3324T

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1 www.semtech.com PRELIMINARYPROTECTION PRODUCTS - RailClamp®®®®® RClamp3324T Low Voltage RailClamp® 4-Line ESD Protection Description Features Circuit Diagram Pin Configuration (Top View) Revision 9/24/2014

Applications

Mechanical Characteristics  ESD protection for high-speed data lines to IEC 61000-4-2 (ESD) ±30kV (air), ±25kV (contact) IEC 61000-4-5 (Lightning) 5A (8/20 μs) IEC 61000-4-4 (EFT) 40A (5/50ns)  Flow-Through design  Protects four high-speed lines  Low capacitance: 0.40pF typical (I/O to ground)  Low ESD clamping voltage  Extremely low dynamic resistance: 0.35 Ohms (Typ)  Solid-state silicon-avalanche technology  USB 3.0  HDMI 1.3/1.4  10GBase-T Ethernet  V-By-One  Display Port  MHL  LVDS Interfaces  eSATA Interfaces Pin 1 Pin 2 Pin 3 Pin 4 5, 6  SLP1710P4T 6L package  Pb-Free, Halogen Free, RoHS/WEEE Compliant  Nominal Dimensions: 1.7 x 1.0 x 0.40 mm  Lead Finish: NiPdAu  Molding compound flammability rating: UL 94V-0  Marking : Marking code + date code  Packaging : Tape and Reel 1I/O 1 I/O 2 I/O 3 I/O 4 GND GND The RClamp ®3324T provides ESD protection for USB3.0, HDMI1.3/1.4, and other high-speed ports. It features a high maximum ESD withstand voltage of ±25kV contact and ±30kV air discharge per IEC 61000-4-2. RClamp3324T is designed to minimize both the ESD peak clamping and the TLP clamping. Peak ESD clamping voltage is extremely low and approximately the same at each pin. The dynamic resistance is among the industry’s lowest at 0.35 Ohms (typical). Typical capacitance on each line to ground is approximately 0.40pF. This allows the RClamp3324T to be used in applications operating in excess of 5GHz without signal attenuation. These devices are manufactured using Semtech’s proprietary low voltage EPD technology for superior characteritics at operating voltages up to 3.3 volts. Each device will protect up to four lines (two high-speed pairs). The RClamp3324T is in a 6-pin SLP1710P4T package. It measures 1.7 x 1.0mm with a nominal height of 0.40mm. The leads have a nominal pin-to-pin pitch of 0.40mm. The flow- through package design simplifies PCB layout and maintains signal integrity on high-speed lines. The combination of low peak ESD clamping, low dynamic resistance, and innovative package design enables this device provides the highest level of ESD protection for applications such as USB 3.0, HDMI and V-By-One inter- faces.

2© 2014 Semtech Corporation www.semtech.com PRELIMINARYPROTECTION PRODUCTS RClamp3324T Absolute Maximum Rating Electrical Characteristics (T=25 oC Unless Otherwise Specified) gnitaRl obmySe ulaVs tinU )sμ02/8=pt(rewoPesluPkaePP kp 57s ttaW )sμ02/8=pt(tnerruCesluPkaePI PP 5A )riA(2-4-00016CEIrepDSE )tcatnoC(2-4-00016CEIrepDSE V DSE 03-/+ 52-/+ Vk erutarepmeTgnitarepOT J 521+ot04-C ° erutarepmeTegarotST GTS 051+ot55-C ° retemaraPl obmySs noitidnoCm uminiMl acipyTm umixaMs tinU egatloVffO-dnatSesreveRV MWR DNGotO/IynA3 .3V egatloVhguorhT-hcnuPV TP I TP Aμ2= DNGotO/IynA 8.38 .45 .5V tnerruCegakaeLesreveRI R V MWR V3.3= DNGotO/IynA 500.00 01.0A μ egatloVgnipmalCV C I PP sμ02/8=pt,A1= DNGotO/IynA egatloVgnipmalCV C I PP sμ02/8=pt,A5= DNGotO/IynA 5.01V ecnaticapaCnoitcnuJC j VR ,zHM1=f,V0= DNGotO/IynA 04.05 6.0F p VR ,zHM1=f,V0= snipO/IneewteB 03.04 .0F p

3© 2014 Semtech Corporation www.semtech.com PRELIMINARYPROTECTION PRODUCTS RClamp3324T Electrical Characteristics (T=25 oC Unless Otherwise Noted) Notes 1)ESD peak voltage measured with a 20dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path connected to ESD ground plane. 2)Transmission Line Pulse Test (TLP) Settings: t p = 100ns, t r = 0.2ns, I TLP and V TLP averaging window: t 1 = 70ns to t2 = 90ns. 3) Dynamic resistance calculated from I TLP = 4A to I TLP = 16A )niPhcaE(sgnitaRDSE retemaraPr etemaraP retemaraP retemaraPr etemaraPl obmySl obmyS lobmyS lobmySl obmySs noitidnoCs noitidnoC snoitidnoC snoitidnoCs noitidnoCm uminiMm uminiM muminiM muminiMm uminiMl acipyTl acipyT lacipyT lacipyTl acipyTm umixaMm umixaM mumixaM mumixaMm umixaMs tinUs tinU stinU stinUs tinU egatloVdnatshtiWDSE 1 repegrahcsidtcatnoC 2-4-00016CEI 52V k egatloVdnatshtiWDSE 1 CEIrepegrahcsidriA 2-4-00016 03V k egatloVkaePDSE 1 V kp 2-4-00016CEIrepVk8+5 5V egatloVkaePDSE 1 V kp 2-4-00016CEIrepVk8-0 6-V egatloVgnipmalCDSE 2 V plt I PP ,A61= sn001/2.0=plt 5.11V egatloVgnipmalCDSE 2 V plt I PP ,A61-= sn001/2.0=plt 11V )evitisoP(ecnatsiseRcimanyD 3,2 R nyD sn001=pt5 3.0s mhO )evitageN(ecnatsiseRcimanyD 3,2 R nyD sn001=pt0 5.0s mhO

4© 2014 Semtech Corporation www.semtech.com PRELIMINARYPROTECTION PRODUCTS RClamp3324T Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Clamping Voltage vs. Peak Pulse Current TLP Characteristic (Positive Pulse) Power Derating Curve Capacitance vs. Reverse Voltage TLP Characteristic (Negative Pulse) 0.01 0.1 0.1 1 10 100 1000 Pulse Duration - tp (µs) Peak Pulse Power - PPP (kW) DR040412-75 0 5 10 15 20 Voltage (V) Current (A) RDYN = 0.35 Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns -30 -25 -20 -15 -10 -20 -15 -10 -5 0 Voltage (V) Current (A) Transmission Line Pulse Test (TLP) Settings: t p = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns RDYN= 0.50 100 120 0 25 50 75 100 125 150 Ambient Temperature - T A (OC) % of Rated Power or IPP DR040512:25:125:150 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 00 . 511 . 522 . 53 Reverse Voltage - V R (V) Capacitance - Cj (pf) f = 1 MHz 0123456 Peak Pulse Current - IPP (A) Clamping Voltage -VC (V) Waveform Parameters: tr = 8µs td = 20µs

5© 2014 Semtech Corporation www.semtech.com PRELIMINARYPROTECTION PRODUCTS RClamp3324T Typical Characteristics ESD Clamping at Each Pin (+8kV Contact per IEC 61000-4-2) ESD Clamping vs. Positive Discharge Voltage (Contact Discharge per IEC 61000-4-2) Typical Insertion Loss S21 (5GhZ) Analog Crosstalk -140 -120 -100 -80 -60 -40 -20 1.00E+07 1.00E+08 1.00E+09 1.00E+10 Frequency (Hz) Insertion Loss (dB) -15 Frequency (Hz) Insertion Loss (dB) Data includes loss due to SMA connector ESD Clamping at Each Pin (-8kV Contact per IEC 61000-4-2) ESD Clamping vs. Negative Discharge Voltage (Contact Discharge per IEC 61000-4-2) -10 -10 0 10 20 30 40 50 60 Time (ns) Voltage (V) +8kV Vpk=54.6V +6kV VPK=41.8V +4kV Vpk=34.1V +2kV Vpk=22.5V Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane -70 -60 -50 -40 -30 -20 -10 -10 0 10 20 30 40 50 60 Time (ns) Voltage (V) -8kV Vpk= -60.20V -6kV Vpk= -48.00V -4kV Vpk= -35.36V -2kV Vpk= -19.20V Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane -70 -60 -50 -40 -30 -20 -10 -10 0 10 20 30 40 50 60 70 80 Time (ns) Voltage (V) Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane0 -10 0 10 20 30 40 50 60 70 80 Time (ns) Voltage (V) Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane

8© 2014 Semtech Corporation www.semtech.com PRELIMINARYPROTECTION PRODUCTS RClamp3324T Applications Information Recommended Mounting Pattern retemaraPylbmessAn oitadnemmoceR ngiseDlicnetSredloSd ehsilop-ortcelE,tucresaL epahserutrepA dednuorhtiwralugnatceR srenroc ssenkcihTlicnetSredloS) "400.0(mm001.0 epyTetsaPredloSr ellamsroerehpsezis3epyT eliforPwolfeRredloS0 20-DTS-JCEDEJreP ngiseDdaPredloSBCPd enifedksamredloS-noN hsiniFdaPBCPu AiNROPSO Note that these are only recommendations and should serve only as a starting point for design. The exact manufacturing parameters will require some experimentation to get the desired solder application. .50 1.70 1.00 .17 .20 .75 .25 .23 Stencil Opening Land Pad ( Follow drawing ) All Dimensions are in mm. Land Pad. Stencil opening Component Figure 5 - HDMI 1.4 Layout RClamp3324T RClamp3324T RClamp7528T HDMI Connector HPD SDA SCL HEC_DAT CEC D2+ D1+ D0+ CLK+ CLK Recommended Assembly Parameters Land Pad Trace Via Device Outline

9© 2014 Semtech Corporation www.semtech.com PRELIMINARYPROTECTION PRODUCTS RClamp3324T Outline Drawing - SO-8 Land Pattern - SLP1710P4T Outline Drawing - SLP1710P4T E D A2 A1 A LxN L1x2 E/2 D/2 bx6 b bbb aaa N e D DIM A 0.250.15 0.20 0.550.45 0.08 0.10 0.50 1.70

0.40 BSC

0.05 0.43 DIMENSIONS MIN 0.00 NOM 0.37 0.02 (0.13) 0.40 CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. NOTES: 1.00E 1.781.65 0.95 1.08 A B PIN 1 INDICATOR (LASER MARK) aaa C e/2 e bbb C A B C SEATING PLANE e1/2 e1 1.00 BSC L 0.20 0.25 0.30 P/2 P X G(C) Y Z THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR NOTES: DIM X P G MILLIMETERS 0.20 0.70 0.40 DIMENSIONS COMPANY'S MANUFACTURING GUIDELINES ARE MET. 1.40Z C (0.825) 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Y 0.45 P1 1.00 0.25 P1/2

10© 2014 Semtech Corporation www.semtech.com PRELIMINARYPROTECTION PRODUCTS RClamp3324T Marking Codes Ordering Information RailClamp and RClamp are trademarks of Semtech Corporation. Carrier Tape Specification YYWW = Alphanumeric character Date Code rebmuNtraP repytQ leeR eziSleeR TCT.T4233pmalCR0 00,3h cnI7 Device Orientation in Tape 3324T YYWW 0A0 B0 K epaT htdiW )xaM(,BD 1 DE F K )XAM( P0 P2 P) XAM(TW mm8m m2.4 mm1.0+5.1 )mm0.0- mm5.0 50.0± 01.±057.1 mm 50.0±5.3 mm mm4.2 1.0±0.4 mm 1.0±0.4 mm 50.0±0.2 mm mm4.0 mm0.8 mm3.0+ mm1.0- Pin 1 Location (Towards Sprocket Holes) User Direction of feed 3324T YYWW 3324T YYWW 3324T YYWW Contact Information Semtech Corporation Protection Products Division

200 Flynn Road, Camarillo, CA 93012

Phone: (805)498-2111 FAX (805)498-3804