BLF242_15 JMNIC | Alldatasheet

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Technical content

Product specification September 1992 DISCRETE SEMICONDUCTORS BLF242 HF/VHF power MOS transistor

Philips Semiconductors Product specification HF/VHF power MOS transistor BLF242

FEATURES

  • High power gain
  • Low noise
  • Easy power control
  • Good thermal stability
  • Withstands full load mismatch
  • Gold metallization ensures excellent reliability.

DESCRIPTION

Silicon N-channel enhancement mode vertical D-MOS transistor designed for professional transmitter applications in the HF/VHF frequency range. The transistor is encapsulated in a 4-lead, SOT123 flange envelope, with a ceramic cap. All leads are isolated from the flange. PINNING - SOT123 PIN DESCRIPTION 1 drain 2 source 3 gate 4 source PIN CONFIGURATION CAUTION The device is supplied in an antistatic package. The gate-source input must be protected against static charge during transport and handling. WARNING Product and environmental safety - toxic materials This product contains beryllium oxide. The product is entirely safe provided that the BeO disc is not damaged. All persons who handle, use or dispose of this product should be aware of its nature and of the necessary safety precautions. After use, dispose of as chemical or special waste according to the regulations applying at the location of the user. It must never be thrown out with the general or domestic waste. Fig.1 Simplified outline and symbol. halfpage MSB057 s d g MBB072 QUICK REFERENCE DATA RF performance at Th = 25°C in a common source test circuit. MODE OF OPERATION f (MHz) VDS (V) PL (W) G p (dB) ηD (%) CW, class-B 175 28 5 > 13 typ. 16 > 50 typ. 60

Philips Semiconductors Product specification HF/VHF power MOS transistor BLF242 LIMITING VALUES In accordance with the Absolute Maximum System (IEC 134). THERMAL RESISTANCE SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VDS drain-source voltage − 65 V ±VGS gate-source voltage − 20 V ID DC drain current − 1A Ptot total power dissipation up to T mb = 25°C − 16 W Tstg storage temperature −65 150 °C Tj junction temperature − 200 °C SYMBOL PARAMETER CONDITIONS THERMAL RESISTANCE R th j-mb thermal resistance from junction to mounting base Tmb =2 5°C; Ptot= 16 W 11 K/W R th mb-h thermal resistance from mounting base to heatsink Tmb =2 5°C; Ptot= 16 W 0.3 K/W Fig.2 DC SOAR. (1) Current is this area may be limited by RDS(on). (2) Tmb =2 5°C. handbook, halfpage MRA918 10−2 10−1 ID (A) VDS (V) 102 (1) (2) Fig.3 Power/temperature derating curves. (1) Continuous operation. (2) Short-time operation during mismatch. handbook, halfpage 0 50 100 150 MPG141 (2) (1) Ptot (W) Th (°C)

Philips Semiconductors Product specification HF/VHF power MOS transistor BLF242 CHARACTERISTICS Tj = 25°C unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT V(BR)DSS drain-source breakdown voltage VGS = 0; ID = 0.1 mA 65 −− V IDSS drain-source leakage current VGS = 0; VDS = 28 V −− 10 µA IGSS gate-source leakage current ±VGS = 20 V; VDS = 0 −− 1 µA VGS(th) gate-source threshold voltage ID = 3 mA; VDS = 10 V 2 − 4.5 V gfs forward transconductance I D = 0.3 A; VDS = 10 V 0.16 0.24 − S R DS(on) drain-source on-state resistance ID = 0.3 A; VGS = 1 V − 3.3 5 Ω IDSX on-state drain current V GS = 10 V; VGS = 10 V − 1.2 − A C is input capacitance V GS = 0; VDS = 28 V; f = 1 MHz− 13 − pF C os output capacitance V GS = 0; VDS = 28 V; f = 1 MHz− 9.4 − pF C rs feedback capacitance V GS = 0; VDS = 28 V; f = 1 MHz− 1.7 − pF Fig.4 Temperature coefficient of gate-source voltage as a function of drain current, typical values. VDS =1 0V . handbook, halfpage 0 100 200 300 MBB777 ID (mA) T.C. (mV/K) Fig.5 Drain current as a function of gate-source voltage, typical values. VDS = 10 V; Tj=2 5°C. handbook, halfpage 1.5 0.5 51 0 1 5 MGP142 VGS (V) ID (A)

Philips Semiconductors Product specification HF/VHF power MOS transistor BLF242 Fig.6 Drain-source on-state resistance as a function of junction temperature, typical values. ID = 0.3 A; VGS =1 0V . handbook, halfpage 50 100 150 MBB778 Tj (oC) R DS (on) (Ω ) Fig.7 Input and output capacitance as functions of drain-source voltage, typical values. VGS = 0; f = 1 MHz. handbook, halfpage 10 20 30 MBB776 VDS (V) C (pF) C is C os Fig.8 Feedback capacitance as a function of drain-source voltage, typical values. VGS = 0; f = 1 MHz. handbook, halfpage 10 20 30 MBB775 VDS (V) C rs (pF)

Philips Semiconductors Product specification HF/VHF power MOS transistor BLF242 APPLICATION INFORMATION FOR CLASS-B OPERATION Th = 25°C; Rth mb-h = 0.3 K/W; unless otherwise specified. RF performance in CW operation in a common source class-B test circuit. MODE OF OPERATION f (MHz) VDS (V) IDQ (mA) PL (W) G P (dB) ηD (%) R GS (Ω ) CW, class-B 175 28 10 5 > 13 typ. 16 > 50 typ. 60 Ruggedness in class-B operation The BLF242 is capable of withstanding a load mismatch corresponding to VSWR = 50 through all phases under the following conditions: V DS = 28 V; f =175 MHz at rated output power. Noise figure(see Fig.11) VDS = 28 V; ID = 0.2 A; f = 175 MHz; R GS =4 7Ω ; Th =2 5°C. Input and output power matched for PL =5W ; F = typ. 5.5 dB. Fig.9 Power gain and efficiency as functions of load power, typical values. Class-B operation; VDS = 28 V; IDQ =1 0m A ; R GS =4 7Ω ; f = 175 MHz. handbook, halfpage 05 1 0 100 MGP143 ηd ηd (%)G p PL (W) G p (dB) Fig.10 Load power as a function of input power, typical values. Class-B operation; VDS = 28 V; IDQ =1 0m A ; R GS =4 7Ω ; f = 175 MHz. handbook, halfpage 0 0.5 1 MGP144 PL (W) PIN (W)

Philips Semiconductors Product specification HF/VHF power MOS transistor BLF242 List of components (class-B test circuit) Notes 1. American Technical Ceramics (ATC) capacitor, type 100B or other capacitor of the same quality. 2. The striplines are on a double copper-clad printed circuit board, with epoxy fibre-glass dielectric (ε r = 4.5), thickness1⁄16 inch. COMPONENT DESCRIPTION VALUE DIMENSIONS CATALOGUE NO. C1, C2, C7 film dielectric trimmer 4 to 40 pF 2222 809 08002 C3 multilayer ceramic chip capacitor (note 1) 100 pF C4, C8 ceramic chip capacitor 100 nF 2222 852 47104 C6 film dielectric trimmer 5 to 60 pF 2222 809 08003 C9 electrolytic capacitor 2.2 µF, 40 V L1 5 turns enamelled 0.7 mm copper wire 53 nH length 5.4 mm int. dia. 3 mm leads 2× 5m m L2, L3 stripline (note 2) 30 Ω 10 × 6m m L4 11 turns enamelled 1 mm copper wire 500 nH length 15.5 mm int. dia. 8 mm leads 2× 5m m L5 5 turns enamelled 1 mm copper wire 79 nH length 9.1 mm int. dia. 5 mm leads 2× 5m m L6 grade 3B Ferroxcube RF choke 4312 020 36640 R1 0.5 W metal film resistor 47 Ω R2 0.5 W metal film resistor 10 Ω Fig.11 Test circuit for class-B operation. f = 175 MHz. handbook, full pagewidth MGP145 input 50 Ω L1 L2 D.U.T. L3 L5 +VG L4R1C2 C8 C9 +VD output 50 Ω

Philips Semiconductors Product specification HF/VHF power MOS transistor BLF242 Fig.12 Component layout for 175 MHz class-B test circuit. The circuit and components are situated on one side of the epoxy fibre-glass board, the other side being fully metallized to serve as earth. Earth connections are made by fixing screws, copper straps and hollow rivets at the edges of the board and under the source. Dimensions in mm. handbook, full pagewidth MGP146 150 strap strap rivet L2 L3 +VG +VD

Philips Semiconductors Product specification HF/VHF power MOS transistor BLF242 Fig.13 Input impedance as a function of frequency (series components), typical values. Class-B operation; VDS = 28 V; PL =3 0W ; R GS =4 7Ω ;Th =2 5°C. handbook, halfpage −10 −30 200 MGP150 100 ri xi Zi (Ω ) f (MHz) Fig.14 Load impedance as a function of frequency (series components), typical values. Class-B operation; VDS = 28 V; PL =3 0W ; R GS =4 7Ω ;Th =2 5°C. handbook, halfpage 0 200 100 MGP149 100 ZL (Ω ) f (MHz) R L XL Fig.15 Power gain as a function of frequency, typical values. Class-B operation; VDS = 28 V; PL =3 0W ; R GS =4 7Ω ;Th =2 5°C. handbook, halfpage 0 200 MGP148 100 G p (dB) f (MHz)

Philips Semiconductors Product specification HF/VHF power MOS transistor BLF242 PACKAGE OUTLINE REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ SOT123A 97-06-28 0 5 10 mm scale Flanged ceramic package; 2 mounting holes; 4 leads SOT123A U 3U 2 H H L b Q D U 1 q A F c p Mw 2 B C C A w 1 M AB α UNIT A mm Db 5.82 5.56 0.18 0.10 9.73 9.47 9.63 9.42 20.71 19.93 3.33 3.04 6.61 6.09 7.47 6.37 c D 1 U 2 U 3 9.78 9.39 1.020.51 w 2w 1 45° αL 5.61 5.16 U 1 25.15 24.38 Q 4.63 4.11 q 18.42 F 2.72 2.31 inches 0.229 0.219 0.007 0.004 0.383 0.373 0.397 0.371 0.815 0.785 0.131 0.120 0.26 0.24 0.294 0.251 0.385 0.370 0.040.020.221 0.203 0.99 0.96 0.182 0.162 0.7250.107 0.091 pH DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)

Philips Semiconductors Product specification HF/VHF power MOS transistor BLF242 DEFINITIONS LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. Data Sheet Status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.