75150

75150 SYC | Alldatasheet

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Technical content

/C0068Meets or Exceeds the Requirement of TIA/EIA-232-F and ITU Recommendation V.28 /C0068Withstands Sustained Output Short Circuit to Any Low-Impedance Voltage Between –25 V and 25 V /C00682-µs Maximum Transition Time Through the 3-V to –3-V Transition Region Under Full 2500-pF Load /C0068Inputs Compatible With Most TTL Families /C0068Common Strobe Input /C0068Inverting Output /C0068Slew Rate Can Be Controlled With an External Capacitor at the Output /C0068Standard Supply Voltages . . .± 12 V

description

The SN75150 is a monolithic dual line driver designed to satisfy the requirements of the standard interface between data-terminal equipment and data-communication equipment as defined by TIA/EIA-232-F. A rate of 20 kbits/s can be transmitted with a full 2500-pF load. Other applications are in data-transmission systems using relatively short single lines, in level translators, and for driving MOS devices. The logic input is compatible with most TTL families. Operation is from 12-V and –12-V power supplies. The SN75150 is characterized for operation from 0°C to 70°C. logic symbol† † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. EN S 2A 3 logic diagram (positive logic) ÎÎ ÎÎ ÎÎ ÎÎ ÎÎ S S GND VCC+ VCC– D OR P PACKAGE (TOP VIEW)

SLLS081C – JANUARY 1971 – REVISED JUNE 1999 schematic (each line driver) VCC– Line Driver To Other GND Strobe S To Other Line Driver 4.5 kΩ 15 kΩ 7 kΩ VCC+ Input A 15 kΩ 10 kΩ 15 kΩ 5 kΩ 47 Ω Output Y 10 kΩ 5 kΩ 1 kΩ 47 Ω 11 kΩ To Other Line Driver Line Driver To Other Resistor values shown are nominal.

SLLS081C – JANUARY 1971 – REVISED JUNE 1999 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. Voltage values are with respect to network ground terminal. 2. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can impact reliability. 3. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace length of zero. recommended operating conditions MIN NOM MAX UNIT Supply voltage VCC+ 10.8 12 13.2 VSupply voltage V High-level input voltage, VIH 2 5.5 V Low-level input voltage, VIL 0 0.8 V Driver output voltage, VO ± 15 V Operating free-air temperature, TA 0 70 °C

SLLS081C – JANUARY 1971 – REVISED JUNE 1999 electrical characteristics over recommended operating free-air temperature range, VCC ± = ± 13.2 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP † MAX UNIT VOH High-level output voltage VCC+ = 10.8 V, VIL = 0.8 V, VCC– = –10.8 V, R L = 3 kΩ to 7 kΩ 5 8 V VOL Low-level output voltage (see Note 4) VCC+ = 10.8 V, VIH = 2 V, VCC– = –10.8 V, R L = 3 kΩ to 7 kΩ –8 –5 V IIH High level input current Data input VI=24V 1 10 µAIIH High-level input current Strobe input VI = 2.4 V 2 20 µA IIL Low level input current Data input VI=04V –1 –1.6 mAIIL Low-level input current Strobe input VI = 0.4 V –2 –3.2 mA VO = 25 V 2 8 IOS Short circuit output current‡ VO = –25 V –3 –8 mAIOS Short-circuit output current‡ VO = 0, VI = 3 V 10 15 30 mA VO = 0, VI = 0 –10 –15 –30 ICCH+ Supply current from VCC+ , high-level output VI = 0, RL = 3 kΩ , 10 22 mA ICCH– Supply current from VCC– , high-level output I , L , TA = 25°C –1 –10 mA ICCL+ Supply current from VCC+ , low-level output VI = 3 V, R L = 3 kΩ , 8 17 mA ICCL– Supply current from VCC– , low-level output IL TA = 25°C –9 –20 mA † All typical values are at VCC+ = 12 V, VCC– = –12 V, TA = 25°C. ‡ Not more than one output should be shorted at a time. NOTE 4: The algebraic convention, in which the less positive (more negative) limit is designated as minimum, is used in this data sheet for logic levels only, e.g., when –5 V is the maximum, the typical value is a more negative voltage. switching characteristics, VCC+ = 12 V, VCC– = –12 V, TA = 25°C (see Figure 1) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT tTLH Transition time, low-to-high-level output C L = 2500 pFR L =3k Ω to7k Ω 0.2 1.4 2 µs tTHL Transition time, high-to-low-level output C L = 2500 pF, R L = 3 kΩ to 7 kΩ 0.2 1.5 2 µs tTLH Transition time, low-to-high-level output C L =1 5 pFR L =7k Ω 40 ns tTHL Transition time, high-to-low-level output C L = 15 pF, R L = 7 kΩ 20 ns tPLH Propagation delay time, low-to-high-level output C L =1 5 pFR L =7k Ω 60 ns tPHL Propagation delay time, high-to-low-level output C L = 15 pF, R L = 7 kΩ 45 ns

NOTES: A. The pulse generator has the following characteristics: duty cycle ≤ 50%, ZO ≈ 50 Ω . B. C L includes probe and jig capacitance. Figure 1. Test Circuit and Voltage Waveforms

SLLS081C – JANUARY 1971 – REVISED JUNE 1999 TYPICAL CHARACTERISTICS –25 IO – Output Current – mA VO – Applied Output Voltage – V –20 –20 –15 –10 –5 0 5 10 15 20 –15 –10 VCC + = 12 V VCC– = –12 V TA = 25°C VI = 2.4 V R L = 3 kΩ R L = 7 kΩ VI = 0.4 V OUTPUT CURRENT vs APPLIED OUTPUT VOLTAGE IO Figure 2

(TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for

applications

design. Customers are responsible for their products and components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Low Power www.ti.com/lpw Telephony www.ti.com/telephony Wireless Video Imaging www.ti.com/video Wireless www.ti.com/wireless

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) SN75150D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75150DE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75150DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75150DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75150DRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75150DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75150JG OBSOLETE CDIP JG 8 TBD Call TI Call TI SN75150P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN75150PE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 23-Apr-2007 Addendum-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN75150DR SOIC D 8 2500 340.5 338.1 20.6 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 Pack Materials-Page 2

MPDI001A – JANUARY 1995 – REVISED JUNE 1999 P (R-PDIP-T8) PLASTIC DUAL-IN-LINE 0.015 (0,38) Gage Plane 0.325 (8,26) 0.300 (7,62) 0.010 (0,25) NOM MAX 0.430 (10,92) 4040082/D 05/98 0.200 (5,08) MAX 0.125 (3,18) MIN 0.355 (9,02) 0.020 (0,51) MIN 0.070 (1,78) MAX 0.240 (6,10) 0.260 (6,60) 0.400 (10,60) 0.015 (0,38) 0.021 (0,53) Seating Plane M0.010 (0,25) 0.100 (2,54) NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001 For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm

MCER001A – JANUARY 1995 – REVISED JANUARY 1997 JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE 0.310 (7,87) 0.290 (7,37) 0.014 (0,36) 0.008 (0,20) Seating Plane 4040107/C 08/96 0.065 (1,65) 0.045 (1,14) 0.020 (0,51) MIN 0.400 (10,16) 0.355 (9,00) 0.015 (0,38) 0.023 (0,58) 0.063 (1,60) 0.015 (0,38) 0.200 (5,08) MAX 0.130 (3,30) MIN 0.245 (6,22) 0.280 (7,11) 0.100 (2,54) 0°–15° NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. This package can be hermetically sealed with a ceramic lid using glass frit. D. Index point is provided on cap for terminal identification. E. Falls within MIL STD 1835 GDIP1-T8

(TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for design. Customers are responsible for their products and components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DLP Products www.dlp.com Broadband www.ti.com/broadband DSP dsp.ti.com Digital Control www.ti.com/digitalcontrol Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Military www.ti.com/military Logic logic.ti.com Optical Networking www.ti.com/opticalnetwork Power Mgmt power.ti.com Security www.ti.com/security Microcontrollers microcontroller.ti.com Telephony www.ti.com/telephony RFID www.ti-rfid.com Video Imaging www.ti.com/video RF/IF and ZigBee Solutions www.ti.com/lprf Wireless www.ti.com/wireless