7406

7406 SYC | Alldatasheet

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SN5406, SN5416, SN7406, SN7416 HEX INVERTER BUFFERS/DRIVERS WITH OPEN-COLLECTOR HIGH-VOLTAGE OUTPUTS SDLS031A – DECEMBER 1983 – REVISED DECEMBER 2001 /C0068 Convert TTL Voltage Levels to MOS Levels /C0068 High Sink-Current Capability /C0068 Input Clamping Diodes Simplify System Design /C0068 Open-Collector Drivers for Indicator Lamps and Relays /C0068 Inputs Fully Compatible With Most TTL Circuits

description

These TTL hex inverter buffers/drivers feature high-voltage open-collector outputs for interfacing with high-level circuits (such as MOS) or for driving high-current loads (such as lamps or relays), and also are characterized for use as inverter buffers for driving TTL inputs. The SN5406 and SN7406 have minimum breakdown voltages of 30 V. The SN5416 and SN7416 have minimum breakdown voltages of 15 V. The maximum sink current is 30 mA for the SN5406 and SN5416, and 40 mA for the SN7406 and SN7416.

ORDERING INFORMATION

TA PACKAGE † ORDERABLE PART NUMBER TOP-SIDE MARKING Tube SN7406D 7406 SOIC D Tape and reel SN7406DR 7406 SOIC – D Tube SN7416D 7416 0°C to 70°C Tape and reel SN7416DR 7416 PDIP N Tube SN7406N SN7406N PDIP – N Tube SN7416N SN7416N SOP – NS Tape and reel SN7406NSR SN7406 CDIP J Tube SNJ5406J SNJ5406J CDIP – J Tube SNJ5416J SNJ5416J –55°C to 125°C CDIP W Tube SNJ5406W SNJ5406W CDIP – W Tube SNJ5416W SNJ5416W LCCC – FK Tube SNJ5406FK SNJ5406FK † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. SN5406, SN5416 ...J O R W PACKAGE SN7406 . . . D, N, OR NS PACKAGE SN7416 ...D O R N PACKAGE (TOP VIEW) GND V CC 3212 0 1 9 91 0 1 1 1 2 1 3 NC NC NC NC SN5406 . . . FK PACKAGE (TOP VIEW)1Y NC 6A 6A GND NC CCV4Y NC – No internal connection www.sycelectronica.com.ar

SN5406, SN5416, SN7406, SN7416 HEX INVERTER BUFFERS/DRIVERS WITH OPEN-COLLECTOR HIGH-VOLTAGE OUTPUTS SDLS031A – DECEMBER 1983 – REVISED DECEMBER 2001 logic diagram (positive logic) Y = A schematic (each buffer/driver) Resistor values shown are nominal. 6 kΩ Input A Output Y GND VCC 1.4 kΩ 1.6 kΩ 100 Ω 1 kΩ 2 kΩ ’06, ’16 absolute maximum ratings over operating free-air temperature (unless otherwise noted)† † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. Voltage values are with respect to network ground terminal. 2. This is the maximum voltage which should be applied to any output when it is in the off state. 3. The package thermal impedance is calculated in accordance with JESD 51-7. www.sycelectronica.com.ar

SN5406, SN5416, SN7406, SN7416 HEX INVERTER BUFFERS/DRIVERS WITH OPEN-COLLECTOR HIGH-VOLTAGE OUTPUTS SDLS031A – DECEMBER 1983 – REVISED DECEMBER 2001 recommended operating conditions SN5406 SN5416 SN7406 SN7416 UNIT MIN NOM MAX MIN NOM MAX VCC Supply voltage 4.5 5 5.5 4.75 5 5.25 V VIH High-level input voltage 2 2 V VIL Low-level input voltage 0.8 0.8 V VOH High level output voltage ’06 30 30 VVOH High-level output voltage ’16 15 15 V IOL Low-level output current 30 40 mA TA Operating free-air temperature –55 125 0 70 °C electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS † SN5406 SN5416 SN7406 SN7416 UNIT MIN TYP ‡ MAX MIN TYP ‡ MAX VIK VCC = MIN, II = –12 mA –1.5 –1.5 V IOH VCC = MIN, VIL = 0.8 V, VOH = § 0.25 0.25 mA VOL VCC = MIN VIH =2V IOL = 16 mA 0.4 0.4 VVOL VCC = MIN , VIH = 2 V IOL = ¶ 0.7 0.7 V II VCC = MAX, VI = 5.5 V 1 1 mA IIH VCC = MAX, VIH = 2.4 V 40 40 µA IIL VCC = MAX, VIL = 0.4 V –1.6 –1.6 mA ICCH VCC = MAX 30 48 30 48 mA ICCL VCC = MAX 32 51 32 51 mA † For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions. ‡ All typical values are at VCC = 5 V, TA = 25°C. § VOH = 30 V for ’06 and 15 V for ’16. ¶ IOL = 30 mA for SN54’ and 40 mA for SN74’. switching characteristics, VCC = 5 V, TA = 25°C (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) TEST CONDITIONS MIN TYP MAX UNIT tPLH A Y R1 1 0 Ω C1 5 p F 10 15 ns tPHL A Y R L = 110 Ω , C L = 15 pF 15 23 ns www.sycelectronica.com.ar

NOTES: A. C L includes probe and jig capacitance. B. In the examples above, the phase relationships between inputs and outputs have been chosen arbitrarily. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω , tr ≤ 7 ns, tf≤ 7 ns. D. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) JM38510/00801BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type JM38510/00801BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SN5406J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN5416J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SN7406D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN7406DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN7406DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN7406DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN7406DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN7406DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN7406J OBSOLETE CDIP J 14 TBD Call TI Call TI SN7406N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7406N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN7406NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7406NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN7406NSRE4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN7406NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN7416D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN7416DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN7416DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN7416DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN7416DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN7416DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN7416N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7416N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN7416NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN7416NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN7416NSRE4 ACTIVE SO NS 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM PACKAGE OPTION ADDENDUM 15-Oct-2009 www.sycelectronica.com.ar

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) no Sb/Br) SN7416NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ5406FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ5406J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ5406W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNJ5416J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ5416W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 www.sycelectronica.com.ar

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION 19-Mar-2008 Pack Materials-Page 1 www.sycelectronica.com.ar

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN7406DR SOIC D 14 2500 333.2 345.9 28.6 SN7406DR SOIC D 14 2500 346.0 346.0 33.0 SN7406NSR SO NS 14 2000 346.0 346.0 33.0 SN7416DR SOIC D 14 2500 346.0 346.0 33.0 SN7416NSR SO NS 14 2000 346.0 346.0 33.0 PACKAGE MATERIALS INFORMATION 19-Mar-2008 Pack Materials-Page 2 www.sycelectronica.com.ar

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MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 4040140/D 10/96

28 TERMINAL SHOWN

B 0.358 (9,09) MAX (11,63) 0.560 (14,22) 0.560 0.458 0.858 (21,8) 1.063 (27,0) (14,22) ANO. OF MINMAX 0.358 0.660 0.761 0.458 0.342 (8,69) MIN (11,23) (16,26) 0.640 0.739 0.442 (9,09) (11,63) (16,76) 0.962 1.165 (23,83) 0.938 (28,99) 1.141 (24,43) (29,59) (19,32)(18,78) 0.020 (0,51) TERMINALS 0.080 (2,03) 0.064 (1,63) (7,80) 0.307 (10,31) 0.406 (12,58) 0.495 (12,58) 0.495 (21,6) 0.850 (26,6) 1.047 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.035 (0,89) 0.010 (0,25) 121314151618 17 432 0.020 (0,51) 0.010 (0,25) 12826 27 B SQ A SQ 0.055 (1,40) 0.045 (1,14) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. This package can be hermetically sealed with a metal lid. D. The terminals are gold plated. E. Falls within JEDEC MS-004 www.sycelectronica.com.ar

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