3346P

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1 www.semtech.com PRELIMINARYPROTECTION PRODUCTS - RailClamp®®®®® RClamp3346P Low Capacitance RClamp® 6-Line ESD protection Description Features Dimensions Circuit Diagram Revision 11/12/2013

Applications

Mechanical Characteristics  ESD protection for high-speed data lines to IEC 61000-4-2 (ESD) ±20kV (air), ±17kV (contact) IEC 61000-4-5 (Lightning) 5A (8/20 μs) IEC 61000-4-4 (EFT) 40A (5/50ns)  Package design optimized for high speed lines  Flow-Through design  Protects six high-speed lines  Low capacitance: 0.65pF Maximum (I/O to Ground)  Low ESD clamping voltage  Low dynamic resistance: 0.15 Ohms (Typ)  Qualified to AEC-Q100  Solid-state silicon-avalanche technology  SGP2708N7 7-pin package (2.7 x 0.8 x 0.50mm)  Pb-Free, Halogen Free, RoHS/WEEE Compliant  Lead Pitch: 0.4mm (intra-pair)  Lead finish: NiPdAu  Marking: Marking Code  Packaging: Tape and Reel 6-Line ProtectionNominal Dimensions in mm (Bottom View)  USB 3.0  eSATA  Display Port  LVDS Pin 1 Pin 3 Pin 4 Pin 5 Pin 2 Pin 6 Pin 7 The RClamp®3346P provides ESD protection for high- speed data interfaces. It features a high maximum ESD withstand voltage of ±17kV contact and ±20kV air discharge per IEC 61000-4-2. RClamp3346P is designed to minimize both the ESD peak clamping and the TLP clamping. Package inductance is reduced at each pin resulting in lower peak ESD clamping voltage. The dynamic resistance is among the industry’s lowest at 0.15 Ohms (typical). Maximum capacitance on each line to ground is 0.65pF allowing the RClamp3346P to be used in applications operating in excess of 5GHz without signal attenuation. Each device will protect up to six lines (three high-speed pairs). The RClamp3346P is in a 7-pin SGP2708N7 package measuring 2.7 x 0.8mm with a nominal height of 0.50mm. The leads have a nominal pin-to-pin pitch of 0.40mm. Flow- through package design simplifies PCB layout and maintains signal integrity on high-speed lines. The combination of low peak ESD clamping, low dynamic resistance, and innovative package design enables this device to provide the highest level of ESD protection for applications such as USB 3.0, eSATA, and DisplayPort. 2.70 0.50 0.80

0.40 BSC

0.80 BSC

2© 2013 Semtech Corporation www.semtech.com PRELIMINARYPROTECTION PRODUCTS RClamp3346P Absolute Maximum Rating Electrical Characteristics (T=25 oC) gnitaRl obmySe ulaVs tinU )sμ02/8=pt(tnerruCesluPkaePI PP 5.4A )riA(2-4-00016CEIrepDSE 1 )tcatnoC(2-4-00016CEIrepDSE 1 V DSE 02-/+ 71-/+ Vk erutarepmeTgnitarepOT J 521+ot55-C ° erutarepmeTegarotST GTS 051+ot55-C ° retemaraPl obmySs noitidnoCm uminiMl acipyTm umixaMs tinU egatloVffO-dnatSesreveRV MWR DNGotO/IynA3 .3V egatloVreggirT 2 V GIRT sn001/2.0=plt8 V tnerruCegakaeLesreveRI R V MWR 52=T,V3.3= oC DNGotO/IynA 10.05 0.0A μ V MWR 521=T,V3.3= oC DNGotO/IynA 051.0A μ egatloVgnipmalCV C I PP sμ02/8=pt,A1= DNGotO/IynA 5.25 .3V egatloVgnipmalCV C I PP sμ02/8=pt,A5.4= DNGotO/IynA 5.35 .4V egatloVgnipmalCDSE 2 VC I PP ,A61= sn001/2.0=plt 5.5V egatloVgnipmalCDSE 2 VC I PP ,A61-= sn001/2.0=plt )evitisoP(ecnatsiseRcimanyD 3,2 RD sn001/2.0=plt5 1.0s mhO ecnatsiseRcimanyD )evitageN( 3,2 RD sn001/2.0=plt4 1.0s mhO ecnaticapaCnoitcnuJC j VR ,zHM1=f,V0= DNGotO/IynA 06.05 6.0F p VR ,zHM1=f,V0= snipO/IneewteB 03.04 .0F p Notes 1)Measured with a 20dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path connected to ESD ground plane. 2)Transmission Line Pulse Test (TLP) Settings: t p = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns. 3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A

3© 2013 Semtech Corporation www.semtech.com PRELIMINARYPROTECTION PRODUCTS RClamp3346P Typical Characteristics Clamping Voltage vs. Peak Pulse Current (Between any I/O and Ground) Junction Capacitance vs. Reverse Voltage (Between any I/O and Ground) ESD Clamping (-8kV Contact per IEC 61000-4-2) (Between any I/O and Ground) ESD Clamping (+8kV Contact per IEC 61000-4-2) (Between any I/O and Ground) TLP Characteristic (Positive) TLP Characteristic (Negative) -10 -10 0 10 20 30 40 50 60 70 80 Time (ns) Voltage (V) Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane. -80 -70 -60 -50 -40 -30 -20 -10 -10 0 10 20 30 40 50 60 70 80 Time (ns) Voltage (V) Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane. 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 012345 Peak Pulse Current - IPP (A) Clamping Voltage - VC (V) Waveform Parameters: tr = 8µs td = 20µs 02468 1 0 TLP Current (A) Clamping Voltage (V) Transmission Line Pulse Test (TLP) Settings: t p=100ns, tr=0.2ns, ITLP and VTLP averaging window: t1=70ns to t2=90ns -30 -25 -20 -15 -10 - 1 0 - 8- 6- 4- 2 0 TLP Current (A) Clamping Voltage (V) Transmission Line Pulse Test (TLP) Settings: t p=100ns, tr=0.2ns, ITLP and VTLP averaging window: t1=70ns to t2=90ns 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 1.00 Capacitance - CJ (pF) Reverse Voltage - VR (V) f = 1 MHz T=25oC

4© 2013 Semtech Corporation www.semtech.com PRELIMINARYPROTECTION PRODUCTS RClamp3346P Typical Characteristics (Con’t) Analog CrosstalkTypical Insertion Loss S21 ‐100 ‐90 ‐80 ‐70 ‐60 ‐50 ‐40 ‐30 ‐20 ‐10 1.00E+07 1.00E+08 1.00E+09 1.00E+10 Frequency (Hz) Cross Talk (dB) Pin 5 to Pin 7 Pin 4 to Pin 5 Pin 1 to Pin 7 -10 01 1 0 Frequency (GHz) Insertion Loss - (IL) dB

6© 2013 Semtech Corporation www.semtech.com PRELIMINARYPROTECTION PRODUCTS RClamp3346P Assembly Guidelines The small size of this device means that some care must be taken during the mounting process to insure reliable solder joint. Semtech's recommended assem- bly guidelines for mounting this device are shown in the Table 1. Figure 4 details Semtech’s recommended aperture. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. Exact manufacturing parameters will require some experimentation to get the desired solder application. Figure 4 - Recommended Mounting Pattern Applications Information retemaraPylbmessAn oitadnemmoceR ngiseDlicnetSredloSd ehsilop-ortcelE,tucresaL epahserutrepA dednuorhtiwralugnatceR srenroc ssenkcihTlicnetSredloS) "400.0(mm001.0 epyTetsaPredloSr ellamsroerehpsezis4epyT eliforPwolfeRredloS0 20-DTS-JCEDEJreP ngiseDdaPredloSBCPd enifedksamredloS-noN hsiniFdaPBCPu AiNROPSO All Dimensions are in mm. ComponentLand Pad. Stencil opening 0.200 0.700 0.025 0.200 2.700 0.800 0.350 0.0250.400 Table 1 - Recommended Assembly Parameters

7© 2013 Semtech Corporation www.semtech.com PRELIMINARYPROTECTION PRODUCTS RClamp3346P Outline Drawing - SO-8Outline Drawing - SGP2708N7 Land Pattern - SGP2708N7 b bbb aaa N L D DIM A 0.250.15 0.20 0.400.30 0.08 0.10 0.35 2.70 MILLIMETERS MAX 0.05 0.53 DIMENSIONS MIN 0.00 NOM 0.47 0.03 0.50 CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES ). NOTES: 0.80E 2.7752.65 0.75 0.875 PIN 1 INDICATOR (LASER MARK ) bbb CAB SEATING PLANE C BA e 0.80 BSC D E e/2 e D/2 (0.025-0.075) LxN E/2 bxN THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY . CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR NOTES: COMPANY'S MANUFACTURING GUIDELINES ARE MET . CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).1. DIM X Y P MILLIMETERS 0.20 0.65 0.80 DIMENSIONS 1.25Z 0.625 P/2 P Y Z X

8© 2013 Semtech Corporation www.semtech.com PRELIMINARYPROTECTION PRODUCTS RClamp3346P Marking Code Ordering Information RailClamp and RClamp are trademarks of Semtech Corporation. Carrier Tape Specification Device Orientation in Tape YYWW = Date Code rebmuNtraP repytQ leeR leeR eziS TNT.P6433pmalCR0 00,01h cnI7 Pin 1 Location (Towards Sprocket Holes) User Direction of feed YY WW YY WW 3346P YY WW YY WW YY WW YY WW 3346P 3346P 3346P 3346P 3346P PIN 1 INDICATOR YYWW 3346P

9© 2013 Semtech Corporation www.semtech.com PRELIMINARYPROTECTION PRODUCTS RClamp3346P Contact Information Semtech Corporation Protection Products Division

200 Flynn Road, Camarillo, CA 93012

Phone: (805)498-2111 FAX (805)498-3804