BAP51-04W_N

BAP51-04W_N_15 JMNIC | Alldatasheet

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Technical content

Preliminary specification 2002 Feb 19 DISCRETE SEMICONDUCTORS BAP51-04W General purpose PIN diode k, halfpage M3D102

2002 Feb 19 2

Philips Semiconductors Preliminary specification General purpose PIN diode BAP51-04W

FEATURES

• Two elements in series configuration in a small SMD plastic package
• Low diode capacitance
• Low diode forward resistance.

APPLICATIONS

• General RF applications.

DESCRIPTION

Two planar PIN diodes in series configuration in a SOT323 small SMD plastic package. PINNING PIN DESCRIPTION 1 anode 2 cathode 3 common connection handbook, halfpage MAM391 Top view Marking code: W6- Fig.1 Simplified outline (SOT323) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT Per diode VR continuous reverse voltage − 50 V IF continuous forward current − 50 mA Ptot total power dissipation T s = 90 °C − 240 mW Tstg storage temperature −65 +150 °C Tj junction temperature −65 +150 °C

2002 Feb 19 3

Philips Semiconductors Preliminary specification General purpose PIN diode BAP51-04W

ELECTRICAL CHARACTERISTICS

Tj = 2 5 °C unless otherwise specified. Note 1. Guaranteed on AQL basis: inspection level S4, AQL 1.0. THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Per diode VF forward voltage I F =5 0m A − 0.95 1.1 V VR reverse voltage I R =1 0 µA5 0 −− V IR reverse current V R =5 0V −− 100 nA Cd diode capacitance V R =0 ; f=1M H z − 0.4 − pF VR =1V ; f=1M H z − 0.3 0.55 pF VR =5V ; f=1M H z − 0.2 0.35 pF rD diode forward resistance I F = 0.5 mA; f = 100 MHz; note 1 − 5.5 9 Ω IF = 1 mA; f = 100 MHz; note 1 − 3.6 6.5 Ω IF = 10 mA; f = 100 MHz; note 1 − 1.5 2.5 Ω τL charge carrier life time when switched from I F =1 0m A t o IR =6m A ; RL = 100 Ω; measured at IR =3m A − 550 − ns LS series inductance I F = 10 mA; f = 100 MHz − 1.6 − nH SYMBOL PARAMETER VALUE UNIT Rth j-s thermal resistance from junction to soldering point 250 K/W

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Philips Semiconductors Preliminary specification General purpose PIN diode BAP51-04W GRAPHICAL DATA handbook, halfpage 102 10−1 MLD507 10−1 1 IF (mA) rD (Ω) 10 10 2 Fig.2 Forward resistance as a function of forward current; typical values. f = 100 MHz; T j =2 5 °C. handbook, halfpage 02 0 500 100 200 300 400 Cd (fF) VR (V) 81 2 1 6 MLD508 Fig.3 Diode capacitance as a function of reverse voltage; typical values. f = 100 MHz; T j =2 5 °C. handbook, halfpage 0.5 3 −2.5 MGS659 −1.5 −0.5 1 1.5 2 2.5 f (GHz) |S21|2 (dB) (2) (3)(1) Fig.4 Insertion loss ( |s21|2) of the diode as a function of frequency; typical values. (1) I F =1 0m A . (2) I F =1m A (3) I F =0 . 5m A Diode inserted in series with a 50Ω stripline circuit and biased via the analyzer Tee network. T amb =2 5 °C. handbook, halfpage 0.5 3 −50 s21 (dB) −40 −30 −20 −10 f (GHz) 1.5 2 2.5 MLD509 Fig.5 Isolation ( |s21|2) of the diode as a function of frequency; typical values. Diode zero biased and inserted in series with a 50 Ω stripline circuit. Tamb =2 5 °C.

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Philips Semiconductors Preliminary specification General purpose PIN diode BAP51-04W PACKAGE OUTLINE UNIT max bp cD E e1 HE Lp Qw v REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm 0.11.1 0.8 0.4 0.3 0.25 0.10 2.2 1.8 1.35 1.15 0.65 e 1.3 2.2 2.0 0.23 0.13 0.20.2 DIMENSIONS (mm are the original dimensions) 0.45 0.15 SOT323 SC-70 w Mbp D e A B Lp Q detail X c HE E v M A AB y 01 2 m m scale A X Plastic surface mounted package; 3 leads SOT323 97-02-28

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Philips Semiconductors Preliminary specification General purpose PIN diode BAP51-04W DATA SHEET STATUS Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was DATA SHEET STATUS (1) PRODUCT STATUS (2) DEFINITIONS Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. DEFINITIONS Short-form specification  The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition  Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information  Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications  These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes  Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.

© Koninklijke Philips Electronics N.V. 2001 SCA73 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reli able and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com.F a x : +31 40 27 24825 Printed in The Netherlands 613512/01/pp 7 Date of release: 2002 Feb 19 Document order number: 9397 750 09456