BAP70-04W_15 JMNIC | Alldatasheet
Document overview
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Technical content
1.1 General description
Two planar PIN diodes in series configuration in a SOT323 small SMD plastic package.
1.2 Features
1.3 Applications
Table 1. Pinning Table 2. Ordering information
BAP70-04W_2 © NXP B.V. 2007. All rights reserved. Table 3. Marking codes Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Table 5. Thermal characteristics Table 6. Characteristics Tamb = 25°C unless otherwise specified.
BAP70-04W_2 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 02 — 3 April 2007 3 of 7 NXP Semiconductors BAP70-04W Silicon PIN diode f = 1 MHz; Tj = 25°C f = 100 MHz; T j = 25°C Fig 1. Diode capacitance as a function of reverse voltage; typical values Fig 2. Forward resistance as a function of forward current; typical values VR (V) 02 0 1551 0 001aaa461 400 300 500 600 C d (fF) 200 103 102 mce007 10−1 11 0 rD (Ω ) IF (mA) 102
BAP70-04W_2 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 02 — 3 April 2007 4 of 7 NXP Semiconductors BAP70-04W Silicon PIN diode 8. Package outline Fig 3. Package outline SOT323 UNIT A 1 max bp cD E e1 H E Lp Qw v REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.11.1 0.8 0.4 0.3 0.25 0.10 2.2 1.8 1.35 1.15 0.65 e 1.3 2.2 2.0 0.23 0.13 0.20.2 DIMENSIONS (mm are the original dimensions) 0.45 0.15 SOT323 SC-70 w Mbp D e A B Lp Q detail X c H E E v M A AB y 0 1 2 mm scale A X Plastic surface-mounted package; 3 leads SOT323 04-11-04 06-03-16
BAP70-04W_2 © NXP B.V. 2007. All rights reserved. Table 7. Revision history
- The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors.
- Legal texts have been adapted to the new company name where appropriate.
- Table6: changed max value of reverse current from 20 nA to 100 nA. BAP70-04W_1 (9397 750 12557)
20040305 Product data -
BAP70-04W_2 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 02 — 3 April 2007 6 of 7 NXP Semiconductors BAP70-04W Silicon PIN diode 10. Legal information
10.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Draft —The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet —A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
10.3 Disclaimers
General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes —NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use —NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications —Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values —Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale —NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license —Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 11. Contact information For additional information, please visit:http://www.nxp.com For sales office addresses, send an email to:salesaddresses@nxp.com Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
NXP Semiconductors BAP70-04W Silicon PIN diode © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 3 April 2007 Document identifier: BAP70-04W_2 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 12. Contents