74HC-HCT257 SYC | Alldatasheet

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Technical content

  1. General description The 74HC257; 74HCT257 are high-speed Si-gate CMOS devices and are pin compatible with Low-power Schottky TTL (LSTTL). The 74HC257 and 74HCT257 have four identical 2-input multiplexers with 3-state outputs, which select 4 bits of data from two sources and are controlled by a common data select input (S). The data inputs from source 0 (1I0 to 4I0) are selected when input S is LOW and the data inputs from source 1 (1I1 to 4I1) are selected when S is HIGH. Data appears at the outputs (1Y to 4Y) in true (non-inverting) form from the selected inputs. The 74HC257 and 74HCT257 are the logic implementation of a 4-pole, 2-position switch, where the position of the switch is determined by the logic levels applied to S. The outputs are forced to a high-impedance OFF-state when OE is HIGH. The logic equations for the outputs are: Except for their non-inverting (true) outputs the 74HC257; 74HCT257 are identical to the 74HC258. 2. Features „ Non-inverting data path „ 3-state outputs interface directly with system bus „ Complies with JEDEC standard no. 7A „ ESD protection: ‹ HBM JESD22-A114E exceeds 2 000 V ‹ MM JESD22-A115-A exceeds 200 V „ Multiple package options „ Specified from −40 °C to +85 °C and from −40 °C to +125 °C 74HC257; 74HCT257 Quad 2-input multiplexer; 3-state Rev. 05 — 13 January 2010 Product data sheet 1Y OE 1I1 S • 1I0• S•()•= 2Y OE 2I1 S • 2I0• S•()•= 3Y OE 3I1 S • 3I0• S•()•= 4Y OE 4I1 S • 4I0• S•()•=

74HC_HCT257_5 © NXP B.V. 2010. All rights reserved. Table 1. Ordering information

1 MUX

74HC_HCT257_5 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 05 — 13 January 2010 3 of 17 NXP Semiconductors 74HC257; 74HCT257 Quad 2-input multiplexer; 3-state Fig 3. Functional diagram mgr280 1I0 1I1 SELECTOR 3-STATE MULTIPLEXER OUTPUTS 2I0 2I1 3I0 3I1 4I0 4I1 OE15 Fig 4. Logic diagram 001aad468 S OE 1I0 1I1 2I0 2I1 3I0 3I1 4I0 4I1

74HC_HCT257_5 © NXP B.V. 2010. All rights reserved.

5.1 Pinning

5.2 Pin description

6.1 Function table

[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state. Table 2. Pin description Table 3. Function table [1]

74HC_HCT257_5 © NXP B.V. 2010. All rights reserved. [1] For DIP16 packages: above 70 °C, Ptot derates linearly with 12 mW/K. [2] For SO16 packages: above 70 °C, Ptot derates linearly with 8 mW/K. [3] For SSOP16 and TSSOP16 packages: above 60 °C, Ptot derates linearly with 5.5 mW/K.

  1. Recommended operating conditions

Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Table 5. Recommended operating conditions

74HC_HCT257_5 © NXP B.V. 2010. All rights reserved. Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

74HC_HCT257_5 © NXP B.V. 2010. All rights reserved. Table 6. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); For test circuit see Figure 8.

74HC_HCT257_5 © NXP B.V. 2010. All rights reserved. [1] t pd is the same as tPHL, tPLH. [2] t en is the same as tPZH, tPZL. [3] t dis is the same as tPHZ, tPLZ. [4] t t is the same as tTHL, tTLH. [5] C PD is used to determine the dynamic power dissipation (PD in μW). ∑(CL × VCC2 × fo) = sum of outputs. Table 7. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); For test circuit see Figure 8.

74HC_HCT257_5 © NXP B.V. 2010. All rights reserved. Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Table 8. Measurement points

74HC_HCT257_5 © NXP B.V. 2010. All rights reserved. Measurement points are given in Table 8 and test data is given in Table 9. RT = Termination resistance should be equal to output impedance Zo of the pulse generator. CL = Load capacitance including jig and probe capacitance. Table 9. Test data

74HC_HCT257_5 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 05 — 13 January 2010 11 of 17 NXP Semiconductors 74HC257; 74HCT257 Quad 2-input multiplexer; 3-state 12. Package outline Fig 9. Package outline SOT38-4 (DIP16) REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT38-4 95-01-14 03-02-13 MH c (e )1 ME A L seating plane w M e D Z E pin 1 index b 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. UNIT A max. 12 b1 (1) (1) (1) b2 cD E e M ZHL mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) A min. A max. b max.wMEe1 1.73 1.30 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 3.60 7.80 10.0 inches 0.068 0.051 0.021 0.015 0.014 0.009 1.25 0.85 0.049 0.033 0.77 0.73 0.26 0.24 0.14 0.31 0.39 DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4

74HC_HCT257_5 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 05 — 13 January 2010 12 of 17 NXP Semiconductors 74HC257; 74HCT257 Quad 2-input multiplexer; 3-state Fig 10. Package outline SOT109-1 (SO16) X w M θ AA1 bp D HE Lp Q detail X E Z e c L v M A (A )3 A y pin 1 index UNIT A max. A1 A2 A3 bp cD (1) E(1) (1)eH E LL p QZ ywv θ REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 o o 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.0 0.4 SOT109-1 99-12-27 03-02-19 076E07 MS-012 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.39 0.38 0.16 0.15 0.05 1.05 0.0410.244 0.228 0.028 0.020 0.028 0.0120.01 0.25 0.01 0.0040.039 0.016 0 2.5 5 mm scale SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1

74HC_HCT257_5 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 05 — 13 January 2010 13 of 17 NXP Semiconductors 74HC257; 74HCT257 Quad 2-input multiplexer; 3-state Fig 11. Package outline SOT338-1 (SSOP16) UNIT A 1 A2 A3 bp cD (1) E (1) eH E LL p QZ ywv θ REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 6.4 6.0 5.4 5.2 0.65 1.257.9 7.6 1.03 0.63 0.9 0.7 1.00 0.55 o o0.130.2 0.1 DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. SOT338-1 99-12-27 03-02-19 (1) w M bp D HE E Z e c v M A X A y 1 8 16 9 θ AA1 Lp Q detail X L (A )3 MO-150 pin 1 index 0 2.5 5 mm scale SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1 A max.

74HC_HCT257_5 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 05 — 13 January 2010 14 of 17 NXP Semiconductors 74HC257; 74HCT257 Quad 2-input multiplexer; 3-state Fig 12. Package outline SOT403-1 (TSSOP16) UNIT A 1 A2 A3 bp cD (1) E (2) (1)eH E LL p QZ ywv θ REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.40 0.06 o o0.13 0.10.21 DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 SOT403-1 MO-153 99-12-27 03-02-18 w M bp D Z e 0.25 16 9 θ AA1 Lp Q detail X L (A )3 HE E c v M A XA y 0 2.5 5 mm scale TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 A max. 1.1 pin 1 index

74HC_HCT257_5 © NXP B.V. 2010. All rights reserved. Table 10. Revision history

74HC_HCT257_5 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 05 — 13 January 2010 16 of 17 NXP Semiconductors 74HC257; 74HCT257 Quad 2-input multiplexer; 3-state 14. Legal information

14.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

14.2 Definitions

Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

14.3 Disclaimers

General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.

14.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 15. Contact information For sales office addresses, please send an email to: info@sycelectronica.com.ar Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.

NXP Semiconductors 74HC257; 74HCT257 Quad 2-input multiplexer; 3-state © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 13 January 2010 Document identifier: 74HC_HCT257_5 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 16. Contents