, Energy Micro, Energy Micro logo and combinations thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZRadio®, EZRadioPRO®, Gecko®, ISOmodem®, Precision32®, ProSLIC®, Simplicity Studio®, SiPHY®, Telegesis, the Telegesis Logo®, USBXpress® and others are trademarks or registered trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. All other products or brand names mentioned herein are trademarks of their respective holders. Not Recommended for New Designs