3321P GENNUM | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 8
Technical content
Features
Applications
Schematic & Pin Confi guration SLP1006P2 package u Molding compound fl ammability rating: UL 94V-0 u Marking: Marking code u Packaging: Tape and Reel u Lead Finish: NiPdAu u Pb-Free, Halogen Free, RoHS/WEEE Compliant u USB 3.0 u HDMI 1.3/1.4 u V-By-One u Display Port u MHL / MDDI u LVDS Interfaces u eSATA Interfaces u Mechanical Characteristics ))&(<&< ))&(<(< Nominal Dimensions (mm) SLP1006P2 (Bottom View)
2 2013 Semtech Corporation. www.semtech.com RClamp3321P PROTECTION PRODUCTS Absolute Maximum Ratings Electrical Characteristics (T=25 OC unless otherwise specifi ed) Rating Symbol Value Units Peak Pulse Power (tp = 8/20µs) P PK 25 Watts Maximum Peak Pulse Current (tp = 8/20µs) I PP 3 Amps ESD per IEC 61000-4-2 (Air) 1 ESD per IEC 61000-4-2 (Contact) 1 VESD +/- 17 +/- 12 kV Operating Temperature TJ -55 to +125 OC Storage Temperature TSTG -55 to +150 OC Parameter Symbol Conditions Min. Typ. Max. Units Reverse Stand-Off Voltage V RWM 3.3 V Breakdown Voltage V BR IBR = 1mA 5.5 7 8.5 V Reverse Leakage Current I R VRWM = 3.3V 10 50 nA Clamping Voltage V C IPP = 1A, tp = 8/20µs 9.5 10 V Clamping Voltage V C IPP = 4A, tp = 8/20µs 10.5 13 V ESD Clamping Voltage 2 VC IPP = 4A, tlp = 0.2/100ns 8.8 V ESD Clamping Voltage 2 VC IPP = 16A, tlp = 0.2/100ns 14.5 V Trigger Voltage 2 VTRIG tlp = 0.2/100ns 8 V Dynamic Resistance 2, 3 RDYN tlp = 0.2 / 100ns 0.47 Ω Junction Capacitance C j VR = 0V, f = 1MHz 0.22 0.35 pF Notes 1)ESD gun return path connected to ESD ground reference plane. 2)TLP Settings: t p = 100ns, t r = 0.2ns, I TLP and V TLP sample window: t 1 = 70ns to t 2 = 90ns. 3) Dynamic resistance calculated from I pp = 4A to I pp = 16A using “Best Fit” 4) Device is electrically symmetrical
3 2013 Semtech Corporation. www.semtech.com RClamp3321P PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time 8x20us Peak Clamping Voltage vs Peak Current Capacitance vs. Temperature vs. Bias Voltage TLP Characteristic 0.0 0.2 0.4 0.6 0.8 -50 0 50 100 150 Junction Capacitance - CJ (pF) Temperature ( OC) VR = 0V VR = 3.3V RC3321P_AR_CJ f = 1MHz ESD Clamping (-8kV Contact per IEC 61000-4-2) -140 -120 -100 -80 -60 -40 -20 -20 0 20 40 60 80 100 Clamping Voltage - VC (V) Time (ns) TA = 25 OC. Waveform IEC61000-4-2 -8kV. Measured with and corrected for 50Ω, 40dB Attenuator. 50Ω Scope Input Impedance, 2GHz BW. ESD Gun Return connected to ESD Ground Plane RC3321P_AR_N8_ESD 100 1000 0.1 1 10 100 1000 Peak Pulse Power - PPP (W) Pulse Duration - tp (µs) DR040412-25 TA = 25 OC 0 1 2 3 4 5 Peak Clamping Voltage - VC (V) Peak Pulse Current - IPP (A) RC3321P_AR_8_20 Surge TA = 25 OC Waveform 8x20us 0 5 10 15 20 TLP Current (A) DUT Voltage (V) RC3321P_AR_TLP TA = 25 OC tP = 100ns tR = 0.2ns tMEAS = 70-90ns RDYN = 0.47Ω Typ. Both Directions -20 100 120 140 -20 0 20 40 60 80 100 Clamping Voltage - VC (V) Time (ns) TA = 25 OC. Waveform IEC61000-4-2 +8kV. Measured with and corrected for 50Ω, 40dB Attenuator. 50Ω Scope Input Impedance, 2GHz BW. ESD Gun Return connected to ESD Ground Plane. RC3321P_AR_P8_ESD ESD Clamping (+8kV Contact per IEC 61000-4-2)
4 2013 Semtech Corporation. www.semtech.com RClamp3321P PROTECTION PRODUCTS Typical Characteristics (Continued) -10 10 100 1000 10000 Insertion Loss - IL (dB) Frequency (MHz) RC3321P_AR_IL_SIM Typical Insertion Loss (S21)
5 2013 Semtech Corporation. www.semtech.com RClamp3321P PROTECTION PRODUCTS "<A "<= **'$ -$$" A */" **'$=-= USB3.0 Eye Diagram USB3.0 Layout Diagram Applications Information
6 2013 Semtech Corporation. www.semtech.com RClamp3321P PROTECTION PRODUCTS Applications Information Device Connection Options These low capacitance TVS diodes are designed to provide common mode protection for one high-speed line or differential protection for one line pair. The device is bidirectional and may be used on lines where the signal polarity is positive and negative. Circuit Board Layout Recommendations for Suppres- sion of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: l Place the TVS near the input terminals or connectors to restrict transient coupling. l Minimize the path length between the TVS and the protected line. l Minimize all conductive loops including power and ground loops. l The ESD transient return path to ground should be kept as short as possible. l Never run critical signals near board edges. l Use ground planes whenever possible. Equivalent Circuit Diagram ))&(<)<
7 2013 Semtech Corporation. www.semtech.com RClamp3321P PROTECTION PRODUCTS Outline Drawing - SLP1006P2 Land Pattern - SLP1006P2 INCHES .026 BSC aaa N E L e .008 .020 DIM A MIN .018 .016 0.30 0.70 0.20 0.50 .003 .010 .024 .012 .028 0.08 0.25 0.60
0.65 BSC
0.55 0.55 DIMENSIONS MIN 0.45 NOM .020 .020 MAX .022 .022 NOM 0.40 0.50 0.50 CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). NOTES: BOTTOM VIEW TOP VIEW A B C b aaa C SEATING PLANE bbb C A B .004 bbb 0.10 D E A bxN e R 2x L PIN 1 ID THIS LAND P ATTE RN IS FOR RE FE RE NCE P URP OSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO E NSURE YOUR NOTES: DIM Y G C MILLIMETERS INCHES (0.85) .055 .012 .022 (.033) 1.40 0.55 0.30 DIMENSIONS COMP ANY'S MANUFACTURING GUIDE LINE S ARE ME T. Z Y (C) G Z X .024 0.60 X 1. CONTROLLING DIME NSIONS ARE IN MILLIME TE RS (ANGLE S IN DE GRE E S).
8 2013 Semtech Corporation. www.semtech.com RClamp3321P PROTECTION PRODUCTS Marking Tape and Reel Specifi cation
Ordering Information
Notes: 1) Device is electrically symmetrical 2) Marking will also include line matrix date code Note: RailClamp and RClamp are trademarks of Semtech Corporation Part Number Qty per Reel Reel Size RClamp3321P.TNT 10,000 7 inch **'$=5= Ko Ao Bo A0 B0 K0 Note: All dimensions in mm unless otherwise specifi ed ))&(<5< A Device Orientation in Tape Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804