AT89C4051 SYC | Alldatasheet
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Technical content
Features
- Compatible with MCS®51 Products 4K Bytes of Reprogrammable Flash Memory – Endurance: 10,000 Write/Erase Cycles 2.7V to 6V Operating Range Fully Static Operation: 0 Hz to 24 MHz Two-level Program Memory Lock 128 x 8-bit Internal RAM 15 Programmable I/O Lines Two 16-bit Timer/Counters Six Interrupt Sources Programmable Serial UART Channel Direct LED Drive Outputs On-chip Analog Comparator Low-power Idle and Power-down Modes Brown-out Detection Power-On Reset (POR) Green (Pb/Halide-free/RoHS Compliant) Packaging 1. Description The AT89C4051 is a low-voltage, high-performance CMOS 8-bit microcontroller with 4K bytes of Flash programmable and erasable read-only memory. The device is man- ufactured using Atmel’s high-density nonvolatile memory technology and is compatible with the industry-standard MCS-51 instruction set. By combining a versa- tile 8-bit CPU with Flash on a monolithic chip, the Atmel AT89C4 051 is a powerful microcontroller which provides a highly-flexible and cost-effective solution to many embedded control applications. The AT89C4051 provides the following st andard features: 4K bytes of Flash, 128 bytes of RAM, 15 I/O lines, two 16-bit timer/counters, a five-vector, two-level inter- rupt architecture, a full duplex serial port, a precision analog comparator, on-chip oscillator and clock circuitry. In addition, t he AT89C4051 is designed with static logic for operation down to zero frequency and supports two software-selectable power saving modes. The Idle Mode stops the CP U while allowing the RAM, timer/counters, serial port and interrupt system to continue functioning. The power-down mode saves the RAM contents but freezes the oscillator di sabling all other chip functions until the next hardware reset. 8-bit Microcontroller with 4K Bytes Flash AT89C4051 1001F–MICRO–6/08
1001F–MICRO–6/08 AT89C4051 2. Pin Configuration
2.1 PDIP/SOIC
- Block Diagram RST/VPP (RXD) P3.0 (TXD) P3.1 XTAL2 XTAL1 (INT0) P3.2 (INT1) P3.3 (TO) P3.4 (T1) P3.5 GND VCC P1.7 P1.6 P1.5 P1.4 P1.3 P1.2 P1.1 (AIN1) P1.0 (AIN0) P3.7
1001F–MICRO–6/08 AT89C4051 4. Pin Description
4.1 VCC
Supply voltage.
4.2 GND
Ground.
4.3 Port 1
P1.1 require external pullups. P1.0 and P1.1 also serve as the positive input (AIN0) and the neg- ative input (AIN1), respectively, of the on-chip precision analog comparator. The Port 1 output buffers can sink 20 mA and can drive LED displays directly. When 1s are written to Port 1 pins, they can be used as inputs. When pins P1.2 to P1.7 are used as inputs and are externally pulled low, they will source current (IIL) because of the internal pullups. Port 1 also receives code data during Flash programming and verification.
4.4 Port 3
hard-wired as an input to the output of the on-chip comparator and is not accessible as a gen- eral-purpose I/O pin. The Port 3 output buffers c an sink 20 mA. When 1s are written to Port 3 pins they are pulled high by the internal pullups and can be used as inputs. As inputs, Port 3 pins that are externally being pulled low will source current (I IL) because of the pullups. Port 3 also serves the functions of various special features of the AT89C4051 as listed below: Port 3 also receives some control signals for Flash programming and verification.
4.5 RST
Reset input. All I/O pins are reset to 1s as soon as RST goes high. Holding the RST pin high for two machine cycles while the oscillator is running resets the device. Each machine cycle takes 12 oscillator or clock cycles.
4.6 XTAL1
Input to the inverting oscillator amplifier and input to the internal clock operating circuit. Port Pin Alternate Functions P3.0 RXD (serial input port) P3.1 TXD (serial output port) P3.2 INT0 (external interrupt 0) P3.3 INT1 (external interrupt 1) P3.4 T0 (timer 0 external input) P3.5 T1 (timer 1 external input)
1001F–MICRO–6/08 AT89C4051
4.7 XTAL2
Output from the inverting oscillator amplifier. 5. Oscillator Characteristics XTAL1 and XTAL2 are the input and output, respectively, of an inverting amplifier which can be configured for use as an on-chip oscillator, as shown in Figure 5-1 . Either a quartz crystal or ceramic resonator may be used. To drive the de vice from an external clock source, XTAL2 should be left unconnected while XTAL1 is driven as shown in Figure 5-2. There are no require- ments on the duty cycle of the exte rnal clock signal, since the i nput to the inte rnal clocking circuitry is through a divide-by-two flip-flop, but minimum and maximum voltage high and low time specifications must be observed. Figure 5-1. Oscillator Connections Note: C1, C2 = 30 pF ± 10 pF for Crystals = 40 pF ± 10 pF for Ceramic Resonators Figure 5-2. External Clock Drive Configuration
1001F–MICRO–6/08 AT89C4051 6. Special Function Registers A map of the on-chip memory area called the Special Function Register (SFR) space is shown in the Table 6-1. Note that not all of the addresses are occupied, and unoccupied addresses may not be imple- mented on the chip. Read accesse s to these addresses will in gener al return random data, and write accesses will have an indeterminate effect. User software should not write 1s to these unlisted locations, since they may be used in future products to invoke new features. In that case, the reset or inac tive values of the new bits will always be 0. Table 6-1. AT89C4051 SFR Map and Reset Values 0F8H 0FFH 0F0H B 00000000 0F7H 0E8H 0EFH 0E0H ACC 00000000 0E7H 0D8H 0DFH 0D0H PSW 00000000 0D7H 0C8H 0CFH 0C0H 0C7H 0B8H IP XXX00000 0BFH 0B0H P3 11111111 0B7H 0A8H IE 0XX00000 0AFH 0A0H 0A7H 98H SCON 00000000 SBUF XXXXXXXX 9FH 90H P1 11111111 97H 88H TCON 00000000 TMOD 00000000 TL0 00000000 TL1 00000000 TH0 00000000 TH1 00000000 8FH 80H SP 00000111 DPL 00000000 DPH 00000000 PCON 0XXX0000 87H
1001F–MICRO–6/08 AT89C4051 7. Restrictions on Certain Instructions The AT89C4051 is an economical and cost-effective member of Atmel’s growing family of micro- controllers. It contains 4K bytes of Flash program memory. It is fully compatible with the MCS-51 architecture, and can be programmed using the MCS-51 instruction set. However, there are a few considerations one must keep in mind when utilizing certain instructions to program this device. All the instructions related to jumping or branching should be restricted such that the destination address falls within the physical program memory space of the device, which is 4K for the AT89C4051. This should be the responsibility of the software programmer. For example, LJMP 0FE0H would be a valid instruction for the AT89C4051 (with 4K of memory), whereas LJMP 1000H would not.
7.1 Branching Instructions
LCALL, LJMP, ACALL, AJMP, SJMP, JMP @A+DPTR. These unconditional branching instruc- tions will execute correctly as long as the programmer keeps in mind that the destination branching address must fall within the physical boundaries of the program memory size (loca- tions 00H to FFFH for the 89C4051). Violating the physical space limits may cause unknown program behavior. instructions the same rule above applies. Again, violating the memory boundaries may cause erratic execution. For applications involving interrupts, the normal interrupt service routine address locations of the 80C51 family architecture have been preserved.
7.2 MOVX-related Instru ctions, Data Memory
The AT89C4051 contains 128 bytes of internal data memory. Thus, in the AT89C4051 the stack depth is limited to 128 bytes, the amount of ava ilable RAM. External DA TA memory access is not supported in this device, nor is external Program memory execution. Therefore, no MOVX [...] instructions should be included in the program. A typical 80C51 assembler will still as semble instructions, even if they are written in violation of the restrictions mentioned above. It is the responsibility of the co ntroller user to know the physi- cal features and limitations of the device being used and adjust the instructions used correspondingly. 8. Program Memory Lock Bits On the chip are two lock bits which can be left unprogrammed (U) or can be programmed (P) to obtain the additional features listed in the Table 8-1. Note: 1. The Lock Bits can only be erased with the Chip Erase operation. Table 8-1. Lock Bit Protection Modes(1) Program Lock Bits Protection TypeLB1 LB2
1 U U No program lock features
2 P U Further programming of the Flash is disabled
3 P P Same as mode 2, also verify is disabled
1001F–MICRO–6/08 AT89C4051 9. Idle Mode In idle mode, the CPU puts itself to sleep while all the on-chip peripherals remain active. The mode is invoked by software. The content of the on-chip RAM and all the special functions regis- ters remain unchanged during this mode. The idle mode can be terminated by any enabled interrupt or by a hardware reset. P1.0 and P1.1 should be set to “0” if no external pullups are used, or set to “1” if external pullups are used. It should be noted that when idle is terminated by a hardware reset, the device normally resumes program execution, from where it left off, up to two machine cycles before the internal reset algorithm takes control. On-chip hardware inhibits access to internal RAM in this event, but access to the port pins is not inhibited. To e liminate the possibility of an unexpected write to a port pin when Idle is terminated by reset, the instruction following the one that invokes Idle should not be one that writes to a port pin or to external memory. 10. Power-down Mode In the power-down mode the oscillator is stopped and the instruction that invokes power-down is the last instruction executed. The on-chip RAM and Special Function Registers retain their val- ues until the power-down mode is terminated. The only exit from power-down is a hardware reset. Reset redefines the SFRs but does not change the on-chip RAM. The reset should not be activated before V CC is restored to its normal operating level and must be held active long enough to allow the oscillator to restart and stabilize. P1.0 and P1.1 should be set to “0” if no external pullups are used, or set to “1” if external pullups are used. 11. Brown-out Detection When VCC drops below the detection threshold, all por t pins (except P1.0 and P1.1) are weakly pulled high. When VCC goes back up again, an internal Reset is automatically generated after a delay of typically 15 msec. The nominal brown-out detection threshold is 2.1V ± 10%. VCC 2.1V2.1V PORT PIN INTERNAL RESET 15 msec.
1001F–MICRO–6/08 AT89C4051 12. Programming The Flash The AT89C4051 is shipped with the 4K bytes of on-chip PEROM code memory array in the erased state (i.e., contents = FFH) and ready to be programmed. The code memory array is pro- grammed one byte at a time. Once the array is programmed, to re-program any non-blank byte, the entire memory array needs to be erased electrically. Internal Address Counter: The AT89C4051 contains an internal PEROM address counter which is always reset to 000H on the rising edge of RST and is advanced by applying a positive going pulse to pin XTAL1. Programming Algorithm: To program the AT89C4051, the following sequence is recommended. 1. Power-up sequence: Apply power between VCC and GND pins Set RST and XTAL1 to GND 2. Set pin RST to “H” Set pin P3.2 to “H” 3. Apply the appropriate combination of “H” or “L ” logic levels to pins P3.3, P3.4, P3.5, P3.7 to select one of the programming operations shown in the PEROM Programming Modes table. To Program and Verify the Array: 4. Apply data for Code byte at location 000H to P1.0 to P1.7. 5. Raise RST to 12V to enable programming. 6. Pulse P3.2 once to program a byte in the PEROM array or the lock bits. The byte-write cycle is self-timed and typically takes 1.2 ms. 7. To verify the programmed data, lower RST from 12V to logic “H” level and set pins P3.3 to P3.7 to the appropriate levels. Output data can be read at the port P1 pins. 8. To program a byte at the next address location, pulse XTAL1 pin once to advance the internal address counter. Apply new data to the port P1 pins. 9. Repeat steps 6 through 8, changing data and advancing the address counter for the entire 4K bytes array or until the end of the object file is reached. 10. Power-off sequence: set XTAL1 to “L ” set RST to “L ” Tur n V CC power off Data Polling: The AT89C4051 features Data Polling to indicate the end of a write cycle. During a write cycle, an attempted read of the last byte written will resu lt in the complement of the writ- ten data on P1.7. Once the write cycle has been completed, true data is valid on all outputs, and the next cycle may begin. Data Polling may begin any time after a write cycle has been initiated. Ready/Busy: The Progress of byte programming can also be monitored by the RDY/BSY output pulled High again when programming is done to indicate READY.
1001F–MICRO–6/08 AT89C4051 Program Verify: If lock bits LB1 and LB2 have not been programmed code data can be read back via the data lines for verification: 1. Reset the internal address counter to 000H by bringing RST from “L ” to “H”. 2. Apply the appropriate control signals for Read Code data and read the output data at the port P1 pins. 3. Pulse pin XTAL1 once to advance the internal address counter. 4. Read the next code data byte at the port P1 pins. 5. Repeat steps 3 and 4 until the entire array is read. The lock bits cannot be verified directly. Verification of the lock bits is achieved by observing that their features are enabled. Chip Erase: The entire PEROM array (4K bytes) and the two Lock Bits are erased electrically by using the proper combination of control signals and by holding P3.2 low for 10 ms. The code array is written with all “1”s in the Chip Erase operation and must be executed before any non- blank memory byte can be re-programmed. Reading the Signature Bytes: The signature bytes are read by the same procedure as a nor- mal verification of locations 000H, 001H, and 002H, except that P3.5 and P3.7 must be pulled to a logic low. The values returned are as follows. (000H) = 1EH indicates manufactured by Atmel (001H) = 41H indicates AT89C4051 13. Programming Interface Every code byte in the Flash array can be writte n and the entire array can be erased by using the appropriate combination of control signals. The write operation cycle is self-timed and once initiated, will automatically time itself to completion. Most major worldwide programming vendors offer support for the Atmel AT89 microcontroller series. Please contact your local programming vendor for the appropriate software revision. Notes: 1. The internal PEROM address counter is reset to 000H on the rising edge of RST and is advanced by a positive pulse at XTAL1 pin. 2. Chip Erase requires a 10-ms PROG pulse. 3. P3.1 is pulled Low during programming to indicate RDY/BSY .
13.1 Flash Programming Modes
Write Code Data(1)(3) 12V L H H H Read Code Data(1) HH L L H H Write Lock B i t - 1 1 2 V HHHH Bit - 2 12V H H L L Chip Erase 12V H L L L Read Signature Byte H H L L L L (2)
1001F–MICRO–6/08 AT89C4051 Note: 1. Only used in 12-volt programming mode. 15. Flash Programming and Verification Waveforms 14. Flash Programming and Verification Characteristics TA = 20°C to 30°C, VCC = 5.0 ± 10% Symbol Parameter Min Max Units VPP Programming Enable Voltage 11.5 12.5 V IPP Programming Enable Current 250 µA tDVGL Data Setup to PROG Low 1.0 µs tGHDX Data Hold after PROG 1.0 µs tEHSH P3.4 (ENABLE) High to VPP 1.0 µs tSHGL VPP Setup to PROG Low 10 µs tGHSL VPP Hold after PROG 10 µs tGLGH PROG Width 1 110 µs tELQV ENABLE Low to Data Valid 1.0 µs tEHQZ Data Float after ENABLE 01 . 0 µ s tGHBL PROG High to BUSY Low 50 ns tWC Byte Write Cycle Time 2.0 ms tBHIH RDY/BSY\\ to Increment Clock Delay 1.0 µs tIHIL Increment Clock High 200 ns
1001F–MICRO–6/08 AT89C4051 Notes: 1. Under steady state (n on-transient) conditions, IOL must be externally limited as follows: Maximum IOL per port pin: 20 mA Maximum total IOL for all output pins: 80 mA If IOL exceeds the test condition, VOL may exceed the related specification. Pins are not guaranteed to sink current greater than the listed test conditions. 2. Minimum V CC for Power-down is 2V. 16. Absolute Maximum Ratings* Maximum Ratings” may cause permanent dam- age to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Voltage on Any Pin 17. DC Characteristics TA = -40°C to 85°C, VCC = 2.7V to 6.0V (unless otherwise noted) Symbol Parameter Condition Min Max Units VIL Input Low-voltage -0.5 0.2 V CC - 0.1 V VIH Input High-voltage (Exc ept XTAL1, RST) 0.2 V CC + 0.9 V CC + 0.5 V VIH1 Input High-voltage (XTAL1, RST) 0.7 V CC VCC + 0.5 V VOL Output Low-voltage(1) (Ports 1, 3) IOL = 20 mA, VCC = 5V IOL = 10 mA, VCC = 2.7V 0.5 V VOH Output High-voltage (Ports 1, 3) IOH = -80 µA, VCC = 5V ± 10% 2.4 V IOH = -30 µA 0.75 V CC V IOH = -12 µA 0.9 V CC V IIL Logical 0 Input Current (Ports 1, 3) VIN = 0.45V -50 µA ITL Logical 1 to 0 Transition Current (Ports 1, 3) VIN = 2V, VCC = 5V ± 10% -750 µA ILI Input Leakage Current (Port P1.0, P1.1) 0 < VIN < VCC ±10 µA VOS Comparator Input Offset Voltage V CC = 5V 20 mV VCM Comparator Input Common Mode Voltage 0V CC V RRST Reset Pulldown Resistor 50 300 K Ω CIO Pin Capacitance Test Freq. = 1 MHz, T A = 25°C 10 pF ICC Power Supply Current Active Mode, 12 MHz, VCC = 6V/3V 15/5.5 mA Idle Mode, 12 MHz, VCC = 6V/3V P1.0 & P1.1 = 0V or VCC 5/1 mA Power-down Mode(2) VCC = 6V, P1.0 & P1.1 = 0V or VCC 20 µA VCC = 3V, P1.0 & P1.1 = 0V or VCC 5µ A
1001F–MICRO–6/08 AT89C4051 18. External Clock Drive Waveforms 19. External Clock Drive Symbol Parameter VCC = 2.7V to 6.0V V CC = 4.0V to 6.0V UnitsMin Max Min Max 1/tCLCL Oscillator Frequency 0 12 0 24 MHz tCLCL Clock Period 83.3 41.6 ns tCHCX High Time 30 15 ns tCLCX Low Time 30 15 ns tCLCH Rise Time 20 20 ns tCHCL Fall Time 20 20 ns
1001F–MICRO–6/08 AT89C4051 21. Shift Register Mode Timing Waveforms 22. AC Testing Input/Output Waveforms(1) Note: 1. AC Inputs during testing are driven at V CC - 0.5V for a logic 1 and 0.45V for a logic 0. Timing measurements are made at VIH min. for a logic 1 and VIL max. for a logic 0. 23. Float Waveforms(1) Note: 1. For timing purposes, a port pin is no longer floating when a 100 mV change from load voltage occurs. A port pin begins t o float when 100 mV change from the loaded VOH/VOL level occurs. 20. Serial Port Timing: Shift Register Mode Test Conditions VCC = 5.0V ± 20%; Load Capacitance = 80 pF Symbol Parameter
12 MHz Osc Variable Oscillator
tXLXL Serial Port Clock Cycle Time 1.0 12t CLCL µs tQVXH Output Data Setup to Clock Rising Edge 700 10t CLCL-133 ns tXHQX Output Data Hold after Clock Rising Edge 50 2t CLCL-117 ns tXHDX Input Data Hold after Clock Rising Edge 0 0 ns tXHDV Clock Rising Edge to Input Data Valid 700 10t CLCL-133 ns
1001F–MICRO–6/08 AT89C4051 24. ICC (Active Mode) Measurements 25. ICC (Idle Mode) Measurements 26. ICC (Power Down Mode) Measurements Notes: 1. XTAL1 tied to GND 2. P .1.0 and P1.1 = VCC or GND 3. Lock bits programmed AT89C4051 TYPICAL ICC - ACTIVE (85˚C) 0 6 12 18 24 FREQUENCY (MHz) I C C m A Vcc=6.0V Vcc=5.0V Vcc=3.0V AT89C4051 TYPICAL ICC - IDLE (85˚C) 0369 1 2 FREQUENCY (MHz) I C C m A Vcc=6.0V Vcc=5.0V Vcc=3.0V AT89C4051 TYPICAL ICC vs. VOLTAGE- POWER DOWN (85˚C) 3.0V 4.0V 5.0V 6.0V Vcc VOLTAGE I C C µ A
1001F–MICRO–6/08 AT89C4051 27. Ordering Information
27.1 Green Package Op tion (Pb/Halide-free)
(MHz) Power Supply Ordering Code Package Operation Range 12 2.7V to 6.0V AT89C4051-12PU AT89C4051-12SU 20P3 20S Industrial (-40° C to 85° C) 24 4.0V to 6.0V AT89C4051-24PU AT89C4051-24SU 20P3 20S Industrial (-40° C to 85° C) Package Type 20P3 20-lead, 0.300” Wide, Plastic Dual In-line Package (PDIP) 20S 20-lead, 0.300” Wide, Plastic Gull Wing Small Outline (SOIC)
1001F–MICRO–6/08 AT89C4051 28. Package Information 28.1 20P3 – PDIP TITLE DRAWING NO. REV. 20P3, 20-lead (0.300"/7.62 mm Wide) Plastic Dual Inline Package (PDIP) D20P3 1/23/04 PIN B E C L SEATING PLANE A D e eB eC COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE A – – 5.334 A1 0.381 – – D 24.892 – 26.924 Note 2 E 7.620 – 8.255 E1 6.096 – 7.112 Note 2 B 0.356 – 0.559 B1 1.270 – 1.551 L 2.921 – 3.810 C 0.203 – 0.356 eB – – 10.922 eC 0.000 – 1.524 e 2.540 TYP Notes: 1. This package conforms to JEDEC reference MS-001, Variation AD. 2. Dimensions D and E1 do not include mold Flash or Protrusion. Mold Flash or Protrusion shall not exceed 0.25 mm (0.010").
1001F–MICRO–6/08 AT89C4051 28.2 20S – SOIC