AM2336N-T1-PF VBSEMI | Alldatasheet
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N-Channel 30-V (D-S) MOSFET
FEATURES
- Halogen-free According to IEC 61249-2-21 Definition T re nchFET® Power MOSFET 100 % R g Tested Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
DC/DC Converter PRODUCT SUMMARY VDS (V) RDS(on) (Ω) ID (A)a Qg (Typ.) 0.030 at VGS = 10 V 6.5 4.5 nC 0.033 at VGS = 4.5 V 6.0 G S D Top View TO-236 (SOT-23) N-Channel MOSFET G D S Notes: a. Package limited b. Surface Mounted on 1" x 1" FR4 board. c. t = 5 s. d. Maximum und er steady state conditions is 130 °C/W. ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwis e noted Parameter Symbol Limit Unit Drain-Source Voltage VDS 30 VGate-Source Voltage VGS ± 20 Continuous Drain Current (TJ = 150 °C) TC = 25 °C ID 6.5a A TC = 70 °C 6.0 TA = 25 °C 5.3 TA = 70 °C 5.0 Pulsed Drain Current IDM 25 Continuous Source-Drain Diode Current TC = 25 °C IS 1.4 TA = 25 °C 0.9b, c Maximum Power Dissipation TC = 25 °C PD 1.7 WTC = 70 °C 1.1 TA = 25 °C 1.1b, c TA = 70 °C 0.7b, c Operating Junction and Storage Temper ature Range TJ, Tstg - 55 to 150 °CSoldering Recommendations (Peak Temperature)d, e 260 THERMAL RESISTANCE RATINGS Parameter Symbol Typical Maximum Unit Maxim um Junction-to-Ambientb, d t ≤ 5 s RthJA 90 115 °C/WMaximum Junction-to-Foot (Drain) Steady Sta te RthJF 60 75 www.VBsemi.tw E-mail:China@VBsemi TEL:86-755-83251052 AM2336N-T1-PF A ll data sheet.com
Notes: a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 % b. Guaranteed by design, not subject to production testing. Stresses beyond those listed under “Absolut e Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. SPECIFICATIONS TJ = 25 °C, unless otherwise no ted Parameter Symbol Test Conditions Min. T yp. Max. Unit Static Drain-Source Breakdown Voltage VDS VGS = 0 V, ID = 250 µA 30 V VDS Temperature Coefficient ΔVDS/TJ ID = 250 µA 31 mV/°CVGS(th) Temperature Coefficient ΔVGS(th)/TJ - 5 Gate-Source Threshold Voltage VGS(th) VDS = VGS , ID = 250 µA 0.7 2.0 V Gate-Source Leakage IGSS VDS = 0 V, VGS = ± 20 V ± 100 nA Zero Gate Voltage Drain Current IDSS VDS = 30 V, VGS = 0 V 1 µAVDS = 30 V, VGS = 0 V, TJ = 55 °C 10 On-State Drain Currenta ID(on) VDS ≥ 5 V, VGS = 10 V 10 A Drain-Source On-State Resistancea RDS(on) VGS = 10 V, ID = 3.2 A 0.030 ΩVGS = 4.5 V, ID = 2.8 A 0.033 Forward Transconductancea gfs VDS = 15 V, ID = 4.8 A 11 S Dynamicb Input Capacitance Ciss VDS = 15 V, VGS = 0 V, f = 1 MHz 335 pFOutput Capacitance Coss 45 Reverse Transfer Capacitance Crss 17 Total Gate Charge Qg VDS = 15 V, VGS = 10 V, ID = 3.4 A 4.5 6.7 nCVDS = 15 V, VGS = 4.5 V, ID = 3.4 A 2.1 3.2 Gate-Source Charge Qgs 0.85 Gate-Drain Charge Qgd 0.65 Gate Resistance Rg f = 1 MHz 0.8 4.4 8.8 Ω Tur n-On Dela y Time td(on) VDD = 15 V, RL = 5.6 Ω ID ≅ 2.7 A, VGEN = 4.5 V, Rg = 1 Ω 12 20 ns Rise Time tr 50 75 Turn-Off Delay Time td(off) 12 20 Fall Time tf 22 35 Tur n-On Del ay Time td(on) VDD = 15 V, RL = 5.6 Ω ID ≅ 2.7 A, VGEN = 10 V, Rg = 1 Ω 51 0 Rise Time tr 12 20 Turn-Off Delay Time td(off) 10 15 Fall Time tf 51 0 Drain-Source Body Diode Chara cteristics Continuous Source-Drain Diode Current IS TC = 25 °C 1.4 A Pulse Diode Forward Current ISM 15 Body Diode Voltage VSD IS = 2.7 A, VGS = 0 V 0.8 1.2 V Body Diode Reverse Recovery Time trr IF = 2.7 A, dI/dt = 100 A/µs, TJ = 25 °C 10 20 ns Body Diode Reverse Recovery Charge Qrr 51 0 n C Reverse Recovery F all Time ta 6 ns Reverse Recovery Rise Time tb 4 1.1 www.VBsemi.tw E-mail:China@VBsemi TEL:86-755-83251052 AM2336N-T1-PF A ll data sheet.com
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted Output Characteristics On-Re sistance vs. Drain Current and Gate Voltage Gate Charge VGS =1 0V thru 4 V VGS =3V VDS - Drain-to-Source Voltage (V) - Drain Current (A)I D 0.00 0.02 0.03 0.04 0.05 0.10 0369 1 2 1 5 VGS =4 .5 V VGS =1 0V - On-Resistance (Ω)RDS(on) ID - Drain Current (A) 012345 VDS =2 4V VDS =7 . 5V ID =3 . 4A VDS =1 5V - Gate-to-Source Voltage (V) Qg - Total Gate Charge (nC) VGS Transfer Characteristics Capacitance On-Resistan ce vs. Junction Temperature TC = 25 °C TC = 125 °C TC = - 55 °C VGS - Gate-to-Source Voltage (V) - Drain Current (A)I D Crss 100 150 200 250 300 0 5 10 15 20 25 30 Ciss Coss VDS - Drain-to-Source Voltage (V) C - Capacitance (pF) 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 - 50 - 25 0 25 50 75 100 125 150 ID =3 . 2A VGS =1 0V TJ -J unction Temperature (°C) (Normalized) - On-ResistanceRDS(on) www.VBsemi.tw E-mail:China@VBsemi TEL:86-755-83251052 AM2336N-T1-PF A ll data sheet.com
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted Source-Drain Diod e Forward Voltage Threshold Voltage 0.1 100 TJ = 150 °C TJ = 25 °C VSD -S ource-to-Drain Voltage (V - Source Current (A)I S 1.2 1.4 1.6 1.8 2.0 2.2 2.4 - 50 - 25 0 25 50 75 100 125 150 ID = 250 µA (V)VGS(th) TJ - Temperature (°C) On-Resistance vs. Gate-to-Source Voltage Single Pulse Power 0.04 0.06 0.08 0.10 0.12 0.14 0246 8 10 ID =3 . 2A TJ =2 5 ° C TJ = 125 °C - On-Resistance (Ω)RDS(on) VGS - Gate-to-Source Voltage (V) Power ( W) Time (s) 10 10000.10.010.001 1001 Safe Operating Area, Junction-to-Ambien t 100 0.1 1 10 100 0.01 0.1 TA = 25 °C Single Pulse 100 ms Limited byR DS(on)* BVDSS Limited 1m s 100 µs 10 ms DC VDS - Drain-to-Source Voltage (V * VGS > minimu m VGS at which RDS(on) is specified - Drain Current (A)ID 1s ,1 0s www.VBsemi.tw E-mail:China@VBsemi TEL:86-755-83251052 AM2336N-T1-PF A ll data sheet.com
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted * The power dissipation P D is based on T J(max) = 150 °C, using junction-to-case thermal resi stance, and is more useful in settling the upper dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package limit. Current Derating* 0 2 55 07 5 1 0 0 1 2 5 1 5 0 Package Limited TC - Case Temperature (°C) I D - Drain Current (A) Power Derating 0.0 0.5 1.0 1.5 2.0 25 50 75 100 125 150 T C - Case Temperature (°C) Power (W www.VBsemi.tw E-mail:China@VBsemi TEL:86-755-83251052 AM2336N-T1-PF A ll data sheet.com
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted Normalized Thermal Transient Impedance, Junc tion-to-Ambient 10-3 10-2 1 10 100010-110-4 100 0.2 0.1 Square WaveP ulse Duration (s) Normalized Effective Transient Thermal Impedance 0.1 0.01 Notes: PDM 1. Duty Cycle, D = 2. Per Unit B ase = RthJA =1 3 0 ° C /W 3. TJM -T A =P DMZthJA(t) 4. Surface Mounted Duty Cycle = 0.5 Single Pulse 0.02 0.05 Normalized Thermal Transient Impedance, Junctio n-to-Foot 0.1 0.01 Duty Cycle = 0.5 Square WaveP u lse Duration (s) Normalized Effective Transient Thermal Impedance 10-3 10-2 110-110-4 0.02 Single Pulse 0.1 0.2 0.05 www.VBsemi.tw E-mail:China@VBsemi TEL:86-755-83251052 AM2336N-T1-PF A ll data sheet.com
SOT-23 (TO-236): 3-LEAD b EE1 S e D A2A A1 C Seating Plane 0.10 mm 0.004" C C L q Gauge Plane Seating Plane 0.25 mm Dim MILLIMETERS INCHES Min Max Min Max A 0.89 1.12 0.035 0.044 A1 0.01 0.10 0.0004 0.004 A2 0.88 1.02 0.0346 0.040 b 0.35 0.50 0.014 0.020 c 0.085 0.18 0.003 0.007 D 2.80 3.04 0.110 0.120 E 2.10 2.64 0.083 0.104 E1 1.20 1.40 0.047 0.055 e 0.95 BSC 0.0374 Ref e1 1.90 BSC 0.0748 Ref L 0.40 0.60 0.016 0.024 L1 0.64 Ref 0.025 Ref S 0.50 Ref 0.020 Ref q 3°8 ° 3°8 ° ECN: S-03946-Rev. K, 09-J ul-01 DWG: 5479 www.VBsemi.tw E-mail:China@VBsemi TEL:86-755-83251052 AM2336N-T1-PF A ll data sheet.com
RECOMMENDED MINIMUM PADS FOR SOT-23 0.106 (2.692) Recommended Minimum Pads Dimensions in Inches/(mm) 0.022 (0.559) 0.049 (1.245) 0.029 (0.724) 0.037 (0.950) 0.053 (1.341) 0.097 (2.459) Return to IndexReturn to Index www.VBsemi.tw E-mail:China@VBsemi TEL:86-755-83251052 AM2336N-T1-PF A ll data sheet.com
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